JP7044228B2 - Board assembly equipment - Google Patents

Description

The present invention relates to a substrate assembly apparatus .

In Patent Document 1, "In the present invention, the contact / detachment drive unit and the attachment / detachment drive unit are operated and controlled by the control unit, and one or both of the first holding member and the adhesive pin are secondly held in a reduced pressure atmosphere. The first work and the second work are bonded to each other by moving them relatively close to the member. After this bonding, the rigid contact surface of the first holding member is in contact with the first work and is adhered. By moving the pin in a direction away from the first work, the peripheral part of the portion of the first work that is adhesively held by the adhesive pin comes into contact with the rigid contact surface and makes a rigid contact as the adhesive pin is peeled off. The shape is maintained along the surface. Therefore, the deformation of the first work can be minimized when the first work is pressurized by the first holding member and when the adhesive pin is peeled off from the first work. "(See paragraph 0007).

Japanese Patent No. 5654155

The work bonding device (board assembly device) described in Patent Document 1 is a bonding device in which a first work (upper board) and a second work (lower board) are bonded from a first holding member (upper table). It is configured to suppress deformation of the first work when it is removed.
However, in order to accurately bond the first work and the second work, it is necessary to align the first work and the second work before bonding.

Patent Document 1 states that "immediately before the first work W1 and the second work W2 are bonded together, either one of the first holding member 1 or the second holding member 2 is adjusted and moved in the XYθ direction with respect to the other. , It is preferable to align the first work W1 and the second work W2 (see paragraph 0020), but the specific method of alignment is not described.
Further, in the adjustment movement in the XYθ direction, the positional deviation between the first work and the second work can be adjusted, but the bonding error (pitch deviation) caused by the dimensional error generated during production or the like cannot be eliminated.

An object of the present invention is to provide a substrate assembly apparatus capable of accurately bonding an upper substrate and a lower substrate by eliminating a bonding error caused by a dimensional error between the upper substrate and the lower substrate.

In order to solve the above problems, the present invention includes a lower table having a lower substrate surface for holding the lower substrate, and an upper table having an upper substrate surface facing the lower substrate surface and holding the upper substrate on the upper substrate surface. In a substrate assembly device that has A plurality of adhesive pins for holding a substrate, a plurality of adhesive pin plates each provided with one or more of the adhesive pins, and each of the adhesive pin plates are independently displaced from each other in a direction perpendicular to the upper table. The upper substrate is curved by displacement-driving each of the plurality of adhesive pin plates according to the pressure-sensitive adhesive pin displacement driving means and the amount of deformation for keeping the displacement between the lower substrate and the upper substrate within a specified range. The substrate assembly apparatus is provided with a control means for controlling the adhesive pin displacement driving means so as to correct the deviation between the upper substrate and the lower substrate within a specified range.

According to the present invention, it is possible to provide a substrate assembly apparatus capable of accurately bonding an upper board and a lower board by eliminating a bonding error caused by a dimensional error between the upper board and the lower board. As a result, the mark pitch deviation caused by the dimensional error between the upper substrate and the lower substrate can be effectively corrected and bonded.

It is a figure which shows the board assembly apparatus. It is a figure which shows the support pin. It is a figure which shows the structure of the upper table. It is a figure which shows the upper substrate surface of the upper table. It is a figure which shows the adhesive pin. It is a figure which shows the upper substrate surface of an upper table, and is the figure which shows an example of the arrangement of adhesive pins. (A) is a diagram showing a lower table, and (b) is a sectional view taken along line Sec1-Sec1. It is a figure which shows the process of bonding the substrate by the substrate assembly apparatus. It is a figure which shows the marking for adjusting the bonding position of the upper substrate and the lower substrate, (a) is the figure which shows the upper mark attached to the upper substrate, (b) is the figure which shows the lower mark attached to the lower substrate. It is a figure which shows. It is a figure which shows the state which adjusts the deviation of the upper mark of the upper substrate and the lower mark of a lower substrate, (a) is a figure which shows the deviation in the XY axis direction, (b) is the figure which adjusted the deviation in the XY axis direction. It is a figure which shows the state. It is a figure which shows the state which adjusts the deviation of the upper mark of the upper substrate and the lower mark of a lower substrate, (a) is a figure which shows the deviation around the Z axis, (b) is the figure which adjusted the deviation around the Z axis. It is a figure which shows the state. It is a figure which shows the state which the deviation of the 1st upper mark and the 1st lower mark is within a specified range, (a) is a figure which shows the state which the 1st upper mark is in the center of the 1st lower mark, (b) is a figure which shows the state. It is a figure which shows the state which the 1st upper mark deviated from the center of the 1st lower mark. It is a figure which shows the state which reduces the displacement of the upper substrate and the lower substrate by changing the displacement amount of an adhesive pin plate, (a) is the figure which shows the state which the 1st upper mark and the 1st lower mark are displaced, (b). ) Is a diagram showing a state in which the displacement between the first upper mark and the first lower mark is reduced (a state in which the mark pitch deviation between the upper substrate and the lower substrate is corrected). (A) is a diagram showing a state in which the split drive unit is displaced according to the shape of the upper substrate, and (b) is a diagram showing a state in which the upper table presses the upper substrate and the lower substrate. It is a figure which shows the design change example, (a) is a figure which shows the state which the displacement amount of the adhesive pin attached to one adhesive pin plate is different, (b) is one split drive part in one adhesive pin. It is a figure which shows the corresponding structure. It is a figure which shows another design change example, (a) is a figure which shows the state which four division drive parts correspond to one adhesive pin plate, (b) is one division into three adhesive pin plates. It is a figure which shows the state which the drive part corresponds. It is a figure which shows the further design change example, (a) is the figure which shows the design change example which all adhesive pins are attached to one adhesive pin plate, (b) is provided with the upper table of an integral structure. It is a figure which shows the design change example.

Hereinafter, the substrate assembly apparatus according to the embodiment of the present invention will be described in detail with reference to the drawings as appropriate. In each of the drawings shown below, the same reference numerals are given to common members, and duplicate description will be omitted as appropriate.

FIG. 1 is a diagram showing a board assembly device.
The substrate assembly device 1 is an apparatus for assembling a substrate such as a liquid crystal panel by laminating an upper substrate K1 (glass substrate) and a lower substrate K2 (glass substrate) carried by a transfer device 200 such as a robot hand in a vacuum. The board assembly device 1 is controlled by the control device 100.
The board assembly device 1 has a gantry 1a and an upper frame 2. The gantry 1a is placed on an installation surface (floor surface or the like). The upper frame 2 is provided so as to be vertically movable above the gantry 1a.
The upper frame 2 is attached to a first drive mechanism (Z-axis drive mechanism 20) attached to the gantry 1a via a load cell 20d.

The board assembly device 1 includes an upper table 3 and a lower table 4. The lower table 4 is attached to the gantry 1a via a moving unit (XYθ moving unit 40). The XYθ moving unit 40 is configured to be independently movable in two axes (X-axis and Y-axis) orthogonal to each other with respect to the gantry 1a. Further, the XYθ moving unit 40 is configured to be rotatable around the Z axis with respect to the gantry 1a. As the XYθ moving unit 40, a unit using a ball bear or the like that is fixed in the Z-axis direction and can freely move in the XY-axis direction can be used.

In the board assembly device 1 of this embodiment, the direction of the upper frame 2 with respect to the gantry 1a is the Z-axis direction (vertical direction). Further, the direction of one axis orthogonal to the Z axis is defined as the X axis direction (horizontal direction), and the direction of one axis orthogonal to the Z axis and the X axis is defined as the Y axis direction (vertical direction).
Further, the upper table 3 and the lower table 4 are rectangular with the Y-axis direction and the X-axis direction as the vertical and horizontal directions. The plane of the upper table 3 (upper substrate surface 3a) and the plane of the lower table 4 (lower substrate surface 4a) face each other.

The upper frame 2 is attached to the gantry 1a via the Z-axis drive mechanism 20. The Z-axis drive mechanism 20 has a ball screw mechanism 20b that moves the ball screw shaft 20a extending in the Z-axis direction (vertical direction) up and down. The ball screw shaft 20a is rotated by the electric motor 20c and moved up and down by the ball screw mechanism 20b.
The electric motor 20c is controlled by the control device 100, and the upper frame 2 is displaced (moved up and down) based on the calculation of the control device 100.

