KR101457044B1 - Apparatus and method for attaching substrates - Google Patents

Abstract

A substrate cementing apparatus according to the present invention comprises: a chamber; An adsorption chamber provided in the chamber and having an adsorption groove for adsorbing and supporting the first substrate; A lower fixture provided in the chamber and including a lower adhesive chuck for adhering a second substrate to be adhered to the first substrate; An actuating pin having an upper adhesive chuck for adsorbing and adhering the first substrate and expanding and contracting to move to the supposition half side; At least one first pump connected to the chamber to form a vacuum state inside the chamber at a predetermined pressure and to provide an attraction force to the operation pin and the suction groove; And a gas supply unit connected to the chamber to supply gas to the first substrate so that the first substrate and the second substrate are pressed and attached to each other so that the first substrate adhered to the upper adhesive chuck is flattened, According to the present invention, it is possible to stably support the substrate by the adhesive force, to easily attach and detach the substrate by the adhesive force, and to prevent the substrate from being damaged by adhesion of the substrate through the substrate. The productivity is improved, and the substrate can be attached in a flat state, thereby improving the quality.

Description

[0001] APPARATUS AND METHOD FOR ATTACHING SUBSTRATES [0002]

More particularly, the present invention relates to a substrate coagulation apparatus and a coagulation method, and more particularly, to a substrate coagulation apparatus and a coagulation method which stably support a substrate by an adhesive force and are easily detachable and attachable by an adhesive force, The present invention relates to a substrate coagulating apparatus and a coagulating method, which can improve the quality of a coagulated substrate in a flat state.

2. Description of the Related Art In general, a substrate laminating apparatus is a device for laminating two substrates in the manufacture of a flat panel display, and is used for manufacturing a liquid crystal display, an organic light emitting display, and the like. In the substrate cementing apparatus, the upper substrate and the lower substrate, which are two substrates, face each other in the vertical direction, and then the upper substrate and the lower substrate are brought close to each other to perform precision alignment, and then the two substrates are cemented.

The upper substrate and the lower substrate facing each other for adhesion are adsorbed and supported on the upper and lower bases, respectively. Typically, since a process is performed in a vacuum state in a chamber of a substrate adhering apparatus, the upper substrate is supported by an electrostatic chuck installed on an upper table after adsorption, and the lower substrate is also supported by an electrostatic chuck installed on a lower table.

However, in the conventional apparatus using the electrostatic chuck, it is difficult to separate the substrate from the electrostatic chuck.

Korean Unexamined Patent Publication No. 10-2006-0069113, "

An object of the present invention is to provide a substrate adhering apparatus and a cementing method which are easy to attach and detach by adhering a substrate by an adhesive force and can be adhered while a substrate is flattened through a substrate.

In an embodiment of the present invention, a substrate fusing device includes a chamber; An upper tacking chuck provided in the chamber and having an upper tacking chuck for holding the first substrate adhered and an adsorption groove for sucking and supporting the first substrate by suction; A lower fixture provided in the chamber and including a lower adhesive chuck for adhering a second substrate to be adhered to the first substrate; An actuating pin that retracts and contracts to move the first substrate to the supposition half side; At least one pump connected to the chamber to form a vacuum state of a predetermined pressure inside the chamber and to provide an attraction force to the operation pin and the suction groove; And a gas supply unit connected to the chamber to supply gas to the first substrate so that the first substrate and the second substrate are pressed and attached to each other so that the first substrate adhered to the upper adhesive chuck is flattened, And a gas supply member for supplying the gas.

The gas supplied by the gas supply member may be an inert gas.

The adsorption grooves may be formed around the upper adhesive chuck.

And the supposition section may include a separator which expands to separate the first substrate from the supposition substrate.

According to another aspect of the present invention, there is provided a method for attaching a substrate, the method comprising the steps of: moving a first substrate introduced into a chamber through an operation pin connected to a pump to move the substrate toward an anticipatory half side, And a second substrate which is introduced into the chamber and is supported on the lower half of the chamber to support the second substrate by adhesive force, And a gas supply member connected to the suction groove such that the first substrate adhered to the upper adhesive chuck is flattened is formed in a vacuum state at a predetermined pressure by the pump, Supplying the gas through the gas supply member to the first substrate separated from the supposition chamber and supplying the gas to the second substrate through the gas supply member, It is attached to each other by pressing the first substrate.

