TWI425591B - Substrate assembling apparatus - Google Patents

Description

Substrate assembly device

The present invention relates to a substrate assembly apparatus, and more particularly to a substrate assembly apparatus capable of combining a pair of substrates, wherein the pair of substrates are constituent elements of a flat display panel. .

Cathode ray tubes (CRTs) have been used as display devices. However, cathode ray tubes have the disadvantage that they are heavy and bulky. Therefore, in recent years, flat display panels such as liquid crystal display (LCD) devices, plasma display panels (PDPs), and organic light emitting devices (OLEDs) have been widely used. The advantage of flat display panels is that they are light and thin and have low power consumption.

A flat display panel is generally manufactured by combining a pair of flat substrates. For example, in order to manufacture a liquid crystal display device, a lower substrate and an upper substrate are formed, wherein a plurality of thin film transistors and a pixel electrode are formed on the lower substrate, and a color filter and a common layer are formed on the upper substrate. electrode. Then, the liquid crystal is dropped on the lower substrate, and a sealant is applied to the peripheral region of the lower substrate. Next, the lower substrate and the upper substrate are positioned such that the surface of the lower substrate (on which the pixel electrode is formed) and the surface of the upper substrate (on which the common electrode is formed) face each other. Then, the lower substrate and the upper substrate are attached and sealed together to form a liquid crystal display device.

Here, the substrate assembly device is used to face the upper substrate and the lower substrate, and the upper substrate and the lower substrate are attached and sealed together. In order to align the upper substrate and the lower substrate with each other, the substrate assembly device is designed to lift the upper substrate to a predetermined height. At this time, a vacuum suction force or an electrostatic force is used as a force for lifting the upper substrate. In addition, the substrate assembly device uses an electrostatic chuck to apply an electrostatic force.

The prior art electrostatic chuck for holding the upper substrate is formed into a single plate shape. That is, the electrode pattern of the prior art electrostatic chuck is formed on the surface of a single substrate, and the substrate is held by applying electric power to the electrode pattern.

The problem with this electrostatic chuck is that the electrostatic chuck does not work effectively when a portion of the electrode pattern on the board is damaged. That is, since the electrode patterns on the electrostatic chuck are interconnected according to the polarity, the damaged portion of the electrode pattern hinders the application of electric power to the entire electrode pattern, and thus the electrostatic pattern on the electrostatic chuck does not work properly. In addition, when a part of the electrostatic chuck is damaged, the entire electrostatic chuck must be replaced, so maintenance cost is increased.

Furthermore, in recent years, as the flat display panel has increased (sixth generation and later), the weight of the upper substrate has rapidly increased. Therefore, in the prior art single-board configuration electrostatic chuck, the upper substrate is mostly manufactured to a large size and weight, so the support and fixing of the upper substrate is relatively difficult. That is to say, it is difficult to manufacture an electrostatic chuck conforming to a large-sized substrate, and an electrostatic force cannot be effectively applied to a central portion of the electrostatic chuck. In addition, it is difficult to achieve uniformity between the substrate and the surface of the electrostatic chuck. If you can't do this These will destroy the clamping force and cause the substrate to fall out of the electrostatic chuck.

The invention provides a substrate assembly device capable of improving the flatness between the surface of the substrate and the surface of the electrostatic chuck, and applying a uniform electrostatic force on the entire substrate, even when the electrostatic chuck is partially damaged. Since the substrate is sandwiched, the durability can be improved and the maintenance cost can be reduced. The substrate assembly device is also capable of holding substrates of various sizes.

According to an embodiment, a substrate assembly apparatus includes: a chamber portion; an upper table and a lower table disposed face to face in the chamber member; and a plurality of upper electrostatic chuck members Installed on the bottom surface of the upper workbench; a flatness adjustment unit for adjusting the flatness between the upper electrostatic chuck members; and at least one lower electrostatic chuck member mounted on the top surface of the lower workbench.

The flatness adjustment unit may include: a plurality of first adjustment screw holes formed through the respective electrostatic chuck members; and a plurality of second adjustment screw holes formed in the upper table and corresponding to the first adjustment screw holes; The gap adjusting screw is inserted into the first adjusting screw hole and the second adjusting screw hole to adjust the gap between each upper electrostatic chuck component and the upper working table.

The flatness adjusting unit may include: a plurality of first adjusting screw holes formed on the respective electrostatic chuck members; a plurality of second adjusting screw holes formed through the upper working table and corresponding to the first adjusting screw holes; And a gap adjusting screw, inserted into the first adjusting screw hole and the second adjusting screw hole, for adjusting a gap between each of the upper electrostatic chuck components and the upper working table.

The flatness adjustment unit may include: a plurality of drive motor components, configured in On the top surface of the upper table, corresponding to the respective upper electrostatic chuck members; and at least one drive shaft member extending from the drive motor member through the upper table to the upper electrostatic chuck member.

A pneumatic, hydraulic or electric power cylinder can be used as the flatness adjustment unit.

Grooves corresponding to the upper electrostatic chuck member are formed on the bottom surface of the upper table, and pneumatic, hydraulic or electric cylinders are disposed in the grooves.

The electrostatic chuck members may be arranged in a matrix pattern on the bottom surface of the upper table.

Each of the upper electrostatic chuck members may include: a base plate; a buffer layer on the base plate; a first film layer on the buffer layer; an electrode layer formed on the first film layer; and a second film layer covered Electrode layer.

The electrode layer may include a positive electrode pattern and a negative electrode pattern, and the electrode patterns are formed in a plate shape or a linear shape and alternately arranged.

The substrate assembly apparatus may further include: a download stage member for moving the lower stage; and a loading stage unit for moving the upper stage.

The download stage component can include X, Y, and θ position adjustment components for adjusting the X, Y, and θ positions of the lower table.

According to another embodiment, a substrate assembly apparatus includes: a chamber member; an upper table and a lower table disposed face to face in the chamber member; and a plurality of upper electrostatic chuck members mounted on a bottom surface of the upper table; A plurality of power control sections provide power to the respective electrostatic chuck components; and at least one lower electrostatic chuck component mounted on a top surface of the lower workbench.

Multiple power control components can be configured for independent drive.

Each of the upper electrostatic chuck components may include: a plurality of electrically connected positive electrode patterns and a plurality of electrically connected negative electrode patterns, and each of the plurality of power control components may include: a connection terminal component, Electrically coupled to the positive electrode pattern and the negative electrode pattern; a controller for controlling the power supply; and a connection line member for electrically connecting the controller to the connection terminal member.

The socket or the connector can be used as a connection terminal member, and the connection terminal member can be located on the bottom surface of the upper table.

The connection terminal member can be buried in the bottom surface and partially exposed. The connection terminal member can be mounted in a recess formed in the bottom surface of the upper table.

The controller can be disposed on a top surface of the upper table or an outer region of the chamber component.

Each of the upper electrostatic chuck members may include: a base plate; a buffer layer on the base plate; a first film layer on the buffer layer; and an electrode layer formed on the first film layer and having a plurality of positive and negative patterns And a second film layer covering the electrode layer. And the electrode layer may include: a positive electrode connection line for interconnecting the positive electrode pattern; and a negative electrode connection line for interconnecting the negative electrode pattern.

The positive electrode pattern and the negative electrode pattern may be formed in a plate shape and alternately arranged.

Each of the upper electrostatic chuck members may include: a positive terminal coupled to one of the positive electrode patterns; a negative terminal coupled to one of the negative electrode patterns; and a power connection member electrically connected to the respective positive, a negative terminal and coupled to the connection terminal component of the power control component.

The substrate assembly device may further include a power supply component for supplying power to the power control component.

The electrostatic chuck members are arranged in a matrix pattern on the bottom surface of the upper table.

