JP7468945B2 - Circuit Board Assembly Equipment - Google Patents

Description

The present invention relates to a substrate assembly device.

Patent document 1 states, "In the present invention, the control unit controls the operation of the approach/separation drive unit and the attachment/detachment drive unit, and the first holding member or the adhesive pin, or both, are moved relatively toward and away from the second holding member in a reduced pressure atmosphere, thereby bonding the first workpiece to the second workpiece. After this bonding, the adhesive pin is moved in a direction away from the first workpiece while the rigid contact surface of the first holding member is in contact with the first workpiece, so that as the adhesive pin is peeled off, the peripheral portion of the portion of the first workpiece adhesively held by the adhesive pin comes into contact with the rigid contact surface and is held in shape along the rigid contact surface. Therefore, deformation of the first workpiece can be minimized when the first holding member presses the first workpiece and when the adhesive pin is peeled off from the first workpiece" (see paragraph 0007).

Patent No. 5654155

The work bonding apparatus (substrate assembly apparatus) described in Patent Document 1 is configured to suppress deformation of the first work when a bonded device formed by bonding a first work (upper substrate) and a second work (lower substrate) is removed from a first holding member (upper table).
However, in order to bond the first workpiece and the second workpiece with high accuracy, it is necessary to align the first workpiece and the second workpiece before bonding them together.

Patent Document 1 states that "immediately before bonding the first workpiece W1 and the second workpiece W2, it is preferable to align the first workpiece W1 and the second workpiece W2 by adjusting and moving either the first holding member 1 or the second holding member 2 in the XYθ directions relative to the other" (see paragraph 0020), but does not describe a specific method for alignment.
Furthermore, although the positional deviation between the first workpiece and the second workpiece can be adjusted by the adjustment movement in the X, Y, and θ directions, it cannot eliminate the joining error (pitch deviation) caused by the dimensional error that occurs during production, etc.

The objective of the present invention is to provide a substrate assembly device that can eliminate bonding errors caused by dimensional errors between the upper and lower substrates and bond the upper and lower substrates together with high precision.

In order to solve the above-mentioned problems, the present invention provides a substrate assembly apparatus which includes a lower table having a lower substrate surface for holding a lower substrate, an upper table having an upper substrate surface opposing the lower substrate surface and for holding an upper substrate, and which bonds the lower substrate held on the lower table and the upper substrate held on the upper table under a vacuum environment, the substrate assembly apparatus comprising: a moving mechanism which displaces and rotates the lower table along the lower substrate surface; an imaging device which images a correspondence between an upper mark which is affixed to the upper substrate and has a coarse adjustment mark and a fine adjustment mark, and a lower mark which is affixed to the lower substrate and has a coarse adjustment mark and a fine adjustment mark, the imaging device which images image data input from the imaging device and images the correspondence between the coarse adjustment marks affixed to the upper substrate and the lower substrate the upper table; a control device which displaces and rotates the moving mechanism so that a predetermined positional relationship is established, and then displaces and rotates the moving mechanism so that fine-adjustment marks affixed to the upper substrate and the lower substrate are in a predetermined positional relationship ; a plurality of divided planar sections which form the upper table; a division drive unit which drives each of the plurality of divided planar sections independently of one another; and one or more adhesive pins which are arranged corresponding to each of the plurality of divided planar sections and which are displaced in a vertical direction relative to the corresponding divided planar section to hold the upper substrate, wherein the one or more adhesive pins arranged corresponding to each of the plurality of divided planar sections have an adhesive pin displacement drive means which drives and displaces in a vertical direction relative to the divided planar section independently of one another for each of the divided planar sections .

The present invention provides a substrate assembly device that can eliminate bonding errors caused by dimensional errors between the upper and lower substrates and bond the upper and lower substrates together with high precision. This makes it possible to effectively correct mark pitch deviations caused by dimensional errors between the upper and lower substrates when bonding them together.

FIG. 2 is a diagram showing a substrate assembly apparatus. FIG. FIG. 13 is a diagram showing the structure of an upper table. FIG. 4 is a diagram showing an upper substrate surface of the upper table. FIG. 13 is a diagram showing an upper substrate surface of the upper table, and is a diagram showing an example of an arrangement of adhesive pins. FIG. 1A is a diagram showing the lower table, and FIG. 1B is a cross-sectional view taken along the line Sec1-Sec1. 1A to 1C are diagrams showing a process of bonding substrates together using a substrate assembly apparatus. 1A and 1B are diagrams showing markings for adjusting the bonding position of an upper substrate and a lower substrate, in which (a) shows an upper mark applied to the upper substrate, and (b) shows a lower mark applied to the lower substrate. 1A and 1B are diagrams showing the state of adjusting the misalignment between an upper mark on an upper substrate and a lower mark on a lower substrate, in which (a) is a diagram showing the misalignment in the XY axis directions, and (b) is a diagram showing the state after the misalignment in the XY axis directions has been adjusted. 1A and 1B are diagrams showing the state of adjusting the misalignment between an upper mark on an upper substrate and a lower mark on a lower substrate, in which (a) shows the misalignment around the Z axis, and (b) shows the state after the misalignment around the Z axis has been adjusted. 1A and 1B are diagrams showing a state in which the misalignment between the first upper mark and the first lower mark is within a specified range, where (a) is a diagram showing a state in which the first upper mark is at the center of the first lower mark, and (b) is a diagram showing a state in which the first upper mark is misaligned from the center of the first lower mark. 1A and 1B are diagrams showing a state in which the misalignment between the upper substrate and the lower substrate is reduced by changing the amount of displacement of the adhesive pin plate, where (a) is a diagram showing a state in which the first upper mark and the first lower mark are misaligned, and (b) is a diagram showing a state in which the misalignment between the first upper mark and the first lower mark has been reduced (a state in which the mark pitch misalignment between the upper substrate and the lower substrate has been corrected). 1A is a diagram showing a state in which the divided drive portion is displaced in accordance with the shape of the upper substrate, and FIG. 1B is a diagram showing a state in which the upper table presses the upper substrate and the lower substrate. 13A and 13B are diagrams showing examples of design modifications, in which (a) shows a state in which the displacement amounts of adhesive pins attached to one adhesive pin plate are different, and (b) shows a configuration in which one divided drive unit corresponds to one adhesive pin. 13A and 13B are diagrams showing another example of a design modification, in which (a) shows a state in which four divided drive units correspond to one adhesive pin plate, and (b) shows a state in which one divided drive unit corresponds to three adhesive pin plates. 13A and 13B are diagrams showing yet another example of a design modification, in which (a) shows an example of a design modification in which all adhesive pins are attached to a single adhesive pin plate, and (b) shows an example of a design modification in which an upper table with an integral structure is provided.

The following describes in detail the board assembly device according to an embodiment of the present invention, with reference to the appropriate drawings. Note that in each of the drawings shown below, common members are given the same reference numerals, and duplicate descriptions will be omitted as appropriate.

FIG. 1 is a diagram showing a board assembly apparatus.
The substrate assembly apparatus 1 is an apparatus that assembles a substrate such as a liquid crystal panel by bonding, in a vacuum, an upper substrate K1 (glass substrate) and a lower substrate K2 (glass substrate) carried in by a conveying device 200 such as a robot hand. The substrate assembly apparatus 1 is controlled by a control device 100.
The board assembly device 1 has a base 1a and an upper frame 2. The base 1a is placed on an installation surface (such as a floor surface). The upper frame 2 is provided above the base 1a so as to be movable up and down.
The upper frame 2 is attached via a load cell 20d to a first driving mechanism (Z-axis driving mechanism 20) which is attached to the base 1a.

The board assembly device 1 is equipped with an upper table 3 and a lower table 4. The lower table 4 is attached to the stand 1a via a movement unit (XYθ movement unit 40). The XYθ movement unit 40 is configured to be independently movable in two mutually perpendicular axial directions (X axis, Y axis) relative to the stand 1a. The XYθ movement unit 40 is also configured to be rotatable around the Z axis relative to the stand 1a. The XYθ movement unit 40 can be a ball bearing or the like that is fixed in the Z axis direction and freely movable in the X and Y axis directions.

