JP3848942B2 - Substrate assembly method and apparatus - Google Patents

Description

  The present invention relates to a method and an apparatus for assembling a substrate to be bonded to each other by holding the substrates to be bonded in a vacuum chamber so that the substrates are opposed to each other in a reduced pressure atmosphere.

  As a method of manufacturing a liquid crystal display panel, liquid crystal is dropped on one substrate drawn in a pattern with a sealant closed, the other substrate is placed on one substrate, and the upper and lower substrates are brought close to each other in a reduced-pressure atmosphere. There is something to stick together.

  By the way, as an apparatus for bonding substrates together, as described in Patent Document 1, as a method of holding the upper substrate before applying pressure, the upper substrate is held using an adhesive means in the atmosphere, and then the chamber An apparatus is disclosed in which the interior is depressurized and then the substrates are bonded together with a narrow interval between the substrates. As a specific embodiment, the adhesive means includes a method using an adhesive sheet, and a configuration in which an opening is provided in the pressure plate, and an actuator is provided above the pressure plate so that the adhesive member moves up and down the opening. It is disclosed.

JP 2001-133745 A

  In the above prior art, it is disclosed that an adhesive member is provided and supported on the pressure plate side. However, although there is no detailed description regarding the lower table, it is supported using the adhesive member in the same manner as the pressure plate. it is conceivable that. By the way, if both the upper and lower substrates are held using the adhesive member, and the pressure plates are lowered and the substrates are bonded together, the adhesive member can be securely held in the vertical direction, When a non-uniform force is applied to (), a problem arises that the position is easily displaced.

  In particular, when the substrate size is increased, a force does not act uniformly at the time of bonding, and a force may act on the substrate in the horizontal direction. Further, when the application state of the sealing member for bonding the substrates is not uniform, even if a force is applied uniformly, the force may be applied to the substrate in the horizontal direction. In the case where the adhesive is held, there is a problem that when the force is applied in the horizontal direction, the substrates are shifted in the horizontal direction.

  Further, when the upper and lower substrates are held on the entire surface using the adhesive member, the substrate is undulated on the surface of the adhesive material, and is bonded in this state, so that the undulation is not corrected. As a result, display unevenness, seals, blurring, and the like occur, resulting in failure.

  Therefore, the object of the present invention is to prevent the deviation between the substrates in the horizontal direction even when the substrate size is increased and thinned, or the adhesive holding method is used for supporting the substrate, and the undulation is corrected and the high accuracy. An object of the present invention is to provide a substrate bonding apparatus capable of bonding.

  In order to achieve the above object, in the present invention, a plurality of adhesive pads and a plurality of friction pads are arranged on a flat table made of a rigid body, and the substrate is placed on the flat table, thereby correcting the swell, The substrate is held by an adhesive pad and a friction pad and bonded.

  By using suction suction together with adhesive pad and friction pad, horizontal pressure generated due to non-uniform pressure or adhesive non-uniformity when pressure is applied while supporting the upper and lower substrates with vacuum pads in a vacuum state The positional displacement of the substrate due to the direction force can be prevented by the friction pad, and the substrates can be bonded with high accuracy. Further, since almost no deviation occurs, there is no need to repeatedly perform position correction between the substrates at the time of pressurization, and the working time can be shortened.

  Hereinafter, an embodiment of the present invention will be described with reference to the drawings.

  FIG. 1 shows a partial cross-sectional view of one embodiment of a substrate bonding apparatus of the present invention.

  1, the substrate assembly apparatus according to the present invention includes a lower chamber portion T1 and an upper chamber portion T2, and an XYθ drive mechanism (not shown) is provided below the lower chamber portion T1. With this XY drive mechanism, the lower chamber portion T1 can come and go in the left and right X-axis directions and the Y-axis direction orthogonal to the X-axis in the drawing. Further, the table 4 on which the lower substrate 1 a is mounted from the shaft 2 through the vacuum seal 3 can be rotated horizontally with respect to the lower chamber unit 5 by the θ drive mechanism. The table 4 is provided with a plurality of substrate holding mechanisms.

