CN115079451B - Substrate assembling device and substrate assembling method - Google Patents
Substrate assembling device and substrate assembling method Download PDFInfo
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- CN115079451B CN115079451B CN202210559552.0A CN202210559552A CN115079451B CN 115079451 B CN115079451 B CN 115079451B CN 202210559552 A CN202210559552 A CN 202210559552A CN 115079451 B CN115079451 B CN 115079451B
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- substrate
- upper table
- holding
- lower table
- adhesive
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- 239000000758 substrate Substances 0.000 title claims abstract description 222
- 238000000034 method Methods 0.000 title claims abstract description 20
- 239000000853 adhesive Substances 0.000 claims abstract description 41
- 230000001070 adhesive effect Effects 0.000 claims abstract description 41
- 230000007246 mechanism Effects 0.000 claims description 45
- 238000010926 purge Methods 0.000 claims description 9
- 238000004049 embossing Methods 0.000 claims description 7
- 229920000139 polyethylene terephthalate Polymers 0.000 claims description 6
- 239000005020 polyethylene terephthalate Substances 0.000 claims description 6
- -1 polyethylene terephthalate Polymers 0.000 claims description 5
- 238000001179 sorption measurement Methods 0.000 claims description 5
- 238000007664 blowing Methods 0.000 claims description 4
- 239000011521 glass Substances 0.000 description 63
- 238000004519 manufacturing process Methods 0.000 description 9
- 230000002093 peripheral effect Effects 0.000 description 8
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 239000004973 liquid crystal related substance Substances 0.000 description 4
- 229910000838 Al alloy Inorganic materials 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- 238000000059 patterning Methods 0.000 description 3
- 230000000630 rising effect Effects 0.000 description 3
- 239000004696 Poly ether ether ketone Substances 0.000 description 2
- 230000006835 compression Effects 0.000 description 2
- 238000007906 compression Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- 239000000806 elastomer Substances 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229920002530 polyetherether ketone Polymers 0.000 description 2
- 239000000565 sealant Substances 0.000 description 2
- 230000003068 static effect Effects 0.000 description 2
- 238000012790 confirmation Methods 0.000 description 1
- 230000006837 decompression Effects 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 238000011946 reduction process Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/185—Joining of semiconductor bodies for junction formation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Nonlinear Science (AREA)
- Optics & Photonics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- Liquid Crystal (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Mathematical Physics (AREA)
- Electroluminescent Light Sources (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Die Bonding (AREA)
Abstract
The invention provides a substrate assembling device and a substrate assembling method capable of reducing deflection of a substrate. A substrate assembling device (1) holds one substrate on a lower table (10), holds the other substrate on an upper table (9) in a manner of being opposite to the one substrate, and uses an adhesive arranged on any one substrate to bond in a vacuum chamber, wherein the upper table (9) and/or the lower table (10) are provided with a plurality of convex parts and a plurality of concave parts which are arranged adjacent to each other on the surface for holding the substrate, and the ratio of the width of the concave parts to the width of the upper table (9) and/or the lower table (10) is 10 －6 ～10 －4 。
Description
The present application is a divisional application having a filing date of 2019, 07, 08, 201910607458.6, and a name of "substrate assembling apparatus and substrate assembling method".
Technical Field
The present invention relates to a substrate assembling apparatus and a substrate assembling method for manufacturing a liquid crystal display, an organic EL display, or the like by bonding substrates in vacuum.
Background
As a technique related to a substrate assembling apparatus for bonding substrates in vacuum, for example, patent document 1 discloses a substrate assembling apparatus that efficiently discharges gas from between an upper substrate and a lower substrate by moving the upper substrate up and down to change a separation distance between the upper substrate and the lower substrate in a vacuum pumping process.
Patent document 2 proposes a workpiece bonding apparatus including an antistatic mechanism for preventing static charge on a table.
Patent document 3 discloses a vacuum bonding apparatus in which a plurality of convex portions and a plurality of concave portions are formed on surfaces of a first holding member and a second holding member that are in contact with a non-bonding surface of a work piece in order to reduce strain caused by thermal insulation compression/temperature change of a table, and in which exhaust gas at the time of decompression (at the time of evacuation) is made good, thereby suppressing an influence of temperature change caused by thermal insulation expansion or thermal insulation compression in a minute space on the work piece.
Patent document 4 discloses a substrate assembling apparatus in which irregularities and grooves are formed on the surface of a sheet material in order to solve the problem of positional displacement of a lower substrate caused by expansion of residual air on the lower stage side under reduced pressure.
Patent document 5 discloses a substrate assembling device capable of bonding with high accuracy without misalignment by a peeling pin up-and-down mechanism or an adhesive pad up-and-down mechanism.
Prior art literature
Patent literature
Patent document 1: japanese patent laid-open publication No. 2017-80868
Patent document 2: japanese patent No. 5654155
Patent document 3: japanese patent No. 6255546
Patent document 4: japanese patent laid-open No. 2003-283185
Patent document 5: japanese patent laid-open No. 2005-134687
Disclosure of Invention
Problems to be solved by the invention
However, in recent years, glass substrates bonded in vacuum have been increasingly enlarged, and in the assembly apparatuses disclosed in patent documents 1 to 3, there is a possibility that air remaining in a groove of a table or the like is discharged at a high speed during evacuation, and static electricity or deflection is generated on the glass substrates.
In the assembly devices disclosed in patent documents 4 and 5, there is a concern that deflection may occur during the substrate raising operation with a speed increase.
Accordingly, the present invention provides a substrate assembling apparatus and a substrate assembling method capable of reducing deflection of a substrate.
