KR20230152637A - Substrate assembly apparatus and substrate assembly method - Google Patents

Abstract

[Project] To provide a substrate assembly device and a substrate assembly method that can reduce substrate warpage.
[Solution] The substrate assembly device 1 holds one substrate on the lower table 10, holds the other substrate on the upper table 9 so that it faces the one substrate, and holds one of the substrates on the upper table 9. A substrate assembling device that performs bonding in a vacuum chamber using an adhesive provided in a substrate, comprising: a first lifter arranged sparsely and a second lifter arranged densely on the surface of the lower table 10 holding the substrate; After the substrate is raised by a predetermined amount by the lifter, the substrate is further raised by the first lifter. The upper table 9 and/or the lower table 10 have a plurality of convex portions and concave portions disposed adjacent to each other on the surface holding the substrate, and the width of the concave portions is greater than or equal to the upper table 9 and/or lower table ( With respect to the width of 10), the ratio is 10 ^-6 to 10 ^-5 .

Description

Board assembly device and board assembly method {SUBSTRATE ASSEMBLY APPARATUS AND SUBSTRATE ASSEMBLY METHOD}

The present invention relates to a substrate assembly device and a substrate assembly method for manufacturing a liquid crystal display, organic EL display, etc. by bonding substrates in a vacuum.

As a technology related to a substrate assembly device for bonding substrates in a vacuum, for example, in Patent Document 1, during the vacuuming process, the upper substrate is moved up and down to change the separation distance between the upper substrate and the lower substrate, A substrate assembly device that efficiently removes gas from between the lower substrate and the lower substrate is disclosed.

Additionally, in Patent Document 2, a workpiece joining device equipped with a table and antistatic means is proposed.

In Patent Document 3, in order to reduce deformation due to adiabatic compression and temperature changes of the table, a plurality of convex portions and concave portions are formed on the surfaces of the first and second holding members in contact with the non-bonding surface of the work. In addition, a vacuum bonding device is disclosed that suppresses the influence of temperature changes due to adiabatic expansion or adiabatic compression in microspaces on the workpiece by improving exhaust during pressure reduction (vacuumization).

Additionally, Patent Document 4 discloses a substrate assembly device in which irregularities and grooves are formed on the sheet surface to improve the problem of lower substrate misalignment due to expansion of residual air on the lower table side under reduced pressure.

Patent Document 5 discloses a substrate assembly device that can perform bonding with good precision without misalignment due to the peeling pin up/down mechanism or the adhesive pad up/down mechanism.

Japanese Patent Laid-Open No. 2017-80868 Japanese Patent No. 5654155 Publication Japanese Patent No. 6255546 Publication Japanese Patent Laid-Open No. 2003-283185 Japanese Patent Laid-Open No. 2005-134687

However, in recent years, the size of glass substrates bonded in a vacuum has progressed, and in the assembly apparatus disclosed in Patent Documents 1 to 3, the air remaining in the table groove etc. when vacuumed is discharged at high speed, causing static electricity. There is concern about the occurrence or warping of the glass substrate.

In addition, in the assembly apparatus disclosed in Patent Document 4 and Patent Document 5, the occurrence of warpage during the substrate lifting operation due to increased speed is a concern.

Accordingly, the present invention provides a substrate assembly device and a substrate assembly method that can reduce substrate warp.

In order to solve the above problem, a substrate assembly device related to the present invention holds one substrate on a lower table, holds the other substrate on an upper table so that it faces the one substrate, and provides a substrate on one of the substrates. A substrate assembly device that performs bonding in a vacuum chamber using an adhesive, comprising: a plurality of convex portions and concave portions disposed adjacent to each other on surfaces of the upper table and/or the lower table holding the substrate; and a width of the concave portions. The ratio is 10 ^-6 to 10 ^-4 with respect to the width of the upper table and/or the lower table, and the plurality of convex portions and concave portions arranged adjacent to each other are formed of an embossed sheet, and the upper table and / Or, it is characterized in that it is attached to the surface of the lower table holding the substrate with an adhesive.

In the substrate assembly device related to the present invention, the plurality of convex portions and concave portions disposed adjacent to each other are formed of an embossed sheet and are attached to the surface of the upper table and/or the lower table holding the substrate with an adhesive. It is characterized by having

The substrate assembly device related to the present invention is characterized in that the embossing sheet is made of polyethylene terephthalate and has a wavy longitudinal cross-section.

