TWI466224B - Substrate lamination device - Google Patents
Substrate lamination device Download PDFInfo
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- TWI466224B TWI466224B TW098112223A TW98112223A TWI466224B TW I466224 B TWI466224 B TW I466224B TW 098112223 A TW098112223 A TW 098112223A TW 98112223 A TW98112223 A TW 98112223A TW I466224 B TWI466224 B TW I466224B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
- B32B37/1009—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure using vacuum and fluid pressure
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/14—Semiconductor wafers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Fluid Mechanics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Description
本發明係關於基板貼合裝置，尤關於利用真空而進行晶圓與基板之貼合等的基板貼合裝置。 The present invention relates to a substrate bonding apparatus, and more particularly to a substrate bonding apparatus that performs bonding of a wafer and a substrate by vacuum.
近年來，隨著個人電腦等電子設備之薄型化及小型化，半導體晶圓(以下適當簡稱「晶圓」)之薄型化及小型化正在進展。但是，經薄型化及小型化的半導體晶圓，強度並不足夠。因此，於晶圓之製造步驟，需要將玻璃板等基板貼合於晶圓，或將2片基板分別貼合在晶圓兩面，藉此補強晶圓。 In recent years, with the thinning and miniaturization of electronic devices such as personal computers, thinning and miniaturization of semiconductor wafers (hereinafter referred to as "wafers" as appropriate) are progressing. However, semiconductor wafers that are thinned and miniaturized are not strong enough. Therefore, in the manufacturing step of the wafer, it is necessary to bond the substrate such as a glass plate to the wafer, or to bond the two substrates to both surfaces of the wafer to reinforce the wafer.
進行如此種補強之前步驟，例如，於專利文獻1提出一種晶圓用真空貼帶貼附裝置，係於晶圓表面貼附切割膠帶(雙面黏貼帶)。該晶圓用真空貼帶貼附裝置，由基台、上蓋、彈性片、貼附用治具，及第1及第2真空泵浦所構成。上蓋係被覆於基台上方而在與基台之間形成氣密空間。彈性片為彈性體，將氣密空間區隔為基台側之第1氣密空間及上蓋側之第2氣密空間，並於第2氣密空間側載置貼附貼帶之構件。貼附用治具載置於彈性片，將晶圓從彈性片分離而支持。第1及第2真空泵浦，分別調整第1及第2氣密空間之內部氣壓。 In the pre-reinforcing step, for example, Patent Document 1 proposes a vacuum tape attaching device for a wafer to which a dicing tape (double-sided adhesive tape) is attached. The wafer uses a vacuum tape attaching device, and is composed of a base, an upper cover, an elastic piece, a jig for attaching, and first and second vacuum pumps. The upper cover is overlaid on the base to form an airtight space with the base. The elastic piece is an elastic body, and the airtight space is partitioned into a first airtight space on the base side and a second airtight space on the upper cover side, and the member to which the tape is attached is placed on the second airtight space side. The attached jig is placed on the elastic piece to support the separation of the wafer from the elastic piece. The first and second vacuum pumps respectively adjust the internal air pressures of the first and second airtight spaces.
專利文獻2中提出將基板貼合於晶圓並補強之基板貼合方法。該基板貼合方法包含3個步驟。第1步驟，係使用上述專利文獻1記載之貼附裝置等，將雙面黏貼帶貼附於晶圓頂面之步驟。第2步驟，係將基板貼附於黏接力弱於該雙面黏貼帶之支持片之黏接面，將該基板隔著間隙配置在與晶圓相面對的位置。第3步驟，係於減壓狀態，將貼附機構推壓於支持片之被黏接面，同時將基板貼附於晶圓上所貼附之雙面黏貼帶。 Patent Document 2 proposes a substrate bonding method in which a substrate is bonded to a wafer and reinforced. The substrate bonding method comprises three steps. In the first step, the double-sided adhesive tape is attached to the top surface of the wafer by using the attaching device described in Patent Document 1 or the like. In the second step, the substrate is attached to the bonding surface of the supporting sheet of the double-sided adhesive tape, and the substrate is placed at a position facing the wafer with a gap therebetween. In the third step, the adhesive mechanism is pressed against the adhered surface of the support sheet, and the substrate is attached to the double-sided adhesive tape attached to the wafer.
【專利文獻1】日本特開2006-310338號公報 [Patent Document 1] Japanese Patent Laid-Open Publication No. 2006-310338
【專利文獻2】日本特開2006-222267號公報 [Patent Document 2] Japanese Patent Laid-Open Publication No. 2006-222267
但是，上述專利文獻2記載之基板貼合方法中，於將基板隔著間隙配置在與晶圓相面對之位置的步驟，作業者極難以將基板貼附在支持片之定位置，無法使晶圓與基板的貼合位置保持一定。 However, in the substrate bonding method described in Patent Document 2, in the step of placing the substrate at a position facing the wafer with a gap therebetween, it is extremely difficult for the operator to attach the substrate to the fixed position of the support sheet, and it is impossible to make the substrate The bonding position of the wafer and the substrate is kept constant.
又，由於支持片之張力、基板與晶圓之間隙及支持片之黏接面的黏接力，基板與晶圓之貼合位置會有變化之虞。又，藉由從黏接面貼附有基板之支持片上以輥推壓，進行基板與晶圓之貼合，因此，對於基板施加應力，基板會有破損之虞。 Moreover, due to the tension of the support sheet, the gap between the substrate and the wafer, and the adhesion of the bonding surface of the support sheet, the bonding position between the substrate and the wafer may vary. Further, by bonding the substrate to the wafer by pressing the support sheet attached to the substrate from the bonding surface, stress is applied to the substrate, and the substrate is damaged.
又，由於支持貼帶之高度係預先設定，因此，貼合之晶圓及基板片數有受限的問題，尚有改善的空間。又，將晶圓與較晶圓直徑更小的基板貼合時，由於在晶圓會殘留未與基板貼合之雙面黏貼帶，因此會有使產品品質惡化的問題。 Moreover, since the height of the support tape is set in advance, there is a problem that the number of bonded wafers and the number of substrates is limited, and there is still room for improvement. Further, when the wafer is bonded to a substrate having a smaller wafer diameter, the double-sided adhesive tape that is not bonded to the substrate remains in the wafer, which may cause deterioration in product quality.
