JP2009123784A - Tape sticking device and tape sticking method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a tape sticking device that can prevent an element formed on a substrate from being destroyed and an air bubble from being formed when a dicing tape is stuck on a back-surface side of an element formation surface of the substrate, and to provide a tape sticking method. <P>SOLUTION: An opening portion 90 is formed in a base plate 10 at a part where a first sealed space S1 is formed, and a slidable piston 91 which has the same external diameter with the opening portion 90 is provided to close the opening portion 90 to decrease the volume of the first sealed space S1 by elevating the piston 91 toward the substrate 20. Consequently, the element is prevented from being destroyed owing to a uniform rise in pressure in the first sealed space S1. Further, pressure is applied to the substrate 20 forming one surface of the first sealed space S1 and the substrate 20 is held nearly flat or slightly convex, so an air bubble is prevented from getting mixed when the dicing tape 40 is stuck while pressing pressure is applied to the substrate surface 20b by a pressing member 50. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a tape attaching apparatus and a tape attaching method for attaching a dicing tape to a substrate on which elements are formed.

  Conventionally, when a tape is pasted on a substrate, there is a problem that the entire circuit surface comes into contact with a table that supports the substrate, thereby damaging the circuit surface or destroying solder bumps formed on the circuit surface. In order to deal with this problem, for example, what is described in Patent Document 1 is known.

In Patent Document 1, a support ring for mounting the outer peripheral portion of the substrate is provided on the suction table. Then, by placing the substrate on the support ring, the portion excluding the outer peripheral portion of the substrate is in a floating state with respect to the suction table. In addition, the peripheral portion of the floating portion of the substrate is more reliably and evenly adsorbed by a plurality of Bernoulli adsorbing means, which are arranged equally on the same circumference of the adsorbing table inside the support ring, so that the adsorbing table Is kept in a non-contact state, which is floating. Thereby, the solder bump formed on the circuit surface and the circuit surface can be protected.
JP 2006-114640 A

  Here, in a state where the outer peripheral portion of the substrate is placed on the substrate support member, the floating portion of the substrate is sucked by the negative pressure by the Bernoulli suction means, and as a result, the central portion in the floating state is centered. Will be curved in a concave shape. When a dicing tape is affixed to such a substrate, a gap may be generated between the curved portion at the center of the substrate and the dicing tape, and bubbles may be generated.

  In order to correct this curvature, in Patent Document 1, compression is performed toward the center of the substrate with respect to the sealed space formed by being surrounded by the substrate support member between the floating substrate portion and the suction table. It was set as the structure by which air is injected. Thereby, the center part of a board | substrate is pressurized with the pressure of compressed air, and a board | substrate is hold | maintained substantially flat.

  However, when compressed air is jetted onto the substrate, the substrate is locally pressurized by the pressure of the compressed air. For this reason, there is a possibility that a structure formed by a semiconductor element, for example, a MEMS technology or the like may be destroyed by applying a large load to the semiconductor element formed in the portion where the compressed air is jetted, which deteriorates the yield. This is considered to be a factor.

  In view of the above problems, the present invention provides a tape attaching apparatus and a tape attaching method capable of preventing elements formed on a substrate from being destroyed and preventing bubbles from being generated. The purpose is to provide.

  In order to achieve the above object, a tape applicator according to claim 1 is provided with a base plate, a substrate support member provided on the base plate for adsorbing and holding a peripheral portion of a substrate on which an element is formed, and The dicing is performed on the substrate surface opposite to the substrate surface facing the base plate by moving on the substrate surface while applying a pressing force to the substrate surface opposite to the substrate surface facing the base plate via a dicing tape. In a tape attaching apparatus comprising a pressing member for attaching a tape, the substrate has a predetermined height between the base plate and the substrate when the substrate is placed on the substrate support member, and the substrate A pressurizing hand that pressurizes the first sealed space so that a first sealed space surrounded by the support member is formed and pressure is uniformly applied to the substrate. The is characterized in that provided.

