JP2010175584A - Substrate bonding apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a substrate bonding apparatus configured so as to shorten vacuum exhaust time in an inside space between an upper chamber and a lower chamber when bonding substrates to each other. <P>SOLUTION: The substrate bonding apparatus includes: the upper chamber; the lower chamber forming a bonding space in contact with the upper chamber; an upper chuck which is arranged under the upper chamber and to which a first substrate is stuck; a lower chuck which is combined with the upper surface of the lower chamber and formed integrally with the lower chamber and to which a second substrate is stuck; a position control means arranged above the upper chamber to control the position of the first substrate; and an exhaust part arranged above the upper chamber to provide vacuum pressure between the bonding space. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a substrate bonding apparatus, and more particularly to a substrate bonding apparatus for a flat panel display panel for bonding substrates in a flat panel display manufacturing process.

With the development of the information society, the demand for display devices has increased in various forms. Recently, LCD (Liquid Crystal Display), PDP (Plasma Display)
Various flat panel displays such as Pannel) and ELD (Electro Luminescent Display) have been studied, and some of them are already widely used in real life.

  Of these, LCDs have superior image quality compared to CRTs (Cathode Ray Tubes), and are widely used in mobile image display devices due to their advantages of light weight, thinness, and low power consumption. A typical example of a liquid crystal display panel used in an LCD is a TFT-LCD panel. A TFT-LCD panel has an array substrate on which a plurality of TFTs (Thin Film Transistors) are formed in a matrix type and a color filter substrate on which a color filter, a light-shielding film, etc. are formed with an interval of about several μm. The panels are manufactured by being bonded to each other and injected and sealed before, during or after bonding.

  Therefore, in manufacturing a liquid crystal display panel used for an LCD, it is essential to have a process of manufacturing an array substrate and a color filter substrate, and then bonding the two substrates together and injecting a liquid crystal material into the space between them. Among them, the process of attaching the substrates is one of the important processes for determining the quality of the LCD.

  In general, the substrate bonding step is performed by a substrate bonding apparatus including an upper chamber and a lower chamber that can be formed in a vacuum state. When the upper chamber and the lower chamber form a joining space, the volume inside the upper chamber and the lower chamber increases. As a result, there arises a problem that the evacuation time for forming the vacuum pressure in the bonding space becomes long. In addition, since the volumes inside the upper chamber and the lower chamber are large, the number of vacuum pumps used when the joining space is evacuated increases, and the power consumed increases.

JP 2004-31934 A

  An object of the present invention is to provide a substrate bonding apparatus that shortens the evacuation time inside the upper chamber and the lower chamber when bonding between substrates.

  The substrate bonding apparatus according to the present embodiment includes an upper chamber, a lower chamber in contact with the upper chamber to form a bonding space, an upper chuck disposed below the upper chamber to which a first substrate is attached, and the lower A lower chuck coupled to the upper surface of the chamber and integrally formed with the lower chamber to which a second substrate is attached; a position adjusting means disposed above the upper chamber to adjust the position of the first substrate; And an exhaust unit provided above the upper chamber and providing a vacuum pressure to the bonding space.

  In the present invention, the space between the upper chamber and the lower chamber can be minimized at the time of bonding between the substrates to shorten the evacuation time. In addition, since the space inside the upper chamber and the lower chamber is minimized, the number of vacuum pumps for evacuation can be minimized. Along with this, there is an advantage that the power consumed for performing the process can be reduced.

It is the schematic sectional drawing which showed the board | substrate bonding apparatus by a present Example. It is the flowchart which showed the board | substrate bonding method by a present Example. It is the operation | movement figure which showed the operation state of the board | substrate bonding apparatus by a present Example. It is the operation | movement figure which showed the operation state of the board | substrate bonding apparatus by a present Example. It is the operation | movement figure which showed the operation state of the board | substrate bonding apparatus by a present Example. It is the operation | movement figure which showed the operation state of the board | substrate bonding apparatus by a present Example. It is the schematic sectional drawing which showed the board | substrate bonding apparatus by another Example.

  Below, the board | substrate bonding apparatus by a present Example is demonstrated. Hereinafter, the same components in different embodiments will be described with the same reference numerals.

<First embodiment>
FIG. 1 is a schematic cross-sectional view showing a substrate bonding apparatus according to a first embodiment.

  Referring to FIG. 1, the substrate bonding apparatus 100 includes a frame 200, an upper chamber 300, a lower chamber 400, a driving unit 500, and a position adjusting unit 600.

