JP2003241157A - Apparatus and method for sticking substrate together, and apparatus and method for manufacturing liquid crystal display panel - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To properly stick substrates together through an adhesive. <P>SOLUTION: A pressing mechanism 13 is assembled in an upper stage 3a so that the upper substrate is pressed along a line of the sealant 11 applied from the outside of the substrate (1a) when the upper stage 3a presses an upper substrate 1a so that the gap between both upper and lower substrates 1a and 1b is decreased and both the substrates are stuck together through an applied sealant (adhesive) 11. The pressing mechanism 13 presses the substrate along the sealant 11, so a leak of liquid crystal 10, entry of air into a cell, etc., are evaded and an excellent liquid crystal display panel ca be manufactured. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an improvement in a substrate bonding apparatus and a substrate bonding method suitable for manufacturing a liquid crystal display panel, and an improvement in a liquid crystal display panel manufacturing apparatus and manufacturing method.

[0002]

2. Description of the Related Art Generally, in a liquid crystal display panel used for a display for a personal computer, a TV receiver, various monitors, etc., a pair of glass substrates arranged to face each other is applied so as to surround the display surface. It is manufactured by laminating with an adhesive.

A liquid crystal display panel is formed by enclosing a liquid crystal in a display surface between both substrates which are bonded together. There are a liquid crystal injection method and a liquid crystal dropping method for enclosing the liquid crystal in the display surface. In any of the liquid crystal encapsulation methods, the space (cell gap) between the substrates encapsulating the liquid crystal should be constant.
A large number of spacers are scattered on one of the substrate surfaces for bonding.

FIG. 10 is a partially cutaway sectional view showing a conventional substrate bonding apparatus used for manufacturing a liquid crystal display panel by a liquid crystal dropping method, and FIG. 11 is a sectional view taken along the line AA of FIG. is there.

As shown in FIG. 10, a pair of upper and lower rectangular glass substrates 1a and 1b are provided in an upper chamber 2 and a lower chamber 2, respectively.
In the chamber 2 composed of a and 2b, the upper substrate 1a is held on the lower surface of the upper stage 3a, and the lower substrate 1b is held on the upper surface of the lower stage 3b by holding means such as a chuck.

The upper stage 3a is connected to and held by the support shaft 4a of the XY-θ moving mechanism 4 at the center thereof.
As shown in FIG. 11, the moving mechanism 4 includes the upper chamber 2a.
While being guided by the guide mechanism 5 incorporated therein, it is movable in the vertical (Z) direction which is the vertical direction.
Further, since the XY-θ moving mechanism 4 is connected to the drive shaft 6a of the motor 6 fixed to the upper chamber 2a and constitutes a so-called ball screw mechanism, the motor 6 and the XY-θ moving mechanism 4 are driven. By the control, the position of the upper substrate 1a can be adjusted in the vertical (Z) direction and the XY-θ direction in the horizontal plane.

The lower stage 3b is a platen-shaped lower chamber 2b.
The upper chamber is fixed, and the lower chamber 2b is embedded with imaging cameras 71 and 72 for positioning the upper and lower substrates 1a and 1b. Images of positioning marks (alignment marks) on the surfaces of the substrates 1a and 1b photographed through the lower stage 3b are supplied to a controller (not shown) by the imaging cameras 71 and 72. Therefore, the controller detects the mark position based on a so-called pattern recognition method, and controls the drive of the motor 6 and the XY-θ moving mechanism 4 based on the detected mark position so that the upper and lower substrates 1a and 1b are relatively moved. Positioning is performed.

Although not shown, the upper chamber 2a itself is constructed to be movable up and down as a whole.
Is lowered and a closed space is formed by the connection with the lower chamber 2b, and in a sealed state, it is possible to reduce the pressure in the chamber 2 by the vacuum pump (not shown) connected to the chamber 2 or return to the atmospheric pressure. Is configured to be. Reference numeral 8 indicates the upper chamber 2a in order to ensure airtightness when closed.
And elastic members attached and fixed to the lower end of the guide mechanism 5, respectively.

A liquid crystal cell is manufactured by laminating the substrates 1a and 1b in the following procedure (process).