  The substrate on which the element is formed may be originally curved. When the substrate is curved toward the base plate, a gap is generated between the curved portion and the dicing tape, and bubbles are generated. On the other hand, when the substrate is curved toward the pressing member, when the pressing member moves on the substrate surface, the bending of the substrate may be reversed to the opposite side by the pressing force from the pressing member. .

  Since the tape sticking device according to the first aspect employs the above-described configuration, it is possible to apply pressure to the substrate so as to push up the substrate from the first sealed space side. For this reason, regardless of which side the substrate is curved on, the substrate can be held in a substantially flat or slightly convex shape toward the pressing member. At this time, since the pressurizing unit pressurizes the substrate so that the pressure is uniformly applied, it is possible to prevent the element from being destroyed due to an even load. In addition, by applying the dicing tape as described above, the pressing member is always in close contact with the substrate via the dicing tape, so that air bubbles are prevented from entering between the tape and the substrate. can do.

  According to a second aspect of the present invention, the pressurizing unit may pressurize the first sealed space uniformly by reducing the volume of the first sealed space. Thereby, since the rapid gas flow in the sealed space can be suppressed, the element can be prevented from being destroyed.

  An opening is formed in the base plate in a portion forming the first sealed space, and the pressurizing unit has the same outer diameter as the opening so as to close the opening. The slidable piston may be provided, and by moving the piston and the base plate relatively, the volume of the first sealed space may be reduced to uniformly pressurize the first sealed space. . In this case, since the volume of the first sealed space formed between the piston and the substrate can be reduced by moving at least one of the piston and the base plate, the substrate is removed from the first sealed space side. The pressure to be pushed up can be adjusted, and the substrate can be held in a substantially flat shape or slightly convex toward the pressing member.

  An opening is formed in the base plate in a portion forming the first sealed space, and the pressurizing unit has an end portion in the base plate so as to close the opening. By providing a fixed movable portion, applying a force to the movable portion, and deforming the movable portion so as to be convex with respect to the first sealed space, the volume of the first sealed space is increased. It is possible to reduce the pressure and uniformly pressurize the first sealed space. In this case, since the first sealed space is formed between the movable portion and the substrate, the substrate is pushed up from the first sealed space side with respect to the substrate by deforming the movable portion so as to be convex. Pressure is applied. As a result, pressure is uniformly applied to the substrate, and the substrate can be held in a substantially flat or slightly convex shape toward the pressing member.

  According to a fifth aspect of the present invention, the pressurizing unit includes a compressed air ejecting unit that ejects compressed air to the movable unit, and the movable unit is sealed by the compressed air. You may deform | transform so that it may become convex with respect to space.

  According to a sixth aspect of the present invention, there is provided a second sealed space adjacent to the first sealed space, the surface of which is the movable portion, and a medium that changes its state with volume expansion by applying heat. Enclosed in a second sealed space, and the pressurizing means heats the medium in the second sealed space to pressurize the movable part by volume expansion of the medium, and the movable part is You may deform | transform so that it may become convex with respect to 1 sealed space.

  According to a seventh aspect of the present invention, a third sealed space is provided on the base plate so as to surround the first sealed space, and the pressurizing unit performs relative pressure reduction by reducing the pressure of the third sealed space. Alternatively, the pressure in the first sealed space may be made larger than the pressure in the third sealed space, and as a result, the first sealed space may be uniformly pressurized. In this case, by reducing the pressure of the third sealed space, the pressure in the first sealed space inside becomes relatively large, so that the substrate forming the first sealed space is pressed almost flat or slightly. It can be held convex toward the side.

  The tape applicator according to any one of claims 1 to 7, wherein a flat ring is disposed on the base plate so as to surround the substrate, and the dicing tape is connected to the flat ring. You may affix so that the said board | substrate may be connected. As a result, the flat ring to which the substrate is attached is fixedly held.