A substrate assembly device related to the present invention includes a vacuum suction mechanism having a plurality of suction pins on an suction pin plate that can be moved up and down independently of the upper table, and a purge gas blow mechanism on the upper table provided inside the chamber. It is characterized by being provided.

In addition, the method of assembling a substrate according to the present invention includes a step of holding one substrate on a lower table, a step of holding the other substrate on an upper table while opposing the one substrate, and an adhesive provided on one of the substrates. A substrate assembly method comprising a step of performing bonding in a vacuum chamber, comprising: a plurality of convex portions and concave portions disposed adjacent to each other on a surface of the upper table and/or the lower table holding the substrate; The width of the portion is in a ratio of 10 ^-6 to 10 ^-4 with respect to the width of the upper table and/or the lower table, and the plurality of convex portions and concave portions arranged adjacent to each other are formed of an embossed sheet, and the upper table It is characterized in that it is attached to the table and/or the surface of the lower table holding the substrate with an adhesive.

Another substrate assembly method related to the present invention is that the plurality of convex portions and concave portions disposed adjacent to each other are formed of an embossed sheet, and are attached to a surface of the upper table and/or the lower table holding the substrate with an adhesive. It is characterized by being

Another substrate assembly method related to the present invention is a substrate assembly method characterized in that the embossing sheet is made of polyethylene terephthalate and has a wavy longitudinal cross-section.

Another substrate assembly method related to the present invention is characterized in that the plurality of convex portions and concave portions disposed adjacent to each other are formed of an elastic plate provided on a surface of the upper table and/or the lower table holding the substrate. do.

In addition, the method of assembling a substrate according to the present invention includes a step of holding one substrate on a lower table, a step of holding the other substrate on an upper table while opposing the one substrate, and an adhesive provided on one of the substrates. A method of assembling a substrate having a step of performing bonding in a vacuum chamber, comprising: a plurality of convex portions and concave portions disposed adjacent to each other on a surface of the upper table and/or the lower table holding the substrate; The width of the section is characterized in that the ratio is 10 ^-6 to 10 ^-4 with respect to the width of the upper table and/or the lower table.

In addition, another substrate assembly method related to the present invention includes a step of holding one substrate on a lower table, a step of holding the other substrate on an upper table while opposing the one substrate, and a step of holding one substrate on an upper table, A method of assembling a substrate having a step of bonding in a vacuum chamber using an adhesive, comprising first lifters arranged sparsely and second lifters arranged densely, the second lifter being capable of penetrating the lower table, After the substrate is lifted by a predetermined amount by the second lifter, the substrate is further raised by the first lifter.

According to the present invention, it becomes possible to provide a substrate assembly device and a substrate assembly method that can reduce warpage of a glass substrate.

Problems, configurations, and effects other than those described above will become clear from the description of the embodiments below.

1 is a schematic configuration diagram of a substrate assembly device of Example 1 according to an embodiment of the present invention.
FIG. 2 is an explanatory diagram of a guide mechanism constituting the substrate assembly device shown in FIG. 1.
Figure 3 is a schematic explanatory diagram of the adhesive pin mechanism.
FIG. 4 is a longitudinal cross-sectional view of the elastic body of the upper and lower table surfaces shown in FIG. 3.
FIG. 5 is a flow chart showing the operation flow of the substrate assembly device shown in FIG. 1.
Figure 6 is a schematic diagram of the substrate assembly device of Example 2 according to another embodiment of the present invention, showing a top view and a side view of the lower table.
Fig. 7 is a flow chart showing the operation flow of the substrate assembly device of Example 2.
FIG. 8 is a longitudinal cross-sectional view showing a state in which the lower glass substrate is lifted by a predetermined amount by the second lifter shown in FIG. 6.
FIG. 9 is a longitudinal cross-sectional view showing a state in which the lower glass substrate is lifted by a predetermined amount by the first lifter shown in FIG. 6.

In this specification, a glass substrate is explained as an example as a substrate to be bonded in a vacuum, but the substrate to be bonded is not limited to a glass substrate.

Hereinafter, embodiments of the present invention will be described using the drawings.

