JP2004153159A - Protection member adhering method for semiconductor wafer and its device - Google Patents

Protection member adhering method for semiconductor wafer and its device Download PDF

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Publication number
JP2004153159A
JP2004153159A JP2002318647A JP2002318647A JP2004153159A JP 2004153159 A JP2004153159 A JP 2004153159A JP 2002318647 A JP2002318647 A JP 2002318647A JP 2002318647 A JP2002318647 A JP 2002318647A JP 2004153159 A JP2004153159 A JP 2004153159A
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Japan
Prior art keywords
semiconductor wafer
protection
wafer
pressure
film
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2002318647A
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Japanese (ja)
Inventor
Takashi Furuya
Hiroshi Matsuzaka
Takashi Sato
孝志 佐藤
貴史 古屋
浩志 松坂
Original Assignee
Enzan Seisakusho:Kk
株式曾社塩山製作所
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Application filed by Enzan Seisakusho:Kk, 株式曾社塩山製作所 filed Critical Enzan Seisakusho:Kk
Priority to JP2002318647A priority Critical patent/JP2004153159A/en
Publication of JP2004153159A publication Critical patent/JP2004153159A/en
Pending legal-status Critical Current

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Abstract

<P>PROBLEM TO BE SOLVED: To provide a protecting member adhering method of a semiconductor wafer for reducing any load or damage to be imposed on the semiconductor wafer, and for adhering an easily treatable protecting member to a semiconductor wafer in a wafer process such as back-grinding or dicing. <P>SOLUTION: This system is provided with a wafer supporting stand 14 on which a wafer 11 and a glass substrate 15 are placed, a lower chamber 22 forming a first air-tight space 24 in which the wafer supporting stand 14 is arranged, a pressurizing film body 26 forming a second air-tight space 25 and a pressure reducing means for generating a differential pressure between the first air-tight space 24 and the second air-tight space 25. Then, the pressurizing film body 26 is bent and deformed by using the differential pressure between the first air-tight space 24 and the second air-tight space 25 whose pressures are reduced by the pressure reducing means, and at least either the wafer 11 or the glass substrate 15 placed on the wafer supporting stand 14 is pressurized by the pressurizing film body 26, and the wafer 11 and the glass substrate 15 are fixed through an adhesive. <P>COPYRIGHT: (C)2004,JPO

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a method and an apparatus for attaching a protection member for a semiconductor wafer for attaching a protection member for protecting and reinforcing a circuit forming surface of a semiconductor wafer in a wafer process such as back grinding and dicing.
[0002]
[Prior art]
When a semiconductor wafer is thinly ground or divided from a single semiconductor wafer into a plurality of semiconductor chips, a surface on which electronic circuits are not formed is mechanically ground on the semiconductor wafer. Is performed through a back-grinding process of thinning the semiconductor wafer and a dicing process of cutting the semiconductor wafer along the dividing line. In each of these steps, in order to reduce the load applied to the semiconductor wafer or to prevent breakage, etc., a protective member (adhesive sheet) is provided on the electronic circuit forming surface in the back grinding step and on the back side of the electronic circuit forming surface in the dicing step. ) Is attached. This pressure-sensitive adhesive sheet is obtained by applying a so-called UV-curable pressure-sensitive adhesive in which a crosslinking reaction proceeds by irradiation of ultraviolet light onto a heat-shrinkable plastic film such as polyethylene terephthalate or polyolefin. Thereby, the adhesive strength of the adhesive sheet can be easily reduced.
[0003]
By the way, when the adhesive sheet is adhered to the semiconductor wafer surface in the back grinding step and the dicing step, the semiconductor wafer 2 is placed on the table 1 in the air as shown in FIG. On the other hand, there is known a method in which an adhesive sheet 3 is spread over the vicinity of the semiconductor wafer 2 in an inclined state, and is adhered to the upper surface of the semiconductor wafer 2 while pressing the adhesive sheet 3 with a rolling roller 4. . Similarly, in a case where an adhesive sheet is attached to an uneven surface on which an electronic circuit is formed, such as in a back grinding process, the semiconductor wafer is kept parallel to the adhesive sheet that has been stretched, and the adhesive sheet is held in place. There is known a method in which a semiconductor wafer is brought close to a parallel state in an inclined state, and the pressure-sensitive adhesive sheet is adhered to the entire uneven surface of the semiconductor wafer 2 while being pressed by a rolling roller.
