JP6566386B2 - Substrate laminating apparatus, laminating method, and electronic device manufacturing method - Google Patents

Description

  The present invention relates to a substrate bonding apparatus, a bonding method, and an electronic device manufacturing method.

  As electronic devices such as display panels, solar cells, and thin-film secondary batteries become thinner and lighter, substrates (first substrates) such as glass plates, resin plates, and metal plates used in these electronic devices are made thinner. Is desired.

  However, since the handling of the substrate deteriorates as the substrate becomes thinner, functional layers for electronic devices (thin film transistor (TFT), color filter (CF)) are formed on the surface of the substrate. It becomes difficult to do.

  Therefore, a reinforcing plate (second substrate) is bonded to the back surface of the substrate to manufacture a laminate in which the substrate is reinforced by the reinforcing plate, and an electronic device in which a functional layer is formed on the surface of the substrate in the state of the laminate. A manufacturing method has been proposed (see, for example, Patent Document 1). In this manufacturing method, since the handling property of the substrate is improved, the functional layer can be favorably formed on the surface of the substrate. And a reinforcement board is peeled from a board | substrate after formation of a functional layer.

  Patent Document 2 discloses a bonding apparatus (bonding apparatus) that bonds a substrate and a reinforcing plate.

  The bonding apparatus of patent document 2 is provided with the upper table which adsorb | sucks a board | substrate on the lower surface, and the lower table which is arrange | positioned under the upper table and a reinforcement board is mounted in the upper surface. Also, the rotating roller that contacts the lower surface of the reinforcing plate placed on the lower table and that deforms and deforms the reinforcing plate by its own weight, and the reinforcing plate that is deflected and deformed by the rotating roller are pressed against the substrate adsorbed on the upper table. A pressing cylinder and a moving mechanism that moves the rotating roller and the pressing cylinder relative to the lower surface of the upper table are provided.

  According to the bonding apparatus of patent document 2, while a board | substrate is first adsorb | sucked to an upper table, a reinforcement board is mounted in a lower table. Next, the rotating roller is lifted by the pressing cylinder, and the rotating roller is brought into contact with the lower surface of the reinforcing plate, and then the rotating roller is further lifted to bend and deform the reinforcing plate by its own weight. Press. Next, the reinforcing plate is bonded to the substrate by moving the rotating roller and the pressing cylinder by the moving mechanism.

  According to the bonding apparatus of patent document 2, since it bonds with a board | substrate in the state which bent and deformed the reinforcement board, a bubble becomes difficult to bite between a board | substrate and a reinforcement board. In addition, since the reinforcing plate is not fixed by suction, the reinforcing plate and the substrate can be bonded with less distortion of the reinforcing plate. Thereby, the curvature of the laminated body which arises after bonding can be reduced.

Japanese Unexamined Patent Publication No. 2007-326358 Japanese Unexamined Patent Publication No. 2013-155503

  Although the bonding apparatus of patent document 2 was able to improve significantly about the curvature of the laminated body which arises after bonding, about the biting of a bubble, it is difficult to improve significantly, and is the lamination | stacking after bonding. Bubbles may remain on the body.

  This invention is made | formed in view of such a subject, The board | substrate bonding apparatus and bonding which can reduce the curvature of the laminated body after bonding, and can reduce the number of remaining bubbles. It is an object to provide a combination method and a method for manufacturing an electronic device.

  One mode of the substrate bonding apparatus of the present invention is the bonding apparatus that bonds the first substrate and the second substrate via an adsorption layer in order to achieve the above object. A first roller that presses against the first substrate in a state of bending and deforming the substrate, and affixes the entire surface of the second substrate to the first substrate by a first force while rolling; By applying a second force larger than the first force while rolling to the laminate in which the entire surface of the second substrate is bonded to one substrate, the second substrate And a second roller for pressing the entire surface to the first substrate.

  In one aspect of the substrate bonding method of the present invention, the first roller in the bonding method of bonding the first substrate and the second substrate through the adsorption layer in order to achieve the above object. The second substrate is pressed against the first substrate while being bent and deformed, and the second force is applied by the first force applied from the first roller while rolling the first roller. An attaching step of attaching the entire surface of the substrate to the first substrate, and a second laminate larger than the first force with respect to the laminate in which the entire surface of the second substrate is adhered to the first substrate. A pressure-bonding step in which the entire surface of the second substrate is pressure-bonded to the first substrate by applying the above force from the second roller while rolling the second roller. And

  According to one aspect of the present invention, in the attaching step, the entire surface of the second substrate is attached to the first substrate by the first force that is applied from the first roller and is smaller than the second force. It is possible to reduce the warpage of the laminated body after pasting. In the crimping step, the entire surface of the second substrate is crimped to the first substrate by a second force greater than the first force applied from the second roller. In the crimping process, the bubbles interposed between the first substrate and the second substrate are diffused into the adsorption layer by the second force and melt into the adsorption layer, thereby reducing the remaining number of bubbles. can do.

