KR20200006008A - Substrate assembly apparatus and substrate assembly method - Google Patents

Abstract

The present invention provides a substrate assembly device and a substrate assembly method, capable of reducing bending of a substrate. The substrate assembly device (1) holds the substrate of one side on a lower table (10). The substrate of the other side is held by facing the substrate of the one side, and the substrate assembly device performs bonding in a vacuum chamber using an adhesive installed on the substrate of the one side. A second lifter installed to be densely arranged with a first lifter loosely arranged is installed on the surface holding the substrate of the lower table (10). After the substrate ascends to a predetermined height by the second lifter, the substrate additionally ascends by the first lifter. Multiple convex units and concave units are arranged to be adjacent to each other and are installed on the surface holding the substrate of the upper table (9) and/or the lower table (10). The width of the concave unit has the ratio of 10^-6 to 10^-5, about the width of the upper table (9) and/or the width of the lower table (10).

Description

Board assembly device and board assembly method {SUBSTRATE ASSEMBLY APPARATUS AND SUBSTRATE ASSEMBLY METHOD}

This invention relates to the board | substrate assembly apparatus which manufactures a liquid crystal display, an organic electroluminescent display, etc. which bond a board | substrate in vacuum, and a board | substrate assembly method.

As a technique related to a substrate assembly apparatus for joining a substrate in a vacuum, for example, Patent Document 1 discloses that the upper substrate and the lower substrate are varied by varying the separation distance between the upper substrate and the lower substrate by vertically moving the upper substrate during the vacuuming step. Disclosed is a substrate assembly apparatus for efficiently removing gas from a lower substrate.

Moreover, in patent document 2, the workpiece | work joining apparatus provided with the antistatic means by the table is proposed.

In patent document 3, in order to reduce the deformation | transformation by the adiabatic compression and temperature change of a table, a plurality of convex part and a concave part are formed in the surface of the 1st and 2nd holding member which contact | connects the non-joint surface of a workpiece | work. The vacuum bonding apparatus which suppresses the influence of the temperature change by the adiabatic expansion or adiabatic compression in a micro space to the workpiece | work by making the exhaust gas at the time of pressure reduction (vacuumization) favorable is disclosed.

Moreover, in patent document 4, the board | substrate assembly apparatus which provided the unevenness | corrugation and the groove | channel in the sheet surface in order to improve the problem of the lower substrate position shift by the residual air expansion on the lower table side under reduced pressure is disclosed.

Patent Literature 5 discloses a substrate assembling apparatus which can be bonded with good accuracy without any deviation caused by the peeling pin up-down mechanism or the adhesive pad up-down mechanism.

Japanese Patent Application Laid-Open No. 2017-80868 Japanese Patent 5565155 Japanese Patent No.6255546 Japanese Patent Laid-Open No. 2003-283185 Japanese Patent Laid-Open No. 2005-134687

However, in recent years, the enlargement of the glass substrate bonded together in a vacuum advances, and in the granulation apparatus disclosed by patent document 1-patent document 3, the static electricity by which the air which remains in the table groove etc. at the time of vacuumization exhausts at high speed. The warpage which generate | occur | produces or arises in a glass substrate is feared.

In addition, also in the assembling apparatus disclosed in patent document 4 and patent document 5, generation | occurrence | production of the curvature in the board | substrate raising operation | movement by speed-up is insulated.

Therefore, this invention provides the board | substrate assembly apparatus and board | substrate assembly method which can reduce the curvature of a board | substrate.

In order to solve the said subject, the board | substrate assembly apparatus which concerns on this invention hold | maintains one board | substrate on the lower table, hold | maintains the other board | substrate on the upper table facing the said one board | substrate, and provided in either board | substrate. A substrate assembly apparatus for bonding in a vacuum chamber by an adhesive, the substrate assembly apparatus comprising: a plurality of convex portions and recesses arranged adjacent to each other on a surface holding the substrate of the upper table and / or the lower table, the width of the recess with respect to which the table top and / or width of the lower table, is characterized in that the proportion of the 10 ^-6 to 10 ^-4.

In the substrate assembly apparatus according to the present invention, the plurality of convex portions and the concave portions arranged adjacent to each other are formed of an embossed sheet, and are attached to the surface holding the substrate of the upper table and / or the lower table by an adhesive. It is characterized by being.

In the board | substrate assembly apparatus which concerns on this invention, the said embossed sheet is a polyethylene terephthalate agent, and a longitudinal cross section is a wave shape. It is characterized by the above-mentioned.

The board | substrate assembly apparatus which concerns on this invention is formed with the elastic plate provided in the surface which hold | maintains the said board | substrate of the said upper table and / or the said lower table, the some convex part and the recessed part arrange | positioned adjacent to each other are characterized by the above-mentioned. .

