JPH0254564A - Device for application of adhesive tape to semiconductor wafer - Google Patents
Device for application of adhesive tape to semiconductor waferInfo
- Publication number
- JPH0254564A JPH0254564A JP63205489A JP20548988A JPH0254564A JP H0254564 A JPH0254564 A JP H0254564A JP 63205489 A JP63205489 A JP 63205489A JP 20548988 A JP20548988 A JP 20548988A JP H0254564 A JPH0254564 A JP H0254564A
- Authority
- JP
- Japan
- Prior art keywords
- adhesive tape
- wafer
- wafers
- pressure
- spaces
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002390 adhesive tape Substances 0.000 title claims abstract description 34
- 239000004065 semiconductor Substances 0.000 title claims abstract description 14
- 235000012431 wafers Nutrition 0.000 abstract description 55
- 238000003825 pressing Methods 0.000 abstract description 3
- 230000007547 defect Effects 0.000 abstract 1
- 239000003643 water by type Substances 0.000 abstract 1
- 238000010438 heat treatment Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
Landscapes
- Dicing (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は半導体ウェハースの粘着テープ貼付は装置に関
する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an apparatus for applying adhesive tape to semiconductor wafers.
従来、この種の粘着テープの貼付は装置はテフロンコー
ティング等の表面コーティングを施した硬質性のステー
ジ上にウェハースのパターン面を押し当て固定し、その
上から粘着テープを被せゴムローラ等の軟質性のローラ
で加圧しながら所定回数だけウェハース上を往復させて
粘着テープの貼付けを行うものとなっていた。Conventionally, this type of adhesive tape application equipment presses and fixes the patterned surface of the wafer on a hard stage with a surface coating such as Teflon coating, and then covers the wafer with adhesive tape and uses a soft stage such as a rubber roller. The adhesive tape was pasted by moving it back and forth over the wafer a predetermined number of times while applying pressure with a roller.
上述した従来の粘着テープの貼付は装置は硬質性のステ
ージでウェハースのパターン面を受け、粘着テープの貼
付けを行うため、パターン面に傷が付き易く、製品の品
質を低下させていた。In the above-mentioned conventional adhesive tape application, the device receives the patterned surface of the wafer on a rigid stage and applies the adhesive tape, so the patterned surface is easily damaged, reducing the quality of the product.
更に、ローラによる加圧を行うため、ローラの均一性、
ローラの加重分布、ウェハースのソリ等の要因から、ウ
ェハースの粘着テープへの均一な貼付けが難しく、又細
心の注意を払って貼付けを行なっても、粘着テープとウ
ェハースの間に気泡を混入することがあり、次工程であ
るダイシング工程においてウェハースが個々の半導体素
子(以下チップと称す)に分割される際に、ダイシング
ブレードの遠心力等の作用により、チップが粘着テープ
よりはがれ、乗び散ったり、又飛び散ったチップが他の
チップを出付けたり、ダイシングブレードを破損させて
しまうという欠点がある。Furthermore, since pressure is applied by rollers, the uniformity of the rollers,
Due to factors such as the load distribution of the rollers and warping of the wafer, it is difficult to uniformly attach the wafer to the adhesive tape, and even if the attachment is done with great care, air bubbles may get mixed in between the adhesive tape and the wafer. When the wafer is divided into individual semiconductor elements (hereinafter referred to as chips) in the next dicing process, the centrifugal force of the dicing blade causes the chips to peel off from the adhesive tape and scatter. Another disadvantage is that the scattered chips may expose other chips or damage the dicing blade.
本発明の目的は前記課題を解決した半導体ウェハースの
粘着テープ粘付は装置を提供することにある。SUMMARY OF THE INVENTION An object of the present invention is to provide an apparatus for adhering semiconductor wafers with adhesive tape, which solves the above-mentioned problems.