[Example 1]

1 is a schematic configuration diagram of a substrate assembly device of Example 1 according to an embodiment of the present invention. As shown in FIG. 1, the substrate assembly device 1 includes a stand 15 and an upper frame 5 as rigid support members, and an upper chamber 7 and a lower chamber 8 inside the stand 15 and the upper frame 5 as rigid support members. It is available. In addition, the upper frame 5 is provided on the pedestal 15 side by rotating the ball screw 2b of the Z-axis drive motor 2a constituting the Z-axis drive mechanism 2. The upper frame 5 is configured to move in the vertical direction with respect to the stand 15 via the ball screw receiving portion 2c. Four sets of guiding mechanisms 3 are provided when the upper frame 5 moves up and down.

Fig. 2 shows an explanatory diagram of the guide mechanism constituting the substrate assembly device shown in Fig. 1. In Fig. 2, a partial cross-sectional view of the guide mechanism 3 is shown. As shown in FIG. 2, two linear guides 3a are provided on the beam 17 fixed on the side of the stand 15, and a linear moving part 3b is provided on the beam 18 fixed on the upper frame 5 side. there is. As shown in Fig. 2, one guide surface is combined so as to be perpendicular to the other guide surface.

Returning to Figure 1, a plurality of lower shafts 12 for supporting the lower table 10 are mounted above the stand 15. Each lower shaft 12 protrudes into the lower chamber 8 through a vacuum seal (not shown) to maintain airtightness within the lower chamber 8. In addition, between each lower shaft 12 and the lower table 10, an XYθ moving unit 13 is mounted to be independently movable in the XYθ direction. Additionally, the XYθ moving unit 13 may be configured by a mechanism using a ball bearing or the like that is fixed in the vertical direction and freely movable in the horizontal direction. In the horizontal direction (X, Y direction) of the lower table 10, a plurality of lower table horizontal drive mechanisms, not shown in the drawing, are provided outside the lower chamber 8, and the lower table side (lower table) is provided on the axis provided in the drive mechanism. It is configured so that positioning in the XYθ direction can be performed by pressing (thickness direction).

In addition, the lower chamber 8 and the upper chamber 7 are configured to be divisible, and a sealing not shown in the drawing is provided at the connection portion, thereby uniting the upper chamber 7 and the lower chamber 8. , Prevents air leakage when exhausting the interior.

A load cell 4 is provided at the connection portion of the upper frame 5 and the Z-axis drive mechanism 2, respectively. Inside the upper frame 5, the upper chamber 7 is mounted. The upper chamber 7 has a structure suspended from the upper frame 5 by a support shaft 6c and a bracket 7b. By moving the upper frame 5 up and down, the upper chamber 7 is connected to the lower chamber. It can be separated from (8). In addition, the upper frame 5 is provided with a plurality of upper shafts 6 toward the inside of the upper chamber 7 to support the upper table 9. The upper shaft 6 and the upper chamber 7 are connected by a vacuum seal to maintain airtightness within the chamber. In addition, the upper table 9 is fixed to the upper shaft 6 and has a structure in which the force when pressing the glass substrate can be detected by the load cell 4. In addition, the Z-axis drive mechanism 2 is capable of moving the upper chamber 7 and the upper table 9 up and down, and for this reason, the support shaft 6c provided on the upper frame 5 for the upper chamber 7 ) and a support shaft (upper shaft 6) on which the upper table 9 is provided on the upper frame 5 are provided, respectively. For this reason, when the upper chamber 7 is combined with the lower chamber 8, the support shaft 6c of the upper chamber 7 exerts a force to move it downward from the upper chamber 7 to the lower chamber 8. To prevent this from happening, it has a support structure with enough room. That is, a bracket 7b of a predetermined height is mounted on the upper chamber 7, and a flange portion inside the bracket 7b is brought into contact with the tip of the support shaft 6c of the upper chamber 7. When lifting the upper chamber 7, the flange portion of the support shaft 6c comes into contact with the bracket 7b, so that the upper chamber 7 and the upper table 9 can move upward as one unit. That is, when the upper shaft 6 is raised and the upper table 9 is moved upward by a predetermined amount within the upper chamber 7, the flange portion of the support shaft 6c comes into contact with the bracket 7b, and when it is further raised, the upper table 9 is moved upward by a predetermined amount within the upper chamber 7. The table 9 and the upper chamber 7 are configured to move upward together. In addition, the upper chamber 7 and the upper table 9 move as one body until the upper chamber 7 moves downward and becomes integrated with the lower chamber 8, and the upper chamber 7 and the lower chamber 8 ) is integrated, the upper table 9 can move independently toward the lower table 10.

