JP4839407B2 - Bonded substrate manufacturing apparatus and bonded substrate manufacturing method - Google Patents

Description

The present invention relates to a bonded substrate manufacturing apparatus and a bonded substrate manufacturing method.
This application claims priority based on Japanese Patent Application No. 2007-290912 filed in Japan on November 8, 2007, and incorporates the contents thereof.

  A flat panel display (FPD) such as a liquid crystal display or a plasma display has a structure in which two substrates are bonded together. For example, in a liquid crystal display, an array substrate (TFT substrate) in which a plurality of TFTs (thin film transistors) are formed in a matrix and a color filter substrate (CF substrate) in which a color filter, a light-shielding film, and the like are formed are about several μm. The liquid crystal is sealed between the two substrates, and the two substrates are manufactured by being bonded to each other with a seal member (adhesive) containing a photocurable resin. Note that the two substrates are bonded together in a vacuum environment in order to prevent mixing of impure gas.

  As an apparatus for bonding such two substrates, for example, a substrate bonding apparatus of Patent Document 1 is known. The substrate laminating apparatus of Patent Document 1 includes a vacuum chamber composed of an upper container and a lower container, an upper substrate conveying jig for moving the upper substrate, and a first for moving the upper container up and down. A support bar, a base plate on which the support bar is supported, and a second support bar for moving the upper substrate transport jig up and down are provided.

In the above-described substrate bonding apparatus, the first support bar is moved downward, the upper container and the lower container are in contact with each other to form a vacuum chamber, and the second support bar is moved downward. Then, the upper substrate transport jig is lowered so that the substrate as the upper substrate is disposed to face the substrate at a predetermined interval. Thereafter, the upper substrate and the lower substrate are aligned and bonded together.
JP 2007-212572 A

  The above-mentioned bonded substrate manufacturing apparatus of Patent Document 1 evacuates the processing chamber, aligns the upper substrate and the lower substrate, and bonds these two substrates. However, if the upper substrate transport jig is moved by moving the second support rod provided on the base plate after the upper substrate and the lower substrate are aligned, the position of the upper substrate and the lower substrate May be shifted relatively. This is because a plurality of members are interposed between the base plate and the lower substrate, so that the lower container on which the lower substrate is disposed and the base plate on which the second support bar is provided move differently. It is. As described above, there is a problem in that the yield decreases due to the relative positions of the upper substrate and the lower substrate being shifted.

  The present invention has been made in view of the above-described circumstances, and provides a substrate manufacturing apparatus and a bonded substrate manufacturing method that can improve the alignment accuracy of two substrates and improve the yield. Is an issue.

Laminating a substrate manufacturing apparatus according to the present invention, by laminating while aligning the upper substrate and a lower substrate, a bonded substrate manufacturing apparatus lamination manufacturing a bonded substrate: base portion for placing the lower substrate When, the base portion and the support rod erected on; a vertically movable along said support rod, and an upper that can hold the pressure member to the substrate; wherein the base portion, the lower Including a substrate adsorption device and a lower substrate floating adsorption device, wherein the lower substrate adsorption device has a function of moving the lower substrate while adsorbing a part of the lower substrate, The lower substrate is levitated when the lower substrate is moved by the lower substrate adsorption device, and a portion of the lower substrate that is not adsorbed by the lower substrate adsorption device is adsorbed when the upper substrate and the lower substrate are bonded. has a function of, by lowering the on pressure member, The substrate is held in serial on the pressure member and said lower substrate placed on the base unit, characterized in that is bonded.

According to the bonded substrate manufacturing apparatus, the upper pressure member holding the upper substrate moves up and down guided by the support bar standing on the base portion on which the lower substrate is placed. The number of members interposed between the upper substrate and the lower substrate can be minimized. Thereby, it can prevent that the relative position of an upper board | substrate and a lower board | substrate slip | deviates between after aligning an upper board | substrate and a lower board | substrate, and bonding. As a result, there is an effect of improving the yield by improving the alignment accuracy of the two substrates.
Moreover, according to the said bonded substrate manufacturing apparatus, when bonding an upper board | substrate and a lower board | substrate, a lower board | substrate can be made to adsorb | suck to a base part with a lower board | substrate floating adsorption apparatus. Therefore, the position shift of the lower substrate can be prevented. As a result, the upper substrate and the lower substrate can be bonded with high accuracy. In addition, since a table for placing the lower substrate is not required separately, the number of members interposed between the base portion and the lower substrate can be reduced. Furthermore, if the lower substrate is adsorbed to the base part, the lower substrate adsorbing device and the lower substrate floating adsorbing device are not exposed to the bonding processing chamber, so that particles generated from each device flow into the bonding processing chamber. Can be prevented. Therefore, the cleanliness in the bonding treatment chamber can be ensured.

  At least one of the upper pressure member and the base portion is provided with a seal member so as to surround a region where the upper substrate or the lower substrate is disposed; by lowering the upper pressure member A bonding treatment chamber may be formed between the seal member, the upper pressure member, and the base portion.

  In this case, since the bonding processing chamber can be constituted by the upper pressurizing member, the base portion, and the seal member, the number of parts can be reduced. As a result, the apparatus can be reduced in size and weight.

Further comprising a decompression means for decompressing the inside of the lamination process chamber; when the lamination process chamber is depressurized by the pressure reducing means, the lamination process chamber may be sealed by the sealing member.

