JP2005135931A - Device and method for sticking tape - Google Patents

Device and method for sticking tape Download PDF

Info

Publication number
JP2005135931A
JP2005135931A JP2003366806A JP2003366806A JP2005135931A JP 2005135931 A JP2005135931 A JP 2005135931A JP 2003366806 A JP2003366806 A JP 2003366806A JP 2003366806 A JP2003366806 A JP 2003366806A JP 2005135931 A JP2005135931 A JP 2005135931A
Authority
JP
Japan
Prior art keywords
tape
plate
vacuum
elastic
sticking
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2003366806A
Other languages
Japanese (ja)
Other versions
JP4221271B2 (en
JP2005135931A5 (en
Inventor
Mikimasa Komatsu
Hidemi Sugano
Yoichiro Taga
洋一郎 多賀
幹昌 小松
秀美 菅野
Original Assignee
Nec Engineering Ltd
日本電気エンジニアリング株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nec Engineering Ltd, 日本電気エンジニアリング株式会社 filed Critical Nec Engineering Ltd
Priority to JP2003366806A priority Critical patent/JP4221271B2/en
Publication of JP2005135931A publication Critical patent/JP2005135931A/en
Publication of JP2005135931A5 publication Critical patent/JP2005135931A5/ja
Application granted granted Critical
Publication of JP4221271B2 publication Critical patent/JP4221271B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Abstract