A substrate assembly apparatus according to the present invention includes a vacuum adsorption mechanism and a purge gas blow mechanism provided with a plurality of adsorption pins on an adsorption pin plate capable of vertically moving up and down independently of the upper table on the upper table provided inside the chamber. It is characterized by including.

Moreover, the other board | substrate assembly apparatus which concerns on this invention hold | maintains one board | substrate on a lower table, hold | maintains the other board | substrate on the upper table facing the said board | substrate, and vacuums with the adhesive agent provided in any one board | substrate. A substrate assembly apparatus for joining in a chamber, comprising: a first lifter and a second lifter, the second lifter being able to penetrate the lower table, and after raising the substrate by a predetermined amount by the second lifter, It is characterized by further raising the substrate by one lifter.

Another substrate assembly apparatus according to the present invention is characterized in that the first lifter is coarsely arranged and the second lifter is densely arranged.

The other board assembly apparatus which concerns on this invention is characterized in that the said 1st lifter arrangement is coarser than the said 2nd lifter arrangement.

The other board | substrate assembly apparatus which concerns on this invention is characterized in that the amount of rise of the said board | substrate by a said 1st lifter is larger than the amount of rise of the board | substrate by a said 2nd lifter.

The other board | substrate assembly apparatus which concerns on this invention is characterized in that the raise amount of the said board | substrate by a said 1st lifter is about 33 times-200 times the amount of a raise of the board | substrate by a said 2nd lifter.

According to another substrate assembling apparatus according to the present invention, the lower table includes a through hole through which the second lifter can pass, and when the substrate is lifted by a predetermined amount by the second lifter, the inner peripheral surface of the through hole and the first hole are raised. The purge gas or the atmosphere penetrates into the back surface of the substrate from the gap with the outer circumferential surface of the two lifters.

Moreover, the board | substrate assembly method which concerns on this invention is a process of hold | maintaining one board | substrate on the lower table, the process of holding the other board | substrate facing the said one board | substrate to the upper table, and the adhesive agent provided in any one board | substrate. A substrate assembling method having a process of bonding in a vacuum chamber by means of: a plurality of convex portions and concave portions disposed adjacent to each other on a surface holding the substrate of the upper table and / or the lower table; The width of the portion is a ratio of 10 ⁻⁶ to 10 ⁻⁴ with respect to the width of the upper table and / or the lower table.

Moreover, the other board | substrate assembly method which concerns on this invention provided the process of holding one board | substrate on the lower table, the process of holding the other board | substrate facing the said one board | substrate to the upper table, and provided in any one board | substrate. A substrate assembling method having a process of bonding in a vacuum chamber by an adhesive, the substrate assembling method comprising: a second lifter densely arranged with a coarse first lifter, the second lifter being able to penetrate the lower table; After the substrate is raised by a predetermined amount by a second lifter, the substrate is further raised by the first lifter.

According to this invention, it becomes possible to provide the board | substrate assembly apparatus and board | substrate assembly method which can reduce the curvature of a glass substrate.

Objects, configurations, and effects other than those described above will be apparent from the description of the following embodiments.

1 is a schematic configuration diagram of a substrate assembly apparatus of Embodiment 1 according to an embodiment of the present invention.
It is explanatory drawing of the guide mechanism which comprises the board | substrate assembly apparatus shown in FIG.
It is a schematic explanatory drawing of an adhesive pin mechanism.
It is a longitudinal cross-sectional view of the elastic body of the upper table and lower table surface shown in FIG.
FIG. 5 is a flowchart illustrating an operation flow of the substrate assembly apparatus shown in FIG. 1.
6 is a schematic view of a substrate assembly apparatus according to a second embodiment according to another embodiment of the present invention, which is a top view and a side view of a lower table.
7 is a flowchart illustrating an operation flow of the substrate assembly apparatus according to the second embodiment.
FIG. 8: is a longitudinal cross-sectional view which shows the state which raised the lower glass substrate by predetermined amount with the 2nd lifter shown in FIG.
It is a longitudinal cross-sectional view which shows the state which raised the lower glass substrate by predetermined amount with the 1st lifter shown in FIG.

In this specification, although the glass substrate is demonstrated as an example as a board | substrate to bond in a vacuum, the board | substrate to bond is not limited to a glass substrate.

EMBODIMENT OF THE INVENTION Hereinafter, the Example of this invention is described using drawing.