Means for solving the problems
In order to solve the above problems, a substrate assembling apparatus according to the present invention is a substrate assembling apparatus for holding one substrate on a lower table, holding the other substrate on an upper table so as to face the one substrate, and bonding the other substrate in a vacuum chamber by an adhesive provided on either one of the substrates, wherein the substrate assembling apparatus has a plurality of convex portions and a plurality of concave portions arranged adjacent to each other on a surface of the upper table and/or the lower table for holding the substrate, and a ratio of a width of the concave portions to a width of the upper table and/or the lower table is 10 －6 ～10 －4 。
In the substrate assembling apparatus according to the present invention, the plurality of convex portions and the plurality of concave portions that are disposed adjacent to each other are formed in an embossed sheet, and the embossed sheet is bonded to a surface of the upper table and/or the lower table for holding the substrate by an adhesive.
In the substrate assembling device of the present invention, the embossed sheet is made of polyethylene terephthalate and is formed in a wave shape in a cross-sectional view.
In the substrate assembling apparatus according to the present invention, the plurality of convex portions and the plurality of concave portions that are disposed adjacent to each other are formed in an elastic body plate that is provided on a surface of the upper table and/or the lower table for holding the substrate.
The substrate assembling apparatus of the present invention is characterized in that the upper table provided inside the chamber is provided with a vacuum suction mechanism and a purge gas blowing mechanism, and the vacuum suction mechanism is provided with a plurality of suction pins on a suction pin plate that can move up and down independently of the upper table.
In another aspect of the present invention, a substrate assembling apparatus for holding one substrate on a lower table, holding the other substrate on an upper table so as to face the one substrate, and bonding the substrates in a vacuum chamber by an adhesive provided on either one of the substrates is characterized by comprising a first lifter and a second lifter, wherein the second lifter penetrates the lower table, and the substrate is raised by a predetermined amount by the second lifter and then further raised by the first lifter.
In another aspect of the substrate assembling apparatus of the present invention, the first lifters are arranged sparsely, and the second lifters are arranged densely.
In another aspect of the present invention, the substrate assembling apparatus is characterized in that the first lifters are arranged more sparsely than the second lifters.
In another aspect of the present invention, the substrate assembling apparatus is characterized in that the first lifter lifts the substrate by a larger amount than the second lifter lifts the substrate.
In another aspect of the present invention, the substrate assembling apparatus is characterized in that the first lifter lifts the substrate by about 33 to 200 times the lifting amount of the second lifter.
In another aspect of the present invention, the lower table includes a through hole through which the second lifter passes, and purge gas or air enters the rear surface of the substrate from a gap between an inner peripheral surface of the through hole and an outer peripheral surface of the second lifter when the substrate is lifted by a predetermined amount by the second lifter.
The substrate assembly method of the present invention includes: a step of holding one substrate on a lower table; a step of holding the other substrate on an upper table so as to face the one substrate; and a step of bonding the substrates in the vacuum chamber by using an adhesive provided on either one of the substrates, wherein the substrate assembling method is characterized in that the upper table and/or the lower table has a plurality of convex portions and a plurality of concave portions arranged adjacent to each other on a surface for holding the substrates, and the width of the concave portions is larger than that of the upper tableAnd/or the ratio of the width of the lower table is 10 －6 ～10 －4 。
In addition, another substrate assembly method according to another aspect of the present invention includes: a step of holding one substrate on a lower table; a step of holding the other substrate on an upper table so as to face the one substrate; and a step of bonding the substrates in the vacuum chamber by using an adhesive provided on either one of the substrates, wherein the substrate assembling method is characterized by comprising a first lift member arranged in a sparse manner and a second lift member arranged in a dense manner, wherein the second lift member is capable of penetrating the lower table, and wherein the substrate is further raised by the first lift member after the substrate is raised by a predetermined amount by the second lift member.
Effects of the invention
According to the present invention, it is possible to provide a substrate assembling apparatus and a substrate assembling method capable of reducing deflection of a glass substrate.
Other problems, configurations and effects than those described above will be apparent from the following description of the embodiments.
Drawings
Fig. 1 is a schematic configuration diagram of a substrate assembly apparatus according to embodiment 1 of the present invention.
Fig. 2 is an explanatory view of a guide mechanism constituting the substrate assembling apparatus shown in fig. 1.
Fig. 3 is a schematic explanatory view of the bonding pin mechanism.
Fig. 4 is a longitudinal sectional view of an elastic body of the surface of the upper table and the surface of the lower table shown in fig. 3.
FIG. 5 is a flowchart showing the operation flow of the substrate assembling apparatus shown in FIG. 1
Fig. 6 is a schematic diagram of a substrate assembly apparatus according to embodiment 2, which is another embodiment of the present invention, and is a top view and a side view of a lower table.
Fig. 7 is a flowchart showing the operation flow of the substrate assembling apparatus according to embodiment 2.
Fig. 8 is a vertical sectional view showing a state in which the lower glass substrate is raised by a predetermined amount by the second lifter shown in fig. 6.
Fig. 9 is a vertical sectional view showing a state in which the lower glass substrate is raised by a predetermined amount by the first lifter shown in fig. 6.
Description of the reference numerals
A substrate assembling apparatus, a 2Z axis driving mechanism, a 2a Z axis driving motor, a 2b ball screw, a 2c ball screw bearing portion, a 3 guide mechanism, a 3a linear guide, a 3b linear moving portion, a 4 load sensor, a 5 upper frame, a 6 upper axis, a 7 upper chamber, a 7b bracket, a 8 lower chamber, a 9 upper table, a 10 lower table, an 11 elastomer plate, 11a, 11b elastomer, a 12 lower axis, a 13xyθ moving unit, a 14 bonding pin driving mechanism, a 14a up-and-down driving motor, a 14b bonding pin plate, a 14c bonding pin, a 14d bonding pin up-down mechanism, a 14e bonding tab, a 15 stage, a 16 lower glass substrate, 17, 18 beams, 21 first lifters, 22 second lifters, and 23 through holes.
Detailed Description
In the present specification, a glass substrate is described as an example of a substrate bonded in vacuum, but the bonded substrate is not limited to the glass substrate.
Hereinafter, embodiments of the present invention will be described using the drawings.