[0004]
[Problems to be solved by the invention]
However, in the method of attaching the pressure-sensitive adhesive sheet 3 to the semiconductor wafer 2 in the air as described above, air is involved in the bonding and the bonding is performed in a state where air bubbles are generated on the bonding surface. There are cases. As a result, when ultraviolet light is irradiated after the back grinding process or the dicing process, the curing due to the crosslinking reaction is inhibited due to the air trapped in the bubbles, and the adhesive strength is not reduced, and the adhesive is not adhered at the peripheral portion of the bubbles. As a result, the agent remains, and the debris of the adhesive sheet 3 remains attached to the semiconductor wafer 2. For this reason, there has been a problem that workability at the time of peeling the pressure-sensitive adhesive sheet 3 is reduced, and that since the organic pressure-sensitive adhesive remains on the semiconductor wafer 2, product reliability is also lowered.
[0005]
Further, in recent years, semiconductor wafers are often processed and formed thinly in accordance with demands for improvement in electrical characteristics of semiconductor chips and reduction in size and thickness. For this reason, in a wafer process such as a back grinding step, the back surface may be thinly ground until the thickness of the semiconductor wafer 2 becomes 100 μm or less, or even 50 μm or less. As described above, as the semiconductor wafer 2 is thinned, the strength of the semiconductor wafer 2 itself may be reduced and the semiconductor wafer 2 may be damaged, which may cause a reduction in product yield. Further, as the semiconductor wafer 2 becomes thinner, the stability during processing becomes worse. For this reason, the semiconductor wafer is deviated from the processing position or floats up, causing a variation in the thickness of the semiconductor wafer after the back grinding process.
[0006]
Accordingly, a first object of the present invention is to reduce the load and damage applied to a semiconductor wafer in a wafer process such as back grinding and dicing, and to attach a protective member that can be easily handled to the semiconductor wafer. An object of the present invention is to provide a method for attaching a protective member to a wafer.
[0007]
A second object of the present invention is to provide an apparatus for attaching a protective member for a semiconductor wafer, which is capable of suppressing the generation of air bubbles when the rigid protective member is attached to the semiconductor wafer and capable of tightly joining the semiconductor wafer. is there.
[0008]
[Means for Solving the Problems]
In order to solve the above-mentioned problems, a method for attaching a protective member to a semiconductor wafer according to the present invention includes a method of attaching a semiconductor wafer to one of a first hermetic space and a second hermetic space partitioned by a flexible pressing film body. A protective member fixed to the semiconductor wafer via an adhesive is superposed on the semiconductor wafer, and the pressure film is bent and deformed by utilizing a pressure difference between the first hermetic space and the second hermetic space. At least one of the wafer and the protection member is pressed by the pressing film to fix the semiconductor wafer and the protection member.
[0009]
According to the present invention, when the protection member is fixed to the semiconductor wafer, one of the semiconductor wafer or the protection member that is disposed so as to overlap in one of the first hermetic space and the second hermetic space is used. It is pressed by the bending deformation of the pressing film body forming the other airtight space. Further, since the pressing film body bends and deforms by utilizing a pressure difference between the first hermetic space and the second hermetic space, the protective member can be fixed without applying an excessive force to the semiconductor wafer. . Further, according to this attaching method, it is possible to attach even a hard protective member such as quartz glass.
[0010]
As a method of generating a pressure difference between the first hermetic space and the second hermetic space, it is possible to easily deform the pressing film body by decompressing both the hermetic spaces and changing the decompression ratio. it can. Particularly, in the process of processing a semiconductor wafer, the process is often performed under a constant reduced pressure, so that the adjustment of the reduced pressure and the ratio thereof is easy. Further, by fixing the semiconductor wafer and the protection member under a constant reduced pressure, contamination of impurities at the time of fixing can be minimized.
[0011]
Further, when pressing at least one of the semiconductor wafer and the protection member with the pressing film body, the other of the semiconductor wafer and the protection member that does not come into contact with the pressing film body is brought closer to the pressing film body, so that the semiconductor is pressed. The adhesion between the wafer and the protection member can be improved.
[0012]
The semiconductor wafer and the protective member are fixed via an adhesive, but when the semiconductor wafer and the protective member are fixed by bending deformation of the pressing film body, the adhesive applied between the semiconductor wafer and the protective member. By heating and melting the agent, the pressure-sensitive adhesive spreads, and the adhesion efficiency can be increased.
