JP2006310338A - Apparatus of sticking vacuum tape for wafer - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To execute a sticking operation without allowing air to remain between a wafer and a tape, without damaging the wafer. <P>SOLUTION: This apparatus has a base; an upper lid put on the top of the base and forming an airtight space between the base and the lid; an elastic sheet of an elastic body for partitioning the air tight space into the airtight space A of the base side and the air tight space B of the upper lid side, and placing a component for which the tape is stuck on the side of the air tight space B; a sticking tool placed on the elastic sheet and supporting the wafer, so that the wafer is spaced from the elastic sheet; and first and second vacuum pumps for changing the inner atmospheric pressures of the airtight spaces A and B. The sticking tool has a plate to be placed on the elastic sheet, a plurality of supporting pins provided on the plate to contact the external periphery of the wafer and supporting the wafer, and a positioning pin for alignment the wafer supported by the supporting pins on the center portion of the elastic sheet. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to tape affixing, and more particularly to tape affixing using vacuum.

  As shown in FIG. 8, the conventional wafer tape affixing device affixes a dicing tape to a wafer by pressing a roller.

  In the wafer fixing method described in Japanese Patent Application Laid-Open No. 2001-308033, a peripheral portion where a circuit on the circuit surface side of the wafer is not formed in the apparatus is adsorbed in a table shape to fix the wafer, and a predetermined surrounding the outer wafer. The ring frame is mounted at the position, the wafer is muffled, and the ring frame and the wafer are fixed in a dicing tape shape by pressing with a roller from the substrate surface side of the dicing tape.

  Moreover, the vacuum tape sticking apparatus and method described in Japanese Patent Application No. 2003-188822 filed earlier by one of the inventors of the present application, as shown in FIG. 9, has a circuit surface of a wafer on a sticking rubber sheet in a vacuum chamber. Is placed in contact with each other, and a ring frame in which dicing tape is pasted in advance is placed at a predetermined position around it, and the airtight space in the vacuum chamber and under the rubber sheet for pasting is reduced to a predetermined vacuum level, By returning only the decompressed airtight space under the rubber sheet for sticking to atmospheric pressure, a differential pressure is generated in the airtight space under the rubber sheet and the rubber sheet for sticking, and the vacuum chamber in which the rubber sheet for sticking is decompressed A system is described that swells in the inner direction (upward), lifts the wafer, and fixes it to the dicing tape.

JP 2001-308033 JP2003-188822

  However, in the conventional wafer tape affixing device as shown in FIG. 8, firstly, since the wafer is held only at the outer periphery of the wafer while avoiding the contact with the wafer structure, the concentrated load on the holding part, There is a problem that stress in the advancing direction is generated, the end surface of the wafer is pressed against the portion of the set base holding the wafer, and the wafer is broken.

  Second, since the dicing tape is stuck on the back surface of the wafer by pressing a roller in the atmosphere, residual air remains between the back surface of the wafer and the tape. When chip division of the next process is performed in this state, there is a problem in that chip breakage or chipping occurs during chip division and yield is deteriorated.

  Thirdly, there is a problem that it takes a lot of man-hours for the operator to remove the residual air so that the residual air between the back surface of the wafer and the dicing tape is pushed out from between the wafer and the dicing tape.

  Further, in the wafer fixing method described in Japanese Patent Application Laid-Open No. 2001-308033, even if only the outer peripheral portion of the MEMS wafer is vacuum-adsorbed and fixed, if an ultrathin wafer is applied while applying a load with a roller, there is damage to the wafer. In the worst case, there was a problem that the wafer was damaged.

  Furthermore, in the vacuum tape sticking apparatus and method described in Japanese Patent Application No. 2003-188822, since the conventional vacuum tape sticking apparatus sets the wafer circuit part directly on the rubber sheet for sticking, it is like a MEMS device. When there is a structure (circuit) that is very fragile, there is a problem that the structure may be broken.

  Therefore, the present invention performs a pasting operation without putting residual air between the MEMS wafer and the dicing tape, prevents cracking or chipping of the chip at the time of chip division in the next process, and prevents the chip from being inserted between the MEMS wafer and the dicing tape. The purpose is to improve the productivity by eliminating the work of removing the residual air so as to push it out.

