KR101274180B1 - Panel attaching apparatus - Google Patents

Abstract

The present invention is to provide a panel bonding apparatus that the circuit wiring protruding from each panel does not cause interference in the process of bonding the touch panel and the display panel. The panel bonding apparatus according to the present invention for solving this problem is a chamber, an upper stage positioned inside the chamber and supporting the first panel, and a lower stage positioned inside the chamber and supporting the second panel different from the first panel. And an elevating unit installed in the chamber to elevate at least one of the upper stage and the lower stage, wherein at least one of the first panel and the second panel is attached and extended with a circuit board, A circuit board position portion is formed to position the circuit board so as to join the first panel and the second panel together.

Description

Panel Mounting Device {PANEL ATTACHING APPARATUS}

The present invention relates to a panel bonding apparatus, and more particularly, to an apparatus for bonding the first panel and the second panel to each other.

Recently, a touch panel attached to the surface of a display panel is used as an input means in a flat panel display device. The touch panel is manufactured separately from the display panel and then attached to the surface of the display panel, and the touch panel and the display panel are then installed in the electronic device.

When the touch panels are attached to each other on the display panel, the touch panel and the display panel are finally manufactured as final products for mounting on the electronic device, and the display panel is also manufactured.

Therefore, since the circuit wiring is exposed to the outside of the touch panel and the display panel, and the touch panel and the display panel are bonded while the circuit wirings are connected, the alignment of the two panels for bonding is not easy.

In addition, since the size of the display panel is different for each electronic device, the touch panel is manufactured in various sizes and bonded to the display panel. However, the bonding of the touch panel and the display panel is mostly made by human hands, and thus, there is a problem in that the production cost of the product is increased and the production efficiency is lowered.

The present invention is to solve the above problems, an object of the present invention is to provide a panel bonding apparatus for automatically bonding the touch panel and the display panel.

In addition, the present invention provides a panel bonding apparatus in which circuit wiring protruding from each panel does not cause interference in the process of bonding the touch panel and the display panel.

Technical problems of the present invention are not limited to the above-mentioned technical problems, and other technical problems that are not mentioned will be clearly understood by those skilled in the art from the following description.

Panel bonding apparatus according to the present invention for solving the above problems the chamber; An upper stage positioned above the inner side of the chamber and supporting the first panel; A lower stage positioned below the inside of the chamber and supporting a second panel different from the first panel; And an elevating unit installed in the chamber to allow the first panel and the second panel to be bonded to each other by elevating at least one of the upper stage and the lower stage, wherein the first panel is located inside the chamber. And a circuit board position portion on which the circuit board may be positioned so as to bond the first panel and the second panel to each other without interference of a circuit board attached to and extending from at least one of the second panels.

In addition, the circuit board position portion may prevent the circuit board from being crimped between the upper stage and the lower stage when the upper stage and the lower stage approach each other to compress the first panel and the second panel. And a recess or a through portion formed in at least one of the lower stages.

Further, a distance from at least one of the upper side and the lower stage to the chamber inner surface facing the first side may be from the second side surface to the chamber inner surface facing the second side. The first and second lower stages are formed to be farther away from each other, and the first and second lower stages are compressed so that the circuit board is not crimped between the upper and lower stages when the upper and lower stages are pressed together. The circuit board may be located between the inner surface of the chamber facing the first side surface from a side surface.

The circuit board may further include a circuit board support part provided at the circuit board position part to support the circuit board.

In addition, the elevating unit for elevating the circuit board support may be further included.

The apparatus may further include a lift pin installed on the lower stage so as to lift the second panel. The lift unit may be configured to lift the lift pin and the circuit board support at the same time or separately.

The apparatus may further include an alignment stage that adjusts a position of at least one of the upper stage and the lower stage to align the first panel and the second panel before bonding to each other.

According to the present invention, the circuit wiring protruding from each panel has an effect of preventing interference that may occur in the process of bonding the touch panel and the display panel.

In addition, as the sagging of the circuit wiring is prevented inside the chamber for bonding, the quality of the bonding is improved.

The technical effects of the present invention are not limited to the above-mentioned effects, and other technical effects not mentioned will be clearly understood by those skilled in the art from the following description.

