JP6134228B2 - Sheet sticking device and sheet sticking method - Google Patents

Description

  The present invention relates to a sheet sticking apparatus and a sheet sticking method for sticking an adhesive sheet to an adherend surface of an adherend.

  2. Description of the Related Art Conventionally, in a semiconductor manufacturing process, a sheet sticking apparatus for sticking a dicing tape (adhesive sheet) to a semiconductor wafer as an adherend (hereinafter sometimes simply referred to as “wafer”) has been proposed (for example, Patent Documents). 1). In the sheet sticking apparatus described in Patent Document 1, the pressure in the pressing means is increased to deform the pressing means convexly toward the wafer, and the adhesive sheet is pressed and stuck to the wafer.

JP 2005-129678 A

  However, in the sheet sticking device described in Patent Document 1, the pressing force is influenced by the members constituting the pressing means, and in the case where the pressing means is easily deformable, if the pressure inside the pressing means is increased, There is a disadvantage that the pressing means located outside the body is deformed and the pressing force cannot be sufficiently applied. On the other hand, when the pressing means is a member that is difficult to deform, if the unevenness is formed on the surface of the adherend or the adhesive sheet, the pressing means becomes difficult to deform following the unevenness, so the adherend and the adhesive sheet There are inconveniences that bubbles are formed between them and that the adherend is attacked to give stress or damage to the adherend.

  An object of the present invention is to provide a sheet sticking apparatus and a sheet sticking method capable of preventing an air bubble from being formed between an adherend and an adhesive sheet to be securely attached to the adherend. .

  In order to achieve the above-mentioned object, the sheet sticking device of the present invention applies a pressing force in a direction approaching the adherend and the adhesive sheet facing each other in a predetermined sticking space, thereby applying the sticking force of the adherend. A sheet sticking apparatus for sticking an adhesive sheet to a wearing surface, comprising a deformable deformable member, and a sealed space located on the opposite side of the sticking space with the deformable member interposed therebetween at a higher pressure than the sticking space. A contact member that deforms the deformable member to bring the adhesive sheet into contact with the adherend surface, and a press member having a press surface that can be pressed all at once without delay over the entire adherend surface. And a pressing means for applying a pressing force to the adherend and the adhesive sheet through the deformable member.

  On the other hand, in the sheet sticking method of the present invention, the adhesive sheet is applied to the adherend surface of the adherend by applying a pressing force in a direction relatively approaching the adherend and the adhesive sheet that are arranged to face each other in a predetermined sticking space. A method of sticking a sheet, wherein a deformable deformable member is sandwiched between the sealed space located on the opposite side of the sticking space to a pressure higher than that of the sticking space, thereby deforming the deformable member. A process of bringing the adhesive sheet into contact with the adherend surface, and a pressing member having a press surface that can be pressed all at once without delay over the entire adherend surface, to the adherend and the adhesive sheet via the deformable member And a step of applying a pressing force.

  According to the present invention as described above, after the adhesive sheet is brought into contact with the adherend surface with a small pressing force by the abutting means, the adhesive sheet is pressed onto the entire surface of the adherend with a large pressing force by the pressing means and pasted. By doing so, bubbles can be prevented from being formed between the adherend and the adhesive sheet can be reliably affixed to the adherend.

Sectional drawing of the sheet sticking apparatus which concerns on embodiment of this invention. Operation | movement explanatory drawing of the sheet sticking apparatus of FIG. Operation | movement explanatory drawing of the sheet sticking apparatus of FIG. (A), (B) is operation | movement explanatory drawing of the sheet sticking apparatus which concerns on the modification of this invention.

DESCRIPTION OF EXEMPLARY EMBODIMENTS Hereinafter, an embodiment of the invention will be described with reference to the drawings.
In this embodiment, for example, when directions such as up, down, left, right, front, back, etc. are shown, all of FIG. When viewed from the appropriate orientation), the top, bottom, left, and right directions are parallel to the page, the front is the front direction perpendicular to the page, and the back is the back direction orthogonal to the page. To do.

