JP5810207B1 - Board assembly apparatus and board assembly method using the same - Google Patents

Abstract

An object of the present invention is to provide a substrate assembling apparatus and a substrate assembling method using the same, which can reduce errors generated when an upper substrate and a lower substrate are bonded to each other and increase the bonding positional accuracy. A plurality of adhesive pins 8 that protrude from an upper substrate surface 3a and hold an upper substrate K1, a Z-axis drive mechanism that advances the adhesive pins 8 and the upper table 3 toward the lower table, and a plurality of adhesive pins 8 Are provided with a plurality of adhesive pin plates 8a and a vertical movement mechanism 80 for independently operating the adhesive pin plates 8a vertically with respect to the upper substrate surface 3a. The adhesive pins 8 are set for each adhesive pin plate 8a. The upper substrate K1 is held by protruding from the upper substrate surface 3a by the projected amount, and the upper substrate K1 held by the adhesive pins 8 is bonded to the lower substrate in a vacuum environment, and the lower substrate and the upper substrate K1 are bonded to each other. At this time, the adhesive pins 8 are pulled from the upper substrate surface 3a, and the upper table 3 presses the upper substrate K1 and the lower substrate. [Selection] Figure 3

Description

  The present invention relates to a board assembly apparatus and a board assembly method using the board assembly apparatus.

  In Patent Document 1, “In the present invention, a hole for allowing an adhesive pin to pass through is provided in the upper table provided inside the upper chamber, and a magnet and a screw hole are further provided for fixing a plate having an elastic body. In addition, the vertical mechanism of the adhesive pin can be operated independently of the vertical mechanism of the upper table, and a servo motor or stepping motor capable of speed and position control is used for driving. Accordingly, the configuration is such that an optimum separation condition can be created ”(see paragraph 0006).

Japanese Patent No. 4379435

The substrate assembly apparatus described in Patent Document 1 moves the lower substrate while the upper substrate is held (adhesion held) by a plurality of adhesive pins, and aligns the lower substrate and the upper substrate. The plurality of adhesive pins are attached to one adhesive pin plate, and all the adhesive pins operate integrally (up and down movement).
The upper substrate and the lower substrate are produced in separate processes, and there may be a dimensional difference in the vertical and horizontal directions. The substrate assembly apparatus of Patent Document 1 aligns an upper substrate and a lower substrate so as to suppress a positional shift caused by a dimensional difference within an allowable range.

  It is an object of the present invention to provide a substrate assembling apparatus and a substrate assembling method using the same, which can reduce an error generated when the upper substrate and the lower substrate are bonded to each other and increase the positional accuracy of the bonding. .

  In order to solve the above problems, the present invention provides a substrate assembly apparatus for bonding a lower substrate held on a lower substrate surface of a lower table, an upper substrate held on an upper substrate surface of an upper table, and a substrate assembly method using the same. And The upper substrate held in a curved state with respect to the upper substrate surface is bonded to the lower substrate.

  According to the present invention, it is possible to provide a substrate assembling apparatus and a substrate assembling method using the same, which can reduce errors generated when the upper substrate and the lower substrate are bonded to each other and increase the positional accuracy of the bonding. As a result, it is possible to effectively correct the mark pitch deviation that occurs between the upper substrate and the lower substrate.

It is a figure which shows a board | substrate assembly apparatus. It is a figure which shows a support pin. It is a figure which shows an adhesive pin. It is a figure which shows the upper board | substrate surface of an upper table. (A) is a figure which shows a lower table, (b) is sectional drawing in Sec1-Sec1. It is a figure which shows the process of bonding a board | substrate with a board | substrate assembly apparatus. It is a figure which shows the marking for adjusting the bonding position of an upper board | substrate and a lower board | substrate, Comprising: (a) is a figure which shows the upper mark attached | subjected to an upper board | substrate, (b) is the lower mark attached | subjected to a lower board | substrate. FIG. (A) is a figure which shows the shift | offset | difference in an XY-axis direction, (b) is a figure which shows the state in which the shift | offset | difference in the XY-axis direction was adjusted. (A) is a figure which shows the shift | offset | difference around a Z-axis, (b) is a figure which shows the state in which the shift | offset | difference around a Z-axis was adjusted. It is a figure which shows the state in which the shift | offset | difference of a 1st upper mark and a 1st lower mark is in a regulation range, (a) is a figure which shows the state in which a 1st upper mark is in the center of a 1st lower mark, (b) is It is a figure which shows the state which the 1st upper mark shifted | deviated from the center of the 1st lower mark. It is a figure which shows the state which changes the protrusion amount of an adhesive pin and reduces the shift | offset | difference of an upper board | substrate and a lower board | substrate, (a) is a figure which shows the state which the 1st upper mark and 1st lower mark have shifted | deviated, (b) FIG. 5 is a diagram showing a state in which the deviation between the first upper mark and the first lower mark is reduced. It is a figure which shows the example of a design change, Comprising: (a) is a figure which shows the state from which the protrusion amount of the adhesive pin attached to one adhesive pin plate differs, (b) is one up-and-down moving mechanism in one adhesive pin. It is a figure which shows the structure provided.

  Hereinafter, a board assembly apparatus and a board assembly method according to embodiments of the present invention will be described in detail with reference to the drawings as appropriate. In the drawings shown below, common members are denoted by the same reference numerals, and redundant descriptions are omitted as appropriate.

FIG. 1 is a diagram showing a board assembly apparatus.
The substrate assembling apparatus 1 is an apparatus for assembling a substrate such as a liquid crystal panel by bonding an upper substrate K1 (glass substrate) and a lower substrate K2 (glass substrate) carried by a transfer device 200 such as a robot hand in a vacuum. The board assembly apparatus 1 is controlled by the control apparatus 100.
The board assembly apparatus 1 includes a gantry 1 a and an upper frame 2. The gantry 1a is placed on an installation surface (floor surface or the like). The upper frame 2 is provided so as to be vertically movable above the gantry 1a.
The upper frame 2 is attached to a first drive mechanism (Z-axis drive mechanism 20) attached to the gantry 1a via a load cell 20d.

  The substrate assembly apparatus 1 includes an upper table 3 and a lower table 4. The lower table 4 is attached to the gantry 1a via a moving unit (XYθ moving unit 40). The XYθ moving unit 40 is configured to be movable independently of the gantry 1a in two orthogonal directions (X-axis and Y-axis). Further, the XYθ moving unit 40 is configured to be rotatable around the Z axis with respect to the gantry 1a. As the XYθ moving unit 40, a unit using a ball bear or the like that is fixed in the Z-axis direction and can freely move in the XY-axis direction can be used.