本發明係有鑑於上述關連技術中的問題而生，目的在於提供一種基板貼合裝置，能保持晶圓與基板等之貼合位置為一定，同時基板無破損之虞，作業效率良好。 The present invention has been made in view of the above problems in the related art, and it is an object of the invention to provide a substrate bonding apparatus capable of maintaining a constant bonding position between a wafer and a substrate, and at the same time, the substrate is not damaged, and the work efficiency is good.
為達成上述目的，本發明之基板貼合裝置，包含：基台；上蓋，設置於前述基台之頂面側，在於前述基台之間形成氣密空間；彈性片，將前述氣密空間區隔為前述基台側之第1氣密空間及上蓋側之第2氣密空間；第1貼合用工模，載置於前述彈性片，使於頂面貼附有雙面黏貼帶之第1基板從前述彈性片分離，同時將前述第1基板於定位在前述彈性片之既定位置之狀態支持；第2貼合用工模，設置於前述第1基板之上方，使第2基板在與前述第1基板相面對的位置從前述第1基板分離並支持，並將前述第2基板定位於既定位置；氣壓調整機構，對於前述第1及第2氣密空間之各內部氣壓進行調整；利用前述氣壓調整機構，使前述第1氣密空間成為大氣壓，同時使前述第2氣密空間為真空壓，藉此使前述彈性片於上方彈性變形，將前述第1基板與前述第2基板隔著前述雙面黏貼帶貼合。 In order to achieve the above object, a substrate bonding apparatus of the present invention includes: a base; an upper cover disposed on a top surface side of the base, wherein an airtight space is formed between the bases; and an elastic piece, the airtight space area The first airtight space on the base side and the second airtight space on the upper cover side; the first bonding mold is placed on the elastic sheet, and the first surface of the double-sided adhesive tape is attached to the top surface. The substrate is separated from the elastic sheet, and the first substrate is supported in a state of being positioned at a predetermined position of the elastic sheet; and the second bonding mold is disposed above the first substrate to make the second substrate and the second substrate a position at which the substrate faces are separated from and supported by the first substrate, and the second substrate is positioned at a predetermined position; and the air pressure adjusting mechanism adjusts respective internal air pressures of the first and second airtight spaces; In the air pressure adjusting mechanism, the first airtight space is at atmospheric pressure, and the second airtight space is vacuum pressure, whereby the elastic piece is elastically deformed upward, and the first substrate and the second substrate are interposed therebetween. Double-sided adhesive Belt fit.
依照上述構成，可藉由第1貼合用工模將第1基板定位於既定位置，藉由第2貼合用工模將第2基板定位於既定位置，並於此狀態將第1基板與第2基板貼合。因此，能將第1基板與第2基板之貼合位置保持一定。又，由於能不以輥推壓而貼合基板，故基板不會有因為應力而破損之虞。 According to the above configuration, the first substrate can be positioned at a predetermined position by the first bonding tool, and the second substrate can be positioned at a predetermined position by the second bonding tool, and the first substrate and the second substrate can be positioned in this state. The substrate is bonded. Therefore, the bonding position of the first substrate and the second substrate can be kept constant. Further, since the substrate can be bonded without being pressed by the roller, the substrate does not break due to stress.
本發明之基板貼合裝置中，前述第1貼合用工模，亦可具有：載置於前述彈性片之板材；及配置於前述板材上，將前述第1基板定位於前述板材之既定位置的定位銷。 In the substrate bonding apparatus of the present invention, the first bonding mold may include: a plate member placed on the elastic sheet; and the plate member disposed on the plate member, and positioning the first substrate at a predetermined position of the plate member Locating pin.
由於上述構成，可能第1基板輕易定位在彈性片之既定位置。 Due to the above configuration, it is possible that the first substrate is easily positioned at a predetermined position of the elastic sheet.
本發明之基板貼合裝置中，前述第2貼合用工模也可包含：貫通孔，與前述第2基板以同形狀地穿設，將前述第2基板定位於既定位置；及支持構件，固定於前述第2貼合用工模之底面，用於支持插入於前述貫通孔之第2基板；前述第1貼合用工模也可具有與前述支持構件以同形狀穿設之孔。又，本發明之基板貼合裝置亦可包含板台，載置於前述彈性片，具有：貫通孔，與前述第1貼合用工模以同形狀地穿設，並將前述第1貼合用工模定位於前述彈性片之既定位置；及，定位機構，將前述第2貼合用工模定位，使得前述第2基板面對於前述第1基板成為既定位置關係。 In the substrate bonding apparatus of the present invention, the second bonding mold may include a through hole penetrating the second substrate in the same shape, positioning the second substrate at a predetermined position, and supporting members and fixing The bottom surface of the second bonding mold is for supporting the second substrate inserted into the through hole, and the first bonding mold may have a hole that is formed in the same shape as the support member. Moreover, the substrate bonding apparatus of the present invention may further include a plate holder that is placed on the elastic piece, has a through hole, and is inserted in the same shape as the first bonding tool, and the first bonding work is performed. The mold is positioned at a predetermined position of the elastic sheet, and the positioning mechanism positions the second bonding mold such that the second substrate surface has a predetermined positional relationship with respect to the first substrate.
藉由上述構成，第2基板可以不利用如關連技術之支持片支持，而能在與第1基板相面對之位置使第1基板分離，同時將第2基板定位於既定位置並且支持。因此，基板之貼合位置沒有變化之虞。又，能定位為使第2基板相對於第1基板成既定之位置關係，並於此狀態支持第2貼合用工模。故，能更為確實保持基板之貼合位置為一定。又，藉由調整第1貼合用工模與第2貼合用工模之間隔，能貼合所望片數的基板。 According to the above configuration, the second substrate can be separated from the first substrate without being supported by the support sheet of the related art, and the second substrate can be positioned at a predetermined position and supported. Therefore, there is no change in the bonding position of the substrate. Further, the second substrate can be positioned to have a predetermined positional relationship with respect to the first substrate, and the second bonding mold can be supported in this state. Therefore, it is possible to more reliably maintain the bonding position of the substrate to be constant. Further, by adjusting the interval between the first bonding mold and the second bonding mold, it is possible to bond the desired number of substrates.