Example 1

1 is a schematic configuration diagram of a substrate assembly apparatus of Embodiment 1 according to an embodiment of the present invention. As shown in FIG. 1, the board | substrate assembly apparatus 1 uses the mount 15 and the upper frame 5 as a rigid body support member, and the upper chamber 7 and the lower chamber 8 inside it. Equipped. In addition, the upper frame 5 is provided on the upper frame 5 by rotationally driving the ball screw 2b of the Z-axis driving motor 2a constituting the Z-axis driving mechanism 2 provided on the mount 15 side. The upper frame 5 is moved up and down with respect to the mount 15 via the ball screw accommodating part 2c. Four sets of guide mechanisms 3 are provided when the upper frame 5 moves up and down.

Explanatory drawing of the guide mechanism which comprises the board | substrate assembly apparatus shown in FIG. 1 is shown in FIG. In FIG. 2, some sectional drawing of the guide mechanism 3 is shown. As shown in FIG. 2, the linear moving part 3b is provided in the beam 18 fixed to the upper frame 5 side by the two linear guides 3a to the beam 17 fixed to the mount 15 side. have. As shown in FIG. 2, one guide surface is combined so that it may become perpendicular | vertical to the other guide surface.

Returning to FIG. 1, above the mount 15, the several lower shaft 12 for supporting the lower table 10 is attached. Each lower shaft 12 protrudes into the lower chamber 8 via a vacuum seal (not shown) in order to maintain airtightness in the lower chamber 8. In addition, an XYθ moving unit 13 configured to be movable independently in the XYθ direction is mounted between each lower shaft 12 and the lower table 10. In addition, the XYθ moving unit 13 may be configured by a mechanism using a ball bearing or the like which is fixed in the vertical direction and freely movable in the horizontal direction. In the horizontal direction (X, Y direction) of the lower table 10, a plurality of lower table horizontal drive mechanisms not shown in the drawing are provided on the outside of the lower chamber 8, and the lower table side surface (lower table is an axis provided in the drive mechanism). It is configured to be able to perform positioning in the XYθ direction by pressing the thickness direction).

In addition, the lower chamber 8 and the upper chamber 7 are configured to be divided, and the connecting portion is provided with a sealing not shown in the drawing, whereby the upper chamber 7 and the lower chamber 8 are united together. This prevents the leakage of air when exhausting the inside.

The load cell 4 is provided in the connection part of the upper frame 5 and the Z-axis drive mechanism 2, respectively. Inside the upper frame 5, the upper chamber 7 is attached. The upper chamber 7 is structured to be suspended from the upper frame 5 by the support shaft 6c and the bracket 7b. The upper chamber 7 is moved downward by moving the upper frame 5 up and down. It can be separated from (8). In addition, the upper frame 5 is provided with a plurality of upper shafts 6 in the upper chamber 7 to support the upper table 9. The upper shaft 6 and the upper chamber 7 are connected by a vacuum seal to maintain the airtight in the chamber. In addition, the upper table 9 is fixed to the upper shaft 6, and has a structure capable of detecting the force when the glass substrate is pressed by the load cell 4. Moreover, the Z-axis drive mechanism 2 is able to move the upper chamber 7 and the upper table 9 up and down, and for this reason, the support shaft 6c which provided the upper chamber 7 in the upper frame 5 was carried out. And the support shaft (upper shaft 6) which provided the upper table 9 in the upper frame 5, respectively. For this reason, when the upper chamber 7 is integrated into the lower chamber 8, the support shaft 6c of the upper chamber 7 acts to move downward from the upper chamber 7 to the lower chamber 8. In order to avoid that, it has a support structure with a margin. That is, the bracket 7b of predetermined height is attached to the upper chamber 7 upper part, and the flange part touches the front-end | tip of the support shaft 6c of the upper chamber 7 inside the bracket 7b. When lifting the upper chamber 7, the flange portion of the support shaft 6c is in contact with (contacts with) the bracket 7b so that the upper chamber 7 and the upper table 9 can be moved upward in an integral manner. That is, when the upper shaft 6 is raised and the upper table 9 is moved upwards by a predetermined amount in the upper chamber 7, the flange portion of the support shaft 6c abuts against the bracket 7b. The table 9 and the upper chamber 7 move upward together. In addition, the upper chamber 7 and the upper table 9 move integrally, and the upper chamber 7 and the lower chamber 8 until the upper chamber 7 moves downward to become integral with the lower chamber 8. ) Is integrated, the upper table 9 can move independently to the lower table 10 side.

As described above, in the present embodiment, since the upper table 9 and the lower table 10 are disposed apart from the upper chamber 7 and the lower chamber 8, when the inside of the chamber is depressurized, Although the deformation | transformation is not carried out, this deformation | transformation is not transmitted to the upper table 9 and the lower table 10, and a glass substrate can be hold | maintained horizontally.