  The substrate holding mechanism includes a plate 41a, a pressure-sensitive adhesive sheet 42a, which is a pressure-sensitive adhesive member fixed on the plate 41a, a vertical drive shaft 60, and a plurality of pressure-sensitive adhesive pads composed of the drive mechanism. That is, the plate 41 a is provided so as to be movable up and down by a drive mechanism (not shown) by the vertical drive shaft 60. The table 4 is provided with a plurality of suction ports 17, which are connected to a negative pressure supply passage. The supply passage is connected to a negative pressure source or a positive pressure source (not shown) via a switching valve. Connected. The lower substrate 1 a is mounted on a substrate holding mechanism provided on the table 4. The mounted lower substrate 1a is sucked and sucked by supplying negative pressure to a plurality of suction ports 17 provided on the table surface. While being sucked and adsorbed, the plate 41a provided with the adhesive sheet 42a is driven (raised), and the adhesive sheet 42a is adhesively fixed by pressing it against the table mounting surface side of the lower substrate 1a with a preset pressing force.

  A friction pad 70 is provided on the end side of the table 4. FIG. 2 shows an arrangement example of the adhesive sheet 42a and the friction pad 70 on the table surface. FIG. 2A shows an example in which a friction pad 70 (friction sheet) is provided in an annular shape so as to surround the periphery on the outer peripheral side of the table (the outer peripheral side of the substrate). In this case, air is not left on the center side of the substrate at the time of suction and adsorption if a cut is provided in a part without surrounding the entire circumference. That is, as shown in FIG. 2B, by arranging a plurality of circular or square friction pads 70 at predetermined intervals, it is difficult for air to remain on the center side of the substrate during suction holding. In addition to providing the friction pads 70 on the outer peripheral side as shown in FIG. 2B, the effect of the friction pads 70 can be increased by arranging a plurality of friction pads 70 between the adhesive pads.

  FIG. 3 shows an example of the shape of the surface of the adhesive sheet 42a. In this embodiment, the pressure-sensitive adhesive sheet 42a has a configuration in which a plurality of substantially hexagonal convex portions (projections) are provided. Each corner of the hexagon is cut out so that no residual air is generated in the interior (recessed portion) when evacuated. In addition, the arrangement | positioning shape of a convex part is not restricted to a hexagonal system, If it is comprised in the polygon of 3 or more strokes, and it is set as the shape which cut off each corner | angular part, a board | substrate can be held reliably.

  The upper chamber portion T2 has a configuration in which an upper chamber unit 6 and a pressure plate 7 are provided therein, and the upper chamber unit 6 and the pressure plate 7 can move up and down independently. That is, the upper chamber unit 6 has a housing 8 incorporating a linear bush and a vacuum seal, and is vertically moved by a cylinder fixed to a frame provided across a column provided on a gantry (not shown) with a shaft 9 as a guide. Move in the Z-axis direction. The pressure plate 7 is moved up and down (Z-axis direction) by a driving device (not shown) provided on the shaft 9. A substrate holding mechanism for the pressure plate is provided on the surface of the pressure plate 7 that faces the table 4. This substrate holding mechanism has a structure in which an iron plate 41b is provided on the pressure plate 7 side and an adhesive sheet 42b is provided on the table 4 side.

  Although not shown, the pressure plate 7 is provided with a plurality of suction ports for suction and suction. This suction port is also provided so as to communicate with the iron plate 41b and the adhesive sheet 42b which are substrate holding mechanisms. The upper substrate 1b is sucked and adsorbed by a suction port provided on the lower surface of the adhesive sheet 42b. The suction port is connected to one end of a pipe provided on the pressure plate side, and a negative pressure source is connected to the other end of the pipe via a valve (not shown). By supplying a negative pressure from the negative pressure source, the upper substrate 1b is sucked and adsorbed on the surface of the adhesive sheet 42b and fixed by adhesion.

  This pressure plate side substrate holding mechanism pushes the end surface of the iron plate 41b through a plurality of magnets arranged in the pressure plate 7, a positioning stopper 44b, and a bracket 46b provided on the pressure plate 7. The pressure plate 7 is positioned and held by the screw 45b.