本發明之基板貼合裝置中，前述第1基板之頂面面積可小於前述第2基板之底面面積。 In the substrate bonding apparatus of the present invention, the top surface area of the first substrate may be smaller than the area of the bottom surface of the second substrate.
藉由上述構成，當第1基板與第2基板貼合後，藉由將雙面黏貼帶沿第1基板之頂面切下，能僅於第1基板與第2基板之貼 合面隔著雙面黏貼帶，能使產品品質不惡化。 According to the above configuration, after the first substrate and the second substrate are bonded together, the double-sided adhesive tape can be cut along the top surface of the first substrate, so that only the first substrate and the second substrate can be attached. The quality of the product is not deteriorated by the double-sided adhesive tape.
前述基板貼合裝置中，可以裝設：貼附用工模，取代前述第1貼合用工模，將基板從前述彈性片分離而支持，同時將前述基板定位於前述彈性片之既定位置並且支持；及支持構件，取代前述第2貼合用工模，使雙面黏貼帶在與前述基板相面對的位置從前述基板分離而支持；於裝設有前述貼附用工模及前述支持構件之狀態，藉由前述氣壓調整機構使前述第1氣密空間為大氣壓，並使前述第2氣密空間為真空壓，藉此，可使前述彈性片於上方彈性變形，於前述基板貼附前述雙面黏貼帶。 In the above-described substrate bonding apparatus, a bonding mold may be attached, and the substrate may be separated from the elastic sheet in place of the first bonding mold, and the substrate may be positioned at a predetermined position of the elastic sheet and supported; And the support member, in place of the second bonding mold, the double-sided adhesive tape is separated from the substrate at a position facing the substrate; and the attachment mold and the support member are mounted. The air pressure adjusting mechanism causes the first airtight space to be atmospheric pressure, and the second airtight space is vacuum pressure, whereby the elastic piece can be elastically deformed upward, and the double-sided adhesive is attached to the substrate. band.
利用上述構成，以1台該基板貼合裝置，能發揮關連技術之貼帶貼附裝置之功能，不需要分別設置貼帶貼合裝置，因此與設備成本之減低有關。 According to the above configuration, the single-layer substrate bonding apparatus can function as a tape attaching device of the related art, and it is not necessary to separately provide the tape bonding device, which is related to the reduction in equipment cost.
如以上，依照本發明，能將晶圓與基板等的貼合位置保持為一定，同時基板無破損之虞，能提供作業效率良好的基板貼合裝置。 As described above, according to the present invention, the bonding position of the wafer and the substrate can be kept constant, and the substrate can be provided without any damage, thereby providing a substrate bonding apparatus having excellent work efficiency.
對於本發明之實施形態參照圖式說明。本發明之實施形態之基板貼合裝置，也能發揮貼帶貼附裝置之功能。本發明之第1實施形態之基板貼合裝置，使用在晶圓貼附雙面黏貼帶(以下稱「貼帶」)之步驟。第2實施形態之基板貼合裝置，使用於貼合晶圓與基板之步驟。第3實施形態之基板貼合裝置，使用於第2實施形態之基板貼合裝置而貼合有基板之晶圓，再貼合1片基板而製造產品的步驟。關於上述實施形態之基板貼合裝置，分別說明。 Embodiments of the present invention will be described with reference to the drawings. The substrate bonding apparatus according to the embodiment of the present invention can also function as a tape attaching device. In the substrate bonding apparatus according to the first embodiment of the present invention, a step of attaching a double-sided adhesive tape (hereinafter referred to as "strip tape") to the wafer is used. The substrate bonding apparatus of the second embodiment is used for bonding a wafer and a substrate. In the substrate bonding apparatus of the third embodiment, the substrate bonding apparatus of the second embodiment is bonded to the wafer of the substrate, and the substrate is bonded to each other to produce a product. The substrate bonding apparatus of the above embodiment will be described separately.
圖1顯示本發明第1實施形態之基板貼合裝置。該基板貼合裝置1，用於貼附貼帶T於晶圓W之步驟。該基板貼合裝置1大別為基台2、上蓋3、橡膠片(彈性片)5、板台6、晶圓用工模7、貼帶支持構件8所構成。上蓋3，在與基台2之間形成氣密空間。 橡膠片5，將該氣密空間分隔為：基台2側之第1氣密空間9，及上蓋側之第2氣密空間10。板台6，將橡膠片5固定於基台2之中央部。晶圓用工模7利用板台6定位於橡膠片5之中央，並載置晶圓W。貼帶支持構件8，在與晶圓W相面對之位置，從晶圓W分離並支持貼帶T。 Fig. 1 shows a substrate bonding apparatus according to a first embodiment of the present invention. The substrate bonding apparatus 1 is for attaching the tape T to the wafer W. The substrate bonding apparatus 1 is mainly composed of a base 2, an upper cover 3, a rubber sheet (elastic sheet) 5, a pallet 6, a wafer mold 7, and a tape supporting member 8. The upper cover 3 forms an airtight space with the base 2. The rubber sheet 5 partitions the airtight space into a first airtight space 9 on the base 2 side and a second airtight space 10 on the upper cover side. The plate 6 fixes the rubber sheet 5 to the central portion of the base 2. The wafer mold 7 is positioned at the center of the rubber sheet 5 by the plate stage 6, and the wafer W is placed. The tape supporting member 8 separates and supports the tape T from the wafer W at a position facing the wafer W.
基台2與上蓋3經由O型環4而氣密的固定。於基台2，包含：配管開口2a、2b，用於經由未圖示之真空泵浦及真空弁，將第1氣密空間9及第2氣密空間10切換為大氣壓或真空壓。圖1、6~9、14及16中，箭號A之箭號方向，代表為了使第1氣密空間9或第2氣密空間10為真空壓，而從該等排出大氣之排氣方向。另一方面，箭號B之箭號方向，係為了使第1氣密空間9或第2氣密空間10為大氣壓，而從其吸引大氣之吸引方向。 The base 2 and the upper cover 3 are airtightly fixed via the O-ring 4. The base 2 includes piping openings 2a and 2b for switching the first airtight space 9 and the second airtight space 10 to atmospheric pressure or vacuum pressure via vacuum pumping and vacuum crucible (not shown). In Figs. 1, 6 to 9, 14 and 16, the arrow direction of the arrow A represents the exhaust direction from which the first airtight space 9 or the second airtight space 10 is subjected to vacuum pressure. . On the other hand, the direction of the arrow of the arrow B is to attract the atmosphere from the suction direction in order to make the first airtight space 9 or the second airtight space 10 atmospheric.