The upper table 9 is provided with a steel elastic plate 11. The elastic body 11a is provided in the whole surface which contacts the glass substrate of the elastic body plate 11. The elastic body plate 11 is fixed by the magnetic force of the several magnet embedded in the upper table 9, and screwing, and is comprised so that replacement is possible. Here, the upper table 9 is made of, for example, an aluminum alloy, and is omitted in FIG. 1, but the lower table 10 is also provided with an elastic elastomer plate 11 similarly, and the elastic plate 11 is provided. The elastic body 11b is provided in the whole surface in contact with the glass substrate of the. In addition, in this embodiment, although the elastic plate 11 and the elastic body 11a are provided in the upper table 9, the structure which provides the elastic plate 11 and the elastic body 11b in the lower table 10 is shown. It is not necessarily limited thereto. That is, it is good also as a structure which provides an elastic body plate and an elastic body only in any one of the upper table 9 or the lower table 10. FIG.

3 is a schematic explanatory diagram of an adhesive pin mechanism. As shown in FIG. 3, on the upper chamber 7 or the upper frame 5, the adhesive pin drive mechanism 14 which can operate independently of the upper table 9 is provided. This adhesive pin drive mechanism 14 is comprised from the motor 14a for up-and-down drive, the adhesive pin plate 14b which attached the some adhesive pin 14c, and the adhesive pin up-down mechanism 14d. The adhesive pin plate 14b and the adhesive pin 14c have a vacuum suction mechanism, and the adhesive sheet 14e is attached to the tip of the adhesive pin 14c. In addition, the adhesive pin 14c has a structure which can be detached with respect to the adhesive pin plate 14b (it attaches and detaches with a screw mechanism), and is replaceable. In the pressure-sensitive adhesive pin plate 14b, a negative pressure chamber for supplying negative pressure and a negative pressure flow path (not shown) provided in the center portion of the pressure-sensitive adhesive pin 14c are connected to the negative pressure chamber, and a hole provided at the tip of the pressure-sensitive adhesive pin 14c is formed. ) To supply negative pressure. The adhesive sheet 14e is provided in the front-end | tip part of the adhesive pin 14c except a hole part. In addition, between the adhesive pin upper and lower mechanism 14d for moving the adhesive pin plate 14b up and down and the upper chamber 7 is connected by an elastic body having a corrugated box shape, whereby a vacuum state can be maintained. have.

FIG. 4: is a longitudinal cross-sectional view of the elastic bodies 11a and 11b of the surface of the upper table 9 and the lower table 10 shown in FIG. In FIG. 4, the longitudinal cross-sectional view of the elastic body 11b of the lower table 10 surface is shown, and it is set as the structure which the back surface of a glass substrate can abut on the upper part in a longitudinal cross-section. Therefore, exactly, in the elastic body 11a of the surface of the upper table 9, the up-down of the longitudinal cross-sectional view shown in FIG. 4 is reversed. In addition, in FIG. 4, it shows as an enlarged view in order to show an example of the cross-sectional shape of the elastic body which has convex part, and recessed part, and those dimensions. As shown in FIG. 4, the elastic body 11b of the lower table 10 surface has several convex part and recessed part arrange | positioned adjacent to each other. The height of the convex portion is, for example, 25 μm, and the pitch of the convex portion (the pitch along the width direction of the lower table 10) is about 500 μm. Moreover, the length along the width direction of the lower table 10 of a convex part is about 460 micrometers, and the length along the width direction of the lower table 10 of a concave part is about 40 micrometers. In addition, although the elastic bodies 11a and 11b which have several convex part and concave part arrange | positioned adjacent to each other in this figure are not shown in figure, when viewed from the upper surface, a some convex part is square lattice shape, triangular lattice shape, or zigzag lattice shape It is arranged. In addition, on the other hand, as mentioned above, the enlargement of the glass substrate joined together in recent years advances, for example, the dimension of a glass substrate becomes 3m * 3m. Therefore, the width of the elastic body 11a and / or the elastic body 11b (the upper table 9 and / or lower side) with respect to the width | variety of the upper table 9 and / or the lower table 10 which hold such a glass substrate. The width | variety along the width direction of the table 10) becomes a ratio of 10 <^-6> -10 <^-4> .

Thereby, when the air remaining in the recessed part (groove part) of the elastic body 11a and / or the elastic body 11b at the time of evacuation is exhausted, it can prevent that a large flow volume airflow arises. In other words, a plurality of thin exhaust flow paths are formed on the surfaces of the elastic body 11a and / or the elastic body 11b, and it is possible to disperse the exhaust of air remaining in the recesses (grooves). As a result, reduction in nonuniformity caused by frictional charging with the substrate, prevention of nonuniformity caused by temperature drop due to rapid adiabatic expansion, and improvement of substrate bonding accuracy, increase in size, thinning, With respect to fine patterning, it becomes possible to contribute to display production without color unevenness.