<P>PROBLEM TO BE SOLVED: To provide a device and a method for sticking tape by which the productivity of a semiconductor etc., can be improved by causing a tape for dicing to advance to the recessed surface etc., of a semiconductor substrate even when the tape is not retractable without leaving any air between the substrate and tape etc., nor damaging the surface of the substrate etc. <P>SOLUTION: The device for sticking tape is provided with vacuum chambers 1 and 2 housing a plate-shaped object 13 and the tape 11, a holding means 12 which holds the tape 11 in the vacuum chambers 1 and 2, and a pressing means 14 which presses the plate-shaped object 13 against the tape 11 by holding the object 13 through a first elastic body 17. The device is also provided with a second elastic body 5 which elastically supports the tape 11 from the side opposite to the plate-shaped object 13 when the pressing means 14 presses the object 13 against the tape 11, pressure adjusting means 4 and 19 which shift the vacuum chambers 1 and 2 to pressurizing atmospheres. The plate-shaped object 13 can be pressed against the tape 11 by moving the pressing means 14 by utilizing the pressure difference of an airtight space 8, different from that between the vacuum chambers 1 and 2. After the tape 11 is stuck to the plate-shaped object 13 in a vacuum, the tape can be caused to advance to the recessed surface etc., of the object 13 by shifting the chambers 1 and 2 to the pressurizing atmospheres. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a tape sticking apparatus and a sticking method, and more particularly to a tape sticking apparatus and a sticking method used when sticking a dicing tape to a semiconductor substrate in a semiconductor manufacturing process.
  Conventionally, when a dicing tape is affixed to a semiconductor substrate in a semiconductor manufacturing process, for example, as shown in FIG. 8, a semiconductor substrate 42 is placed on a semiconductor substrate base 41 and rubber is adhered to the surface. The dicing tape 43 is pressed and pasted from above with a roller 44, a cylindrical block or the like.
  Further, in Patent Document 1, as shown in FIG. 9, a heat insulating material 53, a heater 54, an elastic body 55, and a heat insulator are provided on one vacuum chamber 51 side of the two divided vacuum chambers 51 and 52. A crimping plate 56 is provided, a heat insulating material 62, a heater 61, an elastic body 60, and a thermocompression bonding plate 59 are also provided on the other vacuum chamber 52 side, and a substrate 58 temporarily attached to the film 57 is carried into the ram. A film sticking device is disclosed in which a piston 63 in a cylinder 64 is raised and a film 57 is attached to a substrate 58 by thermocompression bonding using thermocompression bonding plates 56 and 59.
  Furthermore, in the disk laminating method described in Patent Document 2, as shown in FIG. 10, the inner hole or the outer peripheral portion of the first disk 73 coated with an adhesive on the lower surface is formed in the vacuum disk 78 as shown in FIG. The second disk 75 fixed on the surface plate 72 from the upper side of the 73 through the chuck 71 and placed on the plate 76 is opposed to the first disk 73 by vacuum suction on the lower piston 77. Fix by gravity. Then, the chuck 71 fixing the first disk 73 is released, the first disk 73 is dropped onto the second disk 75 by gravity, the both disks 73 and 75 are attached, the piston 77 is raised, and the crimping is performed. Both disks 73 and 75 are bonded together.
  In Patent Document 3, as shown in FIG. 11, a semiconductor substrate 83 is placed on a substrate support 84 in upper and lower vacuum chambers 81 and 85, and a film 82 is sandwiched between the upper and lower vacuum chambers 81 and 85. Then, the substrate support 84 is raised by the air cylinder 86, temporarily attached to the semiconductor substrate 83 using the tension of the film 82, and the vacuum pressure in the vacuum chambers 81 and 85 is returned to the atmospheric pressure. A method of attaching to 83 is disclosed.
Japanese Patent Laid-Open No. 2003-025445 JP 2002-197739 A Japanese Patent No. 2856216
  However, in the conventional tape affixing method shown in FIG. 8, since the dicing tape 43 is affixed to the semiconductor substrate 42 using a roller 44 or a cylindrical block in the atmosphere, the semiconductor substrate 42 and the dicing tape 43 There was a problem that air remained between. In such a state, when the semiconductor substrate 42 is divided in the next process, there is a problem that the semiconductor substrate 42 is cracked or chipped to deteriorate the yield. Here, in order to remove the residual air between the semiconductor substrate 42 and the dicing tape 43, there is a problem that a great number of work steps are required.
  In addition to these, in the conventional method shown in FIG. 8, since the pressure by the roller 44 is directly applied to the surface (circuit surface) of the semiconductor substrate 42, the surface of the semiconductor substrate 42 may be damaged. Further, since the dicing tape 43 is affixed to the semiconductor substrate 42 using the elasticity of the dicing tape 43, when a tape having no elasticity or a hard property is affixed to the semiconductor substrate 42, the semiconductor substrate There was a problem that the tape could not be attached to the concave surface of the surface of 42 and bubbles remained.
  On the other hand, in the film sticking apparatus described in Patent Document 1 shown in FIG. 9, when the substrate 58 and the film 57 are stuck together, the pressure of the piston 63 is directly applied to the substrate 58, which may damage the surface of the substrate 58. was there. In addition, since the film 57 is temporarily attached to the substrate 58 before the vacuum chambers 51 and 52 are evacuated, air may remain between the substrate 58 and the film 57 when the film 57 is attached. there were.
  Further, in the disc bonding method described in Patent Document 2 shown in FIG. 10, since the pressure of the piston 77 is directly applied to the discs 73 and 75, the surfaces of the discs 73 and 75 may be damaged.
  Further, in the method of adhering the adhesive tape to the semiconductor wafer described in Patent Document 3 shown in FIG. 11, the pressure of the air cylinder 86 is directly applied to the semiconductor substrate 83 when the semiconductor substrate 83 and the film 82 are bonded together. There was a risk of damaging the surface of the substrate 83. Further, in this method, since the film 82 is bonded by utilizing the elasticity of the film 82, when a non-stretchable film or a hard film is bonded to the semiconductor substrate 83, the film is formed on the concave surface of the surface of the semiconductor substrate 83. Does not enter and air bubbles remain between the semiconductor substrate 83 and the film 82.
  Therefore, the present invention has been made in view of the above problems in the prior art, and there is a possibility that the surface of a semiconductor substrate or the like may be damaged without leaving air between the semiconductor substrate and a dicing tape or the like. Even if it is a non-stretchable tape or a hard tape, it can enter the concave surface of the semiconductor substrate, etc., and there is no air bubbles remaining between the substrate and the tape, improving the productivity of semiconductors etc. It is an object of the present invention to provide a tape sticking device and a sticking method that can be applied.