如圖1及圖2所示，橡膠片5固定於板台6之底面。於板台6，設置有：開口部(貫通孔)6a；多數支持銷6b，用於支持貼帶支持構件8；定位塊6c，用於將貼帶支持構件8定位於中央。圖1雖未顯示，但是係於夾持橡膠片5之狀態，將板台6以螺絲固定於基台2，將橡膠片5及板台6固定於基台2之中央部。 As shown in FIGS. 1 and 2, the rubber sheet 5 is fixed to the bottom surface of the pallet 6. The pallet 6 is provided with an opening (through hole) 6a, a plurality of support pins 6b for supporting the tape supporting member 8, and a positioning block 6c for positioning the tape supporting member 8 at the center. Although not shown in Fig. 1, in a state in which the rubber sheet 5 is held, the platen 6 is screwed to the base 2, and the rubber sheet 5 and the platen 6 are fixed to the central portion of the base 2.
如圖1、圖3A及圖3B所示，晶圓用工模7包含：板材7a及定位銷7b。板材7a與板台6之開口部6a以同形狀形成。定位銷7b由彈性體構成，於頂面經施加係防黏著處理之Tosical處理(注：Tosical為已註冊之商標名)，將晶圓(基板)W定位於板材7a之中央部。如圖4所示，利用板台6將板材7a定位於橡膠片5之中央部，定位成使得晶圓W、板材7a及橡膠片5之中心一致。 As shown in FIG. 1, FIG. 3A and FIG. 3B, the wafer mold 7 includes a plate member 7a and a positioning pin 7b. The plate member 7a and the opening portion 6a of the platen 6 are formed in the same shape. The positioning pin 7b is made of an elastic body, and is subjected to a Tosical treatment for preventing adhesion treatment on the top surface (Note: Tosical is a registered brand name), and the wafer (substrate) W is positioned at a central portion of the sheet material 7a. As shown in FIG. 4, the sheet material 7a is positioned by the plate table 6 at the central portion of the rubber sheet 5 so as to be aligned so that the centers of the wafer W, the sheet material 7a, and the rubber sheet 5 are aligned.
如圖1及圖5所示，貼帶支持構件8包含面積(開口)大於晶圓W之頂面的開口部8a。該貼帶支持構件8，係卡合於如圖1、圖2及圖4所示板台6之定位塊6b之狀態，載置於支持銷6c。 As shown in FIGS. 1 and 5, the tape supporting member 8 includes an opening portion 8a having an area (opening) larger than the top surface of the wafer W. The tape supporting member 8 is engaged with the positioning block 6b of the plate table 6 shown in Figs. 1, 2, and 4, and is placed on the support pin 6c.
其次，對於具上述構成之基板貼合裝置1之動作，參照圖式說明。 Next, the operation of the substrate bonding apparatus 1 having the above configuration will be described with reference to the drawings.
如圖6所示，經由未圖示之真空泵浦及真空弁，從配管開口2a、2b將大氣吸引到真空泵浦側，藉此將第1氣密空間9及第2 氣密空間10分別從大氣壓各切換為真空壓。 As shown in FIG. 6, the first airtight space 9 and the second air are sucked from the pipe openings 2a and 2b to the vacuum pumping side via vacuum pumping and vacuum shovel (not shown). The airtight space 10 is switched from atmospheric pressure to vacuum pressure, respectively.
之後，如圖7所示，經由真空泵浦等，從配管開口2a供給大氣，將第1氣密空間9從真空壓往大氣壓切換。藉此，使橡膠片5往上方膨脹，使晶圓用工模7往上方移動，將定位銷7b抵接於貼帶T，使定位銷7b彈性變形。其結果，將貼帶T均勻地貼附於晶圓W。第2氣密空間10為真空壓，故可不殘留空氣於晶圓W與貼帶T之間而貼附。 Thereafter, as shown in FIG. 7, the atmosphere is supplied from the pipe opening 2a via vacuum pumping or the like, and the first airtight space 9 is switched from the vacuum pressure to the atmospheric pressure. Thereby, the rubber sheet 5 is expanded upward, the wafer mold 7 is moved upward, and the positioning pin 7b is brought into contact with the tape T to elastically deform the positioning pin 7b. As a result, the tape T is uniformly attached to the wafer W. Since the second airtight space 10 is a vacuum pressure, it can be attached without being left between the wafer W and the tape T.
當貼帶T之貼附完成，如圖8所示，經由真空泵浦等，從配管開口2a吸引大氣，將第1氣密空間9從大氣壓切換為真空壓，同時，從配管開口2b供給大氣，將第2氣密空間10從真空壓切換為大氣壓。藉此，抑制橡膠片5之膨脹，貼帶支持構件8及晶圓用工模7回到原本的位置。取走上蓋3，將貼附有貼帶T之晶圓W與貼帶支持構件8一起取出到裝置1外，切下貼附於晶圓W之頂面以外的多餘貼帶T，完成貼帶T之貼附步驟。 When the attachment of the tape T is completed, as shown in FIG. 8, the atmosphere is sucked from the pipe opening 2a by vacuum pumping or the like, and the first airtight space 9 is switched from atmospheric pressure to vacuum pressure, and the atmosphere is supplied from the pipe opening 2b. The second airtight space 10 is switched from the vacuum pressure to the atmospheric pressure. Thereby, the expansion of the rubber sheet 5 is suppressed, and the tape supporting member 8 and the wafer mold 7 are returned to the original position. The upper cover 3 is removed, and the wafer W to which the tape T is attached is taken out of the device 1 together with the tape supporting member 8, and the excess tape T attached to the top surface of the wafer W is cut out to complete the tape. T attach steps.