  Therefore, according to one aspect of the present invention, after the first substrate is attached to the entire surface of the second substrate with the first force that is smaller than the second force to prevent warping after the attachment, The entire surface of the second substrate is pressure-bonded to the first substrate by a second force that is greater than this force, and the number of remaining bubbles is reduced.

  In one aspect of the bonding apparatus of the present invention, the diameter of the second roller is preferably smaller than the diameter of the first roller.

  According to one embodiment of the present invention, a second force larger than the first force can be obtained by making the diameter of the second roller smaller than the diameter of the first roller (Hertz contact stress). See formula).

  As for the one aspect | mode of the bonding apparatus of this invention, it is preferable that the elasticity modulus of a said 2nd roller is larger than the elasticity modulus of a said 1st roller.

  According to one aspect of the present invention, a second force larger than the first force can be obtained by making the elastic modulus of the second roller larger than the elastic modulus of the first roller (Hertz). Contact stress formula).

  In one aspect of the bonding apparatus of the present invention, the load applied to the second roller is preferably larger than the load applied to the first roller.

  According to one aspect of the present invention, the second force greater than the first force is obtained by making the load applied to the second roller larger than the load applied to the first roller. Can do.

  According to one aspect of the bonding method of the present invention, the first force multiplies the elastic modulus of the first roller by a load applied to the first roller, and the multiplied value is the first value. The second force is obtained by multiplying the elastic modulus of the second roller by the load applied to the second roller, and dividing the multiplied value by the second force. The value divided by the diameter of the roller is used as an index, and the second force index is preferably larger than the first force index.

  According to one aspect of the present invention, the first force and the second force are indexed using the elastic modulus, load, and diameter of the roller as parameters. The first force and the second force increase in proportion to the elastic modulus and load of the roller, and decrease in inverse proportion to the diameter of the roller. In other words, the force increases as the roller diameter decreases. According to one aspect of the present invention, a suitable first force and second force can be set by selecting the elastic modulus, load, and diameter of the roller.

  In one aspect of the method for producing an electronic device of the present invention, in order to achieve the above object, a laminate is produced in which a laminate is produced by bonding a first substrate and a second substrate via an adsorption layer. A step of forming a functional layer on the exposed surface of the first substrate of the laminate, and a separation step of separating the second substrate from the first substrate on which the functional layer is formed. In the method of manufacturing an electronic device, the laminate manufacturing step presses the second substrate against the first substrate while being bent and deformed by the first roller, and the first roller. A sticking step of sticking the entire surface of the second substrate to the first substrate by a first force applied from the first roller while rolling, and the second substrate on the first substrate. For the laminate with the entire surface of By applying a second force larger than the first force from the second roller while rolling the second roller, the entire surface of the second substrate is pressed against the first substrate. A crimping step.

  According to one embodiment of the present invention, by applying the bonding method of the present invention to a laminate manufacturing process of an electronic device manufacturing method, warpage of the stacked body after bonding can be reduced, and air bubbles The manufacturing method of the electronic device which can reduce the remaining number of can be provided. Since the laminate manufactured in the laminate manufacturing process has reduced warpage and the number of remaining bubbles is reduced, a high-quality functional layer is formed on the exposed surface of the first substrate in the functional layer forming process. can do.

  According to the board | substrate bonding apparatus and bonding method which concern on this invention, and the manufacturing method of an electronic device, the curvature of the laminated body after bonding can be reduced and the remaining number of bubbles can be reduced.

The principal part enlarged side view which shows an example of the laminated body provided to the manufacturing process of an electronic device The principal part enlarged side view which shows an example of the laminated body produced in the middle of the manufacturing process of LCD (A)-(D) are the side views which showed the principal part structure of the sticking apparatus used in the sticking process of a laminated body manufacturing process. (A)-(D) are the side views which showed the principal part structure of the crimping | compression-bonding apparatus used in the crimping | compression-bonding process of a laminated body manufacturing process. Explanatory drawing for explaining the maximum pressure Pmax on the roller surface Side view showing another embodiment of the crimping apparatus The top view of the bonding apparatus containing the crimping | compression-bonding apparatus shown in FIG.

  Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings.

  Below, the case where the board | substrate bonding apparatus and bonding method which concern on this invention are used at the manufacturing process of an electronic device is demonstrated.

  An electronic device means electronic components, such as a display panel, a solar cell, and a thin film secondary battery. As a display panel, a liquid crystal display panel (LCD: Liquid Crystal Display), a plasma display panel (PDP: Plasma Display Panel), and an organic EL display panel (OELD: Organic Electro Luminescence Display) can be illustrated.

[Manufacturing process of electronic devices]
An electronic device is manufactured by forming a functional layer for an electronic device (in the case of LCD, a thin film transistor (TFT) and a color filter (CF)) on the surface of a substrate made of glass, resin, metal, or the like.