  The step of placing a substrate on which an element is formed on the substrate support member provided on a base plate, and the step of causing the substrate support member to attract and hold the peripheral portion of the substrate, as recited in claim 9 A pressurizing step of pressurizing a first sealed space having a predetermined height between the base plate and the substrate and surrounded by the substrate support member so that the substrate is uniformly pressurized. And the pressing member applies a pressing force to the substrate surface opposite to the substrate surface facing the base plate through a dicing tape in a state where pressure is applied to the substrate by the pressing step. And a step of attaching the dicing tape to a substrate surface opposite to the substrate surface facing the base plate by moving upward. In the pressurizing step, pressurization is performed so that pressure is uniformly applied to the substrate, so that it is possible to prevent the device from being destroyed due to an even load.

  According to a tenth aspect of the present invention, in the pressurizing step, the first sealed space may be uniformly pressurized by reducing the volume of the first sealed space.

  An opening is formed in the base plate at a portion forming the first sealed space, and the outer diameter is the same as the opening so as to close the opening. A piston may be provided, and in the pressurizing step, the volume of the first sealed space may be reduced by relatively moving the piston and the base plate to pressurize the first sealed space uniformly. .

  The movable part which fixed the edge part in the said baseplate so that an opening part is formed in the said baseplate of the part which forms the said 1st sealed space as described in Claim 12, and the said opening part is obstruct | occluded is provided In the pressurizing step, a force is applied to the movable part, and the movable part is deformed so as to be convex with respect to the first sealed space, whereby the volume of the first sealed space is increased. And the first sealed space may be uniformly pressurized.

  According to a thirteenth aspect of the present invention, there is provided compressed air injection means for injecting compressed air to the movable portion, and in the pressurizing step, the movable portion is injected into the first sealed space by the injection of the compressed air. You may make it deform | transform so that it may become convex.

  The medium that changes the state accompanied by volume expansion by providing a second sealed space adjacent to the first sealed space, with the movable portion as one surface, and applying heat. In the pressurizing step, the movable part is pressurized by the volume expansion of the medium by heating the medium in the second sealed space, and the movable part is You may deform | transform so that it may become convex with respect to 1st sealed space.

  The third sealed space is provided on the base plate so as to surround the first sealed space, and in the pressurizing step, the third sealed space is decompressed to reduce relative pressure. Alternatively, the pressure in the first sealed space may be made higher than the pressure in the third sealed space, and as a result, the first sealed space may be uniformly pressurized.

  The tape attaching method according to any one of claims 9 to 15, wherein a flat ring is disposed on the base plate so as to surround the substrate, and the dicing tape attaching step as described in claim 16. Then, you may have the process of affixing the said dicing tape so that the said flat ring and the said board | substrate may be connected. Thereby, when installing the board | substrate which affixed the dicing tape in the apparatus of the following process, it can be moved without contacting a board | substrate.

  Hereinafter, a plurality of embodiments of the present invention will be described with reference to the drawings. In addition, the overlapping description is abbreviate | omitted by attaching | subjecting the same code | symbol to the corresponding component in each embodiment.

(First embodiment)
As shown in FIG. 1, the tape applicator 100 includes a base plate 10, a substrate support member 30 for attracting and holding the peripheral portion of the substrate 20 on which a semiconductor element (not shown) is formed, and a surface facing the base plate 10. And a pressing member 50 for attaching the dicing tape 40 to the substrate surface 20b opposite to the substrate surface to be formed.

  The substrate support member 30 is provided on the base plate 10 and is formed to have the same shape as the outer peripheral portion of the substrate 20. In the present embodiment, the substrate support member 30 is fixed on the base plate 10 by bolts (not shown), but may be integrally formed with the base plate 10. In this embodiment, the substrate support member 30 is made of an elastic body such as rubber. However, as long as the substrate 20 can be securely held by suction, a metal such as aluminum, a ceramic such as SiC, and rubber A composite made of an elastic body such as metal and ceramic may be used.