  In order to achieve the above object, the present invention is a tape applicator for attaching a tape to a plate-like object, and holds the tape in the vacuum chamber for accommodating the plate-like object and the tape. Holding means, holding the plate-like object via a first elastic body, pressing means for pressing the plate-like object against the tape, and pressing the plate-like object against the tape by the pressing means And a second elastic body for elastically supporting the tape from the opposite side of the plate-like material, and pressure adjusting means for moving the vacuum chamber to a pressurized atmosphere.
  And according to this invention, a plate-shaped object and a tape are accommodated in a vacuum chamber, a plate-shaped object is pressed against a tape via a 1st elastic body by a press means, and a tape is made into a plate-shaped object in this case Because it is supported by the elastic body from the opposite side, air does not remain between the plate and the tape, and the plate is pressed through the elastic body, so the surface of the plate is damaged. I don't have to. In addition, by applying the tape to the plate-like object in a vacuum and then shifting to a pressurized atmosphere, it becomes possible to apply the tape to the concave surface even when the surface of the plate-like object has irregularities. Does not remain.
  In the tape applicator, the first elastic body and the second elastic body can be formed in a sheet shape.
  Further, the pressing means has a portion on the opposite side to the side holding the plate-like object via the first elastic body exposed in the airtight space, and the pressure difference between the pressure in the airtight space and the pressure in the vacuum chamber When the pressing means moves, the plate-like object can be pressed against the tape. Since the pressing means can be easily moved by switching the air flow path or the like, a tape sticking device having a simple configuration can be provided.
  The pressure adjusting means may be configured to include a switching valve for communicating a pipe line communicating with the vacuum chamber with a vacuum pump or the atmosphere.
  Furthermore, the present invention is a method for applying a tape, wherein the plate and the tape are held in a vacuum, the plate is pressed against the tape through an elastic body, and the plate is applied to the tape. When pressed, the tape is elastically supported from the opposite side of the plate, and the plate and the tape existing in the vacuum are placed in a pressurized atmosphere.
  According to the present invention, as described above, since the tape is attached to the plate-like object in a vacuum, air does not remain between the plate-like object and the tape, and the plate-like object is attached to the elastic body. When pressed against the tape, the tape is elastically supported from the opposite side of the plate-like material, so that the plate-like material and the tape existing in the vacuum are added without damaging the surface of the plate-like material. By placing in a pressure atmosphere, even if the surface of the plate-like object has irregularities, the tape can be attached to the concave surface, and no bubbles remain in the irregularities.
  As described above, according to the present invention, air does not remain between the semiconductor substrate and the dicing tape or the like, and there is no risk of damaging the surface of the semiconductor substrate or the like. To provide a tape sticking device and a sticking method capable of allowing a tape to enter a concave surface of a semiconductor substrate and the like, without causing bubbles to remain between the substrate and the tape, and improving the productivity of the semiconductor and the like. Can do.
  Next, embodiments of the present invention will be described with reference to the drawings. In the following description, a case where the tape sticking apparatus and the sticking method according to the present invention are applied to sticking a dicing tape to a semiconductor substrate in a semiconductor manufacturing process will be described as an example.
  FIG. 1 shows an embodiment of a tape applicator according to the present invention, in which the first airtight space 1 and the second airtight space 2 are in an atmospheric pressure, vacuum pressure or pressurized state. The first electromagnetic valve 4 for switching the first vacuum opening 3 to be held and the first airtight space 1 and the second airtight space 2 from atmospheric pressure to vacuum pressure, vacuum pressure to atmospheric pressure, and atmospheric pressure to pressurized state. And the upper lid 6 provided with the first rubber sheet 5 on the inside, the first ring 7 for forming the first hermetic space 1 and the second hermetic space 2, and the third hermetic space 8 at atmospheric pressure. And a second vacuum opening 9 for maintaining the vacuum pressure, a second electromagnetic valve 10 for switching the third hermetic space 8 from the atmospheric pressure to the vacuum pressure and the vacuum pressure to the atmospheric pressure, and a dicing tape (hereinafter, referred to as “dicing tape”). Tape frame 12 for affixing 11) and semiconductor substrate (Hereinafter abbreviated as “substrate”) 13, a second rubber sheet 17 on which the substrate 13 is placed, a piston 14 that moves up and down in the apparatus, and a second ring 15 that forms the third airtight space 8. It is comprised with the base 16 provided with.
  A piston 14 is disposed at the center of the base 16, a second rubber sheet 17 is provided on the piston 14, and a substrate 13 is placed on the second rubber sheet 17. The substrate 13 is configured to move up and down via the piston 14 or the like due to a pressure difference between the second hermetic space 2 and the third hermetic space 8.
  In order to move the piston 14 up and down, the base 16 and the piston 14 form a third hermetic space 8, and a second ring 15 is provided on the base 16 to make the third hermetic space 8 hermetically sealed. It is done. In addition, the base 16 includes a step portion 16a on which the tape frame 12 to which the tape 11 is attached can be arranged.
  A second rubber sheet 17 is provided on the piston 14. The second rubber sheet 17 is formed, for example, in a planar shape having a substantially uniform elastic body on one surface, and one surface thereof is fixed to the piston 14. Has been. The second rubber sheet 17 is fixed in parallel to the first rubber sheet 5 provided on the upper lid 6. As a material of the second rubber sheet 17, it is preferable to use a stretchable elastic body having good gas permeation resistance such as chloroprene rubber and ethylene / propylene rubber.
  The upper lid 6 is provided with a first rubber sheet 5. The first rubber sheet 5 is formed, for example, in a planar shape having a substantially uniform elastic body on one surface, and one surface thereof is fixed to the upper lid 6. The first rubber sheet 5 is fixed in parallel to the second rubber sheet 17 on the piston 14 disposed on the base 16. As a material of the first rubber sheet 5, it is preferable to use a stretchable elastic body having good gas permeation resistance such as chloroprene rubber and ethylene / propylene rubber.