In the board assembly apparatus 1 of this embodiment, the direction of the upper frame 2 relative to the stand 1a is defined as the Z-axis direction (vertical direction), the direction of one axis perpendicular to the Z-axis is defined as the X-axis direction (horizontal direction), and the direction of one axis perpendicular to the Z-axis and the X-axis is defined as the Y-axis direction (vertical direction).
The upper table 3 and the lower table 4 are rectangular in shape with their length and width along the Y-axis and X-axis directions, respectively. The flat surface of the upper table 3 (upper substrate surface 3a) and the flat surface of the lower table 4 (lower substrate surface 4a) face each other.

The upper frame 2 is attached to the stand 1a via a Z-axis drive mechanism 20. The Z-axis drive mechanism 20 has a ball screw mechanism 20b that moves a ball screw shaft 20a extending in the Z-axis direction (vertical direction) up and down. The ball screw shaft 20a is rotated by an electric motor 20c and moved up and down by the ball screw mechanism 20b.
The electric motor 20 c is controlled by a control device 100 , and the upper frame 2 is displaced (moves up and down) based on the calculations of the control device 100 .

The upper table 3 is fixed to the upper frame 2 via multiple upper shafts 2a, and the upper frame 2 and upper table 3 move up and down together. An upper chamber 5a is arranged around the upper table 3. The upper chamber 5a is open on the bottom (the side facing the base 1a) and is arranged to cover the top and sides of the upper table 3.

The upper chamber 5a is attached to the upper frame 2 via a hanging mechanism 6. The hanging mechanism 6 has a support shaft 6a extending downward from the upper frame 2, and a locking portion 6b formed by expanding the lower end of the support shaft 6a into a flange shape.
The upper chamber 5a is provided with a hook 6c. The hook 6c is movable up and down around the support shaft 6a. The hook 6c engages with a locking portion 6b at the lower end of the support shaft 6a.
The upper shaft 2a passes through the upper chamber 5. The space between the upper shaft 2a and the upper chamber 5 is sealed by a vacuum seal (not shown).

When the upper frame 2 moves upward (upward movement), the hook 6c engages with the locking portion 6b of the support shaft 6a, and the upper chamber 5a moves upward together with the upper frame 2. Also, when the upper frame 2 moves downward (downward movement), the hook 6c moves downward under its own weight, and the upper chamber 5a moves downward accordingly.

A lower chamber 5b is disposed around the lower table 4. The lower chamber 5b is supported by a plurality of lower shafts 1b attached to the stand 1a. The lower shafts 1b protrude into the lower chamber 5b. The space between the lower chamber 5b and the lower shafts 1b is sealed by a vacuum seal (not shown).
The lower chamber 5 b is open at the top (the upper frame 2 side) and is disposed so as to cover the lower side and sides of the lower table 4 .

The XYθ movement unit 40 is attached to the lower shaft 1b that protrudes into the lower chamber 5b and supports the lower table 4.

The upper chamber 5a and the lower chamber 5b join their open parts to form the vacuum chamber 5. In other words, the upper chamber 5a moves downward and engages with the lower chamber 5b from above, so that the opening of the lower chamber 5b is blocked by the upper chamber 5a. The connection between the upper chamber 5a and the lower chamber 5b is sealed with a seal ring (not shown), ensuring the airtightness of the vacuum chamber 5.

The upper frame 2 can also move further downward than when the upper chamber 5a is in contact with the lower chamber 5b. This allows the upper frame 2 to move downward from a state in which the downward movement of the upper chamber 5a is restricted by the lower chamber 5b, and the engagement between the locking portion 6b and the hook 6c in the hanging mechanism 6 is released. The upper chamber 5a is placed on the lower chamber 5b by its own weight. The upper table 3 and the lower table 4 are then arranged inside the vacuum chamber 5.

The substrate assembly device 1 is equipped with a vacuum pump P0. The vacuum pump P0 is connected to the vacuum chamber 5 and evacuates the air inside the vacuum chamber 5 to create a vacuum inside the vacuum chamber 5. In other words, when the vacuum pump P0 is driven, the inside of the vacuum chamber 5 becomes a vacuum environment. The vacuum pump P0 is controlled by the control device 100.

The upper table 3 moves downward together with the upper frame 2 which moves downward inside the vacuum chamber 5. By such downward movement of the upper table 3, the upper substrate K1 held on the upper table 3 and the lower substrate K2 held on the lower table 4 are bonded together and pressurized. If the inside of the vacuum chamber 5 is in a vacuum state, the upper substrate K1 and the lower substrate K2 are bonded together in a vacuum.
As described above, the upper table 3 is fixed to the upper frame 2 via a plurality of upper shafts 2a. Therefore, the load applied to the upper substrate K1 and the lower substrate K2 by the upper table 3 is detected by the load cell 20d. The detection signal of the load cell 20d is input to the control device 100.

FIG. 2 is a diagram showing a support pin.
As shown in Fig. 2, the upper frame 2 is provided with a plurality of support pins 7. The support pins 7 are tubular members extending in the vertical direction, and are provided so as to be able to move up and down independently of the upper table 3. All of the support pins 7 are attached to one support base 7a, and all of the support pins 7 move up and down simultaneously. The support base 7a is disposed between the upper chamber 5a and the upper table 3. The support base 7a moves up and down by a vertical movement mechanism (such as a ball screw mechanism) not shown. This vertical movement mechanism is controlled by the control device 100.

The support pins 7 are disposed above the upper board surface 3a of the upper table 3.
When the upper substrate 3 moves downward, it protrudes downward from the upper substrate surface 3a.

The support pin 7 has a hollow tubular shape, and its hollow portion 7a1 communicates with the hollow portion 7a1 of the support base 7a. A vacuum pump P1 is connected to the hollow portion 7a1 of the support base 7a. When the vacuum pump P1 is driven, a vacuum is created in the hollow portion 7a1, and the upper substrate K1 is vacuum-adsorbed to the support pin 7. The vacuum pump P1 is controlled by the control device 100. In other words, the vacuum pump P1 is driven in response to a command from the control device 100, and the upper substrate K1 is vacuum-adsorbed to the support pin 7.

Fig. 3 is a diagram showing the structure of the upper table, and Fig. 4 is a diagram showing the upper substrate surface of the upper table.
As shown in FIG. 3 , the upper table 3 has a back plate 30 and a divided drive portion 31 .
The back plate 30 is attached to the upper shaft 2a and moves up and down integrally with the upper frame 2. The back plate 30 is a plate-like member disposed parallel to the lower substrate surface 4a (see FIG. 1) of the lower table 4. The back plate 30 also faces the lower substrate surface 4a.

The split drive unit 31 splits the upper substrate surface 3a. In other words, the upper substrate surface 3a is formed by a flat surface (split flat surface 31a) formed on the split drive unit 31 so as to face the lower substrate surface 4a (see FIG. 1) of the lower table 4. The split drive unit 31 is disposed so that the split flat surface 31a faces the lower substrate surface 4a. As shown in FIG. 4, in this embodiment, the upper substrate surface 3a is split into nine parts. In other words, the upper table 3 is composed of nine split drive units 31. The upper substrate surface 3a is also split into nine split flat surfaces 31a.

As shown in FIG. 3, an actuator 32 (third drive mechanism) is attached to the back plate 30. The actuator 32 displaces (moves up and down) the divided drive unit 31 relative to the back plate 30. The actuator 32 has a rod 32a that extends in a direction perpendicular to the back plate 30 (up and down direction). The actuator 32 incorporates, for example, an electric motor (not shown), and displaces the rod 32a in the axial direction (up and down direction) using a ball screw mechanism. The actuator 32 is controlled by a control device 100 (see FIG. 1).

The divided drive portion 31 is attached to a rod 32 a of an actuator 32 .
4, for example, rods 32a are attached to the four corners (or near the four corners) of a rectangular divided drive unit 31. A bearing (not shown) is interposed between the rods 32a and the divided drive unit 31, and the rods 32a are attached to the divided drive unit 31 so as to be freely rotatable.

When the rod 32a is moved up and down by the actuator 32, the divided drive parts 31 are displaced (moved up and down) in the vertical direction relative to the back plate 30 in response to the displacement of the rod 32a. Each divided drive part 31 is capable of moving up and down independently without interfering with each other.
In addition, since the back plate 30 faces the lower substrate surface 4 a (see FIG. 1 ), the actuator 32 displaces (up and down) the divided drive unit 31 in a direction perpendicular to the lower substrate surface 4 a. In other words, the actuator 32 displaces the divided drive unit 31 toward the lower substrate surface 4 a.