The gas supplied by the gas supply member may be an inert gas.

The adsorption grooves may be formed around the upper adhesive chuck.

And the supposition section may include a separator which expands to separate the first substrate from the supposition substrate.

The substrate cohesion apparatus and the cohesion method according to the present invention can stably support the substrate by the adhesive force and can easily be detached and attached by the adhesive force, and the substrate can be prevented from being damaged by bonding the substrate through the substrate, The substrate can be bonded together, and the quality can be improved.

1 is a cross-sectional view of a substrate adhering apparatus according to an embodiment of the present invention.
2 is a view showing a substrate supporting operation of the substrate sticking apparatus according to the embodiment of the present invention.
FIG. 3 is a view showing a substrate peeling and adhesion operation of the substrate sticking apparatus according to the embodiment of the present invention.
FIG. 4 is a view showing an estimated half of a substrate sticking apparatus according to an embodiment of the present invention.
5 and 6 are views showing the state of the substrate by the adsorption of the substrate sticking apparatus according to the embodiment of the present invention.
FIG. 7 is a flowchart showing a joining method of a substrate joining method according to an embodiment of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of a substrate cementing apparatus and a cementing method according to the present invention will be described with reference to the drawings. It should be understood, however, that the invention is not limited to the disclosed embodiments, but may be embodied in various forms and should not be construed as limited to the embodiments set forth herein, To be fully informed. The substrate cementing apparatus of the present invention can be used for bonding a CF substrate (color filter substrate) and a TFT substrate, a touch panel substrate and a display substrate, or an OLED panel and a film.

1 is a cross-sectional view of a substrate adhering apparatus according to an embodiment of the present invention. 2 is a view showing a substrate supporting operation of the substrate sticking apparatus according to the embodiment of the present invention. FIG. 3 is a view showing a substrate peeling and adhesion operation of the substrate sticking apparatus according to the embodiment of the present invention. FIG. 4 is a view showing an estimated half of a substrate sticking apparatus according to an embodiment of the present invention. 5 and 6 are views showing the state of the substrate by the adsorption of the substrate sticking apparatus according to the embodiment of the present invention.

As shown in FIGS. 1 to 6, the substrate adhering apparatus according to the embodiment of the present invention may include an upper chamber 110 and a lower chamber 210. The upper chamber 110 may include an upper substrate 120 having an upper adhesive chuck 150 for adhering the first substrate S1 to the upper chamber 110. The lower substrate 210 may include a first substrate S1, And a lower fixture 220 having a lower adhesive chuck 250 for adhering the second substrate S2 to be adhered thereto.

The upper chamber 110 may include an actuating pin 132 that contracts to move the first substrate S1 to the supporter 120 side. The chambers 110 and 210 are formed in a vacuum state at a predetermined pressure in the chambers 110 and 210 and a first pump such as a dry pump for providing an attraction force to the operation pins 132. [ (600). A second pump 700 such as a TMP (Turbo Molecular Pump) may be installed in the chambers 110 and 210 to form a vacuum state lower than a vacuum state formed by the first pump 600 have. As the chambers 110 and 210 are vacuum-formed by the pumps 600 and 700, the two substrates S1 and S2 are adhered together to form a high-quality panel in which air bubbles are not generated .

The assumption unit 120 may include a separator 160 that expands to displace the first substrate S1 from the supposition unit 120. [

When the first substrate S1 is separated from the upper chamber 110 and attached to the second substrate S2, the first substrate S1 separated from the first substrate 120 is supplied with a gas to pressurize the first substrate S1. Member 500 as shown in FIG.

The gas supply member 500 may be a pump for supplying an inert gas such as N2, Ar, or He gas.

The first substrate S1 is supported by the first substrate S1 by being connected to the first pump 600. The first substrate S1 is connected to the first substrate S1 A plurality of operation holes 122 may be formed. The operation hole 122 penetrates the imaginary plane 120 in the thickness direction. In addition, an adsorption groove 122a connected to the operation hole 122 is formed on the surface of the supposing plate 120. The adsorption grooves 122a are for adsorbing the first substrate S1 to the surface of the supporter 120 by receiving the attraction force through the operation hole 122 where the adsorption force is applied by the first pump 600. [

The adsorption grooves 122a can be formed around the upper adhesive chuck 150 and can be formed over the entire surface of the supporter 120. [ When the plate 120 is fabricated in the form of a single plate, the adsorption grooves 122a may be connected to the plates. In the case where a plurality of the induction reaction chambers 120 are combined, the adsorption grooves 122a may be partially formed so that a certain portion of the first substrate S1 can be adsorbed to only one unit surface constituting the induction reaction chamber 120 have.