In the substrate assembly apparatus 1 of the present embodiment, the direction of the upper frame 2 with respect to the gantry 1a is the Z-axis direction (vertical direction). Also, the direction of one axis orthogonal to the Z axis is defined as the X axis direction (lateral direction), and the direction of one axis orthogonal to the Z axis and the X axis is defined as the Y axis direction (vertical direction).
The upper table 3 and the lower table 4 have a rectangular shape with the Y-axis direction and the X-axis direction as vertical and horizontal directions.

The upper frame 2 is attached to the gantry 1 a via the Z-axis drive mechanism 20. The Z-axis drive mechanism 20 has a ball screw mechanism 20b that moves a ball screw shaft 20a extending in the Z-axis direction (vertical direction) up and down. The ball screw shaft 20a is rotated by the electric motor 20c and moved up and down by the ball screw mechanism 20b.
The electric motor 20c is controlled by the control device 100, and the upper frame 2 is displaced (moves up and down) based on the calculation of the control device 100.

  The upper table 3 is fixed to the upper frame 2 via a plurality of upper shafts 2a, and the upper frame 2 and the upper table 3 move up and down together. An upper chamber 5 a is disposed around the upper table 3. The upper chamber 5a is arranged so that the lower side (the side of the gantry 1a) is open and covers the upper side and the side of the upper table 3.

The upper chamber 5 a is attached to the upper frame 2 via a suspension mechanism 6. The suspension mechanism 6 includes a support shaft 6a that extends downward from the upper frame 2, and a locking portion 6b that is formed such that the lower end portion of the support shaft 6a expands in a flange shape.
The upper chamber 5a is provided with a hook 6c. The hook 6c freely moves up and down around the support shaft 6a. The hook 6c engages with the locking portion 6b at the lower end of the support shaft 6a.
The upper shaft 2 a passes through the upper chamber 5. The upper shaft 2a and the upper chamber 5 are sealed with a vacuum seal (not shown).

  When the upper frame 2 moves upward (upward movement), the hook 6c engages with the locking portion 6b of the support shaft 6a, and the upper chamber 5a moves upward together with the upper frame 2. Further, when the upper frame 2 moves downward (downward movement), the hook 6c is moved down by its own weight, and the upper chamber 5a is moved down accordingly.

A lower chamber 5b is disposed around the lower table 4. The lower chamber 5b is supported by a plurality of lower shafts 1b attached to the gantry 1a. The lower shaft 1b protrudes into the lower chamber 5b. A space between the lower chamber 5b and the lower shaft 1b is sealed with a vacuum seal (not shown).
The lower chamber 5b has an upper opening (side of the upper frame 2) and is disposed so as to cover the lower side and the side of the lower table 4.

  The XYθ moving unit 40 is attached to the lower shaft 1b protruding into the lower chamber 5b and supports the lower table 4.

  The upper chamber 5a and the lower chamber 5b are joined together to form a vacuum chamber 5. That is, the upper chamber 5a moved downward is engaged with the lower chamber 5b from above, and the opening of the lower chamber 5b is closed by the upper chamber 5a. The connecting portion between the upper chamber 5a and the lower chamber 5b is sealed with a seal ring (not shown), and the airtightness of the vacuum chamber 5 is ensured.

  Further, the upper frame 2 can move further lower than the state in which the upper chamber 5a is in contact with the lower chamber 5b. As a result, the upper frame 2 moves downward from the state in which the downward movement of the upper chamber 5a is regulated by the lower chamber 5b, and the engagement between the locking portion 6b and the hook 6c in the suspension mechanism 6 is released. The upper chamber 5a is placed on the lower chamber 5b by its own weight. An upper table 3 and a lower table 4 are disposed inside the vacuum chamber 5.

  The substrate assembly apparatus 1 is provided with a vacuum pump P0. The vacuum pump P0 is connected to the vacuum chamber 5 and exhausts air in the vacuum chamber 5 to make the vacuum chamber 5 vacuum. That is, when the vacuum pump P0 is driven, the inside of the vacuum chamber 5 becomes a vacuum environment. The vacuum pump P0 is controlled by the control device 100.

The upper table 3 moves down together with the upper frame 2 that moves down inside the vacuum chamber 5. By such a downward movement of the upper table 3, the upper substrate K1 held on the upper table 3 and the lower substrate K2 held on the lower table 4 are bonded and pressed. If the inside of the vacuum chamber 5 is in a vacuum state, the upper substrate K1 and the lower substrate K2 are bonded together in a vacuum.
As described above, the upper table 3 is fixed to the upper frame 2 via the plurality of upper shafts 2a. For this reason, the load when the upper substrate K1 and the lower substrate K2 are pressurized by the upper table 3 is detected by the load cell 20d. The detection signal of the load cell 20d is input to the control device 100.

FIG. 2 is a diagram showing the support pins.
As shown in FIG. 2, the upper frame 2 is provided with a plurality of support pins 7. The support pin 7 is a tubular member extending in the vertical direction, and is provided so as to be movable up and down independently of the upper table 3. All the support pins 7 are attached to one support base 7a, and all the support pins 7 move up and down simultaneously. The support base 7 a is disposed between the upper chamber 5 a and the upper table 3. The support base 7a moves up and down by a vertical movement mechanism (ball screw mechanism or the like) not shown. This vertical movement mechanism is controlled by the control device 100.

  The support pins 7 are disposed above the plane of the upper table 3 (upper substrate surface 3a), and project downward from the upper substrate surface 3a when moved downward relative to the upper table 3. The upper substrate surface 3a is a plane facing the lower table 4 (see FIG. 1).

  The support pin 7 has a hollow tubular shape, and the hollow portion 7a1 communicates with the hollow portion 7a1 of the support base 7a. A vacuum pump P1 is connected to the hollow portion 7a1 of the support base 7a. When the vacuum pump P1 is driven, the hollow portion 7a1 is evacuated and the upper substrate K1 is vacuum-sucked to the support pins 7. The vacuum pump P1 is controlled by the control device 100. That is, the vacuum pump P <b> 1 is driven in accordance with a command from the control device 100 and the upper substrate K <b> 1 is vacuum-sucked to the support pins 7.

FIG. 3 is a view showing an adhesive pin.
As shown in FIG. 3, the upper frame 2 is provided with a plurality of adhesive pins 8. The adhesive pin 8 is a tubular member extending in the vertical direction, and is provided so as to be movable up and down independently of the upper table 3 and the support pin 7. The vertical movement of the adhesive pin 8 is a vertical movement with respect to the upper substrate surface 3a.
The adhesive pins 8 are arranged above the upper substrate surface 3a and project downward from the upper substrate surface 3a when moved downward relative to the upper table 3. The adhesive pin 8 moves upward and is pulled from the upper substrate surface 3a. In this embodiment, the adhesive pin 8 is drawn from the upper substrate surface 3a when the adhesive pin 8 does not protrude from the upper substrate surface 3a, that is, when the protruding amount of the adhesive pin 8 is zero (or less). State. Then, the adhesive pin 8 moves down and protrudes from the upper substrate surface 3a. The protruding amount of the adhesive pin 8 indicates the protruding amount of the adhesive pin 8 from the upper substrate surface 3a (hereinafter the same).