Example 1
Fig. 1 is a schematic configuration diagram of a substrate assembly apparatus according to embodiment 1 of the present invention. As shown in fig. 1, the substrate assembly apparatus 1 includes a stage 15 and an upper frame 5 as rigid support members, and includes an upper chamber 7 and a lower chamber 8 on the inner sides thereof. The upper frame 5 is configured as follows: the ball screw 2b provided on the stage 15 side and constituting the Z-axis drive motor 2a of the Z-axis drive mechanism 2 is driven to rotate, whereby the upper frame 5 is moved in the up-down direction relative to the stage 15 via the ball screw bearing 2c provided on the upper frame 5. The guide mechanism 3 for moving the upper frame 5 up and down is provided with four sets.
Fig. 2 is an explanatory view of a guide mechanism constituting the substrate assembling apparatus shown in fig. 1. In fig. 2, a partial cross-sectional view of the guide mechanism 3 is shown. As shown in fig. 2, two linear guides 3a are provided on the beam 17 fixed to the stage 15 side, and two linear moving portions 3b are provided on the beam 18 fixed to the upper frame 5 side, and as shown in fig. 2, the linear guides 3a and the linear moving portions 3b are combined such that one guide surface is perpendicular to the other guide surface.
Returning to fig. 1, a plurality of lower shafts 12 for supporting the lower table 10 are installed above the table frame 15. Each lower shaft 12 protrudes into the lower chamber 8 through a vacuum seal (not shown) in order to ensure airtightness in the lower chamber 8. Further, an xyθ moving unit 13 capable of moving in the xyθ direction independently is mounted between each lower shaft 12 and the lower table 10. Note that the xyθ moving unit 13 may be configured by a mechanism using a ball bearing or the like fixed in the up-down direction and movable in the horizontal direction. A plurality of lower table horizontal driving mechanisms (not shown) are provided outside the lower chamber 8 in the horizontal direction (X direction, Y direction) of the lower table 10, and the side surface (thickness direction of the lower table) of the lower table is pressed by a shaft provided in the driving mechanism, whereby positioning in the xyθ direction is enabled.
The lower chamber 8 and the upper chamber 7 are provided in a separable structure, and a seal ring, not shown, is provided at a connecting portion between the lower chamber 8 and the upper chamber 7, so that the upper chamber 7 and the lower chamber 8 are combined to prevent air leakage when the inside is exhausted.
Load sensors 4 are provided at the connection portions between the upper frame 5 and the Z-axis drive mechanism 2, respectively. An upper chamber 7 is installed inside the upper frame 5. The upper chamber 7 is suspended from the upper frame 5 by a support shaft 6c and a bracket 7b, and the upper chamber 7 can be separated from the lower chamber 8 by moving the upper frame 5 up and down. Further, a plurality of upper shafts 6 are provided on the upper frame 5 so as to face into the upper chamber 7, and support the upper table 9. The upper shaft 6 and the upper chamber 7 are connected by a vacuum seal to maintain the air tightness in the chamber. The upper table 9 is fixed to the upper shaft 6, and is configured to be able to detect a force applied to press the glass substrate by the load cell 4. Since the Z-axis driving mechanism 2 can move the upper chamber 7 and the upper table 9 up and down, a support shaft 6c for providing the upper chamber 7 to the upper frame 5 and a support shaft (upper shaft 6) for providing the upper table 9 to the upper frame 5 are provided, respectively. Therefore, the support shaft 6c of the upper chamber 7 is a support structure that can move freely (with play) when the upper chamber 7 and the lower chamber 8 are combined, without a downward force being applied from the upper chamber 7 to the lower chamber 8. That is, a bracket 7b having a predetermined height is attached to the upper portion of the upper chamber 7, and a flange portion is provided at the front end of the support shaft 6c of the upper chamber 7, and the flange portion abuts against the bracket 7b in the bracket 7 b. When the upper chamber 7 is lifted, the flange portion of the support shaft 6c is brought into contact (in contact) with the bracket 7b, and the upper chamber 7 and the upper table 9 can be integrally moved upward. Namely, the following structure is provided: when the upper shaft 6 is raised to move the upper table 9 upward by a predetermined amount in the upper chamber 7, the flange portion of the support shaft 6c abuts against the bracket 7b, and at this time, when the upper table 9 is further raised, the upper table 9 moves upward together with the upper chamber 7. The upper chamber 7 is integrally moved with the upper table 9 before the upper chamber 7 is moved downward to be integrated with the chamber 8, and the upper table 9 can be individually moved toward the lower table 10 after the upper chamber 7 and the lower chamber 8 are integrated.
In addition, as described above, in the present embodiment, since the upper table 9 and the lower table 10 are disposed separately from the upper chamber 7 and the lower chamber 8, even if the chamber is deformed when the pressure in the chamber is reduced, the deformation is not transmitted to the upper table 9 and the lower table 10, and the glass substrate can be held horizontally.
An iron elastic plate 11 is provided on the upper table 9. The elastic body 11a is provided on the entire surface of the elastic body plate 11 that contacts the glass substrate. The elastic body plate 11 is fixed by magnetic force of a plurality of magnets buried in the upper table 9 and screw fastening, and can be replaced. Here, the upper table 9 is made of, for example, an aluminum alloy, and although not shown in fig. 1, an elastic body plate 11 made of iron is similarly provided on the lower table 10, and an elastic body 11b is provided on the entire surface of the elastic body plate 11 that comes into contact with the glass substrate. In the present embodiment, the structure in which the elastic body plate 11 and the elastic body 11a are provided on the upper table 9 and the elastic body plate 11 and the elastic body 11b are provided on the lower table 10 is shown, but the present invention is not limited thereto. That is, only one of the upper table 9 and the lower table 10 may be provided with an elastic plate and an elastic body.