The operation hole 122 and the suction groove 122a are connected to the first pump 600 so as to not only adsorb the first substrate S1 to the surface of the first half, The first substrate S1 may be flattened before being adhered to the first substrate S1.

The first substrate S1 is brought into close contact with the supporter 120 by the upper adhesive chuck 150 due to the adhesive force and the actuating hole 122 and the suction groove 122a by the attraction force of the first pump 600 As shown in FIG. 5, a shape in which the first substrate S1 is bent is generated at a portion where the separation membrane 160 is present. In this state, the substrates S1 and S2 are not uniformly adhered to each other, resulting in deterioration of uniformity of adhesion and deterioration of quality, resulting in generation of bubbles and the like. In order to solve this problem, the inside of the chambers 110 and 210 are formed in vacuum, and then the gas supply member 500 is connected to the operation hole 122 and the suction groove 122a before the coalescence is performed, As shown, the step of flattening the first substrate S1 is proceeded. When the gas is supplied to the operation hole 122 and the suction groove 122a through the gas supply member 500, the first substrate S1, which has been bent into the separation membrane 160, Is flattened.

The gas supply member 500, the first pump 600 and the second pump 700 may be connected to one supply line 138 which may be connected to the inside or outside of the chamber 110 As shown in FIG. The gas supply member 500 connected to the supply line 138, the first pump 600 and the second pump 700 are provided with on / off valves 500a, 600a and 700a for opening and closing the respective members.

The supply line 138 is provided with an adsorption line 136 for providing an adsorption force to a plurality of operation pins 132 for adsorbing the first substrate S1 and an adsorption line 136 for adsorbing the first substrate S1 to the adsorption unit 120 An operating solenoid 126 may be connected to provide the suction force to the hole 122. The supply line 138 is connected with an expansion line 166 for expanding a separation membrane 160 such as a diaphragm and an exhaust line 180 for evacuating the inside of the chambers 110 and 210 .

Accordingly, when the first pump 600 and the second pump 700 are operated, the first substrate S1 can be adsorbed by the actuating pin 132 and the actuating hole 122, The inside of the chambers 110 and 210 may be formed in a vacuum state by a vacuum pump 280. The gas supply member 500 is connected to the supply line 138 so that the first substrate S1 can be pressed by supplying a gas such as N2 and the inside of the chamber 110 It can be used to switch from a vacuum state to a standby state. In addition, a portion of the first substrate S1 bent to the portion of the separation membrane 160 may be flattened.

126a, 126a, 166a, and 180a are provided in the adsorption line 136, the operating line 126, the expansion line 166, and the exhaust line 180, respectively.

The plurality of individual operation pins 132 are connected to the pin plate 130, and the pin plate 130 can be moved up and down by the pin plate driving unit 134. When the first substrate S1 is drawn into the chambers 110 and 210, the actuating pin 132 is lowered to support the first substrate S1 in the adsorbed state by the attraction force. In this state, the actuating pin 132 moves upward and moves toward the supporter 120 side. Thereafter, the first substrate S1 is brought into close contact with the supporter 120. At this time, the attracting force also acts on the first substrate S1 through the operation hole 122 and the suction groove 122a, thereby bringing the first substrate S1 into close contact with the supporter. The first substrate S1 is adhered to the upper adhesive chuck 150 by the adhesive force of the operation hole 122 and the upward force of the actuating pin 132 and is also supported by adhesive force.

When the first substrate S1 and the second substrate S2 are aligned in the chambers 110 and 210 in the upper chamber 110, the alignment state of the first substrate S1 and the second substrate S2 is checked An alignment camera 310 may be provided.

The alignment camera 310 observes alignment marks (not shown) formed on the first substrate S1 and the second substrate S2 and aligns the two substrates S1 and S2 .