  The frame (200) is for forming the outer shape of the substrate bonding apparatus (100) to support and fix each component. The frame (200) includes a plurality of pillars (210) that form a lower portion of the frame (200) and are fixed to the outer peripheral surface of the base (220), and a base (220) that fixes the driving unit (500). Separate beams (not shown) and struts (not shown) for reinforcing the strength of the pillars (210) may be additionally provided between the pillars (210).

  A first support bar (310) is provided at the top of each column (210) and is connected and fixed to the side of the upper chamber (300). Accordingly, the upper chamber (300) is fixed by the first support bar (310). Further, a second support bar 410 for supporting the lower chamber 400 is provided below each pillar 210. Accordingly, the lower chamber (400) is supported by the second support bar (410).

  The upper chamber 300 is fixed to the upper portion of the frame 200, and the lower surface of the upper chamber 300 is in close contact with the lower chamber 400 to form a bonding space. The upper surface plate (320) is disposed below the upper chamber (300), and the upper surface edge portion of the upper surface plate (320) is attached to a position adjusting means (600) described later. The upper chuck (330) is attached to the lower surface of the upper surface plate (320), and the first substrate (P1) is attached to the lower surface of the upper chuck (330). The upper chuck 330 is preferably provided with an electrostatic chuck (ESC) that attaches the first substrate P1 by electrostatic force. The upper surface plate 320 may be formed integrally with the upper chuck 330. At this time, the upper surface plate 320 attaches the first substrate P1.

  On the upper surface of the upper chamber (300), a camera unit (340) for adjusting the relative positions of the first substrate (P1) and the second substrate (P2), and a first chuck (330) are connected to the first chamber (300). A substrate separation device (350) that adsorbs or pressurizes the first substrate (P1) is disposed in order to attach or separate the substrate (P1).

  The camera unit (340) is attached to the upper chuck (330) of the upper platen (320) through a through hole (341) formed in the upper chamber (300) and the upper platen (320). The alignment state of the substrate (P1) and the second substrate (P2) described later is read.

  The camera unit (340) is mounted such that alignment marks (not shown) provided on the first substrate (P1) and the second substrate (P2) can be superposed and observed, and at least the first substrate. Arranged so that two or more diagonal edges of (P1) and the second substrate (P2) are superposed.

  The substrate separation apparatus 350 includes a plurality of separation pins 351 disposed through the upper chamber 300 and the upper surface plate 330, and separation pins (351) disposed outside the upper chamber 300. 351) includes a separating pin actuating body (352).

  The separation pin (351) is provided in a hollow tubular shape. The separation pin (351) forms a vacuum pressure inside the separation pin (351) to adsorb the first substrate (P1), and then the upper chuck (330). Adhere by adhesion. In addition, after the first substrate (P1) is attached to the upper chuck (330), the separation pin (351) is connected to the first substrate (P1) and the second substrate (P2) when the first substrate (P1) is attached. The vacuum pressure is cut off in order to allow the substrate (P1) to freely drop onto the second substrate (P2). Accordingly, the first substrate (P1) is separated from the upper chuck (330).

  The lower chamber (400) is disposed below the upper chamber (300), and is in close contact with the upper chamber (300) while moving up and down toward the upper chamber (300) to form a bonding space. The lower chuck 420 is coupled to the upper surface of the lower chamber 400 and is integrally formed with the lower chamber 400.

  The lower chuck 420 is coupled to the upper surface of the lower chamber 400 and is integrally formed with the lower chamber 400, and is lifted and lowered by a substrate lifting device 430, which will be described later. The lower chuck (420) attaches the second substrate (P2). Since the lower chuck (420) is coupled to the upper surface of the lower chamber (400) and is integrally formed with the lower chamber (400), the internal volume of the chamber (300, 400) is reduced. There is an effect that the evacuation time can be shortened. This is because the lower chuck (420) is coupled to the upper surface of the lower chamber (400) by providing a position adjusting means (600) to be described later above the upper chamber (300) which is not the lower chamber (400). 400) can be integrally formed. In addition, since the internal volume of the chamber (300, 400) is reduced, the number of vacuum pumps for evacuation of the joining space is reduced, and there is an advantage that power consumed can be reduced. In addition, since the lower chuck (420) is integrally formed with the lower chamber (400), the manufacturing cost of the equipment can be reduced.

  The lower chuck (420) is preferably provided with an electrostatic chuck (ESC) that attaches the second substrate (P2) by electrostatic force.

