JP4738758B2 - Tape bonding apparatus and tape bonding method - Google Patents

Description

  The present invention relates to a tape bonding apparatus and a tape bonding method for bonding a tape member to a workpiece.

  In the semiconductor manufacturing process, a circuit pattern is formed on the surface of a semiconductor wafer (hereinafter referred to as a wafer), and then the back surface of the wafer is polished to reduce the thickness, thereby reducing the size and thickness of the formed semiconductor chip. There are things to do. In addition, a chemical etching process may be performed using a chemical solution to perform a manufacturing process for reducing the thickness of the wafer.

  In this manufacturing process, an adhesive protective tape (hereinafter referred to as a tape member) is attached to the wafer surface. As a result, the wafer surface is prevented from being contaminated, and the wafer surface is scratched to prevent the circuit from being damaged.

  There exists a thing of patent document 1 as a tape bonding apparatus which adhere | attaches a tape member on such a wafer surface. In the tape bonding apparatus described in Patent Document 1, the room on the upper lid side is switched to atmospheric pressure from the state where both the room on the main body side and the room on the upper lid side are evacuated. Thereby, a differential pressure is generated between the chamber on the upper lid side and the room on the main body side, and the rubber sheet swells in the room on the main body side by the differential pressure. The bulge causes the rubber sheet to press the tape member, thereby bonding the tape member to the workpiece.

  Moreover, there exists a thing of patent document 2 as another sticking apparatus. In the thing of this patent document 2, using the differential pressure | voltage between a 1st vacuum chamber and a 2nd vacuum chamber, the center part of a base with high smoothness is bent toward the tape member side. Yes. At the same time, the wafer is lifted by driving the lifting device while pressing a base having a bent central portion against a tape member affixed to the wafer. By doing so, the tape member is bonded to the wafer while air is pushed outward from the center side of the tape member.

Japanese Patent Laid-Open No. 2003-7808 (see paragraph number 0007, FIGS. 2 to 4) Japanese Unexamined Patent Publication No. 2000-349047 (summary, see FIGS. 1 to 5)

  The configuration described in Patent Document 1 described above remains at the idea level, and the configuration is not specific. Therefore, various problems arise when actually trying to implement based on such a configuration. For example, in the configuration described in Patent Document 1, since the rubber sheet is located at the upper part, it is necessary to considerably increase the tension when the rubber sheet is stretched in order to remove the slack due to the weight of the rubber sheet. For this reason, it has the subject that the attachment operation | work of a rubber sheet becomes difficult.

  In particular, in order to efficiently bond the tape member, at the initial position where the operation of bonding the tape member to the wafer is started, there is a gap between the tape member in contact with the rubber sheet and the wafer. Usually small. If the rubber sheet is slack in a state where the gap is small, there may be a problem that the tape member adheres to the wafer and bubbles enter the adhesion surface from the stage before vacuum suction.

  Further, in the configuration described in Patent Document 1, a plurality of push screws are provided, and it is necessary to rotate all of these push screws. When it is necessary to rotate the push screws simultaneously, it is a difficult task. Furthermore, in the configuration described in Patent Document 1, it is necessary to install a tape member and a wafer with the upper lid removed. For this reason, it takes extra man-hours.

  Further, in the configuration described in Patent Document 2, a tape member to which a wafer is attached by bending a base such as a glass plate using a differential pressure between the first vacuum chamber and the second vacuum chamber. The base is bonded to the tape, and the tape member and the base to which the wafer is further attached are lifted from the bonded state. For this reason, it has a two-step bonding process, which takes time and is not preferable in terms of cost. Further, since a separate lifting device is required to lift the wafer or the like, the configuration becomes complicated, and the cost increases accordingly.

  The present invention has been made on the basis of the above circumstances, and the object of the present invention is to satisfactorily adhere the tape member to the workpiece while removing the slack of the rubber sheet, simplifying the process and reducing the cost. It is intended to provide a tape bonding apparatus and a tape bonding method capable of achieving the above.

  In order to solve the above-described problems, the present invention provides a tape bonding apparatus for bonding a tape member to a work, an elastic sheet member for placing the work on the upper surface, and an upper surface side of the elastic sheet member, A sealable first vacuum chamber partitioned by the stretchable sheet member; a sealable second vacuum chamber positioned on the lower surface side of the stretchable sheet member and partitioned by the stretchable sheet member; and a first vacuum chamber; In a state where air is not conducted between the second vacuum chamber and the holding member for holding the stretchable sheet member, the tape member is held in a stretched state, and on the upper part of the work placed on the stretchable sheet member Tape holding means for positioning the tape member, first suction means for vacuum suction of the inside of the first vacuum chamber, and first air introduction means for introducing air into the inside of the first vacuum chamber When Is intended to includes a second suction means for vacuum suction of the inside of the second vacuum chamber, and the second air introducing means for introducing air into the second vacuum chamber, the.

  By setting it as such a structure, a workpiece | work is mounted in the upper surface of an expansion-contraction sheet member, and the tape member is located in the upper part by the state hold | maintained by the tape holding means. In this state, the first suction unit and the second suction unit are operated to evacuate the first vacuum chamber and the second vacuum chamber. Thereafter, the second air introduction means is operated to introduce air into the second vacuum chamber. Then, due to the differential pressure between the first vacuum chamber in which the vacuum state is maintained and the second vacuum chamber into which air is introduced, the stretchable sheet member that seals the boundary portion with the holding member, It expands toward the inside of the first vacuum chamber. And by this expansion | swelling, an elastic sheet member lifts a workpiece | work and a workpiece | work contacts a tape member by this lifting.

  When the expandable sheet member further expands from that state, the workpiece is further lifted against the tension of the tape member in the tensioned state. Thereby, the tape member can be favorably adhered to the entire surface of the workpiece. As described above, by placing the work on the upper surface of the stretchable sheet member and expanding the stretchable sheet member in such a placed state, the tape member can be bonded to the work while preventing the entry of bubbles.

  Moreover, compared with the case where the workpiece | work is located in the lower surface of an expansion-contraction sheet member, the influence of the slack of this expansion-contraction sheet member can be removed. Therefore, it is not necessary to apply a large tension to the elastic sheet member in order to remove the slack of the rubber sheet, and the configuration is simplified. Moreover, it becomes easy to manufacture the tape bonding apparatus. Furthermore, since the expansion of the elastic sheet member is used, a special configuration for moving the workpiece to the upper tape member is not required. For this reason, a workpiece | work can be moved toward a tape member with a simple structure.

The present invention further includes control means for controlling the operation of the first suction means, the second suction means, the first air introduction means, and the second air introduction means in addition to the above-described configuration. The control means operates the first suction means and the second suction means to perform vacuum suction of the first vacuum chamber and the second vacuum chamber, and after the vacuum suction, the second air introduction means Is operated to introduce air into the second vacuum chamber, and by introducing this air, the elastic sheet member is expanded toward the inside of the first vacuum chamber, and the expansion of the elastic sheet member causes the workpiece to be a tape member. It is intended to be lifted and bonded to the tape member.

  In the case of such a configuration, the operation of the first suction unit and the second suction unit is first started by the operation control by the control unit, and vacuum suction is performed. Then, after the vacuum suction, the second air introduction means is operated by the operation control by the control means. Thereby, air is introduced into the second vacuum chamber. And by this introduction of air, the elastic sheet member can be expanded toward the inside of the first vacuum chamber. When the elastic sheet member expands, the workpiece can be lifted toward the tape member. Thereby, the work can be bonded to the tape member.

Further, according to the present invention, in addition to the above-described components , the control means operates the second suction means first when the first suction means and the second suction means are operated, and the first suction means later. The suction means is operated.

  In the case of such a configuration, the pressure of the second vacuum chamber is lowered with respect to the first vacuum chamber by operating the second suction means first. Therefore, the elastic sheet member expands toward the second vacuum chamber side on the lower surface side. If it does in this way, an expansion-contraction sheet member will not expand first toward the 1st vacuum chamber side. For this reason, it can prevent that a workpiece | work and a tape member adhere | attach at the stage before a 2nd air introduction means act | operates and introduces air.

Further, in another invention in addition to the inventions described above, the tape bonding device, have a body portion and a lid portion provided to be freely opened and closed with respect to the main body, the lid A sealing member that airtightly closes between the lid and the main body when the part is closed with respect to the main body, and closes the lid In the state, a first vacuum chamber is formed between the lid portion and the stretchable sheet member, and a second vacuum chamber is placed between the space portion existing in the main body portion and the stretchable sheet member. It is supposed to be formed.

  When configured in this manner, the lid portion can be opened and closed with respect to the main body portion. If it does in this way, installation of a workpiece | work and a tape member and taking out of the workpiece | work with the tape member adhere | attached can be easily performed by opening and closing a cover body part. In addition, the presence of the sealing member can airtightly close the space between the lid body portion and the main body portion. For this reason, when the first suction unit and the second suction unit are operated, the first vacuum chamber and the second vacuum chamber can be sucked to a state where the degree of vacuum is high. Further, the second vacuum chamber is present on the lower surface side of the elastic sheet member from the beginning. When the lid is closed with respect to the main body, a first vacuum chamber is formed between the lid and the stretchable sheet member.

  Furthermore, in addition to the above-described invention, in another invention, the lid portion further includes a concave portion that is recessed upward in the closed state of the lid portion, and the upper bottom surface of the concave portion is an elastic sheet member. The upward movement of the work and the tape member due to the expansion of is suppressed from above.

  When comprised in this way, if an expansion-contraction sheet member will expand | swell, a workpiece | work and a tape member will be lifted. When the tape member reaches a predetermined height position by this lifting, it hits the upper bottom surface and is pressed from above. For this reason, the tape member is pressed from above and bonded in a state where it is lifted by the work from below. That is, since the work is lifted and pressed upward while pressing the tape member from above, the adhesion between the work and the tape member can be made strong and reliable.

Also, in the boundary portion between the lid portion and the body portion, together with the sensor for detecting the state in which the lid portion is closed with respect to the main body portion is provided, the sensor detection signal to the control unit the have a transmittable, the control means only when receiving a detection signal corresponding to the closed state of the lid portion from the sensor may be caused to actuate the first suction means or the second suction means.

  When configured in this manner, the sensor can detect a state in which the lid portion is closed with respect to the main body portion. Then, by transmitting a detection signal based on this detection to the control means, the control means can recognize that the closed state has been reached. And the control means does not operate the first suction means and the second suction means unless it recognizes the closed state. For this reason, vacuum suction can be performed only when the lid portion is reliably closed, and waste of the vacuum suction can be prevented.

  In addition, even when a foreign object is accidentally sandwiched between the lid and the main body, the first suction means and the second suction means are not operated, so that the foreign object can be easily removed. . For this reason, it can prevent that a breakage arises between a cover body part and a main-body part.

In addition, the tape holding means may alternatively attached through a pin member relative to the retaining member. In such a configuration, the pin member is interposed between the tape holding means and the holding member, and a gap is generated at a portion where the pin member does not exist. From this gap, the air present in the space between the tape holding means and the holding member can be sucked and exhausted by the first suction means. In other words, the air existing between the workpiece and the tape member can be sucked and exhausted satisfactorily.

Also, word over click is a glass substrate, a tape with the pin member includes a first supporting member protruding toward a side opposite to the tape holding means together with the provided holding member is provided on the holding member A plurality of second support members that protrude toward the side facing the holding means and that have a longer protrusion length than the first support member may be provided .