圖9顯示本發明第2實施形態之基板貼合裝置。該基板貼合裝置11，使用於將頂面貼有貼帶T之晶圓W及基板S貼合的步驟。該基板貼合裝置11，取代上述第1實施形態之基板貼合裝置1之晶圓用工模7，具有晶圓用工模12，同時取代貼帶支持構件8具有基板用工模13。關在與基板貼合裝置1為相同之構成要素，標記相同符號，並省略詳細說明。 Fig. 9 shows a substrate bonding apparatus according to a second embodiment of the present invention. The substrate bonding apparatus 11 is used for bonding a wafer W to which a tape T is attached on the top surface and a substrate S. The substrate bonding apparatus 11 has a wafer mold 12 instead of the wafer mold 7 of the substrate bonding apparatus 1 of the first embodiment, and has a substrate mold 13 instead of the tape supporting member 8. The same components as those of the substrate bonding apparatus 1 are denoted by the same reference numerals, and detailed description thereof will be omitted.
晶圓用工模12，如圖10所示，具有板材12a、定位銷12b、凹部12c。板材12a，與圖2所示板台6之開口部6a以同形狀形成。定位銷12b，將於該板材12a之頂面貼有貼帶T之晶圓W定位於板材12a之中央部。凹部12c，與後述基板用工模13之支持構件13c(參照圖12A及圖12B)以同形狀形成。晶圓用工模12，具有與支持構件13c以同形狀穿設之開口部(孔)12d。如圖11所示，藉由板台6將板材12a定位於橡膠片5(參照圖9)之中央部，定位成使得貼有貼帶T之晶圓W、板材12a及橡膠片5之中心一致。 As shown in FIG. 10, the wafer mold 12 has a plate member 12a, a positioning pin 12b, and a recess 12c. The plate member 12a is formed in the same shape as the opening portion 6a of the platen 6 shown in Fig. 2 . The positioning pin 12b is positioned on the top surface of the plate member 12a with the tape W attached to the top surface of the plate member 12a. The concave portion 12c is formed in the same shape as the supporting member 13c (see FIGS. 12A and 12B) of the mold mold 13 to be described later. The wafer mold 12 has an opening (hole) 12d that is bored in the same shape as the support member 13c. As shown in Fig. 11, the plate member 12a is positioned by the plate table 6 at the central portion of the rubber sheet 5 (refer to Fig. 9) so that the center of the wafer W to which the tape T is attached, the sheet material 12a, and the rubber sheet 5 are aligned. .
基板用工模13，如圖12A及圖12B所示，具有：開口部(貫通孔)13a、安裝用凹部13b、支持構件13c。開口部13a，與基板 S(參照圖9)以大致同形狀形成。安裝用凹部13b，使基板S容易插入開口部13a。支持構件13c，固定在基板用工模13之底面，支持插入於開口部13a之基板S。該基板用工模13如圖13所示，於圖11所示載置有晶圓用工模12之板台6之支持銷6b，利用定位塊6c定位並且載置，藉此使圖9所示晶圓W之中心與基板S之中心一致。 As shown in FIGS. 12A and 12B, the substrate mold 13 has an opening (through hole) 13a, a mounting recess 13b, and a support member 13c. Opening portion 13a, and substrate S (refer to FIG. 9) is formed in substantially the same shape. The mounting recess 13b allows the substrate S to be easily inserted into the opening 13a. The support member 13c is fixed to the bottom surface of the substrate mold 13 and supports the substrate S inserted into the opening 13a. As shown in FIG. 13, the substrate mold 13 is placed on the support pin 6b of the plate stage 6 on which the wafer mold 12 is placed, and is positioned and placed by the positioning block 6c, whereby the crystal shown in FIG. The center of the circle W coincides with the center of the substrate S.
其次，對於具上述構成之基板貼合裝置11之動作，參照圖式說明。 Next, the operation of the substrate bonding apparatus 11 having the above configuration will be described with reference to the drawings.
如圖9所示，於已將各構件定位之狀態，與上述第1實施形態同樣，經由未圖示之真空泵浦及真空弁，使第1氣密空間9及第2氣密空間10之內部氣壓變化。藉此，使橡膠片5往上方膨脹，使晶圓用工模12向上方移動，將載置於晶圓用工模12的晶圓W及支持於基板用工模13之基板S貼合。其結果，能如上述不使已定位之晶圓W與基板S之貼合位置變化而貼合兩構件。由於不需要如關連技術所開示以輥推壓，而可將晶圓W及基板S貼合，故不需考慮因為應力使基板S破損。 As shown in FIG. 9, in the state in which the respective members have been positioned, the inside of the first airtight space 9 and the second airtight space 10 are evacuated via vacuum pumping and vacuum crucible (not shown) as in the first embodiment. The pressure changes. By this, the rubber sheet 5 is expanded upward, and the wafer mold 12 is moved upward, and the wafer W placed on the wafer mold 12 and the substrate S supported by the substrate mold 13 are bonded together. As a result, the two members can be bonded together without changing the bonding position of the positioned wafer W and the substrate S as described above. Since it is not necessary to roll the wafer W and the substrate S as shown by the related art, it is not necessary to consider the damage of the substrate S due to stress.
基板用工模13之支持構件13c(參照圖12A及圖12B)與晶圓用工模12由於可彼此卡合。因此，不會妨礙晶圓W與基板S之貼合，而晶圓W與基板S之貼合位置沒有變化之虞。晶圓W之頂面面積小於基板S之底面面積，因此，不會於基板S之底面貼附多餘貼帶，不會使產品品質惡化。 The support member 13c (see FIGS. 12A and 12B) of the substrate mold 13 and the wafer mold 12 can be engaged with each other. Therefore, the bonding between the wafer W and the substrate S is not hindered, and the bonding position of the wafer W and the substrate S does not change. Since the top surface area of the wafer W is smaller than the area of the bottom surface of the substrate S, no excessive tape is attached to the bottom surface of the substrate S, and the quality of the product is not deteriorated.
圖14顯示本發明第3實施形態之基板貼合裝置。該基板貼合裝置21，使用於第2實施形態中已貼合基板S之晶圓W，再貼合1片基板S而製造產品之步驟。該基板貼合裝置21，代換上述第1實施形態之基板貼合裝置1之晶圓用工模7(參照圖1、圖3A及圖3B)，而具有基板用工模22。其他與上述基板貼合裝置1為相同之構成要素，附以相同符號，詳細說明省略。 Fig. 14 shows a substrate bonding apparatus according to a third embodiment of the present invention. In the substrate bonding apparatus 21, in the second embodiment, the wafer W to which the substrate S has been bonded is bonded, and one substrate S is bonded to each other to manufacture a product. The substrate bonding apparatus 21 has a substrate mold 22 (see FIGS. 1 , 3A, and 3B) instead of the wafer mold 7 of the substrate bonding apparatus 1 of the first embodiment. The same components as those of the substrate bonding apparatus 1 described above are denoted by the same reference numerals, and detailed description thereof will be omitted.