  By covering the base 16 with the upper lid 6 and fixing the upper lid 6 to the base 16 with a fixture (not shown), the first airtight space 1 and the second airtight space 2 are formed, and the first airtight space 1 and The first ring 7 is provided on the base 16 in order to make the second hermetic space 2 hermetically sealed. Moreover, as shown in FIG. 7, since the groove | channel 16b is formed in the base 16, the 1st airtight space 1 and the 2nd airtight space 2 are mutually connected.
  The third airtight space 8 is a space surrounded by the lower side of the piston 14 and the side wall of the base 16. The third hermetic space 8 is configured to be evacuated (reduced pressure) and released to the atmosphere. The third airtight space 8 lowers the piston 14 by reducing the pressure from the atmospheric pressure to the vacuum pressure, and raises the piston 14 by increasing the pressure from the vacuum pressure to the atmospheric pressure. A second vacuum opening 9 is provided on the bottom surface of the base 16 in the third airtight space 8 to enable evacuation (decompression) and release to the atmosphere.
  The second electromagnetic valve 10 is connected to the second vacuum opening 9 through the pipe 18. Further, the second electromagnetic valve 10 is configured so that the third hermetic space 8 can be switched between evacuation (decompression) and release to the atmosphere.
  As shown in FIG. 1, the first airtight space 1 and the second airtight space 2 include a side surface of the upper lid 6, a first rubber sheet 5, a side surface of the base 16, a side surface of the piston 14, It consists of a space surrounded by the upper side of the two rubber sheets 17. The first hermetic space 1 and the second hermetic space 2 are configured to be switchable between evacuation (decompression), release to the atmosphere, and compressed air intake (pressurization). In the first airtight space 1 and the second airtight space 2, the substrate 13 and the tape 11 are bonded together. The first vacuum opening 3 is formed in the side wall of the base 16 in the first hermetic space 1 and the second hermetic space 2.
  The first electromagnetic valve 4 is connected to the first vacuum opening 3 through a pipe 19. The first solenoid valve 4 is configured to be able to switch the first airtight space 1 and the second airtight space 2 to evacuation (decompression), release to the atmosphere, and compressed air intake (pressurization). Has been.
  Next, a sticking method using the tape sticking apparatus having the above configuration will be described with reference to FIGS.
  In FIG. 1, the substrate 13 is placed on the second rubber sheet 17, the tape frame 12 to which the tape 11 is attached is placed on the step portion 16 a of the base 16, and the upper lid 6 is closed, whereby the first The airtight space 1 and the second airtight space 2 are formed.
  As shown in FIG. 2, by switching the first electromagnetic valve 4 and the second electromagnetic valve 10 from atmospheric pressure to vacuum pressure, the first airtight space 1 and the second airtight space from the first vacuum opening 3. 2 is maintained at a vacuum pressure, and the third hermetic space 8 is maintained at a vacuum pressure from the second vacuum opening 9. The second hermetic space 2 holds the vacuum pressure from the groove 16 b (see FIG. 7) provided in the base 16 via the first vacuum opening 1.
  As shown in FIG. 3, the third airtight space 8 is opened from the vacuum pressure to the atmospheric pressure by switching the second electromagnetic valve 10 from the vacuum pressure to the atmospheric pressure from the state of FIG. As a result, a differential pressure is generated in the apparatus, the piston 14 rises, pushes up the substrate 13 and presses it against the tape 11. The substrate 13 is pressed against the first rubber sheet 5 of the upper lid 6 and the tape 11 is affixed to the substrate 13 as shown in FIG.
  As shown in FIG. 4, the third airtight space 8 changes from atmospheric pressure to vacuum pressure by switching the second electromagnetic valve 10 from the atmosphere side to the vacuum side from the state of FIG. Next, by switching the first electromagnetic valve 4 from the vacuum side to the pressurization side, compressed air enters the first airtight space 1 and the second airtight space 2 from the first vacuum opening 3, and the first airtight space 1 The space 1 and the second airtight space 2 are in a pressurized atmosphere, a differential pressure is generated in the apparatus, the piston 14 is lowered, and the tape 11 and the substrate 13 pressed against the first rubber sheet 5 of the upper lid 6. Also descends on the base 16 initially arranged by gravity. Also, by placing the substrate 13 with the tape 11 on it in a pressurized atmosphere space, pressure is applied to the entire tape 11 and the substrate 13, and the tape 11 has a concave surface of the circuit pattern having irregularities as shown in FIG. The tape 11 can be attached to the substrate 13 without leaving bubbles between the substrate 13 and the tape 11.
  The tape sticking device and the sticking method according to the present invention are not limited to sticking a dicing tape to a semiconductor substrate as a plate-like material as described above, but a film tape, a resin, or the like is stuck to a plate-like material other than a semiconductor substrate. It can be used when attaching a tape to a plate-like object such as an optical disk or a flat display.
It is sectional drawing which shows one Embodiment of the tape sticking apparatus concerning this invention. It is sectional drawing for demonstrating one Embodiment of the tape sticking method concerning this invention. It is sectional drawing for demonstrating one Embodiment of the tape sticking method concerning this invention. It is sectional drawing for demonstrating one Embodiment of the tape sticking method concerning this invention. It is sectional drawing for demonstrating one Embodiment of the tape sticking method concerning this invention. It is sectional drawing which shows the state which affixed the tape for dicing on the semiconductor substrate by the tape sticking apparatus and sticking method concerning this invention. It is a figure which shows the base of the tape sticking apparatus of FIG. 1, Comprising: (a) is a top view, (b) is the elements on larger scale of (a). It is the schematic which shows an example of the conventional tape sticking method. It is sectional drawing which shows an example of the conventional film sticking apparatus. It is sectional drawing which shows an example of the conventional disc bonding method. It is sectional drawing which shows an example of the method of adhere | attaching an adhesive tape on the conventional semiconductor wafer.
Explanation of symbols
DESCRIPTION OF SYMBOLS 1 1st airtight space 2 2nd airtight space 3 1st vacuum opening 4 1st solenoid valve 5 1st rubber sheet 6 Upper cover 7 1st ring 8 3rd airtight space 9 2nd vacuum opening 10 Second solenoid valve 11 Dicing tape 12 Tape frame 13 Semiconductor substrate 14 Piston 15 Second ring 16 Base 16a Step 16b Groove 17 Second rubber sheet 18 Pipe 19 Pipe

