KR20120124810A - Panel bonding apparatus for bonding touch panel and display panel - Google Patents

Abstract

PURPOSE: A panel adsorbing device adsorbing a touch panel and a display panel is provided to adsorb the touch panel and the display panel of various sizes, thereby increasing adsorption efficiency and productivity. CONSTITUTION: A top stage(210) is equipped inside a chamber. A bottom stage is equipped inside the chamber. A first top lift pin group(260a) is equipped outside the top stage. The first top lift pin group adsorbs a panel of a predetermined size. A second top lift pin group is equipped in a different location from the first top lift pin group. The second top lift pin group adsorbs the panel of a big size with the first top lift pin group. When the panel of the predetermined size is adsorbed by the first top lift pin group, a controlling unit does not deliver adhesion to the second top lift pin group.

Description

Panel bonding device for bonding touch panel and display panel {PANEL BONDING APPARATUS FOR BONDING TOUCH PANEL AND DISPLAY PANEL}

The present invention relates to a substrate bonding apparatus, and more particularly, to a substrate bonding apparatus for bonding the touch panel and the display panel.

Recently, a touch panel attached to the surface of a display panel is used as an input means in a flat panel display device. The touch panel is manufactured separately from the display panel and then attached to the surface of the display panel, and the touch panel and the display panel are then installed in the electronic device.

When the touch panels are attached to each other on the display panel, the touch panel and the display panel are finally manufactured as final products for mounting on the electronic device, and the display panel is also manufactured.

Therefore, since the circuit wiring is exposed to the outside of the touch panel and the display panel, and the touch panel and the display panel are bonded while the circuit wirings are connected, the alignment of the two panels for bonding is not easy.

In addition, since the size of the display panel is different for each electronic device, the touch panel is manufactured in various sizes and coupled to the display panel. However, most of the touch panel and the display panel are combined by human hand, and thus, there is a problem in that the cost of the product increases and the productivity decreases.

The present invention is to solve the above problems, an object of the present invention is to provide a panel bonding apparatus for automatically bonding the touch panel and the display panel.

Another object of the present invention with respect to the above object is to provide a panel bonding apparatus that allows the operator to selectively attach the display panel and the touch panel of various sizes.

Panel bonding apparatus for bonding the touch panel and the display panel according to the present invention comprises a chamber; An upper stage provided inside the chamber; A lower stage provided inside the chamber; A first upper lift pin group provided outside the upper stage to suck a panel having a predetermined size; A second upper lift pin group provided at a position different from the first upper lift pin group of the upper stage and adsorbing the panel having an area larger than the predetermined size panel together with the first upper lift pin group; And a control unit for controlling a suction force not to be transmitted to the second upper lift pin group when the panel having the predetermined size is sucked by the first upper lift pin group.

The panel may be any one of a touch panel and a display panel, and one of the touch panel and the display panel may be positioned at the upper stage, and the other of the touch panel and the display panel may be positioned at the lower stage. The stage may include an upper adhesive chuck for adhesively holding the panel adsorbed by the first upper lift pin group and the second upper lift pin group.

The panel may be any one of a touch panel and a display panel, and the lower stage may include a lower adhesive chuck to maintain adhesion when one of the touch panel and the display panel is positioned.

The panel may be any one of a touch panel and a display panel, and an outer lift pin may be disposed outside the lower stage to seat one of the touch panel and the display panel on the lower stage.

Each of the first upper lift pin group and the second upper lift pin group may include a first control valve and a second control valve for controlling supply and interruption of suction force.

The chamber may include an upper lift pin lift unit configured to lift the first upper lift pin group and the second upper lift pin group.

The upper stage may include an upper seating stage replaceable according to the size of the touch panel and the display panel, and the lower stage may include a lower seating stage replaceable according to the size of the touch panel and the display panel.

The chamber may include an upper chamber and a lower chamber, and may include an upper chamber elevating unit for elevating the upper chamber to the lower chamber side.

The side of the lower chamber has a connecting rod connected to the side of the lower stage through the side of the lower chamber, the alignment stage may be connected to the connecting rod to align the lower stage.

An upper stage lifter for lowering the upper stage to its own weight may be provided at an upper portion of the upper chamber.

An alignment mark photographing camera for aligning the touch panel and the panel of the display may be provided below the chamber.

The panel bonding apparatus for attaching the touch panel and the display panel according to the present invention enables the touch panel and the display panel to be automatically bonded, and also allows the touch panel to be bonded to a variety of sizes of the display panel. There is an effect to increase the bonding efficiency and productivity.