  When the lower chamber T1 on the XYθ drive mechanism moves directly below the upper chamber T2 and the upper chamber unit 6 is lowered, the flange of the upper chamber unit 6 is attached to the O-ring 12 arranged around the lower chamber unit 5. Contact and become one. Thereby, it will be in the state which functions as a vacuum chamber. Here, the ball bearing 13 installed around the lower chamber unit 5 adjusts the amount of collapse of the O-ring 12 by vacuum, and can be set at an arbitrary position in the vertical direction. The position of the ball bearing 13 is set so that the collapse amount of the O-ring 12 can keep the inside of the vacuum chamber in a predetermined reduced pressure state and the maximum elasticity is obtained. A large force generated by reducing the pressure in the chamber is received by the lower chamber unit 5 via the ball bearing 13. Therefore, the lower chamber portion T1 can be easily finely moved within the elastic range of the O-ring 12 and precisely positioned when the upper and lower substrates to be described later are bonded together.

  The housing 8 moves up and down without causing a pressure leak with respect to the shaft 9 even if the upper chamber unit is deformed by depressurizing the inside by forming the vacuum chamber by combining the upper chamber unit 6 with the lower chamber unit 5. Built-in vacuum seal so that you can. For this reason, the force which the deformation | transformation of a vacuum chamber gives to the shaft 9 can be absorbed, and the deformation | transformation of the pressurization plate 7 supported by the shaft 9 can be prevented substantially. For this reason, it is possible to bond the upper substrate 1b, which is bonded and fixed to the lower surface of the pressure plate 7 with the adhesive sheet 42b, and the lower substrate 1a, which is held on the adhesive sheet 42a on the table 4, in a parallel state. It becomes. As described above, the pressure plate 7 is moved up and down by a drive mechanism (not shown) installed on the upper portion of the shaft 9.

A vacuum pipe (not shown) is provided on the side surface of the upper chamber unit 6, and this pipe is connected to a negative pressure source by a vacuum valve and a pipe hose (not shown). These are used when the pressure in the vacuum chamber is reduced to a predetermined pressure. Similarly, a leak valve is provided on the upper chamber side. This leak valve is provided to arbitrarily adjust the degree of vacuum (decompression) in the vacuum chamber in the pressure increasing direction. Further, in order to return the inside of the vacuum chamber to the atmospheric pressure, a tube provided with a vent valve is provided, so that compressed gas is supplied from a pressure source such as nitrogen gas (N ₂ ) or clean dry air.

  In addition, an image recognition camera or the like is provided for substrate alignment.

  Further, the pressure plate 7 is provided with a peeling mechanism in order to peel the adhesive sheets 42b provided respectively from the substrate surface. In this peeling mechanism, a pin support plate 55 provided with a plurality of push pins 48 projecting to the pressure surface side inside the pressure plate 7 is provided on a pressure spring plate 56 n of the pressure plate 7. 54 and a pin support plate stopper 53 so as to be movable up and down. A receiving plate 57 is provided on the upper side of the pin support plate 55 (on the side opposite to the pressing surface side), and the cylinder 50 is attached to the driving plate provided on the shaft 9 for driving the pressing plate. By pressing the pin support push rod 51 that expands and contracts by the above, the surface of the substrate 1 is pushed by the push pin 48, and the adhesive member 42b is peeled off from the substrate surface. Further, a seal member 52 is also provided between the pin support plate push bar 51 and the upper chamber unit 6 so that the decompressed state in the chamber can be maintained.

  The upper substrate 1b can be held in close contact with the lower surface of the pressure-sensitive adhesive sheet 42b without being sucked and sucked to the lower surface of the pressure plate 7 by its adhesive action. That is, the adhesive sheet 42b is formed with an appropriate adhesive area, interval, and position in accordance with the size and shape of the upper substrate 1b so that the upper substrate 1b can be held horizontally facing the lower substrate 1a. ing. In the present embodiment, the lower substrate 1 a has a support structure similar to that of the upper substrate with respect to the table 4.