The substrate assembly apparatus may further include: a download stage member for moving the lower stage; and a loading stage unit for moving the upper stage.

The download stage component can include X, Y, and θ position adjustment components for adjusting the X, Y, and θ positions of the lower table.

The substrate assembly apparatus may further include: at least one lower power control component for supplying power to the lower electrostatic chuck component.

According to these embodiments, it is possible to support and fix a large-sized substrate using a plurality of upper electrostatic chuck members.

In addition, since a flatness adjustment unit is provided to adjust the surface flatness of the upper electrostatic chuck member, the surface flatness caused by the unevenness of the surface of the upper table or the difference in height between the upper electrostatic chuck members is not The uniform problem can be solved, thereby improving the clamping force and tight adhesion between the upper electrostatic chuck member and the substrate.

Additionally, the upper electrostatic chuck component can be independently driven using a plurality of power control units.

In addition, substrates of various sizes can be held by driving the upper electrostatic chuck member individually or independently.

Furthermore, since the upper electrostatic chuck member can be individually or independently driven even when some of the electrostatic chuck members are damaged, the adjacent electrostatic chuck members can maintain the clamping force. In addition, maintenance costs can be reduced because only damaged electrostatic chuck components need to be replaced.

The above described features and advantages of the present invention will be more apparent from the following description.

Specific embodiments will be described in detail below with reference to the drawings. However, the invention may also be embodied in different forms and should not be limited to the embodiments enumerated herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and the scope of the invention will be fully conveyed by those skilled in the art. In the figures, the same element symbols are the same elements.

1 is a cross-sectional view of a substrate assembly apparatus in accordance with an embodiment. 2 is a top plan view of the upper table for illustrating the arrangement of the plurality of electrostatic chuck components of the substrate assembly of FIG. 1. Figure 3 is a cross-sectional view of the electrostatic chuck member of the substrate assembly apparatus shown in Figure 1. 4 is a top plan view of the electrostatic chuck member of the substrate assembly apparatus shown in FIG. 1. Fig. 5 is a top plan view showing a modified example of the electrostatic chuck member of the substrate assembly apparatus shown in Fig. 1. Figure 6 is a cross-sectional view of the electrostatic chuck component coupled to the table above the substrate assembly of Figure 1. 7(a) to (b) and FIG. 8 are schematic views showing a method of planarizing an electrostatic chuck member by using a flattening adjustment unit according to the first embodiment. Figure 9 is a cross-sectional view showing a modified example in which an electrostatic chuck member is coupled to a table above the substrate assembly shown in Figure 1.

Referring to FIG. 1 to FIG. 9, in an embodiment, the substrate assembly device includes: a chamber component 100 defining an internal space; an upper table 200 and a lower table 300 disposed face to face in the chamber component 100; Multiple on The electrostatic chuck member 400 is mounted on the bottom surface of the upper table 200; the flatness adjusting unit 500 is configured to adjust the flatness between the upper electrostatic chuck members 400; at least one lower electrostatic chuck member 600 is mounted on the lower table The top surface of the 300; the download stage component 700 for moving the lower stage 300; and the loading stage component 800 for moving the upper stage 200. Here, although not shown in the drawings, the substrate assembly device may further include a frame into which the chamber member 100 is loaded, and the download stage member 700 and the upload stage member 800 are disposed in the frame. on.

The chamber component 100 includes an upper chamber 110 and a lower chamber 120 that define a substrate assembly space. Here, it is effective that the upper chamber 110 and the lower chamber 120 are coupled to each other in a detachable manner. Additionally, although not shown in the drawings, the chamber component 100 may further include a pressure adjustment unit for adjusting the pressure of the interior space of the chamber component 100. Further, the chamber component 100 may further include a purge unit for discharging impurities out of the internal space of the chamber component 100. 1 shows a state in which the upper chamber 110 and the lower chamber 120 are coupled to each other, but the present invention is not limited thereto. For example, the chamber component 110 can include an upper portion, a side wall portion, and a lower portion. Additionally, although not shown in the drawings, the chamber component 100 provides an inlet/outlet on one side through which the substrate can be loaded or unloaded. In addition, a gate valve may be provided for opening and closing the inlet/outlet. Needless to say, the substrate can also be loaded into or unloaded from the chamber member 100 by the lifting of the upper chamber 110 or the lower chamber 120. Here, a lifting member may be further provided for raising and lowering the respective upper chamber 110 and lower chamber 120.

The upper stage 200 is provided in a plate shape and disposed adjacent to the inner surface of the upper chamber 110. The shape of the plate may vary abruptly with the shape of the substrate disposed on the bottom surface of the upper table 200. In the present embodiment, the upper table 200 is formed in a rectangular plate shape. In addition, the lower table 300 is also formed in a plate shape and disposed adjacent to the inner surface of the lower chamber 120. In addition, it is effective that the lower table forms a shape similar or identical to the upper table. Therefore, the upper table and the lower table are configured such that the bottom surface of the upper table 200 faces the top surface of the lower table.

The upper electrostatic chuck member 400 is mounted and fixed to the bottom surface of the upper table 200 in a matrix pattern. That is, as shown in FIG. 2, twenty electrostatic chuck members 400 are disposed on the entire bottom surface of the upper table 200. Needless to say, the number of electrostatic chuck components is not limited to twenty. That is, the number of electrostatic chuck components can be greater or less than twenty.

As shown in FIG. 3, each of the upper electrostatic chuck members 400 includes: a base plate 410; a buffer layer 420 on the base plate 410; a first film layer 430 on the buffer layer 420; and an electrode layer 440 formed in the first The film layer 430; and the second film layer 450 cover the electrode layer 440. Here, the buffer layer 420 is adhered to the base plate 410 through the first adhesive member 411, and the first film layer 430 is adhered to the buffer layer 420 through the second adhesive layer 420. In addition, the electrode layer 440 includes a plurality of electrode patterns that are adhered to the first film layer 420 through the third adhesive layer 431. In addition, the second film layer 450 is adhered to the first film layer 430 where the electrode layer 440 is located and the electrode layer 440 through the fourth bonding member 441.

As described above, in the upper electrostatic chuck member 400 of the present embodiment, Since the buffer layer 420 is disposed between the base plate 410 and the electrode layer 440, the surface of the electrostatic chuck member 400 is flexible, so that the substrate 11 can be closely contacted. That is, when the surface of the substrate 11 is not flat and the buffer layer 420 is not under the electrode layer 440, the unevenness of the surface of the substrate 11 causes the substrate 11 to be in intimate contact with the electrode layer 440, and the substrate 11 and the electrode layer 440 are A predetermined space is formed, which causes the clamping force to be broken. However, if the buffer layer 420 is provided under the electrode layer 440 as in the present embodiment, the surface of the substrate 11 is not flat and is absorbed by the buffer layer 420, so that the substrate 11 can closely contact the electrode layer 440 without forming any space. In addition, when an external force is applied to the top surface area of the upper electrostatic chuck member 400, the buffer layer 420 absorbs the additional force, thereby protecting the electrode layer 440 from external force. Here, it is effective that the buffer layer 420 is formed of rubber or ruthenium rubber. Needless to say, the present invention is not limited to this. That is, the buffer layer 420 can also be formed using a variety of other materials.

Here, it is effective that the base plate 410 of the present embodiment is formed of a metal material. Further, the first to fourth bonding members 411, 421, 431, and 441 are formed using an adhesive. Further, the first film layer 430 may be formed using a polyimide or a polyimide film (Kapton). Further, the second film layer 450 may be formed of polyester. Needless to say, the first film layer 430 and the second film layer 450 are not limited to the above materials. That is, the first film layer 430 and the second film layer 450 may be formed using an insulating film capable of protecting the electrode layer 440.

