JP2009152424A - Sheet sticking device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To stick an adhesive sheet on a surface of an adherend without allowing air to be present between the adhesive sheet and the adherend when the adhesive sheet is stuck on the adherend by applying pressing force. <P>SOLUTION: A sheet sticking device 10 includes a table 11 supporting a semiconductor wafer W and a pressing member 14 which presses the adhesive sheet S against the semiconductor wafer W. The pressing member 14 has a pressing surface 22 which becomes an inclined surface or curved surface coming closer to the semiconductor wafer W at its center portion than at its outer peripheral side by its own weight, and a deformation allowing portion 23 provided successively to the outer peripheral side. The deformation allowing portion 23 deforms by the pressure difference between a first space C1 and a second space C2 and the pressing surface 22 moves down by the deformation to apply the pressing force to the adhesive sheet. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a sheet affixing device, and more specifically, when adhering an adhesive sheet to an adherend such as a semiconductor wafer, the adhering sheet can be affixed without mixing air between the adhesive sheet and the adherend. It is related with the sheet sticking apparatus which can be performed.

  Conventionally, a protective sheet for protecting the circuit surface of a semiconductor wafer (hereinafter simply referred to as “wafer”) has been attached, or an adhesive sheet for die bonding has been attached to the back surface. It has been broken.

  In Patent Document 1, in order to prevent air mixing between the wafer and the adhesive sheet, as a member for applying a pressing force to the adhesive sheet, a press having a curved shape in which a central portion relatively protrudes from the outer peripheral side. A configuration using members is disclosed. The pressing member is made of an elastically deformable material. The pressing member is fixed to the tip of the rod of the air cylinder, and when the adhesive sheet is stuck, the rod is extended and pressed by the pressing member. By applying pressure, the adhesive sheet is gradually attached from the central portion toward the outside.

Japanese Patent No. 2945089

However, since the pressing member disclosed in Patent Document 1 can be moved up and down by an air cylinder, a pressure source is required in addition to the pressure source, which increases the number of parts and increases the size of the device. There is an inconvenience that measures to prevent obstruction of vacuum (decompression) due to air intrusion from the joints of these parts are also required.
Further, since the pressing member disclosed in Patent Document 1 is made of an elastically deformable material having a cross-sectional shape with a thicker central portion than the outer peripheral thickness, the pressing member is pressed against the adhesive sheet in the entire region of the wafer. When a pressure is applied, the pressing force on the wafer central portion becomes stronger than the pressing force on the wafer outer peripheral side. Therefore, there is an inconvenience that a sticking failure is likely to occur due to a relatively weak sheet pressing force on the outer peripheral side of the wafer. On the other hand, if the sheet pressing force on the outer peripheral side of the wafer is sufficiently exerted, the pressing force at the center portion tends to be excessive, which causes a disadvantage that the wafer is easily cracked.

[Object of invention]
The present invention has been devised by paying attention to such inconveniences, and its purpose is to reduce the number of parts of the device itself, to reduce the size of the device, and to reduce the air flow with respect to the adherend. It is an object of the present invention to provide a sheet sticking apparatus that can reliably stick an adhesive sheet without mixing, and can avoid damage to an adherend.

  In order to achieve the above object, the present invention provides a sheet sticking apparatus comprising: a table that supports an adherend; and a pressing member that applies pressing force to an adhesive sheet disposed along the adherend. The pressing member is provided with an inclined surface or a curved surface whose center portion is closer to the adherend than the outer peripheral side by its own weight, and is continuously provided on the outer peripheral side of the pressing surface and is pressed in an unloaded state. A deformable portion having an initial shape located in substantially the same plane as the surface, and applying a pressing force to the adhesive sheet via the pressing surface by deforming the deformable portion with respect to the initial shape. It has a configuration of “Yes”.

  In the present invention, it further includes a lower case for accommodating the table and an upper case for accommodating the pressing member, and the upper case, the pressing member, and the upper case, and the pressing member, while forming a first space by the upper, lower case and pressing member Forming the second space by pressing the adhesive sheet and sticking the adhesive sheet to the adherend, the first and second spaces are brought into a reduced pressure state, and the second space is gradually It is preferable to adopt a configuration in which the deformation allowing portion is deformed by releasing from the reduced pressure state.