1 is an external view of a panel bonding apparatus for bonding a touch panel and a display panel according to an exemplary embodiment of the present invention.
2 is a cross-sectional view showing a panel bonding apparatus for bonding the touch panel and the display panel according to an embodiment of the present invention.
3 to 5 are diagrams for explaining a perspective view and an operation of the upper lift pin of the panel bonding apparatus for bonding the touch panel and the display panel according to an embodiment of the present invention.
FIG. 6 is a perspective view illustrating a lower chamber and a lower stage of a panel bonding apparatus for attaching a touch panel and a display panel according to an exemplary embodiment of the present invention.
7 to 10 are views for explaining the operation of the panel bonding device for bonding the touch panel and the display panel according to an embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. The panel bonding apparatus described below is a device which attaches a touch panel to various flat panel display panels. The display panel for this purpose is a state in which an image display is finally possible, and is before being finally attached to the electronic device, and the touch panel is also finally in a state in which manufacture is completed and can be attached to the electronic device to the display panel. Therefore, the bonding process is performed on the touch panel and the display panel in a state in which a circuit board such as a flexible circuit board for connecting the electronic device is connected to each other.

In the following embodiments, any one of the touch panel and the display panel will be named as a first panel, and the other one of the touch panel or display panel will be named and described as a second panel.

1 is an external view of a panel bonding apparatus for bonding a touch panel and a display panel according to an embodiment of the present invention, Figure 2 shows a panel bonding apparatus for bonding a touch panel and a display panel according to an embodiment of the present invention. One cross section.

As shown in FIG. 1 and FIG. 2, the panel bonding apparatus for bonding the touch panel and the display panel includes a chamber. The chamber 200 includes an upper chamber 200 and a lower chamber 300.

An upper stage 210 is provided inside the upper chamber 200. The lower surface of the upper stage 210 may be separated from the upper stage 210, and an upper seating stage 240 on which the first panel 20 is seated is installed. The upper seating stage 240 is replaceable according to the size of the panel.

The upper seating stage 240 is provided with a plurality of upper adhesive chucks 250. The upper adhesive chuck 250 includes an adhesive resin for adhering the first panel 20 and a diaphragm for separating the first panel 20 attached to the adhesive resin from the adhesive resin.

In addition, an upper stage elevating unit 220 is provided at an upper outer side of the upper chamber 200 to raise or lower the upper stage 210 together with the upper seating stage 240. The upper stage lifting unit 220 includes a linear driving block 220a for driving in the horizontal direction. The linear driving block 220a is connected to the upper stage 210 and is inclinedly stacked on the lower surface of the inclined block 211a installed on the driving support plate 211 exposed to the upper outside of the upper chamber 200.

Therefore, as the linear drive block 220a moves horizontally in one direction or the other direction, the inclined block 211a slides along the surface of the linear drive block 220a, and thus the driving support plate 211 is moved to the upper stage 210. And descending up and down with. The linear guide 230 supporting the driving support plate 211 in the vertical direction is installed on the upper chamber 200 so that the lifting direction of the upper stage 210 is maintained in the vertical direction.

Meanwhile, a plurality of lamps 270 are installed in the upper chamber 200. The lamp 270 is installed to temporarily harden the adhesive applied between the first panel 20 and the second panel 30 when the first panel 20 and the second panel 30 are bonded together. will be. The lamp 270 may be implemented as an ultraviolet lamp or an LED lamp.

In addition, an upper lift pin 260 penetrating the upper chamber 200, the upper stage 210, and the upper seating stage 240 is installed at an outer upper portion of the upper chamber 200. The upper lift pin 260 may vacuum suction the panel.

As shown in FIGS. 3 to 5, the upper lift pin 260 may include a first upper lift pin group 206a and a first upper lift pin group 260a that absorb the first panel 20 of a predetermined size. The second upper lift pin group 260b is provided at another position and adsorbs the panel 20 'having a larger area than the first panel having a predetermined size together with the first upper lift pin group 260a. In addition, the upper lift pin 260 may further include a third upper lift pin group 260c and a fourth upper lift pin group (not shown) in addition to the first upper lift pin group 260a and the second upper lift pin group 260b. Can be installed to adsorb larger panels (not shown). The upper lift pin 260 is installed on the upper lift pin lifting plate 259.