As shown in FIG. 4, the electrode layer 440 of the present embodiment includes a plurality of positive electrode patterns 442 and a plurality of negative electrode patterns 443. Here, the positive electrode pattern 442 The negative electrode pattern 443 is formed in a rectangular plate shape. The positive electrode pattern 442 and the negative electrode pattern 443 are alternately arranged in a matrix pattern. In FIG. 4, five positive electrode patterns 442 and four negative electrode patterns 443 are arranged in a 3 x 3 matrix pattern. However, the number of the positive electrode patterns 442 and the negative electrode patterns 443 is not limited to the above numbers, but may be larger or smaller than the above numbers. In addition, a variety of different patterns can also be employed. Furthermore, all of the positive electrode patterns 442 of the electrostatic chuck member 400 on one side of the upper portion are electrically connected to each other, and all of the negative electrode patterns 443 are also electrically connected to each other. That is, the positive electrode patterns 442 are electrically connected to each other through the first connection lines, and the negative electrode patterns 443 are electrically connected to each other through the second connection lines.

Needless to say, the positive electrode pattern 442 and the negative electrode pattern 443 are not limited to the above shapes. That is, as shown in the modified example of FIG. 5, the positive electrode pattern 442 and the negative electrode pattern 443 are formed in a finger shape and alternately arranged. Needless to say, the present invention is not limited to this. That is, the positive electrode pattern 442 and the negative electrode pattern 443 may be formed in various shapes and alternately arranged.

The upper electrostatic chuck member 400 having the above structure is disposed on the upper table 200 for lifting the substrate 11 of a large size.

That is, as the sizes of the substrates 11 and 12 increase, the size of the electrostatic chuck member for supporting and fixing the substrates 11 and 12 also increases. However, when the size of the electrostatic chuck member is increased, the electric resistance caused by the electrode pattern in the electrostatic chuck member is increased, so that an electromagnetic force difference is generated between the peripheral region of the electrostatic chuck member and the central portion, so that static electricity is generated. The chuck member cannot effectively hold the substrate. Therefore, in the present embodiment, the upper electrostatic chuck member 400 having a small size (this small-sized upper electrostatic chuck member 400 does not A difference in electromagnetic force is generated between the center and the periphery) is uniformly mounted on the upper table 200, thereby enhancing the clamping force of the electrostatic chuck member 400. Therefore, even when the size of the substrate is increased to, for example, 1500 × 1800 mm (sixth generation substrate) or more, the chuck member can stably hold the substrate.

Here, the upper electrostatic chuck member 400 is arranged on the bottom surface of the upper table 200. As a result, since the surface of the upper stage 200 is uneven and there is a thickness difference between the upper electrostatic chuck members 400, the upper electrostatic chuck members 400 are unevenly arranged.

Therefore, in the present embodiment, the flatness adjusting unit 500 is provided for adjusting the flatness between the upper electrostatic chuck members 400 adhered to the upper table 200. In the present embodiment, the flatness adjustment unit 500 adjusts the gap between each of the upper electrostatic chuck member 400 and the upper stage 200 by using threads.

Therefore, as shown in FIG. 1 and FIG. 6, the flatness adjusting unit 500 includes: a plurality of first adjusting screw holes 510 formed through the respective electrostatic chuck members 400; and a plurality of second adjusting screw holes 520 passing through The upper table 200 is formed and corresponding to the first adjustment screw hole 510; and the gap adjustment screw 530 is inserted into the first adjustment screw hole 510 and the second adjustment screw hole 520. Here, the first adjustment screw hole 510 is a through hole formed through the upper electrostatic chuck member 400. Here, as shown in FIGS. 2 and 4, it is preferable that four first adjustment screw holes 510 are formed in each of the upper electrostatic chuck members 400. That is, the first adjustment screw holes 510 are disposed at four corners of the rectangular upper electrostatic chuck member 400.

Here, as shown in FIG. 6, above each of the first adjustment screw holes 510 The area (i.e., the area of the electrode layer 440) has a shape corresponding to the screw head, and the area under each of the first adjustment screw holes 510 has a thread shape. In addition, an area above each of the second adjustment screw holes 520 (ie, a bottom surface area of the upper table 200) forms a thread shape, and an area under each of the second adjustment screw holes 520 (ie, a central area of the upper table 200) ) forms a straight line. Further, the gap adjusting screw 530 includes a screw head and a screw body. In the central region of the screw body of the gap adjusting screw 530, a thread corresponding to the threads of the first adjusting screw hole 510 and the second adjusting screw hole 520 is formed.

In the present embodiment, the flatness between the upper electrostatic chuck members 400 adhered to the upper table 200 can be adjusted by the flatness adjusting unit 500.

That is, as shown in FIG. 7, when the surface of the upper stage 200 is not on the same horizontal line as the reference plane due to, for example, a combination process error or a manufacturing process error, the following problem occurs. That is, when the electrostatic chuck member 400 is adhered to the bottom surface of the inclined upper table 200, as shown in (a) of Fig. 7, the upper electrostatic chuck member 400 is also inclined. However, as shown in (b) of FIG. 7, after the gap adjusting screw 530 located in the inclined region of the upper table 200 is manipulated to separate the surface of the electrostatic chuck member 400 from the upper table 200, The electrostatic chuck component 400 becomes level relative to the reference surface.

Further, as shown in FIG. 8, when the heights of the upper electrostatic chuck members 400 are inconsistent due to, for example, process errors or height reduction caused by the buffer layer, the following problems occur. The upper central electrostatic chuck component 400 in Figure 8 is relatively low. Therefore, when the upper electrostatic chuck member 400 is closely connected When the table 200 is touched (see dotted line), the height of the upper electrostatic chuck member 400 does not match. However, after the gap adjustment screw 530 is manipulated to adjust the gap between the electrostatic chuck member 400 and the upper table 200, the upper electrostatic chuck member 400 is variable in level.

As described above, in the present embodiment, the surface of the upper electrostatic chuck member 400 can be leveled by manipulating the flatness adjusting unit 500.

Here, as shown in the modified example of FIG. 9, the above-described flatness adjustment unit 500 may be designed such that the gap adjustment screw 530 penetrates from the upper table 200 to the upper electrostatic chuck member 400. That is, the second adjustment screw hole 520 may be formed in the through hole formed through the upper table 200. In addition, the first adjustment screw hole 510 may be formed only on the area of the base plate 410 of the upper electrostatic chuck member 400. Therefore, no groove is formed on the bottom surface (in contact with the surface) of the electrostatic chuck member 400.

As described above, in the present embodiment, the upper electrostatic chuck member 400 that sandwiches the substrate by electrostatic force is mounted on the bottom surface of the upper table 200. Here, the upper electrostatic chuck member 400 may be formed in a manner of separating units and combined. Here, the upper electrostatic chuck member 400 can be fixed to the upper table 200 by using the gap adjusting screw 530. Needless to say, other fasteners (bolts or adhesives) may be used to secure the upper electrostatic chuck member 400. In addition to the above reasons, the upper electrostatic chuck member 400 may sag due to its own gravity until the internal space of the chamber member 100 is evacuated. However, in the present embodiment, since the substrate 11 closely contacts the surface of the upper electrostatic chuck member 400, the substrate 11 does not sag and maintain a predetermined height.

In addition, at least one lower electrostatic chuck component 600 faces the upper electrostatic card The disk member 400 is disposed on the lower table 300. Here, the shape of the lower electrostatic chuck member 600 is similar or identical to the shape of the upper electrostatic chuck member 400. In addition, the lower electrostatic chuck member 600 can be divided into a plurality of sections to support and fix the large-sized substrate 12.