1 is a perspective view of a panel bonding apparatus for bonding a touch panel and a display panel according to an embodiment of the present invention.
2 is a cross-sectional view of a panel bonding apparatus for bonding a touch panel and a display panel according to an exemplary embodiment of the present invention.
3 is a perspective view illustrating a lower chamber and a lower stage of a panel bonding apparatus for bonding a touch panel and a display panel according to an exemplary embodiment of the present invention.
4 to 7 are views for explaining the operation of the panel bonding device for bonding the first panel and the second panel according to an embodiment of the present invention.
FIG. 8 is a partial side cross-sectional view of the panel bonding apparatus according to the embodiment of the present invention viewed from the side along the line AA ′ of FIG. 3.
9 and 10 are operation diagrams for explaining the operation of the circuit board support.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the present embodiment is not limited to the embodiments disclosed below, but can be implemented in various forms, and only this embodiment makes the disclosure of the present invention complete, and the scope of the invention to those skilled in the art. It is provided for complete information. Shapes of the elements in the drawings may be exaggerated parts for a more clear description, elements denoted by the same reference numerals in the drawings means the same element.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. The panel bonding apparatus described below is a system for attaching a touch panel to various flat panel display panels. The display panel for this purpose is a state in which an image can be finally displayed, and is before being finally attached to the electronic device. The touch panel is also finally manufactured and can be attached to the electronic device together with the display panel. Therefore, the bonding process is performed on the touch panel and the display panel while the flexible circuit board for connection with the electronic device is connected to each other.

In the following embodiments, any one of the touch panel and the display panel will be named as a first panel, and the other one of the touch panel or display panel will be named and described as a second panel.

1 is a perspective view of a panel bonding apparatus for bonding a touch panel and a display panel according to an embodiment of the present invention.

2 is a cross-sectional view of a panel bonding apparatus for bonding a touch panel and a display panel according to an exemplary embodiment of the present invention.

As shown in FIG. 1 and FIG. 2, the panel bonding apparatus 10 for bonding the touch panel and the display panel includes a chamber 100. The chamber 100 includes an upper chamber 200 and a lower chamber 300.

An upper stage 210 is provided inside the upper chamber 200. The lower surface of the upper stage 210 may be separated from the upper stage 210, and an upper seating stage 240 on which the first panel 20 is seated is installed. The upper seating stage 240 is replaceable according to the size of the panel.

In addition, an upper lift pin 260 is installed at an outer upper portion of the upper chamber 200 to penetrate the upper chamber 200, the upper stage 210, and the upper seating stage 240 and to simultaneously lift. The upper lift pin 260 may vacuum suction the panel.

The upper seating stage 240 is provided with a plurality of upper adhesive chucks 250. The upper adhesive chuck 250 includes an adhesive resin for adhering the first panel 20 and a diaphragm for separating the first panel 20 attached to the adhesive resin from the adhesive resin.

In another embodiment, an electrostatic chuck, an adsorption chuck, or other supporting means may be used in addition to the adhesive chuck.

In addition, an upper stage elevating unit 220 is provided at an upper outer side of the upper chamber 200 to raise or lower the upper stage 210 together with the upper seating stage 240. The upper stage lifting unit 220 includes a linear driving block 220a for driving in the horizontal direction. The linear driving block 220a is connected to the upper stage 210 and is inclinedly stacked on the lower surface of the inclined block 211a installed on the driving support plate 211 exposed to the upper outside of the upper chamber 200.

Therefore, as the linear drive block 220a moves horizontally in one direction or the other direction, the inclined block 211a slides along the surface of the linear drive block 220a, and thus the driving support plate 211 is moved to the upper stage 210. And up and down together. The linear guide 230 supporting the driving support plate 211 in the vertical direction is installed on the upper chamber 200 so that the lifting direction of the upper stage 210 is maintained in the vertical direction.

In another embodiment, the upper stage 210 and the lower stage 310 may be configured to include a lift unit for lifting or lowering only the lower stage 310, respectively.

Meanwhile, a plurality of lamps 270 are installed in the upper chamber 200. The lamp 270 is installed for temporary curing of the adhesive applied between the first panel 20 and the second panel 30 when the first panel 20 and the second panel 30 are bonded together. will be. The lamp 270 may be implemented as an ultraviolet lamp or an LED lamp.

In addition, a lower stage 310 on which the second panel 30 is mounted is provided inside the lower chamber 300.

3 is a perspective view illustrating a lower chamber and a lower stage of a panel bonding apparatus for bonding a touch panel and a display panel according to an exemplary embodiment of the present invention.