  In this case, since the sealing member is interposed between the upper pressurizing member and the base portion, the bonding processing chamber can be reliably sealed when the bonding processing chamber is decompressed. Therefore, the pressure in the bonding process chamber can be reliably reduced, and a desired bonded substrate can be manufactured.

  In this case, when the upper substrate and the lower substrate are bonded together, the lower substrate can be adsorbed to the base portion by the lower substrate floating adsorption device. Therefore, the position shift of the lower substrate can be prevented. As a result, the upper substrate and the lower substrate can be bonded with high accuracy. In addition, since a table for placing the lower substrate is not required separately, the number of members interposed between the base portion and the lower substrate can be reduced. Furthermore, if the lower substrate is adsorbed to the base part, the lower substrate adsorbing device and the lower substrate floating adsorbing device are not exposed to the bonding processing chamber, so that particles generated from each device flow into the bonding processing chamber. Can be prevented. Therefore, the cleanliness in the bonding treatment chamber can be ensured.

  The sealing member is: a joint that moves up and down relative to one of the base part and the upper pressure member, and constitutes a wall part of the laminating process chamber; And a seal that abuts against the upper pressure member and ensures the airtightness of the laminating process chamber.

  In this case, since the joining portion moves up and down with respect to the base portion or the upper pressure member to form the wall portion of the bonding processing chamber, the bonding processing chamber is sealed even when the upper pressure member rises. It becomes possible to keep on. This makes it possible to depressurize the laminating process chamber even when the conductance is increased by separating the lower substrate and the upper substrate, and as a result, the depressurization time can be shortened.

In the bonded substrate manufacturing method according to the present invention, a lower substrate is placed on a base portion, and the upper substrate is held by an upper pressure member that can move up and down along a support bar erected on the base portion. , bonded while aligning the said substrate and the lower substrate, adhered to a bonded substrate manufacturing method for manufacturing the bonded substrate: a lower substrate adsorption device installed on the base portion, of the lower substrate while adsorbing part, together to separate the lower substrate from said base portion, a first lower substrate moving step of floating the lower substrate by the lower substrate floating suction device installed in the base unit; wherein the pressure An upper substrate moving step in which a member is lowered and the lower substrate and the upper substrate are arranged to face each other at a predetermined interval; and the lower substrate is moved by the lower substrate suction device, and the lower substrate and the upper substrate are moved. Substrate alignment for alignment A step of raising the upper pressure member, and a step of raising the upper pressure member in which the lower substrate and the upper substrate are spaced apart from each other by a predetermined distance; sealing between the upper pressure member and the base portion was sealed by member, the processing chamber forming process and forming a lamination process chamber in which the substrate and the lower substrate is accommodated; by the lower substrate adsorption device while adsorbing a portion of the lower substrate, the under It is brought into contact with the substrate to the base portion by the lower substrate floating suction device, and a second lower substrate moving step of adsorbing a portion that is not absorbed on the lower substrate adsorption device of the lower substrate; the laminating process chamber A depressurizing step of depressurizing; and a substrate laminating step of lowering the upper pressurizing member in a state in which the laminating processing chamber is sealed and laminating the lower substrate and the upper substrate. It is characterized by.

According to the bonded substrate manufacturing method, the upper pressing member holding the upper substrate moves up and down guided by the support rod standing on the base portion on which the lower substrate is placed. The number of members interposed between the upper substrate and the lower substrate can be minimized. Accordingly, it is possible to prevent the positional relationship between the upper substrate and the lower substrate from being shifted between the time when the upper substrate and the lower substrate are aligned and the time when they are bonded. Therefore, the alignment accuracy of the two substrates can be improved and the yield can be improved.
In addition, since the upper pressurizing member is raised and the lower substrate and the upper substrate are spaced apart from each other by a predetermined distance, the laminating process chamber is depressurized. Thereby, the decompression time can be shortened.
Furthermore, when the upper substrate and the lower substrate are bonded together, the lower substrate can be adsorbed to the base portion by the lower substrate floating adsorption device. Therefore, the position shift of the lower substrate can be prevented, and the upper substrate and the lower substrate can be bonded together with high accuracy. In addition, since a table for placing the lower substrate is not required separately, the number of members interposed between the base portion and the lower substrate can be reduced. Furthermore, if the lower substrate is adsorbed to the base part, the lower substrate adsorbing device and the lower substrate floating adsorbing device are not exposed to the bonding processing chamber, so that particles generated from each device flow into the bonding processing chamber. Can be prevented. Therefore, the upper substrate and the lower substrate can be bonded together in a state where the cleanliness in the bonding processing chamber is ensured.

A member interposed between the upper substrate and the lower substrate because the upper pressurizing member holding the upper substrate moves up and down while being guided by the support rod standing on the base portion on which the lower substrate is placed. The number of is kept to a minimum.
Accordingly, it is possible to prevent the positional relationship between the upper substrate and the lower substrate from being shifted between the time when the upper substrate and the lower substrate are aligned and the time when they are bonded. Therefore, there is an effect that the alignment accuracy of the two substrates can be improved and the yield can be improved.