Here, the upper substrate 11 is supported by the upper electrostatic chuck member 400 and fixed on the upper table 200, and the lower substrate 12 is supported by the lower electrostatic chuck member 600 and fixed to the lower table 300. Here, in order to attach and seal the upper substrate 11 and the lower substrate 12, the upper substrate 11 and the lower substrate 12 must first be moved into the chamber member 100, and placed on the respective upper electrostatic chuck member 400 and static electricity. On the chuck member 600. In addition, the upper substrate 11 and the lower substrate 12 are aligned and pressed together.

Therefore, in the present embodiment, the download stage component 700 and the upload stage component 800 are provided.

The download stage unit 700 moves the lower substrate 12 by moving the lower stage 300, and the upload stage unit 800 moves the upper substrate 11 by moving the upper stage 200.

The download stage component 700 includes at least one lower drive shaft 710 coupled to the lower stage 300, and a lower drive unit 720 that applies a driving force to the lower drive shaft 710. Here, the lower drive shaft 710 partially penetrates a portion of the chamber component 100. Therefore, a lower bellows 730 is installed to surround the lower drive shaft 710 to prevent the drive shaft 710 from breaking the seal of the chamber component 100. Although not shown in the drawings, a plurality of lift pins that are lifted and lowered through the lower table 300 may be further provided. In addition, the download stage component 700 can adjust the X, Y, and θ positions of the lower stage 300. Also That is, the download stage component 700 includes X, Y, and θ position adjustment units for adjusting the respective X, Y, and θ positions of the lower stage 300. Therefore, the lower substrate 12 and the upper substrate 11 can be aligned by the X, Y, and θ position adjusting units. Here, the substrate assembly apparatus of the present embodiment may further include an alignment unit such as a camera or a sensor for aligning the lower substrate 12 and the upper substrate 11.

The upload stage component 800 includes at least one upper drive shaft 810 coupled to the upper table 200, and an upper drive unit 820 that applies a driving force to the upper drive shaft 810. The upload stage component 800 further includes an upper bellows 830 disposed on an outer wall of the upper drive shaft 820. Here, the upload stage member 800 presses the upper substrate 11 and the lower substrate 12 together by lowering the upper stage 200.

Further, the substrate assembly apparatus may further include a vacuum adsorption unit that fixes the substrates 11 and 12 by vacuum suction force and electrostatic force. Here, the vacuum adsorption unit includes a nozzle member that closely contacts the substrates 11 and 12, an elongated tube that is connected to the nozzle member, and a vacuum pump that is disposed at one end of the elongated tube. Here, the nozzle member may be formed on the surface of the upper electrostatic chuck member 400 and/or the lower electrostatic chuck member 600.

Therefore, the substrate assembly apparatus of the present embodiment has the transparent glass substrate 12 disposed on the lower stage 300 in the chamber member 100, on which the thin film transistor and the pixel electrode are formed. First, the substrate assembly apparatus enables the substrate 12 to closely contact the lower electrostatic chuck member 600, and then supports and fixes the substrate 12 by the electrostatic force of the lower electrostatic chuck member 600. Here, the liquid crystal may be dropped on the glass substrate 12. Needless to say, the glass substrate 12 The peripheral portion may be coated with a sealing member such as a sealant. Further, a transparent glass substrate 11 is placed on the upper stage 200, and a common electrode and a color filter pattern are formed on the glass substrate 11. The substrate 11 is supported by a vacuum suction force and is fixed by the electrostatic force of the upper electrostatic chuck member 400. Here, the peripheral portion of the glass substrate 11 may be coated with a sealing member such as a sealant.

Then, the chamber member 100 is evacuated, and the substrates 11 and 12 are aligned with each other. Next, the upper stage 200 is lowered, and the substrates 11 and 12 are attached and sealed together. Next, after the vacuum is released, the two substrates 11 and 12 adhered together are transferred to the hardening device, and light or heat is applied to the sealing member region to harden the sealing member, thereby completely adhering the substrates 11 and 12.

Although the substrate assembly device has been described above with reference to a specific embodiment, the substrate assembly device is not limited to this particular embodiment. Described below is a substrate assembly apparatus in accordance with another embodiment. The same components as those of the foregoing embodiments will not be repeated. The technical concept of the present embodiment is also applicable to the foregoing embodiments.

Figure 10 is a cross-sectional view of a substrate assembly apparatus in accordance with another embodiment.

Referring to FIG. 10, a substrate assembly apparatus according to the present embodiment includes a chamber member 100, an upper table 200 and a lower table 300, a plurality of upper electrostatic chuck members 400 and a lower electrostatic chuck member 600, and a download stage member. 700 and upload stage component 800. The substrate assembly device further includes: a flatness adjustment unit 500 to level the surface of the upper electrostatic chuck member 400; The sensor component 900 is configured to detect the surface height of the upper electrostatic chuck component 400. In the present embodiment, the flatness adjustment unit 500 includes a plurality of drive motor components 550 disposed on a top surface of the upper work table 200 and corresponding to the respective upper electrostatic chuck members 400; and at least one drive shaft member 540 extends from the drive motor component 550 through the upper table 200 to the upper electrostatic chuck component 400. In the present embodiment, the height of the upper electrostatic chuck member 400 can be automatically controlled by the respective drive motor components 550. In the present embodiment, the sensor component 900 is disposed in the inner wall region of the chamber component 100 for detecting whether the height of the electrostatic chuck component 400 is uniform. If the heights of the electrostatic chuck members 400 are not uniform, the heights of the upper electrostatic chuck members 400 having different heights are controlled by the corresponding driving motor members 550. Needless to say, the sensor component 900 for automatically detecting the height can also be omitted. Instead, the horizontal plane of the upper electrostatic chuck component 400 can be uniformly controlled using a naked eye or flatness measuring device.

Although the present embodiment shows and describes that the drive motor unit 550 is disposed on the top surface of the upper table 200, the present invention is not limited thereto. That is, the drive motor component 550 can also be disposed on the outer side of the chamber component 100. Here, the drive shaft member 540 can be coupled to the upper electrostatic chuck member 400 through the chamber member 100 and the upper table 200.

Although the substrate assembly device has been described above with reference to a specific embodiment, the substrate assembly device is not limited to this particular embodiment. A substrate assembly apparatus will be described below in accordance with still another embodiment. The same components as those of the foregoing embodiments will not be repeated. The technical concept of the embodiment can be applied to the foregoing embodiments.

Figure 11 is a cross-sectional view of a substrate assembly apparatus in accordance with still another embodiment.

Referring to FIG. 11, the substrate assembly apparatus according to the embodiment includes: a chamber member 100, an upper table 200 and a lower table 300, a plurality of upper electrostatic chuck members 400 and a lower electrostatic chuck member 600, and a download stage member. 700 and upload stage component 800. The substrate assembly apparatus further includes a flatness adjustment unit 500 for leveling the surface of the upper electrostatic chuck member 400.

Here, the upper table 200 is provided with a plurality of grooves 210 on its bottom surface, which correspond to the upper electrostatic chuck member 400. That is, the upper electrostatic chuck member 400 is located below the respective recess 210. Here, the flatness adjustment unit 500 of the present embodiment may be a pneumatic, hydraulic, or electric cylinder. Here, the height of the electrostatic chuck member 400 is uniformly adjusted to improve the surface flatness between the upper electrostatic chuck members 400.

Although the substrate assembly device has been described above with reference to a specific embodiment, the substrate assembly device is not limited to this particular embodiment. A substrate assembly apparatus will be described below in accordance with still another embodiment. The same components as those of the foregoing embodiments will not be described again. The technical concept of the embodiment can be applied to the foregoing embodiments.