In this way, the substrate assembly device 1 of this embodiment has nine divided drive units 31 that can move up and down independently. The upper substrate surface 3a formed by the divided flat surface portion 31a of each divided drive unit 31 is deformable.

FIG. 5 is a diagram showing an adhesive pin.
5, the upper frame 2 is provided with a plurality of adhesive pins 8. The adhesive pins 8 are tubular members extending in the vertical direction, and are provided so as to be capable of vertical movement independent of the upper table 3 and the support pins 7. The vertical movement of the adhesive pins 8 is a vertical movement with respect to the upper substrate surface 3a.
The adhesive pins 8 are disposed above the upper substrate surface 3a, and when they move downward relative to the upper table 3, they protrude downward from the upper substrate surface 3a. Also, the adhesive pins 8 move upward and are retracted from the upper substrate surface 3a. In this embodiment, a state in which the adhesive pins 8 do not protrude from the upper substrate surface 3a (division plane portion 31a shown in FIG. 3), that is, a state in which the amount of protrusion of the adhesive pins 8 is zero (or less), is defined as a state in which the adhesive pins 8 are retracted from the upper substrate surface 3a. Then, the adhesive pins 8 move downward and protrude from the upper substrate surface 3a. The amount of protrusion of the adhesive pins 8 refers to the amount of protrusion of the adhesive pins 8 from the upper substrate surface 3a (division plane portion 31a) (the same applies below).

The adhesive pins 8 are attached to a number of adhesive pin plates 8a (base parts). One or more adhesive pins 8 are attached to the adhesive pin plate 8a. Each adhesive pin plate 8a is capable of vertical movement (vertical movement relative to the upper substrate surface 3a) independent of the others.

The adhesive pin 8 has an adhesive portion 8b at its tip.
The adhesive pin 8 is hollow and tubular, with a vacuum suction hole 8c opening in the center. The vacuum suction hole 8c communicates with a negative pressure chamber 8a1 formed as a hollow portion of the adhesive pin plate 8a. A first suction means (vacuum pump P2) is connected to the negative pressure chamber 8a1 of the adhesive pin plate 8a. Therefore, the first suction means (vacuum pump P2) is connected to the vacuum suction hole 8c of the adhesive pin 8 via the negative pressure chamber 8a1.

The adhesive pins 8 suck the upper substrate K1 by vacuum when the vacuum pump P2 is driven and the vacuum suction holes 8c are in a vacuum state, and then attach and hold (adhesively hold) the vacuum-sucked upper substrate K1 to the adhesive portions 8b. The adhesive pins 8 hold the upper substrate K1 when protruding from the upper substrate surface 3a.
The vacuum pump P2 is controlled by the control device 100. In response to a command from the control device 100, the upper substrate K1 is vacuum-sucked by the adhesive pins 8 and attached to the adhesive portion 8b.

A gas supply means 8d is connected to the negative pressure chamber 8a1 of the adhesive pin plate 8a. The gas supply means 8d is controlled by the control device 100. The gas supply means 8d operates in response to commands from the control device 100 to supply a predetermined gas (such as air or nitrogen gas) to the negative pressure chamber 8a1. The gas supplied from the gas supply means 8d increases the pressure in the negative pressure chamber 8a1 and the vacuum suction hole 8c, causing the upper substrate K1 attached to the adhesive portion 8b to peel off from the adhesive portion 8b.

Each adhesive pin plate 8a is provided with a second drive mechanism (vertical movement mechanism 80). The vertical movement mechanism 80 has a ball screw shaft 81 rotatably supported by the mounting portion 80a and extending in the Z-axis direction, an electric motor 83 that rotates the ball screw shaft 81, and a ball screw mechanism 82 that moves up and down by the rotating ball screw shaft 81. The mounting portion 80a is fixed to the upper frame 2. The ball screw shaft 81 is rotated by the electric motor 83, and moves the ball screw mechanism 82 up and down. The ball screw mechanism 82 is attached to the adhesive pin plate 8a. The adhesive pin plate 8a moves up and down together with the ball screw mechanism 82 that moves up and down with the rotation of the ball screw shaft 81.
The vertical movement mechanism 80 is controlled by a control device 100 , and the adhesive pin plate 8 a and the adhesive pins 8 move up and down in response to commands from the control device 100 .

The mounting portion 80a is attached to the upper frame 2 and moves up and down integrally with the upper frame 2. As described above, the upper table 3 moves up and down integrally with the upper frame 2. The upper frame 2 moves up and down by the Z-axis drive mechanism 20 (see FIG. 1), and when the upper frame 2 moves down, the upper table 3 and the mounting portion 80a move toward the lower table 4 (see FIG. 1). The vertical movement mechanism 80 is attached to the mounting portion 80a, and the adhesive pin plate 8a (adhesive pins 8) moves up and down in response to the vertical movement of the mounting portion 80a. Therefore, the Z-axis drive mechanism 20 (first drive mechanism) has the function of moving the adhesive pins 8 and the upper table 3 toward the lower table 4.

FIG. 6 is a diagram showing the upper substrate surface of the upper table, and is a diagram showing an example of an arrangement of adhesive pins.
6, in this embodiment in which 81 adhesive pins 8 are provided on the upper table 3, nine adhesive pins 8 are attached to one adhesive pin plate 8a. The board assembly apparatus 1 (see FIG. 1) of this embodiment has nine adhesive pin plates 8a.
In this embodiment, one adhesive pin plate 8a is disposed corresponding to one divided drive section 31. For example, nine adhesive pins 8 are disposed corresponding to the divided flat surface section 31a of one divided drive section 31. The nine adhesive pins 8 disposed in one divided drive section 31 (divided flat surface section 31a) are attached to one adhesive pin plate 8a provided corresponding to that divided drive section 31.

Further, one adhesive pin plate 8a is provided with four vertical movement mechanisms 80. For example, the rectangular adhesive pin plate 8a is provided with vertical movement mechanisms 80 at its four corners. The nine adhesive pin plates 8a can be moved up and down independently of one another by the vertical movement mechanisms 80.
The adhesive pin plates 8a are provided without interfering with the divided drive section 31, and are capable of vertical movement independent of the divided drive section 31. This allows the adhesive pins 8 attached to one adhesive pin plate 8a to be displaced in the vertical direction relative to the corresponding divided flat section 31a.

In this way, the up-down movement mechanism 80 (second drive mechanism) of this embodiment is configured to be able to move each of the multiple (nine) adhesive pin plates 8a independently up and down (vertically with respect to the upper substrate surface 3a).
The vertical movement mechanism 80 can displace the adhesive pin plate 8a by a displacement amount set for each adhesive pin plate 8a, thereby enabling the adhesive pins 8 to hold the upper substrate K1 (see FIG. 1) in a state in which they are displaced together with the adhesive pin plate 8a by the displacement amount set for each adhesive pin plate 8a.

FIG. 7A is a diagram showing the lower table, and FIG. 7B is a cross-sectional view taken along the line Sec1-Sec1.
As shown in Fig. 7A, the lower table 4 is housed inside the lower chamber 5b which is open at the top. The lower table 4 is surrounded by the lower chamber 5b at its bottom and sides. Gaps Gx, Gy are formed between the lower table 4 and the lower chamber 5b in the horizontal direction (X-axis direction) and vertical direction (Y-axis direction), respectively. In addition, the lower side of the lower table 4 is supported by a plurality of XYθ movement units 40. Although Fig. 7A shows the lower table 4 supported by nine XYθ movement units 40, the number of XYθ movement units 40 supporting the lower table 4 is not limited.

The XYθ movement unit 40 supports the lower table 4 so as to be freely displaceable in the X-axis and Y-axis directions. With this structure, the lower table 4 is provided so as to be freely displaceable in the X-axis and Y-axis directions with respect to the lower chamber 5b.
A moving mechanism 41 is attached to the lower table 4. The moving mechanism 41 has a shaft portion 41b connected to an end side of the lower table 4 and a driving portion 41a that displaces the shaft portion 41b in the axial direction. The driving portion 41a displaces the shaft portion 41b in the axial direction by, for example, a ball screw mechanism.