FIG. 1 is a schematic front view of a bonded substrate manufacturing apparatus according to the first embodiment of the present invention. 2 is a cross-sectional view taken along line AA in FIG. FIG. 3 is an enlarged view of a portion B in FIG. FIG. 4 is explanatory drawing (1) which shows the process in which a bonded substrate is manufactured using the bonded substrate manufacturing apparatus concerning the embodiment. Drawing 5 is an explanatory view (2) showing the process of manufacturing a bonded substrate using the bonded substrate manufacturing device concerning the embodiment. FIG. 6: is explanatory drawing (3) which shows the process in which a bonded substrate is manufactured using the bonded substrate manufacturing apparatus concerning the embodiment. FIG. 7: is explanatory drawing (4) which shows the process in which a bonded substrate is manufactured using the bonded substrate manufacturing apparatus concerning the embodiment. FIG. 8: is explanatory drawing (5) which shows the process in which a bonded substrate is manufactured using the bonded substrate manufacturing apparatus concerning the embodiment. FIG. 9: is explanatory drawing (6) which shows the process in which a bonded substrate is manufactured using the bonded substrate manufacturing apparatus concerning the embodiment. FIG. 10: is explanatory drawing (7) which shows the process in which a bonded substrate is manufactured using the bonded substrate manufacturing apparatus concerning the embodiment. FIG. 11 is a flowchart showing a process of manufacturing the bonded substrate according to the embodiment. FIG. 12 is a configuration diagram showing another aspect of the seal member according to the embodiment. FIG. 13 is a configuration diagram of a seal member according to the second embodiment of the present invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Bonded board manufacturing apparatus 11 Base part 13 Support bar 15 Upper pressurizing member 17 Chamber (bonding processing room)
25 Drive stand (lower substrate suction device)
35 Air pad (lower substrate floating adsorption device)
49 Vacuum pump (pressure reduction means)
52 seal 55 seal member 56 tube (expansion / contraction member)
57 Junction W1 Lower substrate W2 Upper substrate W3 Bonded substrate

(First embodiment) (Laminated substrate manufacturing apparatus)
The bonded substrate manufacturing apparatus which concerns on 1st embodiment of this invention is demonstrated based on FIGS.
FIG. 1 is a schematic front view of a bonded substrate manufacturing apparatus, and FIG. 2 is a cross-sectional view taken along line AA of FIG. As shown in FIGS. 1 and 2, the bonded substrate manufacturing apparatus 10 is supported by a base portion 11 on which the lower substrate W1 is placed, a support bar 13 erected from the base portion 11, and the support bar 13. And an upper pressurizing member 15 configured to be movable up and down along the support bar 13 and configured to hold the upper substrate W2.

  The base part 11 has rigidity and is formed in a substantially rectangular parallelepiped shape. The base part 11 is provided with legs 22 at the four corners of the lower surface 21 and is placed on the floor surface. On the other hand, the upper surface 23 of the base portion 11 is formed in a rectangular shape in plan view, and the lower substrate W1 can be placed thereon. A driving base 25 capable of moving the lower substrate W1 in the vertical direction, the orthogonal two-axis horizontal direction, and the horizontal rotation direction (hereinafter referred to as a horizontal plane direction) is provided at a substantially central portion of the upper surface 23 in plan view.

  The drive base 25 is disposed in a recess 24 formed on the upper surface 23 of the base portion 11. The drive base 25 is formed in a substantially circular shape in plan view, and a cavity 28 is formed inside the drive base 25. A plurality of air holes 27 are formed in the ceiling surface of the cavity 28, and the cavity 28 is connected to an exhaust pipe 29 provided below the air hole 27. The exhaust pipe 29 penetrates the base portion 11 and extends from the lower surface 21 and is connected to an exhaust pump (not shown). That is, when the exhaust pump is moved while the lower substrate W1 is placed on the drive base 25, the lower substrate W1 can be adsorbed to the drive base 25 through the air holes 27. A valve 30 is provided in the middle of the exhaust pipe 29 so that the exhaust amount can be adjusted. Further, the surface 26 of the drive base 25 is disposed so as to be flush with the upper surface 23 of the base portion 11 in a normal state (when not driven).

  A first moving device 31 for moving the drive base 25 in the horizontal plane is provided below the drive base 25. Below the first moving device 31, a second moving device 32 for moving the drive base 25 in the vertical direction is provided. The driving method of the first moving device 31 and the second moving device 32 is not particularly limited. In the present embodiment, the first moving device 31 is configured to move in the horizontal plane direction using an actuator mechanism, and the second moving device 32 moves the drive base 25 in the vertical direction by moving a wedge-shaped member. It is configured to make it.

  Next, a plurality of air pads 35 (14 in the present embodiment) are provided on the upper surface 23 of the base portion 11 at positions corresponding to the planar size of the lower substrate W1. The air pad 35 is disposed in a recess 36 formed on the upper surface 23 of the base portion 11. The air pad 35 is formed in a substantially circular shape in plan view, and a cavity 39 is formed inside the air pad 35. A plurality of air holes 38 are formed in the ceiling surface of the cavity 39, and the cavity 39 is connected to a supply / exhaust pipe 40 provided therebelow. The supply / exhaust pipe 40 extends from the lower surface 21 through the base portion 11 and is connected to an unillustrated supply / exhaust pump. In other words, when the air is supplied to the air pad 35 in a state where the lower substrate W1 is placed on the base portion 11, air is ejected from the air holes 38 toward the lower substrate W1, and the lower substrate W1 can be floated. On the other hand, when the lower substrate W <b> 1 is placed on the base portion 11 and exhausted from the air pad 35, the lower substrate W <b> 1 can be adsorbed to the base portion 11 through the air holes 38. A valve 41 is provided in the middle of the air supply / exhaust pipe 40 so that the air supply / exhaust amount can be adjusted. The surface 37 of the air pad 35 is disposed so as to be flush with the upper surface 23 of the base portion 11.