Claims (5)

  1. A tape applicator for attaching a tape to a plate-like object,
    A vacuum chamber for housing the plate and tape,
    Holding means for holding the tape in the vacuum chamber;
    While holding the plate-like object via a first elastic body, pressing means for pressing the plate-like object against the tape;
    A second elastic body that elastically supports the tape from the opposite side of the plate when the plate is pressed against the tape by the pressing means;
    A tape applicator comprising pressure adjusting means for transferring the vacuum chamber to a pressurized atmosphere.
  2.   The tape applicator according to claim 1, wherein the first elastic body and the second elastic body are formed in a sheet shape.
  3.   In the pressing means, a portion opposite to the side holding the plate-like object is exposed in the airtight space via the first elastic body, and the pressing means is pressed by the pressure difference between the airtight space and the vacuum chamber. 3. The tape applicator according to claim 1, wherein the plate-like object is pressed against the tape by moving the means.
  4.   4. The tape sticking apparatus according to claim 3, wherein the pressure adjusting means includes a switching valve for communicating a pipe line communicating with the vacuum chamber with a vacuum pump or the atmosphere.
  5. Hold the plate and tape in a vacuum,
    Pressing the plate-like material against the tape via the first elastic body;
    When the plate-like object is pressed against the tape, the tape is elastically supported from the opposite side of the plate-like object,
    A tape sticking method comprising placing a plate-like object and tape present in the vacuum in a pressurized atmosphere.
JP2003366806A 2003-10-28 2003-10-28 Tape applicator Active JP4221271B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2003366806A JP4221271B2 (en) 2003-10-28 2003-10-28 Tape applicator