上述した従来の粘着テープ貼付は装置に対し、本発明は
ウェハースのパターン面を直接押し当てることを避け、
空気圧を利用しパターン面を受けることにより、粘着テ
ープを貼付は時に生じるパターン面への損傷を防止し、
又、差圧を利用して粘着テープをウェハースの中央部か
ら徐々に同心円状に粘着テープを貼付けることにより、
気泡の混入を防止し、かつ貼付は時の加圧力をウェハー
ス全面に対して均一にすることができるという相違点を
有する。In contrast to the above-mentioned conventional adhesive tape application method, the present invention avoids directly pressing the patterned surface of the wafer,
By using air pressure to hold the pattern surface, it prevents damage to the pattern surface that sometimes occurs when applying adhesive tape.
In addition, by applying adhesive tape gradually in concentric circles from the center of the wafer using differential pressure,
The difference is that the inclusion of air bubbles can be prevented and the pressure applied during attachment can be made uniform over the entire surface of the wafer.
〔課題を解決するための手段〕
前記目的を達成するため、本発明に係る半導体ウェハー
スの粘着テープ貼付は装置においては、半導体ウェハー
スに貼付ける粘着テープにて内部が2つの気密空間に画
成される気密容器と、半導体ウェハースのパターン面を
空気圧で受けてその外縁を保持し該ウェハースを前記粘
着テープに向き合わせて配置するウェハステージと、前
記気密容器内の2つの気密空間に差圧を生じさせて前記
粘着テープを前記ウェハステージ上の半導体ウェハース
に密着させる手段とを有するものである。[Means for Solving the Problems] In order to achieve the above-mentioned object, in the apparatus for applying adhesive tape to semiconductor wafers according to the present invention, the inside is defined into two airtight spaces by the adhesive tape applied to semiconductor wafers. A pressure difference is created between two airtight spaces in the airtight container, a wafer stage that receives the patterned surface of the semiconductor wafer with air pressure to hold the outer edge of the wafer, and arranges the wafer facing the adhesive tape. and means for bringing the adhesive tape into close contact with the semiconductor wafer on the wafer stage.
以下、本発明の実施例を図により説明する。 Embodiments of the present invention will be described below with reference to the drawings.
(実施例1)
第1図(a) 、 (b)は本発明の実施例1を示す縦
断面図である。(Example 1) FIGS. 1(a) and 1(b) are longitudinal sectional views showing Example 1 of the present invention.
図において、本発明は半導体ウェハース(以下、ウェハ
ースという)3に貼付ける粘着テープ2にて内部が上下
に2つの気密空間1a、lbに画成される気密容器1と
、下段の気密空間la内にウェハース3の外縁を保持し
て粘着テープ2に向き合せて配置するウェハステージ4
と、上下の気密空間1aと1bに差圧を生じさせて粘着
テープ2をウェハース3に密着させるエアー装置5.6
とを有する。前記ウェハステージ4は上面中央部にウェ
ハース3のパターン面を受は入れる凹部4aを有し、そ
の外周にウェハース3の外縁を真空吸着するためのリン
グ状真空開口4bを有している。In the figure, the present invention comprises an airtight container 1 whose interior is defined into two airtight spaces 1a and 1b vertically by an adhesive tape 2 attached to a semiconductor wafer (hereinafter referred to as wafer) 3, and a lower airtight space la. A wafer stage 4 holds the outer edge of the wafer 3 and places it facing the adhesive tape 2.
and an air device 5.6 that creates a pressure difference between the upper and lower airtight spaces 1a and 1b to bring the adhesive tape 2 into close contact with the wafer 3.
and has. The wafer stage 4 has a recess 4a in the center of its upper surface for receiving the patterned surface of the wafer 3, and has a ring-shaped vacuum opening 4b on its outer periphery for vacuum suctioning the outer edge of the wafer 3.