Fig. 3 is a schematic explanatory view of the bonding pin mechanism. As shown in fig. 3, an adhesive pin driving mechanism 14 that can be operated independently of the upper table 9 is provided in the upper chamber 7 or the upper frame 5. The bonding pin driving mechanism 14 is composed of a motor 14a for driving up and down, a bonding pin plate 14b to which a plurality of bonding pins 14c are attached, and a bonding pin up-down mechanism 14 d. The bonding pin plate 14b and the bonding pin 14c have a vacuum suction mechanism, and the bonding pin 14c has an adhesive sheet 14e attached to the tip thereof. The adhesive pin 14c is provided so as to be detachable (detachable by a screw mechanism) from the adhesive pin plate 14b, and is replaceable. A negative pressure chamber for supplying negative pressure and a negative pressure flow path (not shown) provided from the negative pressure chamber to the center portion of the bonding pin 14c are connected to the bonding pin plate 14b, so that the negative pressure can be supplied to the hole portion provided at the tip end of the bonding pin 14 c. The adhesive pin 14c has an adhesive piece 14e at its tip end portion in addition to the hole portion. The adhesive pin up-and-down mechanism 14d for moving the adhesive pin plate 14b up and down is connected to the upper chamber 7 by a corrugated elastic body, whereby the vacuum state can be maintained.
Fig. 4 is a longitudinal sectional view of elastic bodies (11 a, 11 b) on the surface of the upper table 9 and the surface of the lower table 10 shown in fig. 3. Fig. 4 shows a longitudinal sectional view of the elastic body 11b on the front surface of the lower table 10, and the elastic body 11b is configured such that the upper portion can be brought into contact with the rear surface of the glass substrate when viewed in section. Therefore, strictly speaking, the elastic body 11a on the surface of the upper table 9 is formed in a shape in which the vertical sectional view shown in fig. 4 is turned upside down. Fig. 4 is an enlarged view of an example of the cross-sectional shape and the dimensions of an elastic body having a convex portion and a concave portion. As shown in fig. 4, the elastic body 11b on the surface of the lower table 10 has a plurality of convex portions and a plurality of concave portions arranged adjacent to each other. The height of the convex portions is, for example, 25 μm, and the pitch of the convex portions (pitch along the width direction of the lower table 10) is about 500 μm. The length of the convex portion along the width direction of the lower table 10 was about 460. Mu.m, and the concave portionThe length along the width direction of the lower table 10 is about 40 μm. Although not shown, the elastic bodies (11 a, 11 b) having the plurality of convex portions and the plurality of concave portions disposed adjacent to each other are disposed in a square lattice, a triangular lattice, or an interlaced lattice in a plan view. On the other hand, as described above, in recent years, glass substrates bonded in vacuum have been increasingly enlarged, and for example, the size of the glass substrates has become 3m×3m. Accordingly, the ratio of the width of the elastic body 11a and/or 11b (the width along the width direction of the upper table 9 and/or the lower table 10) to the width of the upper table 9 and/or the lower table 10 holding the glass substrate as described above becomes 10 －6 ～10 －4 。
This can prevent a large flow rate of air from being generated when the air remaining in the concave portion (groove portion) of the elastic body 11a and/or 11b is discharged during evacuation. In other words, a plurality of fine exhaust flow paths are formed on the surface of the elastic body 11a and/or 11b, and the air remaining in the concave portion (groove portion) can be discharged and dispersed. As a result, unevenness due to frictional electrification with the substrate can be reduced, unevenness due to temperature decrease caused by rapid thermal expansion can be prevented, and substrate attachment accuracy can be improved, whereby it is possible to contribute to large-scale, thin-profile, fine patterning in the next-generation high-definition display manufacturing and to display manufacturing without color unevenness.
In the present embodiment, the structure in which the elastic body plate 11 and the elastic body 11a are provided on the upper table 9 and the elastic body plate 11 and the elastic body 11b are provided on the lower table 10, or the structure in which the elastic body plate and the elastic body are provided only on either one of the upper table 9 and the lower table 10 is described, but the present invention is not limited thereto. For example, the following structure is possible: an embossed sheet having the plurality of convex portions and the plurality of concave portions disposed adjacent to each other as described above is bonded to the surface of the upper table 9 made of aluminum alloy for holding the glass substrate by an adhesive. Here, the embossed sheet is formed into a wave-like shape by embossing a sheet of polyethylene terephthalate (polyethylene terephthalate, referred to as PET), for example. In addition, the following structure is also possible: an embossed sheet having the plurality of convex portions and the plurality of concave portions disposed adjacent to each other as described above is bonded to the surface of the lower table 10 made of an aluminum alloy for holding the glass substrate by an adhesive. Alternatively, the embossed sheet may be bonded by an adhesive to only one of the upper table 9 and the lower table 10.
By using an embossed sheet having a plurality of convex portions and a plurality of concave portions arranged adjacent to each other in this way, the substrate assembling apparatus 1 of the present embodiment can be obtained by simply bonding the embossed sheet with an adhesive on the upper table and/or the lower table constituting the conventional substrate assembling apparatus.
Next, the operation of the substrate assembling apparatus 1 will be described. Fig. 5 is a flowchart showing an operation flow of the substrate assembly apparatus 1 shown in fig. 1.
As shown in fig. 5, in step S11, the upper glass substrate on the side of the bonding surface facing the lower stage 10 is carried under the upper stage 9 by a robot arm, not shown. A plurality of suction support nozzles (not shown) and a bonding pin driving mechanism 14 (fig. 3), which are not shown, are set down from the upper table 9, and the upper glass substrate is first sucked to the tip of the suction support nozzles (not shown). Thereafter, the suction support nozzle is raised until the tip of the suction support nozzle reaches the position of the surface of the bonding pin, and negative pressure is supplied to the bonding pin suction hole (not shown) provided in the bonding pin 14c (fig. 3) to hold the upper glass substrate on the surface of the bonding sheet 14e. In the present embodiment, the suction support nozzle separately provided from the adhesive pin mechanism is used, but the present invention is not limited to this, and suction and adhesive holding may be performed by using only the adhesive pin 14c without providing the suction support nozzle. The adhesive pins 14c are raised in a state where the upper glass substrate is held by the adhesive sheet 14e provided at the tip of the adhesive pins 14c, and the upper glass substrate is held in contact with the surface of the elastic body 11a of the elastic body plate 11 attached to the upper table 9.