The upper table 3 is fixed to the upper frame 2 via a plurality of upper shafts 2a, and the upper frame 2 and the upper table 3 move up and down integrally. An upper chamber 5a is arranged around the upper table 3. The upper chamber 5a is arranged so as to open below (the side of the gantry 1a) and cover the upper side and the side of the upper table 3.

The upper chamber 5a is attached to the upper frame 2 via the hanging mechanism 6. The suspension mechanism 6 has a support shaft 6a extending downward from the upper frame 2 and a locking portion 6b formed by spreading the lower end portion of the support shaft 6a in a flange shape.
Further, the upper chamber 5a is provided with a hook 6c. The hook 6c freely moves up and down around the support shaft 6a. Further, the hook 6c engages with the locking portion 6b at the lower end of the support shaft 6a.
The upper shaft 2a penetrates the upper chamber 5. The upper shaft 2a and the upper chamber 5 are sealed with a vacuum seal (not shown).

When the upper frame 2 moves upward (moves upward), the hook 6c engages with the locking portion 6b of the support shaft 6a, and the upper chamber 5a moves upward together with the upper frame 2. Further, when the upper frame 2 moves downward (moves downward), the hook 6c moves downward due to its own weight, and the upper chamber 5a moves downward accordingly.

Further, a lower chamber 5b is arranged around the lower table 4. The lower chamber 5b is supported by a plurality of lower shafts 1b attached to the gantry 1a. The lower shaft 1b projects into the lower chamber 5b. A vacuum seal (not shown) seals between the lower chamber 5b and the lower shaft 1b.
The lower chamber 5b is arranged so as to open upward (on the side of the upper frame 2) and cover the lower side and the side of the lower table 4.

The XYθ moving unit 40 is attached to the lower shaft 1b protruding into the lower chamber 5b to support the lower table 4.

The upper chamber 5a and the lower chamber 5b are combined with each other to form a vacuum chamber 5. That is, the lower chamber 5a is configured to engage with the lower chamber 5b from above, and the opening of the lower chamber 5b is closed by the upper chamber 5a. The connection portion between the upper chamber 5a and the lower chamber 5b is sealed with a seal ring (not shown) to ensure the airtightness of the vacuum chamber 5.

Further, the upper frame 2 can move further downward than in a state where the upper chamber 5a is in contact with the lower chamber 5b. As a result, the upper frame 2 moves downward from the state in which the lower movement of the upper chamber 5a is restricted by the lower chamber 5b, and the engagement between the locking portion 6b and the hook 6c in the suspension mechanism 6 is eliminated. The upper chamber 5a is placed on the lower chamber 5b by its own weight. Then, the upper table 3 and the lower table 4 are arranged inside the vacuum chamber 5.

The board assembly device 1 is provided with a vacuum pump P0. The vacuum pump P0 is connected to the vacuum chamber 5 and exhausts the air in the vacuum chamber 5 to evacuate the inside of the vacuum chamber 5. That is, when the vacuum pump P0 is driven, the inside of the vacuum chamber 5 becomes a vacuum environment. The vacuum pump P0 is controlled by the control device 100.

The upper table 3 moves downward together with the upper frame 2 that moves downward inside the vacuum chamber 5. By such a downward movement of the upper table 3, the upper substrate K1 held by the upper table 3 and the lower substrate K2 held by the lower table 4 are bonded and pressed. If the inside of the vacuum chamber 5 is in a vacuum state, the upper substrate K1 and the lower substrate K2 are bonded together in a vacuum.
Further, as described above, the upper table 3 is fixed to the upper frame 2 via the plurality of upper shafts 2a. Therefore, the load when the upper substrate K1 and the lower substrate K2 are pressurized by the upper table 3 is detected in the load cell 20d. The detection signal of the load cell 20d is input to the control device 100.

FIG. 2 is a diagram showing support pins.
As shown in FIG. 2, the upper frame 2 is provided with a plurality of support pins 7. The support pin 7 is a tubular member extending in the vertical direction, and is provided so as to be movable up and down independently of the upper table 3. All support pins 7 are attached to one support base 7a, and all support pins 7 move up and down at the same time. The support base 7a is arranged between the upper chamber 5a and the upper table 3. The support base 7a moves up and down by a vertical movement mechanism (ball screw mechanism, etc.) (not shown). This vertical movement mechanism is controlled by the control device 100.

The support pin 7 is arranged above the upper substrate surface 3a of the upper table 3 and is arranged above the upper table 3.
When it moves downward with respect to the above, it protrudes downward from the upper substrate surface 3a.

Further, the support pin 7 has a hollow tubular shape, and the hollow portion 7a1 communicates with the hollow portion 7a1 of the support base 7a. A vacuum pump P1 is connected to the hollow portion 7a1 of the support base 7a. When the vacuum pump P1 is driven, the hollow portion 7a1 becomes a vacuum, and the upper substrate K1 is evacuated to the support pin 7. The vacuum pump P1 is controlled by the control device 100. That is, the vacuum pump P1 is driven according to the command of the control device 100, and the upper substrate K1 is vacuum-sucked to the support pin 7.

FIG. 3 is a diagram showing the structure of the upper table. FIG. 4 is a diagram showing the upper substrate surface of the upper table.
As shown in FIG. 3, the upper table 3 has a back plate 30 and a split drive unit 31.
The back plate 30 is attached to the upper shaft 2a and moves up and down integrally with the upper frame 2. The back plate 30 is a plate-shaped member arranged in parallel with the lower substrate surface 4a (see FIG. 1) of the lower table 4. Further, the back plate 30 faces the lower substrate surface 4a.

The division drive unit 31 divides the upper substrate surface 3a. In other words, the upper substrate surface 3a is formed by the flat surface portion (divided flat surface portion 31a) formed in the split driving portion 31 so as to face the lower substrate surface 4a (see FIG. 1) of the lower table 4. The split drive unit 31 is arranged so that the split flat surface portion 31a is on the side of the lower substrate surface 4a. As shown in FIG. 4, in this embodiment, the upper substrate surface 3a is divided into nine pieces. That is, the upper table 3 is composed of nine divided drive units 31. Further, the upper substrate surface 3a is divided into nine divided plane portions 31a.

As shown in FIG. 3, an actuator 32 (third drive mechanism) is attached to the back plate 30. The actuator 32 displaces (moves up and down) the split drive unit 31 with respect to the back plate 30. The actuator 32 has a rod 32a extending in a direction (vertical direction) orthogonal to the back plate 30. The actuator 32 has, for example, a built-in electric motor (not shown), and the rod 32a is displaced in the axial direction (vertical direction) by a ball screw mechanism. The actuator 32 is controlled by the control device 100 (see FIG. 1).

The split drive unit 31 is attached to the rod 32a of the actuator 32.
For example, as shown in FIG. 4, the rod 32a is attached to the four corners (or the vicinity of the four corners) of the rectangular split drive unit 31. Further, a bearing (not shown) is interposed between the rod 32a and the split drive unit 31, and the rod 32a is rotatably attached to the split drive unit 31.

When the rod 32a is moved up and down by the actuator 32, the split drive unit 31 is displaced (moved up and down) in the direction perpendicular to the back plate 30 according to the displacement of the rod 32a. Each split drive unit 31 can move up and down independently without interfering with each other.
Further, since the back plate 30 faces the lower substrate surface 4a (see FIG. 1), the actuator 32 displaces (moves up and down) the split drive unit 31 in the direction perpendicular to the lower substrate surface 4a. In other words, the actuator 32 displaces the split drive unit 31 toward the lower substrate surface 4a.

As described above, the substrate assembly device 1 of the present embodiment has nine split drive units 31 capable of independently moving up and down. The upper substrate surface 3a formed by the divided flat surface portion 31a of each divided drive unit 31 is deformable.