[0013]
The apparatus for attaching a protective member for a semiconductor wafer according to the present invention includes a support for mounting the semiconductor wafer and the protective member, a chamber forming a first hermetic space in which the support is disposed, And a pressure reducing means for generating a pressure difference between the first airtight space and the second airtight space, wherein the first airtight space is depressurized by the pressure reducing means. The pressure film body is bent and deformed by utilizing a pressure difference between the semiconductor wafer and the second hermetic space, and at least one of the semiconductor wafer mounted on the support table and the protection member is pressed by the pressure film body. And the protective member are fixed via an adhesive.
[0014]
According to the apparatus for attaching a protective member to a semiconductor wafer of the present invention, since the pressurized film body which is hermetically sealed is disposed in a chamber provided with a support for performing various processes of the semiconductor wafer, By adjusting the amount of reduced pressure in the body, a differential pressure between the inside of the chamber and the pressure can be easily generated. Further, the pressure film body is configured to be movable toward the support table on which the semiconductor wafer and the protection member are placed, so that the semiconductor wafer and the protection member can be combined with a bending effect of the pressure film body. Can be further improved.
[0015]
The device for attaching a protective member to a semiconductor wafer according to the present invention may further include a chamber in which a partition partitioning the first hermetic space and the second hermetic space is formed by a flexible pressing film body; A supporting table for mounting the semiconductor wafer and the protection member disposed on one side; and a decompression unit for generating a pressure difference between the first hermetic space and the second hermetic space. The pressure film body is bent and deformed by utilizing a pressure difference between the first airtight space and the second airtight space to be decompressed, and at least one of the semiconductor wafer and the protection member mounted on the support base is pressed by the pressure film. By pressing with a body, the semiconductor wafer and the protective member are fixed via an adhesive.
[0016]
According to the present invention, since the partition partitioning the inside of one chamber into the first hermetic space and the second hermetic space is formed by the flexible pressing film body, the first hermetic space and the second hermetic space are formed. By adjusting the pressure reduction ratio of the hermetic space 2, the pressing film body can be easily bent and deformed, and the semiconductor wafer and the protective member disposed in one hermetic space can be pressed and fixed.
[0017]
Further, when the lifting device is provided on the support table, the semiconductor wafer and the protection member mounted on the support table are pushed out toward the pressing film body, and the semiconductor wafer and the semiconductor wafer are moved along the deforming pressing film body. The protective member can be brought into close contact with no gap. In addition, since the bonding is performed from the center portion to the peripheral portion of the semiconductor wafer, the bonding can be performed gradually so that air bubbles are not generated at the bonding portion.
[0018]
When the pressing film body is formed of a silicone resin, it can be quickly expanded and contracted in accordance with the reduced pressure in the hermetic space partitioned by the pressing film body, so that the semiconductor wafer and the protection member can be fixed in a short time. Further, since the airtightness is high, the amount of reduced pressure can be kept constant.
[0019]
When the semiconductor wafer and the protection member are fixed by the pressing film body, by heating at least one of the semiconductor wafer and the protection member by the heating device provided on the support base, the adhesive interposed between the two is heated. Can be melted. By melting the pressure-sensitive adhesive in this manner, the bonding surface is widened, and the semiconductor wafer and the protection member can be fixed without any gap.
[0020]
By using quartz glass for the protective member to be adhered to the semiconductor wafer, the semiconductor wafer surface can be protected from scratches and breakage even when a relatively large load such as back grinding or dicing is performed on the semiconductor wafer. Is done. Further, even if the semiconductor wafer is thinned, the quartz glass has a certain thickness and strength, so that it can be easily handled when transferred manually or automatically to another wafer process.
[0021]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, a method for attaching a protective member to a semiconductor wafer according to the present invention and an apparatus for implementing the method will be described with reference to the accompanying drawings. FIG. 1 is a process diagram showing a method of attaching a protective member to a semiconductor wafer, and FIGS. 2 to 4 are cross-sectional views showing a configuration of a first embodiment of an attaching device for realizing the attaching method. .