In addition, as described above, in this embodiment, the upper table 9 and the lower table 10 are arranged to be spaced apart from the upper chamber 7 and the lower chamber 8, so that when the pressure inside the chamber is reduced, the chamber is deformed, but this deformation is not transmitted to the upper table 9 and the lower table 10, and the glass substrate can be held horizontally.

The upper table 9 is provided with an elastic plate 11 made of iron. An elastic body 11a is provided on the entire surface of the elastic plate 11 in contact with the glass substrate. The elastic plate 11 is fixed by screw fastening and the magnetic force of a plurality of magnets embedded in the upper table 9, and is configured to be exchangeable. Here, the upper table 9 is, for example, made of aluminum alloy, and although omitted in FIG. 1, an elastic plate 11 made of iron is similarly provided on the lower table 10, and the elastic plate 11 An elastic body 11b is provided on the entire surface in contact with the glass substrate. In addition, in this embodiment, a configuration is shown in which the elastic plate 11 and the elastic body 11a are provided on the upper table 9, and the elastic plate 11 and the elastic body 11b are provided on the lower table 10. It is not necessarily limited to this. That is, the elastic plate and elastic body may be provided only on either the upper table 9 or the lower table 10.

Figure 3 is a schematic explanatory diagram of the adhesive pin mechanism. As shown in Fig. 3, an adhesive pin driving mechanism 14 that can operate independently of the upper table 9 is installed on the upper chamber 7 or the upper frame 5. This adhesive pin drive mechanism 14 is comprised of a vertical drive motor 14a, an adhesive pin plate 14b on which a plurality of adhesive pins 14c are mounted, and an adhesive pin upward and downward mechanism 14d. The adhesive pin plate 14b and the adhesive pin 14c have a vacuum suction mechanism, and an adhesive sheet 14e is attached to the tip of the adhesive pin 14c. Additionally, the adhesive pin 14c has a structure that allows it to be removed from the adhesive pin plate 14b (it is made removable using a screw mechanism) and can be replaced. Inside the adhesive pin plate 14b, a negative pressure chamber that supplies negative pressure is connected to a negative pressure flow path (not shown) provided in the center of the adhesive pin 14c from the negative pressure chamber, and an open hole is provided at the tip of the adhesive pin 14c. ) is designed to supply negative pressure. An adhesive sheet 14e is provided at the tip of the adhesive pin 14c, excluding the opening portion. In addition, the adhesive pin upper and lower mechanism 14d, which moves the adhesive pin plate 14b up and down, and the upper chamber 7 are connected by a corrugated box-shaped elastic body, so that a vacuum state can be maintained. there is.

FIG. 4 is a longitudinal cross-sectional view of the elastic bodies 11a and 11b on the surfaces of the upper table 9 and lower table 10 shown in FIG. 3. FIG. 4 shows a longitudinal cross-sectional view of the elastic body 11b on the surface of the lower table 10, and has a structure in which the back surface of the glass substrate can contact the upper part in the longitudinal cross-section. Therefore, strictly speaking, in the elastic body 11a on the surface of the upper table 9, the vertical cross-sectional view shown in FIG. 4 is reversed. 4 is an enlarged view to show an example of the cross-sectional shape and dimensions of an elastic body having convex portions and concave portions. As shown in Fig. 4, the elastic body 11b on the surface of the lower table 10 has a plurality of convex portions and concave portions arranged adjacent to each other. The height of the convex portion is, for example, 25 μm, and the pitch of the convex portion (pitch along the width direction of the lower table 10) is about 500 μm. Additionally, the length of the lower table 10 of the convex portion along the width direction is about 460 μm, and the length of the lower table 10 of the concave portion along the width direction is about 40 μm. In addition, the elastic bodies 11a and 11b having a plurality of convex portions and concave portions arranged adjacent to each other are not shown in the drawings, but when viewed from the top, the plurality of convex portions have a square lattice shape, a triangular lattice shape, or a zigzag lattice shape. It is placed as . On the other hand, as described above, in recent years, the size of glass substrates bonded in vacuum has progressed, and the size of the glass substrate, for example, has become 3 m x 3 m. Therefore, the width of the elastic body 11a and/or the elastic body 11b relative to the width of the upper table 9 and/or the lower table 10 holding such a glass substrate (the upper table 9 and/or lower The width along the width direction of the table 10 has a ratio of 10 ^-6 to 10 ^-4 .