実施例において、気密容器1に粘着テープ2をセットす
ることにより、気密空間1a及び1bが形成される。ウ
ェハステージ4上にウェハース3をそのパターン面を下
側にしてセットし、負圧■1にて真空開口4bからウェ
ハース3の外縁を真空引きして吸着固定する。この状態
でエアー装ra5により上段の気密空間la内に陽圧P
1を加えるとともにエアー装置6により下段の気密空間
1bに負圧■2を加えると、気密空間1aと1bの差圧
により粘着テープ2が凹状の球面状に下向きに変形し、
ウェハース3へのテープ2の貼付けが行なわれる。貼付
は時にウェハース3に加わる陽圧P1によりウェハース
3が撓まないように1、ウェハステージ4の凹部4aに
陽圧P2を加え、ウェハースの受けとしている。このと
き、負圧v2により気密空間1aの空気を希薄にすると
、貼付は時の気泡混入をより確実に防止することができ
る。In the embodiment, airtight spaces 1a and 1b are formed by setting adhesive tape 2 in airtight container 1. The wafer 3 is set on the wafer stage 4 with its pattern side facing down, and the outer edge of the wafer 3 is vacuumed through the vacuum opening 4b with negative pressure 1 and fixed by suction. In this state, the air supply ra5 causes a positive pressure P in the upper airtight space la.
When 1 is applied and negative pressure 2 is applied to the lower airtight space 1b by the air device 6, the adhesive tape 2 is deformed downward into a concave spherical shape due to the differential pressure between the airtight spaces 1a and 1b.
The tape 2 is attached to the wafer 3. In order to prevent the wafer 3 from bending due to the positive pressure P1 applied to the wafer 3, a positive pressure P2 is applied to the recess 4a of the wafer stage 4, which serves as a wafer support. At this time, if the air in the airtight space 1a is diluted by the negative pressure v2, it is possible to more reliably prevent air bubbles from being mixed in during pasting.
(実施例2) 第2図は本発明の実施例2を示す縦断面図である。(Example 2) FIG. 2 is a longitudinal sectional view showing a second embodiment of the present invention.
ダイシングするチップサイズによっては、常温貼付けで
は所望する粘着強度が得られないため、粘着テープ2と
ウェハース3の加熱貼付けを行う必要が生じる場合があ
る。Depending on the chip size to be diced, it may be necessary to heat the adhesive tape 2 and the wafer 3 because the desired adhesive strength cannot be obtained by pasting at room temperature.
この実施例では、ウェハステージ4をステージ加熱部8
にて加熱することによりウェハース3を予備加熱してお
き、更に空気加熱部7及び7′にて加熱された加熱空気
9及び9′を送り込み、粘着テープ2とウェハース3の
熱圧着貼付けを行うことにより、適度な強度の貼付けを
行うことができるという利点がある。In this embodiment, the wafer stage 4 is connected to the stage heating section 8.
The wafer 3 is preheated by heating at the air heating section 7 and 7', and the heated air 9 and 9' heated by the air heating sections 7 and 7' is sent in to bond the adhesive tape 2 and the wafer 3 by thermocompression. This has the advantage that it can be attached with appropriate strength.
以上説明したように本発明は、ウェハステージを用いて
ウェハースのパターン面を空気圧で受けながら粘着テー
プの貼付けを行うことにより、貼付は時のパターン面へ
の損傷を防ぐことができる。As described above, the present invention uses a wafer stage to apply the adhesive tape while applying air pressure to the patterned surface of the wafer, thereby preventing damage to the patterned surface during pasting.
又、差圧により粘着テープを変形させて貼付けを行うこ
とにより、気泡の無い均一な状態の貼付けが可能となり
、ダイシング工程でのチップの飛び散り、ダイシングブ
レードの破損等のトラブルを防ぐことができ、製品の品
質を向上することができるという効果がある。In addition, by deforming the adhesive tape using differential pressure and applying it, it is possible to apply it in a uniform state without bubbles, which prevents problems such as chip scattering and damage to the dicing blade during the dicing process. This has the effect of improving product quality.
第1図(a) 、 (b)は本発明の実施例1を示す縦
断面図、第2図は本発明の実施例2を示す縦断面図であ
る。
1・・・気密容器 1a、lb・・・気密空間
2・・・粘着テープ 3・・・ウェハース4・・
・ウェハステージ 5.6・・・エアー装置7.7′
・・・空気加熱部 8・・・ステージ加熱部9.9′・
・・加熱空気FIGS. 1(a) and 1(b) are longitudinal sectional views showing a first embodiment of the present invention, and FIG. 2 is a longitudinal sectional view showing a second embodiment of the present invention. 1...Airtight container 1a, lb...Airtight space 2...Adhesive tape 3...Wafer 4...