[0022]
Semiconductor wafers (hereinafter simply referred to as wafers) placed in various wafer processes such as back grinding and dicing are protected by a protective member such as a glass substrate having a certain strength for the purpose of protecting the surface and reinforcing the wafer. Be worn. This sticking is performed by applying an adhesive between the wafer surface and the protective member surface and pressing them both. The characteristic feature of the present invention is that the pressure of the wafer or the protective member is reduced by a pressure difference. This is performed by using a pressing film body formed of a resin material such as silicone which bends and deforms using the above method. Thereby, the protection member can be fixed without applying a large load to the wafer, and the effect of improving the adhesion can be obtained. The pressure film body uses a pressure difference for the bending deformation, and the pressure difference is applied by applying a pressure reducing means (a vacuum pump or the like) for creating an environment for performing a wafer process.
[0023]
Hereinafter, an example of the step of attaching the wafer and the protection member will be described with reference to FIG. Prior to bonding the wafer and the protection member, the support substrate 17 is bonded to the protection member (glass substrate 15) to which the wafer 11 is bonded via an adhesive or the like (step a). The support substrate 17 is for supporting the wafer adhered to the glass substrate 15 in various kinds of processing devices and for facilitating handling when shifting to each process. It is formed of a plate-shaped metal plate or the like wider than the glass substrate 15 so as not to have any. The glass substrate 15 is made of quartz glass having substantially the same shape and diameter as the wafer to be attached. The thickness of the glass substrate 15 is preferably 500 μm or more if the wafer 11 is formed to have a thickness of about 100 μm in order to reinforce a thinly ground wafer. . Next, the support substrate 17 is positioned and set so that the glass substrate 15 faces the surface of the wafer 11 placed on the wafer support 14 (step b). The wafer 11 is uniformly coated with a thermosetting adhesive beforehand on the circuit forming surface 12 and is fixed to the wafer support 14 with the circuit forming surface 12 facing upward. At this time, in order to increase the adhesiveness, the wafer support table 14 is heated to keep the adhesive in a molten state. A pressing load is applied to the center of the supporting substrate 17 due to a bending deformation using a differential pressure applied to the pressing film body 19 disposed above the supporting substrate 17, and the wafer 11 placed below is pressed. In this state, the wafer 11 is attached to the glass substrate 15 (step c). Further, the protection member support base 18 supporting the outer peripheral portion of the support substrate 17 is lifted substantially simultaneously with the pressing operation of the pressing film body 19, so that the wafer 11 is gradually fixed from the central portion to the outer peripheral portion. To go. As described above, air and air bubbles accumulated on the bonding surface in the process of moving from the central portion to the outer peripheral portion of the wafer 11 can escape from the outer peripheral portion of the wafer 11, and the adhesion between the wafer 11 and the glass substrate 15 can be further improved. Can be.
[0024]
FIGS. 2 to 4 show the configuration of an attaching device 21 for attaching the glass substrate 15 to the wafer 11 according to the attaching method shown in FIG. The bonding apparatus 21 includes a lower chamber 22 and an upper chamber 23 whose interiors are widely recessed, and the bonding operation between the wafer 11 and the glass substrate 15 closes the lower chamber 22 and the upper chamber 23. This is performed in the first closed space 24. Further, a pressing film body 26 having a second airtight space 25 is disposed in the first airtight space 24, and a pressing film 27 provided in the pressing film body 26 is placed in the lower chamber 22. By applying a pressing force to the placed supporting substrate 17, the protection member 15 is attached to the wafer 11.
[0025]
The lower chamber 22 is provided with a pedestal 28 on the bottom surface, a cylindrical wafer support 14 at the center of the pedestal 28, and a ring-shaped protection member support 18 around the wafer support 14. ing. The wafer support 14 is formed of a metal body such as copper having a high thermal conductivity, and has a heater for heating inside. The protection member support base 18 is supported by the base 28 via an elastic member 29 such as a spring. The base 28 is supported by a cylinder 30 projecting from the bottom surface of the lower chamber 22 so as to be able to move up and down. Further, the lower chamber 22 is provided with an exhaust hole 31 for performing evacuation, and the pressure is reduced by the vacuum pump 32 from the exhaust hole 31 so that the decompression environment when performing the attaching operation is within the first hermetic space 24. Made.
[0026]
The pressing film body 26 has a disk-shaped top plate 33 having an area covering the support substrate 17, a pressing film 27 covering the lower surface of the top plate 33, and protruding from the ceiling of the upper chamber 23. And a second airtight space 25 hermetically sealed by the top plate 33 and the pressing film 27, and a tip of an exhaust hole 35 provided inside the elevating mechanism 34. The pressure in the second hermetic space 25 is reduced through a vacuum pump 36 which leads to the following.