In addition, in this embodiment, the structure which provides the elastic plate 11 and the elastic body 11a in the upper table 9, and the elastic plate 11 and the elastic body 11b in the lower table 10, or Although the structure which provides an elastic body plate and an elastic body only in any one of the upper table 9 or the lower table 10 was demonstrated, it is not limited to this. For example, it is good also as a structure which affixes the embossed sheet which has several convex part and recessed parts mutually arrange | positioned adjacent to each other as mentioned above to the surface holding the glass substrate of the upper table 9 made from aluminum alloy with an adhesive agent. . Here, the embossed sheet is formed into a wavy shape by embossing a sheet of polyethylene terephthalate (called PET), for example. In addition, similarly, even if it is a structure which attaches the embossed sheet which has a some convex part and recessed parts mutually arrange | positioned adjacent to each other as mentioned above to the surface which hold | maintains the glass substrate of the lower table 10 made of aluminum alloy with an adhesive agent, do. Alternatively, the embossed sheet may be attached to only one of the upper table 9 and the lower table 10 by an adhesive.

Thus, by using the embossing sheet which has a some convex part and the recessed part arrange | positioned adjacent to each other, it only attaches the above-mentioned embossing sheet by an adhesive agent to the upper table and / or lower table which comprise the existing board assembly apparatus. It is possible to obtain the board | substrate assembly apparatus 1 of a present Example.

Next, operation | movement of the board | substrate assembly apparatus 1 is demonstrated. FIG. 5 is a flowchart showing an operation flow of the substrate assembly apparatus 1 shown in FIG. 1.

As shown in FIG. 5, in step S11, the upper glass substrate which carried the bonding surface toward the lower table 10 side is carried in to the lower surface of the upper table 9 using the robot hand which is not shown in figure. The plurality of adsorption support nozzles and the adhesive pin drive mechanism 14 (FIG. 3) not shown in the figure are lowered from the upper table 9, and the upper glass substrate is first adsorbed to the tip of the adsorption support nozzle (not shown). Thereafter, the suction support nozzle is raised until the tip of the suction support nozzle is at the adhesive pin surface position, and a negative pressure is supplied to the adhesive pin suction suction hole (not shown) provided in the adhesive pin 14c (FIG. 3) to supply the upper glass. The board | substrate is hold | maintained on the adhesive sheet 14e surface. In addition, in this embodiment, although the adsorption support nozzle was used separately from the adhesive pin mechanism, it is not limited to this, Even if it does not provide an adsorption support nozzle, even if it is a structure which suction-adsorbs and sticks holding | maintenance using only the adhesive pin 14c. do. The elastic body of the elastic plate 11 which raised the adhesive pin 14c in the state which hold | maintained the upper glass substrate to the adhesive sheet 14e provided in the front-end | tip of the adhesive pin 14c, and the upper glass substrate mounted to the upper table 9. The contact holding is carried out on the (11a) surface.

In step S12, the adhesive agent (sealing agent) is apply | coated to the lower glass substrate surface circularly, and the robot glass hand moves the lower glass substrate which the appropriate amount of liquid crystal was dripped to the area | region enclosed with the adhesive to the position of the lower table 10. Carried in and placed on a support pin. In addition, an adhesive agent may be provided in the upper glass substrate side instead of providing in an lower glass substrate, and may be provided in the upper and lower glass substrates.

Subsequently, the support pin is retracted to the lower table 10 side until the tip end is inside the table surface or the table surface, and the negative pressure is supplied to the suction hole provided in the lower table 10 to hold it. Moreover, the electrostatic adsorption mechanism is provided in the lower table 10, and it is made to hold | maintain so that a glass substrate may not shift even if the inside of a chamber is made into a vacuum state. In addition, the lower table 10 may also be configured to provide an adhesive pin mechanism similarly to the upper table 9. In this case, the moving distance of the adhesive pin can be set small compared with the upper table 9.