7A, three moving mechanisms 41 are connected to the lower table 4. One of the moving mechanisms 41 has a shaft portion 41b extending in the X-axis direction, and the other two of the moving mechanisms 41 have a shaft portion 41b extending in the Y-axis direction.
The shaft portion 41b extending in the X-axis direction is connected to the vicinity of the center of the edge of the lower table 4. The lower table 4 is displaced in the X-axis direction (horizontal direction) by the displacement of the shaft portion 41b extending in the X-axis direction.

Furthermore, the two shaft portions 41b extending in the Y-axis direction are connected near the ends of the edges on the same side of the lower table 4. When the displacement amounts of the two shaft portions 41b extending in the Y-axis direction are equal, the lower table 4 displaces in the Y-axis direction (vertical direction). When the displacement amounts of the two shaft portions 41b extending in the Y-axis direction are different, the one of the shaft portions 41b with a larger displacement amount displaces in the Y-axis direction more than the one with a smaller displacement amount, and the lower table 4 rotates around the Z-axis.
In this way, the lower table 4 to which the three moving mechanisms 41 are connected is capable of displacement in the X-axis direction (horizontal direction), displacement in the Y-axis direction (vertical direction), and rotation around the Z-axis.

The three moving mechanisms 41 are controlled by the control device 100. The control device 100 issues commands to the three moving mechanisms 41 to appropriately displace the shaft portion 41b and displace the lower table 4.

The lower table 4 is also provided with a lifter 42. The lifter 42 extends across the lower table 42, for example, in the X-axis direction. The lifter 42 is a lifting device 42a such as a ball screw mechanism, and moves up and down as shown by the black arrow in FIG. 7(b). The lifting device 42a is controlled by the control device 100. When the lower substrate K2 (see FIG. 1) is transported by the transport device 200 (see FIG. 1), the control device 100 drives the lifter 42 to place the lower substrate K2 on the lower table 4.

Further, alignment windows 4b are formed at the four corners of the rectangular lower table 4. As shown in Fig. 7B, the alignment windows 4b are through holes that penetrate the plane (lower substrate surface 4a) of the lower table 4. An imaging unit accommodating tube 10a fits into the alignment window 4b from below. The imaging unit accommodating tube 10a is formed by the lower surface of the lower chamber 5b rising upward in a cylindrical shape, and a transparent member 10b is fitted into the tip. The imaging unit accommodating tube 10a accommodates an imaging device 10 that images the lower substrate K2 (see Fig. 1) held by the lower table 4.
The lower table 4 is provided with four imaging devices 10, and data (image data) captured by each imaging device 10 is input to the control device 100. Note that the number of imaging devices 10 provided on the lower table 4 is not limited.

The lower substrate surface 4a of the lower table 4 is a plane that holds the lower substrate K2 (see FIG. 1). The movement mechanism 41 displaces the lower table 4 along the lower substrate surface 4a in the X-axis direction, the Y-axis direction, and around the Z-axis.

An imaging window 4c is formed near the two alignment windows 4b. The imaging window 4c is formed in the same shape as the alignment window 4b. A second imaging unit housing tube (not shown) fits into the imaging window 4c from below. The second imaging unit housing tube is formed in the same shape as the imaging unit housing tube 10a. A second imaging device (not shown) is housed in the second imaging unit housing tube. The second imaging device images the lower substrate K2 (see FIG. 1) held by the lower table 4, and the image data is input to the control device 100. Note that FIG. 7(a) illustrates a configuration in which two second imaging devices are provided on the lower table 4, but the number of second imaging devices is not limited.

A plurality of suction holes 43 are opened in the lower substrate surface 4a of the lower table 4. The suction holes 43 are connected to a second suction means (vacuum pump P3). When the vacuum pump P3 is driven, the placed lower substrate K2 (see FIG. 1) is sucked and held by the lower table 4 (lower substrate surface 4a). The vacuum pump P3 is controlled by the control device 100.

Figure 8 is a diagram showing the process of bonding substrates together using the substrate assembly device. The process of bonding substrates together using the substrate assembly device 1 will be explained with reference to Figures 1 to 7 as appropriate.

The first step (STEP 1) is an upper substrate loading step.
In the upper substrate loading step, the control device 100 moves the upper frame 2 upward to move the upper chamber 5a and the upper table 3 upward, whereby the vacuum chamber 5 is opened.
When the upper substrate K1 is transported between the upper table 3 and the lower table 4 by the transport device 200, the control device 100 moves the support pins 7 downward until they contact the upper substrate K1, and drives the vacuum pump P1. The upper substrate K1 is vacuum-sucked by the support pins 7.
When the transport device 200 exits, the control device 100 moves the support pins 7 upward to bring the upper substrate K1 into close contact with the upper substrate surface 3 a of the upper table 3 .
The control device 100 then issues a command to the vertical movement mechanism 80 to move the adhesive pin plate 8a downward and drives the vacuum pump P2. The upper substrate K1 is vacuum-sucked by the adhesive pins 8 that move downward together with the adhesive pin plate 8a, and the adhesive portions 8b at the tips of the pins 8 adhere to the upper substrate K1. The control device 100 then moves the adhesive pin plate 8a downward with the upper substrate K1 adhered to the adhesive pins 8, and separates the upper substrate K1 from the upper substrate surface 3a.
At this time, the control device 100 moves each adhesive pin plate 8a downward so that the amount of displacement of the adhesive pin plate 8a becomes the amount of displacement set for each adhesive pin plate 8a. The details of the amount of displacement of the adhesive pin plate 8a will be described later.

Furthermore, the control device 100 displaces (moves downward) the divided drive unit 31 corresponding to each adhesive pin plate 8a relative to the back plate 30 by the same displacement amount as the displacement amount set for that adhesive pin plate 8a.

The second step (STEP 2) is a lower substrate loading step.
When the lower substrate K2 is carried in between the upper table 3 and the lower table 4 by the transport device 200, the control device 100 moves the lifter 42 upward to receive the lower substrate K2. When the transport device 200 retreats, the control device 100 moves the lifter 42 downward to place the lower substrate K2 on the lower substrate surface 4a of the lower table 4. The control device 100 also drives the vacuum pump P3 to adsorb and hold the lower substrate K2 on the lower substrate surface 4a of the lower table 4.
Thereafter, the control device 100 drives the Z-axis drive mechanism 20 to move the upper frame 2 downward, and thereby move the upper chamber 5a and the upper table 3 downward. The upper chamber 5a and the lower chamber 5b engage with each other to close the vacuum chamber 5. Inside the vacuum chamber 5, the upper table 3, the lower table 4, the support pins 7, and the adhesive pins 8 are arranged.
When the vacuum chamber 5 is closed, the control device 100 drives the vacuum pump P0 to create a vacuum inside the vacuum chamber 5. Since the inside of the vacuum chamber 5 is created by driving the vacuum pump P0, the vacuum chamber 5 stores the upper table 3, the lower table 4, the support pins 7, and the adhesive pins 8 in a vacuum environment.
Before being carried into the substrate assembly apparatus 1 (between the upper table 3 and the lower table 4), the lower substrate K2 is coated with necessary substances such as a sealant, liquid crystal, spacers, and paste material in a separate process.

The third step (STEP 3) is a bonding position adjustment step.
In the bonding position adjusting step, the control device 100 adjusts the bonding position by driving the moving mechanism 41 to displace the lower table 4. The bonding position adjusting step will be described in detail later.

The fourth step (STEP 4) is a bonding step in which the upper substrate K1 and the lower substrate K2 are bonded together. The details of the bonding step will be described later.

The fifth step (STEP 5) is a carrying-out step.
In the carrying-out process, the control device 100 injects gas such as nitrogen gas into the vacuum chamber 5, which is in a vacuum state, to increase the pressure in the vacuum chamber 5 to atmospheric pressure. By increasing the pressure in the vacuum chamber 5 to atmospheric pressure, the upper substrate K1 and the lower substrate K2 are uniformly pressed (pressed) until the gap (cell gap) determined by the amount of spacer and liquid crystal previously applied to the substrate (lower substrate K2) is reached. The control device 100 drives the gas supplying means 8d to supply gas to the vacuum suction holes 8c. At this point, the adhesive pins 8 do not hold the upper substrate K1, so the gas supplied to the vacuum suction holes 8c is supplied into the vacuum chamber 5. The control device 100 measures the air pressure in the vacuum chamber 5 with an air pressure sensor (not shown), and stops the gas supplying means 8d when the air pressure in the vacuum chamber 5 increases to atmospheric pressure. Then, the control device 100 moves the upper frame 2 upward. This opens the vacuum chamber 5.
Thereafter, the bonded upper substrate K1 and lower substrate K2 are carried out of the substrate assembly apparatus 1 by the transport means 200.