Accordingly, when the air remaining in the concave portion (groove portion) of the elastic body 11a and/or the elastic body 11b at the time of evacuation is exhausted, it is possible to prevent a large air flow rate from being generated. In other words, a plurality of thin exhaust passages are formed on the surface of the elastic body 11a and/or the elastic body 11b, making it possible to disperse the exhaust air remaining in the concave portion (groove portion). As a result of this, the occurrence of unevenness due to frictional charging with the substrate is reduced, the occurrence of unevenness due to temperature drop due to rapid adiabatic expansion is prevented, and the accuracy of substrate bonding is improved, resulting in larger, thinner, and larger sizes in the production of next-generation high-definition displays. With regard to fine patterning, it becomes possible to contribute to the manufacture of displays without color unevenness.

In addition, in this embodiment, the elastic plate 11 and the elastic body 11a are provided on the upper table 9, and the elastic plate 11 and the elastic body 11b are provided on the lower table 10, or, Although the configuration in which the elastic plate and elastic body are provided only on either the upper table 9 or the lower table 10 has been described, it is not limited to this. For example, an embossing sheet having a plurality of convex portions and concave portions disposed adjacent to each other as described above may be attached to the surface holding the glass substrate of the aluminum alloy upper table 9 with an adhesive. . Here, the embossed sheet is formed into a wave-shaped shape by, for example, embossing a sheet of polyethylene terephthalate (called PET). Additionally, similarly, the embossing sheet having a plurality of convex portions and concave portions arranged adjacent to each other as described above is attached to the surface holding the glass substrate of the lower table 10 made of aluminum alloy using an adhesive. do. Alternatively, the embossing sheet may be attached to only one of the upper table 9 or the lower table 10 with an adhesive.

In this way, by using an embossing sheet having a plurality of convex portions and concave portions arranged adjacent to each other, the above-described embossing sheet can be simply attached to the upper table and/or lower table constituting the existing substrate assembly device with an adhesive. , it becomes possible to obtain the substrate assembly device 1 of this embodiment.

Next, the operation of the substrate assembly device 1 will be described. FIG. 5 is a flow chart showing the operation flow of the substrate assembly device 1 shown in FIG. 1.

As shown in FIG. 5 , in step S11, the upper glass substrate with the bonding surface facing the lower table 10 is loaded onto the lower surface of the upper table 9 using a robot hand not shown in the drawing. A plurality of suction support nozzles (not shown in the drawing) and an adhesive pin drive mechanism 14 (FIG. 3) are lowered from the upper table 9, and the upper glass substrate is first adsorbed to the tip of the suction support nozzle (not shown). After that, the suction support nozzle is raised until the tip of the suction support nozzle is at the position of the adhesive pin surface, and negative pressure is supplied to the adhesive pin suction adsorption hole (not shown) provided in the adhesive pin 14c (FIG. 3) to remove the upper glass. The substrate is held on the surface of the adhesive sheet 14e. In addition, in this embodiment, a configuration is made in which a suction support nozzle is used separately from the adhesive pin mechanism, but the structure is not limited to this, and a configuration in which suction, adhesion and adhesive holding is performed using only the adhesive pin 14c without providing the suction support nozzle is also possible. do. The upper glass substrate is held on the adhesive sheet 14e provided at the tip of the adhesive pin 14c, the adhesive pin 14c is raised, and the upper glass substrate is mounted on the upper table 9. The elastic body of the elastic plate 11 is mounted on the upper table 9. (11a) is kept in contact with the surface.

In step S12, an adhesive (sealing agent) is applied to the surface of the lower glass substrate in an annular shape, and the lower glass substrate with an appropriate amount of liquid crystal dropped into the area surrounded by the adhesive is moved by a robot hand to the position of the lower table 10. Bring it in and place it on the support pin. In addition, instead of providing the adhesive on the lower glass substrate, the adhesive may be provided on the upper glass substrate side or may be provided on both the upper and lower glass substrates.

Next, the support pin is retracted toward the lower table 10 until the tip is inside the table surface or the table surface, and negative pressure is supplied to the suction hole provided in the lower table 10 to hold it. In addition, the lower table 10 is provided with an electrostatic suction mechanism, so that the glass substrate can be held so that it does not shift even when the inside of the chamber is in a vacuum state. In addition, the lower table 10 may also be configured to have an adhesive pin mechanism similar to the upper table 9. In this case, the moving distance of the adhesive pin can be set to be smaller than that of the upper table 9.