  A sealing member (440) is provided around the lower chamber (400) to contact the lower surface of the upper chamber (300) to maintain the secret of the bonding space.

  The second substrate (P2) is attached to the lower chuck (420) on the lower surface of the lower chamber (400), or the second substrate (P2) attached to the lower chuck (420) is attached to the lower chuck (420). A substrate lifting device (430) for separation is disposed.

  The substrate lifting apparatus 430 includes a plurality of lifting pins 431 disposed through the lower chamber 400 and the lower chuck 420, and a plurality of lifting pins provided outside the lower chamber 400. And a lifting pin actuating body (432) for lifting and lowering (431).

  The raising / lowering pin (431) is provided in a hollow tubular shape. When the second substrate (P2) is carried into the chamber (300, 400), the elevating pins (431) are raised to support the second substrate (P2). In addition, after the first substrate (P1) and the second substrate (P2) are bonded, the lift pins (431) are moved up and down to move the bonded substrate (P1 + P2). P1 + P2) is separated from the lower chamber (400).

  The lower exhaust part (450) is provided below the lower chamber (400). The lower exhaust part (450) is for forming a vacuum pressure in a joining space formed by the upper chamber (300) and the lower chamber (400). The lower exhaust part (450) includes a vacuum pump (not shown) provided separately outside, and a lower exhaust pipe (451) that communicates the vacuum pump with the joining space.

  The lower exhaust pipe (451) is connected to a vacuum pump for forming a vacuum pressure in the coalescing space to form a vacuum pressure, and at the time of coalescence, supplies a necessary N2 processing gas or pressure in the coalescing space. Can be provided to supply the pressure gas so that it is formed at atmospheric pressure. The vacuum pump may be a dry pump, a turbomolecular pump (TMP), a mechanical booster pump, or the like.

  The driving unit 500 is disposed at a lower portion of the frame 200 and moves the lower chamber 400 toward the upper chamber 300 so that the lower chamber 400 and the upper chamber 300 form a joining space. Move up and down. The driving unit 500 is provided at each edge of the base 220 of the frame 200. The driving unit 500 includes a lifting column 510 that supports the lower chamber 400 and a lifting unit 520 that lifts the lifting column 510.

  Such a lifting body (520) is provided with a hydraulic cylinder (not shown) that directly generates power for raising and lowering the lower chamber (400), or a motor (not shown) and the power generated by the motor. It is also possible to provide a combination of a speed reducer (not shown) for switching the direction and a screw combination (not shown) for switching the rotational motion of the speed reducer to a linear motion. The structure of the elevating body 520 can be implemented by various embodiments, and is not limited to the above-described structure.

  The position adjusting means 600 is disposed above the upper chamber 300 and adjusts the position of the first substrate P1. The position adjusting means (600) may be a UVW table (600) that horizontally moves the first substrate (P1).

  The UVW table 600 is attached to the upper surface of the UVW drive shaft 610 and the UVW drive shaft 610 that horizontally moves the first substrate P1 through the upper chamber 300, and the UVW drive shaft. (610) and a UVW drive shaft actuator (620) for transmitting a drive force.

  The UVW drive shaft (610) passes through the upper chamber (300) and is attached to the upper surface edge portion of the upper surface plate (320). Accordingly, the UVW drive shaft (610) is attached to the upper surface edge portion of the upper surface plate (320) and horizontally moves the upper surface plate (320) together with the first substrate (P1).

  The upper surface of the UVW drive shaft operating body (620) is attached to an elevating plate (630) described later, and the lower surface is attached to a UVW drive shaft (610). The UVW driving shaft operating body (620) transmits a driving force to the UVW driving shaft (610) to horizontally move the first substrate (P1). Accordingly, the upper surface plate (320) attached to the UVW drive shaft (610) and the upper chuck (330) attached to the upper surface plate (320) move horizontally, whereby the upper chuck (330 The first substrate (P1) attached to the second substrate moves horizontally with respect to the second substrate (P2).

  The linear actuator (640) is disposed on the top of each column (210) of the frame (200) and attached to the upper surface of the first support bar (310). The upper surface of the linear actuator (640) is in contact with an elevator plate (630) described later to support the elevator plate (630). The linear actuator (640) moves the lifting plate (630) up and down, and as a result, the UVW table (600) attached to the lifting plate (630) is lifted and lowered. Accordingly, the linear actuator (640) adjusts the distance between the first substrate (P1) and the second substrate (P2) by moving the upper surface plate (320) attached to the UVW table (600) up and down. To do.