如圖15所示，基板用工模22與上述晶圓用工模7具相同功能，且包含：板材22a及定位銷22b。板材22a，與圖2所示板台6之開口部6a以同形狀形成。定位銷22b，將於頂面側隔著貼帶T 貼有晶圓W之基板S定位。與上述圖4及圖11所示情形同樣，利用板台6將板材22a定位於橡膠片5之中央部，定位成使基板S、板材22a及橡膠片5之中心一致。 As shown in FIG. 15, the substrate mold 22 has the same function as the wafer mold 7, and includes a plate member 22a and a positioning pin 22b. The plate member 22a is formed in the same shape as the opening portion 6a of the platen 6 shown in Fig. 2 . The positioning pin 22b will be placed on the top side with a tape T The substrate S to which the wafer W is attached is positioned. Similarly to the case shown in Figs. 4 and 11, the plate member 22a is positioned at the central portion of the rubber sheet 5 by the platen 6, and is positioned such that the centers of the substrate S, the plate member 22a, and the rubber sheet 5 are aligned.
其次，對於具上述構成之基板貼合裝置21之動作，一面參照圖式一面說明。 Next, the operation of the substrate bonding apparatus 21 having the above configuration will be described with reference to the drawings.
如圖14所示，於已定位各構件之狀態，與上述第1及第2實施形態同樣，經由未圖示之真空泵浦及真空弁，調整第1氣密空間9及第2氣密空間10之內部氣壓。藉此，使橡膠片5往上方膨脹，使基板用工模22向上方移動，在已貼合於基板S之晶圓W頂面貼附貼帶T。 As shown in FIG. 14 , in the state in which the respective members are positioned, the first airtight space 9 and the second airtight space 10 are adjusted by vacuum pumping and vacuum crucible (not shown) as in the first and second embodiments. Internal air pressure. Thereby, the rubber sheet 5 is expanded upward, the substrate mold 22 is moved upward, and the tape T is attached to the top surface of the wafer W bonded to the substrate S.
貼帶T之貼附完成後，將上蓋3開放，取出貼帶T、貼帶支持構件8及貼於貼帶T之晶圓W及基板S。其次，如圖16所示，使上下反轉，再度載置於板台6之支持銷6b上。於基板用工模22載置新的基板S。如上述，使橡膠片5往上方膨脹，使基板用工模22往上方移動，將基板S貼附於貼帶T後，將基板S與晶圓W之貼合面以外的多餘貼帶T除去。藉此，製造圖17所示產品30。 After the attachment of the tape T is completed, the upper cover 3 is opened, and the tape T, the tape supporting member 8, and the wafer W and the substrate S attached to the tape T are taken out. Next, as shown in Fig. 16, the upper and lower sides are reversed and placed on the support pin 6b of the pallet 6 again. A new substrate S is placed on the substrate mold 22 . As described above, the rubber sheet 5 is expanded upward, the substrate is moved upward by the mold 22, and the substrate S is attached to the tape T, and the excess tape T other than the bonding surface of the substrate S and the wafer W is removed. Thereby, the product 30 shown in Fig. 17 was produced.
本實施形態中，已說明頂面視呈圓形之晶圓W及基板S之貼合，但是本案發明不限定於此。本案發明之構成或細節，可於本願發明之範疇內，進行該技術領域之人士能理解的各種變更。 In the present embodiment, the bonding of the wafer W and the substrate S which are circular in the top surface has been described. However, the present invention is not limited thereto. Various changes that can be understood by those skilled in the art can be made within the scope of the present invention.
以下，藉由改變本發明實施形態之基板貼合裝置，對於頂面視面呈正方形型之晶圓W及基板，也能同樣貼合。如圖18所示，取代上述晶圓用工模7(參照圖1、圖3A及圖3B)等設置晶圓用工模41，並取代上述板台6(圖1、圖2參照)設置板台42。晶圓用工模41，頂面視面呈正方形型，並具有定位銷41a，該定位銷41a用於將頂面貼有貼帶T之晶圓W定位於中央。板台42，具有開口部42a，該開口部42a與該晶圓用工模41形成為同形狀。又，取代上述基板用工模13(參照圖9、圖12A及圖12B)，利用該板材42之定位塊42c定位，並以支持銷42b支持，同時，於中央設置可定位基板之基板用工模(未圖示)。藉此構成，對於頂面視面呈正方形型之晶圓W及基板，也可以同樣地貼合。 In the following, by changing the substrate bonding apparatus according to the embodiment of the present invention, the wafer W and the substrate having a square top surface can be bonded in the same manner. As shown in FIG. 18, a wafer mold 41 is provided instead of the above-described wafer mold 7 (see FIGS. 1, 3A, and 3B), and a pallet 42 is provided instead of the above-described pallet 6 (see FIGS. 1 and 2). . The wafer mold 41 has a top surface view in a square shape and has a positioning pin 41a for positioning the wafer W on which the top surface is attached with the tape T in the center. The stage 42 has an opening 42a, and the opening 42a is formed in the same shape as the wafer mold 41. Further, in place of the above-described substrate mold 13 (see FIGS. 9 , 12A, and 12B), the positioning block 42c of the plate member 42 is positioned and supported by the support pin 42b, and a substrate mold for positioning the substrate is disposed at the center ( Not shown). According to this configuration, the wafer W and the substrate having the square-shaped top surface can be bonded in the same manner.
又，圖16所示基板貼合裝置21中，藉由使基板用工模22與定位塊6c之頂部間的間隔增大，於晶圓W貼附第2片貼帶T後，沿著晶圓W之外形將貼帶T切斷，之後藉由貼附第2片基板S，可製造圖17所示產品30。 Moreover, in the substrate bonding apparatus 21 shown in FIG. 16, the distance between the top of the substrate mold 22 and the positioning block 6c is increased, and the second tape T is attached to the wafer W, and then along the wafer. The outer shape of the W is cut by the tape T, and then the product 30 shown in Fig. 17 can be manufactured by attaching the second substrate S.