  Next, the process of bonding the substrates will be described with reference to FIG. FIG. 4 is a flowchart of the bonding procedure. First, the upper substrate 1b is carried in by a robot hand or the like (S1), and is held by adhesion and suction adsorption to the adhesive sheet 42b under the pressure plate 7 (S2). As described above, since suction is applied by applying a negative pressure to the suction port and the adhesive sheet 42b is adhered and held, suction is performed as compared with the case where the substrate is held only by adhesion without being sucked and absorbed. The probability of the air layer remaining between the substrate and the adhesive sheet is reduced due to the negative pressure. If the pressure around the substrate is reduced from a state where there is an air layer, the air remaining between the pressure-sensitive adhesive sheet 42b and the upper substrate 1b may expand, and the pressure-sensitive adhesive force may be reduced, causing the upper substrate 1b to fall. In the embodiment described above, the surface of the adhesive sheet that contacts the substrate is in a flat state. Therefore, in order to further increase the safety against dropping the substrate, a plurality of convex portions are formed on the adhesive sheet surface so that the concave portions communicate with the outside of the substrate within a range larger than the substrate. This prevents negative pressure from acting on the adhesive surface to create a residual air layer, and even if there is a residual air layer, even if the residual air layer expands by decompressing the surroundings, The air easily escapes from the recesses to the outside of the substrate. In this method, the suction port for sucking and sucking the substrate is preferably formed on the concave surface side. As another method, by forming a range of irregularities and grooves slightly smaller than the outer periphery of the substrate, forming a suction port on the concave surface, and sucking air from the concave surface, a suction force is generated between the convex portion of the adhesive member and the substrate. A force may be applied to ensure that the adhesive force acts on the substrate. Thereby, a board | substrate fall can also be prevented. In this case, if the suction port is formed on the convex surface, the air remaining on the convex surface and expanded is sucked not only from the concave surface but also from the convex surface, which is more effective.

  The lower substrate 1a is also carried in by a robot or the like (S3) and placed on the surface of the table 4, and then the plate 41a provided with the vacuum suction force and the adhesive sheet 42b is raised to the extent that it protrudes on the table surface to hold the adhesive. At the same time, it is fixed using vacuum suction (S4). In the present embodiment, an adhesive 19 for dropping the liquid crystal 20 and sealing the periphery is applied in advance to the lower substrate side. Again, when the pressure around the substrate is reduced, the air remaining between the pressure-sensitive adhesive sheet 42a and the lower substrate 1a expands, and the lower substrate 1a may be violated. Protrusions and grooves are formed. Further, the substrate 1 a is placed so as to be positioned on the friction pad 70.

  From this state, as shown in FIG. 1, the lower chamber portion T1 on the XYθ drive mechanism moves immediately below the upper chamber portion T2 (S5). The lower substrate 1a and the upper substrate 1b face each other, the upper chamber unit 6 is lowered, the flange of the upper chamber unit 6 is brought into contact with the O-ring 12 arranged around the lower chamber unit 5, and the upper and lower chamber portions T1 and T2 are moved. It unites (S6). Thereafter, vacuum exhaust is performed from the vacuum pipe (S7). As the pressure reduction in the vacuum chamber in which the upper chamber unit 6 and the lower chamber unit 5 are integrated proceeds, the difference between the pressure reduction degree that adsorbs the upper substrate 1b from the pressure plate 7 and the pressure reduction degree in the vacuum chamber becomes smaller. The suction adsorption action from 7 disappears. However, the upper substrate 1b is adhesively held by the adhesive sheet 42b. At this time, since the above-mentioned convex portions and grooves are formed on the pressure-sensitive adhesive surface of the pressure-sensitive adhesive sheet 42b, problems such as a decrease in pressure-sensitive adhesive force due to the expansion of air and a drop of the upper substrate 1b do not occur during decompression. Moreover, since the above-mentioned convex part and groove | channel are formed also in the adhesive surface of the adhesive sheet 42a with respect to the lower board | substrate 1a, the fall of the adhesive force by expansion | swelling of air does not generate | occur | produce during pressure reduction. Furthermore, since the friction pad 70 is provided on the outer peripheral side of the substrate, the lower substrate 1a does not run out due to the action of the adhesive and the friction pad 70.

  When the inside of the vacuum chamber reaches a predetermined degree of decompression, the upper and lower substrates 1b and 1a are aligned, the vertical drive mechanism (not shown) on the shaft 9 is operated to lower the pressure plate 7, and the upper and lower substrates are lowered. 1b and 1a are bonded together with a desired pressure (S8).

  Incidentally, in the alignment between the substrates, first, the alignment marks provided on the upper and lower substrates are read by the image recognition camera provided in the upper chamber unit 6. The image processing unit performs image processing on the image signal sent from the camera to measure the mark position, and finely moves an XYθ drive mechanism (not shown) of the lower chamber T1 to perform high-precision alignment. In this fine movement, the ball bearing 13 maintains the space between the upper and lower chamber units 6 and 5 so that a desired reduced pressure state is maintained without the O-ring 12 being extremely deformed.

