JP2004102215A - Substrate assembling apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To solve such a problem that the occurrence of substrate deflection makes the secure retention of the substrate impossible when large-sized substrates are conveyed into a laminating apparatus and, in particular, the upper substrate is retained by a pressing plate (upper table). <P>SOLUTION: A suction pad which is vertically expandable and contractible is disposed near the central part of the pressing plate 2 (upper table), the suction pad is expanded in accordance with the amount of deflection of the conveyed upper substrate, a negative pressure is supplied to a suction hole disposed on the pressing plate, at the same time, the negative pressure is supplied to the suction pad, too, the substrate is sucked, thereafter, the suction pad is contracted in such a manner that the top end of the suction pad is located on the suction surface of the pressing plate and, thereby, the substrate is firmly retained by the pressing plate. <P>COPYRIGHT: (C)2004,JPO

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a substrate bonding apparatus, and more particularly, to a substrate assembling apparatus suitable for assembling a liquid crystal display panel or the like in which substrates to be bonded are held and opposed to each other in a decompression chamber, and the distance between the substrates is reduced.
[0002]
[Prior art]
In manufacturing a liquid crystal display panel, two glass substrates provided with a transparent electrode and a thin film transistor array are attached with an adhesive (hereinafter, also referred to as a sealing agent) provided on a peripheral portion of the substrate at an extremely close interval of about several μm. There is a step of bonding (hereinafter, the substrate after bonding is called a cell) and sealing a liquid crystal in a space formed by the bonding.
[0003]
To seal this liquid crystal, the liquid crystal is dropped on one substrate in which a sealing agent is drawn in a closed pattern so as not to provide an injection port, and the other substrate is placed on one substrate in a vacuum chamber. For example, there is a method proposed in Japanese Patent Application Laid-Open No. 2000-284295 in which the upper and lower substrates are arranged close to each other and bonded together.
[0004]
[Patent Document 1]
JP 2000-284295 A
[Problems to be solved by the invention]
In the prior art disclosed in Japanese Patent Application Laid-Open No. 2000-284295, the lower substrate is mounted on a flat stage for holding the substrate in a vacuum, but the upper substrate is suction-adsorbed by negative pressure in the atmospheric state. When a predetermined vacuum state is reached, the substrate is held by electrostatic attraction by electrostatic force. By the way, recently, there is a tendency that the size of the substrate becomes larger than 1 mx 1 m and the thickness of the substrate becomes thinner from 0.7 mm to 0.63 mm and 0.5 mm. Therefore, when the substrate is sucked and held by the pressing plate (at the upper table), the bending of the substrate increases the peripheral portion of the central portion of the substrate and the distance between the substrate and the pressing plate at the central portion of the substrate. When the pressure plate is delivered, the substrate may not be able to be held. In particular, in the case of holding a large-screen substrate, an alignment film, a TFT, and the like are formed in the center of the substrate, so that only the peripheral portion of the substrate can be supported, and it is difficult to prevent the substrate from bending. Also, the robot hand fingers for holding and transporting the substrate become long, and the tip side is bent when holding the substrate, so that the distance between the substrate and the pressure plate on the tip side of the robot hand also becomes large, and the substrate cannot be sucked. For this reason, unless the above-mentioned problem for a large-sized substrate is solved, accurate bonding cannot be performed.
[0006]
Also, if the substrate is sucked from the center and both ends in a state where the center of the substrate is bent, a residual stress is generated near the center (portion while being gripped) and the reference mark ( In some cases, the substrate is held in a state where the position of the alignment mark is shifted, and the bonding accuracy is reduced.
[0007]
Therefore, an object of the present invention is to provide a substrate assembling apparatus which can securely hold a substrate even when the substrate is enlarged, can perform bonding with high accuracy and at high speed, and has high productivity.
[0008]
[Means for Solving the Problems]
In order to achieve the above object, according to the present invention, a chamber for creating a reduced-pressure atmosphere, a pressure plate configured to hold one substrate in the chamber and move up and down, and a substrate held by the pressure plate A substrate holding table for holding the other substrate at an interval facing the other, driving the substrate holding table, performing alignment of the one substrate and the other substrate, and driving the pressing plate up and down. In a substrate assembling apparatus that narrows an interval between substrates and performs bonding in a reduced-pressure atmosphere with an adhesive provided on one of the substrates, a plurality of suction holes by negative pressure are used to hold the substrate on the pressure plate. In addition to the plurality of electrostatic suction mechanisms, a plurality of vertically movable suction pads are provided near the center of the pressure plate.