  The substrate support member 30 is provided with a plurality of suction holes 70, and the plurality of suction holes 70 are connected to the suction holes 70 that penetrate the base plate 10 and are connected to a vacuum pump (not shown). By vacuum-suctioning the suction hole 70 with a vacuum pump, the peripheral edge of the substrate 20 is sucked and held by the substrate support member 30. In this embodiment, vacuum suction is performed by a vacuum pump, but any vacuum suction can be used. When the suction holes 70 are vacuum-sucked and the distance between the adjacent suction holes is large, when the pressure is applied to the substrate 20 from the base plate 10 side, the peripheral portion of the substrate 20 between the adjacent suction holes is Since it is in a state where it is not adsorbed, the pressure may escape from there. Therefore, in this embodiment, the groove | channel 70a is provided in the circumferential shape in the surface in which the board | substrate 20 of the board | substrate support member 30 is mounted. Thereby, since the whole peripheral part of the board | substrate 20 is attracted | sucked through the suction hole 70, the state attracted | sucked firmly can be hold | maintained. Also, the entire peripheral edge of the substrate 20 can be firmly adsorbed by providing a large number of suction holes in order to fill the gaps between adjacent suction holes. In the present embodiment, by providing the groove 70 a having a width wider than the outer diameter of the suction hole 70, the area for adsorbing the peripheral edge of the substrate 20 is widened, so that it can be adsorbed more firmly. However, even if the first sealed space S1 is pressurized, the shape of the suction hole 70 and the shape of the suction hole 70 can be reduced as long as the peripheral edge of the substrate 20 is reliably sucked and held and the airtightness of the first sealed space S1 is maintained. It doesn't matter about the arrangement.

  The base plate 10 is made of metal such as aluminum or stainless steel, ceramic, hard resin, or the like. On the base plate 10, a convex flat ring support member 11 on which the flat ring 60 is placed is disposed outside the substrate support member 30.

  By providing the flat ring support member 11 on the base plate 10, the position for placing the flat ring 60 can be determined, and the flat ring 60 placed on the flat ring support member 11 and the substrate support member 30. It can be adjusted so that the substrate 20 placed on the substrate 20 is almost the same height. In the present embodiment, the flat ring support member 11 is provided in a convex shape, but the shape may be flat or concave as long as positioning and height adjustment are possible.

  By adjusting the flat ring 60 and the substrate 20 placed on the substrate support member 30 to have substantially the same height, the pressing member is pressed against the flat ring 60 and the substrate 20 when the dicing tape 40 is attached. 50 can be firmly attached.

  Further, by providing the flat ring 60, the substrate 20 is connected to the flat ring 60 through the dicing tape 40, and the dicing tape 40 to which the substrate 20 is attached is fixedly held. For this reason, when installing the board | substrate 20 which affixed the dicing tape 40 in the apparatus of the following process, it can be moved by gripping the flat ring 60, without contacting the board | substrate 20. FIG. In the present embodiment, the flat ring 60 is made of a metal such as aluminum, ceramic, or the like.

  The flat ring support member 11 is formed with a plurality of suction holes 71 provided through the base plate 10. By providing the suction hole 71 in the flat ring support member 11, the flat ring 60 can be adsorbed to the base plate 10 using a vacuum pump. In this embodiment, vacuum suction is performed by a vacuum pump, but any vacuum suction can be used.