In this embodiment, the board assembly device 1 mainly bonds the upper board K1 and the lower board K2 through the five steps (STEP 1 to STEP 5) shown in Figure 8.

The control device 100 adjusts the bonding position of the upper substrate K1 and the lower substrate K2 in the bonding position adjustment process (STEP 3) shown in FIG. 8. The bonding position adjustment process (STEP 3) in this embodiment will be described.

Figure 9 shows markings for adjusting the bonding position of the upper and lower substrates, where (a) shows an upper mark applied to the upper substrate, and (b) shows a lower mark applied to the lower substrate. Also, Figures 10 and 11 show the state of adjusting the misalignment between the upper mark on the upper substrate and the lower mark on the lower substrate, where (a) of Figure 10 shows the misalignment in the XY axis directions, and (b) shows the state after the misalignment in the XY axis directions has been adjusted. Also, (a) of Figure 11 shows the misalignment around the Z axis, and (b) shows the state after the misalignment around the Z axis has been adjusted.

The shapes of the markings (upper mark and lower mark) on the upper substrate K1 and the lower substrate K2 are not limited. For example, as shown in Fig. 9A, the upper mark is a first upper mark Mk1 in the form of a black square attached to a reference position on the upper substrate K1, and a second upper mark Mk1a in the form of a black square attached near the first upper mark Mk1. As shown in Fig. 9B, the lower mark is a first lower mark Mk2 in the form of a square frame attached to a reference position on the lower substrate K2, and a second lower mark Mk2a in the form of a square frame attached near the first lower mark Mk2.
The second upper mark Mk1a is a black square smaller than the first upper mark Mk1, and the second lower mark Mk2a is a square frame that is the same size as the first lower mark Mk2 or larger than the first lower mark Mk2.

The reference position of the upper substrate K1 where the first upper mark Mk1 is placed is set, for example, as the distance from the edge of the upper substrate K1. As an example, the first upper mark Mk1 is placed at a position a predetermined length away from the edge of the upper substrate K1. Similarly, the first lower mark Mk2 is placed at a position a predetermined length away from the edge of the lower substrate K2.

When the first upper mark Mk1 is a black square as shown in (a) of Figure 9 and the first lower mark Mk2 is a square frame shape as shown in (b) of Figure 9, the control device 100 (see Figure 1) determines that the misalignment between the upper substrate K1 and the lower substrate K2 is within a specified range when the first upper mark Mk1 (black square) is within the frame of the first lower mark Mk2 (square frame).
Incidentally, the alignment windows 4b of the lower table 4 shown in FIG. 7(a) are formed in correspondence with the reference positions of the upper substrate K1 and the lower substrate K2.

Furthermore, when the second upper mark Mk1a is a black square as shown in (a) of Figure 9 and the second lower mark Mk2a is a square frame shape as shown in (b) of Figure 9, the control device 100 (see Figure 1) determines that coarse adjustment of the position of the lower substrate K2 relative to the upper substrate K1 has been completed when the second upper mark Mk1a (black square) is within the frame of the second lower mark Mk2a (square frame).
The imaging window 4c of the lower table 4 shown in FIG. 7A is formed to correspond to the position of the second upper mark Mk1a to be attached to the upper substrate K1 and the second lower mark Mk2a to be attached to the lower substrate K2.

The control device 100 (see FIG. 1) adjusts the bonding position of the upper substrate K1 and the lower substrate K2 in two stages in the bonding position adjustment process shown in FIG.
In the bonding position adjustment process, the control device 100 first displaces the lower table 4 so that the second upper mark Mk1a is positioned within the frame of the second lower mark Mk2a. At this time, the control device 100 displaces the lower table 4 based on image data input from a second imaging device (not shown), and positions the two second upper marks Mk1a within the frames of the second lower marks Mk2a. When the two second upper marks Mk1a enter the frames of the second lower marks Mk2a, the control device 100 determines that the rough adjustment of the position of the lower substrate K2 relative to the upper substrate K1 is completed.

After the control device 100 (see FIG. 1) determines that the coarse adjustment of the position of the lower substrate K2 relative to the upper substrate K1 has been completed, if the first upper mark Mk1 (black square) of the upper substrate K1 is outside the frame of the first lower mark Mk2 (square frame) of the lower substrate K2, as shown in FIG. 10(a), the control device 100 determines that the misalignment between the upper substrate K1 and the lower substrate K2 is outside the specified range. The control device 100 then fine-tunes the position of the lower substrate K2 relative to the upper substrate K1.

The control device 100 (see FIG. 1) issues a command to the moving mechanism 41 (see FIG. 7(a)) of the lower table 4 to displace the lower table 4. The control device 100 issues a command to the moving mechanism 41 of the lower table 4 to move the lower table 4 (see FIG. 7(a)) in the X-axis direction (Dx) and the Y-axis direction (Dy). Then, as shown in FIG. 10(b), when all four first upper marks Mk1 are positioned within the frame of the first lower marks Mk2, the control device 100 determines that the upper marks (first upper marks Mk1) and the lower marks (first lower marks Mk2) are in a predetermined positional relationship and that the misalignment between the upper substrate K1 and the lower substrate K2 is within a specified range, and ends the fine adjustment.

Also, as shown in FIG. 11(a), if the first lower mark Mk2 is misaligned relative to the first upper mark Mk1 in a direction rotated around the Z axis, the control device 100 issues a command to the moving mechanism 41 (see FIG. 7(a)) of the lower table 4 to rotate the lower table 4 (see FIG. 7(a)) around the Z axis (Rz). Then, as shown in FIG. 11(b), when all four first upper marks Mk1 are positioned within the frame of the first lower marks Mk2, the control device 100 determines that the upper mark (first upper mark Mk1) and the lower mark (first lower mark Mk2) are in a predetermined positional relationship and that the misalignment between the upper substrate K1 and the lower substrate K2 is within a specified range, and ends the fine adjustment.

In this way, the control device 100 (see Figure 1) adjusts the bonding position of the upper substrate K1 and the lower substrate K2 by coarse adjustment based on the second upper mark Mk1a and the second lower mark Mk2a, and fine adjustment based on the first upper mark Mk1 and the first lower mark Mk2, in the bonding position adjustment process shown in Figure 8.
When the first upper mark Mk1 is positioned within the frame of the first lower mark Mk2, the control device 100 of this embodiment determines that the first upper mark Mk1 and the first lower mark Mk2 are in a predetermined positional relationship.

In addition, in the bonding position adjustment process, the control device 100 (see FIG. 1)
The image data input from the target mark Mk1 (see FIG. 7(b)) is image-processed to extract the positions and shapes of the first upper mark Mk1 and the first lower mark Mk2, and a command is given to the moving mechanism 41 (see FIG. 7(a)) to move the first upper mark Mk1 toward the frame of the first lower mark Mk2.
The control device 100 extracts the positions and shapes of the first upper mark Mk1 and the first lower mark Mk2 by image processing such as multi-value processing.

Figure 12 is a diagram showing a state in which the misalignment between the first upper mark and the first lower mark is within a specified range, where (a) is a diagram showing a state in which the first upper mark is at the center of the first lower mark, and (b) is a diagram showing a state in which the first upper mark is misaligned from the center of the first lower mark.
The control device 100 of this embodiment (see Figure 1) determines that the misalignment between the upper substrate K1 and the lower substrate K2 is within a specified range when the first upper mark Mk1 (black square) is positioned within the frame of the first lower mark Mk2 (square frame), as shown in (b) of Figure 10 and (b) of Figure 11.
The first upper mark Mk1 and the first lower mark Mk2 are provided at reference positions on the upper substrate K1 and the lower substrate K2, respectively. Therefore, as shown in FIG. 12A, when there is no dimensional difference (dimensional error) between the upper substrate K1 and the lower substrate K2, all four first upper marks Mk1 are configured to be positioned at the center of the first lower marks Mk2.