As shown in FIGS. 2 and 3, the lower stage 310 is located inside the lower chamber 300. In addition, a flexible circuit board connected to the first panel 20 or the second panel 30 is exposed to the inside of the chamber 100 during the bonding process on the side of the lower stage 310 of the lower chamber 300. A circuit board position portion 390 is formed. Therefore, when the first panel 20 and the second panel 30 are bonded together, the flexible circuit board of the first panel 20 is stably positioned in the chamber 100 without external interference.

That is, the circuit board position part 390 is the upper stage 210 and the lower stage when the upper stage 210 and the lower stage 310 approaches each other to compress the first panel 20 and the second panel 30. The upper and lower spaces (through parts) formed in the lower stage 310 to prevent the flexible circuit board from being compressed between the 310.

In another embodiment, the circuit board location portion may include a recess formed in the lower stage. In another embodiment, the circuit board position portion may be provided in the upper stage, or may be provided in both the upper stage and the lower stage.

In another embodiment, between the upper stage 210 and the lower stage 310 when the upper stage 210 and the lower stage 310 approach each other to compress the first panel 20 and the second panel 30. An inner surface of the chamber facing the one side (first side) from at least one side (first side) of at least one of the upper stage 210 and the lower stage 310 so that the flexible circuit board can be placed in a non-compressed position. The distance to the (first inner surface) may be formed farther than the distance from the other side (second side) to the chamber inner surface (second inner side) facing the other side (second side). That is, for example, the chamber inner wall surface in which the distance from one side of the lower stage 310 (side toward the circuit board position) to the chamber inner wall surface faces each side in the remaining three sides of the lower stage 310. It may be formed to be farther than the distance to.

A lower seating stage 320 may be installed on the upper surface of the lower stage 310 and may be coupled to the lower stage 310, and the second panel 30 may be seated on the upper surface. The lower seating stage 320 is replaceable according to the size of the panel. A lower lift pin 340 penetrating the lower chamber 300, the lower stage 310, and the lower seating stage 320 is installed below the lower chamber 300.

Meanwhile, the lower seating stage 320 is provided with a plurality of lower sticking chucks 330. The lower adhesive chuck 330 includes an adhesive resin for adhering the second panel 30, and an adsorption hole for adsorbing the panel is formed between the adhesive resins. An outer side of the lower chamber 300 is provided with an alignment stage 360 in the form of a square frame spaced apart in the outward direction of the lower chamber 300.

Alignment stage 360 is provided in a configuration that can be moved back and forth, left and right and rotation. To this end, a first direction guide 361a for guiding the alignment stage 360 to be movable in a first direction and a second for guiding movement in a second direction, which is perpendicular to the first direction, below the alignment stage 360. The two-way guide 361b is stacked and provided, and the alignment driver 361 includes a motor for driving the lower second direction guide 361b. One alignment driver 361 is provided at each of three lower edges of the alignment stage 360. In addition, a rotatable shaft is installed at an edge of the alignment stage 360, and the alignment stage 360 is configured to be rotatable as the plurality of alignment drivers 361 operate.

In addition, four long holes 360a are formed in the alignment stage 360. The long holes 360a penetrate the shaft of the upper chamber lifting part 400 for the lifting of the upper chamber 200 to allow the upper chamber 200 to pass through. Extending to the side is coupled to the edge portion of the upper chamber 200. The reason why the long hole 360a is formed in the alignment stage 360 is to prevent the axis of the upper chamber lift 400 from interfering when the alignment stage 360 is operated for alignment.

In addition, a connection rod 370 is installed on an inner side surface of the alignment stage 360 to be coupled to a side surface of the lower stage 310 located inside the lower chamber 300 by penetrating the side surface of the lower chamber 300. The connecting rod 370 is to synchronize the alignment operation of the alignment stage 360 and the lower stage 310 so that the lower stage 310 is aligned by the alignment operation of the alignment stage 360.

In addition, a bellows 380 is installed outside the surface exposed into the lower chamber 300 of the connection rod 370 to prevent vacuum leakage. In addition, at least one camera 350 is installed at an outer lower portion of the lower chamber 300 to identify the alignment marks formed on the panels 20 and 30 for bonding the panels 20 and 30.

As another embodiment, the alignment stage may be arranged to align only the upper stage or to align both the upper and lower stages, respectively.