  Prior to the formation of the functional layer, the back surface of the substrate is bonded to a reinforcing plate to form a laminate. Thereafter, a functional layer is formed on the surface (exposed surface) of the substrate in the state of the laminate. Then, after the functional layer is formed, the reinforcing plate is peeled from the substrate.

  That is, in the manufacturing process of the electronic device, a laminate manufacturing process in which the substrate and the reinforcing plate are bonded to manufacture a laminate, a functional layer forming step in which a functional layer is formed on the surface of the substrate in the state of the laminate, and A separation step of separating the reinforcing plate from the substrate on which the functional layer is formed is provided. The laminate bonding apparatus and the bonding method according to the present invention are applied to the laminate manufacturing process.

[Laminate 1]
FIG. 1 is an enlarged side view of an essential part showing an example of a laminated body 1.

  The laminate 1 includes a substrate (first substrate) 2 on which a functional layer is formed, and a reinforcing plate (second substrate) 3 that reinforces the substrate 2. The reinforcing plate 3 is provided with a resin layer 4 as an adsorption layer on the front surface 3 a, and the back surface 2 b of the substrate 2 is bonded to the resin layer 4. That is, the substrate 2 is detachably bonded to the reinforcing plate 3 through the resin layer 4 by van der Waals force acting between the resin layer 4 or the adhesive force of the resin layer 4.

[Substrate 2]
The substrate 2 has a functional layer formed on its surface 2a. Examples of the substrate 2 include a glass substrate, a ceramic substrate, a resin substrate, a metal substrate, and a semiconductor substrate. Among these substrates, a glass substrate is suitable as the substrate 2 for an electronic device because it is excellent in chemical resistance and moisture permeability and has a small linear expansion coefficient. Further, as the linear expansion coefficient becomes smaller, there is an advantage that the pattern of the functional layer formed at a high temperature is less likely to be displaced during cooling.

  Examples of the glass of the glass substrate include alkali-free glass, borosilicate glass, soda lime glass, high silica glass, and other oxide-based glasses mainly composed of silicon oxide. As the oxide glass, a glass having a silicon oxide content of 40 to 90% by mass in terms of oxide is preferable.

  As the glass of the glass substrate, it is preferable to select and use a glass suitable for the type of electronic device to be produced and a glass suitable for the production process. For example, it is preferable to employ glass (non-alkali glass) that does not substantially contain an alkali metal component for the glass substrate for a liquid crystal panel.

  The thickness of the substrate 2 is set according to the type of the substrate 2. For example, when a glass substrate is employed as the substrate 2, the thickness thereof is preferably 0.7 mm or less, more preferably 0.3 mm or less, and even more preferably 0.1 mm or less, in order to reduce the weight and thickness of the electronic device. Set to When the thickness is 0.3 mm or less, good flexibility can be imparted to the glass substrate. Furthermore, when the thickness is 0.1 mm or less, the glass substrate can be wound into a roller shape, but from the viewpoint of manufacturing the glass substrate and handling the glass substrate, the thickness is 0.03 mm or more. Preferably there is.

  In FIG. 1, the substrate 2 is composed of a single substrate, but the substrate 2 may be composed of a plurality of substrates. That is, the board | substrate 2 can also be comprised with the laminated body which laminated | stacked the several board | substrate.

[Reinforcement plate 3]
Examples of the reinforcing plate 3 include a glass substrate, a ceramic substrate, a resin substrate, a metal substrate, and a semiconductor substrate.

  The thickness of the reinforcing plate 3 is set to 0.7 mm or less, and is set according to the type and thickness of the substrate 2 to be reinforced. The reinforcing plate 3 may be thicker or thinner than the substrate 2, but is preferably 0.4 mm or more in order to reinforce the substrate 2.

  In this example, the reinforcing plate 3 is constituted by a single substrate, but the reinforcing plate 3 can also be constituted by a laminated body in which a plurality of substrates are laminated.

[Resin layer 4]
In order to prevent the resin layer 4 from peeling between the resin layer 4 and the reinforcing plate 3, the bonding force between the resin layer 4 and the reinforcing plate 3 is set higher than the bonding force between the resin layer 4 and the substrate 2. Thereby, in the peeling process, the interface between the resin layer 4 and the substrate 2 is peeled off.

  Although resin which comprises the resin layer 4 is not specifically limited, Acrylic resin, polyolefin resin, polyurethane resin, a polyimide resin, a silicone resin, and a polyimide silicone resin can be illustrated. Several types of resins can be mixed and used. Of these, silicone resins and polyimide silicone resins are preferred from the viewpoints of heat resistance and peelability.