  On the base plate 10, a pair of plate-like tape attaching and fixing members 80 having a length longer than the width of the dicing tape 40 are provided at positions facing each other with the substrate support member 30 and the flat ring 60 interposed therebetween. Yes. A tape roll (not shown) around which the dicing tape 40 is wound is provided on the outside of the tape attaching and fixing member 80. The dicing tape 40 pulled out from the tape roll is put in a tensioned state by being attached to the tape attaching / fixing member 80 located at the opposite position. Accordingly, the dicing tape 40 can be attached to the substrate 20 in a state where tension is applied without slack. At this time, in order to prevent the dicing tape 40 from coming into contact with the flat ring 60 and the substrate 20, the height of the tape attaching and fixing member 80 is set to be higher than the height of the flat ring 60. In the present embodiment, the tape attaching and fixing member 80 is made of metal such as aluminum or stainless steel, ceramic, hard resin, or the like.

  The pressing member 50 has a width equal to or larger than the outer diameter of the flat ring 60 so that the dicing tape 40 can be attached to the flat ring 60 simultaneously with the substrate 20. Provided in parallel. The pressing member 50 rotates and moves from one tape attaching and fixing member 80 while applying a pressing force to the substrate surface 20 b opposite to the substrate surface facing the base plate 10 via the dicing tape 40. As a result, the pressing member 50 is always in close contact with and pressed against the substrate surface 20b of the substrate 20 via the dicing tape 40, thereby preventing air bubbles from entering between the dicing tape 40 and the substrate 20. be able to. In the present embodiment, the pressing member 50 is made of urethane rubber.

  Here, the substrate 20 on which the semiconductor element is formed may be originally bent. When the substrate 20 is curved toward the base plate 10, a gap is generated between the curved portion and the dicing tape 40 even if the dicing tape 40 is applied while pressing the substrate surface 20 b with the pressing member 50. There is a risk that bubbles may be generated. On the contrary, when the substrate 20 is curved toward the pressing member 50 side, the bending of the substrate 20 is reversed by the pressing force from the pressing member 50 when the pressing member 50 moves on the substrate surface 20b as described above. There is a risk of flipping to the side.

  Therefore, in the present embodiment, a pressurizing unit that pressurizes the first sealed space S1 is provided so that pressure is uniformly applied to the substrate 20 from the base plate 10 side. Thereby, the board | substrate 20 can be hold | maintained in the state which becomes substantially flat or slightly convex toward the press member 50 side.

  Further, at this time, the pressurizing means pressurizes the substrate 20 so that the pressure is uniformly applied. Therefore, the entire substrate 20 is uniformly loaded, and the semiconductor element can be prevented from being destroyed. Hereinafter, a specific configuration of the pressurizing unit will be described.

  The tape applicator 100 has a first sealed space S1 surrounded by a substrate support member 30 between the base plate 10 and the substrate 20, and an opening 90 is formed in a portion of the base plate 10 that forms the first sealed space S1. Is formed. In this opening 90, a slidable piston 91 having the same outer diameter as that of the opening 90 is provided so as to close the opening 90. In the present embodiment, the piston 91 is made of metal such as aluminum, ceramic, or the like. In order to improve airtightness, a plurality of O-rings (not shown) are provided on the surface where the base plate 10 and the piston 91 are in contact.

  The position of the base plate 10 is fixed, and a piston 91 provided in the opening 90 is moved up to the substrate 20 side by a motor (not shown), thereby forming a first sealing formed between the piston 91 and the substrate 20. The volume of the space S1 is decreased. By reducing the volume of the first sealed space S1, the pressure in the first sealed space S1 rises uniformly. Thereby, pressure is applied to the substrate 20 forming one surface of the first sealed space S1. Then, the movement distance of the piston 91 when the substrate 20 becomes substantially flat or slightly convex is measured in advance, and the movement of the piston 91 is stopped when the piston 91 moves by the movement distance. By moving the piston 91 in this way, the substrate 20 can be held substantially flat or slightly convex toward the pressing member 50 side.

