JP4143623B2 - Tape applicator - Google Patents

Description

  The present invention relates to tape affixing, and more particularly to tape affixing using vacuum.

  As shown in FIG. 8, the conventional wafer tape affixing device affixes a dicing tape to a wafer by pressing a roller.

In the wafer fixing method described in Patent Document 1 , a wafer is fixed by adsorbing a peripheral portion where a circuit on the circuit surface side of the wafer is not formed in a table in a device, and a ring is placed at a predetermined position surrounding the outer wafer. equipped with a frame, the wafer was heated, by pressing with a roller from the substrate surface side of the dicing tape, has been described is a method of fixing the dicing tape-like ring frame and the wafer.

In addition, the vacuum tape sticking apparatus and method described in Patent Document 2 previously filed by one of the inventors of the present application brings the circuit surface of the wafer into contact with the rubber sheet for sticking in the vacuum chamber as shown in FIG. And place a ring frame with dicing tape attached in advance around it, depressurize the airtight space in the vacuum chamber and under the adhesive rubber sheet to a predetermined vacuum level, and apply the adhesive rubber. By returning only the decompressed airtight space under the sheet to atmospheric pressure, a differential pressure is created in the vacuum chamber and the airtight space under the adhesive rubber sheet, and the direction in the vacuum chamber where the adhesive rubber sheet is decompressed A method is described that swells (upward), lifts the wafer, and fixes it to the dicing tape.

JP 2001-308033 A JP 2005-26377 A

  However, in the conventional wafer tape affixing device as shown in FIG. 8, firstly, since the wafer is held only at the outer periphery of the wafer while avoiding contact with the wafer structure, the concentrated load on the holding part due to the characteristics of the roller, There is a problem that stress in the advancing direction is generated, the end surface of the wafer is pressed against the portion of the set base holding the wafer, and the wafer is broken.

  Second, since the dicing tape is stuck on the back surface of the wafer by pressing a roller in the atmosphere, residual air remains between the back surface of the wafer and the tape. When chip division of the next process is performed in this state, there is a problem in that chip breakage or chipping occurs during chip division and yield is deteriorated.

  Thirdly, there is a problem that it takes a lot of man-hours for the operator to remove the residual air so that the residual air between the back surface of the wafer and the dicing tape is pushed out from between the wafer and the dicing tape.

In addition, in the wafer fixing method described in Patent Document 1 , even if only the outer peripheral portion of the MEMS wafer is vacuum-adsorbed and fixed, if an ultrathin wafer is applied while applying a load with a roller, there is damage to the wafer, which is the worst case. There was a problem that the wafer was damaged.

Further, in the vacuum tape applying apparatus and a method described in Patent Document 2, for setting in contact directly wafer circuit portions on the rubber sheet for pasting, very fragile as MEMS device structure (circuit) If there is, there was a problem that there is a possibility of breaking the structure.

  Therefore, the present invention performs a pasting operation without putting residual air between the MEMS wafer and the dicing tape, prevents cracking or chipping of the chip at the time of chip division in the next process, and prevents the chip from being inserted between the MEMS wafer and the dicing tape. The purpose is to improve the productivity by eliminating the work of removing the residual air so as to push it out.

Lutein-loop attachment device has all the present invention in order to achieve the above object, a container having an airtight space therein, a second located in the first airtight space and the lower positioned the airtight space above an elastic sheet made from the partition Ru elastic airtight space, is placed in the first hermetic space side of the elastic sheet, said elastic the tape applying object by supporting the periphery of the tape applying object An affixing jig that is supported away from the sheet, and a tape that is attached to the inside of the container and is spaced a predetermined distance from the object to be affixed on the elastic sheet in the first hermetic space. And a first and second atmospheric pressure switching means for switching the first and second hermetic spaces from vacuum to atmospheric pressure, respectively, by the first and second atmospheric pressure switching means. After the first and second hermetic spaces are evacuated, the second airtight space is switched to atmospheric pressure by the second atmospheric pressure switching means, whereby the elastic sheet is moved to the first airtight space side. It is elastically deformed, and the tape is brought into contact with and attached to the tape application object.
In this case, the affixing jig includes a plate placed on the elastic sheet, a positioning member for positioning the object to be affixed to the center of the elastic sheet, and the tape affixing unit provided on the plate. It is desirable to provide a supporting member that supports the object to be taped apart from the elastic sheet by supporting the periphery of the object to be attached.