  When bonding is performed by lowering the pressure plate 7, if the friction pad 70 is not provided on the table 4, if the pressing force of the substrate is not uniform or the adhesive 19 is not applied uniformly. A force is applied to the substrate in the horizontal direction to cause a displacement of the substrate. That is, the adhesive force can hold the substrate firmly in the vertical direction, but easily moves in the front-rear and left-right directions (horizontal direction). For this reason, when the adhesive is held, the friction pad 70 is required to prevent the substrate from moving in the horizontal direction.

  After the bonding is completed, the operation proceeds to the operation for peeling the adhesive sheet 42b from the upper substrate side, that is, the cell. First, the substrate is temporarily fixed by a spot UV device, the push shaft 51 is lowered by the actuator 50 with respect to the upper substrate 1b, and the receiving plate 57 provided on the pin support plate 55 is pushed, whereby a plurality of push pins 48 are formed. The upper substrate 1b surface bonded with a predetermined pressure is pressurized (S9), and the pressure plate 7 is raised in this state (S10). At this time, since the push shaft 48 presses the upper substrate 1b of the cell pc downward while pressing it with a predetermined pressure, the adhesive sheet 42b can be peeled off from the upper substrate 1b (this peeling method will be referred to as pressurization thereafter). (Referred to as peeling) (S11). Thereafter, the push shaft 51 is raised and separated from the upper substrate 1b of the cell pc (S12). Next, the inside of the chamber is returned to the atmosphere, and the upper chamber unit 6 is raised (S13). The remaining cell pc can be peeled off by lowering the lower drive shaft 60 and moving the adhesive sheet 42a below the table surface (S14). Thereafter, the bonded liquid crystal substrate (liquid crystal cell pc) is moved out of the lower chamber and unloaded (S15).

  As another method, after the pasting, the atmosphere is released while the upper and lower substrates are in contact with each other (temporarily fixed by spot UV). Since the atmospheric pressure has an adhesive recess, it is uniformly applied to the entire surface of the substrate, and the upper and lower substrates are pressurized to the final gap. The movement of the upper substrate when the gap is narrowed can be followed according to the collapse of the seal and the liquid crystal even if the pressure table does not move due to the elasticity of the adhesive on the pressure table side. When the inside of the chamber rises to a predetermined pressure after being released to the atmosphere, the lower adhesive pad is lowered and peeled off. After the lower substrate is peeled off, the push shaft 51 is lowered by the actuator 50 with respect to the upper substrate 1b and stopped at a position 0.1 mm away from the upper substrate. Next, with the position of the push pin fixed, the pressure table is raised and the bonded substrate is peeled from the pressure-sensitive adhesive sheet of the pressure table.

  As described above, in this embodiment, the pressure plate side is attached to the mounting plate and the mounting plate is fixedly supported on the pressure plate, and the table side is moved up and down the pressure sensitive sheet provided on the vertical drive shaft. It explained by the method of supporting. In the previous embodiment, the friction pad is not provided on the pressure plate side. However, if a plurality of friction pads are provided on the substrate end side of the pressure plate, further movement of the substrate in the horizontal direction during pressurization can be prevented. It becomes possible, and high-precision bonding can be performed in a short time.

  Further, the pressure plate 7 may be configured to include a plurality of adhesive pads and a plurality of friction pads as provided on the table 4. Furthermore, if the friction pad is also inclined and arranged in a direction toward the center of the table or the pressure plate, when the substrate is installed, a force acts toward the center side, and the lateral displacement can be reliably prevented.

  As described above, in the present invention, at least one of the pressure plate and the table is provided with the suction suction mechanism including a plurality of suction holes, and the substrate holding mechanism including the sheet-like adhesive member and the friction pad, and the substrate in the atmosphere. If the substrate is held with adhesive force even if the suction adsorption force decreases during the process of depressurizing the inside of the chamber, the horizontal Even if a force is applied, the substrates do not deviate from each other, and the primary bonding of the substrates can be performed with high accuracy.

  Furthermore, after the primary bonding is completed, the substrate can be peeled off from the pressure plate (adhesive member) using a peeling mechanism having a plurality of push pins, and then the atmosphere can be secondarily pressurized by introducing air. By pulling the adhesive pad from the table surface to the lower side of the table after the next pressurization, the substrate can be reliably peeled from the adhesive pad.