In step S12, an adhesive (sealant) is applied in a ring shape to the surface of the lower glass substrate, a proper amount of liquid crystal is dropped into the area surrounded by the adhesive, and the lower glass substrate after dropping the liquid crystal is carried into the position of the lower table 10 by a robot and placed on the support pins. The adhesive may be provided on the upper glass substrate side, or may be provided on both the upper and lower glass substrates, in addition to the lower glass substrate.
Next, the support pins are retracted toward the lower stage 10 until the tip ends of the support pins reach the surface of the stage or are positioned inward of the surface of the stage, and negative pressure is supplied to suction holes provided in the lower stage 10 to hold the lower glass substrate. The lower table 10 is provided with an electrostatic adsorbing mechanism, so that the glass substrate can be held without being displaced even when the chamber is in a vacuum state. The lower table 10 may be provided with an adhesive pin mechanism in the same manner as the upper table 9. In this case, the moving distance of the bonding pins may be set smaller than the moving distance of the bonding pins of the upper table 9.
In step S13, when the upper and lower glass substrates are held by the bonding pins 14c and the lower table 10, the Z-axis driving mechanism 2 is operated to lower the upper frame 5, the upper chamber 7, and the upper table 9, and the upper chamber 7 and the lower chamber 8 are joined together with a sealing ring therebetween to form a vacuum chamber. The adhesive pin driving mechanism 14 is also lowered by using the motor 14a for driving up and down and the adhesive pin up and down mechanism 14d in synchronization with this operation so as to keep the positional relationship with the upper table 9 unchanged. At this time, the distance between the facing surfaces of the upper substrate held on the upper table 9 and the lower substrate held on the lower table 10 is kept to be several millimeters, so that the upper substrate and the lower substrate are not in contact. Then, the air in the vacuum chamber is discharged from an exhaust port provided on the lower chamber 8 side, and the inside of the vacuum chamber is depressurized (not shown). When the vacuum chamber is in a reduced pressure state for bonding, a camera (not shown) having a deep focal depth provided on the lower unit side is used to solve the offset amount of the positioning marks provided in advance on the upper glass substrate and the lower glass substrate. However, when the focal depth of the camera is shallow, the following method is adopted: a mechanism for vertically operating the camera is provided, the positioning mark of the upper glass substrate is first identified, then the camera is moved downwards to identify the positioning mark of the lower glass substrate, and then the offset of the positioning marks of the upper and lower glass substrates is solved. Then, the lower table 10 is moved by driving the xyθ moving unit 13, so that the offset in the xyθ direction of the upper and lower substrates is corrected. The positioning operation may be performed during the pressure reduction process for bonding.
In step S14, when the alignment of the upper and lower substrates is completed, the Z-axis driving mechanism 2 is operated to move the upper table 9 via the frame 5, and in synchronization with this, the bonding pin driving mechanism 14 is moved to the lower table 10 side to bring the upper and lower glass substrates into contact. The amount of shift of the positioning marks of the upper and lower glass substrates is again checked in a state where the upper and lower glass substrates are in contact. When the offset occurs, the positioning operation is performed again. When the confirmation operation and the positioning operation are completed, only the upper table 9 is further lowered, and the upper glass substrate is pressed and detached from the bonding pins 14 c. When the substrate is pressurized, the elastic body 11a attached to the elastic body plate 11 of the upper table 9 deforms, so that the entire substrate is uniformly pressurized. Since the glass substrates held on the two tables may be shifted in position during pressurization, it is preferable to observe the positioning marks at all times and correct the shift in position.
In step 15, when the upper and lower glass substrates are pressed to be bonded, a purge gas is introduced into the vacuum chamber by a purge gas blowing mechanism, not shown. At this time, the atmosphere is also introduced into the vacuum chamber to return the vacuum chamber to the atmospheric pressure state. The glass substrate is further pressed to a predetermined thickness by a pressing force by returning the inside of the vacuum chamber to the atmospheric pressure state. In this state, a UV irradiation mechanism, not shown, is operated to cure the adhesive at a plurality of places, thereby temporarily fixing the adhesive, and bonding the liquid crystal substrates is completed.
In the above-described operation, the holding of the substrate by the bonding pins 14c is performed until the upper and lower glass substrates are brought into contact with the adhesive (sealant) provided on one of the glass substrates, and at this time, the bonding pins 14c are peeled off from the substrate surface by only moving the upper table 9 downward without further moving the bonding pins 14c downward. In this case, the bonding pin 14c can be reliably peeled off from the substrate surface by moving the bonding pin 14c in a direction opposite to the moving direction of the glass substrate.
The bonding pins may be moved downward toward the stage 10 at the same time when the pressurizing force is applied to the substrate, and after the pressurizing is completed, the stage may be maintained in the same state as that at the time of the pressurizing, and the bonding pins may be separated from the substrate by raising the bonding pin driving mechanism 14 in this state.
In this case, the adhesive pin can be easily peeled from the substrate surface by raising the adhesive pin while introducing positive pressure gas or clean air into the suction adsorption hole at the tip of the adhesive pin.
In step S16, the bonded substrate is carried out of the vacuum chamber by a robot not shown.
As described above, according to the present embodiment, it is possible to provide a substrate assembling apparatus and a substrate assembling method capable of reducing deflection of a glass substrate.
In addition, according to the present embodiment, it is possible to reduce unevenness due to frictional electrification with a substrate, prevent unevenness due to temperature decrease caused by rapid thermal expansion, and improve substrate bonding accuracy, and thus, it is possible to contribute to display manufacturing without color unevenness in large-scale, thin-scale, and fine patterning in next-generation high-definition display manufacturing.