  Although the thickness of the resin layer 4 is not specifically limited, Preferably it is set to 1-50 micrometers, More preferably, it is set to 4-20 micrometers. By setting the thickness of the resin layer 4 to 1 μm or more, when bubbles or foreign matters are mixed between the resin layer 4 and the substrate 2, the thickness of the bubbles or foreign matters can be absorbed by the deformation of the resin layer 4. On the other hand, when the thickness of the resin layer 4 is 50 μm or less, the formation time of the resin layer 4 can be shortened, and the resin of the resin layer 4 is not used more than necessary, which is economical.

  The outer shape of the resin layer 4 is preferably the same as the outer shape of the reinforcing plate 3 or smaller than the outer shape of the reinforcing plate 3 so that the reinforcing plate 3 can support the entire resin layer 4. In addition, the outer shape of the resin layer 4 is preferably the same as or larger than the outer shape of the substrate 2 so that the resin layer 4 can adhere the entire substrate 2.

  Moreover, although the resin layer 4 is comprised by 1 layer in FIG. 1, the resin layer 4 can also be comprised by two or more layers. In this case, the total thickness of all the layers constituting the resin layer 4 is the thickness of the resin layer. In this case, the type of resin constituting each layer may be different.

  Furthermore, in the embodiment, the resin layer 4 that is an organic film is used as the adsorption layer, but an inorganic layer may be used instead of the resin layer 4. The inorganic film constituting the inorganic layer includes, for example, at least one selected from the group consisting of metal silicide, nitride, carbide, and carbonitride.

  Furthermore, although the laminated body 1 of FIG. 1 includes the resin layer 4 as an adsorption layer, the resin layer 4 may be eliminated and the substrate 2 and the reinforcing plate 3 may be configured. In this case, the substrate 2 and the reinforcing plate 3 are detachably attached by van der Waals force or the like acting between the substrate 2 and the reinforcing plate 3. In this case, it is preferable to form an inorganic thin film on the surface 3a of the reinforcing plate 3 so that the substrate 2 which is a glass substrate and the reinforcing plate 3 which is a glass plate do not adhere at a high temperature.

[Laminated body 6 of embodiment in which functional layer is formed]
A functional layer is formed on the surface 2a of the substrate 2 of the laminate 1 through the functional layer forming step. As a method for forming the functional layer, a vapor deposition method such as a CVD (Chemical Vapor Deposition) method, a PVD (Physical Vapor Deposition) method, or a sputtering method is used. The functional layer is formed in a predetermined pattern by photolithography or etching.

  FIG. 2 is an enlarged side view of an essential part showing an example of a rectangular laminate 6 manufactured during the manufacturing process of the LCD.

  The laminate 6 is configured by laminating a reinforcing plate 3A, a resin layer 4A, a substrate 2A, a functional layer 7, a substrate 2B, a resin layer 4B, and a reinforcing plate 3B in this order. That is, the laminate 6 in FIG. 2 corresponds to a laminate in which the laminate 1 shown in FIG. 1 is arranged symmetrically with the functional layer 7 in between. Hereinafter, a laminate composed of the substrate 2A, the resin layer 4A, and the reinforcing plate 3A is referred to as a first laminate 1A, and a laminate composed of the substrate 2B, the resin layer 4B, and the reinforcement plate 3B is referred to as a second laminate 1B. Called.

  A thin film transistor (TFT) as the functional layer 7 is formed on the surface 2Aa of the substrate 2A of the first laminated body 1A, and a color filter as the functional layer 7 is formed on the surface 2Ba of the substrate 2B of the second laminated body 1B. (CF) is formed.

  The first laminate 1A and the second laminate 1B are integrated by superimposing the surfaces 2Aa and 2Ba of the substrates 2A and 2B. Thereby, the laminated body 6 having a structure in which the first laminated body 1A and the second laminated body 1B are arranged symmetrically with the functional layer 7 interposed therebetween is manufactured.

  The laminate 6 is a product in which, after the separation start portion is formed at the interface by the blade edge of the knife in the separation step, the reinforcing plates 3A and 3B are sequentially peeled off, and then a polarizing plate and a backlight are attached. LCD is manufactured.

[Bonding Device of Embodiment]
3 (A) to 3 (D) are side views showing the main configuration of the sticking device 10 used in the sticking process included in the laminate manufacturing process, and the operation of the sticking process is illustrated in time series. It is explanatory drawing shown.

  4 (A) to 4 (D) are side views showing the main configuration of the crimping device 20 used in the crimping process included in the laminate manufacturing process, and the operations of the crimping process are time-series. It is explanatory drawing shown in figure. The pasting apparatus 10 and the crimping apparatus 20 constitute the pasting apparatus of the embodiment.

  Moreover, in the laminated body manufacturing process mentioned above, after the sticking process by the sticking apparatus 10, the crimping process by the crimping apparatus 20 is performed. 3 and the pressure bonding device 20 in FIG. 4 are commonly used as an upper table 12, a lower table 14, and a cylinder device 22 to be described later, and the roller 16 in FIG. The second roller 18 in FIG. 4 is used separately.