Figure 12 is a cross-sectional view of a substrate assembly apparatus in accordance with still another embodiment. Figure 13 is a top plan view of the upper table for illustrating the arrangement of the plurality of electrostatic chuck components of the substrate assembly shown in Figure 12. Figure 14 is a top plan view of the electrostatic chuck member for illustrating the electrode pattern of the electrostatic chuck member of the substrate assembly shown in Figure 12 . 15 and FIG. 16 are plan views of a modified example of the electrostatic chuck member of the substrate assembly apparatus shown in FIG. Surface map. Figure 17 is a cross-sectional view of the electrostatic chuck coupled to the table above the substrate assembly shown in Figure 12. 18 and 19 are cross-sectional views showing a modified example in which an electrostatic chuck member is coupled to a table above the substrate assembly shown in FIG. 20(a) to (c) are schematic views showing the operation of the electrostatic chuck member of the substrate assembly shown in Fig. 12.

Referring to FIG. 12 to FIG. 20, the substrate assembly apparatus of the present embodiment includes: a chamber member 1100 defining an internal space; an upper table 1200 and a lower table 1300 disposed face to face in the chamber member 1100; The upper electrostatic chuck component 1400 is mounted on the bottom surface of the upper workbench 1200; the plurality of power control units 1500 apply power to the respective upper electrostatic chuck components 1400; at least one lower electrostatic chuck component 1600 is mounted on the lower workbench A top surface of the 1300; a download stage component 1700 for moving the lower stage 1300; and an upload stage component 1800 for moving the upper stage 1200.

Here, although not shown in the drawings, the substrate assembly apparatus may further include a frame into which the chamber member 1100 is fitted, and the download stage member 1700 and the upload stage member 1800 are disposed on the frame. In addition, a plurality of lower power control units (not shown) may be further provided for applying power to the lower electrostatic chuck unit 1600.

The chamber component 1100 includes an upper chamber 1110 and a lower chamber 1120 that define a substrate assembly space. Here, it is effective that the upper chamber 1110 and the lower chamber 1120 are coupled to each other in a detachable manner. Additionally, although not shown in the drawings, the chamber component 1100 may further include a pressure adjustment unit for adjusting the pressure of the interior space of the chamber component 1100. Additionally, the chamber component 1100 can further include a purification unit for discharging impurities into the interior of the chamber component 1100. Outside. 12 shows a state in which the upper chamber 1110 and the lower chamber 1120 are coupled to each other, but the present invention is not limited thereto. For example, the chamber component 1100 can include an upper portion, a side wall portion, and a lower portion. Further, although not shown in the drawings, the chamber member 1100 may provide an inlet/outlet on one side by which the substrate is loaded or unloaded. In addition, a gate valve can be provided for opening and closing the inlet/outlet. Needless to say, the substrate can also be loaded into or unloaded from the chamber member 1100 by the lifting of the upper chamber 1110 or the lower chamber 1120. Here, a lifting member may be further provided for raising and lowering the respective upper chamber 1110 and lower chamber 1120.

The upper table 1200 is provided in a plate shape and disposed adjacent to the inner surface of the upper chamber 1110. The shape of the plate may vary abundance with the shape of the substrate disposed on the bottom surface of the upper table 1200. In the present embodiment, the upper table 1200 is formed in a rectangular plate shape. In addition, the lower table 1300 is also formed in a plate shape and disposed adjacent to the inner surface of the lower chamber 1120. In addition, it is effective that the lower table forms a shape similar or identical to the upper table. Thus, the upper and lower tables are configured such that the bottom surface of the upper table 1200 is directly opposite the top surface of the lower table.

The upper electrostatic chuck member 1400 is mounted and fixed to the bottom surface of the upper table 1200 in a matrix pattern. That is, as shown in FIG. 13, twenty electrostatic chuck members 1400 (for example, a 4 x 5 matrix pattern) are disposed on the entire bottom surface of the upper table 1200. Needless to say, the number of electrostatic chuck components is not limited to twenty. That is, the number of electrostatic chuck components can be greater or less than twenty.

Each upper electrostatic chuck component 1400 includes: a base plate 1410; a buffer A layer 1420 is disposed on the base plate 1410; a first film layer 1430 is disposed on the buffer layer 1420; an electrode layer 1440 is formed on the first film layer 1430; and a second film layer 1450 is disposed over the electrode layer 1440. Here, the buffer layer 1420 is adhered to the base plate 1410 by the first adhesive member 1411, and the first film layer 1430 is adhered to the buffer layer 1420 by the second adhesive layer 1421. In addition, the electrode layer 1440 includes a plurality of electrode patterns which are adhered to the first film layer 1420 by the third adhesive layer 1431. In addition, the second film layer 1450 is adhered to the first film layer 1430 where the electrode layer 1440 is located and the electrode layer 1440 by the fourth bonding member 1441.

As shown in FIG. 14, the electrode layer 1440 of the present embodiment includes: a plurality of positive electrode patterns 1442; a plurality of negative electrode patterns 1443; a positive terminal 1444 electrically coupled to a positive electrode pattern 1442 to which positive power is to be applied; and a negative The terminal 1445 is electrically coupled to the negative electrode pattern 1443 to which negative power is to be applied.

In addition, as shown in FIG. 17, the electrode layer 1440 further includes a power connection member 1460 that is connected to the respective positive terminal 1444 and the negative terminal 1445, and applies power from the external power input terminal. Here, the power connection component 1460 includes: a first wire component and a second wire component connected to the respective positive terminal 1444 and the negative terminal 1445; and a positive connection terminal and a negative connection terminal located at the respective first wire component and On the second line component. Here, covered wires are used as the wire members. In addition, the positive terminal and the negative terminal may be provided in the form of a connector or a socket and a wire.

In addition, the electrode layer 1440 further includes: a plurality of positive electrode connection lines 1446 electrically interconnecting the positive electrode patterns 1442; and a plurality of negative electrode connections Line 1447 electrically interconnects the negative electrode patterns 1443. Therefore, the electric power applied from the positive terminal 1444 is applied to the positive electrode pattern 1442 through the positive electrode connection line 1446. The electric power applied from the negative terminal 1445 is applied to the negative electrode pattern 1443 through the negative electrode connection line 1447.

Here, the positive electrode pattern 1442 and the negative electrode pattern 1443 are formed in a rectangular plate shape. The positive electrode pattern 1442 and the negative electrode pattern 1443 are alternately arranged in a matrix pattern. That is, the negative electrode pattern 1443 is disposed adjacent to the positive electrode pattern 1442, and the positive electrode pattern 1442 is disposed adjacent to the negative electrode pattern 1443. Needless to say, in FIG. 14, the five positive electrode patterns 1442 and the four negative electrode patterns 1443 are arranged in a 3 × 3 matrix pattern. Here, the negative electrode patterns 1443 of the first row and the second row are interconnected by the negative electrode connection line 1447 extending in the space between the first row and the second row, and the negative electrode pattern 1443 of the third row Connected to the negative electrode pattern 1443 of the second row. Some of the negative electrode patterns 1443 of the third row are interconnected by a negative electrode connection line 1447 extending along the periphery of the positive electrode pattern 1442. In addition, the positive electrode patterns 1442 of the second and third rows are interconnected by the positive electrode connection lines 1446 extending along the space between the second and third rows. The two positive electrode patterns 1442 of the first row are interconnected by a positive electrode connection line 1447 extending along the periphery of the negative electrode pattern 1443. One of the positive electrode patterns 1442 is connected to the positive electrode patterns 1442 of the third row, and some of the positive electrode patterns are interconnected by the positive electrode connection lines 1446 extending along the periphery of the negative electrode patterns 1443.