However, if an error (such as a dimensional error) occurs during production of the upper substrate K1 and the lower substrate K2, an error occurs in the reference positions of the upper substrate K1 and the lower substrate K2. If an error occurs in the reference positions of the upper substrate K1 and the lower substrate K2, all of the four first upper marks Mk1 will not be positioned at the center of the first lower marks Mk2. This state in which the first upper marks Mk1 are not positioned at the center of the first lower marks Mk2 is called a mark pitch misalignment (mark pitch misalignment between the upper substrate K1 and the lower substrate K2).
The control device 100 of this embodiment (see Figure 1) determines that the misalignment between the upper substrate K1 and the lower substrate K2 is within the specified range when all four first upper marks Mk1 are positioned within the frame of the first lower mark Mk2, even if all four first upper marks Mk1 are not at the center of the first lower mark Mk2, that is, even if a mark pitch misalignment occurs between the upper substrate K1 and the lower substrate K2, as shown in (b) of Figure 12.

However, when the upper substrate K1 and the lower substrate K2 are bonded together in this state, a slight misalignment occurs between the upper substrate K1 and the lower substrate K2.
Therefore, the control device 100 (see FIG. 1) of the substrate assembly apparatus 1 of this embodiment reduces the misalignment between the upper substrate K1 and the lower substrate K2 by changing the amount of downward displacement for each adhesive pin plate 8a when moving the adhesive pins 8 downward in the upper substrate carry-in step (STEP 1) shown in FIG. 8. This effectively corrects the mark pitch misalignment between the upper substrate K1 and the lower substrate K2.

Figure 13 is a diagram showing a state in which the misalignment between the upper substrate and the lower substrate is reduced by changing the displacement amount of the adhesive pin plate, where (a) is a diagram showing a state in which the first upper mark and the first lower mark are misaligned, and (b) is a diagram showing a state in which the misalignment between the first upper mark and the first lower mark has been reduced (a state in which the mark pitch misalignment between the upper substrate and the lower substrate has been corrected).
In addition, in (a) and (b) of FIG. 13, the position of the first lower mark Mk2 is indicated by a dashed line.

As shown in FIG. 13(a), when the displacement amounts of all adhesive pin plates 8a are equal, the protrusion amounts of all adhesive pins 8 are equal, so the upper substrate K1 adsorbed (held) by the adhesive pins 8 becomes flat. In other words, the upper substrate K1 is held by the adhesive pins 8 in a state parallel to the upper substrate surface 3a. At this time, if dimensional errors occur in the upper substrate K1 or the lower substrate K2 due to dimensional errors that occur during production, etc., the first upper mark Mk1 may be positioned offset from the center of the first lower mark Mk2. In other words, a mark pitch deviation may occur between the upper substrate K1 and the lower substrate K2.

For example, as shown in (b) of Figure 13, when the amount of displacement of the adhesive pin plate 8a becomes greater at the end side where the first upper mark Mk1 is attached, the center of the upper substrate K1 is closer to the upper table 3 than the end side and is held by the adhesive pin 8 in a slightly curved state.
When the upper substrate K1 is curved in this manner, the edge of the upper substrate K1 moves slightly toward the center, and the first upper mark Mk1 attached near the edge moves slightly toward the center. Therefore, the upper substrate K1 is held by the adhesive pins 8 with the first upper mark Mk1 approaching the center of the first lower mark Mk2.

In this way, when the upper substrate K1 is held by the adhesive pins 8 with the first upper mark Mk1 approaching the center of the first lower mark Mk2, fine adjustment in the bonding position adjustment process shown in FIG. 8 brings the first upper mark Mk1 precisely closer to the center of the first lower mark Mk2, as shown in FIG. 13(b). Then, the minute misalignment that occurs when the upper substrate K1 and the lower substrate K2 are bonded together is reduced, and the mark pitch misalignment between the upper substrate K1 and the lower substrate K2 is corrected, and the mark pitch misalignment is reduced.

Errors (such as dimensional errors) occurring during the production of the upper substrate K1 and the lower substrate K2 are approximated for the same production lot. In other words, the magnitude of deviation of the first upper mark Mk1 from the first lower mark Mk2 of the lower substrate K2 is approximated for each production lot of the upper substrate K1 and the lower substrate K2.
Therefore, when the displacement amount of the adhesive pin plate 8a is set for each production lot of the upper substrate K1 or the lower substrate K2, the first upper mark Mk1 can be brought closer to the center of the first lower mark Mk2 as long as the production lot does not change. Then, the control device 100 (see FIG. 1) may be configured to displace the adhesive pin plate 8a by the preset displacement amount.

For example, a manager of the board assembly apparatus 1 (see FIG. 1) sets the amount of displacement of the adhesive pin plates 8a for each production lot of the upper board K1 and the lower board K2. Since the board assembly apparatus 1 of this embodiment has nine adhesive pin plates 8a, the amount of displacement is set for each of the adhesive pin plates 8a.
When the displacement amount set in this manner is input to the control device 100 (see FIG. 1), the control device 100 displaces each adhesive pin plate 8a relative to the back plate 30 (see FIG. 3) by the set displacement amount in the upper substrate carry-in process (see FIG. 8). Each adhesive pin plate 8a moves downward by the set displacement amount.

Note that (b) of Figure 13 illustrates a state in which the displacement amount of the adhesive pin plate 8a located in the center is smaller than the displacement amount of the adhesive pin plate 8a located on the edge side, but it is also possible to make the displacement amount of the adhesive pin plate 8a located in the center larger than the displacement amount of the adhesive pin plate 8a located on the edge side.
In addition, while the amount of displacement of the adhesive pin plate 8a changes in the X-axis direction in FIG. 13B, it is also possible to change the amount of displacement of the adhesive pin plate 8a in the Y-axis direction.

The control device 100 (see FIG. 1) adjusts the bonding position of the upper substrate K1 and the lower substrate K2 in the bonding position adjustment step (STEP 3) shown in FIG. 8, and then performs the bonding step (STEP 4) shown in FIG. 8 to bond the upper substrate K1 and the lower substrate K2 together. The bonding step (STEP 4) in this embodiment will be described below.

FIG. 14A is a diagram showing a state in which the divided driving portions are displaced in accordance with the shape of the upper substrate, and FIG. 14B is a diagram showing a state in which the upper table presses the upper substrate and the lower substrate.
As described above, the control device 100 (see Figure 1) of this embodiment changes the amount of displacement of the adhesive pin plate 8a in the upper substrate loading process (STEP 1) shown in Figure 8, thereby slightly curving the upper substrate K1, as shown in (b) of Figure 13.

Then, the control device 100 (see FIG. 1) adjusts the bonding position in the bonding position adjusting step, and then executes the bonding step (STEP 4) shown in FIG.
In the bonding process, the control device 100 displaces each divided drive unit 31 by an amount of displacement corresponding to the amount of displacement of the adhesive pin plate 8a to which the adhesive pins 8 corresponding to the divided flat surface portions 31a of each divided drive unit 31 are attached. In this embodiment, the control device 100 displaces each divided drive unit 31 by an amount of displacement equal to the amount of displacement of the adhesive pin plate 8a to which the adhesive pins 8 corresponding to the divided flat surface portions 31a of each divided drive unit 31 are attached.

The control device 100 (see FIG. 1) controls the actuator 32 (see FIG. 3) to move the divided drive unit 31 downward and away from the back plate 30. At this time, the control device 100 moves the divided drive unit 31 downward by the same amount of displacement as the corresponding adhesive pin plate 8a. Therefore, as shown in FIG. 14(a), the adhesive pin plate 8a and the divided drive unit 31 corresponding to that adhesive pin plate 8a are displaced (moved downward) by the same amount. The divided drive unit 31 is displaced in response to the deformation of the upper substrate K1, and the upper substrate surface 3a of the upper table 3 is deformed into the shape of the upper substrate K1 held by the adhesive pins 8.