[0009]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, an embodiment of the present invention will be described with reference to the drawings.
[0010]
In FIG. 1, the substrate assembling apparatus includes a lower chamber T1 and an upper chamber T2. In the upper chamber T2, an upper table 2 (hereinafter, also referred to as a pressure plate) is provided so as to be vertically movable by supporting legs 3 and a plurality of adjusting legs 4 penetrating the upper chamber T2. The supporting leg 3 is blocked by an O-ring 5 and the adjusting leg 4 is blocked by a welding bellows 6 so that the inside of the upper chamber T2 does not communicate with the atmosphere. The support leg 3 and the adjustment leg 4 of the upper table 2 are fixed to the pressure base plate 7.
[0011]
Further, the center of the pressure base plate 7 is fixed to the intermediate base plate 8. The intermediate base plate 8 is configured to be able to move up and down by using a ball spline guide 13 as a guide by operating a drive mechanism including a drive motor 10 and a speed reducer 11 mounted on the ceiling frame 9 and a ball screw 12. I have. The ceiling frame 9 is supported by supporting columns provided on the gantry 1 separately from the ball spline guide. The other end of each adjustment leg 4 having one end fixed to the pressure base plate 7 is connected to a ball screw 15 driven by a drive motor 14 attached to the intermediate base plate 8. The upper table 2 can be moved up and down while maintaining flatness by driving a vertical adjustment mechanism including the drive motor 14 and the ball screw 15 to apply a force to the pressure base plate 7.
[0012]
The upper chamber T2 is provided with a fastening mechanism for coupling between the pressurized base plates 7, and when the upper chamber T2 is separated from the lower chamber T1, this fastening mechanism is operated to connect the pressurized base plate and the upper chamber T2. And the drive motor 10 is operated to lift it upward.
[0013]
Further, a door valve 16 for loading / unloading the substrate into / from the chamber is provided on the side outer wall of the upper chamber T2. Further, an ionizer 17 is provided at a position of the upper chamber side wall opposite to the door valve 16 so that the substrate can be neutralized by blowing ionized ultrasonic air onto the substrate surface. Further, an ionizer 17a is provided near the door valve 16 on the outside of the chamber, so that the ionization air can be blown while the door is opened, thereby improving the static elimination effect of the substrate.
[0014]
On the outer wall of the upper surface of the upper chamber T2, a plurality of sub-guides 18 having a bush structure are provided so as to project a center shaft 19 into the chamber. The center shaft 19 can adjust the horizontal direction of the upper table 2 by engaging with a hole provided in a protrusion provided on the outer periphery of the upper table 2. That is, the sub guide 18 and the center shaft 19 operate as a horizontal adjustment mechanism of the upper table 2.
[0015]
The upper chamber T2 is provided with a plurality of observation windows for observing substrate marks. The lens barrel 21 of the camera is inserted into the observation window, and the mark provided on the substrate is recognized by the camera. The lens barrel 21 of the camera is set on a moving stage having a horizontal (X, Y direction) moving axis and a vertical (Z direction) moving axis, and the moving stage is fixed on the upper chamber T2. It is. Further, the upper table 2 is provided with holes for recognizing substrate marks at positions corresponding to the observation windows.
[0016]
In the present embodiment, the camera is arranged outside the chamber. However, by adopting a structure in which the camera is directly attached to the upper table 2, the camera can be arranged close to the substrate, and the accuracy of mark recognition by the camera is improved. And the alignment accuracy between the substrates can be improved.
[0017]
Further, a load cell 22 is provided between the intermediate base plate 8 of the support leg 3 and the ball screw to measure the pressure applied to the substrate. Further, when adjusting the flatness of the upper table, in order to monitor the motor 14 for driving each adjustment leg 4 so as not to be overloaded, a load cell 23 is provided for each adjustment leg on the pressure base plate 7. It is provided.