Further, as shown in the modified example of FIG. 15, the eight positive electrode patterns 1442 and the eight negative electrode patterns 1443 may be arranged in a 4×4 matrix pattern. Here, The negative electrode patterns 1443 of the first row, the second row, the third row, and the fourth row are connected by a negative electrode extending along a space between the first row, the second row, the third row, and the fourth row Line 1447 is interconnected. The negative electrode patterns 1443 of the first and third rows are partially interconnected by a negative electrode connection line 1447 extending along the periphery of the positive electrode pattern 1442. In addition, the positive electrode patterns 1442 of the second and third rows are interconnected by the positive electrode connection lines 1446 extending along the space between the second and third rows. The two positive electrode patterns 1442 of the respective first and fourth rows are partially interconnected by a positive electrode connection line 1447 extending along the periphery of the negative electrode pattern 1443. The positive electrode patterns 1442 of the first row are partially interconnected by the positive electrode connection lines 1447 extending along the periphery of the negative electrode patterns 1443. The positive electrode patterns 1442 of the fourth row are partially interconnected by the positive electrode connection lines 1447 extending along the periphery of the negative electrode patterns 1443.

Needless to say, the number and matrix pattern of the positive electrode pattern 1442 and the negative electrode pattern 1443 are not limited to the above number and matrix pattern, but the number may be larger or smaller than the above number.

Further, the shapes of the positive electrode pattern 1442 and the negative electrode pattern 1443 are not limited to the above shapes. That is, as shown in the modified example of FIG. 16, the positive electrode pattern 1442 and the negative electrode pattern 1443 may be formed in a finger shape and alternately arranged. Here, one end of one positive electrode pattern 1442 is coupled to the positive terminal 1444. One end of one negative electrode pattern 1443 is coupled to the negative terminal 1445. Needless to say, the present invention is not limited to this. That is, the positive electrode pattern 1442 and the negative electrode pattern 1443 can be formed in various shapes and alternately arranged.

The upper electrostatic chuck member 1400 having the above structure is disposed on the upper table 1200 for lifting the large-sized substrate 1011.

That is, as the sizes of the substrates 1011 and 1012 increase, the size of the electrostatic chuck member for supporting and fixing the substrates 1011 and 1012 also increases. However, when the size of the electrostatic chuck member is increased, the electric resistance caused by the electrode pattern in the electrostatic chuck is increased, so that an electromagnetic force difference is generated between the peripheral region of the electrostatic chuck member and the central portion, and thus the electrostatic chuck The component cannot effectively hold the substrate. Therefore, in the present embodiment, the upper electrostatic chuck member 1400 having a small size (550 × 650 mm (third generation) which does not cause an electromagnetic force difference between the center and the periphery) is uniformly mounted on The upper table 1200 is placed on the table 1200 to increase the clamping force of the electrostatic chuck member 1400. That is, the size of the electrostatic chuck member can be selected from the range of 50 x 50 mm to 550 x 650 mm. When the size of the electrostatic chuck member is less than 50 x 50 mm, the number of electrostatic chuck members 1400 to be mounted is increased, so that the processing time required to mount the electrostatic chuck member 1400 is increased. When the size of the electrostatic chuck member is larger than 550 x 650 mm, the clamping force of the electrostatic chuck member is not uniform. In summary, even when the size of the substrate is increased to, for example, 1500 x 1800 mm (sixth generation substrate) or more, the chuck member can firmly hold the substrate.

In the present embodiment, the electrostatic chuck member 1400 disposed on the upper table 1200 is independently driven.

As shown in FIGS. 12 and 17, in the present embodiment, the power control unit 1500 is for supplying power to the respective electrostatic chuck members 1400 to independently drive the electrostatic chuck members 1400.

Each power control component 1500 includes a controller 1510 for controlling a power application, a connection line component 1520 connected to the controller 1510, and a connection terminal component 1530 located at one end of the connection line component 1520 and electrically coupled to the positive Terminal 1444 and negative terminal 1445. Here, as shown in FIG. 12, a power supply part 1900 is further provided for supplying power to the power control part 1500.

In the present embodiment, as shown in FIGS. 12 and 17, the controller 1510 is disposed on the top surface of the upper table 1200. Power supply component 1900 provides power to controller 1510. Therefore, even when the upper table 1200 is moving, power can be supplied to the electrostatic chuck member 1400.

As shown in FIG. 17, the connection terminal member 1530 is disposed on the bottom surface of the upper table 1200. Here, the connection terminal member 1530 is disposed on the bottom surface area around the electrostatic chuck member 1400 such that the power connection member 1460 of the electrostatic chuck member 1400 is connected to the connection terminal member 1530. That is, the number of the connection terminal members 1530 of the present embodiment is equal to the number of the electrostatic chuck members 1400. The number of controllers 1510 coupled to the connection terminal members 1530 through the connecting wire members 1520 may also be equal to the number of the electrostatic chuck members 1400.

Here, since the connection terminal member 1530 is disposed on the bottom surface of the upper table 120, electrical connection between the electrostatic chuck member 1400 and the power control member 1500 is easily achieved. In addition, the connection terminal member 1530 may be formed in a socket type or a connector type, and corresponds to a positive connection terminal or a negative connection terminal. The socket type or connector type connection terminal member 1530 is buried in the upper table 1200 and partially exposed from the bottom surface of the upper table 1200, thereby allowing the static The electric chuck member 1400 can be mounted on the upper table 1200 without any interference. Further, as shown in FIG. 13, since the connection terminal member 1530 is partially exposed from the bottom surface area of the electrostatic chuck member 1400, the power connection member 1460 of the electrostatic chuck member 1400 can extend along the side of the electrostatic chuck member 1400. . In addition, the present invention is not limited to the above, as shown in the modified example of FIG. 18, a groove is formed in the upper table 1200, in contact with the electrostatic chuck member 1400, and the connection terminal member 1530 can be disposed in the groove. in. As a result, the connection terminal member 1530 is not exposed. Additionally, as shown in the modified example of FIG. 19, the power connection component 1460 coupled to the electrode layer 1440 of the electrostatic chuck component 1400 can extend through the electrostatic chuck component 1400 to the bottom surface region. Here, the electrostatic chuck component 1400 can provide a hole through which the power connection component 1460 can pass. Further, the connection terminal member 1530 is formed on the bottom surface of the upper table 1200 to closely contact the bottom surface of the base plate 1410 of the electrostatic chuck member 1400. As such, the power connection component 1460 and the connection terminal component 1530 can be interconnected at the bottom surface area of the electrostatic chuck component 1400.

As described above, the electrostatic chuck member 1400 of the present embodiment is independently driven by the respective controllers 1510 coupled to the electrostatic chuck member 1400. That is, by controlling the operation of the power control unit 1500, all of the electrostatic chuck members 1400 can be driven or a portion of the electrostatic chuck members 1400 can be selectively driven. In this way, a plurality of different substrates can be held. That is, as shown in (a) of FIG. 20, in order to support and fix the large-sized substrate 1011, all of the electrostatic chuck members 1400 can be driven to generate an electrostatic force for supporting and fixing the substrate 1011. In addition, as shown in (b) of FIG. 20, for A relatively small substrate can drive a portion of the electrostatic chuck member 1400 corresponding to the size of the substrate to support the substrate 1011. When supporting the small substrate shown in (b) of FIG. 20, it is only necessary to drive the six electrostatic chuck members 1400 located in the center region without driving all (twenty) electrostatic chuck members 1400. Further, as shown in (c) of FIG. 20, a plurality of small-sized substrates 1011 can be fixed by selectively driving a part of the electrostatic chuck member. In FIG. 20, two substrates 1011 can be supported and fixed by driving the third and fourth rows of the electrostatic chuck members 1400. However, the invention is not limited thereto. That is, a variety of methods can be employed to support the substrate. For example, an electrostatic chuck component 1400 can support and secure a substrate 1011.