FIG. 5 is a diagram showing an adhesive pin.
As shown in FIG. 5, the upper frame 2 is provided with a plurality of adhesive pins 8. The adhesive pin 8 is a tubular member extending in the vertical direction, and is provided with a vertical movement independent of the upper table 3 and the support pin 7. The vertical movement of the adhesive pin 8 is a vertical movement with respect to the upper substrate surface 3a.
The adhesive pin 8 is arranged above the upper substrate surface 3a and protrudes downward from the upper substrate surface 3a when it moves downward with respect to the upper table 3. Further, the adhesive pin 8 moves upward and is pulled in from the upper substrate surface 3a. In this embodiment, the adhesive pin 8 does not protrude from the upper substrate surface 3a (divided flat surface portion 31a shown in FIG. 3), that is, the adhesive pin 8 has a protruding amount of zero (or less). It is assumed that 8 is pulled in from the upper substrate surface 3a. Then, the adhesive pin 8 moves downward and protrudes from the upper substrate surface 3a. The amount of protrusion of the adhesive pin 8 indicates the amount of protrusion of the adhesive pin 8 from the upper substrate surface 3a (divided flat surface portion 31a) (hereinafter, the same applies).

The adhesive pin 8 is attached to a plurality of adhesive pin plates 8a (base portions). One or more adhesive pins 8 are attached to the adhesive pin plate 8a. Each adhesive pin plate 8a can move up and down independently of each other (perpendicular movement with respect to the upper substrate surface 3a).

The adhesive pin 8 has an adhesive portion 8b at the tip thereof.
Further, the adhesive pin 8 has a hollow tubular shape, and a vacuum suction hole 8c is opened in the center. The vacuum suction hole 8c communicates with the negative pressure chamber 8a1 formed as a hollow portion of the adhesive pin plate 8a. A first suction means (vacuum pump P2) is connected to the negative pressure chamber 8a1 of the adhesive pin plate 8a. Therefore, the first suction means (vacuum pump P2) is connected to the vacuum suction hole 8c of the adhesive pin 8 via the negative pressure chamber 8a1.

The adhesive pin 8 sucks the upper substrate K1 in a vacuum when the vacuum pump P2 is driven and the vacuum suction hole 8c is in a vacuum state, and further, the vacuum sucked upper substrate K1 is attached to the adhesive portion 8b and held. (Retains adhesiveness). The adhesive pin 8 holds the upper substrate K1 when it is in a state of protruding from the upper substrate surface 3a.
The vacuum pump P2 is controlled by the control device 100. The upper substrate K1 is vacuum-sucked by the adhesive pin 8 and attached to the adhesive portion 8b in response to a command from the control device 100.

The gas supply means 8d is connected to the negative pressure chamber 8a1 of the adhesive pin plate 8a. The gas supply means 8d is controlled by the control device 100. The gas supply means 8d is driven in response to a command from the control device 100 to supply a predetermined gas (air, nitrogen gas, etc.) to the negative pressure chamber 8a1. The negative pressure chamber 8a1 and the vacuum suction hole 8c are boosted by the gas supplied from the gas supply means 8d, and the upper substrate K1 attached to the adhesive portion 8b is peeled off from the adhesive portion 8b.

Each adhesive pin plate 8a is provided with a second drive mechanism (vertical movement mechanism 80). The vertical movement mechanism 80 is moved up and down by a ball screw shaft 81 rotatably supported by the mounting portion 80a and extended in the Z-axis direction, an electric motor 83 for rotating the ball screw shaft 81, and a rotating ball screw shaft 81. It has a moving ball screw mechanism 82 and. The mounting portion 80a is fixed to the upper frame 2. The ball screw shaft 81 is rotated by the electric motor 83 to move the ball screw mechanism 82 up and down. Then, the ball screw mechanism 82 is attached to the adhesive pin plate 8a. The adhesive pin plate 8a moves up and down integrally with the ball screw mechanism 82 that moves up and down by the rotation of the ball screw shaft 81.
The vertical movement mechanism 80 is controlled by the control device 100, and the adhesive pin plate 8a and the adhesive pin 8 move up and down in response to a command from the control device 100.

The mounting portion 80a is mounted on the upper frame 2 and moves up and down integrally with the upper frame 2. Further, as described above, the upper table 3 moves up and down integrally with the upper frame 2. The upper frame 2 moves up and down by the Z-axis drive mechanism 20 (see FIG. 1), and when the upper frame 2 moves downward, the upper table 3 and the mounting portion 80a advance toward the lower table 4 (see FIG. 1). The vertical movement mechanism 80 is attached to the mounting portion 80a, and the adhesive pin plate 8a (adhesive pin 8) moves up and down according to the vertical movement of the mounting portion 80a. Therefore, the Z-axis drive mechanism 20 (first drive mechanism) has a function of advancing the adhesive pin 8 and the upper table 3 toward the lower table 4.

FIG. 6 is a diagram showing an upper substrate surface of the upper table, and is a diagram showing an example of arrangement of adhesive pins.
As an example, as shown in FIG. 6, in the present embodiment in which the upper table 3 is provided with 81 adhesive pins 8, nine adhesive pins 8 are attached to one adhesive pin plate 8a. The substrate assembly device 1 (see FIG. 1) of this embodiment has nine adhesive pin plates 8a.
Further, in the present embodiment, one adhesive pin plate 8a is correspondingly arranged in one divided drive unit 31. For example, nine adhesive pins 8 are arranged corresponding to the divided flat surface portion 31a of one divided drive unit 31. The nine adhesive pins 8 arranged in one divided drive unit 31 (divided flat surface portion 31a) are attached to one adhesive pin plate 8a provided corresponding to the divided drive unit 31.

Further, one adhesive pin plate 8a is provided with four vertical movement mechanisms 80. For example, the vertical movement mechanism 80 is provided at four corners of the adhesive pin plate 8a having a rectangular shape. The nine adhesive pin plates 8a can be moved up and down independently of each other by the vertical movement mechanism 80.
The adhesive pin plate 8a is provided without interfering with the split drive unit 31, and can move up and down independently of the split drive unit 31. As a result, the adhesive pin 8 attached to one adhesive pin plate 8a can be displaced in the direction perpendicular to the corresponding split flat surface portion 31a.

As described above, the vertical movement mechanism 80 (second drive mechanism) of the present embodiment can independently move a plurality of (9 pieces) adhesive pin plates 8a up and down (perpendicular operation with respect to the upper substrate surface 3a). It is configured in.
Then, the vertical movement mechanism 80 can displace the adhesive pin plate 8a by a displacement amount set for each adhesive pin plate 8a. As a result, the adhesive pin 8 can hold the upper substrate K1 (see FIG. 1) in a state of being displaced together with the adhesive pin plate 8a by a displacement amount set for each adhesive pin plate 8a.

FIG. 7A is a view showing a lower table, and FIG. 7B is a cross-sectional view taken along the line of Sec1-Sec1.
As shown in FIG. 7A, the lower table 4 is housed inside a lower chamber 5b with an open upper part. The lower table 4 is surrounded by the lower chamber 5b on the lower side and the side surface. Between the lower table 4 and the lower chamber 5b, gaps Gx and Gy are formed in the horizontal direction (X-axis direction) and the vertical direction (Y-axis direction), respectively. Further, the lower part of the lower table 4 is supported by a plurality of XYθ moving units 40. Although the lower table 4 supported by the nine XYθ moving units 40 is shown in FIG. 7A, the number of the XYθ moving units 40 supporting the lower table 4 is not limited.

The XYθ moving unit 40 supports the lower table 4 so as to be freely displaceable in the X-axis direction and the Y-axis direction. With such a structure, the lower table 4 is provided so as to be freely displaceable in the X-axis direction and the Y-axis direction with respect to the lower chamber 5b.
Further, a moving mechanism 41 is attached to the lower table 4. The moving mechanism 41 has a shaft portion 41b connected to the end side of the lower table 4 and a drive portion 41a that displaces the shaft portion 41b in the axial direction. The drive unit 41a displaces the shaft unit 41b in the axial direction by, for example, a ball screw mechanism.

As shown in FIG. 7A, three moving mechanisms 41 are connected to the lower table 4. In one moving mechanism 41, the shaft portion 41b is extended in the X-axis direction, and in the two moving mechanisms 41, the shaft portion 41b is extended in the Y-axis direction.
The shaft portion 41b extending in the X-axis direction is connected to the vicinity of the central portion of the end side of the lower table 4. The lower table 4 is displaced in the X-axis direction (lateral direction) due to the displacement of the shaft portion 41b extending in the X-axis direction.