[0018]
The lower table 24 is fixed in the lower chamber T1. When the entire surface of the lower table 24 is fixedly joined to the lower chamber T1, if the lower chamber T1 is deformed during decompression, the flatness may be deviated due to the deformation. Therefore, only the peripheral portion is fixed so as not to be affected by the deformation of the lower chamber T1. Further, a seal ring 25 described later is arranged all around the lower chamber T1, and when the upper chamber T2 is in contact and the door valve 16 is closed, the inside is confidential and a decompression chamber is formed.
[0019]
The lower chamber T1 is installed on a θ base table 28 that is configured to be rotationally driven by a motor 26, a ball screw (not shown), and a rotary bearing 27. When fastening the θ base table 28 and the lower chamber T1, a box-shaped member is interposed to secure a predetermined space. This space is provided for mounting the UV irradiation mechanism 40, the substrate holding claw elevating mechanism 41, and the substrate lift mechanism 42 below the lower chamber T1. base table 28 is mounted on Y table 32 via rotary bearing 27. Further, the Y table 32 is installed so as to be movable by a motor 29 on a linear rail provided on the X table 33. Further, the X table 33 is provided so as to be movable by driving a motor 30 on a linear rail provided on the gantry 1 side.
[0020]
Further, when the upper chamber T2 is brought into contact with the lower chamber T1 to form a decompression chamber, a plurality of ball chambers for the upper chamber are provided on the outer peripheral portion of the θ base table 28 in order to keep the amount of collapse of the seal ring 25 constant. 34 and a receiving seat 35 with an adjustment mechanism. The lower position of the upper chamber portion T2 is adjusted by the ball bear 34 and the receiving seat 35.
[0021]
Further, a plurality of ball carriers 37 for the θ base plate 28 and an adjustment mechanism are attached to a member fixed on the device base (stand) 1 so as to support the outer peripheral portion of the θ base table 28 so that the θ base table 28 is not deformed. An attached receiving seat 38 is provided. Thus, the load from the θ base plate 28 is received. As described above, the configuration is such that the load around the upper and lower chambers is received in two stages, the ball carrier 34 for the chamber and the ball carrier 37 for the θ base table, so that the deformation of the chamber can be suppressed to a small level.
[0022]
The lower chamber T1 is provided with a plurality of transmitted illuminations 39 for recognizing marks, and has holes at corresponding positions on the lower table 24. Further, a plurality of pressure / UV irradiation mechanisms 40 are provided in the lower chamber T1 in order to crush and cure the UV adhesive so that the bonded substrates do not shift. Further, when loading / unloading the substrate, the holding claw lifting / lowering mechanism 41 for preventing the bending in the width direction of the substrate, the bending of the robot hand, and the rotating lifting / lowering pin for preventing the bending of the substrate in the front-back direction, A substrate lift mechanism 43 for lifting the combined substrate is provided.
[0023]
The lower table 24 is provided with holes so that the pressure / UV irradiation mechanism 40 can move up and down in the lower table 24. The pressure / UV irradiation mechanism 40 can also be used as a rotary elevating pin. Grooves (notches) are provided on the substrate support side so that the substrate lift mechanism 43 can move up and down. When loading and unloading the substrate, the substrate lift mechanism 43 is operated so that the robot hand can be inserted into the lower surface of the substrate. Since these holes or grooves fix the lower table 24 to the lower chamber T1, it is only necessary to provide a minimum allowance.
[0024]
Further, the pressurizing / UV irradiation mechanism 40, the holding claw elevating mechanism 41, and the substrate lift mechanism 42 each have a vertical movement mechanism that penetrates the lower chamber T1, but the lower chamber T1 and these vertical movement mechanism parts And an O-ring is provided between them, thereby providing a structure for maintaining airtightness.
[0025]
The mechanism for holding the upper substrate by the upper table 2 in the depressurized state may be either a mechanism for holding electrically by an electrostatic chuck or a mechanism for holding physically by an adhesive. In the case of electrically holding by the electrostatic chuck, the holding by the upper table 2 can be interrupted by cutting off the applied voltage and raising the upper table 2 after a certain static elimination time. When holding with an adhesive material, a plurality of pins are provided for pressing the upper substrate mechanically against the lower substrate, and only the upper table 2 is raised while the pins are pressed downward, whereby the upper substrate is raised. Holding of the substrate can be interrupted.