In step S13, after holding the upper and lower glass substrates on the adhesive pins 14c and the lower table 10, the Z-axis drive mechanism 2 is operated to move the upper frame 5, the upper chamber 7, and the upper table. (9) is lowered to unite the upper chamber (7) and the lower chamber (8) via a seal ring to form a vacuum chamber. In synchronization with this operation, the adhesive pin drive mechanism 14 is also lowered using the vertical drive motor 14a and the adhesive pin upward and downward mechanism 14d so that the positional relationship with the upper table 9 does not change. Also, at this time, the gap between the opposing surfaces of the upper substrate held on the upper table 9 and the lower substrate held on the lower table 10 is maintained at approximately several millimeters, and the upper substrate and the lower substrate are not brought into contact. Afterwards, although not shown in the drawing, the air in the vacuum chamber is exhausted through an exhaust port provided on the lower chamber 8 side to depressurize the vacuum chamber. When the vacuum chamber is in a reduced pressure state for bonding, a camera with a deep depth of focus (not shown) provided on the lower unit side is used to determine the amount of deviation between positioning marks previously provided on the upper and lower glass substrates. However, when the depth of focus of the camera is shallow, a mechanism is provided to move the camera up and down, and the positioning mark on the upper glass substrate is first recognized, and then the camera is moved downward to recognize the positioning mark on the lower glass substrate, thereby A method is taken to determine the amount of deviation of the positioning mark of the substrate. After that, the lower table 10 is moved by driving the XYθ moving unit 13 to correct the deviation in the XYθ direction of the upper and lower substrates. Additionally, this positioning operation can also be performed during the decompression process for joining.

In step S14, when the alignment of the upper and lower substrates is completed, the Z-axis drive mechanism 2 is operated to move the upper table 9 via the frame 5, and in synchronization with it, the adhesive pin drive mechanism 14 ) is moved toward the lower table 10 to bring the upper and lower glass substrates into contact. With the upper and lower glass substrates in contact, the amount of deviation of the positioning marks of the upper and lower glass substrates is checked again, and if there is any deviation, the positioning operation is performed again. When the confirmation and positioning operations are completed, only the upper table 9 is further lowered, and pressurization is performed to release the upper glass substrate from the adhesive pin 14c. When pressing the substrate, the elastic body 11a on the elastic plate 11 mounted on the upper table 9 is deformed, so that the entire substrate can be uniformly pressed. In addition, in some cases, the glass substrates held on both tables may be misaligned during pressurization, so it is better to observe the positioning marks at each time and correct the misalignment.

In step S15, when the upper and lower glass substrates are pressed and bonding is completed, a purge gas is introduced into the vacuum chamber from a purge gas blow mechanism not shown in the drawing. At this time, the atmosphere is also introduced and returns to atmospheric pressure. By returning the glass substrate to atmospheric pressure, a further pressing force is applied, and the glass substrate is pressed to a specified thickness. In that state, a UV irradiation mechanism not shown in the drawing is operated to cure the adhesive at multiple locations and perform temporary fixation, thereby completing bonding of the liquid crystal substrate.

In the above operation, the substrate is held by the adhesive pin 14c until the upper and lower glass substrates come into contact with the adhesive (sealing agent) provided on either glass substrate, and beyond that, the adhesive pin 14c is held downward. The adhesive pin 14c is peeled from the substrate surface by moving only the upper table 9 downward without moving it downward. Also, at this time, by moving the adhesive pin 14c in a direction opposite to the direction of movement of the glass substrate, the adhesive pin 14c can be reliably peeled from the substrate surface.

In addition, when applying a pressing force to the substrate, the adhesive pin is also moved to the lower table 10 side at the same time, and after the pressing is completed and returned to atmospheric pressure, the table maintains the same state as during pressing, and in that state, the adhesive pin driving mechanism ( 14) can be raised to separate the adhesive pin from the substrate. Also, at this time, the adhesive pin can be easily peeled from the substrate surface by raising the adhesive pin while sending positive pressure gas or clean air through the suction and adsorption hole at the tip of the adhesive pin.

In step S16, the bonded substrate is carried out of the vacuum chamber using a robot hand not shown in the drawing.

As described above, according to this embodiment, it becomes possible to provide a substrate assembly device and a substrate assembly method capable of reducing warpage of a glass substrate.