  The deformation allowing portion is formed of a material that is more easily elastically deformed than the pressing surface, and the deformation allowing portion is elastically deformed as the second space is gradually released from the reduced pressure state. Is adopted.

  Further, the pressing surface has at least a two-layer structure of a lower sheet and an upper sheet provided on the upper surface side of the lower sheet, and the outer peripheral side of the lower sheet is provided so as to protrude beyond the outer periphery of the upper sheet. You may make it the said deformation | transformation permission part comprised in the said protrusion area | region.

  Further, the pressing surface is provided thicker than the deformation allowing portion, and the deformation allowing portion can be formed relatively easily by the thickness difference between the pressing surface and the deformation allowing portion.

According to the present invention, since the pressing surface is close to the adhesive sheet when the deformation allowing portion is deformed, the air cylinder that raises and lowers the pressing member as in Patent Document 1 and the joint portion of these parts are used. A seal member or the like for preventing a vacuum (decompression) hindrance due to air intrusion can be eliminated, the number of parts can be reduced, and the apparatus can be downsized. In addition, a pressing surface having an inclined surface or curved surface whose central portion is closer to the adherend than the outer peripheral side is formed by its own weight, and the pressing surface presses the sheet against the adherend from this state. For this reason, it is possible to perform the pasting while expelling the air between the adherend and the adhesive sheet outward from the center. Therefore, the adhesive sheet can be reliably affixed to the adherend without air mixing.
Moreover, according to the structure which accommodated the table and the press member in the lower case and the upper case and made pressure reduction, a to-be-adhered body and an adhesive sheet can be stuck in a pressure-reduced atmosphere, and air mixes between them. This can be prevented. In addition, since the deformation permitting portion is deformed by using the decompression of the second space, a driving source such as an air cylinder as in Patent Document 1 is not necessary, and a pressure source for operating it is also necessary. In addition, the control can be easily performed, and the apparatus can be reduced in size, manufacturing cost, and running cost.
Furthermore, since the deformation | transformation permission part is a material which is easy to elastically deform, the deformation | transformation allowance can be largely ensured using the expansion-contraction.
Note that in this specification, the reduced pressure (state) includes a vacuum (state).

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

  FIG. 1 shows a schematic front view of a sheet sticking apparatus according to the present embodiment. In this figure, a sheet sticking apparatus 10 includes a table 11 that supports a wafer W as an adherend, a lower case 12 that accommodates the table 11, and a lower open type upper case that is located above the lower case 12. 13 and a pressing member 14 that applies a pressing force to the adhesive sheet S supplied between the cases 12 and 13 along the upper surface of the wafer W in the figure. Here, the adhesive sheet S is not particularly limited, but in the present embodiment, the adhesive sheet S is a sheet that protects a circuit surface formed on the surface (upper surface) of the wafer W, and an adhesive is provided on the lower surface side thereof. A layer is provided.

  The table 11 is provided with support means (not shown) so that the wafer W can be fixedly supported on the upper surface thereof. The table 11 is fixed to the upper end of the output shaft 17 of the linear motor 16 positioned on the bottom wall 15 of the lower case 12 and can be moved up and down by the advancement and retreat of the output shaft 17.

  The lower case 12 is provided in an open-topped bottomed cylindrical shape, and a pipe 20 is connected to the outer peripheral wall 18, and the pipe 20 is connected to a decompression source (not shown) to be described later in a first space S1. The pressure of can be controlled.

  As shown in FIG. 2, the pressing member 14 is made of a sheet material having a substantially circular planar shape. The pressing member 14 includes a substantially circular lower sheet 14A and a substantially circular upper sheet 14B which is provided on the upper surface side of the lower sheet 14A and is smaller than the lower sheet 14A. The lower sheet 14A and the upper sheet 14B are made of a material that can be easily elastically deformed, such as rubber, resin, and silicone. The upper sheet 14B may be made of a material such as rubber, resin, or silicone that has higher rigidity than the lower sheet 14A. Here, the pressing surface 22 is configured by a region where the lower sheet 14 </ b> A and the upper sheet 14 </ b> B overlap, and the deformation allowing portion 23 is configured by the lower sheet 14 </ b> A portion protruding from the outer periphery of the pressing surface 22. Thereby, the deformation | transformation permission part 23 becomes an initial shape located in the substantially same plane as the press surface 22 in a no-load state.