[0026]
On the other hand, the mechanism for holding the lower substrate by the lower table 24 in a reduced pressure state is also a method including an electrostatic chucking mechanism for electrically holding by an electrostatic chuck, or an adhesive holding mechanism for physically holding by an adhesive. Any of the methods including The combination of the suction methods of the upper table 2 and the lower table 24 is such that either the upper table 2 or the lower table 24 is an electrostatic chuck, or either the upper table 2 or the lower table 24 is an electrostatic chuck. The other is preferably made of an adhesive material because it has a flat portion as a reference, and it is easy to assemble the tables in parallel, so that the upper and lower substrates can be uniformly bonded. In the present embodiment, the suction suction mechanism that performs suction suction using a negative pressure and the electrostatic suction mechanism that uses electrostatic force can be used.
[0027]
The pressure in the decompression chamber is reduced by connecting to a vacuum valve and a vacuum pump such as a dry pump or a turbo molecular pump through an exhaust port (not shown) provided in one of the upper and lower chambers. The venting of the atmosphere in the chamber is performed by introducing an inert gas such as nitrogen or the atmosphere through a valve provided in one of the upper and lower chambers (not shown). An air vent is preferably an inert gas such as nitrogen having a small content of water molecules, from the viewpoint of reducing adhesion of moisture to the chamber and shortening the time for depressurizing the inside of the chamber.
[0028]
As described above, as an example of the substrate assembling apparatus to which the present invention is applied, the configuration in which the decompression chamber can be divided into two has been described. However, the present invention is not limited to the configuration of this example. Any apparatus can be applied as long as the apparatus holds the substrates and moves the upper table toward the lower table holding the other substrate (narrows the substrate interval) in this state to bond the substrates together.
[0029]
FIG. 2 shows a structure of a hand portion of a robot hand to be carried into the substrate assembling apparatus. FIG. 3 shows a schematic diagram of substrate suction at the suction pad portion of the pressure plate.
[0030]
In FIG. 2, the hand portion of the robot hand is provided with a finger portion 51 for supporting a plurality of substrates 60 from an arm portion 52, and the finger portion 51 is provided with a plurality of suction pads 53. The suction pad 53 has a suction hole at a tip end thereof, so that the substrate 60 can be suctioned by a negative pressure. The suction pad 53 of the finger portion 51 can be moved up and down, and according to the number of chamfers of the substrate 60 to be held, the portion of the suction pad 53 that comes into contact with the surface of the liquid crystal display portion does not contact the substrate surface in advance. It is configured to be retracted to a position. For this reason, in the case of a single-chamfered substrate 60 as shown in FIG. 2B, of the suction pads 53 provided on the center finger, the central suction pad 53b is retracted so as not to contact the substrate surface. The substrate 60 is supported by the suction pad 53a in the peripheral portion.
[0031]
For this reason, as shown in FIG. 2B, the substrate is supported concavely at the center. In this state, when suction is performed by suction using a suction hole provided in the pressure plate (upper table) 2 due to a negative pressure, the substrate 60 may not be able to be held on the upper table 2 without applying a negative pressure to the central portion of the substrate 60. I do. Further, even when the substrate can be held, the suction of the substrate is not uniform, and a large tensile force acts locally on the substrate, which is one of the causes of a decrease in accuracy at the time of bonding. Therefore, in the present embodiment, as shown in FIG. 3, a plurality of suction pads which can be moved up and down so that the center of the substrate can be reliably sucked to the upper table (pressing plate) 2 are provided near the center of the pressing plate 2. Are provided.
[0032]
The suction pad includes an air cylinder 55 for moving up and down, a rod portion 57 that expands and contracts by the air cylinder 55, and a pad portion 56 at the tip. Although not shown, the rod portion 57 is hollow, and is configured to supply negative-pressure air thereto. A hole communicating with the hollow portion of the rod portion 57 is also provided in the pad portion 56 at the tip.