The upper lift pin plate 259 is lifted by the upper lift pin lifter 261 provided outside the upper chamber 200, and the upper lift pin plate 259 is lifted at the end of the connecting rod 263 of the upper lift pin lifter 261. The pin plate 259 is connected to lift the upper lift pin plate 259.

Each of the first upper lift pin group 260a and the second upper lift pin group 260b includes a first control valve 260a 'and a second control for controlling supply and interruption of suction force by the suction pump P. FIG. Valve 260b '. The first control valve 260a 'and the second control valve 260b' are controlled by the controller 267. The controller 267 opens the first control valve 260a 'when the first panel 20 having a predetermined size is attracted by the first upper lift pin group 260a, and opens the second upper lift pin group. The second control valve 260b 'is closed to 260b so that the suction force is not transmitted.

That is, as illustrated in FIG. 4, when the first panel 20 having a predetermined size is adsorbed, the first control valve 260a ′ is opened to adsorb through the adsorption force. At this time, the second control valve 260b 'and the third control valve 260c' are closed by the controller 267, and the suction force is applied to the second upper lift pin group 260b and the third upper lift pin group 260c. It will not be delivered.

Meanwhile, as shown in FIG. 5, when the panel 20 'having a larger area than the first panel 20 having a predetermined size is adsorbed, the first control valve 260a' and the second control valve 260b 'are absorbed. Open to adsorb the panel 20 'through the first control valve 260a' and the second control valve 260b ', and close the third control valve 260c' to the third upper lift pin group 260c. The adsorption force is not transmitted. If a larger area panel (not shown) is adsorbed, the first control valve 260a 'to the third control valve 260c' are opened to open the first upper lift pin group 260a to the third upper lift. The panel is adsorbed through all of the fin groups 260c.

Grouping the upper lift pins 260 into a form capable of adsorbing the predetermined panels 20, 20 ', absorbs the small size of the first panel 20 through the first upper lift pin group 260a. In this case, when the suction force is also provided to the second upper lift pin group 260b and the third upper lift pin group 260c, since there is no adsorption object, it becomes a leaky element and is not absorbed. That is, it is to be able to elastically absorb the panels 20, 20 'of various sizes.

The arrangement of the upper lift pins 260 may take a variety of forms. As shown in the drawing, the shape of the panel 20 (20 ') extends in the width direction stepwise based on the long side or the step of the length of the panel 20 (20') extending in the long direction stepwise Or the like.

In addition, it is also possible to form in a step-wise expansion or evenly disposed overall with respect to the diagonal length of the panel 20 (20 ').

Adsorption pump (P) for providing the adsorption force to the upper lift pin 260 may be used as shown, there may be a method of individually controlling by using a plurality of forms, such as a small capacity as necessary.

In addition, a lower stage 310 on which the second panel 30 is mounted is provided inside the lower chamber 300. FIG. 6 is a perspective view illustrating a lower chamber and a lower stage of a panel bonding apparatus for bonding a touch panel and a display panel according to an exemplary embodiment of the present invention.

As shown in FIG. 6, the lower stage 310 occupies a portion of the inner space of the lower chamber 300. In addition, a flexible circuit board connected to the first panel 20 or the second panel 30 is exposed to the inside of the chamber 100 during the bonding process on the side of the lower stage 310 of the lower chamber 300. A circuit board position portion 390 is formed. Therefore, when the first panel 20 and the second panel 30 are bonded together, the flexible circuit board of the first panel 20 is stably positioned in the chamber 100 without external interference.

A lower seating stage 320 may be installed on the upper surface of the lower stage 310 and may be coupled to the lower stage 310, and the second panel 30 may be seated on the upper surface. The lower seating stage 320 is replaceable according to the size of the panel. A lower lift pin 340 penetrating the lower chamber 300, the lower stage 310, and the lower seating stage 320 is installed below the lower chamber 300.

Meanwhile, the lower seating stage 320 is provided with a plurality of lower sticking chucks 330. The lower adhesive chuck 330 includes an adhesive resin for adhering the second panel 30, and an adsorption hole for adsorbing the panel is formed between the adhesive resins. An outer side of the lower chamber 300 is provided with an alignment stage 360 in the form of a square frame spaced apart in the outward direction of the lower chamber 300.