Further, the two shaft portions 41b extending in the Y-axis direction are connected to each other in the lower table 4 in the vicinity of the end portion of the end side on the same side. When the displacement amounts of the two shaft portions 41b extending in the Y-axis direction are equal, the lower table 4 is displaced in the Y-axis direction (vertical direction). When the displacement amounts of the two shaft portions 41b extending in the Y-axis direction are different, in the lower table 4, one of the large displacement amounts of the shaft portions 41b is displaced in the Y-axis direction more than the one with the smaller displacement amount. Therefore, it rotates around the Z axis.
In this way, the lower table 4 to which the three moving mechanisms 41 are connected can be displaced in the X-axis direction (horizontal direction), displaced in the Y-axis direction (vertical direction), and rotated around the Z axis. It has become.

The three moving mechanisms 41 are controlled by the control device 100. The control device 100 gives a command to the three moving mechanisms 41 to appropriately displace the shaft portion 41b and displace the lower table 4.

Further, the lower table 4 is provided with a lifter 42. The lifter 42 is extended so as to cross the lower table 42 in the X-axis direction, for example. The lifter 42 is an elevating device 42a such as a ball screw mechanism, and moves up and down as shown by a black arrow in FIG. 7B. The elevating device 42a is controlled by the control device 100. The control device 100 drives the lifter 42 when the lower substrate K2 (see FIG. 1) is conveyed by the conveying device 200 (see FIG. 1), and the lower substrate K2 is placed on the lower table 4.

Further, alignment windows 4b are formed at the four corners of the lower table 4 having a rectangular shape. As shown in FIG. 7B, the alignment window 4b is a through hole penetrating the flat surface (lower substrate surface 4a) of the lower table 4. The image pickup unit accommodating cylinder 10a enters the alignment window 4b from below. The image pickup unit accommodating cylinder 10a is formed by the lower surface of the lower chamber 5b rising upward in a cylindrical shape, and the transparent member 10b is fitted in the tip end portion. The image pickup apparatus 10 a for taking an image of the lower substrate K2 (see FIG. 1) held by the lower table 4 is housed in the image pickup unit accommodating cylinder 10a.
The lower table 4 is provided with four image pickup devices 10, and the data (image data) captured by each image pickup device 10 is input to the control device 100. The number of image pickup devices 10 provided in the lower table 4 is not limited.

The lower substrate surface 4a of the lower table 4 is a plane that holds the lower substrate K2 (see FIG. 1). Further, the moving mechanism 41 displaces the lower table 4 along the lower substrate surface 4a in the X-axis direction, the Y-axis direction, and around the Z-axis.

An image pickup window 4c is formed in the vicinity of the two alignment windows 4b. The image pickup window 4c is formed in the same shape as the alignment window 4b. A second image pickup unit accommodating cylinder (not shown) enters the image pickup window 4c from below. The second image pickup unit accommodating cylinder is formed in the same manner as the image pickup unit accommodating cylinder 10a. A second image pickup apparatus (not shown) is accommodated in the second image pickup unit accommodating cylinder. The second image pickup device takes an image of the lower substrate K2 (see FIG. 1) held by the lower table 4, and the image data thereof is input to the control device 100. Although FIG. 7A shows a configuration in which the lower table 4 is provided with two second image pickup devices, the number of the second image pickup devices is not limited.

A plurality of suction holes 43 are opened on the lower substrate surface 4a of the lower table 4. The suction hole 43 is connected to the second suction means (vacuum pump P3). When the vacuum pump P3 is driven, the mounted lower substrate K2 (see FIG. 1) is attracted and held by the lower table 4 (lower substrate surface 4a). The vacuum pump P3 is controlled by the control device 100.

FIG. 8 is a diagram showing a process of bonding substrates by a substrate assembly device. The process of bonding the boards by the board assembly device 1 will be described with reference to FIGS. 1 to 7 as appropriate.

The first step (STEP 1) is a step of carrying in the upper substrate.
In the process of bringing in the upper substrate, the control device 100 moves the upper frame 2 upward to move the upper chamber 5a and the upper table 3 upward. This opens the vacuum chamber 5.
When the upper board K1 is conveyed between the upper table 3 and the lower table 4 by the transfer device 200, the control device 100 moves the support pin 7 downward until it hits the upper board K1 to drive the vacuum pump P1. The upper substrate K1 is evacuated to the support pin 7.
When the transport device 200 exits, the control device 100 moves the support pin 7 upward to bring the upper substrate K1 into close contact with the upper substrate surface 3a of the upper table 3.
Then, the control device 100 gives a command to the vertical movement mechanism 80 to move the adhesive pin plate 8a downward and drives the vacuum pump P2. The upper substrate K1 is vacuum-sucked by the adhesive pin 8 that moves downward together with the adhesive pin plate 8a, and the adhesive portion 8b at the tip is attached to the upper substrate K1. After that, the control device 100 moves the adhesive pin plate 8a in a state where the upper substrate K1 is attached to the adhesive pin 8 downward, and separates the upper substrate K1 from the upper substrate surface 3a.
At this time, the control device 100 moves down each adhesive pin plate 8a so that the displacement amount of the adhesive pin plate 8a becomes the displacement amount set for each adhesive pin plate 8a. Details of the displacement amount of the adhesive pin plate 8a will be described later.

Further, the control device 100 displaces (moves downward) the split drive unit 31 corresponding to each adhesive pin plate 8a with respect to the back plate 30 with the same displacement amount as the displacement amount set for the adhesive pin plate 8a. Let me.

The second step (STEP2) is a lower substrate carry-in step.
When the lower board K2 is carried in between the upper table 3 and the lower table 4 by the transfer device 200, the control device 100 moves the lifter 42 upward to receive the lower board K2. When the transport device 200 exits, the control device 100 moves the lifter 42 downward to place the lower substrate K2 on the lower substrate surface 4a of the lower table 4. Further, the control device 100 drives the vacuum pump P3 to attract the lower substrate K2 to the lower substrate surface 4a of the lower table 4 and hold it.
After that, the control device 100 drives the Z-axis drive mechanism 20 to move the upper frame 2 downward, and lower the upper chamber 5a and the upper table 3. The upper chamber 5a and the lower chamber 5b engage with each other to close the vacuum chamber 5. Inside the vacuum chamber 5, an upper table 3, a lower table 4, a support pin 7, and an adhesive pin 8 are arranged.
When the vacuum chamber 5 is closed, the control device 100 drives the vacuum pump P0 to evacuate the inside of the vacuum chamber 5. Since the inside of the vacuum chamber 5 is evacuated by driving the vacuum pump P0, the vacuum chamber 5 houses the upper table 3, the lower table 4, the support pin 7, and the adhesive pin 8 in a vacuum environment.
Before the lower substrate K2 is carried into the substrate assembly device 1 (between the upper table 3 and the lower table 4), necessary substances such as a sealant, a liquid crystal display, a spacer, and a paste material are applied in another process. There is.

The third step (STEP3) is a bonding position adjusting step.
In the bonding position adjusting step, the control device 100 drives the moving mechanism 41 to displace the lower table 4 and adjust the bonding position. Details of the bonding position adjustment process will be described later.

The fourth step (STEP4) is a bonding step of bonding the upper substrate K1 and the lower substrate K2. Details of the bonding process will be described later.

The fifth step (STEP 5) is a carry-out step.
In the carry-out process, the control device 100 injects a gas such as nitrogen gas into the vacuum chamber 5 in a vacuum state to boost the pressure inside the vacuum chamber 5 to atmospheric pressure. By boosting the pressure inside the vacuum chamber 5 to atmospheric pressure, the upper substrate K1 and the lower substrate become a gap (cell gap) determined by the amount of spacers and liquid crystals previously applied to the substrate (lower substrate K2). K2 is uniformly pressed (pressurized press). The control device 100 drives the gas supply means 8d to supply the gas to the vacuum suction hole 8c. Since the adhesive pin 8 does not hold the upper substrate K1 at this point, the gas supplied to the vacuum suction hole 8c is supplied into the vacuum chamber 5. The control device 100 measures the pressure in the vacuum chamber 5 with a pressure sensor (not shown), and stops the gas supply means 8d when the pressure in the vacuum chamber 5 is increased to the atmospheric pressure. Then, the control device 100 moves up the upper frame 2. This opens the vacuum chamber 5.
After that, the bonded upper substrate K1 and lower substrate K2 are carried out from the substrate assembly device 1 by the transport means 200.