Hereinafter, the operation of the panel bonding apparatus for bonding the first panel 20 and the second panel 30 according to the embodiment of the present invention configured as described above will be described.

4 to 7 are views for explaining the operation of the panel bonding device for bonding the first panel and the second panel according to an embodiment of the present invention.

In the embodiment of the present invention, the second panel 30 is seated on the lower stage 310 and the first panel 20 is seated on the upper stage 210. However, the mounting position of the first panel 20 and the second panel 30 may be changed.

As shown in FIG. 4, when the first panel 20 enters from the outside, the upper lift pin 260 descends to adsorb the first panel 20. The upper lift pin 260 is raised to allow the first panel 20 to adhere to the upper adhesive chuck 250.

When the second panel 30 enters, the lower lift pin 340 is raised to support the second panel 30 and then descend. Accordingly, the second panel 30 is adhered to the lower adhesive chuck 330. In this case, the flexible printed circuit board coupled to the second panel 30 may be located at the circuit board position part 390 inside the lower chamber 300 of the chamber 100.

Thereafter, as shown in FIG. 5, the upper chamber 200 is lowered by the upper chamber lifting unit 400. As the upper chamber 200 descends, the upper chamber 200 and the lower chamber 300 are in close contact with each other, and the inside of the chamber 100 is sealed. In addition, vacuum pumping is performed to the inside of the chamber 100, and the inside of the chamber 100 is in a vacuum state.

While the interior of the chamber 100 is in a vacuum state or after the vacuum state, the lower stage 310 is aligned in the front, rear, left, and right directions by the alignment stage 360. The alignment operation of the alignment stage 360 is transmitted to the lower stage 310 through the connecting rod 370 so that the lower stage 310 is aligned. In order to determine the alignment position at the time of alignment, the camera 350 finds the alignment position by photographing the alignment marks formed on the first panel 20 and the second panel 30. The operation algorithm of the alignment stage 360 for alignment is performed by the control unit of the panel bonding apparatus 10 (not shown) to transmit a signal for alignment to the alignment driver 361 installed in the alignment stage 360. This is achieved by operating the alignment driver 361 at a set value.

As shown in FIG. 6, the upper stage 210 is moved by the upper stage lifter 220 during the alignment of the first panel 20 and the second panel 30 or after the alignment is completed. 310) to the side. As the lower stage 210 descends, the linear driving block 220a of the upper stage lifter 220 moves together as the upper stage lifter 220 linearly drives in the lateral direction, and thus the driving support plate 211 is moved. The inclined block 211a of the linear driving block 220a descends and slides, so that the upper stage 210 descends.

As the upper stage 210 descends, the first panel 20 and the second panel 30 are closely bonded to each other by the weight of the upper stage 210, the driving support plate 211, and the upper stage 210. do.

Meanwhile, as shown in FIG. 7, the bonding is performed by pressing the first panel 20 by the weight of the driving support plate 211 and the upper stage 210 of the first panel 20 and the second panel 30. Adhesion is made firmly. In addition, the diaphragm of the adhesive chuck 250 is expanded so that the upper first panel 20 is separated from the upper adhesive chuck 250 of the upper seating stage 240, and together with the upper stage lifting unit 220, When the upper stage 210, the driving support plate 211, and the upper seating stage 240 are raised by returning to the direction of, the bonding is completed. When the lamp is attached, illumination of the lamp 270 is irradiated to temporarily harden the adhesive between the first panel 20 and the second panel 30. Then, although not shown in the drawings, the robot is brought in and brought out to the outside, and the bonding and the carrying out of the first panel 20 and the second panel 30 are completed.

8 is a partial side cross-sectional view of the panel bonding apparatus according to the embodiment of the present invention viewed from the side along the line AA ′ of FIG. 3.

As shown in FIG. 8, the lower chamber 300 is fixed to the base 500. The lower stage 310 is installed to be slidable back, front, left, and right on an upper surface of the base 500. The connecting rod 370 is coupled to the lower stage 310 and is removably inserted into the through hole 301 formed in the lower chamber 300.

The bellows 380 is formed between the lower chamber 300 and the lower stage 310 by surrounding the connecting rod 370 so that outside air does not enter the reaction chamber formed between the upper chamber and the lower chamber through the through hole 301. It is installed to be located at.