First, the upper substrate 1a is carried into the chamber 2, and the upper substrate 1a is suction-held on the lower surface of the upper stage 3a. → Next, as shown in FIG. 10, the lower substrate 1b
Spacers 9 are previously sprayed on the display surface, a sealant 11 as an adhesive is applied so as to surround the display surface, and liquid crystal 10 is dropped on the display surface. The lower substrate 1b is adsorbed and held by the lower stage 3b, and the chamber 2
It is brought in. → Next, the upper chamber 2a descends to form a closed space, and the chamber 2 is exhausted. → Next, the upper stage 3a descends, the upper substrate 1a is aligned with the lower substrate 1b and pressurized, and the bonding is performed via the sealant 11. → Finally, the atmospheric pressure in the chamber 2 is returned to the atmospheric pressure, the adsorption is released from the upper stage 3a of the upper substrate 1a, and the upper chamber 2a is raised, and then the lower stage 3
Both substrates 1a and 1b (liquid crystal cells) sucked and held by b are carried out.

As described above, the bonding of the substrates 1a and 1b is performed in the vacuum space of the chamber 2 and then the chamber 2 is returned to the atmospheric pressure. Therefore, the space of the display surface surrounded by the sealant 11, that is, the cell space is contracted by a large external pressure due to the atmospheric pressure, and the spacer 9 secures a gap (cell gap) while receiving the pressing force. Intervals of the order of microns are obtained.

The liquid crystal cell after being carried out is carried toward the sealing agent curing step by the next irradiation of ultraviolet rays or the like.

As described above, since the upper and lower substrates 1a and 1b are carried in and out of the chamber 2 during the bonding operation, the lower chamber 2b on which the lower stage 3b is mounted is It is configured to move on the transport rail 12.

[0014]

As described above, in the conventional substrate bonding apparatus used for manufacturing a liquid crystal display panel, the upper stage 3a is lowered and positioned in the chamber 2 by driving the motor 6. Both substrates 1a, 1
b is bonded via a sealant 10 which is an adhesive so as to maintain a gap with an accuracy of a micron unit.

By the way, in recent years, when the size of the display panel is becoming larger and larger, for example, in a large liquid crystal display having a side of 1 m, the sealing agent applied in a large frame shape so as to surround the display surface is pressed at all positions. It is not easy to obtain a uniform height with an accuracy of micron.

That is, even if the sealant has a uniform width,
Even if the coating can be applied to one of the substrate surfaces at a uniform height, the upper stage 3a holding the upper substrate 1a is supported by the XY-θ moving mechanism 4 at one point in the central portion and descends. This is because it is practically difficult to descend and press the entire upper stage 3a while ensuring high-precision parallelism with the upper surface of the lower stage 3b at the time of its descending.

In the first place, the entire holding surface of each of the upper and lower stages 3a and 3b holding the upper and lower substrates 1a and 1b is processed and manufactured so as to obtain mechanical flatness and parallelism over a wide range with an accuracy of a micron unit. , Not easy.

As a result, as shown in a partially enlarged front view in FIG. 12, the upper substrate 1a descends and presses the spacer 9 and the applied sealant 11 while pressing the upper and lower substrates 1a, 1a.
Even if b is bonded, bonding may occur in a state where the sealing material 11 is not sufficiently crushed.

Therefore, each substrate 1a formed by the sealant 11 is
If the adhesion between 1b and 1b is not enough,
Even if the sealant 11 seems to connect between the upper and lower substrates 1a and 1b, when the pressure is returned to the atmospheric pressure, the air is expanded by pushing out the insufficient connection portion from the outside. Since it penetrates into the inside, causes display failure, and reduces the yield, improvement has been demanded.

Therefore, the present invention is directed to a substrate bonding apparatus, a substrate bonding method, and a liquid crystal display panel manufacturing apparatus, in which bonding between substrates by an adhesive is performed well even in a large-sized display substrate. It is intended to provide a manufacturing method.

[0021]

In order to solve the above conventional problems, the first invention is to hold an upper substrate on the lower surface of an upper stage arranged above and to bond the upper substrate to the held upper substrate. In a substrate bonding apparatus, the other lower substrate is held on a lower stage located below and opposed to each other, and the two substrates are bonded to each other via an adhesive applied so as to draw a line on one of the substrate surfaces. A pressing mechanism that presses the substrate surface on the side opposite to the surface sandwiching the adhesive along the line coated with the adhesive in the direction of narrowing the gap between the two substrates. It is characterized by that.

A second invention is a liquid crystal display panel manufacturing apparatus, wherein the adhesive is formed so as to form a closed curve so as to surround the liquid crystal on the substrate display surface. The substrate bonding apparatus described above is used.