・Wafer stage 5.6...Air device 7.7'
... Air heating section 8... Stage heating section 9.9'.
・Heated air
Claims (1)
が2つの気密空間に画成される気密容器と、半導体ウェ
ハースのパターン面を空気圧で受けてその外縁を保持し
該ウェハースを前記粘着テープに向き合わせて配置する
ウェハステージと、前記気密容器内の2つの気密空間に
差圧を生じさせて前記粘着テープを前記ウェハステージ
上の半導体ウェハースに密着させる手段とを有すること
を特徴とする半導体ウェハースの粘着テープ貼付け装置
。(1) An airtight container whose interior is defined into two airtight spaces by an adhesive tape attached to a semiconductor wafer, and a patterned surface of the semiconductor wafer is received by air pressure to hold its outer edge and the wafer is oriented toward the adhesive tape. A semiconductor wafer comprising: a wafer stage arranged together; and means for generating a pressure difference between two airtight spaces in the airtight container to bring the adhesive tape into close contact with the semiconductor wafer on the wafer stage. Adhesive tape pasting device.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP63205489A JPH0254564A (en) | 1988-08-18 | 1988-08-18 | Device for application of adhesive tape to semiconductor wafer |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP63205489A JPH0254564A (en) | 1988-08-18 | 1988-08-18 | Device for application of adhesive tape to semiconductor wafer |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0254564A true JPH0254564A (en) | 1990-02-23 |
Family
ID=16507701
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP63205489A Pending JPH0254564A (en) | 1988-08-18 | 1988-08-18 | Device for application of adhesive tape to semiconductor wafer |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0254564A (en) |
Cited By (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005093987A (en) * | 2003-08-08 | 2005-04-07 | Tsubaki Seiko:Kk | Tape bonding apparatus and tape bonding method |
WO2006040848A1 (en) * | 2004-10-13 | 2006-04-20 | Tsubaki Seiko Inc. | Tape bonding device and tape bonding method |
JP2007305628A (en) * | 2006-05-08 | 2007-11-22 | Disco Abrasive Syst Ltd | Processing system and method therefor |
JP2008294026A (en) * | 2007-05-22 | 2008-12-04 | Lintec Corp | Apparatus and method of sticking sheet |
US7621307B2 (en) * | 2004-05-25 | 2009-11-24 | Tsubaki Seiko Inc. | Tape adhering apparatus and tape adhering method |
JP2010118584A (en) * | 2008-11-14 | 2010-05-27 | Takatori Corp | Mounting device for wafer |
JP2012038879A (en) * | 2010-08-06 | 2012-02-23 | Lintec Corp | Sheet pasting device and pasting method |
JP2013058806A (en) * | 2012-12-25 | 2013-03-28 | Lintec Corp | Sheet replacement apparatus and sheet replacement method |
US9324581B2 (en) | 2012-04-09 | 2016-04-26 | Mitsubishi Electric Corporation | Method for manufacturing semiconductor device |
WO2017065006A1 (en) * | 2015-10-13 | 2017-04-20 | 日東電工株式会社 | Adhesive tape affixing method and adhesive tape affixing device |
WO2017065005A1 (en) * | 2015-10-13 | 2017-04-20 | 日東電工株式会社 | Adhesive tape affixing method and adhesive tape affixing device |
EP1628333B1 (en) * | 2003-05-29 | 2018-02-14 | The Furukawa Electric Co., Ltd. | Use of protecting adhesive tape in method of producing film-thinning circuit board having penetrated structure |
JP2019212811A (en) * | 2018-06-06 | 2019-12-12 | 株式会社ディスコ | Wafer processing method |
JP2020024990A (en) * | 2018-08-06 | 2020-02-13 | 株式会社ディスコ | Wafer processing method |