In step S13, after holding the upper and lower glass substrates in the adhesive pin 14c and the lower table 10, respectively, the Z-axis drive mechanism 2 is operated to operate the upper frame 5 and the upper chamber 7 and the upper table. (9) is lowered, and the upper chamber 7 and the lower chamber 8 are coalesced through a sealing to form a vacuum chamber. In synchronism with this operation, the adhesive pin drive mechanism 14 is also lowered such that the positional relationship between the upper and lower drive motors 14a and the adhesive pin up and down mechanism 14d is not changed. In addition, the space | interval of the opposing surface of the upper board | substrate hold | maintained by the upper table 9 and the lower board | substrate hold | maintained by the lower table 10 is maintained for several millimeters, and an upper board | substrate and a lower board | substrate are not contacted. Thereafter, although not shown in the figure, the air in the vacuum chamber is exhausted from the exhaust port provided on the lower chamber 8 side to reduce the pressure in the vacuum chamber. When the vacuum chamber is in a reduced pressure state for joining, the shift amount of the positioning mark provided in advance on the upper glass substrate and the lower glass substrate is calculated using a camera (not shown) having a deep depth of focus provided on the lower unit side. However, when the depth of focus of the camera is shallow, a mechanism for operating the camera up and down is first provided to recognize the positioning mark of the upper glass substrate, and then the camera is moved downward to recognize the positioning mark of the lower glass substrate, thereby the upper and lower glass. The method of obtaining the shift amount of the positioning mark of a board | substrate is taken. Thereafter, the lower table 10 is moved by driving the XYθ moving unit 13 to correct the deviation in the XYθ direction of the upper and lower substrates. In addition, this positioning operation can also be performed in the middle of the pressure reduction process for joining.

In step S14, when the alignment of the upper and lower substrates is completed, the Z-axis driving mechanism 2 is operated to move the upper table 9 through the frame 5, and in synchronization with the adhesive pin driving mechanism 14. ) Is moved to the lower table 10 side to bring the upper and lower glass substrates into contact. The shift amount of the positioning mark of the up-and-down glass substrate is confirmed again in the state which contacted the up-and-down glass board | substrate, and if there is a shift | offset, the positioning operation is performed again. When the confirmation and positioning operation is completed, only the upper table 9 is further lowered, and while pressing, the upper glass substrate is separated from the adhesive pin 14c. When pressing a board | substrate, the elastic body 11a on the elastic body plate 11 attached to the upper table 9 deform | transforms, and the whole board | substrate can be pressurized uniformly. Moreover, in the case of pressurization, the glass substrate hold | maintained on both tables may cause a position shift, and it is good to observe a positioning mark at that time, and to perform position shift correction.

In step S15, when bonding is complete | finished by pressing up and down the glass substrate, purge gas is introduce | transduced into the vacuum chamber from the purge gas blow mechanism not shown in a figure. At this time, the atmosphere is also introduced to return to atmospheric pressure. The pressing force acts further by returning a glass substrate to atmospheric pressure, and it presses to a prescribed thickness. In that state, UV irradiation mechanism not shown in figure is operated, a several place adhesive is hardened | cured, and a temporary fixation is performed, and bonding of a liquid crystal substrate is complete | finished.

In the above operation, the holding of the substrate by the adhesive pin 14c is until the upper and lower glass substrates are in contact with the adhesive (sealing agent) provided on any one of the glass substrates, and the adhesive pin 14c is directed downward. The adhesive pin 14c is peeled from the board | substrate surface by moving only the upper table 9 downward without moving to the lower side. At this time, the adhesive pin 14c can be reliably peeled from the substrate surface by moving the adhesive pin 14c in the direction opposite to the moving direction of the glass substrate.

Further, even when the pressing force is applied to the substrate, the adhesive pin is also moved to the lower table 10 side at the same time, and after the completion of pressurization, the table is held at the same state as when pressurized, and the adhesive pin drive mechanism ( 14) may be raised to release the adhesive pin from the substrate. At this time, the pressure-sensitive adhesive pin can be easily peeled from the substrate surface by raising the pressure-sensitive adhesive pin while sending a positive pressure gas or clean air to the suction suction hole at the tip of the pressure-sensitive adhesive pin.

In step S16, the board | substrate after bonding is carried out of the vacuum chamber using the robot hand which is not shown in figure.

As mentioned above, according to a present Example, it becomes possible to provide the board | substrate assembly apparatus and board | substrate assembly method which can reduce the curvature of a glass substrate.

Further, according to the present embodiment, the size of the next generation high-definition display is increased by reducing the occurrence of unevenness caused by frictional charging with the substrate, preventing the occurrence of unevenness caused by the temperature drop due to rapid thermal expansion, and improving the substrate bonding accuracy. -It becomes possible to contribute to manufacture of a display without color nonuniformity about thinning and a fine patterning.

Example 2

6 is a schematic view of a substrate assembly apparatus according to a second embodiment according to another embodiment of the present invention, showing a top view and a side view of a lower table. The present embodiment differs from the first embodiment described above in that the first lifter 21 is coarsely arranged and the second lifter 22 is densely arranged to penetrate the lower table 10. Hereinafter, the same code | symbol is attached | subjected to the component similar to Example 1, and the description which overlaps with Example 1 is abbreviate | omitted.