Thereafter, the control device 100 (see FIG. 1) drives the Z-axis drive mechanism 20 (see FIG. 1) to further move the upper frame 2 (see FIG. 1) downward, thereby moving the upper table 3 and the adhesive pin plate 8a (adhesive pins 8) downward as shown in FIG. 14(a). As a result, the upper substrate K1 held by the adhesive pins 8 and the lower substrate K2 held by the lower table 4 are bonded together as shown in FIG. 14(b).
As shown in (a) of Fig. 14, the control device 100 drives the Z-axis drive mechanism 20 (see Fig. 1) with the divided drive unit 31 displaced. The upper table 3 (back plate 30, divided drive unit 31) moves downward together with the upper frame 2 (see Fig. 1). Then, as shown in (b) of Fig. 14, the upper substrate K1 held by the adhesive pins 8 and the lower substrate K2 held by the lower table 4 are pressed by the upper table 3 (divided drive unit 31) and the lower table 4 to be bonded together. At this time, the divided drive unit 31 presses the upper substrate K1 and the lower substrate K2 in a displaced state.

As a result, the upper substrate K1 and the lower substrate K2 are bonded together in a state (shape) in which the first upper mark Mk1 of the upper substrate K1 is close to the center of the first lower mark Mk2 of the lower substrate K2. This suppresses deviation in the mark pitch between the upper substrate K1 and the lower substrate K2 during the bonding process, and reduces errors that occur when bonding the upper substrate K1 and the lower substrate K2 together.

In addition, in (a) and (b) of FIG. 14, the amount of deformation of the upper substrate K1 is exaggerated for ease of explanation. The actual amount of deformation of the upper substrate K1 is very small, and the amount of displacement of the divided drive unit 31 is also very small. Therefore, even if the upper substrate K1 and the lower substrate K2 are bonded together with the divided drive unit 31 in a displaced state (moved downward from the back plate 30), the amount of deformation of the upper substrate K1 is very small, and the upper substrate K1 and the lower substrate K2 are bonded together with high precision without creating any gaps, etc.

When the control device 100 detects that the upper substrate K1 and the lower substrate K2 have been bonded together based on a detection signal input from the load cell 20d (see FIG. 1), it drives the vertical movement mechanism 80 at that point to pull the adhesive pins 8 from the upper substrate surface 3a. At this time, the control device 100 stops the vacuum pump P2 (see FIG. 5) and drives the gas supply means 8d to supply gas to the vacuum suction holes 8c, causing the upper substrate K1 to peel off from the adhesive portion 8b. Then, the control device 100 drives the Z-axis drive mechanism 20 to further move the upper frame 2 downward, and the upper table 3 presses the upper substrate K1 and the lower substrate K2. When the control device 100 determines based on a detection signal input from the load cell 20d that a predetermined load has been generated between the upper table 3 and the lower table 4, it stops the downward movement of the upper frame 2.
The inside of the vacuum chamber 5 is a vacuum, and the upper substrate K1 and the lower substrate K2 are bonded together with a predetermined load in the vacuum environment inside the vacuum chamber 5. The pressure applied at this time appropriately presses the sealant that has been applied to the lower substrate K2 in advance, and the vacuum of the liquid crystal portion that is applied within the frame surrounded by the sealant is maintained.
Thereafter, the sealant is temporarily cured by ultraviolet light irradiated from a UV (ultraviolet) irradiation device (not shown) so that the positions of the upper substrate K1 and the lower substrate K2 are not misaligned.

As described above, the dimensional errors of the upper substrate K1 and the lower substrate K2 are approximated for the same production lot, and the displacement amount of the adhesive pin plate 8a is set for each production lot of the upper substrate K1 and the lower substrate K2. Therefore, while the production lots of the upper substrate K1 and the lower substrate K2 do not change, the divided drive unit 31 may be maintained in a state in which it is displaced by an amount equal to the displacement amount set for the adhesive pin plate 8a. For example, while the production lots of the upper substrate K1 and the lower substrate K2 do not change, the control device 100 (see FIG. 1) may be configured to maintain the divided drive unit 31 in a state in which it is displaced by an amount equal to the displacement amount of the adhesive pin plate 8a corresponding to each production lot.
With this configuration, as long as the production lots of the upper substrate K1 and the lower substrate K2 do not change, the control device 100 (see FIG. 1) does not need to displace the divided drive unit 31 every time the bonding process is performed.

As described above, the substrate assembly device 1 (see FIG. 1) of this embodiment can reduce minute deviations (mark pitch deviations) caused by dimensional errors that occur during the production of the upper substrate K1 and the lower substrate K2 by changing the amount of displacement of the adhesive pins 8 (see FIG. 5) for each adhesive pin plate 8a (see FIG. 5) when holding the brought-in upper substrate K1. Then, the mark pitch deviations of the upper substrate K1 and the lower substrate K2 can be corrected, and the mark pitch deviations are reduced.

In addition, in the substrate assembly device 1 of this embodiment, the split drive unit 31 (see FIG. 3) is displaced by the same amount of displacement as the adhesive pins 8 (see FIG. 5) that have been modified to correct the mark pitch deviation between the upper substrate K1 and the lower substrate K2. As a result, the shape of the upper substrate surface 3a (see FIG. 3) of the upper table 3 becomes equal to the shape of the upper substrate K1 held by the adhesive pins 8. Then, in the bonding process (see FIG. 8), the upper substrate K1 is pressed against the lower substrate K2 by the upper substrate surface 3a, which has the same shape, so that the upper substrate K1 and the lower substrate K2 are bonded together with high precision without any mark pitch deviation occurring in the bonding process.

It should be noted that the present invention is not limited to the above-described embodiment. For example, the above-described embodiment has been described in detail in order to easily explain the present invention, and the present invention is not necessarily limited to the embodiment having all of the configurations described.
It is also possible to replace part of the configuration of one embodiment with the configuration of another embodiment, and it is also possible to add the configuration of another embodiment to the configuration of one embodiment.

Furthermore, the present invention is not limited to the above-described embodiment, and appropriate design changes are possible without departing from the spirit of the invention.
Fig. 15 is a diagram showing an example of a design modification, (a) showing a state in which the displacement amounts of adhesive pins attached to one adhesive pin plate are different, (b) showing a configuration in which one divided drive unit corresponds to one adhesive pin. Also, Fig. 16 is a diagram showing another example of a design modification, (a) showing a state in which four divided drive units correspond to one adhesive pin plate, and (b) showing a state in which one divided drive unit corresponds to three adhesive pin plates.

As shown in Fig. 6, one adhesive pin plate 8a is driven by four vertical movement mechanisms 80. Also, as shown in Fig. 4, one divided drive unit 31 is supported by four rods 32a (actuators 32 shown in Fig. 3).
Therefore, it is possible to change the amount of movement of the four vertical movement mechanisms 80 in one adhesive pin plate 8a. Similarly, it is possible to change the amount of displacement of the rod 32a for each actuator 32 supporting one divided drive unit 31.

15A, it is possible to make the displacement amounts of the adhesive pins 8 attached to one adhesive pin plate 8a different. In this case, it is possible to deform (bend) the upper substrate K1 held by the adhesive pins 8 in various ways. Furthermore, it is also possible to displace the divided drive units 31 from the back plate 30 in accordance with the displacement amount of one adhesive pin 8.
15A, the divided drive section 31 can be appropriately displaced from the back plate 30 to tilt the divided flat section 31a relative to the back plate 30, so that the shape of the upper substrate surface 3a matches the shape of the upper substrate K1. This makes it possible to more effectively reduce minute deviations that occur when the upper substrate K1 and the lower substrate K2 are bonded together. As a result, the mark pitch deviation between the upper substrate K1 and the lower substrate K2 can be more effectively corrected.

Also, as shown in FIG. 15B, it is possible to configure one adhesive pin 8 with one vertical movement mechanism 80. That is, it is possible to configure one adhesive pin 8 attached to one adhesive pin plate 8a. Furthermore, it is also possible to configure one divided drive unit 31 corresponding to one adhesive pin 8 and one divided drive unit 31 with one actuator 32. In this configuration, it is possible to make the displacement amount different for each adhesive pin 8, and the upper substrate K1 held by the adhesive pin 8 can be deformed (curved) in a more diverse manner. Furthermore, the control device 100 (see FIG. 1) can displace each divided drive unit 31 according to the displacement amount of the adhesive pin 8, and can match the shape of the upper substrate surface 3a (see FIG. 5) of the upper table 3 to the shape of the upper substrate K1.
In this case, if a vacuum pump P2 (see FIG. 5) is connected to each of the adhesive pins 8, the upper substrate K1 can be vacuum-sucked by each of the adhesive pins 8.