  The adhesive pin 8 is attached to the base (adhesive pin plate 8a). One or more adhesive pins 8 are attached to the adhesive pin plate 8a. Each adhesive pin plate 8a is independently movable up and down (perpendicular to the upper substrate surface 3a).

The adhesive pin 8 has an adhesive portion 8b at the tip.
The adhesive pin 8 has a hollow tubular shape, and a vacuum suction hole 8c is opened at the center. The vacuum suction hole 8c communicates with a negative pressure chamber 8a1 formed as a hollow portion of the adhesive pin plate 8a. A first suction means (vacuum pump P2) is connected to the negative pressure chamber 8a1 of the adhesive pin plate 8a. Therefore, the first suction means (vacuum pump P2) is connected to the vacuum suction hole 8c of the adhesive pin 8 via the negative pressure chamber 8a1.

The adhesive pin 8 vacuum-sucks the upper substrate K1 when the vacuum pump P2 is driven and the vacuum suction hole 8c is in a vacuum state, and further holds the vacuum-suctioned upper substrate K1 attached to the adhesive portion 8b. (Adhesion retention). The adhesive pins 8 hold the upper substrate K1 when protruding from the upper substrate surface 3a.
The vacuum pump P2 is controlled by the control device 100. The upper substrate K1 is vacuum-sucked by the adhesive pin 8 in accordance with a command from the control device 100 and is attached to the adhesive portion 8b.

  A gas supply means 8d is connected to the negative pressure chamber 8a1 of the adhesive pin plate 8a. The gas supply means 8d is controlled by the control device 100. The gas supply means 8d is driven in accordance with a command from the control device 100, and supplies a predetermined gas (such as air or nitrogen gas) to the negative pressure chamber 8a1. The negative pressure chamber 8a1 and the vacuum suction hole 8c are pressurized by the gas supplied from the gas supply means 8d, and the upper substrate K1 adhered to the adhesive portion 8b is peeled from the adhesive portion 8b.

Each adhesive pin plate 8a is provided with a second drive mechanism (vertical movement mechanism 80). The vertical movement mechanism 80 is vertically supported by a ball screw shaft 81 that is rotatably supported by the mounting portion 80 a and extends in the Z-axis direction, an electric motor 83 that rotates the ball screw shaft 81, and a rotating ball screw shaft 81. A ball screw mechanism 82 that moves. The attachment portion 80a is fixed to the upper frame 2. The ball screw shaft 81 is rotated by an electric motor 83 to move the ball screw mechanism 82 up and down. The ball screw mechanism 82 is attached to the adhesive pin plate 8a. The adhesive pin plate 8a moves up and down integrally with the ball screw mechanism 82 that moves up and down by the rotation of the ball screw shaft 81.
The vertical movement mechanism 80 is controlled by the control device 100, and the adhesive pin plate 8 a and the adhesive pin 8 move up and down in accordance with a command from the control device 100.

  The attachment portion 80a is attached to the upper frame 2 and moves up and down integrally with the upper frame 2. Further, as described above, the upper table 3 moves up and down integrally with the upper frame 2. The upper frame 2 moves up and down by the Z-axis drive mechanism 20 (see FIG. 1), and when the upper frame 2 moves down, the upper table 3 and the mounting portion 80a advance toward the lower table 4 (see FIG. 1). The vertical movement mechanism 80 is attached to the attachment part 80a, and the adhesive pin plate 8a (adhesive pin 8) moves up and down according to the vertical movement of the attachment part 80a. Therefore, the Z-axis drive mechanism 20 (first drive mechanism) has a function of causing the adhesive pins 8 and the upper table 3 to advance toward the lower table 4.

FIG. 4 is a diagram showing the upper substrate surface of the upper table, and shows an example of the arrangement of the adhesive pins.
As an example, as shown in FIG. 4, in the present embodiment in which the upper table 3 includes 81 adhesive pins 8, nine adhesive pins 8 are attached to one adhesive pin plate 8a. Nine adhesive pin plates 8 a are provided corresponding to one upper table 3. One adhesive pin plate 8a is provided with four vertical movement mechanisms 80. For example, vertical movement mechanisms 80 are provided at four corners of a rectangular adhesive pin plate 8a. The nine adhesive pin plates 8a can be moved up and down independently of each other by a vertical movement mechanism 80.

As described above, the vertical movement mechanism 80 (second drive mechanism) of the present embodiment can move the plurality (9 pieces) of the adhesive pin plates 8a up and down independently (perpendicular movement with respect to the upper substrate surface 3a). It is configured.
And the vertical movement mechanism 80 can make the adhesion pin 8 protrude from the upper board | substrate surface 3a by the protrusion amount set for every adhesion pin plate 8a. Thereby, the adhesive pin 8 can hold the upper substrate K1 (see FIG. 1) in a state of protruding from the upper substrate surface 3a with a protruding amount set for each adhesive pin plate 8a.

5A is a view showing the lower table, and FIG. 5B is a cross-sectional view taken at Sec1-Sec1.
As shown in FIG. 5A, the lower table 4 is housed inside a lower chamber 5b that is open at the top. The lower table 4 is surrounded by a lower chamber 5b at the lower side and the side surface. Between the lower table 4 and the lower chamber 5b, gaps Gx and Gy are formed in the horizontal direction (X-axis direction) and the vertical direction (Y-axis direction), respectively. The lower table 4 is supported at the lower side by a plurality of XYθ moving units 40. FIG. 5A shows the lower table 4 supported by nine XYθ moving units 40, but the number of XYθ moving units 40 that support the lower table 4 is not limited.

The XYθ moving unit 40 supports the lower table 4 so as to be freely displaceable in the X axis direction and the Y axis direction. With such a structure, the lower table 4 is provided to be freely displaceable in the X-axis direction and the Y-axis direction with respect to the lower chamber 5b.
A moving mechanism 41 is attached to the lower table 4. The moving mechanism 41 includes a shaft portion 41b connected to the end side of the lower table 4, and a drive portion 41a that displaces the shaft portion 41b in the axial direction. The drive unit 41a displaces the shaft portion 41b in the axial direction by, for example, a ball screw mechanism.

As shown in FIG. 5A, three moving mechanisms 41 are connected to the lower table 4. One moving mechanism 41 has a shaft portion 41b extending in the X-axis direction, and two moving mechanisms 41 have a shaft portion 41b extending in the Y-axis direction.
The shaft portion 41 b extending in the X-axis direction is connected to the vicinity of the center portion of the end side of the lower table 4. The lower table 4 is displaced in the X-axis direction (lateral direction) by the displacement of the shaft portion 41b extending in the X-axis direction.