<Paste device 10>
3 (A) to 3 (D), the reinforcing plate 3 is pressed by the roller 16 against the substrate 2 while being bent and deformed by its own weight, and the roller 16 is applied from the roller 16 while rolling. In this device, the entire surface of the reinforcing plate 3 is attached to the substrate 2 by the first force.

  As shown in FIG. 3A, the sticking device 10 includes an upper table 12 that vacuum-sucks the substrate 2 on its lower surface, a lower table 14 that is disposed below the upper table 12, and on which the reinforcing plate 3 is placed. Is provided. The lower surface of the upper table 12 and the upper surface of the lower table 14 are set in parallel. A resin sheet 15 that reduces friction with the reinforcing plate 3 is provided on the upper surface of the lower table 14, and the reinforcing plate 3 is placed on the resin sheet 15.

  The arrangement of the substrate 2 and the reinforcing plate 3 may be reversed. That is, the substrate 2 may be placed on the lower table 14 and the reinforcing plate 3 may be attracted to the upper table 12. In addition, the sticking device 10 preferably includes a transport mechanism that delivers the substrate 2 and the reinforcing plate 3 to the upper table 12 and the lower table 14.

  The affixing device 10 contacts the lower surface of the reinforcing plate 3 placed on the lower table 14, and adsorbs to the upper table 12 the roller 16 that bends and deforms the reinforcing plate 3 with its own weight, and the reinforcing plate 3 that is bent and deformed by the roller 16. And a cylinder device 22 that presses against the substrate 2 to be pressed.

  The cylinder device 22 includes a cylinder body 24 and a rod 26 that protrudes and retracts from the cylinder body 24. The roller 16 is supported at the tip of the rod 26 so as to be rotatable about the central axis 16A.

  In addition, the sticking device 10 includes a moving mechanism (not shown) that moves the lower table 14, the roller 16, and the cylinder device 22 integrally with the lower surface of the upper table 12 in parallel and in the horizontal direction.

  As shown in FIG. 3B, the roller 16 is raised in the direction of arrow A by the rod 26 protruding, contacts the lower surface of the reinforcing plate 3 placed on the lower table 14, and bends the reinforcing plate 3 by its own weight. Deform. The roller 16 includes, for example, a metal roller main body and a rubber sheet fixed to the outer peripheral surface of the roller main body, and the rubber sheet is in contact with the lower surface of the reinforcing plate 3 in order to suppress damage to the reinforcing plate 3. .

  The cylinder device 22 presses the reinforcing plate 3 bent and deformed by the roller 16 against the substrate 2 adsorbed by the upper table 12. That is, a load applied to the roller 16 is given from the cylinder device 22, and the reinforcing plate 3 is pressed against the substrate 2 through the roller 16 by this load.

<Attaching method with the attaching device 10>
As shown in FIG. 3B, the roller 16 is lifted by the cylinder device 22 when the substrate 2 and the reinforcing plate 3 are bonded, and the reinforcing plate 3 placed on the lower table 14 is bent and deformed, so that the upper table It is pressed from below onto the substrate 2 adsorbed to the substrate 12. At this time, the reinforcing plate 3 is pressed against the substrate 2 by the first force. Further, since the reinforcing plate 3 is affixed to the substrate 2 in a state of being bent and deformed, it is difficult for air bubbles to bite between the substrate 2 and the reinforcing plate 3.

  In this state, that is, with the first force maintained, the roller 16 is moved in the direction of arrow B by the moving mechanism as shown in FIG. 3C, and the right half of the substrate 2 and the right half of the reinforcing plate 3 are moved. And paste. 3D, the roller 16 is moved in the direction of arrow C, and the left half of the substrate 2 and the left half of the reinforcing plate 3 are attached. At this time, the roller 16 sticks the entire surface of the reinforcing plate 3 to the substrate 2 by the first force while rolling by friction with the lower surface of the reinforcing plate 3. As a result, the entire surface of the reinforcing plate 3 is attached to the substrate 2 to manufacture the laminate 1.

  3A to 3D, the reinforcing plate 3 is merely placed on the lower table 14 and is not fixed to the lower table 14 by suction. The reinforcing plate 3 can be attached to the substrate 2 with little distortion. Thereby, the curvature of the laminated body 1 (refer FIG. 3D) after bonding can be reduced. This effect is remarkable when both the substrate 2 and the reinforcing plate 3 include glass plates.

  For example, when a glass plate and a resin plate having a lower rigidity than the glass plate are bonded together, the resin plate has a lower rigidity than the glass plate. In contrast, the glass plate is hardly distorted, so that it tends to be flat and the laminate is not easily warped. On the other hand, when the glass plates are bonded to each other, both the glass plates are distorted after bonding, and the laminated body is likely to warp because it is difficult to follow one.