  When configured in this manner, the tape holding means is supported by the first support member and the second support member. For this reason, the height position of the tape member fixed to the tape holding means is low in the vicinity of the first support member, and the height position is high in the vicinity of the second support member. Therefore, the height of the tape member can be lowered as compared with the case where the entire tape member is supported by the second support member, and considering the deflection of the tape member, above the tape member, It is possible to provide a space. Moreover, it is not necessary to make the depth of the recessed part which exists in a cover body part deeper than necessary. For this reason, when there is little space margin, it can deepen by cutting a recessed part etc., and can be adjusted arbitrarily.

In addition, the lid portion may be as closing aid for assisting the opening and closing with respect to the body portion. In the case of such a configuration, the opening / closing auxiliary means acts when opening and closing the lid body portion. Therefore, it becomes easy for an operator to perform an operation of opening and closing the lid, and it is possible to reduce the burden on the operator.

Also, opening and closing the auxiliary means comprises a mounting shaft that extends toward the side opposite to the side where the lid body from the rotation fulcrum of the lid portion is provided, and the weight to be attached to the mounting shaft, the mounting A projecting portion provided on the shaft, an arm that is provided so as to be rotatable with respect to the main body portion, is provided on a side on which the attachment shaft moves in accordance with the opening operation of the lid portion, and extends toward the attachment shaft; Provided at the part of the arm where the protruding part abuts, the protruding part is fitted, and when this protruding part is fitted, the rotation of the arm is restricted, and the protruding part is maintained in the fitted state. It is good also as what comprises the notch part which can maintain the open state of.

  In the case of such a configuration, since the weight is attached to the attachment shaft, the lid portion can be opened with a small force. Further, even when the lid portion is closed, the lid portion is not closed suddenly by its own weight, and it is possible to prevent problems such as damage to the lid portion and the main body portion. Further, the protruding portion is fitted into the notch provided in the arm, and in the fitted state of the protruding portion, the rotation of the arm is restricted, and the open state of the lid portion can be maintained well. Become. Therefore, it is not necessary to maintain the open state of the lid body part by pressing the lid part by hand, and the operator can perform other work such as transporting the work by that much, which is convenient. improves.

Tape Furthermore, the tape member, have heat-curable adhesive is applied, the lid portion, the heating means is provided, by heating means when the adhesive of the tape member to the work The member may be heated. When configured in this manner, the tape member is coated with a thermosetting adhesive on the surface, and therefore, when heated by the heating means, the adhesion to the workpiece is enhanced. In this state, when the tape member is pressed against the workpiece, the tape member can be favorably bonded to the workpiece.

Also, pressurized thermal means, with is provided with a plurality in the housing portion adjacent to the recess of the lid portion, the plurality of heating means may be as being located radially in the housing portion. When comprised in this way, it becomes possible to heat the whole tape member favorably using a heating means. Therefore, it becomes possible to improve the adhesiveness of the tape member with respect to the workpiece.

Furthermore, the tape adhering method as another invention is the tape adhering method for adhering the tape member to the workpiece, wherein the workpiece is placed on the upper surface of the elastic sheet member, and the tape member is placed on the upper portion of the workpiece by the tape holding means. The first vacuum chamber located on the upper surface side of the stretchable sheet member is vacuum-sucked by the first suction means while the second vacuum is located on the lower surface side of the stretchable sheet member. A suction step for vacuum suction of the chamber with the second suction means, and a vacuum reach detection step for detecting that the first vacuum chamber and the second vacuum chamber have reached the set vacuum degree by the suction step; After detecting that the degree of vacuum set by the vacuum degree detection step is reached, the vacuum suction of the second vacuum chamber is stopped by stopping the operation of the second suction means, and the second A first air introduction step of operating air introduction means to introduce air into the second vacuum chamber; and after the first air introduction step, the expandable sheet member is expanded toward the inside of the first vacuum chamber. Then, the expansion of the elastic sheet member causes the workpiece to be lifted toward the tape member and bonded to the tape member, and after the bonding step is executed for a preset time, the first air introduction means is operated. And a second air introduction step for introducing air into the first vacuum chamber.

  In this case, in the suction step, vacuum suction is performed between the first vacuum chamber and the second vacuum chamber. After the suction step, the arrival of the vacuum level is detected in the vacuum level detection step. Then, when it is detected that the set degree of vacuum has been reached, the second air introduction means is operated in the first air introduction step to introduce air into the second vacuum chamber. Thereby, the elastic sheet member starts to expand toward the first vacuum chamber side that is the upper surface side thereof.

  Thereafter, an adhesion step is started, and the work is lifted by the expansion of the stretchable sheet member and bonded to the tape member. If such expansion is continuously performed for a predetermined time, the tape member is bonded over the entire surface of the workpiece by continuing the expansion. After the bonding, if the first air introducing means is operated to introduce air into the first vacuum chamber, both the first vacuum chamber and the second vacuum chamber are in a state equal to the atmospheric pressure. Then, the bonding of the tape member to the work is completed.

  As described above, by placing the work on the upper surface of the stretchable sheet member and expanding the stretchable sheet member in such a placed state, the tape member can be bonded to the work while preventing the entry of bubbles. Moreover, compared with the case where the workpiece | work is located in the lower surface of an expansion-contraction sheet member, the influence of the slack of this expansion-contraction sheet member can be removed. Therefore, it is not necessary to apply a large tension to the stretchable sheet member in order to remove the slack, the bonding becomes simple, and the tape bonding apparatus can be easily manufactured. Furthermore, since the expansion of the elastic sheet member is used, a special step for moving the workpiece to the upper tape member is not required. For this reason, a workpiece | work can be moved toward a tape member by a simple method.

Further, in the tape adhering method of the above-described invention , in addition to the above- described configuration , in the suction step, when the first suction means and the second suction means are operated, the second suction means is operated first, Later, the first suction means is activated.

  In such a case, the pressure of the second vacuum chamber is lowered with respect to the first vacuum chamber by operating the second suction means first. Therefore, the elastic sheet member expands toward the second vacuum chamber side on the lower surface side. If it does in this way, an expansion-contraction sheet member will not expand first toward the 1st vacuum chamber side. For this reason, it can prevent that a workpiece | work and a tape member adhere | attach at the stage before a 2nd air introduction means act | operates and introduces air.

Further, the tape bonding method of another invention, in addition to the inventions of the tape bonding method described above, the tape member, with heat curing adhesive is applied, the tape member to the workpiece with adhesive step Prior to bonding, a heating step of heating the tape member is provided.

  When configured in this way, the tape member is coated with a thermosetting adhesive on the surface, and therefore, when heated in the heating step, the adhesion to the workpiece is enhanced. In this state, when the tape member is pressed against the workpiece in the bonding step, the tape member can be favorably bonded to the workpiece.

  According to the present invention, the tape member can be satisfactorily bonded to the work while removing the slack of the elastic sheet member. In addition, the process can be simplified and the cost can be reduced.

(First embodiment)
Hereinafter, a tape bonding apparatus 10 according to a first embodiment of the present invention will be described with reference to FIGS. 1 to 7. FIG. 1 is a plan view of the main body 20 in a state where the lid 60 shown in FIG. 2 is seen through, and shows a state where the wafer 11 is placed on the rubber sheet 25. FIG. 2 is a side view showing a state where a part of the internal structure (rubber sheet 25 and the like) of the tape bonding apparatus is transmitted. FIG. 3 is a schematic configuration diagram showing the exhaust system and the control system of the tape bonding apparatus 10 of FIG. 1 in a simplified manner.

  As shown in FIG. 1, the planar shape of the main body 20 is a square such as a substantially square. A plurality of (for example, four) support legs 21 (see FIG. 2) are attached to the bottom surface of the main body 20. As shown in FIG. 2, the tape bonding apparatus 10 includes a main body portion 20 and a lid portion 60 that is provided so as to be rotatable with respect to the main body portion 20.

  A main body upper surface portion 22 is provided in the main body portion 20 so as to be close to and opposed to the lid body portion 60. The main body upper surface portion 22 is configured to have an appropriate strength in order to receive a pressure applied during vacuum suction (particularly, a vertical load applied from the lid body 60 side). In addition, the side wall and the bottom wall that support the main body 20 and are a part of the main body 20 have a strength that can sufficiently resist the pressure applied during vacuum suction.

  A hole portion 23 (see FIG. 3) is provided in the central portion of the main body upper surface portion 22. As will be described later, the hole 23 is covered with a rubber sheet 25. As shown in FIGS. 1 to 3, a seal ring 24 is attached to the upper surface portion 22 of the main body. The seal ring 24 is an O-ring-shaped member and abuts on the ring abutting portion 63 on the lid body 60 side. Thereby, the inside of the tape bonding apparatus 10 is sealed from the outside (atmosphere), and the inside of the tape bonding apparatus 10 can be vacuum-sucked.

  Further, a rubber sheet 25 as an elastic sheet member is provided on the upper surface portion 22 of the main body so as to cover the hole portion 23 on the center side of the seal ring 24 (see FIG. 1; hereinafter referred to as the inner diameter portion 22a). Is provided. The rubber sheet 25 is a member on which the wafer 11 as a work is mounted. Then, in a state where the wafer 11 is mounted, the rubber sheet 25 is expanded upward as described later, whereby the wafer 11 rises toward the tape member 12 described later.

  The rubber sheet 25 is made of a material that can reduce the generation of bubbles, such as chloroprene. However, the material of the rubber sheet 25 is not limited to such chloroprene, and normal natural rubber or synthetic rubber may be used. A preferable material for the rubber sheet 25 is a material that can prevent the generation of bubbles, such as chloroprene described above.

  Note that the presence of the rubber sheet 25 divides the interior of the tape bonding apparatus 10 into two spaces (see FIG. 3). In the following description, the space above the rubber sheet 25 is defined as the first vacuum chamber 50 and the space below the rubber sheet 25 is defined as the second vacuum chamber 51 in the state where the lid 60 is closed. To do. The second vacuum chamber 51 uses a space 51 a that exists inside the main body 20. The first vacuum chamber 50 is divided into a space between the tape member 12 and the lid body portion 60 and a space between the tape member 12 and the rubber sheet 25. Both spaces communicate with each other. The first vacuum chamber 50 is configured as a whole.

  In the present embodiment, the diameter of the wafer 11 mounted on the upper surface of the rubber sheet 25 is 12 inches. However, the size of the wafer 11 is not particularly limited, and may be another size such as an 8-inch wafer. When the size of the wafer 11 is changed, the sizes of other members (rubber sheet 25, pressing ring 26, tape frame 28, etc.) are changed accordingly. However, for example, the tape bonding apparatus 10 of the present embodiment may be used for bonding to a small-sized wafer 11 such as an 8-inch wafer.

  As shown in FIG. 4, a pressing ring 26 as a holding member is attached to the outer peripheral edge of the rubber sheet 25 and has a substantially ring-like appearance. The pressing ring 26 is for pressing the rubber sheet 25. The pressing ring 26 is pressed against the inner diameter portion 22a from above by, for example, a screw 26a (see FIG. 1), and is fixed at an appropriate interval along the circumferential direction. Note that when the screw 26 a is fixed, the screw 26 a passes through the rubber sheet 25. Therefore, a hole corresponding to the through hole of the screw 26a may be formed in the rubber sheet 25 in advance. It should be noted that a screw (not shown) for attaching a pin member 27 described later may also be used for attaching the holding ring 26.