In the substrate assembly apparatus 1 of this embodiment, the upper substrate K1 and the lower substrate K2 are bonded together with the five steps (STEP1 to STEP5) shown in FIG. 8 as the main steps.

The control device 100 adjusts the bonding positions of the upper substrate K1 and the lower substrate K2 in the bonding position adjusting step (STEP 3) shown in FIG. The bonding position adjustment step (STEP3) in this embodiment will be described.

9A and 9B are views showing markings for adjusting the bonding position between the upper substrate and the lower substrate, FIG. 9A is a diagram showing an upper mark attached to the upper substrate, and FIG. 9B is a diagram showing the upper mark attached to the lower substrate. It is a figure which shows the lower mark. Further, FIGS. 10 and 11 are diagrams showing a state of adjusting the deviation between the upper mark of the upper substrate and the lower mark of the lower substrate, and FIG. 10 (a) is a diagram showing the deviation in the XY axis direction, (b). Is a figure showing a state in which the deviation in the XY axis direction is adjusted. Further, FIG. 11A is a diagram showing a deviation around the Z axis, and FIG. 11B is a diagram showing a state in which the deviation around the Z axis is adjusted.

The shapes of the markings (upper mark and lower mark) attached to the upper substrate K1 and the lower substrate K2 are not limited. For example, as shown in FIG. 9A, the upper mark has the first upper mark Mk1 of the black square attached to the reference position of the upper substrate K1 and the second upper mark of the black square in the vicinity of the first upper mark Mk1. The mark Mk1a is attached. Further, as shown in FIG. 9B, the lower mark has a square frame-shaped first lower mark Mk2 attached to the reference position of the lower substrate K2, and a square frame-shaped first lower mark Mk2 is attached in the vicinity of the first lower mark Mk2. 2 The lower mark Mk2a is attached.
The second upper mark Mk1a is a black square having a smaller size than the first upper mark Mk1. Further, the second lower mark Mk2a has a square frame shape having the same size as the first lower mark Mk2 or a larger size than the first lower mark Mk2.

The reference position of the upper substrate K1 to which the first upper mark Mk1 is attached is set, for example, by the distance from the end side of the upper substrate K1. As an example, the first upper mark Mk1 is attached at a position separated by a predetermined length from the end side of the upper substrate K1. Similarly, the first lower mark Mk2 is attached at a position separated by a predetermined length from the end side of the lower substrate K2.

When the first upper mark Mk1 is a black square as shown in FIG. 9 (a) and the first lower mark Mk2 is a square frame shape as shown in FIG. 9 (b), the control device 100 (see FIG. 1). ) Determines that the deviation between the upper substrate K1 and the lower substrate K2 is within the specified range when the first upper mark Mk1 (black square) is within the frame of the first lower mark Mk2 (square frame).
The alignment window 4b of the lower table 4 shown in FIG. 7A is formed corresponding to the reference position of the upper substrate K1 and the lower substrate K2.

Further, when the second upper mark Mk1a is a black square as shown in FIG. 9A and the second lower mark Mk2a has a square frame shape as shown in FIG. 9B, the control device 100 (FIG. 9). 1) determines that the rough adjustment of the position of the lower substrate K2 with respect to the upper substrate K1 has been completed when the second upper mark Mk1a (black square) is within the frame of the second lower mark Mk2a (square frame).
The image pickup window 4c of the lower table 4 shown in FIG. 7A corresponds to the positions of the second upper mark Mk1a attached to the upper substrate K1 and the second lower mark Mk2a attached to the lower substrate K2. It is formed.

The control device 100 (see FIG. 1) adjusts the bonding positions of the upper substrate K1 and the lower substrate K2 in two steps in the bonding position adjusting step shown in FIG.
In the bonding position adjusting step, the control device 100 first displaces the lower table 4 so that the second upper mark Mk1a is arranged within the frame of the second lower mark Mk2a. At this time, the control device 100 displaces the lower table 4 based on the image data input from the second image pickup device (not shown), and places the two second upper marks Mk1a in the frame of the second lower mark Mk2a, respectively. Deploy. When the two second upper marks Mk1a enter the frame of the second lower mark Mk2a, the control device 100 determines that the rough adjustment of the position of the lower board K2 with respect to the upper board K1 has been completed.

The control device 100 (see FIG. 1) determines that the rough adjustment of the position of the lower substrate K2 with respect to the upper substrate K1 has been completed, and then, as shown in FIG. 10A, the first upper mark of the upper substrate K1. When Mk1 (black square) is outside the frame of the first lower mark Mk2 (square frame) of the lower board K2, the control device 100 determines that the deviation between the upper board K1 and the lower board K2 is out of the specified range. Then, the control device 100 finely adjusts the position of the lower substrate K2 with respect to the upper substrate K1.

The control device 100 (see FIG. 1) gives a command to the moving mechanism 41 (see (a) of FIG. 7) of the lower table 4 to displace the lower table 4. The control device 100 gives a command to the moving mechanism 41 of the lower table 4 to move the lower table 4 (see (a) in FIG. 7) in the X-axis direction (Dx) and the Y-axis direction (Dy). Then, as shown in FIG. 10B, when all four first upper marks Mk1 are arranged within the frame of the first lower mark Mk2, the control device 100 sets the upper mark (first upper mark Mk1). ) And the lower mark (first lower mark Mk2) are in a predetermined positional relationship, and it is determined that the deviation between the upper substrate K1 and the lower substrate K2 is within the specified range, and the fine adjustment is completed.

Further, as shown in FIG. 11A, when the first lower mark Mk2 is deviated from the first upper mark Mk1 in the direction of rotation about the Z axis, the control device 100 moves the lower table 4. A command is given to the mechanism 41 (see (a) of FIG. 7) to rotate the lower table 4 (see (a) of FIG. 7) around the Z axis (Rz). Then, as shown in FIG. 11B, when all four first upper marks Mk1 are arranged within the frame of the first lower mark Mk2, the control device 100 sets the upper mark (first upper mark Mk1). ) And the lower mark (first lower mark Mk2) are in a predetermined positional relationship, and it is determined that the deviation between the upper substrate K1 and the lower substrate K2 is within the specified range, and the fine adjustment is completed.

As described above, in the bonding position adjusting step shown in FIG. 8, the control device 100 (see FIG. 1) performs rough adjustment based on the second upper mark Mk1a and the second lower mark Mk2a, and the first upper mark Mk1 and the first. 1 The bonding position of the upper substrate K1 and the lower substrate K2 is adjusted by fine adjustment based on the lower mark Mk2.
Then, in the control device 100 of the present embodiment, when the first upper mark Mk1 is arranged within the frame of the first lower mark Mk2, the first upper mark Mk1 and the first lower mark Mk2 are in a predetermined positional relationship. Judge that there is.

In the bonding position adjusting step, the control device 100 (see FIG. 1) is the image pickup device 10 (see FIG. 1).
The image data input from (b) of FIG. 7) is image-processed to extract the positions and shapes of the first upper mark Mk1 and the first lower mark Mk2, and the first upper mark Mk1 is the first lower mark Mk2. A command is given to the moving mechanism 41 (see (a) of FIG. 7) so as to move toward the inside of the frame.
The control device 100 extracts the positions and shapes of the first upper mark Mk1 and the first lower mark Mk2 by image processing such as multi-value processing.

FIG. 12 is a diagram showing a state in which the deviation between the first upper mark and the first lower mark is within the specified range, and FIG. 12A is a diagram showing a state in which the first upper mark is in the center of the first lower mark. b) is a diagram showing a state in which the first upper mark is deviated from the center of the first lower mark.
In the control device 100 (see FIG. 1) of this embodiment, as shown in (b) of FIG. 10 and (b) of FIG. 11, the first upper mark Mk1 (black square) is the first lower mark Mk2 (square). It is determined that the deviation between the upper substrate K1 and the lower substrate K2 is within the specified range when the upper substrate K1 and the lower substrate K2 are arranged in the frame of the frame).
The first upper mark Mk1 and the first lower mark Mk2 are attached to reference positions of the upper substrate K1 and the lower substrate K2, respectively. Therefore, as shown in FIG. 12A, when there is no dimensional difference (dimensional error) between the upper substrate K1 and the lower substrate K2, the four first upper marks Mk1 are all centered on the first lower mark Mk2. It is configured to be placed.