In addition, according to this embodiment, the occurrence of unevenness due to frictional charging with the substrate is reduced, the occurrence of unevenness due to temperature drop due to rapid adiabatic expansion is prevented, and the accuracy of substrate bonding is improved, thereby increasing the size in the production of next-generation high-definition displays. · With regard to thinning and fine patterning, it becomes possible to contribute to the manufacture of displays without color unevenness.

[Example 2]

Figure 6 is a schematic diagram of the substrate assembly apparatus of Example 2 according to another embodiment of the present invention, showing a top view and a side view of the lower table. This embodiment is different from the above-described embodiment 1 in that the first lifters 21 are sparsely arranged and the second lifters 22 are densely arranged so that they can penetrate the lower table 10. Hereinafter, the same symbols as in Example 1 are assigned to the same components, and descriptions overlapping with Example 1 are omitted.

FIG. 6 shows a top view and a side view of the lower table 10 constituting the substrate assembly device 1 of this embodiment. As shown in the top view, the substrate assembly device 1 of this embodiment includes a rod-shaped first lifter 21 extending in one direction, and a through hole provided in the lower table 10, as shown in the side view ( 23) and is provided with a second lifter 22 capable of moving up and down. For convenience of explanation, Figure 6 shows a case where there are 2 first lifters 21 and 24 second lifters 22, but the number of first lifters 21 and 22 is limited to this. It doesn't work. However, as shown in FIG. 6, the arrangement density of the first lifters 21 is sparse, and the arrangement density of the second lifters 22 is dense. In other words, if the first lifters 21 are sparsely arranged and the second lifters 22 are densely arranged, the number of the first lifters 21 and the second lifters 22 can be set appropriately.

Fig. 7 is a flow chart showing the operation flow of the substrate assembly device of this embodiment.

Since steps S21 to S25 in FIG. 7 are the same as steps S11 to S15 shown in FIG. 5 in Example 1 described above, description is omitted here.

In step S27, the second lifter 22 rises by a predetermined amount, causes the bonded substrate to protrude from the holding surface (surface) of the lower table 10 by a predetermined amount, and is bonded beyond the holding surface (surface) of the lower table 10. The next substrate is floated. Here, FIG. 8 shows a vertical cross-sectional view showing a state in which the lower glass substrate 16 is lifted by a predetermined amount by the second lifter 22 shown in FIG. 6. In FIG. 8, for convenience of explanation, the lower glass substrate 16 is shown raised by a predetermined amount, but this refers to the substrate after bonding. As shown in FIG. 8, the pitch P1 (pitch along the width direction of the lower table 10) of the second lifter 22 is, for example, 80 mm to 100 mm, and the diameter D1 of the second lifter 22 is, for example, 80 mm to 100 mm. is, for example, 5 mm, and the diameter of the through hole 23 is, for example, 8 mm. In addition, the amount h1 of the second lifter 22 lower table 10 raised from the holding surface (surface) is, for example, 1 mm to 3 mm. In addition, the second lifter 22 is formed of, for example, PEEK (polyetheretherketone) resin, and the tip portion in contact with the back surface of the lower glass substrate 16 has a curved shape with a predetermined radius of curvature. It is possible to prevent damage or scratches to the back surface of the lower glass substrate 16. The purge gas or atmospheric air introduced from the purge gas blow mechanism passes through the gap between the inner peripheral surface of the through hole 23 and the outer peripheral surface of the second lifter 22, as indicated by the arrow in FIG. 8, to the lower glass substrate 16. ) is sprayed and attached to the back side. In other words, the purge gas or the atmosphere enters the back surface of the lower glass substrate 16 through the gap between the inner peripheral surface of the through hole 23 and the outer peripheral surface of the second lifter 22.

Returning to Fig. 7, in step S27, the first lifter 21 rises a predetermined amount to further separate the lower glass substrate 16 from the holding surface (surface) of the lower table 10. Here, FIG. 9 shows a vertical cross-sectional view showing a state in which the lower glass substrate 16 is lifted by a predetermined amount by the first lifter 21 shown in FIG. 6. In FIG. 9 , as in FIG. 8 , the lower glass substrate 16 is shown raised by a predetermined amount for convenience of explanation, but this refers to the substrate after bonding. As shown in FIG. 9, the pitch P2 (pitch along the width direction of the lower table 10) of the first lifter 21 is, for example, 200 mm to 250 mm, and the lower table of the first lifter 21 The rise amount h2 from the holding surface (surface) of (10) is, for example, 100 to 200 mm. Therefore, the lifting amount h2 from the holding surface (surface) of the lower table 10 of the first lifter 21 is approximately the lifting amount h1 from the holding surface (surface) of the lower table 10 of the second lifter 22. It is 33 to 200 times.