本發明能應用於基板貼合裝置。若使用該基板貼合裝置，能保持晶圓與基板等之貼合位置為一定，基板無破損之虞，因此，能使作業效率良好。 The present invention can be applied to a substrate bonding apparatus. When the substrate bonding apparatus is used, the bonding position between the wafer and the substrate can be kept constant, and the substrate can be prevented from being damaged. Therefore, work efficiency can be improved.
本申請案基於2008年4月18日提申之日本申請案特願2008-108759主張優先權，其揭示全部納入於此。 The present application claims priority based on Japanese Patent Application No. 2008-108759, filed on Apr.
S‧‧‧基板 S‧‧‧Substrate
T‧‧‧貼帶 T‧‧‧ 贴带
W‧‧‧晶圓 W‧‧‧ wafer
1‧‧‧基板貼合裝置 1‧‧‧Substrate bonding device
2‧‧‧基台 2‧‧‧Abutment
2a、2b‧‧‧配管開口 2a, 2b‧‧‧ piping opening
3‧‧‧上蓋 3‧‧‧Upper cover
4‧‧‧O型環 4‧‧‧O-ring
5‧‧‧彈性片 5‧‧‧Elastic film
6‧‧‧板台 6‧‧‧Sheet
6a‧‧‧開口部(貫通孔) 6a‧‧‧ openings (through holes)
6b‧‧‧支持銷 6b‧‧‧Support pin
6c‧‧‧定位塊 6c‧‧‧ positioning block
7‧‧‧晶圓用工模 7‧‧‧ Wafer mold
7a‧‧‧板材 7a‧‧‧ plates
7b‧‧‧定位銷 7b‧‧‧Locating pin
8‧‧‧貼帶支持構件 8‧‧‧With support members
8a‧‧‧開口部 8a‧‧‧ openings
9‧‧‧第1氣密空間 9‧‧‧1st airtight space
10‧‧‧第2氣密空間 10‧‧‧2nd airtight space
11‧‧‧基板貼合裝置 11‧‧‧Substrate bonding device
12‧‧‧晶圓用工模 12‧‧‧ Wafer mold
12a‧‧‧板材 12a‧‧‧ plates
12b‧‧‧定位銷 12b‧‧‧Locating pin
12c‧‧‧凹部 12c‧‧‧ recess
12d‧‧‧開口部(孔) 12d‧‧‧ openings (holes)
13‧‧‧基板用工模 13‧‧‧Working molds for substrates
13a‧‧‧開口部(貫通孔) 13a‧‧‧ openings (through holes)
13b‧‧‧安裝用凹部 13b‧‧‧Installation recess
13c‧‧‧支持構件 13c‧‧‧Support components
21‧‧‧基板貼合裝置 21‧‧‧Substrate bonding device
22‧‧‧基板用工模 22‧‧‧Working molds for substrates
22a‧‧‧板材 22a‧‧‧ plates
22b‧‧‧定位銷 22b‧‧‧Locating pin
30‧‧‧產品 30‧‧‧Products
41‧‧‧晶圓用工模 41‧‧‧Watt molds
41a‧‧‧定位銷 41a‧‧‧Locating pin
42‧‧‧板台 42‧‧‧Sheet
42a‧‧‧開口部 42a‧‧‧ Opening
42b‧‧‧支持銷 42b‧‧‧Support pin
42c‧‧‧定位塊 42c‧‧‧ Positioning block
圖1顯示本發明第1實施形態之基板貼合裝置之剖面圖。 Fig. 1 is a cross-sectional view showing a substrate bonding apparatus according to a first embodiment of the present invention.
圖2顯示圖1所示基板貼合裝置之板台之頂面圖。 2 is a top plan view showing the slab of the substrate bonding apparatus shown in FIG. 1.
圖3A顯示圖1所示基板貼合裝置之晶圓用工模之頂面圖。 3A is a top plan view showing a wafer mold of the substrate bonding apparatus shown in FIG. 1.
圖3B顯示圖3A之A-A線剖面圖。 Fig. 3B is a cross-sectional view taken along line A-A of Fig. 3A.
圖4顯示圖2、圖3A及圖3B所示板台及晶圓用工模組裝狀態之頂面圖。 Fig. 4 is a top plan view showing the assembled state of the die for the plate and the wafer shown in Fig. 2, Fig. 3A and Fig. 3B.
圖5顯示圖1所示基板貼合裝置之貼帶及貼帶用工模之底面圖。 Fig. 5 is a bottom plan view showing the bonding and attaching molds of the substrate bonding apparatus shown in Fig. 1.
圖6顯示圖1所示基板貼合裝置之動作之剖面圖。 Fig. 6 is a cross-sectional view showing the operation of the substrate bonding apparatus shown in Fig. 1.
圖7顯示圖1所示基板貼合裝置之動作之剖面圖。 Fig. 7 is a cross-sectional view showing the operation of the substrate bonding apparatus shown in Fig. 1.
圖8顯示圖1所示基板貼合裝置之動作之剖面圖。 Fig. 8 is a cross-sectional view showing the operation of the substrate bonding apparatus shown in Fig. 1.
圖9顯示本發明第2實施形態之基板貼合裝置之剖面圖。 Fig. 9 is a cross-sectional view showing a substrate bonding apparatus according to a second embodiment of the present invention.
圖10顯示圖9所示基板貼合裝置之晶圓用工模之頂面圖。 Fig. 10 is a top plan view showing a wafer mold of the substrate bonding apparatus shown in Fig. 9.
圖11顯示圖2及圖10所示板台與晶圓用工模組裝後狀態之頂面圖。 Fig. 11 is a top plan view showing the assembled state of the pallet and the wafer mold shown in Figs. 2 and 10.
圖12A顯示圖9所示基板貼合裝置之基板用工模之頂面圖。 Fig. 12A is a top plan view showing a mold for a substrate of the substrate bonding apparatus shown in Fig. 9.
圖12B顯示圖12A之B-B線剖面圖。 Fig. 12B is a cross-sectional view taken along line B-B of Fig. 12A.
圖13顯示圖2、圖10、圖12A及圖12B所示板台、晶圓用 工模、基板用工模組裝後狀態之頂面圖。 Figure 13 shows the stage and wafer shown in Figures 2, 10, 12A and 12B. The top view of the state after assembly of the mold and the substrate.