In this embodiment, nine adhesive pin plates 8a are provided, but the number of adhesive pin plates 8a is not limited. The number of adhesive pin plates 8a can be changed appropriately depending on, for example, the number of adhesive pins 8. Furthermore, the shape of the adhesive pin plates 8a and the arrangement of the adhesive pins 8 on one adhesive pin plate 8a are not limited.
For example, the adhesive pins 8 may be arranged in a row on an elongated adhesive pin plate 8a extending in the X-axis direction (or the Y-axis direction).
Furthermore, the number of adhesive pins 8 provided on one adhesive pin plate 8a is not limited either, and a configuration in which a different number of adhesive pins 8 are provided on each adhesive pin plate 8a may be used.

In addition, in this embodiment, as shown in FIG. 6, one divided drive unit 31 corresponds to one adhesive pin plate 8a. This configuration is not limited to this, and as shown in FIG. 16(a), one adhesive pin plate 8a may correspond to multiple divided drive units 31 (four in the example of FIG. 16(a)). As shown in FIG. 16(b), one adhesive pin plate 8a may correspond to one divided drive unit 31 (three in the example of FIG. 16(b).

The shape of each divided drive unit 31 is not limited to a rectangle (square or rectangle). Although not shown, it may be an upper table 3 (see FIG. 1) that combines divided drive units in a frame shape with an opening in the center. In addition, the divided drive units (not shown) may be in various shapes, such as a triangle or trapezoid.

Furthermore, the drive mechanisms such as the Z-axis drive mechanism 20 (see FIG. 1) that moves the upper frame 2 up and down, the up and down movement mechanism 80 (see FIG. 5) that drives the adhesive pin plate 8a, the movement mechanism 41 (see FIG. 7(a)) that drives the lower table 4, and the actuator 32 (see FIG. 3) are not limited to ball screw mechanisms. All or part of these drive mechanisms may be configured with other mechanisms such as air cylinders or linear motors.

The upper substrate K1 (see FIG. 1) and the lower substrate K2 (see FIG. 1) to be bonded by the substrate assembly device 1 (see FIG. 1) are mainly glass substrates, and are prone to errors due to changes in the ambient temperature. For example, in order to reduce errors that occur in the upper substrate K1 and the lower substrate K2 due to temperature changes when the inside of the vacuum chamber 5 (see FIG. 1) is evacuated, a heating device (heater) may be provided that heats the upper table 3 (see FIG. 1) and the lower table 4 (see FIG. 1) to suppress the temperature drop of the upper substrate K1 and the lower substrate K2. Conversely, a Peltier element or the like may be used to suppress the temperature rise of the upper substrate K1 and the lower substrate K2. With such a configuration, errors that occur in the upper substrate K1 and the lower substrate K2 due to temperature changes are reduced, and the bonding accuracy of the upper substrate K1 and the lower substrate K2 is improved. Furthermore, the occurrence of mark pitch deviations of the upper substrate K1 and the lower substrate K2 due to temperature changes can be effectively reduced.

Figure 17 is a diagram showing yet another design modification example, in which (a) shows a design modification example in which all adhesive pins are attached to a single adhesive pin plate, and (b) shows a design modification example in which an upper table with an integrated structure is provided.
As shown in Fig. 6, the board assembly apparatus 1 (see Fig. 1) of this embodiment has nine adhesive pin plates 8a. Nine adhesive pins 8 are attached to one adhesive pin plate 8a. The present invention is not limited to this configuration, and may be configured such that all adhesive pins 8 are attached to one adhesive pin plate 8a, as shown in Fig. 17(a), for example.

As shown in FIG. 17A, the vertical movement mechanisms 80 may be provided at the four corners of a rectangular adhesive pin plate 8a.
With this configuration, it is possible to set the displacement amount of the adhesive pins 8 to different amounts by changing the operation amount of the four vertical movement mechanisms 80. Furthermore, each divided drive unit 31 can be displaced from the back plate 30 (see FIG. 3) in accordance with the displacement amount of the adhesive pins 8, and in this state, the upper substrate K1 (see FIG. 1) and the lower substrate K2 (see FIG. 1) can be bonded together.

As shown in FIG. 4, the upper table 3 of the substrate assembly device 1 (see FIG. 1) of this embodiment is provided with nine divided drive units 31. This configuration is not limited to this, and the upper table 3 may be an integral structure as shown in FIG. 17(b). In other words, the upper table 3 may not be provided with the divided drive units 31, and may be made of a single steel plate or the like. In this case, if the rods 32a of the actuator 32 (see FIG. 3) are attached to the four corners of the rectangular upper table 3, the upper table 3 can be appropriately tilted by changing the displacement amount of the four rods 32a. Therefore, the upper table 3 can be appropriately tilted according to the displacement amount of the adhesive pin 8, and the upper substrate K1 (see FIG. 1) and the lower substrate K2 (see FIG. 1) can be bonded together in this state.

REFERENCE SIGNS LIST 1 Substrate assembly device 3 Upper table 3a Upper substrate surface 4 Lower table 4a Lower substrate surface 5 Vacuum chamber 5a Upper chamber 5b Lower chamber 8 Adhesive pin 8a Adhesive pin plate (base portion)
8b Adhesive portion 8c Vacuum suction hole 8d Gas supply means 10 Imaging device 20 Z-axis driving mechanism (first driving mechanism)
31 Divided driving portion 31a Divided flat portion 32 Actuator (third driving mechanism)
41 Movement mechanism 43 Suction hole 80 Up-down movement mechanism (second drive mechanism)
100 Control device K1 Upper substrate K2 Lower substrate Mk1 First upper mark (upper mark)
Mk2 1st lower mark (lower mark)
P2 Vacuum pump (first suction means)
P3 Vacuum pump (second suction means)

Claims (4)

a lower table having a lower substrate surface for holding a lower substrate;
an upper table having an upper substrate surface facing the lower substrate surface and supporting an upper substrate;
a substrate assembly apparatus for bonding the lower substrate held on the lower table and the upper substrate held on the upper table in a vacuum environment,
a moving mechanism for displacing and rotating the lower table along the lower substrate surface;
an imaging device for imaging a correspondence between an upper mark, which is affixed to the upper substrate and has a coarse adjustment mark and a fine adjustment mark, and a lower mark, which is affixed to the lower substrate and corresponds to the upper mark, and has a coarse adjustment mark and a fine adjustment mark;
a control device that performs image processing on image data input from the imaging device, displaces and rotates the moving mechanism so that the coarse adjustment marks on the upper substrate and the lower substrate have a predetermined positional relationship, and subsequently displaces and rotates the moving mechanism so that the fine adjustment marks on the upper substrate and the lower substrate have a predetermined positional relationship ;
A plurality of divided planar portions forming the upper table;
a division drive unit that drives each of the plurality of division planar portions independently of one another;
one or more adhesive pins arranged corresponding to each of the plurality of division plane portions and displacing in a direction perpendicular to the corresponding division plane portion to hold the upper substrate;
a substrate assembly device having an adhesive pin displacement drive means for driving the one or more adhesive pins arranged corresponding to each of the plurality of divided planar portions to be displaced in a direction perpendicular to the divided planar portion independently of each other for each of the divided planar portions . The substrate assembly device according to claim 1, characterized in that the coarse adjustment mark and fine adjustment mark of one of the upper and lower marks are in the shape of a black square, and the coarse adjustment mark and fine adjustment mark of the other mark are in the shape of a square frame, and the square frame is sized within a specified range that allows for misalignment of the black square. The substrate assembly device according to claim 1, characterized in that the coarse adjustment mark and the fine adjustment mark of the upper mark are in the shape of a black square, and the coarse adjustment mark and the fine adjustment mark of the lower mark are in the shape of a rectangular frame, and the rectangular frame has a size within a specified range that allows for misalignment of the black square. 4. The substrate assembly apparatus according to claim 1, wherein the lower substrate and the upper substrate are rectangular, the coarse adjustment marks are arranged at four corners of the upper substrate and the lower substrate, and the fine adjustment marks are arranged in the vicinity of the coarse adjustment marks that are diagonally opposite each other on the upper substrate and the lower substrate.