  1 to 3, the sheet sticking apparatus 10 applies a pressing force in a direction relatively approaching the wafer WF and the adhesive sheet AS that are arranged to face each other in a predetermined sticking space SP <b> 2, thereby the wafer WF. This is an apparatus for attaching the adhesive sheet AS to the adherend surface WA, and includes a deformable deformable member 21, and a sealed space SP1 positioned on the opposite side of the paste space SP2 with the deformable member 21 interposed therebetween. By making the pressure higher than SP2, the abutting means 20 that deforms the deformable member 21 and abuts the adhesive sheet AS on the adherend surface WA, and the entire adherend surface WA can be pressed all at once without delay. A pressing means 30 having a pressing member 31 having a pressing surface 31A, applying a pressing force to the wafer WF and the adhesive sheet AS via the deformation member 21, a support means 40 capable of supporting the wafer WF, and a deformation portion 21, and a housing unit 50 for housing the pressing means 30 and the support means 40.

  The abutting means 20 is provided so as to be deformable by rubber or resin provided in a substantially circular shape in plan view, and is a so-called electrostatic chuck function capable of holding the adhesive sheet AS on its lower surface by a Coulomb force of a voltage applying means (not shown). , A pressure reducing means 22 such as a pressure reducing pump or a vacuum ejector communicated with the sealed space SP1, and a pressure sensor 23 capable of detecting the pressure of the sealed space SP1 or a pressure detecting means 23 such as a load cell. Yes. The deformable member 21 is configured to be easier to deform than the pressing member 31. The decompression means 22 is provided in the first space SP1 so as to be able to introduce air.

  The pressing means 30 is provided substantially parallel to the adherend surface WA of the wafer WF, and is formed with a radial dimension equal to or greater than that of the adherend surface WA, so that there is no delay over the entire adherend surface WA. A pressing member 31 having a pressing surface 31A that can be pressed at once, a linear motion motor 32 as a driving device that supports the pressing member 31 with its output shaft 32A, and a detection means (not shown) capable of detecting the pressing force by the pressing member 31 And. That is, the pressing member 31 is provided so as to be able to press all areas of the adherend surface WA at substantially the same timing by the pressing surface 31A.

  The support unit 40 is supported by a linear motion motor 41 as a driving device and an output shaft 41A of the linear motion motor 41, and is a so-called electrostatic that can hold the wafer WF on its upper surface by a Coulomb force of a voltage application unit (not shown). And a table 42 having a chuck function.

The accommodating means 50 opens upward, supports the lower case 51 in the shape of a cylindrical box having the support means 40 disposed on the bottom surface, the deformation member 21 and the pressing means 30, and closes the opening of the lower case 51. An upper case 52 capable of forming a hermetically sealed space SP2, a linear motor 53 as a driving device that supports the upper case 52 with its output shaft 53A, a decompression pump, a vacuum ejector, etc. communicated with the pasting space SP2. A pressure reducing means 54 and a pressure detecting means 55 such as a pressure sensor or a load cell capable of detecting the pressure in the pasting space SP2 are provided. The decompression means 54 is provided in the pasting space SP2 so as to be able to introduce air.
The upper case 52 is set to a depth substantially the same as the thickness dimension of the deformable member 21, and is set in the first recess 52 </ b> A to a depth substantially the same as the thickness dimension of the pressing member 31. The second concave portion 52B and the third concave portion 52C, which is located in the second concave portion 52B and has the linear motor 32 disposed on the bottom surface thereof, are supported by the outer edge of the deformable member 21 on the bottom edge of the first concave portion 52A. Has been. As a result, a sealed space SP1 that is sealed by the upper surface of the deformable member 21, the bottom surface of the first recess 52A, the second recess 52B, and the third recess 52C is formed. By setting the second recess 52B to a depth substantially the same as the thickness dimension of the pressing member 31, the bottom surface of the first recess 52A and the lower surface of the pressing member 31 are positioned on the same plane. In a state where the deformable member 21 is in contact with the bottom surface of the first recess 52A, the surface of the deformable member 21 is maintained flat, and the deformable member 21 can be prevented from deteriorating.