Further, the two shaft portions 41 b extending in the Y-axis direction are connected to the vicinity of the end portion on the same side in the lower table 4. When the displacement amounts of the two shaft portions 41b extending in the Y-axis direction are equal, the lower table 4 is displaced in the Y-axis direction (vertical direction). When the displacement amounts of the two shaft portions 41b extending in the Y-axis direction are different, the lower table 4 is displaced in the Y-axis direction in which one of the displacement amounts of the shaft portion 41b is larger than one of the smaller displacement amounts. To rotate around the Z axis.
Thus, the lower table 4 to which the three moving mechanisms 41 are connected can be displaced in the X-axis direction (lateral direction), displaced in the Y-axis direction (vertical direction), and rotated around the Z-axis. It has become.

  The three moving mechanisms 41 are controlled by the control device 100. The control device 100 gives commands to the three moving mechanisms 41 to appropriately displace the shaft portion 41b and displace the lower table 4.

  Further, the lower table 4 is provided with a lifter 42. The lifter 42 extends so as to cross the lower table 42 in the X-axis direction, for example. The lifter 42 is an elevating device 42a such as a ball screw mechanism, and moves up and down as indicated by a black arrow in FIG. The lifting device 42 a is controlled by the control device 100. When the lower substrate K2 (see FIG. 1) is transported by the transport device 200 (see FIG. 1), the control device 100 drives the lifter 42 to place the lower substrate K2 on the lower table 4.

In addition, alignment windows 4b are formed at the four corners of the lower table 4 having a rectangular shape. As shown in FIG. 5B, the alignment window 4b is a through-hole that penetrates the plane of the lower table 4 (lower substrate surface 4a). The imaging unit accommodation cylinder 10a enters the alignment window 4b from below. The imaging unit accommodating cylinder 10a is formed such that the lower surface of the lower chamber 5b rises upward in a cylindrical shape, and a transparent member 10b is fitted at the tip. An imaging device 10 that captures an image of the lower substrate K2 (see FIG. 1) held by the lower table 4 is accommodated in the imaging unit accommodation cylinder 10a.
The lower table 4 includes four imaging devices 10, and data (image data) captured by each imaging device 10 is input to the control device 100. Note that the number of the imaging devices 10 provided in the lower table 4 is not limited.

  The lower substrate surface 4a of the lower table 4 is a plane that holds the lower substrate K2 (see FIG. 1). Further, the moving mechanism 41 displaces the lower table 4 along the lower substrate surface 4a in the X axis direction, the Y axis direction, and the Z axis.

  Note that the lower substrate surface 4a of the lower table 4 is a plane facing the upper substrate surface 3a of the upper table 3 (see FIG. 4). That is, the lower substrate surface 4a of the lower table 4 and the upper substrate surface 3a of the upper table 3 face each other.

  An imaging window 4c is formed in the vicinity of the two alignment windows 4b. The imaging window 4c is formed in the same shape as the alignment window 4b. A second imaging unit housing cylinder (not shown) enters the imaging window 4c from below. The second imaging unit housing cylinder is formed to be equivalent to the imaging unit housing cylinder 10a. A second imaging device (not shown) is accommodated in the second imaging unit accommodation cylinder. The second imaging device images the lower substrate K <b> 2 (see FIG. 1) held by the lower table 4, and the image data is input to the control device 100. FIG. 5A shows a configuration in which the second table 4 includes two second imaging devices, but the number of second imaging devices is not limited.

  A plurality of suction holes 43 are opened in the lower substrate surface 4 a of the lower table 4. The suction hole 43 is connected to the second suction means (vacuum pump P3). When the vacuum pump P3 is driven, the placed lower substrate K2 (see FIG. 1) is sucked and held by the lower table 4 (lower substrate surface 4a). The vacuum pump P3 is controlled by the control device 100.

  FIG. 6 is a diagram illustrating a process of bonding substrates together with the substrate assembly apparatus. With reference to FIGS. 1 to 5 as appropriate, a process in which the substrate assembly apparatus 1 bonds substrates together will be described.

The first step (STEP 1) is an upper substrate carry-in step.
In the upper substrate loading process, the control device 100 moves the upper frame 2 upward to move the upper chamber 5a and the upper table 3 upward. This opens the vacuum chamber 5.
When the upper substrate K1 is transported between the upper table 3 and the lower table 4 by the transport device 200, the control device 100 moves down the support pin 7 until it hits the upper substrate K1, and drives the vacuum pump P1. The upper substrate K1 is vacuumed by the support pins 7.
When the transfer device 200 is withdrawn, the control device 100 moves the support pin 7 upward to bring the upper substrate K1 into close contact with the upper substrate surface 3a of the upper table 3. Since the upper substrate surface 3a is a flat surface, deformation such as bending in the upper substrate K1 is corrected (deformation such as bending is removed).
Then, the control device 100 gives a command to the vertical movement mechanism 80 to move the adhesive pin plate 8a downward and drive the vacuum pump P2. The upper substrate K1 is vacuum-sucked by the adhesive pins 8 that move downward together with the adhesive pin plate 8a, and the adhesive portion 8b at the tip sticks to the upper substrate K1. Thereafter, the control device 100 moves down the adhesive pin plate 8a with the upper substrate K1 attached to the adhesive pins 8, and separates the upper substrate K1 from the upper substrate surface 3a.
At this time, the control device 100 moves down each adhesive pin plate 8a so that the protruding amount of the adhesive pin 8 becomes the protruding amount set for each adhesive pin plate 8a.

The second step (STEP 2) is a lower substrate carry-in step.
When the lower substrate K2 is carried between the upper table 3 and the lower table 4 by the transfer device 200, the control device 100 moves up the lifter 42 and receives the lower substrate K2. When the transfer device 200 is withdrawn, the control device 100 moves the lifter 42 downward to place the lower substrate K2 on the lower substrate surface 4a of the lower table 4. Further, the control device 100 drives the vacuum pump P <b> 3 to attract and hold the lower substrate K <b> 2 on the lower substrate surface 4 a of the lower table 4.
Thereafter, the control device 100 drives the Z-axis drive mechanism 20 to move the upper frame 2 downward, and moves the upper chamber 5a and the upper table 3 downward. The upper chamber 5a and the lower chamber 5b are engaged to close the vacuum chamber 5. Inside the vacuum chamber 5, an upper table 3, a lower table 4, support pins 7 and adhesive pins 8 are arranged.
When the vacuum chamber 5 is closed, the control device 100 drives the vacuum pump P0 to evacuate the vacuum chamber 5. Since the vacuum chamber 5 is evacuated by driving the vacuum pump P0, the vacuum chamber 5 accommodates the upper table 3, the lower table 4, the support pins 7, and the adhesive pins 8 in a vacuum environment.
In addition, before the lower substrate K2 is carried into the substrate assembly apparatus 1 (between the upper table 3 and the lower table 4), necessary substances such as a sealant, a liquid crystal, a spacer, and a paste material are applied in another process. Yes.