  As shown in FIG. 4, pin members 27 are attached to the upper surface portion of the pressing ring 26 at an appropriate interval in the circumferential direction. A tape frame 28 as a tape holding means is attached to the pin member 27 at the upper part thereof. The tape frame 28 is for maintaining the tension state of the tape member 12 such as an ultraviolet curable UV (Ultra Violet light) tape. Therefore, the upper surface of the tape frame 28 is covered with the tape member 12. When the tape member 12 is stretched on the tape frame 28, the tape member 12 is stretched with the adhesive surface facing downward (wafer 11 side).

  A plurality of positioning pins 29 (four in FIG. 1 at intervals of about 90 degrees) are attached to the tape frame 28. Further, at least one (two in FIG. 1) detent pins 30 are attached to the tape frame 28.

  Further, the tape frame 28 is provided with a plurality of notches 31 (four locations at intervals of approximately 90 degrees in FIG. 1) corresponding to the positioning pins 29. The notch 31 is in a state where a part of the outer peripheral side of the tape frame 28 is cut off. Positioning the edge portion of the cutout portion 31 in a state where the positioning pin 29 is in contact with the edge portion of the cutout portion 31 can prevent displacement of the tape frame 28 in the planar direction. As a result, when the tape member 12 is bonded to the wafer 11, it is possible to prevent the positional deviation from occurring.

  Further, the tape frame 28 is provided with pin pinching portions 32 (in FIG. 1, two locations with the notch portion 31 on the near side in between) corresponding to the locking pins 30. The pin clamping portion 32 is formed in a state where a part of the tape frame 28 is cut into, for example, a substantially triangular shape. As a result, the anti-rotation pin 30 comes into contact with the edge of the pin clamping portion 32, and the tape frame 28 can be restricted from rotating clockwise and counterclockwise. Such rotation prevention can also prevent misalignment when the tape member 12 and the wafer 11 are bonded.

  4 shows the positional relationship among the rubber sheet 25, the wafer 11, the pressing ring 26, the pin member 27, the tape frame 28, and the tape member 12. As shown in FIG. As shown in this figure, when the wafer 11 is mounted on the rubber sheet 25, a predetermined gap 50 a exists between the tape member 12 and the wafer 11. However, the gap 50a is set to such an extent that when the rubber sheet 25 is inflated as will be described later, the wafer 11 mounted on the rubber sheet 25 is lifted and the wafer 11 and the tape member 12 are well bonded. Has been.

  Further, as shown in FIG. 3, in order to vacuum-suck the first vacuum chamber 50, the end portion side of the air duct 33 is disposed inside the first vacuum chamber 50. One end 33a of the air duct 33 is branched into four (FIG. 3 shows only two because of the cross-sectional view). And the opening part 34 of each branched air pipe 33 exists in the inside of the 1st vacuum chamber 50, as shown in FIG. In the present embodiment, the openings 34 are arranged at intervals of approximately 90 degrees in the plan view shown in FIG. The opening 34 is an inner diameter portion 22 a on the inner side of the seal ring 24 and exists between the tape frame 28 and the seal ring 24. Further, the air duct 33 passes through the inner diameter portion 22a and merges into one from the branched state inside the second vacuum chamber 51 or outside the main body portion 20 (FIG. 1, FIG. 1). 3).

  Further, the other end portion 33 b of the air duct 33 protrudes from the bottom wall 22 c of the main body upper surface portion 22. Then, one end portion of the tube member 35 is connected to the other end portion 33 b, and the other end portion 35 b of the tube member 35 is connected to the vacuum pump 36. Accordingly, when the vacuum pump 36 is activated, the first vacuum chamber 50 can be vacuumed.

  A first valve member 37 is provided in the middle of the pipe member 35. The first valve member 37 is switched so as to communicate with the vacuum pump 36 in order to vacuum-suck the inside of the first vacuum chamber 50 (hereinafter, this switching is referred to as switching to the suction side). At the same time, it is possible to switch to open to the atmosphere introduction side (switching to the protruding tube portion 35a side in FIG. 3; this switching is hereinafter referred to as switching to the atmosphere introduction side). When the tube member 35 is opened to the atmosphere introduction side by switching the first valve member 37, the atmosphere is introduced into the first vacuum chamber 50 through the tube member 35. Further, as the first valve member 37, for example, an electromagnetic valve that can be opened and closed by a solenoid can be used, but a system that opens and closes using another driving source such as a motor may be used.

  Further, the vacuum pump 36 is provided outside the main body 20 in the present embodiment. However, a configuration in which the vacuum pump 36 is built in the main body 20 may be adopted. The vacuum pump 36, the air pipe 33, the pipe member 35, the first valve member 37 and the like constitute a first suction means. The first valve member 37, the air pipe 33, the pipe member 35, the protruding pipe portion 35a, etc. constitute a first air introduction means.

  The vacuum pump 36 and the first valve member 37 are connected to a control device 70 described later, and operate after receiving a signal corresponding to a control command from the control device 70.

  Further, an air pipe 38 is also provided in the second vacuum chamber 51 as in the case of the air pipe 33 described above. Unlike the air duct 33, only one air duct 38 is provided inside the second vacuum chamber 51. In addition, the opening 39 of the air duct 38 exists in the center of the second vacuum chamber 51.

  Similarly to the air pipe 33 described above, the other end 38 b of the air pipe 38 protrudes from the bottom wall 22 c of the main body upper surface portion 22, and the pipe member 40 of the other end portion 38 b is not connected. One end side is connected. The other end of the tube member 40 is connected to the vacuum pump 36. Thereby, when the vacuum pump 36 is operated, the second vacuum chamber 51 can be vacuum-sucked.

  A second valve member 41 is also provided in the middle of the pipe member 40. Similarly to the first valve member 37 described above, the second valve member 41 is switched so as to communicate with the vacuum pump 36 side, and is switched so as to open to the atmosphere introduction side via the protruding pipe part 40a. It is possible. When the tube member 40 is opened to the atmosphere introduction side by switching the second valve member 41, the atmosphere is introduced into the second vacuum chamber 51 through the tube member 40. Note that the second valve member 41 is also electrically connected to the control device 70.

  The vacuum pump 36, the second valve member 41, the air pipe 38, and the pipe member 40 constitute a second suction unit. The second valve member 41, the air pipe 38, the pipe member 40, the protruding pipe portion 40a, and the like constitute second air introduction means.

  In the present embodiment, only one vacuum pump 36 is provided. Further, by switching the first and second valve members 37, 41 to the atmosphere introduction side and the suction side, either the first vacuum chamber 50 or the second vacuum chamber 51, or the first and second The vacuum chambers 50 and 51 can be evacuated and at atmospheric pressure.

  However, the number of vacuum pumps 36 is not limited to one, and two or more vacuum pumps 36 may be provided corresponding to each of the first suction unit and the second suction unit. Further, without using the three-way valve such as the first valve member 37 and the second valve member 41, both the suction side valve member and the air introduction side valve member are connected to the pipe member 35 and the pipe member 40, respectively. You may make it provide. Even in this case, the suction of the first vacuum chamber 50 and the second vacuum chamber 51 can be switched satisfactorily.

  Further, as shown in FIG. 2, a vacuum gauge 42 is attached to the outer surface of the side wall of the main body 20. In this embodiment, two vacuum gauges 42 are provided. One of the vacuum gauges 42 is for measuring the atmospheric pressure inside the first vacuum chamber 50 (hereinafter referred to as a vacuum gauge 42a as necessary). The other one of the vacuum gauges 42 is for measuring the atmospheric pressure inside the second vacuum chamber 51 (hereinafter referred to as a vacuum gauge 42b as necessary). The two vacuum gauges 42 a and 42 b are also connected to the control device 70.

  In addition, among the two upper corner portions of the main body upper surface portion 22 that is, for example, the farthest from a hinge 61 described later, a sensor 43 is provided in one corner portion 22b (see FIG. 1). The sensor 43 uses, for example, a magnetic sensor, and detects whether or not the lid body portion 60 is closed to the main body portion 20 until it is close to a predetermined distance. The sensor 43 is also connected to the control device 70 and transmits a detection signal as to whether or not the lid 60 is closed to the control device 70. And the control apparatus 70 transmits the signal corresponding to an action | operation with respect to the vacuum pump 36 etc., only when the detection signal corresponding to the state which the cover body part 60 is closed is received.

  Next, the configuration of the lid body 60 will be described. As shown in FIGS. 1, 3, and 5, the lid body portion 60 is connected to the main body portion 20 via a hinge 61. That is, with the hinge 61 as a fulcrum, the lid body 60 is rotatable. In addition, one end side 62 a of the two damper members 62 is attached to the lid portion 60. Further, each other end 62 b of the damper member 62 is attached to the main body upper surface portion 22. The damper member 62 is extendable and prevents the lid body portion 60 from being suddenly lowered with respect to the main body portion 20 due to the viscous resistance of a viscous body (oil or the like) existing inside. .

  The damper member 62 also incorporates a spring member (not shown), and can maintain a state in which the lid portion 60 is open (for example, the state shown in FIG. 5A). However, when it is not necessary to maintain the state where the lid 60 is open, the spring member may be omitted.

  Here, in a state where the lid body portion 60 is lowered with respect to the main body portion 20 and closed (the state shown in FIGS. 2, 3, and 5 (b)), between the lid body portion 60 and the main body portion 20. A lock mechanism for performing the locking may be provided (in this embodiment, no lock mechanism is provided). In the case of providing such a lock mechanism, one member of the lock mechanism is attached to the lid portion 60 and the other member is attached to the main body upper surface portion 22. In addition, when providing a locking mechanism, it provides in the site | part spaced apart from the hinge 61. FIG.

  Further, as shown in FIGS. 2 and 3, a portion of the lid 60 that contacts the seal ring 24 of the main body 20 is a ring contact portion 63. The ring contact portion 63 seals the first vacuum chamber 50 by contact with the seal ring 24. In addition, in order to make this sealing favorable, the ring contact part 63 is comprised from the flat part which makes the same plane in this Embodiment.

  As shown in FIGS. 3 and 4, a concave portion 64 is formed in a portion of the lid portion 60 that is opposed to the main body portion 20 and is located on the inner diameter side of the ring contact portion 63. . The concave portion 64 is formed in a state that is recessed from the ring contact portion 63. The concave portion 64 has a size corresponding to the above-described inner diameter portion 22a. Therefore, when the lid 60 is closed and the seal ring 24 comes into a sealed state where the seal ring 24 comes into contact with the ring contact portion 63, the space surrounded by the recess 64, the seal ring 24, the inner diameter portion 22a, and the rubber sheet 25 is formed. Appear. This space becomes the first vacuum chamber 50.

  In addition, a bottom surface (hereinafter referred to as an upper bottom surface 64a) of the concave portion 64 serves as a portion that suppresses (receives) the tape member 12 from moving upward when the rubber sheet 25 expands. For this reason, the recess 64 is set to a depth at which the tape member 12 can be received and the tape member 12 can be adhered to the wafer 11 satisfactorily.

  A handle 65 a is attached to a portion of the side wall portion of the lid portion 60 that faces the hinge 61. Therefore, the operator can easily open and close the lid 60 by grasping the handle 65a. Note that a total of four handles 65b are provided on the side wall portion of the main body portion 20 so as to face each other. By holding the handle 65b, the tape bonding apparatus 10 can be easily moved.