The upper chamber 110 may include an anticipation semi-driving unit 140 for driving the anticipation unit 120 in which the first substrate S1 is held. The supposed hemispherical driving unit 140 moves the first substrate S1 toward the second substrate S2.

Meanwhile, the upper chamber driving unit 320 may be provided on the lower chamber 210 side to move the upper chamber 110 up and down. The upper chamber driving unit 320 moves the upper chamber 110 downward to form or raise the cohesive space to allow the substrates S1 and S2 to be carried in and out. The lower chamber 210 may be provided with a lower semi-spherical portion 234 for lifting and lowering the lower stage 220. The lower and upper substrates 220 and 220 may be adjusted to align the first substrate S1 and the second substrate S2 An alignment unit 330 may be provided.

The lower chamber 210 is formed with an exhaust line 280 for switching the chambers 110 and 210 to a vacuum state and an atmospheric pressure state at the lower side and the exhaust line 280 is provided with the first pump 600, The second pump 700 and the gas supply member 500 may be connected.

A lower adhesive chuck base plate 242 and a lower adhesive chuck plate 244 may be provided on the upper portion of the lower plate 220. The lower adhesive chuck plate 244 is provided with a plurality of lower adhesive chucks 250 to adhere and support the second substrate S2.

Pumping holes 222 and 262 are formed in the lower adhesive chuck base plate 242, the lower adhesive chuck plate 244, and the lower plate 220. A plurality of pumping holes 222 and 262 are formed and pumping holes 262 formed in the lower adhesive chuck base plate 242 and the lower adhesive chuck plate 244 and a pumping hole 222 formed in the lower half plate 220, The center portions are formed in a staggered state. The pumping holes 222 and 262 may be formed by forming the chambers 110 and 210 into a vacuum state through the first pump 600 and the second pump 700, This is the path through which the gases are moved.

A plurality of flatness adjusting blocks 278 for adjusting the flatness of the lower adhesive chuck base plate 242 with respect to the lower flat bar 220 are provided between the lower adhesive chuck base plate 242 and the lower flat bar 220 do.

The flatness adjusting block 278 adjusts the gap between the two plates in such a manner that two plates (not shown) are maintained at a constant interval to adjust the flatness of the lower adhesive chuck base plate 242 and the lower adhesive chuck plate 244 Adjust the degree. The gas can flow through the flatness adjusting block 278.

The staggered configuration of the pumping holes 262 formed in the lower adhesive chuck base plate 242 and the lower adhesive chuck plate 244 and the center portion of the pumping holes 222 formed in the lower fixed unit 220 is achieved by the chamber 110 (S2) when the N2 or the like is supplied into the vacuum chamber 210 from the vacuum state to the atmospheric state. When the substrates S1 and S2 are moved, the degree of cohesion may be changed and there may be a problem that air bubbles or the like may flow in.

When the second substrate S2 is received in the lower chamber 210 and the bonded substrates S1 and S2 are carried out to the outside, the bonded substrates S1 and S2 are separated from the lower substrate 220 A lift pin 232 may be provided to support the lift pin 232. [ The lift pins 232 arranged in a manner penetrating through the lower half 220 are fixed to the lower chamber 210. When the lower semi-spherical portion 234 is operated to lower the lower half 220, the lift pins 232 are exposed to the outside of the lower adhesive chuck plate 244. At this time, (S1) and (S2) to the outside. When the lower semicircular portion 234 is operated and the lower half 220 is lifted with the lift pin 232 exposed and the second substrate S2 received, the second substrate S2 is lowered to the lower adhesive chuck plate 244 To the lower pressure-sensitive adhesive chuck 250 of the pressure- At this time, the second substrate S2 is adsorbed through the pumping holes 222 and 262.

Hereinafter, a method of attaching a substrate according to an embodiment of the present invention constructed as described above will be described.

7, the method of attaching a substrate according to an embodiment of the present invention includes moving the first substrate S1, which is introduced into the chambers 110 and 210, to the operation pin 132 to which the first pump 600 is connected, (S100) is carried out.

As shown in FIG. 1, when the first substrate S1 enters the chambers 110 and 210, the actuating pin 132 moves down and contacts the first substrate S1. An attraction force is applied to the operation pin 132 by the first pump 600 so that the first substrate S1 is attracted.