  The pressing member 14 is attached to the lower end portion of the mounting cylinder 32 fixed to the lower surface of the top wall 31 of the upper case 13 via a mounting hole 23A provided in the region of the deformation allowing portion 23 and a fixing ring 32A. Screwed. Thereby, the pressing member 14 becomes an inclined surface or a curved surface in which the center portion is closer to the adherend than the outer peripheral side by its own weight. Further, when the upper case 13 closes the upper end of the lower case 12, the first space S 1 is formed by the cases 12, 13 and the pressing member 14, while the top wall 31 portion of the upper case 13 and the pressing member 14 are formed. The second space S2 is formed by the mounting cylinder 32. Note that the width dimension of the adhesive sheet S along the direction orthogonal to the paper surface in the figure is set to be smaller than the inner diameters of the upper and lower cases 13 and 12, and therefore the first space S1 is divided by the adhesive sheet S. There is no.

  In the upper case 13, a pipe 35 is connected to the top wall 31, and the pipe 35 is connected to a decompression source (not shown) that decompresses the inside of the second space S2, and the decompression of the second space S2 can be controlled. It has become. A concave groove 36A is formed on the lower end surface of the peripheral wall 36 in the upper case 13, and an O-ring 38 is accommodated as a packing material in the concave groove 36, thereby closing the cases 12 and 13 together. Sealing time is ensured.

  Next, the sheet sticking method in this embodiment is demonstrated, referring also to FIG. 3 thru | or FIG.

  First, in an open state where the upper case 13 is separated from the lower case 12, the wafer W is transferred onto the table 11 via a transfer arm or the like (not shown). Thereafter, the adhesive sheet S is disposed along the wafer W across the upper and lower cases 13 and 12 via a sheet supply device (not shown).

  Next, as shown in FIG. 3, the upper and lower cases 13 and 12 are closed together and the output shaft 17 of the linear motor 16 is extended so that the upper surface of the wafer W is close to the lower surface of the adhesive sheet S. Raise the table 11 until. Then, the first and second spaces S1 and S2 are set to a predetermined reduced pressure state while being controlled to be substantially the same reduced pressure state. Next, while the first space S1 is kept in a predetermined reduced pressure state, the reduced pressure state only on the second space S2 side is gradually released (approached to the atmospheric pressure).

  As shown in FIG. 4, when the pressure member 14 is released, the deformation allowing portion 23 starts to be deformed, and the surface position of the pressing surface 22 is pushed down by this deformation. The adhesive sheet S is pressed and attached to the central portion of the wafer W.

  As the second space S2 is further decompressed and released, as shown in FIG. 5, the deformation allowing portion 23 further increases the degree of deformation, and the inclined surface of the pressing surface 22 is pressed against the wafer W side. Affixed to the wafer W gradually from the central portion toward the outer peripheral side, and finally, as shown in FIG. 6, the pressing surface 22 is deformed so as to follow the upper surface of the wafer W, and the entire surface of the upper surface of the wafer W is transformed. The adhesive sheet S is pasted.

  After the application of the adhesive sheet S is completed in this manner, the upper and lower cases 13 and 12 are opened, and the adhesive sheet S is cut along the outer periphery of the wafer W by a cutting device (not shown). The wafer W is transferred via a transfer arm or the like (not shown).

  Therefore, according to such an embodiment, the first and second spaces S1, S2 are brought into substantially the same reduced pressure state, and only the second space S2 side is gradually released from the reduced pressure state, thereby allowing the deformation allowing portion 23. The adhesive sheet S can be pasted on the wafer W by deforming. As a result, the pressing surface 22 gradually deforms from the central portion toward the outer peripheral side due to the deformation, and the adhesive sheet S is stuck while releasing the air existing between the adhesive sheet S and the wafer W to the outside. It can be carried out. Furthermore, since the adhesive sheet S can be attached to the wafer W by using only the reduced pressure, there is an effect that the apparatus can be downsized without requiring a pressure source.

As described above, the best configuration, method, and the like for carrying out the present invention have been disclosed in the above description, but the present invention is not limited to this.
In other words, the present invention has been illustrated and described mainly with respect to specific embodiments, but without departing from the scope of the technical idea and object of the present invention, the shape, position, or With respect to the arrangement and the like, those skilled in the art can make various changes as necessary.