  In addition, a plurality of lift pins 45 (24 in the present embodiment) are provided on the upper surface 23 of the base portion 11 where the drive base 25 and the air pad 35 are not disposed. The lift pin 45 is normally disposed below the upper surface 23 of the base portion 11. In addition, when the lower substrate W1 is delivered from another device (not shown) to the bonded substrate manufacturing apparatus 10, the lift pins 45 are raised and the lower substrate W1 can be received from a robot arm (not shown). Then, the lower substrate W1 can be placed on the upper surface 23 of the base portion 11 by lowering the lift pins 45 after receiving the lower substrate W1. Further, when the substrate is transferred to another apparatus after the substrate bonding process is completed, the lift pins 45 are raised to separate the bonded substrate W3 from the upper surface 23 of the base portion 11, and the robot arm is placed in the gap. Can be inserted and the bonded substrate W3 can be conveyed.

  An exhaust port 47 is formed on the upper surface 23 of the base portion 11. The exhaust port 47 is connected to an exhaust pipe 48 that penetrates the base portion 11. The exhaust pipe 48 is connected to a vacuum pump 49 attached to the lower surface 21 of the base portion 11.

  Further, a recess 51 is formed on the upper surface 23 of the base portion 11 so as to surround the drive base 25, the air pad 35, the lift pin 45, and the exhaust port 47 described above. The recess 51 is formed in a rectangular shape in plan view. In a plan view, a wall 53 is formed along the entire inner periphery of the recess 51. The height of the wall portion 53 is smaller than the total thickness of the lower substrate W1 and the upper substrate W2.

  FIG. 3 is an enlarged view of a portion B in FIG. As shown in FIG. 3, a seal member 55 is provided in the recess 51. The seal member 55 includes, for example, a rubber tube 56 disposed below the recess 51, and a joint portion 57 disposed above the tube 56. By changing the air pressure of the tube 56 to expand and contract, the joint portion 57 moves up and down along the side surface 60 of the recess 51 and can follow the movement of the upper pressurizing member 15. The upper surface 58 of the joint portion 57 is located above the upper surface 23 of the base portion 11. Further, a seal 52 is provided on the upper surface 58 of the joint portion 57 to seal the space between the upper pressurizing member 15. Further, a seal 61 is provided between the side surface 59 of the joint portion 57 and the side surface 60 of the concave portion 51 of the base portion 11 to seal between the two. As a result, the base portion 11, the upper pressure member 15, and the seal member 55 constitute the chamber 17. The wall portion 53 supports the joint portion 57 so that the joint portion 57 does not fall to the chamber 17 side when the chamber 17 is evacuated.

Returning to FIG. 2, the support bar 13 is erected on the upper surface 23 of the base portion 11 outside the recess 51. The support bars 13 are erected at the four corners of the base portion 11. In addition, a drive shaft 65 is erected between the support rods 13 in the middle portion in the short side direction on the upper surface 23 of the base portion 11.
The drive shaft 65 includes a drive source 66 composed of a motor or the like attached to the base portion 11, and two shaft portions 67 on one side that move up and down in accordance with instructions from the drive source 66. That is, four support rods 13 and four drive shafts 65 are erected on the base portion 11. 1 shows the support rod 13 on the right side and the drive shaft 65 on the left side for convenience of explanation.

  For example, the drive shaft 65 is configured such that the shaft portion 67 is rotated by the drive force from the drive source 66. A male screw 85 is formed on the shaft portion 67. The male screw 85 is configured to be screwed into a female screw 86 formed in the base portion 11 by rotating the shaft portion 67, and thereby the shaft portion 67 is raised / lowered.

  An upper pressure member 15 is provided above the support bar 13. The upper pressure member 15 is formed in a rectangular shape having the same size as that of the base portion 11 in plan view. In plan view, through holes 71 through which the support bar 13 can be inserted are formed at four corners of the upper pressure member 15 at positions corresponding to the support bar 13. A guide guide 83 is disposed below the through hole 71 so that the upper pressurizing member 15 moves up and down in the vertical direction along the support bar 13. A load cell 69 is provided at a position corresponding to the drive shaft 65 on the lower surface of the upper pressure member 15. The pressure receiving surface (lower surface) of the load cell 69 and the tip end portion 68 of the shaft portion 67 are arranged so as to contact each other.

  A stepped portion 73 is formed between the position corresponding to the support bar 13 (both side portions 72 in the short side direction) on the lower surface of the upper pressing member 15 and other positions. Further, both side portions 72 are formed so as to be located farther than the stepped portion 73 with respect to the base portion 11. A holding surface 75 that holds the upper substrate W <b> 2 is formed at a position closer to the base portion 11 than the both side portions 72. The peripheral edge portion 76 of the holding surface 75 is formed so as to be located outside the concave portion 51 of the base portion 11 in plan view.