However, if an error (dimensional error or the like) occurs during the production of the upper substrate K1 and the lower substrate K2, an error occurs in the reference positions of the upper substrate K1 and the lower substrate K2. Then, if an error occurs in the reference positions of the upper substrate K1 and the lower substrate K2, all four first upper marks Mk1 are not arranged at the center of the first lower mark Mk2. Such a state in which the first upper mark Mk1 is not arranged at the center of the first lower mark Mk2 is called a mark pitch deviation (mark pitch deviation between the upper substrate K1 and the lower substrate K2).
In the control device 100 (see FIG. 1) of the present embodiment, as shown in FIG. 12 (b), even if all four first upper marks Mk1 are not the centers of the first lower mark Mk2, that is, the upper ones. Even when the mark pitch shift occurs between the substrate K1 and the lower substrate K2, when all four first upper mark Mk1 are arranged within the frame of the first lower mark Mk2, the upper substrate K1 and the lower substrate K1 and the lower substrate K2 are arranged. It is determined that the deviation of K2 is within the specified range.

However, if the upper substrate K1 and the lower substrate K2 are bonded together in this state, a slight deviation occurs between the upper substrate K1 and the lower substrate K2.
Therefore, the control device 100 (see FIG. 1) of the substrate assembly device 1 of the present embodiment moves downward for each adhesive pin plate 8a when the adhesive pin 8 is moved downward in the upper substrate loading step (STEP 1) shown in FIG. The displacement amount of the upper substrate K1 and the lower substrate K2 is reduced by changing the displacement amount of. As a result, the mark pitch deviation between the upper substrate K1 and the lower substrate K2 is effectively corrected.

FIG. 13 is a diagram showing a state in which the displacement amount of the adhesive pin plate is changed to reduce the deviation between the upper substrate and the lower substrate, and FIG. 13A is a diagram showing a state in which the first upper mark and the first lower mark are displaced. , (B) is a diagram showing a state in which the displacement between the first upper mark and the first lower mark is reduced (a state in which the mark pitch deviation between the upper substrate and the lower substrate is corrected).
In FIGS. 13 (a) and 13 (b), the position of the first lower mark Mk2 is indicated by a broken line.

As shown in FIG. 13A, when the displacement amounts of all the adhesive pin plates 8a are equal, the protruding amounts of all the adhesive pins 8 are equal, so that the upper substrate K1 adsorbed (held) by the adhesive pins 8 is attached. Becomes flat. That is, the upper substrate K1 is held by the adhesive pin 8 in a state parallel to the upper substrate surface 3a. At this time, if a dimensional error occurs in the upper substrate K1 or the lower substrate K2 due to a dimensional error or the like that occurs during production or the like, the first upper mark Mk1 may be displaced from the center of the first lower mark Mk2. That is, a mark pitch shift may occur between the upper substrate K1 and the lower substrate K2.

For example, as shown in FIG. 13B, when the displacement amount of the adhesive pin plate 8a increases on the end side where the first upper mark Mk1 is attached, the center of the upper substrate K1 is the upper table 3 rather than the end side. It is held by the adhesive pin 8 in a state of being slightly curved toward the surface.
When the upper substrate K1 is curved in this way, the end portion of the upper substrate K1 is slightly closer to the center, so that the first upper mark Mk1 attached near the end portion is slightly closer to the center. Therefore, the upper substrate K1 is held by the adhesive pin 8 in a state where the first upper mark Mk1 approaches the center of the first lower mark Mk2.

As described above, when the upper substrate K1 is held by the adhesive pin 8 in a state where the first upper mark Mk1 is close to the center of the first lower mark Mk2, the fine adjustment in the bonding position adjusting step shown in FIG. 8 causes the upper substrate K1 to be held by the adhesive pin 8. As shown in FIG. 13B, the first upper mark Mk1 approaches the center of the first lower mark Mk2 with high accuracy. Then, the minute deviation caused by the bonding of the upper substrate K1 and the lower substrate K2 is reduced, whereby the mark pitch deviation between the upper substrate K1 and the lower substrate K2 is corrected, and the mark pitch deviation is reduced.

Errors (dimensional errors, etc.) that occur during production of the upper substrate K1 and the lower substrate K2 are approximated in the same production lot. That is, the magnitude of the deviation of the first upper mark Mk1 with respect to the first lower mark Mk2 of the lower substrate K2 is approximated for each production lot of the upper substrate K1 and the lower substrate K2.
Therefore, if the displacement amount of the adhesive pin plate 8a is set for each production lot of the upper substrate K1 and the lower substrate K2, the first upper mark Mk1 is placed at the center of the first lower mark Mk2 as long as the production lot does not change. You can get closer. The control device 100 (see FIG. 1) may be configured to displace the adhesive pin plate 8a by a preset displacement amount.

For example, the administrator of the substrate assembly device 1 (see FIG. 1) sets the displacement amount of the adhesive pin plate 8a for each production lot of the upper substrate K1 and the lower substrate K2. Since the substrate assembly device 1 of this embodiment has nine adhesive pin plates 8a, a displacement amount is set for each adhesive pin plate 8a.
When the displacement amount set in this way is input to the control device 100 (see FIG. 1), the control device 100 receives each adhesive pin plate with the set displacement amount in the upper substrate loading step (see FIG. 8). The 8a is displaced with respect to the back plate 30 (see FIG. 3). Each adhesive pin plate 8a moves downward with a set displacement amount.

Note that FIG. 13B shows a state in which the displacement amount of the adhesive pin plate 8a arranged in the center is smaller than the displacement amount of the adhesive pin plate 8a arranged on the end side, but in the center. It is also possible to make the displacement amount of the adhesive pin plate 8a arranged larger than the displacement amount of the adhesive pin plate 8a arranged on the end side.
Further, in FIG. 13B, the displacement amount of the adhesive pin plate 8a changes in the X-axis direction, but it is also possible to change the displacement amount of the adhesive pin plate 8a in the Y-axis direction.

The control device 100 (see FIG. 1) adjusts the bonding positions of the upper substrate K1 and the lower substrate K2 in the bonding position adjusting step (STEP 3) shown in FIG. 8, and then performs the bonding step (STEP 4) shown in FIG. This is executed and the upper substrate K1 and the lower substrate K2 are bonded together. The bonding step (STEP4) in this embodiment will be described.

FIG. 14A is a diagram showing a state in which the split drive unit is displaced according to the shape of the upper substrate, and FIG. 14B is a diagram showing a state in which the upper table presses the upper substrate and the lower substrate.
As described above, in the control device 100 (see FIG. 1) of this embodiment, the displacement amount of the adhesive pin plate 8a is changed in the upper substrate loading step (STEP 1) shown in FIG. As shown, the upper substrate K1 is slightly curved.

Then, the control device 100 (see FIG. 1) executes the bonding step (STEP 4) shown in FIG. 8 after adjusting the bonding position in the bonding position adjusting step.
In the bonding process, the control device 100 is divided and driven by a displacement amount corresponding to the displacement amount of the adhesive pin plate 8a to which the adhesive pin 8 corresponding to the divided flat surface portion 31a of each divided drive unit 31 is attached. Displace the portion 31. In the present embodiment, the control device 100 has the same displacement amount as the displacement amount of the adhesive pin plate 8a to which the adhesive pin 8 corresponding to the divided flat surface portion 31a of each divided drive unit 31 is attached, and each divided drive unit. Displace 31.

The control device 100 (see FIG. 1) controls the actuator 32 (see FIG. 3) to move the split drive unit 31 downward to separate it from the back plate 30. At this time, the control device 100 moves the split drive unit 31 downward with the same displacement amount as the displacement amount of the corresponding adhesive pin plate 8a. Therefore, as shown in FIG. 14A, the adhesive pin plate 8a and the split drive unit 31 corresponding to the adhesive pin plate 8a are displaced (moved downward) by the same amount. The split drive unit 31 is displaced according to the deformation of the upper substrate K1, and the upper substrate surface 3a of the upper table 3 is deformed into the shape of the upper substrate K1 held by the adhesive pin 8.