  Further, as shown in FIG. 3, the tape bonding apparatus 10 is provided with a control device 70 as a control means. As described above, the control device 70 is electrically connected to the vacuum pump 36, the first and second valve members 37 and 41, the sensor 43, and the vacuum gauge 42. The control device 70 is connected to an operation button (not shown) for performing an ON operation. For this reason, when the operator presses the operation button in the closed state of the lid portion 60 that allows the sensor 43 to be turned on, the vacuum pump 36 is activated. When the first vacuum chamber 50 or the second vacuum chamber 51 reaches a preset degree of vacuum by the operation of the vacuum pump 36, the control device 70 controls the first valve member 37 or the second vacuum chamber 37. A control signal is issued so as to switch the valve member 41 to the atmosphere introduction side.

  Here, the control device 70 first switches the second valve member 41 to the suction side and maintains the state in which the first valve member 37 is switched to the atmosphere introduction side, so that the second vacuum chamber is maintained for a predetermined time. A control signal is issued to each of the first and second valve members 37 and 41 so as to perform vacuum suction 51. Then, after a predetermined time has elapsed, a control signal is issued to the first valve member 37, the first valve member 37 is switched from the atmosphere introduction side to the suction side, and the second vacuum chamber together with the first vacuum chamber 50. 51 vacuum suction is performed.

  The control device 70 controls the second valve member 41 to switch to the atmosphere introduction side when the first vacuum chamber 50 and the second vacuum chamber 51 reach a predetermined degree of vacuum. Issue a command. Thereby, adhesion between the wafer 11 and the tape member 12 is started. Further, after a predetermined time has elapsed from this state and the bonding is completed, the control device 70 issues a control command for switching the first valve member 37 to the atmosphere introduction side. By such switching, both the first and second vacuum chambers 50 and 51 become equal to the atmospheric pressure, and the bonding operation ends.

  An example of the above-mentioned predetermined degree of vacuum is about 20 Pa. However, the predetermined degree of vacuum is not limited to this, and may be any degree of vacuum as long as it is lower than atmospheric pressure. Further, after the bonding is completed, the control device 70 issues a control command to the vacuum pump 36 so as to stop the vacuum pump 36 together with an operation of switching the first valve member 37 to the atmosphere introduction side. It may be configured. However, in this case, the suction time for the next vacuum suction is somewhat longer than when the vacuum pump 36 is kept operating.

  The operation (operation) of the tape bonding apparatus 10 having the above configuration will be described below. This action (operation) is executed based on the operation flow shown in FIG.

  First, the operator stretches the tape member 12 with respect to the tape frame 28. In this case, the tape member 12 is stretched so that the adhesive surface faces downward. After the tape member 12 is stretched on the tape frame 28 with a constant tension, the tape frame 28 is subsequently placed on the holding ring 26 (step S10). In this case, the tape frame 28 is installed on the pin member 27 of the holding ring 26, but the positioning pin 29 is brought into the notch portion 31 and the rotation prevention pin 30 is positioned at the pin clamping portion 32. Install. In this state, the installation of the wafer 11 and the tape member 12 is completed.

  Subsequently, the lid body portion 60 is lowered with respect to the main body portion 20 until the sensor 43 detects that the lid body portion 60 is closed (step S11). In this case, the operator may hold down the lid body 60 downward by a predetermined amount. And the control apparatus 70 judges whether the sensor 43 detected the obstruction | occlusion state of the cover body part 60 by this fall (step S12). When the sensor 43 detects the closed state, the control device 70 permits the operation of the vacuum pump 36, and the vacuum pump 36 can be operated when the operator presses the operation button.

  When the operator presses the operation button, the control device 70 detects the pressing and issues a command for operation to the vacuum pump 36. Thereby, the vacuum pump 36 is operated to perform vacuum suction of the first vacuum chamber 50 and the second vacuum chamber 51 (corresponding to the suction step). In this case, initially, the second valve member 41 is switched to the suction side, and the first valve member 37 is switched to the atmosphere introduction side to perform vacuum suction of only the second vacuum chamber 51 (step S13). . Then, after the vacuum suction of the second vacuum chamber 51 is performed for a predetermined time, the first valve member 37 is switched from the atmosphere introduction side to the suction side, and the first vacuum chamber 50 and the second vacuum chamber 51 are switched. Vacuum suction is performed on both (step S14).

  In the present embodiment, no locking mechanism is provided. However, when the vacuum pump 36 operates and the first vacuum chamber 50 and the second vacuum chamber 51 become lower than the atmospheric pressure, atmospheric pressure is applied from the periphery of the tape bonding apparatus 10. Thereby, the degree of adhesion between the seal ring 24 and the ring contact portion 63 is improved, and the first vacuum chamber 50 and the second vacuum chamber 51 can be reliably sealed without using a lock mechanism. It has become.

  When the vacuum pump 36 performs vacuum suction for a predetermined time, the vacuum gauge 42 detects that the first vacuum chamber 50 and the second vacuum chamber 51 have reached a predetermined degree of vacuum (Step S15; vacuum) Corresponding to the degree arrival detection step) When the vacuum gauge 42 detects a predetermined degree of vacuum, a predetermined detection signal is transmitted to the control device 70. Then, the control device 70 switches the second valve member 41 to the atmosphere introduction side while maintaining the operation of the vacuum pump 36 (step S16; corresponding to the first air introduction step). Thereby, the atmosphere is introduced into the second vacuum chamber 51 through the protruding tube portion 40a.

  When the atmosphere is introduced into the second vacuum chamber 51, the rubber sheet 25 expands toward the first vacuum chamber 50 due to a pressure difference between the first vacuum chamber 50 and the second vacuum chamber 51. To do. In this case, the wafer 11 is lifted by the expansion of the rubber sheet 25, and the upper surface of the wafer 11 contacts the tape member 12. Then, adhesion of the tape member 12 to the upper surface of the wafer 11 is started (step S17; corresponding to the adhesion step).

  Here, there are two types of bonding between the upper surface of the wafer 11 and the tape member 12 as shown in FIGS. First, as shown in FIG. 7A, the wafer 11 is maintained parallel to the tape member 12 without being inclined as shown in FIG. In this case, the tape member 12 is bonded. In this case, when the wafer 11 is gradually lifted by the expansion of the rubber sheet 25 when the central portion of the tape member 12 is slightly slacked downward due to its own weight, the central portion of the wafer 11 is On the other hand, when the peripheral portion of the wafer 11 is slightly bent, adhesion is started from the central portion of the tape member 12.

  Then, when the wafer 11 is gradually lifted, adhesion starts gradually from the center of the tape member 12 toward the peripheral portion. In addition, when the wafer 11 is lifted as the rubber sheet 25 expands, the wafer 11 comes into contact with the tape member 12 while resisting the tension of the tape member 12 stretched on the tape frame 28. The wafer 11 comes into contact with the tape member 12 while resisting the tension, so that the tape member 12 can be prevented from being loosened and bonded in a state where bubbles enter, and the wafer 11 and the tape member 12 can be prevented from being bonded. The adhesiveness between them becomes good.

  Here, when the wafer 11 is lifted by a predetermined amount, the upper surface of the tape member 12 comes into contact with the upper bottom surface 64a and does not move further upward. Therefore, the tape member 12 is suppressed from above, and the wafer 11 is lifted from below while resisting the tension of the tape member 12. Thereby, the bonding is reliably performed from the central part toward the peripheral part. In this state, when a predetermined time elapses, the bonding between the wafer 11 and the tape member 12 is reliably performed.

  In the bonding mode as described above, bonding between the upper surface of the wafer 11 and the tape member 12 is performed while air is released from the central portion of the wafer 11 (tape member 12) outward. In this bonding mode, the vacuum pump 36 continues to be in a state where the first vacuum chamber 50 side is vacuum-sucked. For this reason, in combination with the above-described bonding mode, the air existing between the upper surface of the wafer 11 and the tape member 12 is excluded, so that the adhesion between the wafer 11 and the tape member 12 is in a good state. Done.

  Further, as a second mode of bonding, as shown in FIG. 7B, in the state where the wafer 11 is inclined with respect to the tape member 12, the highest portion of the inclined wafer 11 ( Hereinafter, it is the case where it adheres to the tape member 12. In this case, first, the bonding to the tape member 12 is started from the upper end of the inclined wafer 11. Also in this case, when the wafer 11 is lifted as the rubber sheet 25 expands, it comes into contact with the tape member 12 while resisting the tension of the tape member 12 stretched on the tape frame 28.

  In this state, when the rubber sheet 25 is gradually expanded and the wafer 11 is lifted while resisting the tension of the tape member 12, the wafer 11 rotates while using the contact portion with the tape member 12 as a fulcrum. The inclination angle gradually decreases.

  Here, also in this bonding mode, when the upper end of the wafer 11 is lifted while resisting the tension of the tape member 12 by a predetermined amount, the upper surface of the tape member 12 comes into contact with the upper bottom surface 64a. And the upper surface of the tape member 12 stops moving further upward. When the rubber sheet 25 is gradually expanded in this state, the upper end of the wafer 11 is restricted by the upper bottom surface 64a, so that the wafer 11 is lifted while the inclination angle of the wafer 11 is gradually narrowed. The wafer 11 is lifted up until the tilt angle of the wafer 11 becomes zero. In addition, when the inclination angle of the wafer 11 becomes zero and a predetermined time elapses, the bonding between the wafer 11 and the tape member 12 is surely performed.

  In the bonding mode as described above, bonding between the upper surface of the wafer 11 and the tape member 12 is performed while air is released from the upper end of the wafer 11 (tape member 12) toward the other end. . In this bonding mode as well, the vacuum pump 36 continues to be in a state where the first vacuum chamber 50 side is vacuum-sucked. For this reason, in combination with the above-described bonding mode, the air existing between the upper surface of the wafer 11 and the tape member 12 is excluded, so that the adhesion between the wafer 11 and the tape member 12 is in a good state. Done.

  As described above, the control device 70 continues the switching of the second valve member 41 to the atmosphere introduction side for a predetermined time while continuing the switching state of the first valve member 37 to the suction side (step S18). As a result, the bonding between the wafer 11 and the tape member 12 is reliably performed. If the control device 70 determines in step S18 that the predetermined time has elapsed, the control device 70 switches the first valve member 37 to the atmosphere introduction side (step S19; corresponding to the second air introduction step). Thereby, the atmosphere is introduced into the first vacuum chamber 50 and the expanded state of the rubber sheet 25 is released. For this reason, the wafer 11 is lowered while maintaining the state where the upper surface thereof is bonded to the tape member 12.

  In step S19, when the first valve member 37 is switched to the atmosphere introduction side, the operation of the vacuum pump 36 is maintained. As a result, it is possible to quickly cope with the bonding operation to the next wafer 11. However, such an operation may be stopped.

  Thereafter, the operator opens the lid part 60. Then, the operator takes out the wafer 11 with the tape member 12 bonded together with the tape frame 28 (step S20). As described above, the bonding of the tape member 12 to the upper surface of the wafer 11 is completed.

  In addition, after the adhesion of the tape member 12 to the upper surface of the wafer 11 is completed, the process proceeds to the next step such as a dicing process.