The third step (STEP 3) is a bonding position adjustment step.
In the bonding position adjustment step, the control device 100 adjusts the bonding position by driving the moving mechanism 41 to displace the lower table 4. Details of the bonding position adjustment step will be described later.

The fourth step (STEP 4) is a bonding step.
In the bonding process, the control device 100 drives the Z-axis drive mechanism 20 to further move the upper frame 2 downward to move the upper table 3 and the adhesive pin plate 8a (adhesive pin 8) downward. As a result, the upper substrate K1 held by the adhesive pins 8 and the lower substrate K2 held by the lower table 4 are bonded together. When the control device 100 detects that the upper substrate K1 and the lower substrate K2 are bonded together by the detection signal input from the load cell 20d, the controller 100 drives the vertical movement mechanism 80 at that time to attach the adhesive pin 8 to the upper substrate surface 3a. Pull from. At this time, the control device 100 stops the vacuum pump P2 and drives the gas supply means 8d to supply gas to the vacuum suction hole 8c, thereby separating the upper substrate K1 from the adhesive portion 8b. Then, the control device 100 drives the Z-axis drive mechanism 20 to further move the upper frame 2 downward, and presses the upper substrate K1 and the lower substrate K2 with the upper table 3. The control device 100 stops the downward movement of the upper frame 2 when it is determined by the detection signal input from the load cell 20d that a predetermined load is generated between the upper table 3 and the lower table 4.
The inside of the vacuum chamber 5 is a vacuum, and the upper substrate K1 and the lower substrate K2 are bonded together with a predetermined load in a vacuum environment in the vacuum chamber 5. By the pressurization at this time, the sealing agent previously applied to the lower substrate K2 is appropriately pressed, and the vacuum of the liquid crystal portion applied in the frame surrounded by the sealing agent is maintained.
Thereafter, the sealing agent is temporarily cured with ultraviolet rays irradiated from a UV (ultraviolet) irradiation device (not shown) so that the positions of the upper substrate K1 and the lower substrate K2 do not shift.

The fifth step (STEP 5) is a carry-out step.
In the carry-out process, the control device 100 injects a gas such as nitrogen gas into the vacuum chamber 5 in a vacuum state to increase the pressure in the vacuum chamber 5 to atmospheric pressure. By increasing the pressure inside the vacuum chamber 5 to atmospheric pressure, the upper substrate K1 and the lower substrate are changed until a gap (cell gap) determined by the amount of spacers or liquid crystals previously applied to the substrate (lower substrate K2) is reached. K2 is pressed uniformly (pressing press). The control device 100 drives the gas supply means 8d to supply gas to the vacuum suction hole 8c. At this time, since the adhesive pin 8 does not hold the upper substrate K1, the gas supplied to the vacuum suction hole 8c is supplied into the vacuum chamber 5. The control device 100 measures the atmospheric pressure in the vacuum chamber 5 with an atmospheric pressure sensor (not shown), and stops the gas supply means 8d when the atmospheric pressure in the vacuum chamber 5 is increased to atmospheric pressure. Then, the control device 100 moves up the upper frame 2. As a result, the vacuum chamber 5 is opened.
Thereafter, the bonded upper substrate K1 and lower substrate K2 are carried out of the substrate assembly apparatus 1 by the transport means 200.

  The substrate assembly apparatus 1 of the present embodiment bonds the upper substrate K1 and the lower substrate K2 together with the five steps shown in FIG. 6 as the main steps.

The control device 100 adjusts the bonding position of the upper substrate K1 and the lower substrate K2 in the bonding position adjustment step (STEP 3) shown in FIG.
7A and 7B are diagrams showing markings for adjusting the bonding position of the upper substrate and the lower substrate. FIG. 7A is a diagram showing the upper mark attached to the upper substrate, and FIG. 7B is attached to the lower substrate. FIG. 8 and 9 are diagrams showing a state in which the deviation between the upper mark on the upper substrate and the lower mark on the lower substrate is adjusted, and FIG. 8A is a diagram showing the deviation in the XY axis direction. FIG. 4 is a diagram illustrating a state in which a deviation in the XY axis direction is adjusted. FIG. 9A is a diagram showing a shift around the Z axis, and FIG. 9B is a diagram showing a state in which the shift around the Z axis is adjusted.

The shapes of the markings (upper mark and lower mark) attached to the upper substrate K1 and the lower substrate K2 are not limited. For example, as shown in FIG. 7A, the upper mark is provided with a black square first upper mark Mk1 at the reference position of the upper substrate K1, and the black square second upper side near the first upper mark Mk1. A mark Mk1a is attached. Further, as shown in FIG. 7B, the lower mark is provided with a square frame-shaped first lower mark Mk2 at the reference position of the lower substrate K2, and in the vicinity of the first lower mark Mk2, a square frame-shaped first mark is added. 2 A lower mark Mk2a is attached.
The second upper mark Mk1a is a black square having a smaller size than the first upper mark Mk1. The second lower mark Mk2a has a rectangular frame shape having the same size as the first lower mark Mk2 or a larger size than the first lower mark Mk2.

  The reference position of the upper substrate K1 to which the first upper mark Mk1 is attached is set, for example, as a distance from the end side of the upper substrate K1. As an example, the first upper mark Mk1 is attached at a position that is a predetermined length away from the edge of the upper substrate K1. Similarly, a first lower mark Mk2 is attached at a position away from the end side of the lower substrate K2 by a predetermined length.

When the first upper mark Mk1 is a black square as shown in FIG. 7A, and the first lower mark Mk2 is a square frame shape as shown in FIG. 7B, the control device 100 (see FIG. 1). ) Determines that the deviation between the upper substrate K1 and the lower substrate K2 is within the specified range when the first upper mark Mk1 (black square) is within the frame of the first lower mark Mk2 (square frame).
Note that the alignment window 4b of the lower table 4 shown in FIG. 5A is formed corresponding to the reference positions of the upper substrate K1 and the lower substrate K2.

Further, when the second upper mark Mk1a is a black square as shown in FIG. 7A and the second lower mark Mk2a is a square frame shape as shown in FIG. 7B, the control device 100 (FIG. 1) determines that the rough adjustment of the position of the lower substrate K2 with respect to the upper substrate K1 is completed when the second upper mark Mk1a (black square) is within the frame of the second lower mark Mk2a (square frame).
The imaging window 4c of the lower table 4 shown in FIG. 5A corresponds to the positions of the second upper mark Mk1a attached to the upper substrate K1 and the second lower mark Mk2a attached to the lower substrate K2. Is formed.