Alignment stage 360 is provided in a configuration that can be moved back and forth, left and right and rotation. To this end, a first direction guide 361a for guiding the alignment stage 360 to be movable in a first direction and a second for guiding movement in a second direction, which is perpendicular to the first direction, below the alignment stage 360. The two-way guide 361b is stacked and provided, and the alignment driver 361 includes a motor for driving the lower second direction guide 361b. One alignment driver 361 is provided at each of three lower edges of the alignment stage 360. In addition, a rotatable shaft is installed at an edge of the alignment stage 360, and the alignment stage 360 is configured to be rotatable as the plurality of alignment drivers 361 operate.

In addition, four long holes 360a are formed in the alignment stage 360. The long holes 360a penetrate the shaft of the upper chamber lifting part 400 for the lifting of the upper chamber 200 to allow the upper chamber 200 to pass through. Extending to the side is coupled to the edge portion of the upper chamber 200. The reason why the long hole 360a is formed in the alignment stage 360 is to prevent the axis of the upper chamber lift 400 from interfering when the alignment stage 360 is operated for alignment.

In addition, a connection rod 370 is installed on an inner side surface of the alignment stage to be coupled to a side surface of the lower stage 310 positioned inside the lower chamber 300 through the side surface of the lower chamber 300. The connecting rod 370 is to synchronize the alignment operation of the alignment stage 360 and the lower stage 310 so that the lower stage 310 is aligned by the alignment operation of the alignment stage 360.

In addition, a bellows 380 is installed outside the surface exposed into the lower chamber 300 of the connection rod 370 to prevent vacuum leakage. In addition, at least one camera 350 is installed at an outer lower portion of the lower chamber 300 to identify the alignment marks formed on the panels 20 and 30 for bonding the panels 20 and 30.

Hereinafter, the operation of the panel bonding apparatus for bonding the first panel 20 and the second panel 30 according to the embodiment of the present invention configured as described above will be described. 7 to 10 are views for explaining the operation of the panel bonding device for bonding the first panel and the second panel according to an embodiment of the present invention.

In the embodiment of the present invention, the second panel 30 is seated on the lower stage 310 and the first panel 20 is seated on the upper stage 210. However, the mounting position of the first panel 20 and the second panel 30 may be changed.

As shown in FIG. 7, when the first panel 20 enters from the outside, the entire upper lift pin 260 is lowered, and the first panel 20 is absorbed by the suction force provided to the first upper lift pin group 260a. 20) Adsorb. In this case, the second control valve 260b 'and the third control valve 260c' are controlled by the controller 267 so that the suction force is not applied to the second upper lift pin group 260b and the third upper lift pin group 260c. Is closed. The upper lift pin 260 is raised to allow the first panel 20 to adhere to the upper adhesive chuck 250.

When the second panel 30 enters, the lower lift pin 340 is raised to support the second panel 30 and then descend. Accordingly, the second panel 30 is adhered to the lower adhesive chuck 330. In this case, the flexible printed circuit board coupled to the second panel 30 may be located at the circuit board position part 390 inside the lower chamber 300 of the chamber 100.

Thereafter, as shown in FIG. 8, the upper chamber 200 is lowered by the upper chamber elevating unit 400. As the upper chamber 200 descends, the upper chamber 200 and the lower chamber 300 are in close contact with each other, and the inside of the chamber 100 is sealed. In addition, vacuum pumping is performed to the inside of the chamber 100, and the inside of the chamber 100 is in a vacuum state.

While the interior of the chamber 100 is in a vacuum state or after the vacuum state, the lower stage 310 is aligned in the front, rear, left, and right directions by the alignment stage 360. The alignment operation of the alignment stage 360 is transmitted to the lower stage 310 through the connecting rod 370 so that the lower stage 310 is aligned. In order to determine the alignment position at the time of alignment, the camera 350 finds the alignment position by photographing the alignment marks formed on the first panel 20 and the second panel 30. The operation algorithm of the alignment stage 360 for alignment is performed by the control unit of the panel bonding apparatus 10 (not shown) to transmit a signal for alignment to the alignment driver 361 installed in the alignment stage 360. This is achieved by operating the driver 361 at a set value.

As shown in FIG. 9, the upper stage 210 is moved by the upper stage lifter 220 during the alignment of the first panel 20 and the second panel 30 or after the alignment is completed. 310) to the side. As the lower stage 210 descends, the linear driving block 220a of the upper stage lifter 220 moves together as the upper stage lifter 220 linearly drives in the lateral direction, and thus the driving support plate 211 is moved. The inclined block 211a of the linear driving block 220a descends and slides, so that the upper stage 210 descends.