In the sheet sticking apparatus 10 described above, a procedure for sticking the adhesive sheet AS to the wafer WF will be described.
First, as shown by a two-dot chain line in FIG. 1, with the upper and lower cases 52 and 51 separated from each other, the adhesive sheet AS is placed on the lower surface of the deformable member 21 by a manual means or conveying means (not shown) such as an articulated robot or a belt conveyor. When abutting, the abutting means 20 drives a voltage applying means (not shown) and holds the adhesive sheet AS by the Coulomb force. Next, when the wafer WF is placed on the table 42 manually or by a transfer means (not shown), the support means 40 drives a voltage application means (not shown) to hold the wafer WF by a Coulomb force. Next, the accommodating means 50 drives the linear motor 53 to lower the upper case 52 to form a pasting space SP2 as shown by a solid line in FIG. After that, the contact means 20 and the accommodation means 50 drive the decompression means 22 and 54 to decompress the sealed space SP1 and the pasting space SP2 at the same decompression rate. When the pressure is detected, the contact means 20 and the accommodation means 50 stop driving the decompression means 22 and 54. Next, after the support means 40 drives the linear motion motor 41 and raises the table 42 to a predetermined position, the contact means 20 drives the decompression means 22 to gradually introduce the atmosphere into the sealed space SP1. Thus, the sealed space SP1 is set to a higher pressure than the pasting space SP2. As a result, the deformable member 21 is deformed, and as shown by a solid line in FIG. 2, the center portion of the adhesive sheet AS is brought into contact with the center portion of the adherend surface WA of the wafer WF, and then the adhesive sheet AS is moved to the outside. The adhesive sheet AS is gradually brought into contact with the adherend surface WA, and the entire adhesive sheet AS is brought into contact with the adherend surface WA as shown by a two-dot chain line in FIG. As a result, the sticking is performed while the air between the adhesive sheet AS and the adherend surface WA is expelled to the outside, thereby preventing air bubbles from being formed between the adhesive sheet AS and the adherend surface WA. can do. Then, when the pressure detection means 23 detects that the pressure in the sealed space SP1 has become a predetermined reduced pressure state (second pressure), the contact means 20 stops driving the pressure reduction means 22. At this time, the accommodating means 50 drives the decompression means 54 and controls the pressure in the application space SP2 to be maintained at the first pressure based on the detection result of the pressure detection means 55.

  Here, even if the pressure in the sealed space SP1 is made higher than the pressure in the pasting space SP2, only the deformable member 21 located outside the outer edge of the wafer WF swells, so that a sufficient pressing force is applied to the adhesive sheet AS. Cannot be granted. Therefore, if the deformable member 21 is formed of a member that is difficult to deform (a high-strength member), the adhesive sheet AS can be sufficiently pressed against the wafer WF. In this case, the surface of the wafer WF or the adhesive sheet AS is uneven. Is formed, it becomes difficult for the deformable member 21 to deform following the unevenness, so that bubbles are formed between the wafer WF and the adhesive sheet AS, or the wafer WF is attacked to attack the wafer WF. Stress or damage the wafer WF.

  Next, the pressing means 30 drives the linear motion motor 32 to lower the pressing member 31 and press it against the adherend surface WA without delay over the entire adhesive sheet AS as shown in FIG. As a result, a sufficient pressing force can be applied to the adhesive sheet AS so that the adhesive sheet AS can be attached to the wafer WF, and the deformation member 21 portion located outside the outer edge of the wafer WF is prevented from expanding and rupturing. In addition, since the pressing member 31 is pressed via the deformation member 21 that is easier to deform than the pressing member 31, the aggression on the wafer WF can be reduced. Furthermore, since the deforming member 21 is in contact with the adhesive sheet AS and the adherend surface WA so that no bubbles are formed in the previous stage, the pressing member 31 can be used without any delay over the entire adherend surface WA. Even if pressed, no bubbles are formed between the adhesive sheet AS and the adherend surface WA. In addition, the time required for pressing by the pressing member 31 can be shortened, and the pasting ability per unit time of the sheet pasting apparatus 10 can be improved. Note that, in order to familiarize the adhesive surface of the adhesive sheet AS and the adherend surface WA, the pressing means 30 drives the linear motion motor 32 and moves the pressing member 31 up and down to perform the pressing operation by the pressing member 31 a plurality of times. May be.