  A plurality of electrostatic chuck portions 77 are provided at positions where the upper substrate W <b> 2 is held on the holding surface 75. The surface of the electrostatic chuck portion 77 is disposed so as to be flush with the holding surface 75. A plurality of holding pins 79 are provided on the holding surface 75 where the electrostatic chuck portion 77 is not disposed. The holding pin 79 is provided with an air inlet at its tip, and can hold the upper substrate W2 by suction. The holding pin 79 is disposed above the holding surface 75 in a normal state. When the upper substrate W2 is delivered from another apparatus (not shown) to the bonded substrate manufacturing apparatus 10, the holding pins 79 are lowered and the upper substrate W2 can be received from a robot arm (not shown). The upper substrate W2 can be held on the holding surface 75 by raising the holding pins 79 after receiving the upper substrate W2 and simultaneously causing the electrostatic chuck portion 77 to function.

Furthermore, an imaging portion 81 of the camera 80 used for alignment with the lower substrate W1 is formed at an arbitrary position (preferably near the peripheral edge of the upper substrate W2) on the holding surface 75 where the upper substrate W2 is held. Has been. The imaging unit 81 is formed with a camera placement unit 82 that is a through-hole penetrating the upper pressure member 15. That is, the camera 80 is set in the camera placement unit 82, and the camera 80 is used to photograph the alignment marks M1 and M2 of the lower substrate W1 and the upper substrate W2 through the photographing unit 81, thereby detecting the displacement of the alignment marks M1 and M2. it can.
Further, a control unit (not shown) is provided for instructing the first moving device 31 on the amount of movement in the horizontal plane based on the result of photographing with the camera 80.

(Function)
Next, the procedure for manufacturing a bonded substrate using the bonded substrate manufacturing apparatus 10 will be described with reference to FIGS. 4-10 is explanatory drawing which shows the process in which a bonded substrate is manufactured using a bonded substrate manufacturing apparatus, and FIG. 11 is a flowchart which shows the process in which a bonded substrate is manufactured. Each step number to be described later corresponds to the step number in FIG.
First, as shown in FIG. 4, the upper pressurizing member 15 of the bonded substrate manufacturing apparatus 10 is held in a state of being positioned at the uppermost position.

In step S1, the lower substrate W1 is carried in by the robot arm in this state. A specific method for carrying in the lower substrate will be described after step S2.
In step S <b> 2, the lower substrate W <b> 1 transported by a robot arm (not shown) is disposed above the base portion 11. Here, the lift pins 45 are raised to float the lower substrate W1 from the robot arm.

In step S <b> 3, the robot arm is retracted from the chamber 17.
In step S <b> 4, the lift pins 45 are lowered to place the lower substrate W <b> 1 on the upper surface 23 of the base portion 11.
In step S <b> 5, the lower substrate W <b> 1 is adsorbed to the drive base 25 by exhausting from the exhaust pipe 29.

In step S6, the 2nd moving apparatus 32 provided in the base part 11 is driven, and the drive stand 25 is moved upwards.
In step S7, air is supplied to the air pad 35 substantially simultaneously with step S6, and air is ejected from the air hole 38 toward the lower substrate W1. Then, the lower substrate W1 is lifted substantially at the center by the drive base 25, and the peripheral portion of the lower substrate W1 is floated by the action of the air pad 35. In this way, the lower substrate W1 is held in a horizontal state (first lower substrate moving step). At this time, the lower substrate W1 floats from the upper surface 23 of the base portion 11 by about several tens of μm.

In step S <b> 8, the upper substrate W <b> 2 that has been transported by a robot arm (not shown) is disposed below the holding surface 75 of the upper pressure member 15.
In step S9, the holding pin 79 is lowered to suck the upper substrate W2.
In step S <b> 10, the robot arm is retracted from the chamber 17.

In step S11, the holding pin 79 is raised.
In step S <b> 12, the electrostatic chuck unit 77 is caused to function to attract the upper substrate W <b> 2 to the holding surface 75. FIG. 5 is an explanatory diagram when the steps up to step S12 are completed.
Note that either the step of carrying in the lower substrate W1 of steps S1 to S5 or the step of carrying in the upper substrate W2 of steps S8 to S12 may be performed first. However, since the upper substrate W2 may fall from the suction pins 57, it is possible to prevent the upper substrate W2 from being affected by the drop of the upper substrate W2 by carrying in the upper substrate W2 first. In particular, when manufacturing a liquid crystal panel, it is desirable to carry in the upper substrate W2 first because the liquid crystal is applied to the upper surface of the lower substrate W1.

  Next, in step S13, as shown in FIG. 6, with the lower substrate W1 held horizontally, the drive shaft 65 is driven to move the upper pressurizing member 15 toward the base portion 11 (lower substrate W1). To lower (upper substrate moving step). At this time, the shaft portion 67 is lowered by rotating the shaft portion 67 in accordance with an instruction from the drive source 66. Since the upper pressure member 15 is supported by the shaft portion 67, the upper pressure member 15 is simultaneously lowered. Further, since the support rod 13 is inserted into the guide guides 83 at the four corners of the upper pressure member 15, the upper pressure member 15 is lowered while maintaining the horizontal state. Then, the upper pressurizing member 15 is lowered until a predetermined interval is reached between the lower substrate W1 and the upper substrate W2.