  The elastic sheet may be any of ethylene propylene rubber, butyl rubber, fluorine rubber, silicon rubber, and neoprene rubber.

The tape applying apparatus of the present invention, instead of placing directly tape applying object the elastic sheet, in contact only the peripheral edge of the tape applying object set by sticking jig, the elastic sheet in this state by the was pasted to the adhesive layer of the tape and lift the tape applying object upward inflation by the pressure difference, when the tape applying object as wafers, structure (circuitry present on the back surface ) without destroying, it becomes possible to paste the tape in a uniform state without residual air the entire back surface of the tape applying object.

  In this way, it can be applied to the entire wafer in a uniform state with no residual air, reducing the man-hours for removing the residual air between the wafer and the dicing tape that has been generated in the past from between the wafer and the dicing tape. In addition, in chip division in the next step, troubles such as chip breakage and chipping caused by residual air between the wafer and the dicing tape can be prevented, and the product yield can be improved.

  Furthermore, since it becomes possible to affix the dicing tape to the wafer without using the elongation characteristic of the dicing tape, it is possible to affix the dicing tape while suppressing the tension of the dicing tape. It is now possible to attach non-stretchable adhesives such as film tape and resin.

  Next, an embodiment of the present invention will be described with reference to FIGS.

FIG. 1 shows the configuration of a tape applicator according to the present invention, in which an airtight space is formed by joining a base 15, an upper lid 4 covering the upper side of the base 15, and the base 15 and the upper lid 4. In order to make the space between the ring B9 attached to the upper lid 4 side of the base 15 and the rubber sheet 3 at the center of the upper surface of the base 15 and the center of the rubber sheet 3 and the base 15 airtight. A ring A23 attached to the upper lid 4 side of the table 15, a frame table 22 mounted on the periphery of the rubber sheet 3, a dicing frame 13 mounted on the frame table 22 with the dicing tape 1 attached thereto, A dicing tape 1 that is attached to the dicing frame 13 and separates the airtight space formed by the upper lid 4 and the base 15 into an airtight space B5 on the upper lid 4 side and an airtight space C6 on the base 15 side; The sticking jig 14 provided on the inner side of the frame base 22 on the sheet sheet 3, the wafer 2 positioned and placed at the center of the rubber sheet by the sticking jig 14, and the airtight space B 5 portion of the base 15 The vacuum opening B7 provided in the vacuum opening B7, the vacuum valve B8 for changing the airtight spaces B5, C6 from the atmospheric pressure to the vacuum pressure through the tube from the vacuum opening B7, and the vacuum provided at the lower part of the rubber sheet 3 at the center of the base 15. It is comprised from opening A11 and the vacuum valve A12 which changes the airtight space A10 comprised with the pipe | tube from vacuum opening A11 from atmospheric pressure to a vacuum pressure.

4 and 5 show a cross-sectional view and a plan view of the sticking jig 14. Sticking jig 14, as apparent from the figure, a plate 16 is placed on the rubber sheet 3, a plurality of support pins 17 for supporting the wafer 2 is provided on the plate 16 is supported by the support pins 17 Further, the positioning pins 18 for positioning the wafer 2 are arranged, and the circuit 19 of the wafer 2 is placed so as to face downward in the drawing. The wafer 2 is supported by a plurality of support pins 17 and the load is distributed. Since the wafer 2 has a substantially uniform load , the stress does not concentrate on one point.

6 and 7 show a sectional view and a plan view of a dicing frame 1 3 and the frame base 22. Incidentally, for the sake of clarity, it is shown to remove the sticking jig 14 shown in FIGS. 4 and 5 from FIGS. As apparent from the figure, the dicing tape 1, a dicing frame 13 for attaching the dicing tape 1, a plurality of frame support pins 20 for supporting the dicing frame 13, is fixed on the rubber sheet 3 mounting the frame support pins 20 a frame board 2 2 to location, which is fixed on the frame base 2 2 and a frame alignment pins 21 for positioning the dicing frame 13 in the central portion of the rubber sheet 3.

It will now be described with reference to the drawings attached to the operation of the present invention.

  The dicing tape 1 is affixed to the dicing frame 13 in advance.