  For example, in the above-described embodiment, the pressing member 14 having a two-layer structure in which the lower sheet 14A and the upper sheet 14B are overlapped is illustrated and described, but a three-layer or more layer structure may be used. Further, as shown in FIG. 7, the sheet thickness in the region where the pressing surface 22 is formed can be provided thicker than the deformation allowing portion 23. According to this, the pressing surface 22 has a structure in which the rigidity is relatively increased due to the thickness difference, and the deformation allowing portion 23 is preferentially deformed, so that the pressing force similar to that in the above embodiment can be applied. The structure of the pressing member 14 can be simplified.

  Moreover, in the said embodiment, while providing 1st space S1 and 2nd space S2, and decompressing 1st, 2nd space S1, S2, only 2nd space S2 is open | released from a pressure-reduced state. However, the present invention is not limited to this. In other words, substantially the same sheet can be used even when the adhesive sheet S is attached to the wafer W by deforming the deformation allowing portion 23 and the pressing surface 22 by sending air only into the space S2 without using a reduced pressure atmosphere. Can be affixed.

  Furthermore, the adherend in the present invention is not limited to the semiconductor wafer W, and other adherends such as a glass plate, a steel plate, or a resin plate can also be targeted. The semiconductor wafer is a silicon wafer. Or a compound wafer.

  Moreover, in the said embodiment, although 2nd space S2 was formed with the press member 14, the upper case 13, and the attachment cylinder 32, the attachment cylinder 32 may be abbreviate | omitted and 2nd space S2 may be formed.

The schematic sectional drawing of the sheet sticking apparatus which concerns on this embodiment. The schematic perspective view of a press member. The schematic sectional drawing which shows the state which completed the initial operation | movement of sheet sticking. The schematic sectional drawing which shows the state immediately after sheet | seat sticking is started. The schematic sectional drawing which shows the state which a deformation | transformation permission part deform | transforms and a press surface planarizes. The schematic sectional drawing which shows the state in which the sheet | seat was completely stuck on the wafer. The schematic sectional drawing of the sheet sticking apparatus using a different press member.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Sheet sticking apparatus 11 Table 12 Lower case 13 Upper case 14 Pressing member 14A Lower sheet 14B Upper sheet 22 Pressing surface 23 Deformation allowable part S Adhesive sheet S1 1st space S2 2nd space W Semiconductor wafer (adhered body)

Claims (5)

In a sheet sticking apparatus comprising a table that supports an adherend, and a pressing member that applies a pressing force to an adhesive sheet disposed along the adherend,
The pressing member is provided with an inclined surface or a curved surface whose center portion is closer to the adherend than the outer peripheral side by its own weight, and is continuously provided on the outer peripheral side of the pressing surface and in an unloaded state. It consists of a deformation allowing part with an initial shape located in substantially the same plane as the pressing surface,
A sheet sticking apparatus that applies a pressing force to the adhesive sheet through the pressing surface by deforming the deformation allowing portion with respect to an initial shape. A lower case for accommodating the table; and an upper case for accommodating the pressing member;
The upper space, the lower case and the pressing member form a first space, while the upper case and the pressing member form a second space,
When the adhesive sheet is pressed to attach the adhesive sheet to an adherend, the first and second spaces are brought into a reduced pressure state, and the second space is gradually released from the reduced pressure state to thereby deform the deformation. The sheet sticking device according to claim 1, wherein the allowing portion is deformed.   The deformation allowing portion is formed of a material that is more easily elastically deformed than the pressing surface, and the deformation allowing portion is elastically deformed as the second space is gradually released from the reduced pressure state. The sheet sticking device according to claim 2.   The pressing surface has at least a two-layer structure of a lower sheet and an upper sheet provided on the upper surface side of the lower sheet, and the outer surface of the lower sheet is provided so as to protrude beyond the outer periphery of the upper sheet. The sheet sticking device according to claim 1, wherein the deformation allowing portion is configured in a region.   The press surface is provided with a thickness greater than that of the deformation allowance portion, and the deformation allowance portion is formed to be relatively easily deformed by a thickness difference between the press surface and the deformation allowance portion. The sheet sticking device according to 2 or 3.

Images