  When the detection means (not shown) detects that the pressing force by the pressing member 31 has reached a predetermined pressing force, the pressing means 30 drives the linear motor 32 to raise the pressing member 31, and the contact means 20 After stopping the driving of the voltage application means (not shown), the contact means 20 drives the decompression means 22 to decompress the sealed space SP1 until the first pressure is reached. Thereafter, the contact means 20 and the accommodation means 50 drive the decompression means 22 and 54 to pressurize the sealed space SP1 and the pasting space SP2 at the same pressurization rate (introducing the atmosphere), and the respective pressure detection means 23 and 55 When it is detected that the atmospheric pressure has been reached, the contact means 20 and the accommodation means 50 stop driving the decompression means 22 and 54. Then, after the accommodating means 50 drives the linear motion motor 53 and raises the upper case 52, the support means 40 stops driving the voltage applying means (not shown), and the adhesive sheet AS is moved manually or by a conveying means (not shown). The affixed wafer WF is transferred to the next process, and thereafter the same operation as described above is repeated.

According to this embodiment, there are the following effects.
That is, the adhesive sheet AS is brought into contact with the adherend surface WA with a small pressing force by the abutting means 20, and then the adhesive sheet AS is pressed and pasted on the entire surface of the adherend WA with a large pressing force by the pressing means 30. Thus, bubbles can be prevented from being formed between the wafer WF and the adhesive sheet AS can be reliably attached to the wafer WF.

  As described above, the best configuration, method and the like for carrying out the present invention have been disclosed in the above description, but the present invention is not limited to this. That is, the invention has been illustrated and described primarily with respect to particular embodiments, but may be configured for the above-described embodiments without departing from the scope and spirit of the invention. Various modifications can be made by those skilled in the art in terms of materials, quantity, and other detailed configurations. Therefore, the description limiting the shape, material, etc. disclosed above is an example for easy understanding of the present invention, and does not limit the present invention. The description by the name of the member which remove | excluded the limitation of one part or all of such is included in this invention.

For example, the deformable member 21 may be a member that can be elastically deformed, or may be a member that does not completely or partially return to the original shape.
The material, shape, thickness, and size of the deformable member 21 can be selected as appropriate.
Further, the deformable member 21 may be configured to be sandwiched between the upper and lower cases 52 and 51, and the deformable member 21 may function as a packing for the upper and lower cases 52 and 51.
Further, the deformable member 21 and the table 42 may be configured to hold the adhesive sheet AS and the wafer WF by suction, adhesion, mechanical chuck, or the like.

Further, as shown in FIG. 4A, the contact means 20 and the pressing means 30 form a sealed space SP1, and the pressure reducing means 54 depressurizes the pasting space SP2 so that the sealed space SP1. May be configured to have a higher pressure than the affixing space SP2. At this time, when the pressing member 31 is configured to be fixed to the upper case 52, the linear motion motor 41 functions as the pressing means, and the table 42 is lifted, as shown in FIG. The wafer WF and the adhesive sheet AS may be pressed by the contact means 20 and the pressing means.
Further, if the sealed space SP1 is higher than the atmospheric pressure, the affixing space SP2 may be atmospheric pressure, the decompression means 54 and the lower case 51 may be omitted, and the upper case 52 and the lower case 51 The pasting space SP2 need not be a sealed space. Further, if the contact means 20 is provided so as to pressurize the sealed space SP1, the pasting space SP2 may be atmospheric pressure, and the decompression means 54, the pressure detection means 55, and the lower case 51 may be omitted. However, the upper case 52 and the lower case 51 may not form the pasting space SP2 in a sealed space. Moreover, as long as the contact means 20 is provided so that the 1st space SP1 can be pressurized, it is good also considering the sticking space SP2 as a pressure higher than atmospheric pressure.
Further, the first pressure and the second pressure can be arbitrarily set as long as the deformable member 21 is deformed and the adhesive sheet AS can be brought into contact with the wafer WF.
Furthermore, it may replace with each decompression means 22 and 54, and the thing of the structure which pressurizes and depressurizes sealed space SP1 and sticking space SP2 with fluids other than air, such as a liquid and a gel, may be employ | adopted.
Further, the material, shape, thickness, and size of the pressing member 31 can be appropriately selected.