The lower lift pin 340 is installed to be elevated by elevating means (not shown) in the through holes formed in each of the base 500, the lower stage 310, and the lower seating stage 320.

Meanwhile, the circuit board support part (circuit board lift pin) 341 is positioned at the circuit board position part 390 to support a flexible circuit board attached to the first panel 20 or the second panel 30. . The circuit board support part 341 may be installed to be elevated in a through hole formed in the base 500. A loading part 341a having a substantially flat upper surface may be installed at an upper end of the circuit board support 341 so that at least a portion of the flexible circuit board may be mounted on the upper surface.

In this embodiment, the circuit board support part 341 is formed to simultaneously lift up and down simultaneously with the lower lift pin 340. However, as another embodiment, the circuit board support 341 may be formed to be elevated apart from the lower lift pin 340. As another example, the circuit board support part 341 may be installed so as not to be elevated.

In this embodiment, the upper end of the circuit board support 341 is shown similarly to the upper end of the lower lift pin 340, but is not necessarily limited thereto. If necessary, the upper end of the circuit board support 341 may be the lower lift pin 340. It may be formed higher or lower than the top of.

9 and 10 are operation diagrams for explaining the operation of the circuit board support.

As shown in FIG. 9, when the second panel 30 to which the flexible circuit board 31 is attached is loaded on the upper surface of the lower seating stage 320, the flexible circuit board 31 may sag downward due to its own weight.

If the deflection of the flexible circuit board 31 occurs, a portion of the second panel 30 may be separated from the upper surface of the lower seating stage 320 or the flatness may be degraded in some cases. In such a case, product defects may occur in the bonding process of the first panel 20 and the second panel 30. Therefore, it is necessary to prevent the flexible circuit board 31 from drooping excessively. The circuit board support part 341 may allow the flexible circuit board 31 to maintain substantially the same height as the second panel 30, or at least so that the flatness of the second panel 30 does not decrease. ) Is provided to support.

As shown in FIG. 10, when the circuit board support part 341 is raised by elevating means (not shown), the flexible circuit board 31 that sags downward is also raised. The circuit board support 341 may be raised so that the flexible circuit board 31 maintains substantially the same height as the second panel 30. As a result, the flatness of the second panel 30 does not decrease.

An embodiment of the present invention described above and illustrated in the drawings should not be construed as limiting the technical idea of the present invention. The scope of protection of the present invention is limited only by the matters described in the claims, and those skilled in the art will be able to modify the technical idea of the present invention in various forms. Accordingly, such improvements and modifications will fall within the scope of the present invention as long as they are obvious to those skilled in the art.

Claims (7)

chamber;
An upper stage positioned above the inner side of the chamber and supporting the first panel;
A lower stage positioned below the inside of the chamber and supporting a second panel different from the first panel; And
And an elevating part installed in the chamber to allow the first panel and the second panel to be bonded to each other by elevating at least one of the upper stage and the lower stage.
A circuit in which the circuit board may be positioned in the chamber to bond the first panel and the second panel to each other without interference of a circuit board attached to and extending from at least one of the first panel and the second panel. A substrate location is formed,
The circuit board position portion may prevent the circuit board from being compressed between the upper stage and the lower stage when the upper stage and the lower stage approach each other to compress the first panel and the second panel. Panel mounting apparatus comprising a recess or a through formed in at least one of the lower stage.
delete The method of claim 1,
The upper stage and the lower stage is provided in a rectangular shape,
The distance from the first side of at least one of the upper stage and the lower stage to the inside surface of the chamber facing the first side is opposite to the second side from the second side, which is the other side except the first side. The beam is formed to be farther than a distance to the inner surface of the chamber, and the circuit board is disposed between the upper stage and the lower stage when the upper stage and the lower stage approach each other to compress the first panel and the second panel. And the circuit board is positioned between the inner surface of the chamber facing the first side from the first side so as not to be compressed.
The method of claim 1,
And a circuit board support portion provided in the circuit board position portion to support the circuit board.
5. The method of claim 4,
And a lifter configured to lift and lower the circuit board support.
The method of claim 5,
It further includes a lift pin installed to be liftable on the lower stage to elevate the second panel,
And the elevating unit is configured to elevate the lift pin and the circuit board support at the same time or separately.
The method of claim 1,
And an alignment stage for adjusting the position of at least one of the upper stage and the lower stage to align the first panel and the second panel before bonding to each other.

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