[ example 2 ]
Fig. 6 is a schematic diagram of a substrate assembly apparatus according to embodiment 2, which is another embodiment of the present invention, and is a top view and a side view of a lower table. The present embodiment is different from embodiment 1 described above in that the first lifters 21 are provided in a sparse arrangement and the second lifters 22 are provided in a dense arrangement so as to penetrate the lower table 10. Hereinafter, the same components as those in embodiment 1 are denoted by the same reference numerals, and the description thereof will be omitted.
Fig. 6 shows a top view and a side view of the lower table 10 constituting the substrate assembly apparatus 1 of the present embodiment. The substrate assembly apparatus 1 of the present embodiment includes a rod-shaped first lifter 21 extending in one direction as shown in a plan view and a second lifter 22 disposed in a through hole 23 provided in the lower table 10 and movable up and down as shown in a side view. In fig. 6, for convenience of explanation, a structure having two first lifters 21 and 24 second lifters 22 is shown, but the number of the first lifters 21 and the second lifters 22 is not limited thereto. However, as shown in fig. 6, the arrangement density of the first lifters 21 is sparse, and the arrangement density of the second lifters 22 is dense. In other words, the number of the first lifters 21 and the number of the second lifters 22 may be appropriately set as long as the first lifters 21 are arranged in a sparse manner and the second lifters 22 are arranged in a dense manner.
Fig. 7 is a flowchart showing an operation flow of the substrate assembling apparatus according to the present embodiment.
Step S21 to step S25 in fig. 7 are similar to step S11 to step S15 shown in fig. 5 in example 1, and therefore, the description thereof is omitted here.
In step S27, the second lifter 22 is raised by a predetermined amount, and the bonded substrate is projected by a predetermined amount from the holding surface (surface) of the lower table 10, and the bonded substrate is suspended from the holding surface (surface) of the lower table 10. Here, fig. 8 is a longitudinal sectional view showing a state in which the lower glass substrate 16 is raised by a predetermined amount by the second lifter 22 shown in fig. 6. Fig. 8 shows the state in which the lower glass substrate 16 is raised by a predetermined amount for convenience of explanation, but this is a substrate after bonding. As shown in fig. 8, the pitch P1 of the second lifters 22 (pitch along the width direction of the lower table 10) is, for example, 80mm to 100mm, the diameter D1 of the second lifters 22 is, for example, 5mm, and the aperture of the through hole 23 is, for example, 8mm. The amount of elevation h1 of the second lifter 22 from the holding surface (surface) of the lower table 10 is, for example, 1mm to 3mm. The second lifter 22 is formed of, for example, a resin of PEEK (polyetheretherketone) material, and a tip portion thereof abutting against the rear surface of the lower glass substrate 16 is formed in a curved surface shape having a predetermined radius of curvature, so that damage or scratch to the rear surface of the lower glass substrate 16 can be prevented. The purge gas or the atmosphere introduced by the purge gas blowing mechanism is blown to the back surface of the lower glass substrate 16 through the gap between the inner peripheral surface of the through hole 23 and the outer peripheral surface of the second lifter 22 as indicated by the arrow in fig. 8. In other words, the purge gas or the atmosphere intrudes into the back surface of the lower glass substrate 16 from the gap between the inner peripheral surface of the through hole 23 and the outer peripheral surface of the second lifter 22.
Returning to fig. 7, in step S27, the first lifter 21 is lifted by a predetermined amount, and the lower glass substrate 16 is further separated from the holding surface (surface) of the lower table 10. Here, fig. 9 is a longitudinal sectional view showing a state in which the lower glass substrate 16 is raised by a predetermined amount by the first lifter 21 shown in fig. 6. In fig. 9, the lower glass substrate 16 is also shown in a state raised by a predetermined amount for convenience of explanation as in fig. 8, but this is a substrate after bonding. As shown in fig. 9, the pitch P2 of the first lifters 21 (pitch along the width direction of the lower table 10) is, for example, 200mm to 250mm, and the rising amount h2 of the first lifters 21 from the holding surface (surface) of the lower table 10 is, for example, 100mm to 200mm. Therefore, the rising amount h2 of the first lifter 21 from the holding surface (surface) of the lower table 10 is about 33 to 200 times the rising amount h1 of the second lifter 22 from the holding surface (surface) of the lower table 10.
In this way, in the initial stage of separating the rear surface of the lower glass substrate 16 constituting the bonded substrate from the holding surface (front surface) of the lower table 10 in step S26, the purge gas or the atmosphere intrudes into the rear surface of the lower glass substrate 16 from the gap between the inner peripheral surface of the through hole 23 and the outer peripheral surface of the second lifter 22. At this time, negative pressure between the back surface of the lower glass substrate 16 and the holding surface (front surface) of the lower table 10 is dissipated through the through hole 23, and the substrate after bonding can be prevented from being deflected by the negative pressure. Further, in step S27 described above, the lower glass substrate 16 is further separated from the holding surface (surface) of the lower table 10 by the first lifter 21, so that the bonded substrate can be prevented from being deflected and can be appropriately separated from the holding surface (surface) of the lower table 10. As a result, it is possible to prevent the occurrence of unevenness due to deflection of the glass substrate, and it is possible to contribute to the production of a display having no color unevenness by making the display larger, thinner, and finely patterned in the production of a next-generation high-definition display, and it is possible to improve the quality and yield, reduce the cost, and improve the productivity.
Returning to fig. 7, in step S28, the bonded substrate separated from the holding surface (front surface) of the lower table 10 by the first lifter 21 is transferred to a robot, not shown, and is carried out of the vacuum chamber by the robot.
As described above, according to the present embodiment, it is possible to provide a substrate assembling apparatus and a substrate assembling method capable of reducing deflection of a glass substrate.