(Second Embodiment)
Next, a second embodiment will be described. As shown in FIG. 2, in the tape applicator 200 according to the present embodiment as well, as in the tape applicator 100 according to the first embodiment, the first plate surrounded by the substrate support member 30 between the base plate 10 and the substrate 20. The closed space S2 is formed, and an opening 90 is formed in a portion of the base plate 10 that forms the first sealed space S2. Further, a slidable piston 92 having the same outer diameter as that of the opening 90 is provided so as to close the opening 90.

  However, in the tape applicator 200 according to the present embodiment, the first sealed space S2 formed between the piston 92 and the substrate 20 by fixing the piston 92 at a fixed position and lowering the base plate 10 by the motor. Reduce the volume of. Even if comprised in this way, there can exist an effect similar to the tape sticking apparatus 100 by 1st Embodiment.

  The volume of the first sealed space S1 (S2) may be reduced by moving the base plate 10 and the piston 91 (92) together.

(Third embodiment)
Next, a third embodiment will be described. As shown in FIG. 3, in the tape applicator 300 according to the present embodiment as well, as in the tape applicator 100 according to the first embodiment, the first plate surrounded by the substrate support member 30 between the base plate 10 and the substrate 20. The closed space S3 is formed, and an opening 90 is formed in a portion of the base plate 10 that forms the first sealed space S3.

  However, the tape attaching apparatus 300 according to the present embodiment includes a movable portion 93 having an end portion fixed in the base plate 10 so as to close the opening portion 90 in the opening portion 90. In the present embodiment, the movable portion 93 is disposed in the opening 90 of the base plate 10, and the end thereof is fixed in the base plate 10 with a bolt (not shown). Note that the movable portion 93 may not be disposed in the opening 90 but may be provided so as to cover the opening end of the opening 90 on the first sealed space S3 side. In this embodiment, the movable part 93 is made of a thin metal film that is deformed when pressure is applied to the movable part 93.

  The tape applicator 300 according to the third embodiment further includes compressed air injection means (not shown) for injecting compressed air to the movable portion 93. This compressed air injection means pressurizes the movable part 93 by injecting compressed air into the space below the movable part 93 formed in the base plate 10 to form between the movable part 93 and the substrate 20. The movable portion 93 can be deformed so as to be convex with respect to the first sealed space S3. Thereby, since the volume of 1st sealed space S3 reduces, the effect similar to 1st Embodiment can be acquired.

(Fourth embodiment)
Next, a fourth embodiment will be described. As shown in FIG. 4, the tape applicator 400 according to the present embodiment is the same as the tape applicator 300 according to the third embodiment, and is surrounded by the substrate support member 30 between the base plate 10 and the substrate 20. The closed space S3 is formed, and an opening 90 is formed in a portion of the base plate 10 that forms the first sealed space S3. In the opening 90, a movable portion 94 having the same outer diameter as that of the opening 90 whose end is fixed in the base plate 10 is provided.

  However, in the tape attaching apparatus 400 according to the present embodiment, the closing member 96 is provided in the opening 90 so as to further close the opening 90. As a result, a second sealed space S4 that is adjacent to the first sealed space S3 with the movable portion 94 as one surface is formed. In the present embodiment, the closing member 96 is made of metal or the like and has a heater built therein.

  Then, a medium 95 that changes its state with volume expansion by applying heat is enclosed in the second sealed space S4, and the medium 95 in the second sealed space S4 is heated by a heater built in the closing member 96. To do. At this time, the movable portion 94 is pressurized by the volume of the medium 95 sealed in the second sealed space S4 being expanded by heat. And it can be made to change so that movable part 94 may become convex to the 1st sealed space S3. Thereby, since the volume of 1st sealed space S3 reduces, the effect similar to 1st Embodiment can be acquired. In this embodiment, ethanol is used as the medium 95 that changes its state with volume expansion by applying heat.

(Fifth embodiment)
Next, a fifth embodiment will be described. As shown in FIG. 5, the tape applicator 500 according to the present embodiment is the same as the tape applicator 100 according to the first embodiment, and is surrounded by the substrate support member 30 between the base plate 10 and the substrate 20. The sealed space S5 is formed.