The first substrate S1 is moved upward by lifting the operation pin 132 in a state where the first substrate S1 is attracted and the first substrate S1 is mounted on the first substrate 120, A step S200 of sticking and adsorbing and holding by the chuck 150 and the operation hole 122 and the suction groove 122a is performed. When the first substrate S1 is brought close to the supporter 120 by the actuating pin 132, the first substrate S1 is moved by the actuating hole 122 and the sucking groove 122a formed in the supporter 120, And is adsorbed. The first substrate S1 is adhered and supported on the upper adhesive chuck 150 provided on the upper half 120 by the attraction force of the operation pin 132, the operation hole 122 and the suction groove 122a, . At this stage, the adsorption line 136 connected to the feed line 138 and the intermediate valve 136a 126a of the operating solenoid 126 are open.

Thereafter, the second substrate S2 introduced into the chambers 110 and 210 is adhered to the lower adhesive chuck 250 (S300). At this time, the lower semi-spherical chuck plate 244 and the lower adhesive chuck base plate 242 provided at the upper portion of the lower half 220 are lowered by interlocking with the lower semi-spherical portion 234 to lower the lower half 220 do. Accordingly, the lift pins 232 are exposed, and the second substrate S2 introduced by the robot (not shown) is supported by the lift pins 232. When the second substrate S2 is supported by the lift pins 232, the robot exits to the outside and the lower semi-driving portion 234 is operated again. The lower semi-spherical portion 234 is operated to raise the lower half 220, the lower adhesive base plate 242 and the lower adhesive chuck plate 244. At this time, the pumping holes 222 and 262 are provided with an attraction force by the first pump 600 to attract the second substrate S2, and the second substrate S2 is attracted by the suction force, And adhered to the lower adhesive chuck plate 244. [

2, the upper chamber driving unit 320 operates to move the upper chamber 110 downward to be closely contacted with the lower chamber 210 to form a cementing space.

When the upper chamber 110 and the lower chamber 210 are in close contact with each other to form a cemented space, the valve 180a of the upper exhaust line 180 is opened and the first pump 600 moves the inside of the chamber 110 (S400) of forming a vacuum state of a predetermined pressure. Vacuum evacuation proceeds in the chambers 110 and 210 through the lower exhaust line 280 as well. At this time, the valves 500a and 700a of the gas supply member 500 and the second pump 700 are in a closed state.

Thereafter, the process of forming the inside of the chambers 110 and 210 through the second pump 700 to a lower high vacuum state proceeds.

The valve 600a of the first pump 600 is closed and the valve 700a of the second pump 700 is opened after the inside of the chambers 110 and 210 reaches a predetermined pressure by the first pump 600 The inside of the chambers 110 and 210 is pumped for forming a high vacuum by the second pump 700 through the supply line 138 and the exhaust lines 180 and 280.

The second pump 700 functions to form a high vacuum and maintain a high vacuum.

When the inside of the chambers 110 and 210 is completely vacuum-formed, the gas is supplied to the operation hole 122 and the suction groove 122a through the gas supply member 500, The step S500 of advancing the portion of the first substrate S1 that is bent to the portion of the separation membrane 160 to a flat state is performed.

Then, the supposed hemispherical driving unit 140 is operated so that the first substrate S1 is lowered and moved to the second substrate S2 side. At this time, the alignment unit 330 is operated to adjust the second substrate S2 in the X, Y, and θ directions, and the alignment marks of the second substrate S2 and the first substrate S1 are aligned through the alignment camera 310 Observe and arrange them roughly. When the alignment is completed, the substrate 120 is further lowered so that the interval between the two substrates S1 and S2 becomes several hundreds of micrometers, and the final alignment state is confirmed. Although not shown, illumination may be provided on the opposite side of the alignment camera 310, and the substrates S1 and S2 are supported by adhesive force in a vacuum state.

As shown in FIG. 3, in a state in which the final alignment is performed, a step S600 of pressing the first substrate S1 with a gas and attaching the second substrate S2 to the second substrate S2 is performed.

The valves 600a and 700a of the first pump 600 and the second pump 700 are closed and the gas supply member 500 is closed when the first substrate S1 is pressurized with the gas and adhered to the second substrate S2. The valve 500a of the supply line 138 is opened and an inert gas such as N 2 is supplied to the supply line 138.