  As shown in FIG. 3B, the roller 16 at the start of the application is arranged at an equal distance from both side edges of the reinforcing plate 3, but is arranged in the vicinity of one side edge of the reinforcing plate 3. The entire surface of the reinforcing plate 3 may be attached to the substrate 2 by moving from the position toward the other side edge.

<Crimping device 20>
The crimping device 20 shown in FIGS. 4A to 4D applies a second force larger than the above-described first force to the laminate 1 in which the entire surface of the reinforcing plate 3 is bonded to the substrate 2. In this device, the entire surface of the reinforcing plate 3 is pressure-bonded to the substrate 2 by being applied from the roller 18 while rolling the roller 18.

  As shown in FIG. 3A, the crimping device 20 includes a roller 18 that is in contact with the lower surface of the reinforcing plate 3 of the laminated body 1 and has a diameter smaller than that of the roller 16. Further, the second force applied from the roller 18 to the reinforcing plate 3 is adjusted by the cylinder device 22.

<Crimping method with the crimping device 20>
As shown in FIG. 4B, the roller 18 is raised in the direction of arrow A by the cylinder device 22 when the substrate 2 and the reinforcing plate 3 are pressure-bonded, and the reinforcing plate 3 of the laminate 1 adsorbed to the upper table 12. Pressed against. At this time, the reinforcing plate 3 is pressed against the substrate 2 by the second force.

  In this state, that is, with the second force maintained, the roller 18 is moved in the direction of arrow B by the moving mechanism as shown in FIG. 4C, and the right half of the substrate 2 and the right half of the reinforcing plate 3 are moved. And crimp. Thereafter, as shown in FIG. 4D, the roller 18 is moved in the direction of arrow C, and the left half of the substrate 2 and the left half of the reinforcing plate 3 are pressure-bonded. At this time, the roller 16 presses the entire surface of the reinforcing plate 3 against the substrate 2 by the second force while rolling by friction with the lower surface of the reinforcing plate 3. Thereby, the entire surface of the reinforcing plate 3 is pressure-bonded to the substrate 2.

  In the crimping process shown in FIGS. 4A to 4D, the air bubbles interposed between the substrate 2 and the reinforcing plate 3 are diffused into the resin layer 4 by the second force, and the resin layer 4 Since it melts inside, the number of remaining bubbles can be reduced.

  As shown in FIG. 4 (B), the roller 18 at the start of pressure bonding is arranged at an equal distance from both side edges of the reinforcing plate 3, but is arranged in the vicinity of one side edge of the reinforcing plate 3, The entire surface of the reinforcing plate 3 may be pressure-bonded to the substrate 2 by moving from the position toward the other side edge.

[Features of the bonding apparatus of the embodiment]
In the pasting process by the pasting device 10 shown in FIG. 3, the entire surface of the reinforcing plate 3 is pasted on the substrate 2 by the first force that is applied from the roller 16 and is smaller than the second force. 1 warpage can be reduced.

  4A to 4D, the entire surface of the reinforcing plate 3 is applied to the substrate 2 by the second force that is applied from the roller 18 and is larger than the first force. Crimp. In the crimping process, the air bubbles interposed between the substrate 2 and the reinforcing plate 3 are diffused into the resin layer 4 by the second force and melt into the resin layer 4, thereby reducing the remaining number of air bubbles. can do.

  In addition, since the 2nd force larger than 1st force is provided to the reinforcement board 3 before a sticking process, the reinforcement board 3 deform | transforms locally and distortion remains, and this distortion remains in this distortion process. This is not preferable because warpage occurs in the laminated body 1 after bonding.

  Therefore, according to the bonding apparatus of the embodiment, the first force is applied after the entire surface of the reinforcing plate 3 is attached to the substrate 2 by the first force that is smaller than the second force to prevent warping after the application. Since the entire surface of the reinforcing plate 3 is pressure-bonded to the substrate 2 by the second force larger than that, the remaining number of bubbles can be reduced.

  In addition, by applying the pasting process and the crimping process of the embodiment to the laminate manufacturing process of the electronic device manufacturing method, the laminate 1 manufactured in the laminate manufacturing process is reduced in warpage and remains of bubbles. Since the number is also reduced, a functional layer with good quality can be formed on the substrate 2 of the laminate 1 in the functional layer forming step.

ここで、Pmax：ローラ１６の表面に作用する最大圧力（Ｐａ）、F：ローラ１６の荷重（Ｎ）、 E：ローラ１６のヤング率（Ｐａ）、R：ローラ１６の半径（ｍ）、 W：ローラ１６の加圧幅（ｍ）、π：円周率である。
また、ローラ１６の加圧幅は、図５の奥行き方向の長さを意味する。ローラ１６の幅が積層体１の幅よりも大きい場合、ローラ１６の加圧幅は積層体１の幅（図５の奥行き方向の長さ）に等しくなる。<Principle of first force and second force>
The “force” in the first force and the second force means the maximum pressure Pmax in the contact state between the roller 16 and the laminated body 1.
FIG. 5 is an explanatory diagram for explaining Pmax, and the pressure distribution on the surface of the roller 16 is described in a cross-sectional view of the roller 16 and the laminated body 1 as viewed along the axial direction of the roller 16.
When the laminated body 1 is pressed by the roller 16, the maximum pressure Pmax acting on the surface of the roller 16 is expressed by the following simple formula of Hertz contact stress type.