In addition, according to the present embodiment, unevenness due to deflection of the glass substrate can be prevented, and the present embodiment can contribute to display manufacturing without color unevenness in large-scale, thin-scale, and fine patterning in next-generation high-definition display manufacturing, and can improve quality and yield, reduce cost, and improve productivity.
The present invention is not limited to the above-described embodiments, and various modifications may be included. For example, the above-described embodiments are examples described in detail for easy understanding of the present invention, but the present invention is not limited to the embodiments having all the structures described. Some of the structures of the embodiment may be replaced with structures of other embodiments, and structures of other embodiments may be added to the structures of the embodiment.
Claims (7)
1. A substrate assembling apparatus holds one substrate on a lower table, holds the other substrate on an upper table so as to face the one substrate, bonds the one substrate and the other substrate in a vacuum chamber by an adhesive provided on either substrate,
the substrate assembling apparatus is characterized in that,
an embossed sheet of an elastic body attached by an adhesive is provided on a surface of the upper table and/or the lower table for holding the substrate,
the embossing sheet has a plurality of convex parts and a plurality of concave parts which are adjacently arranged, and the concave partsThe ratio of the width of the part to the width of the upper table and/or the lower table is 10 －6 ～10 －4 The plurality of convex portions and the plurality of concave portions which are arranged adjacently to each other form a wave-shaped cross section,
the plurality of convex parts are arranged in a square grid shape, a triangular grid shape or a staggered grid shape,
and forming a plurality of exhaust flow paths by the plurality of convex parts and the plurality of concave parts.
2. The substrate assembly device of claim 1, wherein,
the embossing sheet is made of polyethylene terephthalate, and the longitudinal section of the embossing sheet is in a wave shape.
3. The substrate assembly device of claim 1, wherein,
the plurality of convex portions and the plurality of concave portions arranged adjacent to each other are formed on an elastic body plate provided on a surface of the upper table and/or the lower table for holding the substrate.
4. The substrate assembly device according to any one of claim 1 to 3, wherein,
the upper table provided inside the chamber is provided with a vacuum adsorption mechanism and a purge gas blowing mechanism, and the vacuum adsorption mechanism is provided with a plurality of adsorption pins on an adsorption pin plate that can move up and down independently of the upper table.
5. A substrate assembly method, comprising:
a step of holding one substrate on a lower table; a step of holding the other substrate on an upper table so as to face the one substrate; and a step of bonding one substrate and the other substrate in a vacuum chamber by using an adhesive provided on either substrate,
the substrate assembling method is characterized in that,
an embossed sheet of an elastic body attached by an adhesive is provided on a surface of the upper table and/or the lower table for holding the substrate,
the embossing sheet has a plurality of convex parts and a plurality of concave parts arranged adjacently to each other, and the ratio of the width of the concave parts to the width of the upper working table and/or the lower working table is 10 －6 ～10 －4 The plurality of convex portions and the plurality of concave portions which are arranged adjacently to each other form a wave-shaped cross section,
the plurality of convex parts are arranged in a square grid shape, a triangular grid shape or a staggered grid shape,
and forming a plurality of exhaust flow paths by the plurality of convex parts and the plurality of concave parts.
6. The method of assembling a substrate according to claim 5, wherein,
the embossing sheet is made of polyethylene terephthalate, and the longitudinal section of the embossing sheet is in a wave shape.
7. The method of assembling a substrate according to claim 6, wherein,
the plurality of convex portions and the plurality of concave portions arranged adjacent to each other are formed on an elastic body plate provided on a surface of the upper table and/or the lower table for holding the substrate.
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| CN202210559552.0A CN115079451B (en) | 2018-07-09 | 2019-07-08 | Substrate assembling device and substrate assembling method |
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| JP2018129801A JP6733966B2 (en) | 2018-07-09 | 2018-07-09 | Board assembly apparatus and board assembly method |
| JP2018-129801 | 2018-07-09 | ||
| CN201910607458.6A CN110703469B (en) | 2018-07-09 | 2019-07-08 | Substrate assembling device and substrate assembling method |
| CN202210559552.0A CN115079451B (en) | 2018-07-09 | 2019-07-08 | Substrate assembling device and substrate assembling method |
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Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1869778A (en) * | 2005-05-25 | 2006-11-29 | 株式会社日立工业设备技术 | Substrate assembling apparatus and substrate assembling method |
| CN1910745A (en) * | 2004-01-16 | 2007-02-07 | 夏普株式会社 | Substrate adsorption device and substrate bonding device |
| CN101075036A (en) * | 2006-05-17 | 2007-11-21 | 株式会社日立工业设备技术 | Substrate assembling apparatus and substrate assembling method using the same |