After that, the control device 100 (see FIG. 1) drives the Z-axis drive mechanism 20 (see FIG. 1), further moves the upper frame 2 (see FIG. 1) downward, and the upper table shown in FIG. 14 (a). 3 and the adhesive pin plate 8a (adhesive pin 8) are moved downward. As a result, as shown in FIG. 14B, the upper substrate K1 held by the adhesive pin 8 and the lower substrate K2 held by the lower table 4 are bonded to each other.
As shown in FIG. 14A, the control device 100 drives the Z-axis drive mechanism 20 (see FIG. 1) in a state where the split drive unit 31 is displaced. The upper table 3 (back plate 30, split drive unit 31) moves downward together with the upper frame 2 (see FIG. 1). Then, as shown in FIG. 14B, the upper board K1 held by the adhesive pin 8 and the lower board K2 held by the lower table 4 are the upper table 3 (divided drive unit 31) and the lower table. It is pressed with 4 and pasted together. At this time, the split drive unit 31 presses the upper substrate K1 and the lower substrate K2 in a displaced state.

Therefore, the upper substrate K1 and the lower substrate K2 are bonded together in a state (shape) in which the first upper mark Mk1 of the upper substrate K1 is close to the center of the first lower mark Mk2 of the lower substrate K2. As a result, the mark pitch deviation between the upper substrate K1 and the lower substrate K2 in the bonding step is suppressed, and the error caused by the bonding between the upper substrate K1 and the lower substrate K2 is reduced.

In addition, in FIGS. 14A and 14B, the amount of deformation of the upper substrate K1 is largely shown in order to make the explanation easy to understand. The actual amount of deformation of the upper substrate K1 is very small, and the amount of displacement of the split drive unit 31 is also very small. Therefore, even if the upper substrate K1 and the lower substrate K2 are bonded to each other in a state where the split drive unit 31 is displaced (moved downward from the back plate 30), the amount of deformation of the upper substrate K1 is small, and the upper substrate K1 and the lower substrate K1 and the lower substrate K1 are attached to each other. The substrate K2 is accurately bonded without forming a gap or the like.

When the control device 100 detects that the upper substrate K1 and the lower substrate K2 are bonded to each other by the detection signal input from the load cell 20d (see FIG. 1), the control device 100 drives the vertical movement mechanism 80 at that time to drive the adhesive pin 8 Is pulled in from the upper substrate surface 3a. At this time, the control device 100 stops the vacuum pump P2 (see FIG. 5) and drives the gas supply means 8d to supply the gas to the vacuum suction hole 8c and peel the upper substrate K1 from the adhesive portion 8b. Then, the control device 100 drives the Z-axis drive mechanism 20 to move the upper frame 2 further downward, and presses the upper substrate K1 and the lower substrate K2 on the upper table 3. The control device 100 stops the lower movement of the upper frame 2 when it is determined that a predetermined load is generated between the upper table 3 and the lower table 4 by the detection signal input from the load cell 20d.
The inside of the vacuum chamber 5 is a vacuum, and the upper substrate K1 and the lower substrate K2 are bonded together with a predetermined load in a vacuum environment inside the vacuum chamber 5. By the pressurization at this time, the sealant previously applied to the lower substrate K2 is appropriately pressed, and the vacuum of the liquid crystal portion to be applied is maintained in the frame surrounded by the sealant.
After that, the sealant is temporarily cured by ultraviolet rays emitted from a UV (ultraviolet) irradiation device (not shown) so that the positions of the upper substrate K1 and the lower substrate K2 do not shift.

As described above, the dimensional errors of the upper substrate K1 and the lower substrate K2 are approximated in the same production lot, and the displacement amount of the adhesive pin plate 8a is set for each production lot of the upper substrate K1 and the lower substrate K2. To. Therefore, while the production lots of the upper substrate K1 and the lower substrate K2 do not change, the split drive unit 31 may be maintained in a state of being displaced by a displacement amount equal to the displacement amount set in the adhesive pin plate 8a. .. For example, while the production lot of the upper substrate K1 and the production lot of the lower substrate K2 do not change, the control device 100 (see FIG. 1) has a displacement amount equal to the displacement amount of the adhesive pin plate 8a corresponding to each production lot. The split drive unit 31 may be maintained in a displaced state.
With such a configuration, as long as the production lots of the upper board K1 and the lower board K2 do not change, the control device 100 (see FIG. 1) needs to displace the split drive unit 31 every time the bonding step is executed. Disappears.

As described above, the substrate assembly apparatus 1 (see FIG. 1) of the present embodiment sets the displacement amount of the adhesive pin 8 (see FIG. 5) to the adhesive pin plate 8a (see FIG. 5) when holding the carried-in upper substrate K1. By changing each of these (see 5), it is possible to reduce minute deviations (mark pitch deviations) due to dimensional errors and the like that occur during production of the upper substrate K1 and the lower substrate K2. Then, the mark pitch deviation between the upper substrate K1 and the lower substrate K2 can be corrected, and the mark pitch deviation is reduced.

Further, in the substrate assembly device 1 of the present embodiment, the split drive unit has the same displacement amount as the displacement amount of the adhesive pin 8 (see FIG. 5) modified so as to correct the mark pitch deviation between the upper substrate K1 and the lower substrate K2. 31 (see FIG. 3) is displaced. As a result, the shape of the upper substrate surface 3a (see FIG. 3) of the upper table 3 becomes equal to the shape of the upper substrate K1 held by the adhesive pin 8. Then, in the bonding step (see FIG. 8), the upper substrate K1 is pressed against the lower substrate K2 on the upper substrate surface 3a having the same shape, so that the mark pitch shift does not occur in the bonding process, and the upper substrate K1 and the lower substrate K1 are pressed. The substrate K2 is accurately bonded.

The present invention is not limited to the above-described embodiment. For example, the above-described embodiment has been described in detail in order to explain the present invention in an easy-to-understand manner, and is not necessarily limited to the one including all the described configurations.
It is also possible to replace a part of the configuration of one embodiment with the configuration of another embodiment, and it is also possible to add the configuration of another embodiment to the configuration of one embodiment.

In addition, the present invention is not limited to the above-described embodiment, and the design can be appropriately changed without departing from the spirit of the invention.
15A and 15B are views showing an example of design modification, FIG. 15A is a diagram showing a state in which the displacement amounts of the adhesive pins attached to one adhesive pin plate are different, and FIG. 15B is a diagram showing a state in which the displacement amounts of the adhesive pins are different, and FIG. It is a figure which shows the structure corresponding to the drive part. 16A and 16B are views showing another design change example, in which FIG. 16A shows a state in which four split drive units correspond to one adhesive pin plate, and FIG. 16B shows three adhesive pins. It is a figure which shows the state which one division drive part corresponds to a plate.

As shown in FIG. 6, one adhesive pin plate 8a is driven by four vertical movement mechanisms 80. Further, as shown in FIG. 4, one split drive unit 31 is supported by four rods 32a (actuator 32 shown in FIG. 3).
Therefore, it is possible to change the amount of movement of the four vertical movement mechanisms 80 in one adhesive pin plate 8a. Similarly, it is possible to change the displacement amount of the rod 32a for each actuator 32 that supports one split drive unit 31.

Then, as shown in FIG. 15A, it is possible to make the displacement amounts of the adhesive pins 8 attached to one adhesive pin plate 8a different. In this case, the upper substrate K1 held by the adhesive pin 8 can be variously deformed (curved). Further, the split drive unit 31 can be displaced from the back plate 30 according to the displacement amount of one adhesive pin 8.
Therefore, as shown in FIG. 15A, the split drive unit 31 is appropriately displaced from the back plate 30 to incline the split flat surface portion 31a with respect to the back plate 30, and the shape of the upper substrate surface 3a is changed to the upper substrate K1. Can be matched with the shape of. As a result, it is possible to more effectively reduce the minute deviation caused by the bonding of the upper substrate K1 and the lower substrate K2. As a result, the mark pitch deviation between the upper substrate K1 and the lower substrate K2 is corrected more effectively.