  According to the tape bonding apparatus 10 having such a configuration, the tape member 12 can be bonded to the upper surface of the wafer 11 by utilizing the expansion of the rubber sheet 25. For this reason, the tape member 12 can be reliably adhered to the upper surface of the wafer 11 due to the pressure difference between the atmospheric pressure and the vacuum state with a simple configuration. In particular, by using the rubber sheet 25, even if the wafer 11 comes into contact with the tape member 12 in a so-called one-sided state, the posture of the wafer 11 can be easily recovered by elastic deformation of the rubber sheet 25. Can do. For this reason, the adhesiveness of the tape member 12 with respect to the upper surface of the wafer 11 can be made favorable.

  Further, the wafer 11 is placed on the upper surface of the rubber sheet 25. For this reason, compared with the case where the workpiece | work (wafer 11) is located in the lower surface of the rubber sheet 25, the influence of the looseness of this rubber sheet 25 can be removed. Therefore, in order to remove the influence of slackness, it is not necessary to provide a configuration for applying a large tension to the rubber sheet 25, and the configuration can be simplified. Moreover, since the tension | tensile_strength provided to the rubber sheet 25 may be small, the man-hour of the operator who manufactures the tape bonding apparatus 10 can be reduced. Further, when the rubber sheet 25 is pressed by the pressing ring 26, the airtightness can be improved.

  Further, since the expansion of the rubber sheet 25 is used, a special configuration for moving the wafer 11 to the upper tape member 12 is not required. For this reason, the wafer 11 can be moved upward toward the tape member 12 with a simple configuration.

  When the rubber sheet 25 lifts the wafer 11 and the wafer 11 comes into contact with the tape member 12, the wafer 11 comes into contact with the tape member 12 against the stretched state of the tape frame 28. For this reason, the tape member 12 is not adhered to the upper surface of the wafer 11 while being loosened, and bubbles can be prevented from entering the adhesive surface between the upper surface of the wafer 11 and the tape member 12. Further, even if the tape member 12 is in a state where the center of the tape member 12 bulges downward due to its own weight, the contact with the wafer 11 starts from the center and is a preferable contact. Therefore, good adhesion can be achieved.

  Furthermore, the control device 70 is connected to the vacuum pump 36, the first and second valve members 37 and 41, the sensor 43, and the vacuum gauge 42, and can control these operations. In particular, the control device 70 operates the vacuum pump 36 to perform vacuum suction of the first vacuum chamber 50 and the second vacuum chamber 51, and after this vacuum suction, the second valve member 41 is moved to the atmosphere introduction side. And the atmosphere is introduced into the second vacuum chamber 51. As a result, the rubber sheet 25 can be expanded toward the first vacuum chamber 50, and the tape member 12 can be reliably attached to the upper surface of the wafer 11 by utilizing the expansion of the rubber sheet 25 from which the slack is removed. Can be bonded.

  Further, when performing vacuum suction of the first vacuum chamber 50 and the second vacuum chamber 51, the control device 70 switches the first valve member 37 to the atmosphere introduction side, and vacuums the second valve member 41. The second vacuum chamber 51 is evacuated first by switching to the side. For this reason, the pressure in the second vacuum chamber 51 initially decreases with respect to the first vacuum chamber 50. Therefore, the rubber sheet 25 expands toward the second vacuum chamber 51 side on the lower surface side. In this way, the rubber sheet 25 does not first expand toward the first vacuum chamber 50 side. For this reason, it is possible to prevent the wafer 11 and the tape member 12 from being bonded before the second valve member 41 is switched to the atmosphere introduction side.

  Further, the lid 60 is provided so as to be openable and closable with respect to the main body 20. For this reason, the lid part 60 can be rotated via the hinge 61. As a result, the wafer 11 and the tape member 12 can be easily installed or the wafer 11 to which the tape member 12 is bonded can be easily taken out with the lid portion 60 opened.

  Further, a seal ring 24 is provided between the lid 60 and the main body 20. For this reason, between the cover part 60 and the main-body part 20 can be airtightly obstruct | occluded. For this reason, in the case of the operation of the vacuum pump 36 and the switching operation of the first and second valve members 37 and 41 to the vacuum suction side, there is a slight gap between the lid 60 and the main body 20 first. Even when the suction operation proceeds, the pressure due to the atmospheric pressure increases as the suction operation proceeds, and the bonding state between the seal ring 24 and the ring contact portion 63 is strengthened, whereby the lid body portion 60 and the main body The space between the portions 20 can be airtightly closed.

  Further, the lid portion 60 is formed with a recess 64 that is recessed upward when the lid portion 60 is closed. Thereby, when the tape member 12 reaches a predetermined height position, the tape member 12 hits the upper bottom surface 64a and is pressed from above, and the tape member 12 is lifted by the wafer 11 from below, and bonding is performed in this state. . That is, since the wafer 11 is lifted and pressed upward while pressing the tape member 12 with the upper upper bottom surface 64a, adhesion between the wafer 11 and the tape member 12 can be made strong and reliable.

  In addition, when the lid body portion 60 is strongly sucked during vacuum suction, the center of the lid body portion 60, that is, the approximate center of the upper bottom surface 64a may be bent toward the wafer 11 side. In such a case, the bending acts so as to make the contact between the wafer 11 and the tape member 12 favorable.

  A sensor 43 is provided on the upper surface portion 22 of the main body. For this reason, it can be detected by the sensor 43 that the lid portion 60 is closed with respect to the main body portion 20. A detection signal based on this detection is transmitted to the control device 70, and the vacuum pump 36 is not operated unless the control device 70 receives a detection signal corresponding to the closed state. For this reason, vacuum suction can be performed only when the lid portion 60 is reliably closed, and waste of the vacuum suction can be prevented.

  Further, even if a foreign object is accidentally sandwiched between the lid 60 and the main body 20, the vacuum pump 36 is not operated, and therefore this foreign object can be easily removed. For this reason, it is possible to prevent breakage between the lid portion 60 and the main body portion 20.

  Further, the tape frame 28 is attached to the pressing ring 26 via a pin member 27. For this reason, a gap can be formed between the tape frame 28 and the pressing ring 26. From this gap, air existing in the space between the tape member 12 and the wafer 11 can be sucked and exhausted by operating the vacuum pump 36. Therefore, when the tape member 12 is bonded to the upper surface of the wafer 11, bubbles can be prevented from entering the bonded portion.

(Second Embodiment)
Hereinafter, a second embodiment of the present invention will be described with reference to FIGS. FIG. 8 is a plan view of the main body 20 in a state where the tape bonding apparatus 100 according to the present embodiment is shown and the lid 60 shown in FIG. 11 is seen through. FIG. 9 is a side view of a state where a part of the internal configuration (release lever 135 and the like) of the tape bonding apparatus 100 is seen through. FIG. 10 is a front view showing the configuration of the tape bonding apparatus 100. FIG. 11 is a plan view showing a configuration centering on the lid body 60 and the balancer mechanism 110 in the tape bonding apparatus 100.

  The tape bonding apparatus 100 of the present embodiment uses a glass substrate 101 as a workpiece, and bonds the tape member 12 to the upper surface of the glass substrate 101. Therefore, the basic structure of the tape bonding apparatus 100 is the same as that of the tape bonding apparatus 10 in the first embodiment described above. For this reason, the description of the same parts as those described in the first embodiment is omitted.

  The tape member 12 bonded to the glass substrate 101 in the present embodiment is an ultraviolet curable UV tape (sheet) similar to the tape member 12 in the first embodiment described above. Therefore, if the tape member 12 is bonded to the glass substrate 101 and then irradiated with ultraviolet rays, the tape member 12 is cured and easily peeled off from the glass substrate 101. However, the tape member 12 is not limited to the ultraviolet curable type, and a polarizing film may be used as the tape member 12. A polarizing plate that is functionally the same as the polarizing film may be used as the tape member 12. The glass substrate 101 is a mother glass substrate used for, for example, a liquid crystal display, a plasma display, etc., and has a large size (for example, 25 inches to 35 inches or more). However, the glass substrate 101 may have a small size. In the present embodiment, the glass substrate 101 has a rectangular planar shape. However, the glass substrate 101 may have a shape other than a rectangular shape such as a circular shape or an elliptical shape in plan view.

  As shown in FIG. 8, the planar shape of the tape bonding apparatus 100 is provided so as to form a substantially rectangular shape. That is, the main body 20, the main body upper surface portion 22, the hole portion 23, the rubber sheet 25, the lid body portion 60, the concave portion 64 and the like are formed in a substantially rectangular shape. Further, the seal ring 24, the pressing ring 26, the tape frame 28, and the like are provided in a rectangular ring shape in which a corner portion has R. Similarly, the hole 23, the recess 64, and the like are also provided in a rectangular shape with a corner portion having R.

  As shown in FIG. 8, the main body 20 in the present embodiment is provided so that the overall planar shape is substantially rectangular. Therefore, the main body upper surface portion 22 and the like of the main body portion 20 are also provided so that the planar shape is substantially rectangular.

  Further, as shown in FIG. 9 and FIG. 11 and the like, the tape bonding apparatus 100 of the present embodiment is provided with a balancer mechanism 110 that forms a part of the opening / closing auxiliary means. The balancer mechanism 110 is a mechanism for facilitating the opening and closing of the lid portion 60 having a large area and weight corresponding to the glass substrate 101 having a large area. As shown in FIG. 11, the balancer mechanism 110 is a mechanism that can attach a weight 111 to a portion on the opposite side of the lid 60 with the hinge 61 interposed therebetween. Further, the balancer mechanism 110 includes a substantially rectangular housing 112, and members such as the weight 111 and the mounting shaft 114 are accommodated in the housing 112.

  As shown in FIGS. 9 and 11, the balancer mechanism 110 has an attachment fixing portion 113. The attachment fixing portion 113 is attached to a portion between the pair of hinges 61 on the upper surface side and the rear end side (side on which the hinge 61 is provided) of the lid body portion 60. An attachment shaft 114 is attached to the rear end side of the attachment fixing portion 113 (the side away from the lid body portion 60). That is, the attachment shaft 114 is attached to the lid body portion 60 via the attachment fixing portion 113. The attachment shaft 114 has a large diameter portion 114a and a small diameter portion 114b. A weight 111 can be attached to each of the large diameter portion 114a and the small diameter portion 114b.

  In addition, in the level | step-difference part 114c which exists between the large diameter part 114a and the small diameter part 114b, the weight 111 attached to the small diameter part 114b can be received. In the present embodiment, the weight 111 attached to the large diameter portion 114a is lighter than the weight 111 attached to the small diameter portion 114b. However, the weight of the weight 111 attached to the large diameter portion 114a and the small diameter portion 114b can be selected as appropriate.

  In addition, a collar 115 is attached to a portion of the large diameter portion 114a that extends from the stepped portion 114c toward the lid portion 60 by a predetermined dimension. The collar 115 is for determining the mounting position of the weight 111 described above. In addition, a collar 116 is attached to a predetermined portion of the large diameter portion 114 a closer to the lid body 60 than the collar 115. A joint pin 133 described later is locked to the collar 116. Further, on the outer peripheral surface of the collar 116, a locking pin 117 corresponding to the protruding portion protrudes toward the outer diameter side. The locking pin 117 is a part that enters a notch part 134 described later. In the present embodiment, the locking pin 117 extends in a state of being substantially parallel to the main body upper surface portion 22.