The gas is supplied to the separation membrane 160 through the expansion line 166 through which the valve 166a is opened to expand the separation membrane 160 to separate the first substrate S1 from the upper adhesive chuck 150, ). The gas is also supplied through the operation hole 122 and the suction groove 122a to press the first substrate S1 falling toward the second substrate S2 so that the two substrates S1 and S2 are stuck together do. The operation of supplying the gas to the separation membrane 160 and the operation hole 122 and the absorption groove 122a can be performed at the same time and the separation membrane 160 can be operated first and then the operation hole 122 and the absorption groove 122a A method of supplying gas through the operation hole 122 and an absorption groove 122a and a method of supplying gas to the separation membrane 160 may be selectively used.

The operation hole 122 and the suction groove 122a are connected to the first pump 600 or the first pump 600 and the second pump 700 to have a function of sucking the substrate S1 by receiving the sucking force, And is also connected to the member 500 to pressurize and push the substrate S1 by receiving the gas.

The gas is supplied into the chambers 110 and 210 through the exhaust line 180 in a state where the first substrate S1 and the second substrate S2 are pressurized and the atmosphere is switched to the atmospheric pressure state.

When the inside of the chambers 110 and 210 is completed at atmospheric pressure, the upper chamber driving unit 320 is operated to raise the upper chamber 110 away from the lower chamber 210.

Then, the lower semi-spherical portion 234 is lowered to carry the substrates S1 and S2 held together by the lift pins 232 to the outside through the robot.

As described above, the embodiments of the present invention should not be construed as limiting the technical idea of the present invention. The scope of protection of the present invention is limited only by the matters described in the claims, and those skilled in the art will be able to modify the technical idea of the present invention in various forms. Accordingly, such improvements and modifications will fall within the scope of the present invention as long as they are obvious to those skilled in the art.

120 ... assumed block 122 ... operation hole
132 ... operation pin 134 ... pin plate drive section
140 ... assumption hemispherical portion 150 ... upper sticking chuck
220 ... Lower half 222, 262 ... Pumping hole
234 ... Lower part Hemispherical part 250 ... Lower part adhesive chuck
320: upper chamber driving unit 330:
278 ... control block

Claims (8)

chamber;
An upper tacking chuck provided in the chamber and having an upper tacking chuck for holding the first substrate adhered and an adsorption groove for sucking and supporting the first substrate by suction;
A lower fixture provided in the chamber and including a lower adhesive chuck for adhering a second substrate to be adhered to the first substrate;
An actuating pin that retracts and contracts to move the first substrate to the supposition half side;
A pump connected to the chamber to form a vacuum inside the chamber at a predetermined pressure and provided with a plurality of pumps for providing an attraction force to the actuating pin and the suction groove;
And a gas supply unit connected to the chamber to supply gas to the first substrate so that the first substrate and the second substrate are pressed and attached to each other so that the first substrate adhered to the upper adhesive chuck is flattened, And a gas supply member for supplying the gas to the substrate.
The substrate adhering apparatus according to claim 1, wherein the gas supplied by the gas supply member is an inert gas.
The apparatus of claim 1, wherein the adsorption grooves are formed in the periphery of the upper adhesive chuck.
The substrate adhering apparatus according to claim 1, wherein the upper adhesive chuck includes a separating membrane that expands to release the first substrate from the supposition substrate.
The first substrate introduced into the chamber is sucked through the operation pin connected to the pump,
The first substrate raised by the operation pin is adhered and held by an upper adhesive chuck provided in the supposition half, and is held by an adsorption groove connected to the pump and to which an adsorption force acts,
A second substrate introduced into the chamber is adhered to a lower adhesive chuck for supporting the second substrate by an adhesive force,
The inside of the chamber is evacuated to a predetermined pressure by the pump,
Supplying a gas through a gas supply member connected to the suction groove so that the first substrate adhered to the upper adhesive chuck is flattened,
Supplying a gas to the first substrate separated from the supposition plate through the gas supply member to press and bond the first substrate to the second substrate,
Wherein the plurality of pumps are selectively driven.
6. The method of claim 5, wherein the gas supplied by the gas supply member is an inert gas.
6. The method of claim 5, wherein the adsorption grooves are formed in the periphery of the upper adhesive chuck.
6. The method of claim 5, wherein the assumption section includes a separating membrane that expands to displace the first substrate from the supposition panel.

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