  The elevating plate (630) is supported by the linear actuator (640) with the linear actuator (640) attached to the lower surface edge portion of the elevating plate (630). Further, the UVW table (600) is attached to the lower surface of the lifting plate (630), and the UVW table (600) is also moved up and down by moving the linear actuator (640) up and down. Accordingly, the distance between the first substrate (P1) and the second substrate (P2) is adjusted by moving up and down the upper surface plate (320) attached to the UVW table (600).

  FIG. 2 is a flow chart illustrating a substrate bonding method according to the first embodiment, and FIGS. 3 to 6 are operation diagrams illustrating operating states of the substrate bonding apparatus according to the first embodiment.

  2 to 6, first, the first substrate P1 and the second substrate P2 are supplied between the upper chamber 300 and the lower chamber 400 by a substrate supply device (not shown). .

  When the first substrate (P1) is supplied first, the first substrate (P1) is placed between the upper chamber (300) and the lower chamber (400) to be arranged in the upper chamber (300). The upper surface plate 320 is attached by the upper chuck 330.

  When the second substrate (P2) is supplied, the elevating pins (431) disposed in the lower chamber (400) are raised and raised to the upper portion of the lower chamber (400) by the elevating pin operating body (432). The second substrate (P2) positioned between the upper chamber (300) and the lower chamber (400) is supported by the lift pins (431). While the elevating pin (431) is lowered by the elevating pin actuating body (432), the second substrate (P2) supported by the elevating pin (431) is lowered together and is positioned below the second substrate (P2). The lower chuck (420) is attached by the adhesion force (S110) (see FIG. 3).

  When the attachment of the first substrate (P1) and the second substrate (P2) is completed, the lower chamber (400) is raised to the upper chamber (300) side by the driving unit (500), and the upper surface of the lower chamber (400). Is in close contact with the lower surface of the upper chamber (300), and a bonding space for bonding the first substrate (P1) and the second substrate (P2) is formed (S120) (see FIG. 4). .

  The lower chamber (400) is supported by a plurality of drive units (500) that can operate independently. The elevating bodies (520) disposed in the respective driving units (500) operate independently, and the lower chamber (400) is raised by the elevating columns (510) raised and lowered by the respective elevating bodies (520) to raise the upper chamber ( 300), the lower chamber 400 and the upper chamber 300 form a joining space. At this time, the upper chamber (300) and the lower chamber (400) are kept secret by a sealing member (440) disposed around the upper surface of the lower chamber (400).

  When the bonding space is formed, the distance between the first substrate (P1) and the second substrate (P2) is adjusted by the linear actuator (640), and the first substrate (P1) is adjusted by the UVW table (600). ) Is adjusted (aligned) with respect to the second substrate P2 (S130).

  The upper surface of the linear actuator (640) is in contact with the lifting plate (630) to support the lifting plate (630). The linear actuator (640) moves the lifting plate (630) up and down, and as a result, the UVW table (600) attached to the lifting plate (630) is lifted and lowered. Accordingly, the linear actuator (640) adjusts the distance between the first substrate (P1) and the second substrate (P2) by moving the upper surface plate (320) attached to the UVW table (600) up and down. To do.

  At this time, the camera unit 340 captures an alignment mark (not shown) of the first substrate (P1) and the second substrate (P2) to capture the first substrate (P1) and the second substrate (P2). ) Check the alignment status. Further, the UVW table 600 adjusts (aligns) the position of the first substrate (P1) with respect to the second substrate (P2) by adjusting the position of the upper surface plate (320). That is, the UVW table 600 horizontally moves the upper surface plate 320 and the upper chuck 330 together with the first substrate P1.

  When the distance adjustment and the position adjustment are completed, a vacuum pressure is formed in the bonding space, and the first substrate (P1) attached to the upper chuck (330) is freely dropped onto the second substrate (P2). The first substrate (P1) and the second substrate (P2) are temporarily joined. Thereafter, an N2 processing gas is supplied to the outside of the temporarily bonded first substrate (P1) and second substrate (P2) and pressure is applied, whereby the first substrate (P1) and the second substrate ( P2) is firmly attached and bonded (S140) (see FIG. 5). That is, by increasing the pressure in the bonding space, the first substrate (P1) and the second substrate are caused by the pressure difference between the inside and the outside of the temporarily bonded first substrate (P1) and the second substrate (P2). The substrate (P2) is bonded.