[0027]
By bringing the lower chamber 22 and the upper chamber 23 into close contact with each other via a vacuum seal material 37 such as an O-ring or packing, the amount of reduced pressure in each hermetic space during vacuum evacuation can be kept constant. In the sticking device 21 of the present embodiment, the first hermetic space 24 and the second hermetic space 25 are depressurized by independent vacuum pumps 32 and 36, but may be switched by a single vacuum pump to depressurize. It is also possible to perform the operation by depressurizing only one of the first hermetic space 24 and the second hermetic space 25. Note that, in addition to the above-described constituent members, the attaching device 21 includes a heating device (not shown), a control device that manages and controls the temperature of the wafer support 14 and the amount of reduced pressure in the first hermetic space 24 and the second hermetic space 25. Kind is provided.
[0028]
Next, a specific example of the wafer sticking process using the sticking device 21 will be described with reference to FIGS. In the present embodiment, a silicon wafer 11 having a diameter of 6 inches and a thickness of 625 μm is used. The glass substrate 15 to be bonded to the wafer 11 is made of quartz glass having a diameter of 6.1 inches larger than the wafer 11 and a thickness of 1000 μm, and is mounted on the support substrate 17 as shown in FIG. It is transported in a state where
[0029]
First, as shown in FIG. 2, the upper chamber 23 is raised, and the wafer 11 coated with the adhesive is placed on the center of the wafer support 14. Next, after positioning the edge portion of the support substrate 17 to which the glass substrate 15 has been adhered on the protective member support base 18 and placing it thereon, as shown in FIG. State. Subsequently, the wafer support 14 is heated at a predetermined temperature to melt and activate the adhesive applied to the surface of the wafer 11. The heating temperature at this time varies depending on the type and application amount of the pressure-sensitive adhesive, but is generally set between 80 and 100 ° C. When the wafer support 14 is heated to the set temperature, the pressing film body 26 is gently lowered to lightly contact the pressing film 27 with the supporting substrate 17. In this state, the first hermetic space 24 and the second hermetic space 25 are evacuated and decompressed by the vacuum pumps 32 and 36. The amount of pressure reduction at this time is controlled so that the first hermetic space 24 gradually becomes higher than the second hermetic space 25. By controlling the amount of reduced pressure, as shown in FIG. 3, the pressing film 27 provided on the pressing film body 26 starts to expand from the central portion, and the upper surface of the glass substrate 15 supported by the protection member support 18. Pressing is started from the center. Further, the pedestal 28 is slightly raised by the cylinder 30 simultaneously with the evacuation of the first hermetic space 24 and the second hermetic space 25. By this lifting operation, the center of the support substrate 17 is pressed by the pressing film 27, and the peripheral edge of the support substrate 17 is bent and deformed along the curved surface of the pressing film 27. Due to the bending deformation of the support substrate 17, the wafer 11 and the glass substrate 15 are gradually closely adhered from the center to the periphery. After maintaining this state for a predetermined time, as shown in FIG. 4, the evacuation of the first hermetic space 24 is stopped, and the pressure is returned to approximately the same level as the reduced pressure amount of the second hermetic space 25. The expansion of the pressing film 27 stops, and the force pressing the surface of the support substrate 17 is released. Then, the first hermetic space 24 and the second hermetic space 25 are returned to normal atmospheric pressure. Finally, the upper chamber 23 is opened, the support substrate 17 on which the wafer 11 is adhered is taken out, and the process proceeds to the next wafer processing step such as a back grinding step.
[0030]
Next, a second embodiment of the sticking device will be described with reference to FIGS. The sticking device 41 sticks the wafer 11 and the protection member 15 set in the lower chamber 42 by bending deformation of a flexible partition 47 that partitions an airtight space sealed by the lower chamber 42 and the upper chamber 43. It has a structure to wear. FIGS. 5 and 6 show that the partition wall 47 is provided on the upper chamber 43 side. As shown in FIG. 6, the lower chamber 42 and the upper chamber 43 are hermetically sealed via a vacuum seal material 37 so that the lower chamber 47 is closed. The chamber 42 side is a first hermetic space 44, and the upper chamber 43 side is a second hermetic space 45.