  However, in the tape applicator 500 according to the present embodiment, the third sealed space S6 is provided so as to surround the first sealed space S5. At this time, the atmospheric pressures in the first sealed space S5 and the third sealed space S6 are substantially equal. In the present embodiment, the third sealed space S <b> 6 is formed by providing a cover 97 so as to surround a substantially rectangular shape with the tape attaching and fixing member 80 facing two sides. In the present embodiment, the cover 97 is made of metal or the like.

  In the tape applicator 500 according to the fifth embodiment, a plurality of suction holes 72 are further provided in the base plate 10 between the cover 97 and the substantially rectangular shape having the tape applicator fixing member 80 facing two sides. By sucking the suction hole 72 with a vacuum pump, the pressure in the third sealed space S6 is reduced, and by further sucking, the pressure in the third sealed space S6 is the pressure in the adjacent first sealed space S5. Smaller than. As a result, by reducing the pressure in the third sealed space S6, the pressure in the first sealed space S5 increases relatively uniformly. Even if comprised in this way, the effect similar to 1st Embodiment can be acquired. In this embodiment, vacuum suction is performed by a vacuum pump, but any vacuum suction can be used.

  As described above, according to the tape applicator in the embodiment as described above, it is possible to prevent the elements formed on the substrate 20 from being destroyed and to generate bubbles between the substrate 20 and the dicing tape 40. Can be prevented.

It is sectional drawing which shows the tape sticking apparatus 100 by 1st Embodiment of this invention. It is sectional drawing which shows the tape sticking apparatus 200 by 2nd Embodiment of this invention. It is sectional drawing which shows the tape sticking apparatus 300 by 3rd Embodiment of this invention. It is sectional drawing which shows the tape sticking apparatus 400 by 4th Embodiment of this invention. It is sectional drawing which shows the tape sticking apparatus 500 by 5th Embodiment of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 ... Base plate 11 ... Flat ring support member 20 ... Substrate 30 ... Substrate support member 40 ... Dicing tape 50 ... Pressing member 60 ... Flat rings 70, 71, 72 ... · Suction hole 70a · · · groove 80 · · · tape attachment fixing member 90 · · · opening 91, 92 · · · piston 93, 94 · · · movable portion 95 · · · medium 96 · · · closure member 97 ... Covers S1, S2, S3, S5 ... First sealed space S4 ... Second sealed space S6 ... Third sealed space

Claims (16)