Then, placing the sticking jig 14 in the rubber sheet 3 is brought into contact only the outer peripheral portion of the wafer 2 by performing the positioning by the positioning pin 18 to the support pins 17 so that the circuit surface wafer 2 faces downward Place.

  Thereafter, the dicing frame 13 with the dicing tape 1 attached is placed on the frame base 22.

In this state, the base 15 is closed by the upper lid 4 to form airtight spaces B 5 and C 6 .

  As shown in FIG. 2, when the vacuum valves A12 and B8 are switched from the atmospheric pressure side to the vacuum pressure side, the piping from the vacuum valve B8 to the vacuum opening B7 and the airtight spaces B5 and C6 from the vacuum opening B7 become the vacuum pressure. The piping from the vacuum opening A11 to the vacuum valve A12 and the airtight space A10 from the vacuum opening A11 to the space between the rubber sheet 3 and the base 15 held by the ring A23 become a vacuum pressure.

After that, as shown in FIG. 3, the pressure is generated between the airtight space C6 and the airtight space A10 by switching the vacuum valve A12 from the vacuum side to the air side to change the airtight space A10 from the vacuum pressure to the atmospheric pressure. by, by pushing up the sticking jig 14 is inflated rubber sheet 3 in an airtight space C6 side upward, the dicing tape wafers 2 placed on the sticking jig 14 without a residual air 1 Can be pasted on.

  When the dicing tape 1 is affixed to the wafer 2, the vacuum valve B8 is switched from the vacuum side to the atmosphere side, the airtight spaces B5 and C6 are changed from the vacuum pressure to the atmospheric pressure, and the upper lid 4 is removed from the base 15 to remove the dicing tape 1 Can be taken out.

  Although the best mode has been described above, the rubber sheet 3 may be ethylene propylene rubber, butyl rubber, fluorine rubber, silicon rubber, or neoprene rubber, and the rubber sheet 3 is not limited to rubber. Any material having elasticity can be used.

It shows a configuration of a lutein-loop attachment device has all the present invention. The figure which showed the state when the vacuum valves A and B were made into the vacuum side. The figure which showed the state when the vacuum valve A was made into the atmosphere side and the vacuum valve B was made into the vacuum side. Sectional drawing of the jig | tool for sticking. The top view of the jig | tool for sticking. Sectional drawing of the dicing frame 13 and the frame stand 22. FIG. The top view of the dicing frame 13 and the frame stand 22. FIG. The figure which showed the structure of the vacuum tape sticking apparatus for wafers using the conventional roller. A vacuum tape applicator described in Patent Document 2.

Explanation of symbols

1 Dicing tape 2 Wafer 3 Rubber sheet 4 Upper lid 5 Airtight space B
6 Airtight space C
7 Vacuum opening B
8 Vacuum valve B
9 Ring B
10 Airtight space A
11 Vacuum opening A
12 Vacuum valve A
13 dicing frame 14 sticking jig 15 base plate 16 plate 17 support pin 18 alignment pins 19 circuit 20 the frame support pins 21 frame alignment pin 22 frame stand 23 ring A

Claims (3)

A container having an airtight space inside;
An elastic sheet made from the partition Ru elastic member in the second airtight space located in the first airtight space and the lower positioned the airtight space upwardly,
Wherein mounted on said first hermetic space side of the elastic sheet, the sticking jig which supports away the tape applying object from the elastic sheet by supporting the periphery of the tape applying object,
A tape support member attached to the inside of the container and supporting the tape so as to be separated from the tape application object placed on the elastic sheet within the first hermetic space;
First and second air pressure switching means for switching the first and second airtight spaces from vacuum to atmospheric pressure, respectively;
After the first and second air pressure spaces are evacuated by the first and second air pressure switching means, the second air pressure space is switched to the atmospheric pressure by the second air pressure switching means, A tape applying apparatus, wherein an elastic sheet is elastically deformed toward the first hermetic space, and the tape is abutted and applied to the tape application object. The affixing jig includes a plate placed on the elastic sheet, a positioning member for positioning the tape application object at a central portion of the elastic sheet, and the tape application object provided on the plate. The tape sticking device according to claim 1, further comprising a support member that supports the object to be taped away from the elastic sheet by supporting a peripheral edge of the tape. The tape applicator according to claim 1 or 2, wherein the elastic sheet is any one of ethylene propylene rubber, butyl rubber, fluorine rubber, silicon rubber, and neoprene rubber.

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