[0031]
In the upper chamber 43, a flexible partition wall 47 made of silicone resin is provided on a concave opening surface, and an exhaust hole 49 for evacuating is provided. The upper chamber 43 is brought into close contact with the lower chamber 42 when performing the attaching operation, and is evacuated by the vacuum pump 36 from the exhaust hole 49. This creates a depressurized hermetic space. In the sticking device 41 having such a configuration, the partition 47 is flexibly deformed and overlapped by adjusting the amount of pressure reduction in the first hermetic space 44 and the second hermetic space 45 partitioned by the partition 47. By pressing one of the wafer 11 and the protection member 15, the wafer 11 and the protection member 15 can be fixed. In addition, the structure of the lower chamber 42 and the configuration of the control devices provided outside the attaching device 41 are the same as those of the attaching device 21 of the first embodiment. It is also possible to switch between the hermetic space 44 and the second hermetic space 45 with a single vacuum pump to perform a depressurizing operation, or to reduce the pressure in only one of the hermetic spaces.
[0032]
According to the adhering devices 21 and 41 of the first and second embodiments, the glass substrate 15 is pressed against the wafer 11 by bending deformation accompanying expansion of the flexible pressing film 27 or the partition wall 47. Therefore, no excessive force is applied to the wafer 11 and the wafer 11 can be securely and safely attached without damaging the surface. In addition, since the protection member support 18 rises with the expansion of the pressing film 27 and the partition wall 47, the wafer 11 and the glass substrate 15 are adhered while being gradually curved from the center to the peripheral edge of the wafer 11. Air bubbles are less likely to be generated on the surface to be adhered. Further, since all the attaching operations are performed under reduced pressure by evacuation, intrusion of impurities such as minute dust and dust can be prevented.
[0033]
As described above, since impurities such as bubbles do not enter the bonding surface between the wafer 11 and the glass substrate 15, the operation of peeling the glass substrate 15 after the wafer process such as back grinding is completed can be easily performed.
[0034]
The sticking apparatuses 21 and 41 in the above-described embodiment are configured such that an operator manually sets and removes the wafer 11 and the support substrate 17 one by one. You can also. For example, a loading unit including a cassette in which a plurality of wafers and frames are loaded around the attaching devices 21 and 41, a cassette in which a frame in which the wafer attaching process has been completed is loaded, and the wafer and the frame are transferred from the loading device. By arranging the transfer means by the transfer arm that is carried into and out of the vacuum chamber, it is possible to perform the sticking operation in a clean environment without manual intervention.
[0035]
In the above embodiment, a GaAs wafer is used. However, in addition to such GaAs, the present invention can be applied to a wafer made of an oxide such as silicon, selenium, and germanium. If the vacuum chamber 21 is enlarged, It is possible to cope with a large-diameter wafer having a diameter of 8 inches or more by the same attaching method and apparatus configuration.
[0036]
In the present embodiment, quartz glass is used for the protective member on the assumption that the wafer 11 is ground very thinly. However, a material having similar strength and thickness is not limited to such quartz glass. For example, metal or silicon can be used without any problem. Further, the sticking method and apparatus of the present invention can be used even for a conventional wafer having a general thickness. With such a relatively thick wafer, the wafer can be directly adhered to the adhesive tape surface of the frame without using a protective member.
[0037]
【The invention's effect】
As described above, according to the method for attaching a protective member to a semiconductor wafer according to the present invention, when the protective member is pressed against and bonded to the semiconductor wafer, the superposed semiconductor wafer and the protective member are made to be flexible. Since the pressing is performed by the expansion of the pressing film, the semiconductor wafer can be pressed and joined without applying an excessive force. Further, by adjusting the amount of reduced pressure in the hermetic space partitioned by the pressing film or the partition, it is possible to easily generate a differential pressure and adjust the pressing force.
[0038]
Further, according to the apparatus for attaching a protective member to a semiconductor wafer according to the present invention, each airtight space partitioned by a flexible pressing film or a partition is depressurized by a predetermined amount by a vacuum pump, and the depressurization ratio is changed. By doing so, the expansion coefficient of the pressing film can be controlled, and the semiconductor wafer and the protective member can be pressed and joined.
[0039]
Further, the method and apparatus for attaching a protective member to a semiconductor wafer according to the present invention are applicable to various materials having different thicknesses and shapes, from a thick quartz glass to an adhesive tape.