[0033]
Although not shown in FIG. 3, the suction surface of the pressure plate 2 is provided with a plurality of suction suction holes by a negative pressure. In the case of performing the work of transferring the substrate 60 from the robot hand 50 in the above-described configuration, the suction / suction mechanism using the negative pressure of the pressure plate 2 is operated, and the rod portion 57 of the suction pad that can move up and down is moved to the substrate side by a required amount. After being extended and holding the substrate 60 with the pad portion 56, the rod portion 57 is retracted to the substrate holding surface of the upper table 2 so that the suction portion is reliably sucked in the suction hole near the center. When bonding is performed by applying a pressing force to the substrate 60, a negative pressure is also supplied to the pad portion 56 as a suction suction hole. The pad portion 56 is made of an elastic material such as rubber so as not to damage the substrate 60 when it comes into contact with the substrate 60.
[0034]
In the present embodiment, the vertical movement of the rod portion 57 is performed by an air cylinder. In this embodiment, the drive unit is mounted outside the decompression chamber T2, but may be mounted on the side opposite to the pressing surface of the pressing plate. The amount of elongation of the rod portion 57 of the suction pad is set to a predetermined amount by measuring the amount of bending of the substrate in advance and changing the position of a stopper that suppresses elongation according to the measured amount. I have. Further, a motor or the like may be used as the driving device, or a sensor for measuring the amount of bending of each loaded substrate may be provided, and the amount of extension of the rod portion 57 may be controlled according to the measurement result. It is.
[0035]
In the above, the mechanism that operates when the central portion of the substrate 60 bends has been described. However, when the substrate 60 is carried in by a plurality of fingers 51 of the robot hand 50, the rigidity of the fingers 51 is increased. Therefore, the finger portion 51 becomes large and hinders the operation of the robot hand 50. Therefore, the rigidity of the finger portion 51 cannot be increased. For this reason, when the large substrate is carried in, the distal end of the finger portion 51 is bent as shown in FIG. 4, and the pressure plate 2 may not be able to suck the substrate 60 due to the negative pressure. Therefore, a substrate tip correction mechanism 70 having a correction claw for lifting the tip of the substrate 60 before sucking and sucking the upper substrate 60 is provided in the chamber. The substrate leading end correction mechanism 70 includes a substrate end holding unit 71 for holding an end of the substrate, and a finger holding unit 72 for lifting the finger 51 of the robot hand. The substrate end holding portion 71 is provided between adjacent finger portions of the robot hand, and corrects bending between the fingers of the substrate as shown in FIG. For this reason, the substrate end holding part 71 is provided not only on the tip end side of the finger part but also on the arm part side.
[0036]
In this drawing, a substrate tip correction mechanism 70 that moves up and down by a cylinder is provided in the lower chamber T1. Thus, even if the finger portion 51 of the robot hand 50 bends, the substrate 60 can be reliably attracted to the pressure plate 2.
[0037]
Instead of providing the substrate leading end correction mechanism 70, as in the previous embodiment, the position of the substrate holding part at the leading end side of the finger 51 of the robot hand 50 (the opposite side to the substrate entrance side of the chamber, that is, A pressure pad 2 provided with a vertical drive mechanism may be provided on the pressure plate 2 at a position corresponding to the position on the back side.
[0038]
FIG. 5 shows another embodiment of the present invention. In this embodiment, the suction suction holes provided in the pressure plate 2 are divided into a plurality of groups (R1, R2, R3), and a negative pressure source is provided so that the negative pressure supplied to each group can be varied. The two negative pressure sources are branched, and a pressure regulating valve is provided in the middle of the piping so that the pressure can be adjusted.