In this way, in the initial stage when the back side of the lower glass substrate 16 constituting the bonded substrate is separated from the holding surface (surface) of the lower table 10 by step S26 described above, purge gas, or Atmosphere enters the back surface of the lower glass substrate 16 through the gap between the inner peripheral surface of the through hole 23 and the outer peripheral surface of the second lifter 22. At this time, the negative pressure between the back surface of the lower glass substrate 16 and the holding surface (surface) of the lower table 10 escapes through the through hole 23, preventing bending of the substrate after bonding due to the negative pressure. It becomes possible. Then, in step S27 described above, the lower glass substrate 16 is further separated from the holding surface (surface) of the lower table 10 by the first lifter 21, while preventing bending of the substrate after bonding, It becomes possible to further separate the properly bonded substrate from the holding surface (surface) of the lower table 10. As a result, this prevents the occurrence of unevenness due to bending of the glass substrate and contributes to the manufacture of displays without color unevenness in response to larger, thinner, and finer patterning in the manufacture of next-generation high-definition displays, improving quality, improving yield, and improving quality. It becomes possible to reduce costs and improve productivity.

Returning to FIG. 7, in step S28, the bonded substrate separated from the holding surface (surface) of the lower table 10 by the first lifter 21 is transferred to a robot hand not shown in the drawing, and is transferred to the robot hand. is taken out of the vacuum chamber.

As described above, according to this embodiment, it becomes possible to provide a substrate assembly device and a substrate assembly method capable of reducing warpage of a glass substrate.

In addition, according to this embodiment, the occurrence of unevenness due to bending of the glass substrate is prevented, and it contributes to the manufacture of displays without color unevenness in response to larger, thinner, and finer patterning in the manufacture of next-generation high-definition displays, improving quality. It becomes possible to improve yield, reduce costs, and improve productivity.

Additionally, the present invention is not limited to the above-described embodiments and includes various modifications. For example, the above-described embodiments have been described in detail in order to easily understand the present invention, and are not necessarily limited to having all the described configurations. In addition, it is possible to replace part of the configuration of one embodiment with the configuration of another embodiment, and it is also possible to add the configuration of another embodiment to the configuration of one embodiment.

One… board assembly device
2… Z-axis driving mechanism
2a… Z-axis drive motor
2b… ball screw
2c… ball screw receiver
3… guidance device
3a… linear guide
3b… Linear moving part
4… load cell
5… upper frame
6… upper shaft
7… upper chamber
7b… bracket
8… lower chamber
9… upper table
10… lower table
11… elastomer plate
11a, 11b… elastic body
12… lower shaft
13… XYθ moving unit
14… Adhesive pin driving mechanism
14a… Motor for up and down drive
14b… adhesive pin plate
14c… adhesive pin
14d… Adhesive pin upper and lower mechanism
14e… adhesive sheet
15… trestle
16… lower glass substrate
17, 18… beam
21… 1st lifter
22… 2nd lifter
23… through hole

Claims (3)

A substrate assembly device in which one substrate is held on a lower table, the other substrate is held on an upper table facing the one substrate, and bonding is performed in a vacuum chamber using an adhesive provided on one of the substrates, comprising:
an embossing sheet made of an elastic body having a plurality of convex portions and concave portions arranged adjacent to each other, and attached with an adhesive to a surface of the lower table holding the substrate;
Having a first lifter that is sparsely arranged and a second lifter that is densely arranged,
The second lifter is capable of penetrating the lower table, so that after the substrate is lifted by a predetermined amount by the second lifter, the substrate is further raised by the first lifter,
The lower table has a through hole through which the second lifter can penetrate, and when the substrate is lifted by a predetermined amount by the second lifter, a purge gas or A substrate assembly device characterized in that the atmosphere penetrates into the back surface of the substrate. According to claim 1,
A substrate assembly device wherein the lower table is provided with an electrostatic suction mechanism for holding the substrate on the lower table. According to claim 1,
A substrate assembly device wherein the lower table is provided with an adhesive pin mechanism for holding the substrate on the lower table.