  In addition, in the state which maintained the pressurization state, air | atmosphere is introduce | transduced and secondary pressurization is performed. At this time, each adhesive holding surface is provided with a notch so that gas can pass through. Atmospheric pressure is introduced from this portion to apply atmospheric pressure to the substrate surface, and secondary pressurization can be performed. Thereafter, the adhesive pad is pulled from the table surface and peeled off, and the peeling pin is moved from the pressure plate side to a position of 0.1 mm from the substrate surface, and in this state, the pressure plate is lifted to release the pressure plate surface (adhesive surface). The substrate (cell) can be peeled off. As described above, there are a plurality of methods for peeling the adhesive member from the substrate, but any procedure is possible as long as the adhesive member can be peeled off without damaging the completed cell.

It is a fragmentary sectional view of the board | substrate bonding apparatus of this invention. It is the figure which showed the example of arrangement | positioning of the adhesive sheet and friction pad which were provided in the table surface. It is the figure which showed an example of the shape of the adhesive pad surface. It is the flowchart which showed an example of the bonding operation | movement procedure of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1a ... Lower substrate, 1b ... Upper substrate, 4 ... Table, 5 ... Lower chamber unit, 6 ... Upper chamber unit, 7 ... Pressure plate, 17 ... Suction port, 12 ... O-ring, 41b ... Iron plate, 42a, 42b ... Adhesive sheet, 43b ... magnet, 47b ... push pin, 48b ... actuator, 70 ... friction pad.

Claims (5)

Adhesive provided on at least one of the substrates by holding one substrate to be bonded in the vacuum chamber by applying an adhesive force to the lower surface of the pressure plate and holding the other substrate to be bonded on the table In the method of assembling the substrates to be bonded together by narrowing the interval in vacuum,
The one substrate is held by an adhesive holding mechanism that is detachably attached to the pressure plate, and the other substrate is provided with a plurality of adhesive pads and a plurality of friction pads in the vicinity of the outer periphery of the table so as to surround the plurality of adhesive pads. After holding and pasting both substrates, the substrate is peeled off from the adhesive holding mechanism provided on the pressure plate, and the vacuum pad is released to the atmosphere, and then the adhesive pad on the table is retracted. A method for assembling a substrate, wherein the substrate is peeled off from the adhesive pad of the other substrate bonded together. Adhesive provided on at least one of the substrates by holding one substrate to be bonded in the vacuum chamber by applying an adhesive force to the lower surface of the pressure plate and holding the other substrate to be bonded on the table. In the method of assembling the substrates to be bonded together by narrowing the interval in a vacuum,
A table in which the one substrate is held by an adhesive holding mechanism detachably attached to the pressure plate, and the other substrate is provided with a plurality of adhesive pads and a plurality of friction pads in the vicinity of the outer periphery of the table so as to surround the adhesive pads. After holding and aligning and bonding the two substrates, hold the adhesive and release it to the atmosphere while aligning it, and release the adhesive pad on the table during or after release to the atmosphere. A method for assembling a substrate, comprising: peeling an adhesive pad from the substrate and peeling the substrate from an adhesive holding mechanism provided on a pressure plate. A pressure plate that holds one substrate above the vacuum chamber, and a table that holds the other substrate to be bonded below the vacuum chamber. The two substrates face each other and are attached to at least one of the substrates. In a board assembly apparatus that bonds substrates together by reducing the distance between both boards in a reduced-pressure atmosphere with an agent,
A plurality of adhesive pads for holding the other substrate on the table, and a plurality of friction pads are arranged so as to surround the adhesive pad in the vicinity of the outer periphery of the table, and the adhesive pads protrude from the table surface and are inside the table surface A board assembly apparatus comprising a drive mechanism for retracting to the board. In the board | substrate assembly apparatus of Claim 3,
A substrate assembly apparatus, wherein the pressure plate is also provided with a plurality of friction pads around the adhesive holding mechanism. The board assembly apparatus according to claim 3 or 4,
The pressure plate and the table are provided with a plurality of suction ports for suction and suction, and the suction holding mechanism provided on the pressure plate is also penetrated to the substrate suction side so as to communicate with the suction port. A substrate assembly apparatus, wherein holes are provided, and the table is provided with suction suction ports in portions other than the adhesive pads and friction pads.

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