[0039]
In FIG. 5, the suction suction holes are divided into three groups R1, R2, R3, and each of the negative pressure sources can apply two negative pressures A1 and A2. Since an alignment film or the like of a liquid crystal panel is formed at the center of the substrate 60, it is supported by the suction pads 53 on both sides of the robot hand and is carried into the assembling apparatus. For this reason, as shown in FIG. 5A, the central portion of the substrate is deflected to be at a distance from the pressure plate 2. For this reason, a large negative pressure A1 is first applied to the suction suction hole R2 at the center to suck the center of the substrate (FIG. 5B). Next, by applying a negative pressure A2 smaller than the negative pressure A1 applied to the central portion to the suction suction holes R1 and R3 on both sides, the substrate 60 can be suctioned to the pressure plate 2 without distortion remaining on the substrate 60. (FIG. 5C). In this embodiment, the state in which the suction holes are divided into three groups has been described as an example. However, the suction holes are further divided into smaller groups, and the suction holes are further gradually suctioned from the central portion of the substrate toward the edge of the substrate, thereby further increasing the height. Accurate suction becomes possible. In this operation, a plurality of vertically movable suction pads 56 described with reference to FIG. 3 are arranged on the pressing plate 2, and the suction pads 56 are sequentially suction-adsorbed and pulled up toward the center or the periphery, and the corresponding pressing plate 2 is provided. It can also be realized by performing suction using a plurality of suction suction holes. Although not shown, the pressure plate is provided with an adhesive holding mechanism and an electrostatic suction mechanism in addition to the suction and suction mechanism described above in order to prevent the substrate from dropping when the pressure in the chamber of the substrate assembling apparatus is reduced. I have.
[0040]
Next, an operation of bonding the liquid crystal panels by the substrate assembling apparatus 1 according to the present invention will be described.
[0041]
First, the upper substrate with the adhesive applied in a black matrix or around the periphery of the liquid crystal panel in a frame shape is placed in an inverted state so that the surface on which the adhesive is applied is on the lower side, and the lower side of the robot hand is placed. On one finger located on the side. In addition, the lower substrate whose surface is coated with liquid crystal in advance is mounted on the other finger portion of the robot hand positioned above, with the liquid crystal dropping surface arranged above. In this way, the robot hand moves in front of the bonding apparatus with the two substrates mounted on the upper and lower finger portions. The substrate assembling apparatus 1 opens the door valve 16 in the upper chamber T2, and the robot hand inserts the inverted upper substrate on the lower finger into the apparatus.
[0042]
The substrate assembling apparatus 1 descends the upper table 2 and sucks and holds the inverted upper substrate under the upper table 2 by suction suction using a negative pressure. At this time, if the substrate is bent, the substrate leading end correction mechanism 70 and the suction pad are operated together to hold the substrate flat. In other words, when the substrate is bent, the suction pad is projected from the table surface to a position where the substrate can be sucked, and when the suction pad sucks the substrate, the suction pad is retracted until the suction pad surface reaches the position of the upper table surface. The substrate can be held flat on the table surface.
[0043]
If the suction holes of the upper table are divided into a plurality of groups, a negative pressure is applied sequentially from the suction holes at the center to the suction holes at the end so that the substrate remains free from distortion. It can be kept flat.
[0044]
Next, the lower robot hand once retreats from the inside of the substrate assembling apparatus 1, and after this retreat, the substrate assembling apparatus 1 removes the liquid crystal panel on the lower table 24, which has been already bonded, by the substrate lift mechanism 43, and The holding claw elevating mechanism 41 is used to lift up. In this state, the lower robot hand is again inserted under the liquid crystal panel in the board assembling apparatus 1 and the hand is lifted up. Then, the liquid crystal panel is taken out of the board assembling apparatus 1 by retracting. The substrate assembling apparatus 1 lowers the substrate lift mechanism 43 and the holding claw elevating mechanism 41.
[0045]
Next, the lower substrate on the upper robot hand, on which liquid crystal has been applied in advance, is inserted into the substrate assembling apparatus 1. The substrate assembling apparatus 1 raises the holding claw elevating mechanism 41, lifts the lower substrate, waits for the robot hand to retreat, sets the lower substrate on the lower table 24, and sucks and sucks the lower substrate.
[0046]
Next, the substrate mark position of the upper substrate is measured by moving the camera barrel 21 down the vertical movement axis, and using the horizontal movement axis, the mark center position of the upper substrate and the center of the camera barrel 21 are determined. Move to a matching position. Subsequently, the upper table 2 is lowered, and the displacement of the mark position between the upper substrate and the lower substrate is measured by the lens barrel 21 of the camera. Then, the ball carrier 34 is lifted by a lifting mechanism (not shown) to raise the upper chamber portion T2 through the receiving seat 35 with the adjusting mechanism, and the sealing ring 25 and the upper chamber portion T2 are slightly in contact with each other. The lower chamber T1 is driven by the motor 26, the motor 29, and the motor 30 so that the load of the upper chamber does not act on the seal ring. As a result, the lower table 24 is horizontally moved in the X, Y, and θ directions together with the lower chamber T1 to perform coarse positioning of the alignment marks on the lower substrate and the upper substrate. After the coarse positioning is completed, the ball bear 34 is lowered. Next, when the upper and lower tables use the substrate chuck by the electrostatic chuck, a voltage is applied to the electrostatic chuck to suck the substrate. In this state, the door valve 16 is closed and the inside of the decompression chamber is evacuated using a vacuum pump. During the evacuation, the upper table 2 is raised so that gas between the upper and lower substrates is easily exhausted.