A base plate;
A substrate support member provided on the base plate for adsorbing and holding the peripheral edge of the substrate on which the element is formed;
The substrate surface opposite to the substrate surface facing the base plate is moved on the substrate surface while applying a pressing force via a dicing tape to the substrate surface opposite to the substrate surface facing the base plate. In a tape applicator comprising a pressing member for adhering a dicing tape,
When the substrate is placed on the substrate support member, a first sealed space having a predetermined height between the base plate and the substrate and surrounded by the substrate support member is formed,
A tape attaching apparatus, comprising: a pressurizing unit that pressurizes the first sealed space so that a uniform pressure is applied to the substrate.   The tape applying apparatus according to claim 1, wherein the pressurizing unit uniformly pressurizes the first sealed space by reducing the volume of the first sealed space.   An opening is formed in the base plate in a portion forming the first sealed space, and the pressurizing means includes a slidable piston having the same outer diameter as the opening so as to close the opening. 3. The tape application according to claim 2, wherein the piston and the base plate are moved relatively to reduce the volume of the first sealed space and to uniformly pressurize the first sealed space. Attachment device.   An opening is formed in the base plate in a portion forming the first sealed space, and the pressurizing means includes a movable portion having an end fixed in the base plate so as to close the opening, and the movable By applying a force to the part and deforming the movable part so as to be convex with respect to the first sealed space, the volume of the first sealed space is reduced, and the first sealed space is reduced. The tape applying apparatus according to claim 2, wherein the pressure is uniformly applied.   The pressurizing means has compressed air injection means for injecting compressed air to the movable part, and the movable part is projected with respect to the first sealed space by the injection of the compressed air. The tape applying apparatus according to claim 4, wherein the tape applying apparatus is deformed.   A second sealed space adjacent to the first sealed space with the movable portion as one surface is provided, and a medium that changes its state with volume expansion by applying heat is enclosed in the second sealed space. The pressurizing unit heats the medium in the second sealed space, pressurizes the movable part by volume expansion of the medium, and the movable part is convex with respect to the first sealed space. The tape sticking apparatus according to claim 4, wherein the tape sticking apparatus is deformed as follows.   A third sealed space is provided on the base plate so as to surround the first sealed space, and the pressurizing unit relatively reduces the first sealed space by reducing the pressure of the third sealed space. 2. The tape attaching apparatus according to claim 1, wherein the pressure is made higher than the pressure in the third sealed space, and as a result, the first sealed space is uniformly pressurized.   8. The tape according to claim 1, wherein a flat ring is disposed on the base plate so as to surround the substrate, and the dicing tape is attached so as to connect the flat ring and the substrate. Pasting device. Placing a substrate on which an element is formed on the substrate support member provided on a base plate;
Adsorbing and holding the periphery of the substrate to the substrate support member;
A pressurizing step of pressurizing a first sealed space having a predetermined height between the base plate and the substrate and surrounded by the substrate support member so that the substrate is uniformly pressurized; ,
In the state where pressure is applied to the substrate by the pressurizing step, a pressing member is applied on the substrate surface while applying a pressing force to the substrate surface opposite to the substrate surface facing the base plate via a dicing tape. And a step of attaching the dicing tape to the substrate surface opposite to the substrate surface facing the base plate by moving.   The tape applying method according to claim 9, wherein, in the pressurizing step, the first sealed space is uniformly pressurized by reducing the volume of the first sealed space.   An opening is formed in the base plate in a portion forming the first sealed space, and a slidable piston having the same outer diameter as the opening is provided so as to close the opening. 11. The tape application according to claim 10, wherein the piston and the base plate are relatively moved to reduce the volume of the first sealed space and to uniformly pressurize the first sealed space. Attaching method.   In the pressurizing step, an opening is formed in the portion of the base plate that forms the first sealed space, and a movable portion having an end fixed in the base plate so as to close the opening is provided. By applying a force to the movable portion and deforming the movable portion so as to be convex with respect to the first sealed space, the volume of the first sealed space is reduced, and the first sealed space is reduced. The method of claim 10, wherein the space is uniformly pressurized.   Compressed air injection means for injecting compressed air to the movable part is provided, and in the pressurizing step, the movable part is deformed to be convex with respect to the first sealed space by the injection of the compressed air. The tape attaching method according to claim 12, wherein:   A second sealed space adjacent to the first sealed space with the movable portion as one surface is provided, and a medium that changes its state with volume expansion by applying heat is enclosed in the second sealed space. In the pressurizing step, the medium in the second sealed space is heated to pressurize the movable part by volume expansion of the medium, and the movable part protrudes from the first sealed space. The tape attaching method according to claim 12, wherein the tape attaching method is deformed so that   A third sealed space is provided on the base plate so as to surround the first sealed space, and in the pressurizing step, the third sealed space is decompressed to relatively reduce the first sealed space. 10. The tape attaching method according to claim 9, wherein the pressure is made higher than the pressure in the third sealed space, and as a result, the first sealed space is uniformly pressurized.   A flat ring is disposed on the base plate so as to surround the substrate, and the dicing tape is attached so as to connect the flat ring and the substrate in the dicing tape attaching step. The tape attaching method according to any one of 9 to 15.

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