  A retaining ring 118 is attached to the tip of the small diameter portion 114b. The retaining ring 118 is a member for maintaining the attachment state without the weight 111 coming out of the attachment shaft 114 even if the attachment shaft 114 rotates as the lid 60 is opened and closed.

  Further, as shown in FIGS. 9 and 12, a support base 120, which is a part of the opening / closing auxiliary means, is provided inside the main body portion 20, and the support base 120 is inserted through which the rotating shaft 122 is inserted. A hole 121 is provided. The rotating shaft 122 rotatably supports the arm 130 that forms part of the opening / closing assisting means. A shaft hole 131 is formed on the lower end side of the arm 130, and a rotating shaft 122 that passes through the insertion hole 121 is inserted into the shaft hole 131. Thereby, the arm 130 is rotatably supported with respect to the support stand 120. In the present embodiment, a pair of arms 130 are provided across the center line L (see FIG. 8) of the main body 20. Therefore, a pair of support bases 120 are also provided inside the main body 20. The rotating shaft 122 has a length dimension that penetrates both of the pair of support tables 120.

  FIG. 12 is a partial side view showing the configuration near the arm 130. As shown in FIG. 12, the pair of arms 130 have an appearance in which a short piece (upper end portion in FIG. 12) of the elongated plate-like member is bent at an obtuse angle with respect to the long piece. The shaft hole 131 described above is formed on one end side (lower end side) of the arm 130, but a through hole 132 is also formed on the other end side (upper end side) of the arm 130. Here, the upper end side of the arm 130 in which the through hole 132 is provided is located above the attachment shaft 114 in the closed state of the lid body portion 60. In addition, a joint pin 133 is inserted into the through-hole 132 so as to straddle both the pair of arms 130. Due to the presence of the joint pin 133, both the pair of arms 130 can be integrally rotated.

  Here, the joint pin 133 is stretched across the pair of arms 130 on the upper side of the mounting shaft 114. Therefore, the joint pin 133 is always located above the mounting shaft 114. In the closed state of the lid 60, the joint pin 133 is in a state of being locked to the collar 116 described above.

  Further, as shown in FIG. 12, the arm 130 is provided with a notch 134. The notch 134 is provided at a substantially central portion of the arm 130. In FIG. 12, the cutout portion 134 is cut out from the side surface of the arm 130 on the rear end side (side away from the lid body portion 60), and cut out from below to upward. As a result, the arm 130 has a configuration in which a downward projecting portion 130b located below the top portion 130a of the notch exists. For this reason, when the locking pin 117 enters the notch 134, the movement of the locking pin 117 toward the rear end side is restricted by the presence of the downward projecting portion 130b. Thereby, the state in which the locking pin 117 enters the notch 134 is maintained, and the open state of the lid 60 can be maintained.

  Further, as shown in FIGS. 9 and 12, one end side 135 a of a release lever 135 is connected to the arm 130. One end side 135 a of the release lever 135 is connected to the arm 130 on a lower side than the notch portion 134. In addition, the other end side 135 b of the release lever 135 protrudes from the front side surface of the main body 20. A gripping portion 136 having a collar portion is attached to the other end side 135b. Therefore, by pulling the grip portion 136 toward the front side, the arm 130 can be rotated toward the front side with the rotation shaft 122 as a fulcrum. In the state where the locking pin 117 is fitted in the notch part 134, the arm 130 is rotated forward and the lid body part 60 is slightly lifted by hand, etc., so that the notch of the locking pin 117 is obtained. It is possible to release the fitting into the portion 134.

  Further, as shown in FIGS. 8, 11 and 13, the tape bonding apparatus 100 of the present embodiment is provided with a lock mechanism 140 as an opening / closing lock means. The lock mechanism 140 is a member for ensuring the closed state of the lid body portion 60. As shown in FIG. 13, the lock mechanism 140 includes a receiving portion 141 provided in the lid body portion 60, a lock main body portion 142 provided in the main body portion 20, and a lever portion 143. . Among these, the receiving portion 141 is formed with a hole 144. A lock pin 145 described later enters the hole 144.

  The lock main body 142 is provided with a lever portion 143. A lock pin 145 is provided in the lever portion 143 so as to be interlocked. That is, when the operator holds the lever portion 143 and rotates the lever portion 143 by, for example, about 180 degrees, the lock pin 145 enters the hole portion 144 on the receiving portion 141 side. Thereby, the opening of the lid 60 is locked. Further, when the lever portion 143 is rotated by, for example, about 180 degrees from the state in which the lock pin 145 enters the hole portion 144, the lock pin 145 that has entered the hole portion 144 comes out of the hole portion 144. As a method for moving the lock pin 145 into and out of the hole 144, various methods such as a screw method, a method for releasing the biasing force of the spring by rotation, a cam method, and the like can be used.

  In addition, as the lock mechanism 140, a method of moving the lock pin 145 into and out of the hole 144 may not be used, and another method such as a slide lock method may be used.

  14 is arranged on the right side of the cross-sectional view along the line AA in FIG. 8 and on the left side of the cross-sectional view along the line BB in FIG. 8, and the center line X of the short pin 150 and the long pin 151 is bounded It is a half sectional view joined together as a line. As shown in FIGS. 8 and 14, in the present embodiment, the holding ring 26 includes a short pin 150 as a pin member and a first support member, and a long pin as a pin member and a second support member. 151. The short pin 150 is a pin member that protrudes upward from the upper surface of the pressing ring 26 by approximately 1 mm. Similarly, the long pin 151 is a pin member that protrudes upward from the upper surface of the pressing ring 26 and protrudes approximately 1.7 mm.

  The protruding length of the short pin 150 and the long pin 151 is not limited to this length, and the length of the long pin 151 is longer than that of the short pin 150 and the tape member 12 is initially formed on the upper bottom surface 64a. Any length is possible as long as the tape member 12 is in contact with the upper bottom surface 64a when the rubber sheet 25 is expanded, although it does not contact.

  Here, in the present embodiment, the press ring 26 is provided with a total of ten short pins 150 and long pins 151 (see FIG. 8). Of these, a total of three short pins 150 and long pins 151 are provided on the left longitudinal piece 26b and the right longitudinal piece 26c of the press ring 26, respectively. Further, a total of two short pins 150 and long pins 151 are provided on the upper short piece 26d and the lower short piece 26e of the pressing ring 26, respectively. The left longitudinal piece 26b is provided with a long pin 151 at the lower part and short pins 150 at the central part and the upper part. Further, in the right longitudinal piece 26c, a long pin 151 is disposed at the upper portion, and a short pin 150 is disposed at the central portion and the lower portion. Further, the upper short piece 26d has a long pin 151 on the left side and a short pin 150 on the right side, and the lower short piece 26e has a long pin 151 on the right side. A short pin 150 is arranged in the part.

  When the four long pins 151 arranged in this way are connected, a parallelogram having a shape close to a rectangle is formed.

  The operation (operation) of the tape bonding apparatus 100 having the above configuration will be described below. Since the operation (operation) of the tape bonding apparatus 100 is basically the same as the operation of the tape bonding apparatus 10 described in the first embodiment, description of common parts is omitted or abbreviated. To do.

  First, the worker places the glass substrate 101 on the rubber sheet 25. Next, the tape member 12 is stretched on the tape frame 28. Thereafter, the tape frame 28 is set on the holding ring 26 (step S10; see FIG. 6).

  In this case, the tape frame 28 is installed above the short pins 150 and the long pins 151 provided on the holding ring 26. Due to the difference in length between the short pins 150 and the long pins 151, the tape frame 28 is Portions other than the vicinity of the four portions that are in contact with the long pin 151 (the contact portion with the short pin 150 and the portion between the short pin 150 and the long pin 151) bend downward. The tape member 12 stretched on the tape frame 28 also bends downward at portions other than the vicinity of the four locations where the long pins 151 are in contact with the tape frame 28. As described above, the installation of the glass substrate 101 and the tape member 12 is completed.

  Next, the operator grasps the grasping portion 136 and pulls it toward the front side. In this case, it is preferable that the operator lightly pushes the lid body 60 toward the rear end side (rotates clockwise in FIG. 9). Then, since the arm 130 receives a force toward the near side via the release lever 135, the arm 130 rotates toward the near side with the rotation shaft 122 as a fulcrum. At this time, the lid 60 is slightly lifted (turns slightly clockwise in FIG. 9), so that the locking pin 117 gets over the lower end side of the downward projecting portion 130b. Then, the engagement of the locking pin 117 with the notch 134 is released. As a result, the lid 60 can be rotated in the closing direction (rotated counterclockwise in FIG. 9).

  Subsequently, the lid body portion 60 is lowered with respect to the main body portion 20 until the sensor 43 detects that the lid body portion 60 is closed (step S11; see FIG. 6). Then, after closing the lid portion 60, the lever portion 143 of the lock mechanism 140 is rotated. Thereby, the lock pin 145 enters the hole portion 144, the ring contact portion 63 (see FIG. 3) of the lid body portion 60 is pressed against the seal ring 24, and the lid body portion 60 is locked. The subsequent steps are the same as the steps described in the first embodiment (see FIG. 6). And after passing each step, the tape member 12 can be reliably adhere | attached with respect to the glass substrate 101 so that a bubble may not enter between the glass substrate 101 and the tape member 12. FIG.

  According to the tape bonding apparatus 100 having such a configuration, even when the glass substrate 101 is used as a workpiece, the glass sheet 101 is utilized by utilizing the expansion of the rubber sheet 25 as in the case of the first embodiment described above. The tape member 12 can be adhered to the upper surface of the substrate 101. In other words, the tape member 12 can be reliably bonded to the upper surface of the glass substrate 101 by the pressure difference between the atmospheric pressure and the vacuum state with a simple configuration.

  Further, the tape bonding apparatus 100 is provided with a balancer mechanism 110. Therefore, it becomes easy for the operator to perform the operation of opening and closing the lid body 60, and the burden on the operator can be reduced. In particular, the balancer mechanism 110 includes an attachment shaft 114, and the weight 111 is attached to the attachment shaft 114. Therefore, the weight balance between the lid body portion 60 and the weight 111 can be maintained across the hinge 61. Become. Therefore, it becomes easier to open and close the lid 60.

  Further, the balancer mechanism 110 includes an arm 130, and the arm 130 is provided with a notch portion 134 into which the locking pin 117 is fitted. For this reason, when the lid 60 is opened and the locking pin 117 enters and hits the notch 134, the locking pin 117 is prevented from coming out of the notch 134 due to the presence of the lower protrusion 130b. Is maintained. As a result, the rotation of the arm 130 is prevented, and the open state of the lid body 60 can be maintained, and the operator needs to maintain the open state of the lid body 60 by pressing the lid 60 with his / her hand. Disappears. Therefore, the operator can perform other operations, and the tape bonding apparatus 100 is excellent in convenience.

  Further, the press ring 26 is provided with a short pin 150 and a long pin 151, and the tape frame 28 is supported by the short pin 150 and the long pin 151. Therefore, the height of the tape member 12 fixed to the tape frame 28 is high in the vicinity of the support portion of the long pin 151, and the height position is low in other portions. Therefore, it is possible to prevent the tape member 12 from coming into contact with the glass substrate 101 with the long pins 151, and by providing the short pins 150, compared to the case where the entire tape member 12 is supported by the long pins 151, The height position of the tape member 12 can be lowered. In this case, if the bending of the tape member 12 is taken into consideration, a space can be provided above the tape member 12.