Here, Pmax: maximum pressure (Pa) acting on the surface of the roller 16, F: load of the roller 16 (N), E: Young's modulus (Pa) of the roller 16, R: radius (m) of the roller 16, W : Pressurization width (m) of the roller 16; π: Circumference ratio.
Further, the pressure width of the roller 16 means the length in the depth direction of FIG. When the width of the roller 16 is larger than the width of the laminated body 1, the pressure width of the roller 16 is equal to the width of the laminated body 1 (length in the depth direction in FIG. 5).

<Setting method of first force and second force>
As a first setting method, the diameter of the roller 18 is made smaller than the diameter of the roller 16.

  As a result, a second force larger than the first force can be obtained (see Hertz contact stress equation).

  As a second setting method, the elastic modulus of the roller 18 is made larger than the elastic modulus of the roller 16. As a result, a second force larger than the first force can be obtained (see Hertz contact stress equation).

  As a third setting method, the load applied from the cylinder device 22 to the roller 18 is made larger than the load applied from the cylinder device 22 to the roller 16. Thereby, the 2nd force larger than the 1st force can be obtained.

  As a fourth setting method, the first force and the second force are indexed, and the index value of the second force is set to be larger than the first index value.

  As the index value, a value obtained by multiplying the elastic modulus (MPa) of the roller 16 by the load (N) applied from the cylinder device 22 to the roller 16, and dividing the multiplied value by the diameter (d) of the roller 16, The index value of the first force is used. Similarly, a value obtained by multiplying the elastic modulus of the roller 18 by the load applied from the cylinder device 22 to the roller 18 and dividing the multiplied value by the diameter of the roller 18 is used as an index value of the second force.

  That is, the first force and the second force are indexed using the elastic modulus of the rollers 16 and 18, the load applied from the cylinder device 22 to the rollers 16 and 18, and the diameter of the rollers 16 and 18 as parameters. .

  The index values of the first force and the second force increase in proportion to the elastic modulus and the load, and decrease in inverse proportion to the diameter. In other words, the force increases as the roller diameter decreases. Therefore, by selecting the elastic modulus, the load, and the diameter based on the material and thickness of the substrate 2 and the reinforcing plate 3, a suitable first force for reducing warpage and the remaining number of bubbles are obtained. A suitable second force to be reduced can be set.

  Table 1 below is an example in which the first force and the second force are indexed. This index value is a value calculated by setting the length of the rollers 16 and 18 to 1 m.

<Other embodiments of the crimping apparatus>
FIG. 6 is a side view showing another embodiment of the crimping device 30.

  The crimping device 30 includes a roller conveyor 32 that transports the laminate 1 manufactured by the sticking device 10 shown in FIG. 3 in the horizontal direction and a laminate 1 that is transported by the roller conveyor 32 in the vertical direction. And a pair of rollers 34 and 36 to be applied to the laminate 1 having a force of two. The roller 34 is driven to rotate by being brought into sliding contact with the lower surface (reinforcing plate 3) of the laminated body 1 by the conveyance of the laminated body 1 in the arrow D direction.

  On the other hand, the roller 36 presses the substrate 2 against the reinforcing plate 3 with a second force by a load applied from the cylinder device 38 while being driven to rotate by sliding contact with the upper surface (substrate 2) of the laminate 1.

  Thereby, the laminated body 1 passes through the crimping | compression-bonding part by the rollers 34 and 36, and the remaining number of bubbles is reduced.

  FIG. 7 is a plan view of a bonding apparatus 40 including the crimping apparatus 30 illustrated in FIG. 6.

  The laminating device 40 separately arranges the laminating device 10 shown in FIG. 3 and the crimping device 30 shown in FIG. 6, and the substrate 2 and the reinforcing plate 3 by the robot 42, the transport mechanism 44, and the roller conveyor 32. This is an apparatus for manufacturing the laminate 1 with reduced warpage and bubbles while conveying the laminate 1 in a predetermined direction.

  The board | substrate 2 and the reinforcement board 3 are thrown into the insertion part 46 of the bonding apparatus 40, and are sequentially delivered to the conveyance mechanism 44 by the receiving operation | movement of the robot 42, rotation operation | movement, and delivery operation | movement after that. The substrate 2 and the reinforcing plate 3 are sequentially transported to the pasting device 10 by the transport mechanism 44 and pasted by the pasting device 10. Thereby, the laminated body 1 with which curvature was reduced is manufactured by the sticking apparatus 10. FIG.