[0047]
After the inside of the decompression chamber is reduced to a certain decompression state, the upper table 2 is lowered again, the displacement between the upper and lower substrates is measured, and the lower chamber T1 is driven by the motor 26, the motor 29, and the motor 30. By horizontally moving in the XYθ directions, fine positioning of the alignment marks on the lower substrate and the upper substrate is performed. After the fine positioning is completed, the upper table 2 is further lowered while measuring the value of the load cell 22, and the substrates are pressed and bonded. After the applied pressure reaches a predetermined value for crushing the adhesive, the pressurization is terminated, and the pressurizing / UV irradiation mechanism 40 presses the temporary adhesive UV adhesive applied in advance to the temporary fixing position of the substrate. UV light is radiated, and temporary fixing is performed so that the position of the substrate does not shift.
[0048]
After the temporary fixing is completed, the pressure / UV irradiation mechanism 40 is raised. When the upper table 2 utilizes suction in a vacuum by the electrostatic chuck, the voltage is cut off, and the upper table 2 is moved up after waiting for the charge elimination time. When the upper table 2 uses adhesive, the upper substrate is mechanically pressed against the lower substrate by a plurality of pins, and only the upper table is raised while the pins are pressed downward, thereby raising the upper table. The holding of the substrate is interrupted.
[0049]
After that, an inert gas such as nitrogen or the atmosphere is introduced into the decompression chamber through a valve provided in the decompression chamber and released to the atmosphere. Subsequently, the door valve 16 is opened to carry in and carry out the substrate. When performing maintenance such as cleaning in the vacuum chamber of the substrate assembling apparatus 1, the fastening mechanism attached to the upper chamber portion T2 is operated to integrate the pressure base plate 7 and the upper chamber T2 portion and drive the same. It is lifted in the Z-axis direction together with the upper table 2 using the motor 10. This makes it possible to perform maintenance on the upper and lower tables with the chamber open. As described above, in the present embodiment, when a large substrate is held on the upper table, the problem that the substrate cannot be reliably held on the upper table due to the bending of the substrate occurring when the substrate is loaded is solved. The bonding accuracy can be improved.
[0050]
【The invention's effect】
As described above, according to the substrate bonding apparatus of the present invention, when carrying the substrate into the apparatus, particularly when holding a large upper substrate on the upper table, reliably eliminate the influence of the bending generated in the substrate. Since the substrate can be held at a predetermined position, the accuracy of the alignment can be improved and the time required for the alignment can be reduced.
[Brief description of the drawings]
FIG. 1 is a diagram showing a configuration of a board assembling apparatus according to an embodiment of the present invention.
FIG. 2 is a diagram illustrating an outline of a robot hand used for carrying in a substrate.
FIG. 3 is a diagram illustrating a schematic configuration of a suction pad provided on a pressure plate and a method of holding a substrate when it is bent.
FIG. 4 is an explanatory diagram of a mechanism that corrects substrate deflection due to deflection of a finger portion of the robot hand.