  In order to achieve the above object, a vacuum tape applicator according to the present invention includes a base, an upper lid that is placed over the base and forms an airtight space between the base and the airtight space. An elastic sheet of an elastic body that divides into an airtight space A on the base side and an airtight space B on the upper lid side, and on which a part for attaching a tape to the airtight space B is placed, and a wafer placed on the elastic sheet, And a first vacuum pump for changing the internal pressures of the airtight space A and the airtight space B, respectively.

  In this case, the attaching jig includes a plate placed on the elastic sheet, a plurality of support pins provided on the plate and supported in contact with an outer peripheral portion of the wafer, and a wafer supported by the support pins. It is desirable to have an alignment pin that positions the central portion of the elastic sheet.

  The elastic sheet may be any of ethylene propylene rubber, butyl rubber, fluorine rubber, silicon rubber, and neoprene rubber.

  In the wafer tape affixing device of the present invention, the wafer is not placed directly on the elastic sheet, but is set by contacting only the outer peripheral portion of the circuit surface on which the wafer structure is located with the affixing jig. The wafer is lifted upward by a differential pressure and is applied to the adhesive layer of the dicing tape so that the wafer's structure (circuit) is not destroyed, and there is no residual air on the entire back surface of the wafer. It became possible to attach a dicing tape.

  In this way, it can be applied to the entire wafer in a uniform state with no residual air, reducing the man-hours for removing the residual air between the wafer and the dicing tape that has been generated in the past from between the wafer and the dicing tape. In addition, in chip division in the next step, troubles such as chip breakage and chipping caused by residual air between the wafer and the dicing tape can be prevented, and the product yield can be improved.

  Furthermore, since it becomes possible to affix the dicing tape to the wafer without using the elongation characteristic of the dicing tape, it is possible to affix the dicing tape while suppressing the tension of the dicing tape. It is now possible to attach non-stretchable adhesives such as film tape and resin.

  Next, an embodiment of the present invention will be described with reference to FIGS.

FIG. 1 shows the structure of a wafer tape applicator according to the present invention. A base 15, an upper lid 4 covering the base 15, and a base 15 and the upper lid 4 are joined together to form an airtight space. In order to make the space between the ring B9 attached to the upper lid 4 side of the base 15 and the rubber sheet 3 at the center of the upper surface of the base 15 and the center of the rubber sheet 3 and the base 15 airtight. A ring A23 attached to the upper cover 4 side of the base 15, a frame base 14 placed on the periphery of the rubber sheet, and a dicing frame base 22 placed on the frame fourth with the dicing tape 1 attached thereto. When,
A dicing tape 1 that is attached to the dicing frame 22 and separates the airtight space formed by the upper lid 4 and the base 15 into the airtight space B5 on the upper lid 4 side and the airtight space C6 on the base 15 side, and a rubber sheet 3 is provided in the airtight space B5 of the base 15 and the sticking jig 14 provided on the inner side of the frame base 14, the wafer 2 positioned and placed at the center of the rubber sheet by the sticking jig 14. The vacuum opening B7, the vacuum valve B8 for changing the airtight spaces B and C from the atmospheric pressure to the vacuum thickness through the tube from the vacuum opening B7, and the vacuum opening A11 provided at the lower part of the rubber sheet 3 in the center of the base 15. The airtight space A10 composed of a tube from the vacuum opening A11 is composed of a vacuum valve A12 that changes the atmospheric pressure to a vacuum thickness.

  4 and 5 show a cross-sectional view and a plan view of the sticking jig 14. As is apparent from the drawing, the attaching jig 14 is supported by a plate 16 placed on the rubber sheet 3, a plurality of support pins 17 provided on the plate 16 and supporting the wafer 2, and the support pins 17. The positioning pin 18 is used for positioning the wafer 2, and the circuit 19 of the wafer 2 is placed so as to face downward in the drawing. The wafer 2 is supported by a plurality of support pins 17 and the load is distributed. Since the wafer 2 has a substantially uniform load, the stress does not concentrate on one point.

  6 and 7 show a sectional view and a plan view of the dicing frame 1 and the frame base 14. For easy understanding, the sticking jig 14 shown in FIGS. 4 and 5 is removed from FIGS. 6 and 7. As is apparent from the figure, the dicing tape 12, the dicing frame 13 to which the dicing tape 12 is attached, the plurality of frame support pins 20 that support the dicing frame 13, and the support pins 20 that are fixed on the rubber sheet 3 are placed. And a frame alignment pin 21 that is fixed on the frame table 12 and positions the dicing frame 13 at the center of the rubber sheet 3.