As the upper stage 210 descends, the first panel 20 and the second panel 30 are closely bonded to each other by the weight of the upper stage 210, the driving support plate 211, and the upper stage 210. do.

Meanwhile, as shown in FIG. 10, the bonding is performed by pressing the first panel 20 by the weight of the driving support plate 211 and the upper stage 210 of the first panel 20 and the second panel 30. Adhesion is made firmly. In addition, the diaphragm of the adhesive chuck 250 is expanded so that the upper first panel 20 is separated from the upper adhesive chuck 250 of the upper seating stage 240, and together with the upper stage lifting unit 220, When the upper stage 210, the driving support plate 211, and the upper seating stage 240 are raised by returning to the direction of, the bonding is completed. When the lamp is attached, illumination of the lamp 270 is irradiated to temporarily harden the adhesive between the first panel 20 and the second panel 30. Then, although not shown in the drawings, the robot is brought in and brought out to the outside, and the bonding and the carrying out of the first panel 20 and the second panel 30 are completed.

The embodiments of the present invention have been described through the embodiments described in the drawings and the detailed description of the present invention, but these are merely exemplary, and those skilled in the art to which the present invention pertains have various modifications and equivalents therefrom. Examples are possible. Therefore, the technical protection scope of the present invention will be defined by the appended claims.

100 ... chamber
200 ... upper chamber
210 ... upper stage
240.Top seating stage
250 ... upper adhesion chuck
260 ... upper lift pin
300 ... lower chamber
320 ... lower seating stage
400 ... upper chamber lift

Claims (11)

chamber;
An upper stage provided inside the chamber;
A lower stage provided inside the chamber;
A first upper lift pin group provided outside the upper stage to suck a panel having a predetermined size;
A second upper lift pin group provided at a position different from the first upper lift pin group of the upper stage and adsorbing the panel having an area larger than the predetermined size panel together with the first upper lift pin group;
And a control panel for controlling the display panel so as to prevent a suction force from being transmitted to the second upper lift pin group when the panel having the predetermined size is absorbed by the first upper lift pin group.
The display panel of claim 1, wherein the panel is any one of a touch panel and a display panel, and one of the touch panel and the display panel is positioned at the upper stage, and the other of the touch panel and the display panel is positioned at the lower stage. Is positioned, and the panel attaches the panel and the touch panel including the upper adhesive chuck to adhere the panel adsorbed by the first upper lift pin group and the second upper lift pin group to the upper stage. Device.
The touch panel as claimed in claim 1, wherein the panel is any one of a touch panel and a display panel, and the lower stage includes a touch panel including a lower adhesive chuck to maintain adhesion when one of the touch panel and the display panel is positioned. Panel fixing device for attaching the display panel.
The touch panel as claimed in claim 1, wherein the panel is any one of a touch panel and a display panel, and an outer side of the lower stage includes a lower lift pin for mounting one of the touch panel and the display panel to the lower stage. Panel bonding device for bonding panels and display panels together.
The touch panel and display panel of claim 1, wherein each of the first upper lift pin group and the second upper lift pin group includes a first control valve and a second control valve for controlling supply and interruption of suction force. Panel bonding device for bonding.
The panel bonding apparatus of claim 1, wherein the chamber includes a touch panel and a display panel including an upper lift pin lift unit configured to lift the first upper lift pin group and the second upper lift pin group.
According to claim 1, The upper stage is provided with an upper mounting stage that can be replaced according to the size of the touch panel and the display panel,
The panel bonding apparatus for bonding the display panel and the touch panel including a lower mounting stage that can be replaced according to the size of the touch panel and the display panel on the lower stage.
The panel bonding apparatus of claim 1, wherein the chamber includes an upper chamber and a lower chamber, and the touch panel and the display panel are attached to each other, wherein the upper panel and the upper chamber are provided to elevate the upper chamber.
The touch panel of claim 8, wherein a side of the lower chamber has a connecting rod connected to a side of the lower stage through a side of the lower chamber, and the alignment stage is connected to the connecting rod to align the lower stage. Panel bonding device for bonding panels and display panels together.
The panel bonding apparatus of claim 8, wherein the touch panel and the display panel are attached to an upper portion of the upper chamber, the upper panel elevating unit lowering the upper stage to its own weight.
The panel bonding apparatus of claim 1, wherein an alignment mark photographing camera for aligning the touch panel and the panel of the display is attached to the lower side of the chamber.

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