The control device 100 (see FIG. 1) adjusts the bonding position of the upper substrate K1 and the lower substrate K2 in two steps in the bonding position adjustment step shown in FIG.
In the bonding position adjustment step, the control device 100 first displaces the lower table 4 so that the second upper mark Mk1a is disposed within the frame of the second lower mark Mk2a. At this time, the control device 100 displaces the lower table 4 based on the image data input from the second imaging device (not shown), and places the two second upper marks Mk1a within the frames of the second lower marks Mk2a, respectively. Deploy. When the two second upper marks Mk1a enter the frame of the second lower mark Mk2a, the control device 100 determines that the rough adjustment of the position of the lower substrate K2 with respect to the upper substrate K1 has been completed.

  After determining that the rough adjustment of the position of the lower substrate K2 relative to the upper substrate K1 has been completed, the control device 100 (see FIG. 1), as shown in FIG. 8A, the first upper mark on the upper substrate K1. When Mk1 (black square) is outside the frame of the first lower mark Mk2 (square frame) of the lower substrate K2, the control device 100 determines that the deviation between the upper substrate K1 and the lower substrate K2 is outside the specified range. Then, the control device 100 finely adjusts the position of the lower substrate K2 with respect to the upper substrate K1.

  The control device 100 (see FIG. 1) gives a command to the moving mechanism 41 (see FIG. 5A) of the lower table 4 to displace the lower table 4. The control device 100 gives a command to the moving mechanism 41 of the lower table 4 and moves the lower table 4 (see FIG. 5A) in the X-axis direction (Dx) and the Y-axis direction (Dy). Then, as shown in FIG. 8B, when all the four first upper marks Mk1 are arranged within the frame of the first lower mark Mk2, the control device 100 determines that the upper mark (first upper mark Mk1). ) And the lower mark (first lower mark Mk2) are in a predetermined positional relationship, and it is determined that the deviation between the upper substrate K1 and the lower substrate K2 is within the specified range, and fine adjustment is finished.

  Further, as shown in FIG. 9A, when the first lower mark Mk2 is shifted in the direction rotated around the Z axis with respect to the first upper mark Mk1, the control device 100 moves the lower table 4. A command is given to the mechanism 41 (see FIG. 5A), and the lower table 4 (see FIG. 5A) is rotated around the Z axis (Rz). Then, as shown in FIG. 9B, when all of the four first upper marks Mk1 are arranged within the frame of the first lower mark Mk2, the control device 100 determines that the upper mark (first upper mark Mk1). ) And the lower mark (first lower mark Mk2) are in a predetermined positional relationship, and it is determined that the deviation between the upper substrate K1 and the lower substrate K2 is within the specified range, and fine adjustment is finished.

As described above, the control device 100 (see FIG. 1) performs the rough adjustment based on the second upper mark Mk1a and the second lower mark Mk2a, the first upper mark Mk1, and the first in the bonding position adjustment step shown in FIG. 1 The bonding position of the upper substrate K1 and the lower substrate K2 is adjusted by fine adjustment based on the lower mark Mk2.
Then, in the control device 100 of the present embodiment, when the first upper mark Mk1 is disposed within the frame of the first lower mark Mk2, the first upper mark Mk1 and the first lower mark Mk2 are in a predetermined positional relationship. Judge that there is.

In the bonding position adjustment step, the control device 100 (see FIG. 1) performs image processing on the image data input from the imaging device 10 (see FIG. 5B) to perform the first upper mark Mk1 and the first lower mark. The position and shape of the mark Mk2 are extracted, and a command is given to the moving mechanism 41 (see FIG. 5A) so that the first upper mark Mk1 moves toward the frame of the first lower mark Mk2.
The control device 100 extracts the positions and shapes of the first upper mark Mk1 and the first lower mark Mk2 by image processing such as multi-value processing.

FIG. 10 is a diagram showing a state where the deviation between the first upper mark and the first lower mark is within a specified range, and (a) is a diagram showing a state where the first upper mark is at the center of the first lower mark. b) is a diagram illustrating a state in which the first upper mark is displaced from the center of the first lower mark.
As shown in FIG. 8B and FIG. 9B, the control device 100 (see FIG. 1) of the present embodiment uses the first upper mark Mk1 (black square) as the first lower mark Mk2 (square). It is determined that the deviation between the upper substrate K1 and the lower substrate K2 is within the specified range.
The first upper mark Mk1 and the first lower mark Mk2 are attached to the reference positions of the upper substrate K1 and the lower substrate K2, respectively. For this reason, as shown in FIG. 10A, when there is no dimensional difference (dimensional error) between the upper substrate K1 and the lower substrate K2, the four first upper marks Mk1 are all in the center of the first lower mark Mk2. It is configured to be arranged.

However, if an error (such as a dimensional error) occurs during manufacture of the upper substrate K1 and the lower substrate K2, an error occurs in the reference positions of the upper substrate K1 and the lower substrate K2. If an error occurs in the reference positions of the upper substrate K1 and the lower substrate K2, all the four first upper marks Mk1 are not arranged at the center of the first lower mark Mk2. A state in which the first upper mark Mk1 is not arranged at the center of the first lower mark Mk2 in this way is referred to as mark pitch deviation (mark pitch deviation between the upper substrate K1 and the lower substrate K2).
As shown in FIG. 10B, the control device 100 of the present embodiment (see FIG. 1) does not require all four first upper marks Mk1 to be the center of the first lower mark Mk2, that is, Even when the mark pitch shift occurs between the substrate K1 and the lower substrate K2, when all of the four first upper marks Mk1 are arranged within the frame of the first lower mark Mk2, the upper substrate K1 and the lower substrate It is determined that the deviation of K2 is within the specified range.

However, when the upper substrate K1 and the lower substrate K2 are bonded together in this state, a slight shift occurs between the upper substrate K1 and the lower substrate K2.
Therefore, the control device 100 (see FIG. 1) of the substrate assembly apparatus 1 according to the present embodiment moves downward for each adhesive pin plate 8a when the adhesive pins 8 are moved downward in the upper substrate loading process (STEP 1) shown in FIG. The displacement between the upper substrate K1 and the lower substrate K2 is reduced. This effectively corrects the mark pitch deviation between the upper substrate K1 and the lower substrate K2.

FIG. 11 is a diagram showing a state in which the protrusion amount of the adhesive pin is changed to reduce the deviation between the upper substrate and the lower substrate, and (a) is a diagram showing a state in which the first upper mark and the first lower mark are displaced, FIG. 6B is a diagram illustrating a state in which the shift between the first upper mark and the first lower mark is reduced (a state in which the mark pitch shift between the upper substrate and the lower substrate is corrected).
In FIGS. 11A and 11B, the position of the first lower mark Mk2 is indicated by a broken line.