  The laminated body 1 is taken out from the sticking device 10 by the transport mechanism 44 and received by the robot 42. Thereafter, the laminated body 1 is transferred to the roller conveyor 32 by the robot 42, conveyed by the roller conveyor 32, and passes through the crimping portion by the rollers 34 and 36 (see FIG. 6). Thereby, the laminated body 1 in which the number of remaining bubbles is reduced is manufactured.

  Like the bonding apparatus 40 of FIG. 7, the productivity of the laminated body 1 can be improved by separating the bonding apparatus 10 and the pressure bonding apparatus 30.

  As mentioned above, although one Embodiment of this invention was described, this invention is not restrict | limited to said embodiment. Various modifications and changes are possible within the scope of the gist of the present invention described in the claims.

  For example, the sticking apparatus 10 and the crimping apparatuses 20 and 30 of the embodiment are used for manufacturing the laminate 1 used in the manufacturing process of the electronic device, but the uses of the sticking apparatus 10 and the crimping apparatuses 20 and 30 are various. It's okay.

  Moreover, this application is based on the JP Patent application 2014-237358 of an application on November 25, 2014, The content is taken in here as a reference.

DESCRIPTION OF SYMBOLS 1 ... Laminated body 2 ... Board | substrate 2A ... Board | substrate 2B ... Board | substrate 3 ... Reinforcement board 3A ... Reinforcement board 3B ... Reinforcement board 4 ... Resin layer 4A ... Resin layer 4B ... Resin layer 6 ... Laminate body 7 ... Functional layer 10 ... Pasting apparatus 16 ... Roller 18 ... Rollers 20, 30 ... Pressing device 40 ... Bonding device

Claims (7)

In the bonding apparatus for bonding the first substrate and the second substrate having one side edge and the other side edge to each other via the adsorption layer,
The second substrate is pressed against the first substrate while being bent and deformed, and at least the entire surface of the second substrate is rolled from the one side edge toward the other side edge . A first roller attached to the first substrate by the force of
A second force larger than the first force is applied from at least one side edge to the other side edge with respect to the laminate in which the entire surface of the second substrate is bonded to the first substrate. A second roller that presses the entire surface of the second substrate against the first substrate by rolling and applying toward the first substrate;
The board | substrate bonding apparatus characterized by the above-mentioned.   The substrate bonding apparatus according to claim 1, wherein a diameter of the second roller is smaller than a diameter of the first roller.   The board | substrate bonding apparatus of Claim 1 or 2 with which the elasticity modulus of a said 2nd roller is larger than the elasticity modulus of a said 1st roller.   The board | substrate bonding apparatus of any one of Claims 1-3 with which the load added to a said 2nd roller is larger than the load added to a said 1st roller. In the bonding method of bonding the first substrate and the second substrate having one side edge and the other side edge to each other via the adsorption layer,
The second substrate is pressed against the first substrate while being bent and deformed by the first roller, and the first roller rolls from at least one of the side edges toward the other side edge. An attaching step of attaching the entire surface of the second substrate to the first substrate by a first force applied from the first roller,
A second force larger than the first force is applied from at least one side edge to the other side edge with respect to the laminate in which the entire surface of the second substrate is bonded to the first substrate. A crimping step of crimping the entire surface of the second substrate to the first substrate by applying from the second roller while rolling the second roller toward the surface;
The board | substrate bonding method characterized by having provided. The first force is obtained by multiplying the elastic modulus of the first roller by a load applied to the first roller, and using the value obtained by dividing the multiplied value by the diameter of the first roller as an index,
The second force is obtained by multiplying the elastic modulus of the second roller by a load applied to the second roller, and using the value obtained by dividing the multiplied value by the diameter of the second roller as an index.
The board | substrate bonding method of Claim 5 with which the parameter | index of said 2nd force is larger than the parameter | index of said 1st force. A laminate manufacturing step of manufacturing a laminate by bonding a first substrate and a second substrate having one side edge and the other side edge to each other via an adsorption layer; and Manufacturing an electronic device comprising: a functional layer forming step of forming a functional layer on an exposed surface of the first substrate; and a separation step of separating the second substrate from the first substrate on which the functional layer is formed. In the method
The laminate manufacturing process includes:
The second substrate is pressed against the first substrate while being bent and deformed by the first roller, and the first roller rolls from at least one of the side edges toward the other side edge. An attaching step of attaching the entire surface of the second substrate to the first substrate by a first force applied from the first roller,
A second force larger than the first force is applied from at least one side edge to the other side edge with respect to the laminate in which the entire surface of the second substrate is bonded to the first substrate. A crimping step of crimping the entire surface of the second substrate to the first substrate by applying from the second roller while rolling the second roller toward the surface;
An electronic device manufacturing method comprising:

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