Further, as shown in FIG. 15 (b), one adhesive pin 8 may be provided with one vertical movement mechanism 80. That is, it is also possible to configure one adhesive pin 8 attached to one adhesive pin plate 8a. Further, it is also possible to have a configuration in which one split drive unit 31 corresponds to one adhesive pin 8 and one actuator 32 is provided in one split drive unit 31. In the case of this configuration, the displacement amount can be different for each adhesive pin 8, and the upper substrate K1 held by the adhesive pin 8 can be deformed (curved) in a wider variety of ways. Further, the control device 100 (see FIG. 1) displaces each of the divided drive units 31 according to the displacement amount of the adhesive pin 8 to change the shape of the upper substrate surface 3a (see FIG. 5) of the upper table 3 to the upper substrate. It can be matched to the shape of K1.
In this case, if the vacuum pump P2 (see FIG. 5) is connected to each of the adhesive pins 8, the upper substrate K1 can be vacuum-sucked by each adhesive pin 8.

In this embodiment, nine adhesive pin plates 8a are provided, but the number of adhesive pin plates 8a is not limited. The number of adhesive pin plates 8a can be appropriately changed depending on, for example, the number of adhesive pins 8. Further, the shape of the adhesive pin plate 8a and the arrangement of the adhesive pins 8 in one adhesive pin plate 8a are not limited.
For example, the adhesive pins 8 may be arranged in a row on a long adhesive pin plate 8a extending in the X-axis direction (or Y-axis direction).
Further, the number of adhesive pins 8 provided in one adhesive pin plate 8a is not limited. A different number of adhesive pins 8 may be provided for each adhesive pin plate 8a.

Further, in this embodiment, as shown in FIG. 6, one split drive unit 31 corresponds to one adhesive pin plate 8a. The configuration is not limited to this, and as shown in FIG. 16A as an example, a plurality of (four in the example of FIG. 16A) split drive units 31 correspond to one adhesive pin plate 8a. May be. Further, as shown in (b) of FIG. 16, one split drive unit 31 may correspond to a plurality of (three in the example of (b) of FIG. 16) adhesive pin plates 8a. ..

The shape of one split drive unit 31 is not limited to a rectangle (square or rectangle). Although not shown, the upper table 3 (see FIG. 1) may be combined with a frame-shaped split drive unit having an open central portion. In addition, it may be a split drive unit (not shown) having various shapes such as a triangle or a trapezoid.

Further, a Z-axis drive mechanism 20 that moves the upper frame 2 up and down (see FIG. 1), a vertical movement mechanism 80 that drives the adhesive pin plate 8a (see FIG. 5), and a moving mechanism 41 that drives the lower table 4 (see FIG. 7). The drive mechanism such as (a)) and the actuator 32 (see FIG. 3) is not limited to the ball screw mechanism. All or part of these drive mechanisms may be configured by another mechanism such as an air cylinder or a linear motor.

Further, the upper substrate K1 (see FIG. 1) and the lower substrate K2 (see FIG. 1) to be bonded by the substrate assembly device 1 (see FIG. 1) are mainly glass substrates, and errors occur according to changes in the ambient temperature. Cheap. For example, in order to reduce the error that occurs in the upper substrate K1 and the lower substrate K2 due to the temperature change when the inside of the vacuum chamber 5 (see FIG. 1) becomes a vacuum, the upper table 3 (see FIG. 1) and the lower table 4 (See FIG. 1) may be provided with a heating device (heater) for heating the upper substrate K1 and the lower substrate K2 to suppress the temperature drop. On the contrary, a configuration in which the temperature rise of the upper substrate K1 and the lower substrate K2 can be suppressed by using a Pelche element or the like may be used. With such a configuration, the error that occurs in the upper substrate K1 and the lower substrate K2 due to the temperature change is reduced, and the bonding accuracy between the upper substrate K1 and the lower substrate K2 is improved. Then, it is possible to effectively reduce the occurrence of mark pitch deviation between the upper substrate K1 and the lower substrate K2 due to the temperature change.

17A and 17B are views showing still another example of design modification, FIG. 17A is a diagram showing an example of design modification in which all adhesive pins are attached to one adhesive pin plate, and FIG. 17B is an integral structure. It is a figure which shows the design change example with a table.
As shown in FIG. 6, the substrate assembly device 1 (see FIG. 1) of this embodiment has nine adhesive pin plates 8a. Nine adhesive pins 8 are attached to one adhesive pin plate 8a. The configuration is not limited to this, and for example, as shown in FIG. 17A, all the adhesive pins 8 may be attached to one adhesive pin plate 8a.

Then, as shown in FIG. 17A, the vertical movement mechanism 80 may be provided at the four corners of the adhesive pin plate 8a having a rectangular shape.
With this configuration, it is possible to make the displacement amounts of the adhesive pins 8 different by changing the operation amounts of the four vertical movement mechanisms 80. Further, each of the divided drive units 31 is displaced from the back plate 30 (see FIG. 3) according to the displacement amount of the adhesive pin 8, and in this state, the upper substrate K1 (see FIG. 1) and the lower substrate K2 (see FIG. 1). ) Can be pasted together.

Further, as shown in FIG. 4, the upper table 3 of the substrate assembly apparatus 1 (see FIG. 1) of this embodiment is provided with nine split drive units 31. The structure is not limited to this, and the upper table 3 may have an integral structure as shown in FIG. 17 (b). That is, the upper table 3 may not be provided with the split drive unit 31, and the upper table 3 may be composed of a single steel plate or the like. In this case, if the rods 32a of the actuator 32 (see FIG. 3) are attached to the four corners of the rectangular upper table 3, the upper table 3 is appropriately tilted by changing the displacement amount of the four rods 32a. Can be made to. Therefore, the upper table 3 can be appropriately tilted according to the displacement amount of the adhesive pin 8, and the upper substrate K1 (see FIG. 1) and the lower substrate K2 (see FIG. 1) can be bonded together in this state.

1 Board assembly device 3 Upper table 3a Upper board surface 4 Lower table 4a Lower board surface 5 Vacuum chamber 5a Upper chamber 5b Lower chamber 8 Adhesive pin 8a Adhesive pin plate (base part)
8b Adhesive part 8c Vacuum suction hole 8d Gas supply means 10 Imaging device 20 Z-axis drive mechanism (first drive mechanism)
31 Divided drive unit 31a Divided flat surface unit 32 Actuator (3rd drive mechanism)
41 Movement mechanism 43 Suction hole 80 Vertical movement mechanism (second drive mechanism)
100 Control device K1 Upper board K2 Lower board Mk1 First upper mark (upper mark)
Mk2 1st lower mark (lower mark)
P2 vacuum pump (first suction means)
P3 vacuum pump (second suction means)

Claims (3)

It has a lower table having a lower substrate surface for holding the lower substrate, and an upper table having an upper substrate surface facing the lower substrate surface and holding the upper substrate on the upper substrate surface, and holding the lower table on the lower table. In the substrate assembly apparatus in which the lower substrate and the upper substrate held on the upper table are bonded together in a vacuum environment.
A plurality of adhesive pins that are vertically displaced with respect to the upper table to hold the upper substrate, and
A plurality of adhesive pin plates, each with one or more of the adhesive pins.
Adhesive pin displacement driving means for displacement-driving each of the adhesive pin plates independently of the upper table in the direction perpendicular to the upper table.
Each of the plurality of adhesive pin plates is displaced and driven according to the amount of deformation for keeping the displacement between the lower substrate and the upper substrate within the specified range to bend the upper substrate, and the upper substrate and the lower substrate are subjected to each other. A substrate assembly apparatus including a control means for controlling the adhesive pin displacement driving means so as to correct the deviation within a specified range. The upper table is formed of a plurality of divided plane portions facing the lower substrate surface, and is formed.
The substrate assembly apparatus according to claim 1 , further comprising a split drive unit that independently drives each of the plurality of split plane portions forming the upper table. The substrate assembly apparatus according to claim 2 , wherein the control means controls each of the divided drive portions so that the divided plane portions are displaced together with the displacement drive of the corresponding adhesive pin plate.

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