圖14顯示本發明第3實施形態之基板貼合裝置之剖面圖。 Figure 14 is a cross-sectional view showing a substrate bonding apparatus according to a third embodiment of the present invention.
圖15顯示圖14所示基板貼合裝置之基板用工模之頂面圖。 Fig. 15 is a top plan view showing a mold for a substrate of the substrate bonding apparatus shown in Fig. 14.
圖16顯示圖14所示基板貼合裝置之動作之剖面圖。 Figure 16 is a cross-sectional view showing the operation of the substrate bonding apparatus shown in Figure 14.
圖17顯示圖14所示基板貼合裝置所製造之產品之剖面圖。 Figure 17 is a cross-sectional view showing the product manufactured by the substrate bonding apparatus shown in Figure 14.
圖18顯示貼合其他形狀晶圓時使用晶圓用工模之頂面圖。 Figure 18 shows a top view of a wafer mold used when bonding other shaped wafers.
S‧‧‧基板 S‧‧‧Substrate
T‧‧‧貼帶 T‧‧‧ 贴带
W‧‧‧晶圓 W‧‧‧ wafer
2‧‧‧基台 2‧‧‧Abutment
2a、2b‧‧‧配管開口 2a, 2b‧‧‧ piping opening
3‧‧‧上蓋 3‧‧‧Upper cover
4‧‧‧O型環 4‧‧‧O-ring
5‧‧‧彈性片 5‧‧‧Elastic film
6‧‧‧板台 6‧‧‧Sheet
6b‧‧‧支持銷 6b‧‧‧Support pin
6c‧‧‧定位塊 6c‧‧‧ positioning block
9‧‧‧第1氣密空間 9‧‧‧1st airtight space
10‧‧‧第2氣密空間 10‧‧‧2nd airtight space
11‧‧‧基板貼合裝置 11‧‧‧Substrate bonding device
12‧‧‧晶圓用工模 12‧‧‧ Wafer mold
12a‧‧‧板材 12a‧‧‧ plates
12b‧‧‧定位銷 12b‧‧‧Locating pin
13‧‧‧基板用工模 13‧‧‧Working molds for substrates
Claims (3)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008108759A JP4812131B2 (en) | 2008-04-18 | 2008-04-18 | Substrate bonding equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201003832A TW201003832A (en) | 2010-01-16 |
| TWI466224B true TWI466224B (en) | 2014-12-21 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW098112223A TWI466224B (en) | 2008-04-18 | 2009-04-13 | Substrate lamination device |
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| Country | Link |
|---|---|
| JP (1) | JP4812131B2 (en) |
| KR (1) | KR101260117B1 (en) |
| CN (1) | CN102007587B (en) |
| TW (1) | TWI466224B (en) |
| WO (1) | WO2009128376A1 (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2014152287A (en) * | 2013-02-12 | 2014-08-25 | Disco Abrasive Syst Ltd | Adhesion method for adhesive sheet |
| CN104022057A (en) * | 2013-02-28 | 2014-09-03 | 株式会社日立高新技术 | Substrate fitting device and substrate fitting tool |
| KR101494757B1 (en) * | 2013-07-23 | 2015-02-25 | 에이피시스템 주식회사 | Substrate holder module and apparatus for treatmenting substrate having the same |
| JP6388331B2 (en) * | 2014-07-14 | 2018-09-12 | Ｎｅｃプラットフォームズ株式会社 | Tape sticking device and tape sticking jig |
| KR101706617B1 (en) | 2016-11-24 | 2017-02-16 | 주식회사 오디아이 | Flexible display panel curved laminator |
| CN110740866B (en) * | 2017-12-21 | 2021-12-28 | 深圳市柔宇科技股份有限公司 | Bonding apparatus and bonding method |
| WO2020175038A1 (en) | 2019-02-28 | 2020-09-03 | 日本ゼオン株式会社 | Resin composition, resin film, and electronic component |
| CN114683568A (en) * | 2020-12-31 | 2022-07-01 | 昆山摩建电子科技有限公司 | A cover pastes tool for accurate plastic part |
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| JP2003007808A (en) * | 2001-06-20 | 2003-01-10 | Mighty Engineering:Kk | Wafer taping machine using vacuum |
| JP4143488B2 (en) * | 2003-06-30 | 2008-09-03 | Ｎｅｃエンジニアリング株式会社 | Tape applicator |
| JP4152295B2 (en) * | 2003-10-23 | 2008-09-17 | Ｎｅｃエンジニアリング株式会社 | Tape applicator |
| JP4221271B2 (en) * | 2003-10-28 | 2009-02-12 | Ｎｅｃエンジニアリング株式会社 | Tape applicator |
| JP2005191535A (en) * | 2003-12-01 | 2005-07-14 | Tokyo Ohka Kogyo Co Ltd | Sticking device and sticking method |
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| JP4379435B2 (en) * | 2006-05-17 | 2009-12-09 | 株式会社日立プラントテクノロジー | Board assembly apparatus and board assembly method using the same |
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2009
- 2009-04-08 CN CN2009801131619A patent/CN102007587B/en active Active
- 2009-04-08 KR KR1020107022935A patent/KR101260117B1/en active IP Right Grant
- 2009-04-08 WO PCT/JP2009/057200 patent/WO2009128376A1/en active Application Filing
- 2009-04-13 TW TW098112223A patent/TWI466224B/en active
Patent Citations (3)
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|---|---|---|---|---|
| JP2001326206A (en) * | 2000-05-16 | 2001-11-22 | Shin Etsu Handotai Co Ltd | Method for thinning semiconductor wafer and thin semiconductor wafer |
| JP2003257907A (en) * | 2002-03-01 | 2003-09-12 | Sharp Corp | Semiconductor element and method for manufacturing the same |
| JP2006310338A (en) * | 2005-04-26 | 2006-11-09 | Nec Engineering Ltd | Apparatus of sticking vacuum tape for wafer |
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|---|---|
| WO2009128376A1 (en) | 2009-10-22 |
| CN102007587B (en) | 2012-09-26 |
| KR20110004383A (en) | 2011-01-13 |
| JP4812131B2 (en) | 2011-11-09 |
| CN102007587A (en) | 2011-04-06 |
| TW201003832A (en) | 2010-01-16 |
| KR101260117B1 (en) | 2013-05-02 |
| JP2009260114A (en) | 2009-11-05 |
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