JP2003007808A - Wafer taping machine using vacuum - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a wafer taping machine with no air remaining between the wafer and the tape, which can solve the problem of air being remained between the wafer and the tape and causes troubles in the next process at the time of taping on the wafer by using a roller in the atmosphere. SOLUTION: The wafer and a sheet ring equipped with tape for taping wafer are attached onto the main body, and a upper cap with rubber sheet is mounted, while a chamber on the main body side and a chamber on the upper cap side are vacuumized. Then, tape is pressed with the rubber sheet that inflates by changing vacuum in the chamber on the upper cap side into atmosphere.

Description

Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus for attaching tape to a wafer. 2. Description of the Related Art , Using rollers and the like. Since the operation is performed in the atmosphere, air remains between the wafer and the tape, and this often hinders the next process. [Problems to be Solved by the Invention] The remaining amount of air between the wafer and the tape is reduced to zero. According to the present invention, the residual air between the wafer and the tape is reduced to zero. [Means for Solving the Problems] A vacuum is used to achieve the above object. [Embodiment of the Invention] An embodiment of the invention will be described with reference to the drawings based on an embodiment. FIG. 1 is an assembly view of the present apparatus. This device is divided into three parts, namely, the cap screw on the main body. The procedure for attaching tape to the work (wafer) is as follows:-Place the work (wafer) in the center of the main body. -Set the seat ring with the electron tape to be attached to the wafer on the main body. -Put the top lid on the main body-Tighten it with a set screw. The setting in this state is completed in the lower diagram of FIG. [Operation of Apparatus of the Invention] FIGS. 2 to 4 are explanatory diagrams of the operation of the apparatus of the present invention. FIG. 2 Since the valve A and the valve B are on the vacuum pump side, both the room on the main body side and the room on the upper lid side are evacuated. Fig. 3 When only the valve A is switched to the atmosphere side, the room on the upper lid side is at atmospheric pressure, so a differential pressure is generated with the room on the main body side. Paste on the work. Since the space between the electron tape and the work is a vacuum when it is attached, the residual air becomes almost zero if the degree of vacuum is high. FIG. 4 The valve B is also switched to the atmosphere side to complete the tape attaching operation. [Effects of the Invention] In this apparatus, a tape affixed to a wafer has no trouble caused by residual air in the next step.

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[Procedure amendment] [Submission date] September 19, 2001 (2001.9.1)
9) [Procedure amendment 1] [Document name to be amended] Description [Item name to be amended] Brief explanation of drawings [Amendment method] Change [Content of amendment] [Brief explanation of drawings] [Fig. It is sectional drawing of a wafer tape sticking machine. The upper figure shows before setting the work,
The lower diagram shows the state after the work is set. FIG. 2 is a view in which a main body and an upper lid are evacuated. FIG. 3 is a view in which the upper lid is opened to the atmosphere. FIG. 4 is a view in which both the upper lid and the main body are opened to the atmosphere. [Description of Signs] 1 Work 2 Electron tape 3 Seat ring 4 Main body 5 Rubber sheet 6 Upper lid 7 Set screw

Claims (1)

Claims: 1. A method for applying a vacuum to a tape on a wafer.