6, the top view and the side view of the lower table 10 which comprise the board | substrate assembly apparatus 1 of a present Example are shown. As shown in the top view, the board assembly apparatus 1 of this embodiment has the rod-shaped 1st lifter 21 extended in one direction, and the through-hole provided in the lower table 10 as shown in the side view ( It is provided with 23 and the 2nd lifter 22 which can move up and down. In FIG. 6, for convenience of description, the case of having two first lifters 21 and twenty-four second lifters 22 is illustrated, but the number of first lifters 21 and second lifters 22 is limited thereto. It doesn't happen. However, as shown in FIG. 6, the batch density of the first lifter 21 is sparse, and the batch density of the second lifter 22 is dense. In other words, as long as the first lifter 21 is coarsely arranged and the second lifter 22 is densely arranged, the number of the first lifter 21 and the second lifter 22 may be appropriately set.

7 is a flowchart showing the operation flow of the substrate assembly apparatus of the present embodiment.

Since steps S21 to S25 in FIG. 7 are the same as those of steps S11 to S15 shown in FIG. 5 in the first embodiment described above, description thereof is omitted here.

In step S27, the second lifter 22 rises by a predetermined amount, and the bonded substrate is made to protrude from the viewing surface (surface) of the lower table 10 by a predetermined amount and bonded to the viewing surface (surface) of the lower table 10. The subsequent substrate is floated. Here, the longitudinal cross-sectional view which shows the state which raised the lower glass substrate 16 by predetermined amount by the 2nd lifter 22 shown in FIG. 6 is shown. In FIG. 8, the state which raised the lower glass substrate 16 by predetermined amount for the convenience of description is shown, but this means the board | substrate after bonding. As shown in FIG. 8, the pitch P1 (the pitch along the width direction of the lower table 10) of the 2nd lifter 22 is 80 mm-100 mm, for example, and the diameter D1 of the 2nd lifter 22 is shown. Is 5 mm, for example, and the pore size of the through hole 23 is 8 mm, for example. In addition, the lift amount h1 from the viewing surface (surface) of the 2nd lifter 22 lower table 10 is 1 mm-3 mm, for example. In addition, the second lifter 22 is formed of, for example, a resin of PEEK (polyetheretherketone) material, and the front end portion of the lower glass substrate 16 which comes into contact with the rear surface thereof has a curved shape having a predetermined radius of curvature. It is possible to prevent damage to the back surface of the lower glass substrate 16 or the occurrence of scratches. The purge gas introduced from the purge gas blow mechanism or the atmosphere passes through the gap between the inner circumferential surface of the through hole 23 and the outer circumferential surface of the second lifter 22 as indicated by arrows in FIG. 8, and the lower glass substrate 16. It is sprayed on the back of the) and attached. In other words, the purge gas or the atmosphere enters the rear surface of the lower glass substrate 16 from the gap between the inner circumferential surface of the through hole 23 and the outer circumferential surface of the second lifter 22.

Returning to FIG. 7, in step S27, the first lifter 21 is increased by a predetermined amount, and the lower glass substrate 16 is further separated from the viewing surface (surface) of the lower table 10. Here, FIG. 9 is a longitudinal cross-sectional view which shows the state which raised the lower glass substrate 16 by predetermined amount by the 1st lifter 21 shown in FIG. Also in FIG. 9, the state which raised the lower glass substrate 16 predetermined amount for the convenience of description similarly to FIG. 8 is shown, This means the board | substrate after bonding. As shown in FIG. 9, the pitch P2 (pitch along the width direction of the lower table 10) of the 1st lifter 21 is 200 mm-250 mm, for example, and the lower table of the 1st lifter 21 is shown. The amount of rise h2 from the viewing surface (surface) of (10) is, for example, 100 to 200 mm. Therefore, ascending amount h2 from the viewing surface (surface) of the lower table 10 of the first lifter 21 is approximately the elevation amount h1 from the viewing surface (surface) of the lower table 10 of the second lifter 22. 33 times to 200 times.

Thus, in the initial stage in which the back surface of the lower glass substrate 16 which comprises the board | substrate after bonding is spaced apart from the viewing surface (surface) of the lower table 10 by step S26 of the above-mentioned, purge gas, or, The atmosphere enters the rear surface of the lower glass substrate 16 from the gap between the inner circumferential surface of the through hole 23 and the outer circumferential surface of the second lifter 22. At this time, the negative pressure between the back surface of the lower glass substrate 16 and the bottom surface (surface) of the lower table 10 escapes through the through holes 23 to prevent the bending of the substrate after the bonding due to the negative pressure. It becomes possible. And by step S27 of the said description, in order to further separate the lower glass substrate 16 from the viewing surface (surface) of the lower table 10 by the 1st lifter 21, preventing the bending of the board | substrate after bonding, It is possible to further separate the substrate after bonding from the viewing surface (surface) of the lower table 10. And as a result, it prevents the nonuniformity generate | occur | produced by the curvature of a glass substrate, and contributes to the manufacture of a display without color nonuniformity with respect to the enlargement, thinning, and micropatterning in the manufacture of next-generation high-definition display, and improving quality and yield. It becomes possible to reduce cost and improve productivity.