  When the bonding of the first substrate (P1) and the second substrate (P2) is completed, the pressure in the bonding space is restored to the atmospheric pressure state, and the bonded substrate is removed from the substrate bonding apparatus (100). (S150) (see FIG. 6). At this time, the reason why the pressure is restored to the atmospheric pressure state is that control of the pressure is easy, and the subsequent substrate carrying-out work is performed in the atmospheric pressure state, so that no further steps are necessary.

  On the other hand, FIG. 7 is a schematic sectional view showing a substrate bonding apparatus according to another embodiment. The description of the same configuration as that of the embodiment described above with reference to FIG. As shown in FIG. 7, the exhaust part of the present embodiment is provided with an upper exhaust part (360) connected to the upper chamber (300).

  The upper exhaust part (360) is provided above the upper chamber (300). The upper exhaust part (360) is for forming a vacuum pressure in a joining space formed by the upper chamber (300) and a lower chamber (400) described later. The upper exhaust part (360) includes a vacuum pump (not shown) provided separately outside, and an upper exhaust pipe (361) that communicates the vacuum pump with the joining space.

  The upper exhaust pipe (361) is connected to a vacuum pump for forming a vacuum pressure in the coalescing space to form a vacuum pressure, and at the time of coalescence, supplies a necessary N2 processing gas, or pressure in the coalescing space. Can be provided to supply the pressure gas so that it is formed at atmospheric pressure. The vacuum pump may be a dry pump, a turbomolecular pump (TMP), a mechanical booster pump, or the like.

  As described above, the preferred embodiments of the present invention have been described in detail. However, those skilled in the art to which the present invention pertains have ordinary knowledge, and the present invention defined in the appended claims. The present invention can be variously modified and implemented without departing from the spirit and scope of the present invention. Therefore, future modifications of the embodiments of the present invention cannot deviate from the technology of the present invention.

  For example, components having other additional functions can be added to the present invention, or replaced with other components. However, if other modified embodiments include the essential components of the present invention, they should be considered within the technical scope of the present invention.

100 Substrate bonding apparatus 200 Frame 210 Column 220 Base 300 Upper chamber 310 First support bar 320 Upper surface plate 330 Upper chuck 340 Camera unit 341 Through-hole 350 Substrate separating apparatus 351 Separating pin 352 Separating pin operating body 360 Upper exhaust section 361 Upper exhaust pipe 400 Lower chamber 410 Second support bar 420 Lower chuck 430 Substrate elevating device 431 Elevating pin 432 Elevating pin operating body 450 Lower exhaust part 451 Lower exhaust pipe 500 Driving part 510 Elevating column 520 Elevating body 600 Position adjusting means 600 UVW Table 610 UVW drive shaft 620 UVW drive shaft actuator 630 Lift plate 540 Linear actuator P1 First substrate P2 Second substrate

Claims (8)

Upper chamber;
A lower chamber that forms an attachment space in contact with the upper chamber;
An upper chuck disposed below the upper chamber and to which the first substrate is deposited;
A lower chuck coupled to an upper surface of the lower chamber and integrally formed with the lower chamber, to which a second substrate is attached; and
A substrate bonding apparatus, comprising: a position adjusting means which is disposed above the upper chamber and adjusts the position of the first substrate. In claim 1,
The substrate bonding apparatus, wherein the lower chuck includes an electrostatic chuck (ESC) that adheres the second substrate by electrostatic force. In claim 1,
The substrate bonding apparatus, wherein the position adjusting means is a UVW table that horizontally moves the first substrate. In claim 3,
The UVW table includes a UVW driving shaft that horizontally moves the first substrate through the upper chamber, and a UVW driving shaft operation that is attached to the upper surface of the UVW driving shaft and transmits a driving force to the UVW driving shaft. A substrate bonding apparatus comprising a body. In claim 1,
A substrate bonding apparatus including an upper exhaust unit provided above the upper chamber and providing a vacuum pressure to the bonding space. In claim 1,
The substrate bonding apparatus, wherein the exhaust section includes a vacuum pump provided separately outside, and an upper exhaust pipe for communicating the vacuum pump and the bonding space. In claim 1,
A substrate bonding apparatus including a lower exhaust unit provided below the lower chamber and providing a vacuum pressure to the bonding space. In claim 7,
The substrate lowering unit includes a vacuum pump provided separately outside, and a lower exhaust pipe for communicating the vacuum pump and the bonding space.