The power supply to the electrostatic chuck component 1400 can be achieved with the power control component 1500. That is, the power control unit 1500 can control the power supplied to the electrostatic chuck unit 1400 in accordance with the signal applied to the external control unit. As such, the electrostatic chuck component 1400 can be selectively or independently driven.

Since the electrostatic chuck member 1400 can be driven independently or selectively, the substrate can maintain the support and the fixed state even when the at least one electrostatic chuck member 1400 is damaged. That is, as shown in (a) of FIG. 20, even when one of the electrostatic chuck members 1400 located in the center region is damaged, the peripheral electrostatic chuck member 1400 can hold the substrate 1011 in the nip state until the end of the process. until. That is, even when 50% of the electrostatic chuck members 1400 are inoperable, the remaining electrostatic chuck members 1400 can support and hold the substrate 1011. In addition, maintenance costs can be reduced because only damaged electrostatic chuck components need to be replaced.

In the present embodiment, an electrostatic chuck member is controlled by a power control unit 1500, but the present invention is not limited thereto. That is, the electrostatic chuck components can be divided into a plurality of groups such that each group can be controlled by one power control component 1500. For example, two adjacent electrostatic chuck components 1400 can be controlled with one power control component 1500, or one row of electrostatic chuck components 1400 can be controlled with one power control component 1500.

Although not shown in the drawings, the controller 1510 of the power control unit 1500 may not be disposed on the upper table 1200, but disposed outside the chamber member 1100. Here, the wire component 1520 of the power control component 1500 passes through the chamber component 1100 and the upper table 1200. In addition, the connecting wire member 1520 can be elongated or shortened to some extent. Although only one power supply part 1900 is provided in the present embodiment, the present invention is not limited thereto. That is, a plurality of power supply components 1900 may be provided to correspond to the respective power control components 1500.

As described above, in the present embodiment, the electrostatic chuck member 1400 for holding the substrate 1011 is mounted on the bottom surface of the upper table 1200, and the power control unit 1500 is provided on the top region of the upper table 1200 for Power is supplied independently to the respective upper electrostatic chuck component 1400. Here, the upper electrostatic chuck component 1400 can be provided in the form of a separate unit that will be combined. Further, each of the upper electrostatic chuck members 1400 is electrically connected to the power control unit 1500.

In addition, at least one lower electrostatic chuck member 1600 is disposed on the lower table 1300 opposite the upper electrostatic chuck member 1400. Here, the shape of the lower electrostatic chuck member 1600 is similar to the shape of the upper electrostatic chuck member 1400. Or the same. Additionally, the lower electrostatic chuck component 1600 can be divided into a plurality of sections to support and secure the large size substrate 1012. Needless to say, although not shown in the drawings, these partitions of the lower electrostatic chuck member 1600 can also be independently driven by the respective power control components 1500.

Here, the upper substrate 1011 is supported by the upper electrostatic chuck member 1400 and fixed on the upper table 1200, and the lower substrate 1012 is supported by the lower electrostatic chuck member 1600 and fixed on the lower table 1300. Here, in order to attach and seal the upper substrate 1011 and the lower substrate 1012 together, the upper substrate 1011 and the lower substrate 1012 must first be moved into the chamber member 1100, and placed on the respective upper electrostatic chuck member 1400 and the lower electrostatic card. On the disk member 1600. In addition, the upper substrate 1011 and the lower substrate 1012 are aligned and pressed together.

Therefore, in the present embodiment, the download stage component 1700 and the upload stage component 1800 are to be provided.

The download stage unit 1700 moves the lower substrate 1012 by moving the lower stage 1300, and the upload stage unit 1800 moves the upper substrate 1011 by moving the upper stage 1200.

The download stage component 1700 includes at least one lower drive shaft 1710 coupled to the lower table 1300, and a lower drive unit 1720 that applies a driving force to the lower drive shaft 1710. Here, the lower drive shaft 1710 partially penetrates a portion of the chamber component 1100. Therefore, the lower bellows 1730 is to be installed to surround the lower drive shaft 1710 to prevent the drive shaft 1710 from breaking the seal of the chamber member 1100. Although not shown in the drawings, a plurality of lift pins that are lifted up and down through the lower table 1300 may be provided. In addition, the download stage component 1700 can adjust the X, Y, and θ positions of the lower stage 1300. In other words, download the platform department The piece 1700 includes X, Y, and θ position adjustment units for adjusting the respective X, Y, and θ positions of the lower table 1300. Therefore, the lower substrate 1012 and the upper substrate 1011 can be aligned by the X, Y, and θ position adjusting units. Here, the substrate assembly apparatus of the present embodiment may further include an alignment unit such as a camera or a sensor for aligning the lower substrate 1012 with the upper substrate 1011.

The upload stage component 1800 includes at least one upper drive shaft 1810 coupled to the upper table 1200 and an upper drive unit 1820 that applies a driving force to the upper drive shaft 1810. The loading stage component 1800 further includes an upper bellows 1830 disposed on a wall of the upper drive shaft 1810. Here, the upload stage member 1800 presses the upper substrate 1011 and the lower substrate 1012 together by lowering the upper stage 1200.

Further, the substrate assembly apparatus may further include: a vacuum adsorption unit that fixes the substrates 1011 and 1012 by vacuum adsorption force and electrostatic force. Here, the vacuum adsorption unit includes a nozzle member that closely contacts the substrates 1011, 1012, an elongated tube that is connected to the nozzle member, and a vacuum pump that is located at one end of the elongated tube. Here, the nozzle member may be formed on the surface of the upper electrostatic chuck member 1400 and/or the lower electrostatic chuck member 1600. In addition, the nozzle member may be disposed at a space between the upper electrostatic chuck members 1400.

Therefore, the substrate assembly apparatus of the present embodiment disposes the transparent glass substrate 1012 on the lower stage 1300 in the chamber member 1100, in which the thin film transistor and the pixel electrode are formed on the glass substrate 1012. First, the substrate assembly apparatus enables the substrate 1012 to closely contact the lower electrostatic chuck member 1600, and then supports and fixes the substrate 1012 by the electrostatic force of the lower electrostatic chuck member 1600. At this time, the liquid crystal is applied to the glass substrate one drop at a time. On 1012. Needless to say, the peripheral portion of the glass substrate 1012 may be coated with a sealing member such as a sealant. In addition, a transparent glass substrate 1011 is placed on the upper stage 1200, wherein a common electrode and a color filter pattern are formed on the glass substrate 1011. The substrate 1011 is supported by a vacuum suction force and is fixed by the electrostatic force of the upper electrostatic chuck member 1400. Here, the peripheral portion of the glass substrate 1011 may be coated with a sealing member such as a sealant.

The chamber component 1100 is then evacuated and the substrates 1011 and 1012 are aligned with each other. Next, the upper stage 1200 is lowered to attach and seal the substrates 1011, 1012 together. Then, after the vacuum is released, the two substrates 1011, 1012 attached together are transferred to the hardening device, and light or heat is applied to the sealing member region to harden the sealing member, thereby completely adhering the substrates 1011, 1012 together. .

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the invention, and any one of ordinary skill in the art can make some modifications and refinements without departing from the spirit and scope of the invention. The scope of the invention is defined by the scope of the appended claims.