  As shown to (a) of FIG. 11, when the protrusion amount of all the adhesive pins 8 is equal, the upper board | substrate K1 attracted | sucked to the adhesive pins 8 becomes planar shape. That is, the upper substrate K1 is held by the adhesive pins 8 in a state parallel to the upper substrate surface 3a. At this time, if a dimensional error occurs in the upper substrate K1 or the lower substrate K2 due to a manufacturing error or the like, the first upper mark Mk1 may be shifted from the center of the first lower mark Mk2. That is, mark pitch deviation may occur between the upper substrate K1 and the lower substrate K2.

For example, as shown in FIG. 11B, when the protruding amount of the adhesive pin 8 is large on the end side where the first upper mark Mk1 is attached, the center of the upper substrate K1 is closer to the upper table 3 than the end side. The adhesive pin 8 is held in a state where it is approaching and slightly curved.
When the upper substrate K1 is curved in this way, the end portion of the upper substrate K1 is slightly shifted from the center, so that the first upper mark Mk1 attached in the vicinity of the end portion is slightly shifted to the center. Accordingly, the upper substrate K1 is held by the adhesive pins 8 in a state where the first upper mark Mk1 is close to the center of the first lower mark Mk2.

  As described above, when the upper substrate K1 is held by the adhesive pin 8 with the first upper mark Mk1 approaching the center of the first lower mark Mk2, the fine adjustment in the bonding position adjusting step shown in FIG. As shown in FIG. 11B, the first upper mark Mk1 approaches the center of the first lower mark Mk2 with high accuracy. Then, a minute shift caused by the bonding of the upper substrate K1 and the lower substrate K2 is reduced, whereby the mark pitch shift between the upper substrate K1 and the lower substrate K2 is corrected, and the mark pitch shift is reduced.

Note that errors (such as dimensional errors) that occur during the manufacture of the upper substrate K1 and the lower substrate K2 are approximated in the same production lot. That is, the magnitude of the shift of the first upper mark Mk1 with respect to the first lower mark Mk2 on the lower substrate K2 is approximated for each production lot of the upper substrate K1 and the lower substrate K2.
Therefore, when the protruding amount of the adhesive pin 8 is set for each production lot of the upper substrate K1 and the lower substrate K2, the first upper mark Mk1 can be brought closer to the center of the first lower mark Mk2.

For example, an administrator of the board assembly apparatus 1 (see FIG. 1) sets the protruding amount of the adhesive pin 8 for each adhesive pin plate 8a for each production lot of the upper substrate K1 and the lower substrate K2. Since the board assembly apparatus 1 of the present embodiment has nine adhesive pin plates 8a, the protruding amount of the adhesive pins 8 is set for each of the nine adhesive pin plates 8a. That is, nine projection amounts are set.
When the protrusion amount set in this way is input to the control device 100 (see FIG. 1), the control device 100 is attached to each adhesive pin plate 8a in the upper substrate carry-in step (see FIG. 6). Each adhesive pin plate 8a is moved downward so that the protruding amount of the adhesive pin 8 becomes the set protruding amount.

11B illustrates a state in which the protruding amount of the adhesive pin 8 at the center is smaller than the protruding amount of the adhesive pin 8 on the end side, the protruding amount of the adhesive pin 8 at the center is the end. It is also possible to make the state larger than the protruding amount on the side.
11B, the protruding amount of the adhesive pin 8 is changed in the X-axis direction, but the protruding amount of the adhesive pin 8 may be changed in the Y-axis direction.

  As described above, when the substrate assembly apparatus 1 (see FIG. 1) of the present embodiment holds the loaded upper substrate K1, the protruding amount of the adhesive pins 8 (see FIG. 3) is set to the adhesive pin plate 8a (see FIG. 1). 3), it is possible to reduce a minute shift caused by bonding the upper substrate K1 and the lower substrate K2. Then, the mark pitch deviation between the upper substrate K1 and the lower substrate K2 can be corrected, and the mark pitch deviation is reduced.

In addition, this invention is not limited to an above-described Example. For example, the above-described embodiments have been described in detail for easy understanding of the present invention, and are not necessarily limited to those having all the configurations described.
Further, a part of the configuration of a certain embodiment can be replaced with the configuration of another embodiment, and the configuration of another embodiment can be added to the configuration of a certain embodiment.

In addition, the present invention is not limited to the above-described embodiments, and appropriate design changes can be made without departing from the spirit of the invention.
12A and 12B are diagrams showing design changes, in which FIG. 12A shows a state in which the protruding amount of the adhesive pin attached to one adhesive pin plate is different, and FIG. 12B shows one upper and lower one for each adhesive pin. It is a figure which shows the structure with which a moving mechanism is provided.

  As shown in FIG. 4, one adhesive pin plate 8 a is driven by four vertical movement mechanisms 80. Therefore, it is possible to change the operation amounts of the four vertical movement mechanisms 80 in one adhesive pin plate 8a. And as shown to (a) of FIG. 12, it becomes possible to make the protrusion amount of the adhesion pin 8 attached to one adhesion pin plate 8a differ. In this case, the upper substrate K1 held by the adhesive pins 8 can be variously deformed (curved). As a result, a minute shift caused by bonding the upper substrate K1 and the lower substrate K2 can be reduced more effectively. As a result, the mark pitch deviation between the upper substrate K1 and the lower substrate K2 is more effectively corrected.

Further, as shown in FIG. 12B, it is possible to adopt a configuration in which one vertical movement mechanism 80 is provided in one adhesive pin 8. That is, it is possible to adopt a configuration in which one adhesive pin 8 is attached to one adhesive pin plate 8a. And it becomes possible to set it as a different protrusion amount for every adhesion pin 8, and can change (bend) the upper board | substrate K1 hold | maintained with the adhesion pin 8 more variously.
In this case, if the vacuum pump P <b> 2 (see FIG. 3) is connected to each of the adhesive pins 8, the upper substrate K <b> 1 can be vacuumed by each adhesive pin 8.

In addition, although the present Example was set as the structure provided with the nine adhesion pin plates 8a, the number of the adhesion pin plates 8a is not limited. The number of adhesive pin plates 8a can be appropriately changed according to the number of adhesive pins 8, for example. Further, the shape of the adhesive pin plate 8a and the arrangement of the adhesive pins 8 in one adhesive pin plate 8a are not limited.
For example, a configuration in which the adhesive pins 8 are arranged in a row on an elongated adhesive pin plate 8a extending in the X-axis direction (or Y-axis direction) may be employed.
Further, the number of adhesive pins 8 provided on one adhesive pin plate 8a is not limited. A configuration in which a different number of adhesive pins 8 are provided for each adhesive pin plate 8a may be employed.