  In step S14, as shown in FIG. 7, when the predetermined distance (about several hundred μm) is reached between the lower substrate W1 and the upper substrate W2, the camera 80 is operated to align the lower substrate W1 and the upper substrate W2. The marks M1 and M2 are sequentially focused and photographed. Then, the lower substrate W1 is moved in the horizontal plane direction so that the respective alignment marks coincide (substrate alignment step). At this time, based on the amount of misalignment of the alignment mark, the first moving device 31 is driven to move the drive base 25 in the horizontal plane direction, and the lower substrate W1 is moved to an appropriate position.

  When the lower substrate W1 and the upper substrate W2 are aligned, the holding surface 75 and the joint portion 57 of the seal member 55 are in contact with each other. That is, the chamber 17 hermetically sealed with the base portion 11, the upper pressure member 15, and the seal member 55 is configured (processing chamber forming step). Specifically, when the upper pressure member 15 presses the joint portion 57, the joint portion 57 presses the tube 56. Since a relief valve (not shown) is connected to the tube 56, the tube 56 contracts with the internal pressure kept constant. Thereby, the airtight state of the upper pressurizing member 15 and the joint portion 57 can be maintained while preventing the tube 56 from being damaged.

  In step S15, as shown in FIG. 8, when the alignment between the lower substrate W1 and the upper substrate W2 is completed, the drive base 25 of the lower substrate W1 is lowered and the supply of air to the air pad 35 is stopped. The substrate W1 is lowered to the upper surface 23 of the base portion 11. Then, the air is discharged from the air pad 35 and the lower substrate W1 is attracted to the upper surface 23 so that the position is not shifted (second lower substrate moving step). Thereafter, the upper pressure member 15 is moved slightly upward (upper pressure member raising step). In this way, the distance between the lower substrate W1 and the upper substrate W2 is made longer than that during alignment. This is because the conductance is increased during the subsequent evacuation of the chamber 17 to shorten the evacuation time and to surely exhaust the air between the substrates W1 and W2. Therefore, even when the upper pressurizing member 15 is moved slightly upward, the holding surface 75 and the joint portion 57 are adjusted so as to contact with each other reliably.

  Specifically, contrary to the above, the tube 56 expands in a state where the internal pressure is kept constant, and the sealed state between the upper pressure member 15 and the joint portion 57 can be maintained. That is, the position of the upper surface 58 of the joint portion 57 is adjusted by adjusting the air pressure of the tube 56 of the seal member 55. Further, even if the joint portion 57 is moved up and down, the seal 61 maintains the airtightness in the chamber 17. Note that the lower substrate W <b> 1 may be lowered to the upper surface 23 of the base portion 11 after raising the upper pressure member 15. Moreover, you may implement a process chamber formation process after an upper pressurization member raising process.

  In step S16, the vacuum pump 49 is operated and the inside of the chamber 17 is exhausted from the exhaust port 47 (decompression step). Then, the inside of the chamber 17 is kept in a vacuum state (about 0.4 Pa or less).

In step S17, after the evacuation in the chamber 17 is completed, the upper pressure member 15 is lowered again.
In step S18, as shown in FIG. 9, the lower substrate W1 and the upper substrate W2 are bonded together (substrate bonding step). At this time, both the substrates W1 and W2 are pressurized by a part of the weight of the upper pressure member 15. Here, the load cell 69 provided between the front end portion 68 of the shaft portion 67 and both side portions 72 of the upper pressure member 15 detects the load acting on both the substrates W1 and W2, and the substrate is loaded with an appropriate load. Adjust to stick.

  In step S19, as shown in FIG. 10, when the bonding of the lower substrate W1 and the upper substrate W2 is completed, the upper pressure member 15 is raised. At this time, the bonded substrate W3 is disposed on the base portion 11. That is, the function of the electrostatic chuck portion 77 of the upper pressing member 15 is released, and the upper substrate W2 is separated from the upper pressing member 15.

In step S20, the lift pins 45 of the base portion 11 are raised, and the bonded substrate W3 is raised from the upper surface 23.
In step S21, the robot arm is inserted into the gap between the bonded substrate W3 and the upper surface 23 of the base part 11, and the bonded substrate W3 is delivered from the lift pins 45 to the robot arm. And a robot arm conveys the bonding board | substrate W3 to another apparatus which is not shown in figure, and a process is completed.

According to the present embodiment, in the bonded substrate manufacturing apparatus 10 that manufactures the bonded substrate W3 by bonding the upper substrate W2 and the lower substrate W1, the base unit 11 on which the lower substrate W1 is placed; A support bar 13 erected on the base 11, and an upper pressurization member 15 that can move up and down along the support bar 13 and that can hold the upper substrate W <b> 2. By lowering 15, the upper substrate W2 and the lower substrate W1 are bonded together.
For this reason, the upper pressurizing member 15 holding the upper substrate W2 moves up and down while being guided by the support bar 13 standing on the base portion 11 on which the lower substrate W1 is placed. That is, the number of members interposed between the upper substrate W2 and the lower substrate W1 is minimized. Thereby, it is possible to prevent the relative positions of the upper substrate W2 and the lower substrate W1 from being shifted between the time when the upper substrate W2 and the lower substrate W1 are aligned and the time when they are bonded. Therefore, the alignment accuracy of the two substrates W1 and W2 can be improved, and the yield can be improved.