  Further, the support means 40 may be configured not to be lifted or lowered by a driving device. Furthermore, when the wafer WF is supported by another apparatus, the support means 40 may not be provided in the sheet sticking apparatus of the present application.

  Further, the adhesive sheet AS may be a belt-like sheet that continues to the outside of the upper and lower cases 52 and 51, and is set between the upper and lower cases 52 and 51 by being fed out in the left-right direction. The configuration may be such that the affixed wafer WF is sent to the next step, or an appropriate cutting means for cutting the belt-like sheet affixed to the wafer WF into a predetermined shape may be employed.

Further, the material, type, shape, etc. of the adhesive sheet and adherend in the present invention are not particularly limited. For example, the adhesive sheet is a single layer having only an adhesive layer, one having an intermediate layer between the base sheet and the adhesive layer, and having three or more layers such as having a cover layer on the upper surface of the base sheet, Further, it may be a so-called double-sided adhesive sheet that can peel the base sheet from the adhesive layer, and the double-sided adhesive sheet has a single-layer or multi-layer intermediate layer, It may be a single layer or multiple layers without any. Examples of the adherend include, for example, foods, resin containers, semiconductor wafers such as silicon semiconductor wafers and compound semiconductor wafers, circuit board, information recording substrates such as optical disks, glass plates, steel plates, ceramics, wood plates or resin plates, Arbitrary forms of members and articles can also be targeted. It should be noted that the adhesive sheet is replaced with functional and intended readings, for example, any shape such as a label for information description, a decorative label, a protective sheet, a dicing tape, a die attach film, a die bonding tape, a recording layer forming resin sheet, etc. Any sheet, film, tape or the like can be attached to any adherend as described above.
Each means in the present invention is not limited in any way as long as it can perform the operation or function described for those means, and moreover, it is completely limited to the structure of only one embodiment shown in the above embodiment. is not. For example, the abutting means includes a deformable deformable member, and deforms the deformable member by setting a sealed space located on the opposite side of the paste space with the deformable member interposed therebetween to a pressure higher than the paste space. As long as the adhesive sheet can be brought into contact with the adherend surface of the adherend, there is no limitation as long as it is within that range in light of the technical common sense at the beginning of the application (other means) Will be omitted).
The drive device in the embodiment includes an electric device such as a rotation motor, a linear motion motor, a linear motor, a single-axis robot, and an articulated robot, an actuator such as an air cylinder, a hydraulic cylinder, a rodless cylinder, and a rotary cylinder. In addition to these, a combination of them directly or indirectly may be employed (some of them overlap with those exemplified in the embodiment).

DESCRIPTION OF SYMBOLS 10 Sheet sticking apparatus 20 Contact means 21 Deformation member 30 Press means 31 Press member 31A Press surface SP1 Sealing space SP2 Sticking space AS Adhesive sheet WF Wafer (Substrate)
WA surface

Claims (2)

A sheet sticking device for sticking the adhesive sheet to the adherend surface of the adherend by applying a pressing force in a direction relatively approaching the adherend and the adhesive sheet disposed to face each other in a predetermined sticking space,
A deformable deformable member is provided, and a sealing space located on the opposite side of the paste space with the deformable member interposed therebetween is set to a pressure higher than the paste space, thereby deforming the deformable member and the adherend surface A contact means for contacting the adhesive sheet to,
A pressing member having a pressing surface that can be pressed at a time without delay over the entire adherend surface, and a pressing unit that applies a pressing force to the adherend and the adhesive sheet via the deformable member; The sheet sticking apparatus characterized by the above-mentioned. A sheet sticking method for sticking the adhesive sheet to the adherend surface of the adherend by applying a pressing force in a direction relatively approaching the adherend and the adhesive sheet placed opposite to each other in a predetermined sticking space,
The sealed space located on the opposite side of the sticking space with a deformable deforming member interposed therebetween is set to a pressure higher than the sticking space, thereby deforming the deformable member and bringing the adhesive sheet into contact with the adherend surface A process of
And a step of applying a pressing force to the adherend and the adhesive sheet through the deformable member with a pressing member having a pressing surface that can be pressed all at once without delay over the entire surface to be adhered. Sheet affixing method.

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