JPH0254564A - Device for application of adhesive tape to semiconductor wafer - Google Patents

Abstract

PURPOSE:To prevent air bubbles from mixing and to make applying pressure at the time of adhering to whole semiconductor wafers uniform by generating pressure difference in two sealed spaces in a hermetically sealed vessel to bring an adhesive tape into close contact with the wafers on a wafer stage. CONSTITUTION:An adhesive tape 2 is set in a hermetically sealed vessel 1 to form sealed spaces 1a and 1b. Wafers 3 are set on a wafer stage 4 with its pattern face disposed at its lower side, evacuated in vacuum at the outer edge of the wafers 3 from a vacuum opening 4b by negative pressure V1 to be secured by suction. When positive pressure P1 is applied into the upper stage space 1a by an air unit 5 and negative pressure V2 is applied to the lower stage space 1b by an air unit 6, the tape 2 is deformed by the differential pressure between the spaces 1a and 1b with the recess spherical state directed downward, thereby applying the tape 2 to the wafers 3. Positive pressure P2 is so applied to the recess 4a of the wafer stage 4 as not to defect the waters 3 by the positive pressure P1 applied to the wafers 3 at the time of adhering as the reception of the wafers.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an apparatus for applying adhesive tape to semiconductor wafers.

[Conventional technology]

Conventionally, this type of adhesive tape application equipment presses and fixes the patterned surface of the wafer on a hard stage with a surface coating such as Teflon coating, and then covers the wafer with adhesive tape and uses a soft stage such as a rubber roller. The adhesive tape was pasted by moving it back and forth over the wafer a predetermined number of times while applying pressure with a roller.

[Problem to be solved by the invention]

In the above-mentioned conventional adhesive tape application, the device receives the patterned surface of the wafer on a rigid stage and applies the adhesive tape, so the patterned surface is easily damaged, reducing the quality of the product.

Furthermore, since pressure is applied by rollers, the uniformity of the rollers,
Due to factors such as the load distribution of the rollers and warping of the wafer, it is difficult to uniformly attach the wafer to the adhesive tape, and even if the attachment is done with great care, air bubbles may get mixed in between the adhesive tape and the wafer. When the wafer is divided into individual semiconductor elements (hereinafter referred to as chips) in the next dicing process, the centrifugal force of the dicing blade causes the chips to peel off from the adhesive tape and scatter. Another disadvantage is that the scattered chips may expose other chips or damage the dicing blade.

SUMMARY OF THE INVENTION An object of the present invention is to provide an apparatus for adhering semiconductor wafers with adhesive tape, which solves the above-mentioned problems.

[Differences between the invention and the prior art]

In contrast to the above-mentioned conventional adhesive tape application method, the present invention avoids directly pressing the patterned surface of the wafer,
By using air pressure to hold the pattern surface, it prevents damage to the pattern surface that sometimes occurs when applying adhesive tape.
In addition, by applying adhesive tape gradually in concentric circles from the center of the wafer using differential pressure,
The difference is that the inclusion of air bubbles can be prevented and the pressure applied during attachment can be made uniform over the entire surface of the wafer.

[Means for Solving the Problems] In order to achieve the above-mentioned object, in the apparatus for applying adhesive tape to semiconductor wafers according to the present invention, the inside is defined into two airtight spaces by the adhesive tape applied to semiconductor wafers. A pressure difference is created between two airtight spaces in the airtight container, a wafer stage that receives the patterned surface of the semiconductor wafer with air pressure to hold the outer edge of the wafer, and arranges the wafer facing the adhesive tape. and means for bringing the adhesive tape into close contact with the semiconductor wafer on the wafer stage.

〔Example〕

Embodiments of the present invention will be described below with reference to the drawings.

(Example 1) FIGS. 1(a) and 1(b) are longitudinal sectional views showing Example 1 of the present invention.

In the figure, the present invention comprises an airtight container 1 whose interior is defined into two airtight spaces 1a and 1b vertically by an adhesive tape 2 attached to a semiconductor wafer (hereinafter referred to as wafer) 3, and a lower airtight space la. A wafer stage 4 holds the outer edge of the wafer 3 and places it facing the adhesive tape 2.
and an air device 5.6 that creates a pressure difference between the upper and lower airtight spaces 1a and 1b to bring the adhesive tape 2 into close contact with the wafer 3.
and has. The wafer stage 4 has a recess 4a in the center of its upper surface for receiving the patterned surface of the wafer 3, and has a ring-shaped vacuum opening 4b on its outer periphery for vacuum suctioning the outer edge of the wafer 3.

In the embodiment, airtight spaces 1a and 1b are formed by setting adhesive tape 2 in airtight container 1. The wafer 3 is set on the wafer stage 4 with its pattern side facing down, and the outer edge of the wafer 3 is vacuumed through the vacuum opening 4b with negative pressure 1 and fixed by suction. In this state, the air supply ra5 causes a positive pressure P in the upper airtight space la.
When 1 is applied and negative pressure 2 is applied to the lower airtight space 1b by the air device 6, the adhesive tape 2 is deformed downward into a concave spherical shape due to the differential pressure between the airtight spaces 1a and 1b.
The tape 2 is attached to the wafer 3. In order to prevent the wafer 3 from bending due to the positive pressure P1 applied to the wafer 3, a positive pressure P2 is applied to the recess 4a of the wafer stage 4, which serves as a wafer support. At this time, if the air in the airtight space 1a is diluted by the negative pressure v2, it is possible to more reliably prevent air bubbles from being mixed in during pasting.

(Example 2) FIG. 2 is a longitudinal sectional view showing a second embodiment of the present invention.

Depending on the chip size to be diced, it may be necessary to heat the adhesive tape 2 and the wafer 3 because the desired adhesive strength cannot be obtained by pasting at room temperature.

In this embodiment, the wafer stage 4 is connected to the stage heating section 8.
The wafer 3 is preheated by heating at the air heating section 7 and 7', and the heated air 9 and 9' heated by the air heating sections 7 and 7' is sent in to bond the adhesive tape 2 and the wafer 3 by thermocompression. This has the advantage that it can be attached with appropriate strength.

〔Effect of the invention〕

As described above, the present invention uses a wafer stage to apply the adhesive tape while applying air pressure to the patterned surface of the wafer, thereby preventing damage to the patterned surface during pasting.

In addition, by deforming the adhesive tape using differential pressure and applying it, it is possible to apply it in a uniform state without bubbles, which prevents problems such as chip scattering and damage to the dicing blade during the dicing process. This has the effect of improving product quality.

[Brief explanation of the drawing]

FIGS. 1(a) and 1(b) are longitudinal sectional views showing a first embodiment of the present invention, and FIG. 2 is a longitudinal sectional view showing a second embodiment of the present invention. 1...Airtight container 1a, lb...Airtight space 2...Adhesive tape 3...Wafer 4...
・Wafer stage 5.6...Air device 7.7'
... Air heating section 8... Stage heating section 9.9'.
・Heated air

Claims (1)

[Claims] (1) An airtight container whose interior is defined into two airtight spaces by an adhesive tape attached to a semiconductor wafer, and a patterned surface of the semiconductor wafer is received by air pressure to hold its outer edge and the wafer is oriented toward the adhesive tape. A semiconductor wafer comprising: a wafer stage arranged together; and means for generating a pressure difference between two airtight spaces in the airtight container to bring the adhesive tape into close contact with the semiconductor wafer on the wafer stage. Adhesive tape pasting device.