  Next, the operation of the present invention will be described with reference to the accompanying drawings.

  The dicing tape 1 is affixed to the dicing frame 13 in advance.

  Then, a sticking jig 14 is placed on the rubber sheet 3, the wafer 2 is positioned with the alignment pins 18 so that the circuit surface faces downward, and only the outer peripheral portion of the wafer 2 is brought into contact with the support pins 17. Put.

  Thereafter, the dicing frame 13 with the dicing tape 1 attached is placed on the frame base 22.

  In this state, airtight spaces B and C are formed by closing the base 15 with the upper lid 4.

  As shown in FIG. 2, when the vacuum valves A12 and B8 are switched from the atmospheric pressure side to the vacuum pressure side, the piping from the vacuum valve B8 to the vacuum opening B7 and the airtight spaces B5 and C6 from the vacuum opening B7 become the vacuum pressure. The piping from the vacuum opening A11 to the vacuum valve A12 and the airtight space A10 from the vacuum opening A11 to the space between the rubber sheet 3 and the base 15 held by the ring A23 become a vacuum pressure.

  After that, as shown in FIG. 3, the pressure is generated between the airtight space C6 and the airtight space A10 by switching the vacuum valve A12 from the vacuum side to the air side to change the airtight space A10 from the vacuum pressure to the atmospheric pressure. As a result, the rubber sheet 3 is inflated toward the airtight space C6 and the sticking jig 14 is pushed upward, so that the wafer 2 placed on the sticking jig 14 is stuck to the dicing tape 1 without any residual air. Can be attached.

  When the dicing tape 1 is affixed to the wafer 2, the vacuum valve B 8 is switched from the vacuum side to the atmospheric side, the airtight spaces B 5 and C 6 are changed from the vacuum pressure to the atmospheric pressure, and the upper lid 4 is removed from the base 15 to remove the dicing tape 1. Can be taken out.

  Although the best mode has been described above, the rubber sheet 3 may be ethylene propylene rubber, butyl rubber, fluorine rubber, silicon rubber, or neoprene rubber, and the rubber sheet 3 is not limited to rubber. Any material having elasticity can be used.

The figure which showed the structure of the vacuum tape sticking apparatus for wafers concerning this invention. The figure which showed the state when the vacuum valves A and B were made into the vacuum side. The figure which showed the state when the vacuum valve A was made into the atmosphere side and the vacuum valve B was made into the vacuum side. Sectional drawing of the jig for sticking. The top view of the jig for sticking. Sectional drawing of the dicing frame 1 and the frame stand 14. FIG. The top view of the dicing frame 1 and the frame stand 14. FIG. The figure which showed the structure of the vacuum tape sticking apparatus for wafers using the conventional roller. A vacuum tape applicator described in Japanese Patent Application No. 2003-188822.

Explanation of symbols

1 Dicing tape 2 Wafer 3 Rubber sheet 4 Upper lid 5 Airtight space B
6 Airtight space C
7 Vacuum opening B
8 Vacuum valve B
9 Ring B
10 Airtight space A
11 Vacuum opening A
12 Vacuum valve A
13 Dicing frame 14 Affixing jig 15 Base 16 Plate 17 Support pin 18 Alignment pin 19 Circuit 20 Frame support pin 21 Frame alignment pin 22 Frame base 23 Ring A

Claims (3)

A base, an upper lid that is placed over the base and forms an airtight space with the base, and the airtight space is divided into an airtight space A on the base side and an airtight space B on the upper lid side. An elastic sheet of an elastic body for placing a partition and a part for attaching a tape to the airtight space B side, a sticking jig placed on the elastic sheet and supporting the wafer away from the elastic sheet, and the airtight space A vacuum tape sticking device for a wafer, comprising first and second vacuum pumps for changing the internal pressures of A and hermetic space B, respectively. The affixing jig includes a plate placed on the elastic sheet, a plurality of support pins provided on the plate and supported in contact with an outer peripheral portion of the wafer, and a wafer supported by the support pins. 2. The vacuum tape attaching apparatus for a wafer according to claim 1, further comprising an alignment pin for positioning at a center portion of the sheet. 3. The wafer vacuum tape attaching apparatus according to claim 1, wherein the elastic sheet is any one of ethylene propylene rubber, butyl rubber, fluorine rubber, silicon rubber, and neoprene rubber.

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