JP2020024987A (en) * | 2018-08-06 | 2020-02-13 | 株式会社ディスコ | Wafer processing method |
JP2020145268A (en) * | 2019-03-05 | 2020-09-10 | 株式会社ディスコ | Wafer processing method |
JP2020145253A (en) * | 2019-03-05 | 2020-09-10 | 株式会社ディスコ | Wafer processing method |
JP2021027218A (en) * | 2019-08-07 | 2021-02-22 | 株式会社ディスコ | Wafer processing method |
JP2021027220A (en) * | 2019-08-07 | 2021-02-22 | 株式会社ディスコ | Wafer processing method |
JP2021027221A (en) * | 2019-08-07 | 2021-02-22 | 株式会社ディスコ | Wafer processing method |
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Cited By (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1628333B1 (en) * | 2003-05-29 | 2018-02-14 | The Furukawa Electric Co., Ltd. | Use of protecting adhesive tape in method of producing film-thinning circuit board having penetrated structure |
JP2005093987A (en) * | 2003-08-08 | 2005-04-07 | Tsubaki Seiko:Kk | Tape bonding apparatus and tape bonding method |
US7621307B2 (en) * | 2004-05-25 | 2009-11-24 | Tsubaki Seiko Inc. | Tape adhering apparatus and tape adhering method |
US8336595B2 (en) | 2004-05-25 | 2012-12-25 | Tsubaki Seiko Inc. | Tape adhering apparatus and tape adhering method |
WO2006040848A1 (en) * | 2004-10-13 | 2006-04-20 | Tsubaki Seiko Inc. | Tape bonding device and tape bonding method |
JP2006114598A (en) * | 2004-10-13 | 2006-04-27 | Tsubaki Seiko:Kk | Tape adhering device and tape adhering method |
JP4559183B2 (en) * | 2004-10-13 | 2010-10-06 | 有限会社都波岐精工 | Tape bonding device |
JP2007305628A (en) * | 2006-05-08 | 2007-11-22 | Disco Abrasive Syst Ltd | Processing system and method therefor |
JP2008294026A (en) * | 2007-05-22 | 2008-12-04 | Lintec Corp | Apparatus and method of sticking sheet |
JP4733069B2 (en) * | 2007-05-22 | 2011-07-27 | リンテック株式会社 | Sheet sticking device and sticking method |
JP2010118584A (en) * | 2008-11-14 | 2010-05-27 | Takatori Corp | Mounting device for wafer |
JP2012038879A (en) * | 2010-08-06 | 2012-02-23 | Lintec Corp | Sheet pasting device and pasting method |
US9324581B2 (en) | 2012-04-09 | 2016-04-26 | Mitsubishi Electric Corporation | Method for manufacturing semiconductor device |
JP2013058806A (en) * | 2012-12-25 | 2013-03-28 | Lintec Corp | Sheet replacement apparatus and sheet replacement method |
WO2017065006A1 (en) * | 2015-10-13 | 2017-04-20 | 日東電工株式会社 | Adhesive tape affixing method and adhesive tape affixing device |
WO2017065005A1 (en) * | 2015-10-13 | 2017-04-20 | 日東電工株式会社 | Adhesive tape affixing method and adhesive tape affixing device |
JP2019212811A (en) * | 2018-06-06 | 2019-12-12 | 株式会社ディスコ | Wafer processing method |
JP2020024990A (en) * | 2018-08-06 | 2020-02-13 | 株式会社ディスコ | Wafer processing method |
JP2020024987A (en) * | 2018-08-06 | 2020-02-13 | 株式会社ディスコ | Wafer processing method |
JP2020145268A (en) * | 2019-03-05 | 2020-09-10 | 株式会社ディスコ | Wafer processing method |
JP2020145253A (en) * | 2019-03-05 | 2020-09-10 | 株式会社ディスコ | Wafer processing method |
JP2021027218A (en) * | 2019-08-07 | 2021-02-22 | 株式会社ディスコ | Wafer processing method |
JP2021027220A (en) * | 2019-08-07 | 2021-02-22 | 株式会社ディスコ | Wafer processing method |
JP2021027221A (en) * | 2019-08-07 | 2021-02-22 | 株式会社ディスコ | Wafer processing method |
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