[Brief description of the drawings]
FIG. 1 is a process chart showing a method for attaching a protective member to a semiconductor wafer according to the present invention.
FIG. 2 is a sectional view showing a first embodiment of a semiconductor wafer protective member sticking apparatus according to the present invention.
FIG. 3 is a cross-sectional view showing a pressing operation state of the semiconductor wafer by the protective member attaching device.
FIG. 4 is a cross-sectional view illustrating a state where the pressing operation of the semiconductor wafer by the protective member attaching device is completed.
FIG. 5 is a sectional view showing a second embodiment of the semiconductor wafer protective member sticking apparatus according to the present invention.
FIG. 6 is a cross-sectional view illustrating a pressing operation state of the semiconductor wafer by the protective member attaching device.
FIG. 7 is an explanatory view showing a conventional method of attaching a protective member to a semiconductor wafer.
[Explanation of symbols]
11 Wafer (semiconductor wafer)
14 Wafer support 15 Glass substrate (protective member)
17 Support Substrates 21, 41 Adhering Devices 22, 42 Lower Chambers 23, 43 Upper Chambers 24, 44 First Hermetic Space 25, 45 Second Hermetic Space 26 Press Film 27 Press Film 47 Partition

Claims (11)

  1. A semiconductor wafer and a protection member fixed to the semiconductor wafer via an adhesive are superposed and arranged on one of the first hermetic space and the second hermetic space partitioned by a flexible pressing film body; The pressure film body is flexed and deformed by utilizing a pressure difference between the first airtight space and the second airtight space, and at least one of the semiconductor wafer and the protection member is pressed by the pressure film body to form the semiconductor wafer and the protection member. And a method of attaching a protective member to a semiconductor wafer.
  2. 2. The method according to claim 1, wherein the pressure difference between the first hermetic space and the second hermetic space is generated by a pressure reduction ratio between the first hermetic space and the second hermetic space. 3.
  3. 2. The pressure film according to claim 1, wherein when pressing at least one of the semiconductor wafer and the protection member with the pressure film, the other of the semiconductor wafer and the protection member not in contact with the pressure film is moved toward the pressure film. 3. A method for attaching a protective member to a semiconductor wafer.
  4. 2. The method according to claim 1, wherein, when the semiconductor wafer and the protection member are fixed to each other with a pressing film, an adhesive interposed between the semiconductor wafer and the protection member is heated and melted.
  5. A support for mounting the semiconductor wafer and the protection member, a chamber for forming the first hermetic space in which the support is provided, a pressing film for forming a second hermetic space, and the first hermetic seal; Pressure reducing means for generating a differential pressure between the space and the second hermetic space, wherein the pressure is reduced by utilizing a pressure difference between the first hermetic space and the second hermetic space which is decompressed by the depressurizing means. Protecting a semiconductor wafer by bending and deforming a film body and pressing at least one of the semiconductor wafer and the protection member placed on the support table with the pressing film body to fix the semiconductor wafer and the protection member via an adhesive. Member sticking device.
  6. 6. The apparatus according to claim 5, wherein the pressing film body is movable in a direction approaching or away from the support table.
  7. A chamber in which a partition partitioning the first hermetic space and the second hermetic space is formed by a flexible pressing film body; and a support for mounting a semiconductor wafer and a protection member disposed in one of the hermetic spaces. A table, and a pressure reducing means for generating a pressure difference between the first airtight space and the second airtight space, wherein the first airtight space and the second airtight space are decompressed by the pressure reducing means. The pressure film body is bent and deformed by using a differential pressure, and at least one of the semiconductor wafer and the protection member placed on the support table is pressed by the pressure film body to apply an adhesive to the semiconductor wafer and the protection member. A device for attaching a protective member to a semiconductor wafer, which is fixed through the device.
  8. 8. The device according to claim 5, wherein the support table includes an elevating device that approaches the pressing film body.
  9. 8. The apparatus according to claim 5, wherein the pressing film is formed of a silicone resin.
  10. 8. The device according to claim 5, wherein the support is provided with a heating device that melts an adhesive interposed between the semiconductor wafer and the protection member. 9.
  11. 8. The apparatus according to claim 5, wherein the protection member is quartz glass having substantially the same diameter as the semiconductor wafer.
JP2002318647A 2002-10-31 2002-10-31 Protection member adhering method for semiconductor wafer and its device Pending JP2004153159A (en)

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