| JP2008034435A (en) * | 2006-07-26 | 2008-02-14 | Shin-Etsu Engineering Co Ltd | Chuck device for holding substrate |
| JP2009122666A (en) * | 2007-10-26 | 2009-06-04 | Shibaura Mechatronics Corp | Apparatus for bonding substrates and method for bonding substrates |
| CN102169253A (en) * | 2010-02-23 | 2011-08-31 | 株式会社日立工业设备技术 | Liquid crystal substrate bonding system |
| JP5810207B1 (en) * | 2014-11-14 | 2015-11-11 | 株式会社日立製作所 | Board assembly apparatus and board assembly method using the same |
| CN106556939A (en) * | 2015-09-30 | 2017-04-05 | 艾美柯技术株式会社 | Substrate assembly system, base panel assembly apparatus and substrate assembly method |
| JP6255546B1 (en) * | 2016-10-17 | 2017-12-27 | 信越エンジニアリング株式会社 | Vacuum bonding equipment for bonding devices |
Family Cites Families (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5523941A (en) | 1978-08-09 | 1980-02-20 | Agency Of Ind Science & Technol | Immobilization of enzyme using water-soluble photo- crosslinkable resin |
| JPS5654155U (en) | 1979-10-02 | 1981-05-12 | ||
| JPS56112958A (en) | 1980-02-12 | 1981-09-05 | Mitsubishi Rayon Co Ltd | Impact-resistant resin composition |
| JPS6255546U (en) | 1985-09-28 | 1987-04-06 | ||
| JP2002365644A (en) * | 2001-06-08 | 2002-12-18 | Display Technologies Inc | Manufacturing method and manufacturing apparatus of liquid crystal display device |
| JP3819797B2 (en) | 2002-03-27 | 2006-09-13 | 株式会社 日立インダストリイズ | Board assembly equipment |
| JP4131164B2 (en) * | 2002-11-27 | 2008-08-13 | セイコーエプソン株式会社 | Substrate fixing method and display device manufacturing method |
| JP3848942B2 (en) | 2003-10-31 | 2006-11-22 | 株式会社 日立インダストリイズ | Substrate assembly method and apparatus |
| TW200606501A (en) * | 2004-04-09 | 2006-02-16 | Shinetsu Eng Co Ltd | Adhesive chuck device |
| KR100920384B1 (en) * | 2005-12-28 | 2009-10-07 | 주식회사 에이디피엔지니어링 | Lift pin module of fpd manufacturing machine |
| JP4417432B1 (en) * | 2009-02-17 | 2010-02-17 | 信越エンジニアリング株式会社 | Work transfer device and vacuum bonding method |
| JP2012247507A (en) * | 2011-05-25 | 2012-12-13 | Shibaura Mechatronics Corp | Substrate bonding device |
| JP2013055093A (en) * | 2011-09-01 | 2013-03-21 | Creative Technology:Kk | Adhesive chuck device and adhesion holding method of work-piece |
| KR101553801B1 (en) * | 2013-03-29 | 2015-09-30 | 도오꾜오까고오교 가부시끼가이샤 | Attachment method |
| KR102215641B1 (en) * | 2013-12-18 | 2021-02-16 | 주성엔지니어링(주) | Lift pin assembly and substrate processing apparatus having the same |
| JP5654155B1 (en) * | 2014-04-04 | 2015-01-14 | 信越エンジニアリング株式会社 | Work bonding machine |
| WO2016084703A1 (en) * | 2014-11-25 | 2016-06-02 | 旭硝子株式会社 | Substrate bonding device, substrate bonding method, and electronic device manufacturing method |
| CN115284718A (en) * | 2015-04-09 | 2022-11-04 | 信越工程株式会社 | Manufacturing device for bonding equipment |
| JP6659307B2 (en) | 2015-10-30 | 2020-03-04 | Ａｉメカテック株式会社 | Board assembly apparatus, board assembly system using the apparatus, and board assembly method using the system |
-
2018
- 2018-07-09 JP JP2018129801A patent/JP6733966B2/en active Active
-
2019
- 2019-06-18 TW TW110106311A patent/TWI826773B/en active
- 2019-06-18 TW TW108121043A patent/TWI723426B/en active
- 2019-07-08 CN CN201910607458.6A patent/CN110703469B/en active Active
- 2019-07-08 CN CN202210559552.0A patent/CN115079451B/en active Active
- 2019-07-08 KR KR1020190082079A patent/KR102307344B1/en active IP Right Grant
-
2021
- 2021-09-24 KR KR1020210126404A patent/KR20210120946A/en active Application Filing
-
2023
- 2023-10-25 KR KR1020230143826A patent/KR102691362B1/en active IP Right Grant
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1910745A (en) * | 2004-01-16 | 2007-02-07 | 夏普株式会社 | Substrate adsorption device and substrate bonding device |
| CN1869778A (en) * | 2005-05-25 | 2006-11-29 | 株式会社日立工业设备技术 | Substrate assembling apparatus and substrate assembling method |
| CN101075036A (en) * | 2006-05-17 | 2007-11-21 | 株式会社日立工业设备技术 | Substrate assembling apparatus and substrate assembling method using the same |
| JP2008034435A (en) * | 2006-07-26 | 2008-02-14 | Shin-Etsu Engineering Co Ltd | Chuck device for holding substrate |
| JP2009122666A (en) * | 2007-10-26 | 2009-06-04 | Shibaura Mechatronics Corp | Apparatus for bonding substrates and method for bonding substrates |
| CN102169253A (en) * | 2010-02-23 | 2011-08-31 | 株式会社日立工业设备技术 | Liquid crystal substrate bonding system |
| JP5810207B1 (en) * | 2014-11-14 | 2015-11-11 | 株式会社日立製作所 | Board assembly apparatus and board assembly method using the same |
| CN105607307A (en) * | 2014-11-14 | 2016-05-25 | 株式会社日立制作所 | Substrate assembling apparatus and substrate assembling method using the same |
| CN106556939A (en) * | 2015-09-30 | 2017-04-05 | 艾美柯技术株式会社 | Substrate assembly system, base panel assembly apparatus and substrate assembly method |
| JP6255546B1 (en) * | 2016-10-17 | 2017-12-27 | 信越エンジニアリング株式会社 | Vacuum bonding equipment for bonding devices |
Also Published As
| Publication number | Publication date |
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| CN110703469B (en) | 2022-06-14 |
| KR20230152637A (en) | 2023-11-03 |
| TW202133986A (en) | 2021-09-16 |
| KR102307344B1 (en) | 2021-09-30 |
| KR20200006008A (en) | 2020-01-17 |
| KR102691362B1 (en) | 2024-08-05 |
| TW202005738A (en) | 2020-02-01 |
| TWI723426B (en) | 2021-04-01 |
| CN110703469A (en) | 2020-01-17 |
| KR20210120946A (en) | 2021-10-07 |
| TWI826773B (en) | 2023-12-21 |
| CN115079451A (en) | 2022-09-20 |
| JP2020008725A (en) | 2020-01-16 |
| JP6733966B2 (en) | 2020-08-05 |
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