  Moreover, it is not necessary to make the depth of the recessed part 64 which exists in the cover body part 60 deeper than necessary. For this reason, when there is little space margin, the recessed part 64 can be deepened by cutting etc., and it becomes possible to adjust arbitrarily. That is, if the depth of the upper bottom surface 64a for pressing the tape member 12 from above is appropriately adjusted, the adhesiveness between the glass substrate 101 lifted by the expansion of the rubber sheet 25 and the tape member 12 is improved. Is possible.

  In the above-described embodiment, the tape bonding apparatus 100 is provided with the lock mechanism 140. Therefore, it is possible to prevent the lid body portion 60 from being opened during the bonding operation of the tape member 12, and the closed state of the lid body portion 60 can be reliably maintained.

(Third embodiment)
Hereinafter, a third embodiment of the present invention will be described with reference to FIGS. FIG. 15 is a plan view showing a state in which the lid 60 is viewed from the main body 20 in the tape bonding apparatus 200 according to the present embodiment. FIG. 16 is a side view showing a state where a part of the internal structure (release lever or the like) of the tape bonding apparatus 200 is seen through. FIG. 17 is a rear view showing the configuration of the tape bonding apparatus 200. FIG. 18 is a side view showing a state in which the internal structure of the lid portion 60 of the tape bonding apparatus 200 is seen through.

  The tape bonding apparatus 200 according to the present embodiment has a lid portion 60 side changed as compared with the tape bonding apparatus 10 according to the first embodiment described above. The tape member 12 is coated with a material (for example, a thermosetting adhesive) whose adhesiveness is improved by heating. Therefore, the tape member 12 is easily bonded to the wafer 11 by heating as described later. The details will be described below.

  The tape member 12 is not limited to one having a thermosetting adhesive applied to the surface thereof, and any tape member 12 can be used as long as the tape member 12 is improved in adhesiveness by heating. .

  As shown in FIG. 15, a heater unit 210 is built in the lid body portion 60. The heater unit 210 applies heat to the concave portion 64 present in the lid portion 60, and heats the tape member 12 by radiant heat from the concave portion 64 or contact with the concave portion 64. Therefore, the heater unit 210 is a part of the lid part 60 that is close to the upper bottom surface 64a of the recess 64 (in FIG. 18, an upper part adjacent to the recess 64; hereinafter, this part is referred to as a storage part 220). ) Is built in. The heater unit 210 includes a plurality of heaters 211 (eight in the present embodiment) as heating means, and the plurality of heaters 211 extend from the radial center of the storage unit 220 to the outer diameter side. It is arranged radially so as to face.

  For example, a cartridge heater is used as the heater 211. However, the heater 211 is not limited to the cartridge heater, and various heaters such as a halogen heater and an infrared heater may be used. A sheath heater other than the cartridge heater (for example, a sheathed heater) may be used.

  The heater 211 is attached to the inside of the storage unit 220 via separate fixing means (such as the cartridge holder 214 shown in FIG. 14). However, the fixing means is not limited to the cartridge holder 214, and any fixing method may be used. In addition, the wiring 212 toward the heater 211 is located in the radial center portion of the storage portion 220 (concave portion 64) with respect to the heater 211. As shown in FIG. 18, the wiring 212 extends upward in the radial center portion of the storage portion 220 (concave portion 64). The wiring 212 extends toward the outer diameter side in a state of being located on the upper side of the lid body 60 so as not to interfere with the heater 211, and is connected to the power supply side (not shown) via a terminal block (not shown). )It is connected to the.

  As shown in FIG. 18, a heat insulating material 213 a is attached to the upper surface side of the storage unit 220. Further, as shown in FIG. 15, a heat insulating material 213b is also attached to one end side 62a of the damper member 62 (in the vicinity of the front handle 65b). Furthermore, a heat insulating material 213c is also attached to the front side (the handle 65a side) of the tape bonding apparatus 200. Thereby, the upper surface side of the lid part 60 and the handles 65 a and 65 b that are often gripped by the operator are prevented from being heated by the heater 211.

  In the present embodiment, the heater 211 can heat the tape member 12 to about 70 degrees, up to about 100 degrees at the maximum. However, the heating temperature by the heater 211 is not limited to this. For example, depending on the type of the thermosetting adhesive applied to the adhesive surface of the tape member 12, the adhesive surface is heated to about 200 degrees. May be.

  Here, the bonding procedure of the tape member 12 to the wafer 11 in the present embodiment is the same as that described in the first embodiment except for the heated portion. That is, after the heater 211 reaches a temperature suitable for heating, the same steps as those described in the first embodiment are performed. Therefore, the description of the operation when the tape member 12 is bonded using the tape bonding apparatus 200 is omitted.

  In the present embodiment, the heating step is automatically executed when the tape frame 28 to which the wafer 11 and the tape member 12 are attached is installed inside the main body 20 and the lid 60 is closed. . In this heating step, a predetermined thickness portion (plate-shaped upper bottom surface 64 a) constituting the recess 64 is heated by the heater 211. That is, the upper bottom surface 64a having a large area is heated, and after reaching a substantially uniform temperature over the entire upper bottom surface 64a, the tape member 12 is heated by the radiant heat from the upper bottom surface 64a. Therefore, the tape member 12 is heated indirectly and uniformly through the upper bottom surface 64a.

  In the present embodiment, the heater 211 is always operated regardless of whether the lid body 60 is opened or closed. However, depending on the heating temperature, the sensor 43 may detect the state in which the lid body 60 is open, and the operation of the heater 211 may be stopped when the detection signal is detected by the control device 70. .

  In the tape bonding apparatus 200 having such a configuration, the adhesiveness (tackiness) of the tape member 12 to the wafer 11 is improved by heating. For this reason, the tape member 12 can be firmly bonded to the wafer 11.

  In addition, the heaters 211 are radially arranged so as to go from the radial center of the storage unit 220 toward the outer diameter side. For this reason, it is possible to uniformly heat the entire circumference of the tape member 12. In addition, by adopting such a radial arrangement, it is possible to suppress unevenness in heating on the inner diameter side and the outer diameter side of the tape member 12. Further, the tape member 12 is indirectly heated through the upper bottom surface 64a. Therefore, compared with the case where the tape member 12 is directly heated by the heater 211, it can suppress that a heating nonuniformity arises and can heat more uniformly.

  Further, heat insulating materials 213 a to 213 c are respectively attached to the upper surface side of the storage portion 220, one end side 62 a of the damper member 62, and the front side of the tape bonding apparatus 200. For this reason, it is possible to prevent the handles 65a and 65b, which are frequently held by the operator, from being heated by the heater 211, making it easier for the operator to work and improving the production efficiency.

  Although the first to third embodiments of the present invention have been described above, the present invention can be variously modified in addition to this. This will be described below.

  In each of the above-described embodiments, the work such as the wafer 11 and the glass substrate 101 is placed on the upper surface of the rubber sheet 25. However, a sheet-like member made of, for example, a resin may be placed on the upper surface of the rubber sheet 25, and a workpiece may be placed on the upper part of the sheet-like member. In this way, it is possible to prevent the dust from adhering to the work caused by rubbing the rubber sheet 25 and the like, and it is possible to reduce the subsequent cleaning process using the cleaning processing apparatus.

  Further, the tape frame 28 may be provided with a gripping portion that protrudes toward the outer diameter side for easy removal. Thus, the operator can easily take out the tape frame 28 and the tape member 12 and the work attached to the tape frame 28 to the outside.

  Further, a rotating tongue piece member may be attached to the lower surface side of the tape frame 28. The rotating tongue piece member is rotated after the bonding is finished so as to contact the lower surface side of the workpiece. In this way, the weight of the workpiece can be supported by the tongue piece member. Thereby, even if there is a portion having a weak adhesive force between the workpiece and the tape member 12, it is possible to prevent the tape from peeling between the workpiece and the tape member 12.

  Further, in each of the above-described embodiments, the seal ring 24 is attached to the main body upper surface portion 22. However, the seal ring 24 may be attached to the lid body 60 side. In such a configuration, a ring contact portion is provided on the upper surface portion 22 of the main body.

  Further, in each of the above-described embodiments, the case where the rubber sheet 25 is used as the elastic sheet member has been described. However, the elastic sheet member is not limited to the rubber sheet 25, and may be made of a material other than the rubber material such as a resin such as an elastomer resin. Moreover, in the above-mentioned embodiment, the case where the pressing ring 26 is used as the holding member has been described. However, the holding member is not limited to the pressing ring 26, and for example, a material having adhesiveness such as an adhesive applied to the inner diameter portion 22a may be used as the holding member. Further, the shape of the holding member is not limited to the ring shape, and various shapes such as a ring shape having an outer diameter forming a polygon can be adopted.

  In each of the above-described embodiments, the case where the tape frame 28 is used as the tape holding means has been described. However, the tape holding means is not limited to the tape frame 28, and for example, a pair of rod-like members may be used as the tape holding means. In this case, the tape member 12 is stretched between the pair of rod-like members with tension applied.

  Moreover, as a control means, the control condition may be set beforehand, and the structure which can set a control condition arbitrarily on the operator side may be sufficient. Furthermore, the sealing member may have any shape and configuration as long as the sealing member can be hermetically closed between the main body 20 and the lid 60. In addition to the wafer, a display member such as a liquid crystal, a special glass material, a glass substrate for organic EL, or the like may be employed as the workpiece. In the above-described embodiment, the atmosphere (air) is introduced after evacuation. However, other than air, for example, argon gas or the like is introduced so that the pressure is higher than that in the vacuum state. good.

  In the second embodiment described above, the case where the locking pin 117 is used as the protruding portion is described. However, the protruding portion is not limited to the locking pin 117, and any member may be used as long as it fits into the cutout portion 134. Further, the concave / convex relationship between the locking pin 117 and the notch 134 may be reversed.

  Furthermore, in the above-described second embodiment, the balancer mechanism 110, the support base 120, and the arm 130 are used as the opening / closing auxiliary means. However, the opening / closing assisting means is not limited to these. For example, without using an opening / closing assisting means for the operator to grip and open the lid 60 by gripping the handles 65a to 65c by hand, an opening / closing assisting means having a driving means such as a motor or a hydraulic jack may be employed. good. Moreover, you may employ | adopt the opening-and-closing assistance means provided with the air actuator which supplies air to an air cylinder using the vacuum pump 36. FIG. Moreover, when the cover part 60 is light, the structure which abbreviate | omits opening / closing assistance means may be employ | adopted.

  In the second embodiment described above, the case where the lock mechanism 140 is used as the opening / closing lock means has been described. However, the open / close lock means is not limited to the lock mechanism 140. For example, an insertion hole is provided on the main body portion 20 side, a claw portion that rotates while receiving a biasing force from a spring is provided on the lid body portion 60 side, and the claw portion is inserted into the insertion hole when the lid body portion 60 is closed. It may be configured such that the opening of the lid body portion 60 is locked by being locked in the insertion hole of the claw portion. Further, a configuration in which the opening / closing lock means is omitted may be employed.

  Furthermore, in the above-described embodiment, the short pin 150 is provided as the pin member and the first support member, and the long pin 151 is provided as the pin member and the second support member, respectively. However, the configuration in which the short pin 150 and the long pin 151 are provided in the pressing ring 26 is not limited, and the short pin 150 and the long pin 151 may be provided in a portion of the tape frame 28 facing the pressing ring 26. . Further, a convex portion is formed in a portion of the tape frame 28 that faces the holding ring 26, and the projection portion having a long projecting length is the first support member, and the projecting portion having a short projecting length. May be used as the second support member.