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003366806A JP4221271B2 (en) 2003-10-28 2003-10-28 Tape applicator

Publications (3)

Publication Number Publication Date
JP2005135931A true JP2005135931A (en) 2005-05-26
JP2005135931A5 JP2005135931A5 (en) 2008-04-10
JP4221271B2 JP4221271B2 (en) 2009-02-12

Family

ID=34644990

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003366806A Active JP4221271B2 (en) 2003-10-28 2003-10-28 Tape applicator

Country Status (1)

Country Link
JP (1) JP4221271B2 (en)

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008078430A (en) * 2006-09-22 2008-04-03 Matsushita Electric Ind Co Ltd Method of manufacturing electronic component
JP2008153597A (en) * 2006-12-20 2008-07-03 Hitachi Setsubi Eng Co Ltd Dicing-tape sticking method and device for semiconductor wafer
JP2009071145A (en) * 2007-09-14 2009-04-02 Hitachi Setsubi Eng Co Ltd Method and device for sticking dicing tape on plate type member such as semiconductor wafer
JP2009123784A (en) * 2007-11-12 2009-06-04 Denso Corp Tape sticking device and tape sticking method
WO2009081690A1 (en) * 2007-12-20 2009-07-02 Lintec Corporation Apparatus and method for adhering sheet
WO2009128376A1 (en) * 2008-04-18 2009-10-22 Necエンジニアリング株式会社 Substrate bonding device
JP2009302237A (en) * 2008-06-12 2009-12-24 Mitsubishi Electric Corp Tape applying device
CN101620986A (en) * 2008-07-03 2010-01-06 株式会社迪思科 Adhesive tape attaching method
JP2010165740A (en) * 2009-01-13 2010-07-29 Tokyo Seimitsu Co Ltd Wafer mounting method and wafer mounting device
JP2010165962A (en) * 2009-01-19 2010-07-29 Takatori Corp Support table of wafer
KR101006216B1 (en) * 2008-04-10 2011-01-07 히다치 세츠비 엔지니어링 가부시키가이샤 Semiconductor wafer dicing tape attaching method and apparatus
US7896049B2 (en) * 2006-08-08 2011-03-01 Nitto Denko Corporation Semiconductor wafer holding method, semiconductor wafer holding apparatus and semiconductor wafer holding structure
JP2011199159A (en) * 2010-03-23 2011-10-06 Nitto Denko Corp Semiconductor wafer mounting method and semiconductor wafer mounting device
JP2014033005A (en) * 2012-08-01 2014-02-20 Disco Abrasive Syst Ltd Wafer bonding device