Further, in the bonded substrate manufacturing apparatus 10 according to the present embodiment, the base member 11 is provided with the seal member 55 so as to surround the arrangement region of the lower substrate W1, and the upper pressurizing member 15 is lowered so that the seal is achieved. A chamber 17 is formed between the member 55, the upper pressure member 15, and the base portion 11.
For this reason, the chamber 17 can be comprised by the upper pressurization member 15, the base part 11, and the sealing member 55, and can reduce a number of parts. Therefore, the apparatus can be reduced in size and weight.

The bonded substrate manufacturing apparatus 10 according to the present embodiment further includes a vacuum pump 49 that depressurizes the inside of the chamber 17, and the chamber 17 is sealed by a seal member when the chamber 17 is depressurized by the vacuum pump 49.
Thus, by interposing the seal member 55 between the upper pressurizing member 15 and the base portion 11, the chamber 17 can be reliably sealed when the chamber 17 is decompressed. Therefore, the chamber 17 can be reliably decompressed, and a desired bonded substrate W3 can be manufactured.

Further, the base 11 is configured to move the lower substrate W1 while adsorbing a part of the lower substrate W1, and to float the lower substrate W1 when the lower substrate W1 is moved by the drive base 25, An air pad 35 capable of adsorbing the lower substrate W1 at the time of bonding to the lower substrate W1 was provided.
Therefore, when the upper substrate W2 and the lower substrate W1 are bonded together, the lower substrate W1 can be attracted to the base portion 11 by the air pad 35. Therefore, the position shift of the lower substrate W1 can be prevented, and the upper substrate W2 and the lower substrate W1 can be bonded together with high accuracy. In addition, since a separate table for placing the lower substrate W1 is not required, the number of components interposed between the base portion 11 and the lower substrate W1 can be reduced. Further, when the lower substrate W1 is attracted to the base portion 11, the drive base 25 and the air pad 35 are not exposed to the chamber 17, so that particles generated from each device can be prevented from flowing into the chamber 17. Therefore, the cleanliness in the chamber 17 can be ensured.

The seal member 55 moves up and down with respect to the base portion 11, is installed in the joint portion 57 that constitutes the wall portion of the chamber 17, and the joint portion 57. And a seal 52 for ensuring safety.
For this reason, the joining portion 57 moves up and down with respect to the base portion 11 to form the wall portion of the chamber 17, and the sealed chamber 17 can be constructed even when the upper pressurizing member 15 is raised. As a result, the inside of the chamber 17 can be decompressed in a state where the lower substrate W1 and the upper substrate W2 are spaced apart to increase conductance, and the decompression time can be shortened.

  In addition, another aspect of the sealing member 55 in this embodiment is shown in FIG. As shown in FIG. 12, the seal member 255 includes an air supply unit 256 that is provided in the recess 51 and formed below the recess 51, and a joint portion 57 that is disposed above the air supply unit 256. Yes. By changing the air pressure of the air supply unit 256, the joint portion 57 moves up and down along the side surface 60 of the recess 51 and can follow the movement of the upper pressurizing member 15. The upper surface 58 of the joint portion 57 is located above the upper surface 23 of the base portion 11.

Further, a seal 52 is provided on the upper surface 58 of the joint portion 57 to seal the space between the upper pressurizing member 15. Further, two seals 61 are provided between the side surface 59 of the joint portion 57 and the side surface 60 of the concave portion 51 of the base portion 11 to seal between the two. A communication pipe (not shown) that communicates with the outside (atmosphere) is connected to the space 263 between the seals 61 and 61. As a result, the pressure load on the seal 61 can be reduced. In addition, a seal 262 for blocking between the air supply unit 256 and the outside (atmosphere) is provided on the opposite side where the seal 61 is provided.
Thereby, the sealing member 255 can obtain substantially the same effect as the sealing member 55 described above.

(Second embodiment)
Next, the bonded substrate manufacturing apparatus according to the second embodiment of the present invention will be described with reference to FIG. Note that this embodiment is different from the first embodiment only in the configuration of the seal member, and the other configurations are substantially the same. Therefore, the same portions are denoted by the same reference numerals and detailed description thereof is omitted.
FIG. 13 is a configuration diagram of the seal member. As shown in FIG. 13, the seal member 155 is provided on the upper pressure member 15 side. Specifically, a recess 151 is formed in the holding surface 75 of the upper pressure member 15. The recess 151 is formed at a position substantially opposite to the recess 51 of the first embodiment.

  A seal member 155 is provided in the recess 151. The seal member 155 includes a spring 156 disposed at the bottom of the recess 151 and a joint 157 disposed above the spring 156. As the spring 156 contracts, the joint 157 moves up and down. Further, a seal 164 is provided on the distal end surface 162 of the joint portion 157. Further, a side seal 161 is provided between the side surface 159 of the joint portion 157 and the side surface 160 of the recess 151. A stopper 165 is erected from the side surface 160 of the concave portion 151 toward the side surface 159 of the joint portion 157 so that the joint portion 157 does not fall from the concave portion 151. Thereby, the chamber 17 can be configured by the base portion 11, the upper pressurizing member 15, and the seal member 155.