  In the third embodiment described above, the case where the heater 211 for heating the tape member 12 is used as the heating means has been described. However, when the heat resistance of the rubber sheet 25 is excellent, the glass substrate 101 side may be heated.

  In the second embodiment described above, when the tape member 12 is a polarizing film, a peeling mechanism for peeling the tape member 12 may be provided inside the tape bonding apparatus 100. Here, as a peeling mechanism, various structures, such as providing a suction holding mechanism for sucking and holding the tape member 12, and picking and peeling the end of the tape member 12, can be employed. In this case, when the tape member 12 is detached (peeled) inside the tape bonding apparatus 100 using a peeling mechanism, it is possible to prevent dust from adhering to the surface (upper surface portion or four corner portions) of the glass substrate 101. it can. In particular, it is difficult to prevent dust from adhering to the surface of the glass substrate 101 even if the tape member 12 is peeled off in a clean room, but the tape bonding apparatus 100 of the present embodiment is used. In this case, since the tape member 12 is peeled inside the vacuum, it is possible to more reliably prevent dust from being attached to the glass substrate 101.

  In the second embodiment described above, when the tape member 12 is a UV curable tape, a peeling mechanism for peeling the tape member 12 may be provided inside the tape bonding apparatus 100. Here, as the peeling mechanism, a suction holding mechanism for peeling the tape member 12 or a mechanism for picking and peeling the end of the tape member 12 may be provided inside the tape bonding apparatus 100. Moreover, when providing a suction holding mechanism, you may employ | adopt the structure using the suction of the vacuum pump 36 mentioned above. By providing such a peeling mechanism, the tape member 12 can be peeled inside the tape bonding apparatus 100 that is vacuum-sucked. Therefore, dust can be prevented from adhering to the surface of the glass substrate 101 when the tape is peeled off.

  Further, in the tape bonding apparatus 10, 100, 200 of each of the above-described embodiments, when the tape member 12 uses a UV curable tape, for example, ultraviolet rays that irradiate the lid 60 or the main body 20 with ultraviolet rays. An irradiation device may be provided to irradiate the glass substrate 101 with ultraviolet rays. In this case, the process up to the step of curing the tape member 12 by irradiation of ultraviolet rays can be performed inside the tape bonding apparatus 10, 100, 200.

  Further, the tape member 12 is not limited to a protective tape, a UV curable tape, and a polarizing film, and various members bonded to a workpiece such as a transparent electrode may be used as the tape member 12.

  Alternatively, a mechanism for cutting the tape member 12 after the tape member 12 is bonded to the wafer 11 or the glass substrate 101 may be provided inside the tape bonding apparatus 10, 100, 200.

  The tape bonding apparatus and the tape bonding method of the present invention can be used in the manufacturing process of a semiconductor integrated circuit using a wafer and the manufacturing process of a liquid crystal display device using a liquid crystal. That is, it can be used in the semiconductor manufacturing industry. It can also be used in the display manufacturing industry using a glass substrate.

It is a figure which shows the structure of the tape bonding apparatus which concerns on the 1st Embodiment of this invention, and is a top view which sees through a cover body part in the state which has arrange | positioned the wafer on the rubber sheet. It is a figure which shows the structure of the tape bonding apparatus of FIG. 1, and is a side view which shows the state which looked through a part of internal structure while showing the state which closed the cover part. It is a schematic block diagram which simplifies and shows the state of the exhaust system and control system of the tape bonding apparatus of FIG. It is a partial sectional side view which shows the state which expanded the structure which hold | maintains a rubber sheet and a tape member among the tape bonding apparatuses of FIG. It is a figure which shows the structure of the tape bonding apparatus of FIG. 1, (a) is the side view which partially saw through the inside which shows the state which opened the cover part, (b) is the state which closed the cover part. It is principal part sectional drawing seen from the front side to show. It is a figure which shows the operation | movement flow at the time of adhere | attaching a tape member with respect to a wafer using the tape bonding apparatus of FIG. It is an image figure which shows the aspect of adhesion | attachment when a wafer is lifted and adhere | attached on a tape member using the tape bonding apparatus of FIG. 1, (a) is a case where adhesion | attachment is started from the center part of a wafer with respect to a tape member. (B) is a figure which shows the case where adhesion | attachment is started from the upper end of the wafer inclined with respect to a tape member. It is a figure which shows the structure of the tape bonding apparatus which concerns on the 2nd Embodiment of this invention, and is a top view which sees through and shows a cover body part. It is a figure which shows the structure of the tape bonding apparatus of FIG. 8, and is a side view which shows the state which looked through a part of internal structure while showing the state which closed the cover part. It is a front view which shows the structure of the tape bonding apparatus of FIG. It is a top view which shows the structure centering on a cover body part among the tape bonding apparatuses of FIG. It is a partial side view which shows the structure of the arm vicinity among the tape bonding apparatuses of FIG. It is a partial side view which shows the structure of a lock mechanism vicinity among the tape bonding apparatuses of FIG. The side cross-sectional view along the line AA of the tape bonding apparatus in FIG. 8 is arranged on the right side, and the side cross-sectional view along the line BB is arranged on the left side. It is sectional drawing. It is a figure which shows the structure of the tape bonding apparatus which concerns on the 3rd Embodiment of this invention, and is a top view which sees through and shows a cover body part. It is a figure which shows the structure of the tape bonding apparatus shown in FIG. 15, and is a side view which shows the state which closed the cover part. It is a rear view which shows the structure of the tape bonding apparatus of FIG. It is a side view which shows the state which saw through the internal structure of the cover body part among the tape bonding apparatuses of FIG.

Explanation of symbols

10, 100, 200 ... Tape bonding apparatus 11 ... Wafer (workpiece)
DESCRIPTION OF SYMBOLS 12 ... Tape member 20 ... Main-body part 22 ... Main-body upper surface part 22a ... Inner-diameter part 23 ... Hole 24 ... Seal ring 25 ... Rubber sheet 26 ... Holding ring (holding member)
27: Pin member 28 ... Tape frame (tape holding means)
33 ... Air duct (part of first suction means, part of first air introduction means)
35 ... Tube member (part of first suction means, part of first air introduction means)
36 ... Vacuum pump (part of the first suction means, part of the second suction means)
37 ... 1st valve member (a part of 1st suction means, a part of 1st air introduction means)
38 ... Air pipe (part of the second suction means, part of the second air introduction means)
40 ... Tube member (part of second suction means, part of second air introduction means)
41 ... 2nd valve member (a part of 2nd suction means, a part of 2nd air introduction means)
42 (42a, 42b) ... Vacuum gauge 50 ... First vacuum chamber 51 ... Second vacuum chamber 60 ... Lid portion 61 ... Hinge 62 ... Damper member 63 ... Ring contact portion 64 ... Recess 64a ... Upper bottom surface 70 ... Control device (control means)
101 ... Glass substrate (supports workpieces)
110 ... Balancer mechanism (part of opening / closing assisting means)
111 ... Weight 114 ... Mounting shaft 117 ... Locking pin (corresponding to protruding portion)
120 ... Support base (part of opening / closing assisting means)
122... Rotating shaft 130..
133 ... Joint pin 134 ... Notch 140 ... Lock mechanism (open / close lock means)
150 ... short pin (corresponding to the pin member and the first support member)
151... Long pin (corresponding to pin member and second support member)
210: Heater unit 211: Heater (corresponding to heating means)
220 .. storage part

Claims (5)

In a tape bonding apparatus that bonds a tape member to a workpiece,
An elastic sheet member for placing the workpiece on the upper surface;
A sealable first vacuum chamber located on the upper surface side of the stretchable sheet member and partitioned by the stretchable sheet member;
A sealable second vacuum chamber located on the lower surface side of the stretchable sheet member and partitioned by the stretchable sheet member;
A holding member that holds the stretchable sheet member in a state that prevents air conduction between the first vacuum chamber and the second vacuum chamber;
A tape holding means for holding the tape member in a stretched state, and for positioning the tape member on top of the workpiece placed on the stretchable sheet member;
First suction means for vacuum suction of the inside of the first vacuum chamber;
First air introduction means for introducing air into the first vacuum chamber;
Second suction means for vacuum suction of the inside of the second vacuum chamber;
Second air introducing means for introducing air into the second vacuum chamber;
Equipped with,
A control means for controlling the operation of the first suction means, the second suction means, the first air introduction means, and the second air introduction means;
This control means
Actuating the first suction means and the second suction means to perform vacuum suction of the first vacuum chamber and the second vacuum chamber;
After the vacuum suction, the second air introduction means is operated to introduce air into the second vacuum chamber,
By introducing this air, the expandable sheet member is expanded toward the inside of the first vacuum chamber,
With the expansion of the elastic sheet member, the work is lifted toward the tape member and adhered to the tape member, and
When the first suction unit and the second suction unit are operated, the control unit operates the second suction unit first and then operates the first suction unit later. Tape bonding device. The tape bonding apparatus includes a main body part and a lid part that is provided to be openable and closable with respect to the main body part.
When the lid body portion is closed with respect to the main body portion, a seal member that hermetically closes between the lid body portion and the main body portion is provided at a boundary portion between the lid body portion and the main body portion. ,
In the closed state of the lid portion, the first vacuum chamber is formed between the lid portion and the stretchable sheet member,
The second vacuum chamber is formed between the space portion present in the main body portion and the elastic sheet member.
The tape bonding apparatus according to claim 1, wherein   The lid portion has a concave portion that is recessed upward in the closed state of the lid portion, and the upper bottom surface of the concave portion is directed upward of the work and the tape member due to expansion of the elastic sheet member. 3. The tape bonding apparatus according to claim 2, wherein the movement is suppressed from above. In a tape bonding method for bonding a tape member to a workpiece,
In a state where the work is placed on the upper surface of the stretchable sheet member and the tape member is placed in a stretched state on the upper part of the work by the tape holding means, a first position located on the upper surface side of the stretchable sheet member. A vacuum step of vacuum suction of the vacuum chamber with the first suction means, and vacuum suction of the second vacuum chamber located on the lower surface side of the stretchable sheet member with the second suction means;
A vacuum achievement level detecting step for detecting that the first vacuum chamber and the second vacuum chamber have reached a set vacuum level by the suction step;
After detecting that the degree of vacuum set by the vacuum degree detection step has been reached, the vacuum suction of the second vacuum chamber is stopped by stopping the operation of the second suction means, and the second air introduction A first air introduction step of actuating means to introduce air into the second vacuum chamber;
After the first air introduction step, the expandable sheet member is expanded toward the inside of the first vacuum chamber, and the work is lifted toward the tape member by the expansion of the expandable sheet member, and the tape A bonding step for bonding to the member;
A second air introduction step of operating the first air introduction means to introduce air into the first vacuum chamber after performing the bonding step for a preset time;
Equipped with,
In the suction step, when the first suction means and the second suction means are operated, the second suction means is operated first, and then the first suction means is operated later. Tape bonding method.   The tape member is coated with a thermosetting adhesive, and includes a heating step of heating the tape member prior to bonding of the tape member to the workpiece in the bonding step. The tape bonding method according to claim 4.

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