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7896049B2 (en) * 2006-08-08 2011-03-01 Nitto Denko Corporation Semiconductor wafer holding method, semiconductor wafer holding apparatus and semiconductor wafer holding structure
TWI412098B (en) * 2006-08-08 2013-10-11 Nitto Denko Corp Semiconductor wafer holding method, and semiconductor wafer holding apparatus
JP2008078430A (en) * 2006-09-22 2008-04-03 Matsushita Electric Ind Co Ltd Method of manufacturing electronic component
JP2008153597A (en) * 2006-12-20 2008-07-03 Hitachi Setsubi Eng Co Ltd Dicing-tape sticking method and device for semiconductor wafer
JP2009071145A (en) * 2007-09-14 2009-04-02 Hitachi Setsubi Eng Co Ltd Method and device for sticking dicing tape on plate type member such as semiconductor wafer
JP2009123784A (en) * 2007-11-12 2009-06-04 Denso Corp Tape sticking device and tape sticking method
WO2009081690A1 (en) * 2007-12-20 2009-07-02 Lintec Corporation Apparatus and method for adhering sheet
KR101006216B1 (en) * 2008-04-10 2011-01-07 히다치 세츠비 엔지니어링 가부시키가이샤 Semiconductor wafer dicing tape attaching method and apparatus
WO2009128376A1 (en) * 2008-04-18 2009-10-22 Necエンジニアリング株式会社 Substrate bonding device
JP2009302237A (en) * 2008-06-12 2009-12-24 Mitsubishi Electric Corp Tape applying device
JP2010016147A (en) * 2008-07-03 2010-01-21 Disco Abrasive Syst Ltd Adhesive tape attaching method
CN101620986A (en) * 2008-07-03 2010-01-06 株式会社迪思科 Adhesive tape attaching method
US7875148B2 (en) 2008-07-03 2011-01-25 Disco Corporation Adhesive tape attaching method
JP2010165740A (en) * 2009-01-13 2010-07-29 Tokyo Seimitsu Co Ltd Wafer mounting method and wafer mounting device
JP2010165962A (en) * 2009-01-19 2010-07-29 Takatori Corp Support table of wafer
JP2011199159A (en) * 2010-03-23 2011-10-06 Nitto Denko Corp Semiconductor wafer mounting method and semiconductor wafer mounting device
JP2014033005A (en) * 2012-08-01 2014-02-20 Disco Abrasive Syst Ltd Wafer bonding device

Also Published As

Publication number Publication date
JP4221271B2 (en) 2009-02-12

Similar Documents

Publication Publication Date Title
KR850001056B1 (en) Method for way mounting of thin wafers for polishing
JP3769005B2 (en) Bonded substrate manufacturing apparatus and substrate bonding method
TWI291068B (en) Method and apparatus for fabricating liquid crystal display device
DE10260233B4 (en) Method of attaching a workpiece to a solid on a workpiece carrier and workpiece carrier
KR101019469B1 (en) Vacuum suction head
CN102177010B (en) Device and method for thermoforming by hot-plate heating
TWI466222B (en) Fixed fixture and workpiece processing methods
US7418991B2 (en) Substrate bonding apparatus for manufacturing liquid crystal display device
JP6186452B2 (en) Substrate stacking system and method
JP3882004B2 (en) Adhesive chuck device
JP4107316B2 (en) Board bonding equipment
JP2007227439A (en) Method and apparatus of manufacturing semiconductor device
US7183125B2 (en) Method for manufacturing surface acoustic wave device
JP3917651B2 (en) Adhesive chuck device
JP3041221B2 (en) Apparatus and method for forming a cavity without using an insert
JP4985513B2 (en) Method and apparatus for peeling electronic parts
KR20030045653A (en) Suction holding device
US20010021000A1 (en) Apparatus and method for manufacturing liquid crystal display
JP4012887B2 (en) Flat board holder
US20090117809A1 (en) Process for glass-to-glass sealing OLEDs with dry film adhesive
JP2648638B2 (en) Wafer bonding method and apparatus
KR100984748B1 (en) Electrostatic chuck, assemble-type chucking apparatus having the chuck, apparatus for attaching glass substrates having the chuck and assemble-type apparatus for attaching glass substrates having the chuck
US9390948B2 (en) Tape attaching apparatus and tape attaching method
KR20050053008A (en) Attaching apparatus and method
JP2005219297A (en) Method and apparatus for molding resin

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20060904

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20080226

A871 Explanation of circumstances concerning accelerated examination

Free format text: JAPANESE INTERMEDIATE CODE: A871

Effective date: 20080226

A975 Report on accelerated examination

Free format text: JAPANESE INTERMEDIATE CODE: A971005

Effective date: 20080321

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20080325

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20080523

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20080616

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20080715

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20080811

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20081006

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20081029

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20081117

R150 Certificate of patent or registration of utility model

Ref document number: 4221271

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20111121

Year of fee payment: 3

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20111121

Year of fee payment: 3

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20121121

Year of fee payment: 4

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20121121

Year of fee payment: 4

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20131121

Year of fee payment: 5

S111 Request for change of ownership or part of ownership

Free format text: JAPANESE INTERMEDIATE CODE: R313111

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350