(Function)
Before the substrates are bonded together (the initial state of the apparatus), the joining portion 157 hangs downward by the urging force of the spring 156 and its own weight and is locked by the stopper 17. When the upper pressure member 15 is lowered to bond the substrates, the upper substrate W2 is lowered at the same time. Then, the seal 164 of the joint portion 157 contacts the upper surface 23 of the base portion 11, and the base portion 11, the upper pressurizing member 15, and the seal member 155 constitute the chamber 17. Thereafter, when the upper pressing member 15 is further lowered, the spring 156 contracts and the joint portion 157 is stored in the recess 151. Thereafter, even if the upper pressurizing member 15 is slightly moved up and down, the urging force of the spring 156 acts to keep the seal 164 and the upper surface 23 of the base portion 11 in contact.
Therefore, the chamber 17 can be reliably configured when the substrates W1 and W2 are bonded, and a desired bonded substrate W3 can be manufactured.

  Since the upper substrate W2 and the bonded substrate W3 are taken in and out of the chamber 17 by the robot arm, the seal member 155 is disposed so as not to obstruct the same. Further, the spring 156 may not be provided on the seal member 155 as long as the joint portion 157 can move downward only by its own weight. In this case, since the vertical mechanism of the joining portion 157 is not necessary, the number of parts can be reduced, and as a result, the apparatus can be manufactured without cost. Further, when the substrate is taken in and out, since the robot arm is taken in and out, the upper pressurizing member 15 is raised to the extent that the joint 157 does not get in the way.

It should be noted that the technical scope of the present invention is not limited to the above-described embodiment, and includes those in which various modifications are made to the above-described embodiment without departing from the spirit of the present invention. That is, the specific shapes, configurations, and the like given in the embodiment are merely examples, and can be changed as appropriate.
For example, in the present embodiment, the case where a tube or a spring is employed to move the joint portion up and down has been described, but an actuator or the like may be used.
Moreover, in this embodiment, although the case where a camera was installed in the upper pressurization member was demonstrated, you may install in a base part.

  A bonded substrate manufacturing apparatus and a bonded substrate manufacturing method capable of improving the alignment accuracy of two substrates and improving the yield can be provided.

Claims (5)

Bonded while aligning the upper substrate and a lower substrate, a bonded substrate manufacturing apparatus lamination manufacturing a bonded substrate:
A base portion on which the lower substrate is placed;
A support rod standing on the base portion;
Along said support rods are vertically movable, and an upper pressing member capable of holding said substrate;
With
The base portion includes a lower substrate suction device and a lower substrate floating suction device,
The lower substrate adsorption device has a function of moving the lower substrate while adsorbing a part of the lower substrate,
The lower substrate floating adsorption device floats the lower substrate when the lower substrate is moved by the lower substrate adsorption device, and the lower substrate adsorption device of the lower substrate is bonded to the upper substrate and the lower substrate. Has the function of adsorbing parts that are not adsorbed on
By lowering the upper pressure member, the upper substrate held by the upper pressure member and the lower substrate placed on the base part are bonded together. . The bonded substrate manufacturing apparatus according to claim 1, wherein:
At least one of the upper pressure member and the base portion is provided with a seal member so as to surround a region where the upper substrate or the lower substrate is disposed;
By lowering the upper pressure member, a bonding processing chamber is formed between the seal member, the upper pressure member, and the base portion. The bonded substrate manufacturing apparatus according to claim 2, wherein:
Further comprising a decompression means for decompressing the inside of the laminating treatment chamber;
The bonded substrate manufacturing apparatus according to claim 1, wherein when the bonding processing chamber is depressurized by the pressure reducing means, the bonding processing chamber is sealed by the sealing member. It is a bonded substrate manufacturing apparatus of Claim 2 or 3,
The sealing member is:
A joint that moves up and down relative to one of the base portion and the upper pressure member and constitutes a wall portion of the bonding treatment chamber;
A seal that is installed at the joining portion and abuts against the base portion or the upper pressure member to ensure airtightness of the laminating treatment chamber;
An apparatus for manufacturing a bonded substrate board comprising: A lower substrate is placed on the base portion, and the upper substrate is held by an upper pressure member that can be moved up and down along a support rod standing on the base portion, and the lower substrate and the upper substrate are aligned. A bonded substrate manufacturing method for manufacturing a bonded substrate by bonding together while:
Wherein the lower substrate adsorption device installed in the base unit while adsorbing a portion of the lower substrate, with to separate the lower substrate from the base portion, the lower substrate floating suction device installed in the base unit A first lower substrate moving step of levitating the lower substrate;
An upper substrate moving step of lowering the upper pressure member and disposing the lower substrate and the upper substrate opposite to each other at a predetermined interval;
A substrate alignment step of aligning the lower substrate and the upper substrate by moving the lower substrate by the lower substrate suction device;
An upper pressurizing member raising step of raising the upper pressurizing member and disposing the lower substrate and the upper substrate by a predetermined distance;
A process chamber forming step of forming a bonding process chamber in which the upper substrate and the lower substrate are accommodated by sealing between the upper pressure member and the base portion with a seal member;
By the lower substrate adsorption device while adsorbing a portion of the lower substrate, is brought into contact with the lower substrate to the base portion by the lower substrate floating suction apparatus, the suction in the lower substrate adsorption device of the lower substrate A second lower substrate moving step for adsorbing a portion that has not been made;
A depressurization step of depressurizing the inside of the bonding treatment chamber;
A substrate laminating step of lowering the upper pressurizing member in a state where the laminating treatment chamber is sealed, and laminating the lower substrate and the upper substrate;
A method for producing a bonded substrate, comprising:

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