  Further, a Z-axis drive mechanism 20 (see FIG. 1) that moves the upper frame 2 up and down, a vertical movement mechanism 80 (see FIG. 3) that drives the adhesive pin plate 8a, and a moving mechanism 41 (see FIG. 5) that drives the lower table 4. The drive mechanism such as (see (a)) is not limited to the ball screw mechanism. All or a part of these drive mechanisms may be constituted by another mechanism such as an air cylinder or a linear motor.

  Further, the upper substrate K1 (see FIG. 1) and the lower substrate K2 (see FIG. 1) to be bonded by the substrate assembling apparatus 1 (see FIG. 1) are mainly glass substrates, and an error corresponding to a change in ambient temperature occurs. Cheap. For example, the upper table 3 (see FIG. 1) and the lower table 4 are used to reduce errors caused in the upper substrate K1 and the lower substrate K2 due to a temperature change when the inside of the vacuum chamber 5 (see FIG. 1) is evacuated. A structure provided with a heating device (heater) that heats (see FIG. 1) and suppresses the temperature drop of the upper substrate K1 and the lower substrate K2 may be provided. On the contrary, it is good also as a structure which can suppress the temperature rise of the upper board | substrate K1 and the lower board | substrate K2 using a Peltier device etc. With such a configuration, an error generated in the upper substrate K1 and the lower substrate K2 due to a temperature change is reduced, and the bonding accuracy between the upper substrate K1 and the lower substrate K2 is improved. Further, it is possible to effectively reduce the occurrence of the mark pitch deviation between the upper substrate K1 and the lower substrate K2 due to the temperature change.

DESCRIPTION OF SYMBOLS 1 Board | substrate assembly apparatus 3 Upper table 3a Upper board surface 4 Lower table 4a Lower board surface 5 Vacuum chamber 5a Upper chamber 5b Lower chamber 8 Adhesive pin 8a Adhesive pin plate (base part)
8b Adhesive part 8c Vacuum suction hole 8d Gas supply means 10 Imaging device 20 Z-axis drive mechanism (first drive mechanism)
41 Moving mechanism 43 Suction hole 80 Vertical movement mechanism (second drive mechanism)
100 Control device K1 Upper substrate K2 Lower substrate Mk1 First upper mark (upper mark)
Mk2 1st lower mark (lower mark)
P2 Vacuum pump (first suction means)
P3 Vacuum pump (second suction means)

Claims (6)

A lower table having a lower substrate surface for holding the lower substrate;
An upper table having an upper substrate surface facing the lower substrate surface;
A plurality of adhesive pins that protrude from the upper substrate surface and hold the upper substrate in a vertical motion with respect to the upper substrate surface;
A vacuum chamber capable of storing the lower table, the upper table, and the adhesive pin in a vacuum environment;
A first drive mechanism for advancing the adhesive pin and the upper table toward the lower table;
A plurality of base parts to which one or more adhesive pins are attached;
A second drive mechanism for independently operating a plurality of the base portions perpendicularly to the upper substrate surface;
First suction means connected to a vacuum suction hole opened in the adhesive pin;
Second suction means connected to a suction hole formed in the lower substrate surface,
The adhesive pin protrudes from the upper substrate surface with a protrusion amount set for each base portion, and holds the upper substrate.
In the vacuum environment in the vacuum chamber, the first driving mechanism is driven to bond the upper substrate held by the adhesive pin to the lower substrate, and when the lower substrate and the upper substrate are bonded to each other, A substrate assembly characterized in that a second driving mechanism is driven to pull the adhesive pin from the upper substrate surface, and the first driving mechanism is driven to press the upper substrate and the lower substrate with the upper table. apparatus.   The substrate assembly apparatus according to claim 1, wherein a bonding position of the upper substrate and the lower substrate is adjusted in a state where the upper substrate is held by the adhesive pin. A moving mechanism for displacing the lower table along the lower substrate surface;
An imaging device for imaging the upper mark attached to the upper substrate and the lower mark attached to the lower substrate;
A control device that performs image processing on image data input from the imaging device to extract the upper mark and the lower mark;
The control device gives a command to the moving mechanism based on the extracted positions of the upper mark and the lower mark, and displaces the lower table so that the upper mark and the lower mark have a predetermined positional relationship. The substrate assembly apparatus according to claim 2, wherein a bonding position between the upper substrate and the lower substrate is adjusted. The adhesive pin is a tubular member having the vacuum suction hole opened, and has an adhesive portion at the tip.
The substrate assembly apparatus according to any one of claims 1 to 3, wherein the upper substrate is vacuum-sucked and attached to the adhesive portion and held.   The substrate assembly apparatus according to claim 4, further comprising a gas supply unit that supplies a predetermined gas to the vacuum suction hole. An upper substrate that is loaded between the upper table and the lower table in a state where a vacuum chamber capable of storing the upper table and the lower table that press the upper substrate and the lower substrate in a vacuum environment is separated into the upper chamber and the lower chamber. The plurality of adhesive pins project from the upper substrate surface of the upper table, and the first suction means connected to the vacuum suction holes of the adhesive pins is driven, and the upper substrate is moved by the plurality of adhesive pins. An upper substrate carry-in step of vacuum suction and attaching the upper substrate to the adhesive portion provided at the tip of the adhesive pin;
After driving the second suction means connected to the suction hole formed in the lower substrate surface of the lower table to adsorb the lower substrate carried between the upper table and the lower table to the lower substrate surface A lower substrate carrying-in step of engaging the upper chamber and the lower chamber to close the vacuum chamber and evacuate the vacuum chamber;
A predetermined positional relationship between an upper mark attached to the upper substrate attached to the adhesive portion of the plurality of adhesive pins and a lower mark attached to the lower substrate adsorbed to the lower substrate surface And a bonding position adjusting step of displacing the lower table along the lower substrate surface,
The adhesive pin with the upper substrate adhered is advanced toward the lower table holding the lower substrate, and the upper substrate and the lower substrate are bonded together, and then the adhesive pin is attached to the upper substrate. A bonding step of pulling in from the surface, further moving the upper table toward the lower table, and pressing the upper substrate and the lower substrate with the upper table;
An unloading step of increasing the pressure in the vacuum chamber to atmospheric pressure and opening the vacuum chamber;
In the upper substrate carrying-in step, a plurality of base portions to which one or more of the adhesive pins are attached are vertically operated independently with respect to the upper substrate surface, and the adhesive is set with a protrusion amount set for each base portion. A substrate assembling method, wherein the upper substrate is attached to the adhesive portion in a state where pins protrude from the upper substrate surface.

Images