FIG. 5 is a view of a pressure plate portion according to another embodiment of the present invention.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 ... Board assembly apparatus, 2 ... Upper table, 3 ... Support leg, 4 ... Adjustment leg, 5 ... O-ring, 6 ... Weld bellows, 7 ... Pressure base plate, 8 ... Intermediate base plate, 9 ... Ceiling frame, 10 ... Drive motor, 11 ... Reducer, 13 ... Ball spline guide, 14 ... Drive motor, 15 ... Ball screw, 16 ... Door valve, 17 ... Ionizer, 18 ... Sub guide, 19 ... Center shaft, 20 ... Observation window, 21 ... Camera , 22 ... Load cell, 23 ... Load cell, 24 ... Lower table, 25 ... Seal ring, 26 ... Motor, 27 ... Rotating bearing, 28 ... Base table, 29 ... Motor, 30 ... Motor, 31 ... Linear guide, 32: Y table, 33: X table, 34: Ball bearing, 35: Receiving seat with adjustment mechanism, 36: Device base, 37: Ball bearing, 38: A Receiving seat with cast mechanism, 39: transmission illumination, 40: pressurizing / UV irradiation mechanism, 41: holding claw elevating mechanism, 42: rotating elevating pin, 43: substrate lifting mechanism, 51: finger part, 53: suction pad, 56 ... pad part, 57 ... rod part, 60 ... substrate.

Claims (8)

A chamber for reducing the pressure, a pressure plate configured to hold one substrate in the chamber and move up and down, and to separate the other substrate at an interval facing the substrate held by the pressure plate. The substrate holding table to be held and the substrate holding table are driven to position the one substrate and the other substrate, and the pressure plate is driven up and down to reduce the distance between the substrates. In a substrate assembling apparatus that performs bonding in a reduced pressure atmosphere with an adhesive provided on one side,
The pressure plate has a plurality of suction holes by a negative pressure to hold a substrate, and among the plurality of suction holes, suction holes near and around the center of the pressure plate are provided on a plurality of suction pads having a vertical movement mechanism. A substrate assembling apparatus, comprising: 2. The substrate assembling apparatus according to claim 1, wherein the plurality of suction pads are provided near a central portion of the pressure plate. 3. The substrate assembling apparatus according to claim 1, wherein a plurality of suction pads are provided at an end of the pressing plate opposite to the substrate carrying-in port and at an end thereof. A chamber for reducing the pressure, a pressure plate configured to hold one substrate in the chamber and move up and down, and to separate the other substrate at an interval facing the substrate held by the pressure plate. The substrate holding table to be held and the substrate holding table are driven to position the one substrate and the other substrate, and the pressure plate is driven up and down to reduce the distance between the substrates. In a substrate assembling apparatus that performs bonding in a reduced pressure atmosphere with an adhesive provided on one side,
A substrate assembling apparatus, wherein a substrate tip correcting mechanism for pushing up a substrate to a pressure plate side in accordance with an amount of bending of a finger end of a robot hand for transporting the substrate to the pressure plate is provided in a chamber. A chamber for reducing the pressure, a pressure plate configured to hold one substrate in the chamber and move up and down, and to separate the other substrate at an interval facing the substrate held by the pressure plate. The substrate holding table to be held and the substrate holding table are driven to position the one substrate and the other substrate, and the pressure plate is driven up and down to reduce the distance between the substrates. In a substrate assembling apparatus that performs bonding in a reduced pressure atmosphere with an adhesive provided on one side,
A substrate assembling apparatus having a configuration in which a plurality of suction suction holes are divided into three or more groups for suction suction by the pressure plate, and a negative pressure source or a pressure regulating valve is provided so that suction force can be varied for each group. . The substrate assembling apparatus according to any one of claims 1 to 5,
A substrate assembling apparatus comprising an electrostatic suction mechanism or an adhesive holding mechanism for holding the substrate when the pressure in the chamber is reduced. In a vacuum chamber, two substrates are opposed to each other with a space between them up and down, held by suction and suction on the upper and lower tables, respectively, aligned, and provided with one of the substrates by narrowing the space between both substrates. In the substrate assembling method of bonding both substrates with the adhesive,
A method of assembling a substrate, wherein, when the upper table substrate is held, a suction force is applied from a central portion of the substrate. In a vacuum chamber, two substrates are opposed to each other with a space between them up and down, held by suction and suction on the upper and lower tables, respectively, aligned, and provided with one of the substrates by narrowing the space between both substrates. In the substrate assembling method of bonding both substrates with the adhesive,
When holding the upper table substrate, the substrate assembly is characterized in that the substrate is suction-adsorbed by a suction pad provided with a vertical moving mechanism and sequentially pulled up from the central portion of the substrate toward the periphery, and then is suctioned to the upper table. Method.

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