11, 12, 1011, 1012‧‧‧ substrates

100, 1100‧‧‧ chamber components

110, 120, 1110, 1120‧‧ ‧ chamber

200, 300, 1200, 1300 ‧ ‧ workbench

210, 1210‧‧‧ grooves

400, 600, 1400, 1600‧‧‧ Electrostatic chuck parts

410, 1410‧‧‧ base plate

411, 421, 431, 441, 1411, 1421, 1431, 1441‧‧ ‧ adhesive layer

420, 1420‧‧‧ buffer layer

430, 450, 1430, 1450‧‧ ‧ film layer

440, 1440‧‧‧ electrode layer

442, 443, 1442, 1443 ‧ ‧ electrode pattern

500‧‧‧flatness adjustment unit

510, 520‧‧‧Adjust screw holes

530‧‧‧Gap adjustment screw

540‧‧‧Drive shaft components

550‧‧‧Drive motor parts

700, 800, 1700, 1800‧‧‧ stage components

710, 810, 1710, 1810‧‧‧ drive shaft

720, 820, 1720, 1820‧‧‧ drive units

730, 830, 1730, 1830‧‧‧ telescopic bladder

900‧‧‧Sensor components

1444, 1445‧‧‧ terminals

1446, 1447‧‧‧ electrode connection line

1460‧‧‧Power connection parts

1500‧‧‧Power Control Unit

1510‧‧‧ Controller

1520‧‧‧Connector components

1530‧‧‧Connecting terminal parts

1900‧‧‧Power supply components

1 is a cross-sectional view of a substrate assembly apparatus in accordance with an embodiment.

2 is a top plan view of the upper table for illustrating the arrangement of the plurality of electrostatic chuck components of the substrate assembly of FIG. 1.

Figure 3 is a cross-sectional view of the electrostatic chuck member of the substrate assembly apparatus shown in Figure 1.

Figure 4 is a view showing the electrostatic chuck member of the substrate assembly shown in Figure 1 View the floor plan.

Figure 5 is a top plan view showing an improved exemplary electrostatic chuck component of the substrate assembly of Figure 1.

Figure 6 is a cross-sectional view of the electrostatic chuck component coupled to the table above the substrate assembly of Figure 1.

7(a) to (b) and FIG. 8 are schematic views showing a method of planarizing an electrostatic chuck member by using a flattening adjustment unit according to the first embodiment.

Figure 9 is a cross-sectional view showing a modified example of an electrostatic chuck component coupled to a table above the substrate assembly shown in Figure 1.

Figure 10 is a cross-sectional view of a substrate assembly apparatus in accordance with another embodiment.

Figure 11 is a cross-sectional view of a substrate assembly apparatus in accordance with still another embodiment.

Figure 12 is a cross-sectional view of a substrate assembly apparatus in accordance with still another embodiment.

Figure 13 is a top plan view of the upper table for illustrating the arrangement of the plurality of electrostatic chuck components of the substrate assembly shown in Figure 12.

Figure 14 is a top plan view of the electrostatic chuck member for illustrating the electrode pattern of the electrostatic chuck member of the substrate assembly shown in Figure 12 .

15 and FIG. 16 are top plan views showing a modified example of the electrostatic chuck member of the substrate assembly apparatus shown in FIG.

Figure 17 is a cross-sectional view of the electrostatic chuck coupled to the table above the substrate assembly shown in Figure 12.

18 and FIG. 19 are the electrostatic chuck components coupled to the base shown in FIG. An improved cross-sectional view of a table above the plate assembly.

20(a) to (c) are schematic views showing the operation of the electrostatic chuck member of the substrate assembly shown in Fig. 12.

11, 12‧‧‧ substrate

100‧‧‧ chamber components

110, 120‧‧‧ chamber

200, 300‧‧‧ workbench

400, 600‧‧‧ Electrostatic chuck parts

500‧‧‧flatness adjustment unit

510, 520‧‧‧Adjust screw holes

530‧‧‧Gap adjustment screw

700, 800‧‧‧stage components

710, 810‧‧‧ drive shaft

720, 820‧‧‧ drive unit

730, 830‧‧ ‧ telescopic sac

Claims (18)

A substrate assembly device comprising: a chamber member; an upper table and a lower table disposed face to face in the chamber member; a plurality of upper electrostatic chuck members mounted on a bottom surface of the upper table; And a power control component configured to provide power to each of the electrostatic chuck components; and at least one lower electrostatic chuck component mounted on a top surface of the lower table. The substrate assembly device of claim 1, further comprising: a flatness adjustment unit for adjusting a flatness between the upper electrostatic chuck members. The substrate assembly device of claim 2, wherein the flatness adjustment unit comprises: a plurality of first adjustment screw holes formed through the respective electrostatic chuck members; and a plurality of second adjustments a screw hole formed in the upper table and corresponding to the first adjusting screw hole; and a gap adjusting screw inserted into the first adjusting screw hole and the second adjusting screw hole, and used to adjust each a gap between the upper electrostatic chuck member and the upper table. The substrate assembly device of claim 2, wherein the flatness adjustment unit comprises: a plurality of first adjustment screw holes formed on the respective electrostatic chuck members; and a plurality of second adjustment screws Hole, wear Formed by the upper workbench and corresponding to the first adjustment screw hole; and a gap adjustment screw inserted into the first adjustment screw hole and the second adjustment screw hole, and used to adjust each of the a gap between the upper electrostatic chuck member and the upper table. The substrate assembly device of claim 2, wherein the flatness adjustment unit comprises: a plurality of driving motor components disposed on a top surface of the upper table, and electrostatically separated from each other a chuck member corresponding; and at least one drive shaft member extending from the drive motor member through the upper table to the upper electrostatic chuck member. The substrate assembly device of claim 1, wherein the power control component is configured to be independently driven. The substrate assembly device of claim 6, wherein each of the upper electrostatic chuck members comprises: a plurality of positive electrode patterns electrically connected to each other, and a plurality of negative electrode patterns electrically connected to each other; And each of the power control components includes: a connection terminal component electrically coupled to the positive electrode pattern and the negative electrode pattern; a controller for controlling a power supply; and a connection line component for using the A controller is electrically connected to the connection terminal component. The substrate assembly device of claim 7, wherein a socket or a connector is used as the connection terminal member; and the connection terminal member is disposed on a bottom surface of the upper table. The substrate assembly device of claim 7, wherein the controller is disposed on a top surface of the upper table or an outer region of the chamber member. The substrate assembly device according to any one of claims 1 to 9, wherein each of the upper electrostatic chuck members comprises: a base plate; a buffer layer on the base plate; a thin film layer on the buffer layer; an electrode layer formed on the first thin film layer and having a plurality of positive and negative patterns; and a second thin film layer covering the electrode layer. The substrate assembly device of claim 10, wherein the electrode layer comprises: a positive electrode connection line interconnecting the positive electrode patterns; and a negative electrode connection line interconnecting the negative electrode patterns . The substrate assembly device of claim 10, wherein the positive electrode pattern and the negative electrode pattern are formed in a plate shape and alternately arranged. The substrate assembly device of claim 10, wherein each of the upper electrostatic chuck members comprises: a positive terminal coupled to one of the positive electrode patterns; and a negative terminal coupled to the negative One of the electrode patterns; and a power connection component electrically connected to the respective positive terminal and the negative terminal and coupled to the connection terminal component of the power control component. The substrate assembly device of claim 10, wherein the electrode layer comprises: a positive electrode pattern and a negative electrode pattern, the positive electrode pattern and the negative electrode pattern are formed in a plate shape and alternately arranged, or form a straight line Shaped and alternately arranged. The substrate assembly device of claim 10, wherein the upper electrostatic chuck member is arranged in a matrix pattern on the bottom surface of the upper table. The substrate assembly device of claim 1, further comprising: a download stage member for moving the lower table; and a loading stage member for moving the upper table. The substrate assembly device of claim 16, wherein the download stage member includes: X, Y, and θ position adjustment members for adjusting X, Y, and θ positions of the lower table. The substrate assembly device of claim 1, further comprising: at least one lower power control component that supplies power to the lower electrostatic chuck component.