Returning to FIG. 7, in step S28, the board | substrate after joining separated from the viewing surface (surface) of the lower table 10 by the 1st lifter 21 is transferred to the robot hand not shown in figure, and is sent to a robot hand. It is taken out of the vacuum chamber by this.

As mentioned above, according to a present Example, it becomes possible to provide the board | substrate assembly apparatus and board | substrate assembly method which can reduce the curvature of a glass substrate.

In addition, according to the present embodiment, it is possible to prevent the occurrence of unevenness due to the warping of the glass substrate and to contribute to the manufacture of displays without color unevenness for the increase in size, thinness, and fine patterning in the production of next-generation high-definition displays. It becomes possible to improve yield, reduce cost, and improve productivity.

In addition, this invention is not limited to the above-mentioned embodiment, Various modified examples are included. For example, the above-described embodiments are described in detail for easy understanding of the present invention, and are not necessarily limited to those having all the configurations described. It is also possible to replace part of the configuration of one embodiment with the configuration of another embodiment, and it is also possible to add the configuration of another embodiment to the configuration of one embodiment.

One… Board Assembly Device
2… Z axis drive mechanism
2a... Z axis drive motor
2b... Ball screw
2c... Ball screw receptacle
3... Guide
3a... Linear guide
3b... Linear moving parts
4… Load cell
5... Upper frame
6... Upper shaft
7... Upper chamber
7b... Bracket
8… Lower chamber
9... Upper table
10... Lower table
11... Elastomer plate
11a, 11b... Elastomer
12... Lower shaft
13... XYθ moving unit
14... Adhesive Pin Drive Mechanism
14a... Vertical drive motor
14b... Adhesive pin plate
14c... Adhesive pin
14d... Adhesive pin up and down mechanism
14e... Adhesive sheet
15... trestle
16... Lower glass substrate
17, 18... beam
21... First lifter
22... Second lifter
23... Through hole

Claims (10)

As a board | substrate assembly apparatus which hold | maintains one board | substrate on a lower table, holds the other board | substrate to the upper table facing the said one board | substrate, and bonds in a vacuum chamber by the adhesive agent provided in any one board | substrate,
Having a first lifter and a second lifter, the second lifter can penetrate the lower table, and after raising the substrate by a predetermined amount by the second lifter, further raising the substrate by the first lifter; Board assembly apparatus characterized by the above-mentioned. The method of claim 1,
And the first lifter is coarsely disposed, and the second lifter is densely disposed. The method according to claim 1 or 2,
And said first lifter arrangement is coarser than said second lifter arrangement. The method according to any one of claims 1 to 3,
The raising amount of the said board | substrate by a said 1st lifter is larger than the raising amount of the board | substrate by a said 2nd lifter. The method according to any one of claims 1 to 4,
And the amount of rise of the substrate by the first lifter is approximately 33 to 200 times the amount of rise of the substrate by the second lifter. The method according to any one of claims 1 to 5,
The lower table includes a through hole through which the second lifter can penetrate, and when the substrate is raised by a predetermined amount by the second lifter, a purge gas is formed from a gap between an inner circumferential surface of the through hole and an outer circumferential surface of the second lifter. Or atmosphere invades the back surface of the substrate. Holding the one substrate on the lower table;
A step of holding the other substrate in the upper table so as to face the one substrate;
As a board | substrate assembly method which has the process of bonding together in a vacuum chamber by the adhesive agent provided in any one board | substrate,
A second lifter densely arranged with a coarse first lifter, the second lifter being able to penetrate the lower table, and after raising the substrate by a predetermined amount by the second lifter, Further raising the substrate by the substrate assembly method. The method of claim 7, wherein
The raising amount of the said board | substrate by a said 1st lifter is larger than the raising amount of the board | substrate by a said 2nd lifter. The method according to claim 7 or 8,
And the amount of rise of the substrate by the first lifter is approximately 33 to 200 times the amount of rise of the substrate by the second lifter. The method according to any one of claims 7 to 9,
The lower table includes a through hole through which the second lifter can penetrate, and when the substrate is raised by a predetermined amount by the second lifter, a purge gas is formed from a gap between an inner circumferential surface of the through hole and an outer circumferential surface of the second lifter. Or atmosphere invades the back surface of the substrate.

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