According to a third aspect of the present invention, in the substrate bonding method, the step of holding the upper substrate on the lower surface of the upper stage arranged above and the lower substrate bonded to the upper substrate held in this step, A step of holding it on a lower stage positioned below, and a step of superposing the two substrates with an adhesive applied so as to draw a line on at least one substrate surface of the upper substrate and the lower substrate. , With respect to both the substrates superposed in this step, from the surface opposite to the substrate surface sandwiching the adhesive, along the line coated with the adhesive, in the direction of narrowing the distance between the two substrates. And a pressing step of pressing toward.

A fourth invention is a method of manufacturing a liquid crystal display panel, wherein the adhesive forms a closed curve so as to surround the liquid crystal on the substrate display surface. It is characterized by being used.

As described above, the first and second inventions are provided with the pressing mechanism for pressing the substrate surface in the direction of narrowing the gap between the two substrates along the line (line) coated with the adhesive. It is a thing.

Therefore, even if the surfaces of the upper and lower stages holding both substrates are deformed and the pressing force applied between the stages does not act on the adhesive on the coated portion, the adhesive is applied from the pressing mechanism to the upper substrate. Since the substrates are crushed by receiving the pressing force directly applied to them, both the substrates can be properly and firmly adhered to each other, and the liquid crystal display panel can be manufactured by the favorable substrate bonding or the proper substrate bonding.

Further, in the third and fourth inventions as well, since there is a pressing step of pressing in the direction of narrowing the distance between the two substrates along the line coated with the adhesive, even if the upper and lower stages are both pressed. Even if the surface holding the substrate is deformed, the adhesive receives the necessary and sufficient pressing force by the pressing mechanism, so it is necessary to manufacture a liquid crystal display panel by adhering the substrates properly or by adhering the substrates properly. You can

[0028]

BEST MODE FOR CARRYING OUT THE INVENTION An embodiment of a substrate bonding apparatus, a substrate bonding method, a liquid crystal display panel manufacturing apparatus and a manufacturing method according to the present invention will be described below in detail with reference to FIGS. 1 to 9. Explained. In these figures, the same components as those shown in FIGS. 10 to 12 are designated by the same reference numerals, and detailed description thereof will be omitted.

FIG. 1 is a partially cutaway sectional view showing a first embodiment of a substrate bonding apparatus of the present invention adopted for manufacturing a liquid crystal dropping type liquid crystal display panel.
FIG. 2 is a sectional view taken along the line AA of FIG.

As shown in FIG. 1, a pair of upper and lower rectangular substrates 1a and 1b made of glass are provided in a chamber 2. The upper substrate 1a is on the lower surface of the upper stage 3a, and the lower substrate 1b is on the lower stage 3b. The upper surface is held by suction means such as a chuck.

The upper stage 3a is connected and held at the center by the support shaft 4a of the XY-θ moving mechanism 4, and this XY-θ moving mechanism 4 is inside the upper chamber 2a as shown in FIG. The upper substrate 1a is configured to be movable in the up-down direction (Z-axis) while being guided by the guide mechanism 5 of FIG.
Driven by the θ movement mechanism 4, up and down (Z axis) and XY-θ
The position is adjustable in the direction.

As shown in FIGS. 1 and 2, the upper stage 3a has a linear shape along each of the four sides of the sealant 11 applied so as to form a frame on the lower substrate 1b. A slit 3aa is formed, and a pressing mechanism 13 capable of pressing the upper substrate 1a held by the upper stage 3a from above through the slit 3aa is attached. In the sectional view shown in FIG. 2, the XY-θ moving mechanism 4 is omitted. Further, in the above configuration, the XY-θ moving mechanism 4, the motor 6, the respective imaging cameras 71, 72, etc. are connected to the controller 14 as shown in FIG.

FIGS. 4 to 6 are views for explaining the mounting structure of the pressing mechanism 13. FIG. 4 shows one of the four pressing mechanisms 13 shown in FIG. FIG. 5 is an enlarged plan view of an essential part of the apparatus shown in FIG.
6 is a front view seen in the direction of the arrow Y in FIG. 6, and FIG. 6 is an enlarged front view of a main part from which the XY-θ moving mechanism 4 is removed in FIG.

That is, the pressing mechanism 13 is shown in FIGS.
As shown in FIG. 3, the slit 3 formed on the upper stage 3a
a plate member 131 provided to be inserted into aa so as to be able to push the upper substrate 1a held by the upper stage 3a downward from above, and a drive unit 132 for supporting the plate member 131 and driving the plate member 131 in the vertical direction. It consists of and.

In FIG. 5, the lower part of the plate 131 enters the slit 3aa of the upper stage 3a and is invisible, which is indicated by a broken line, and the upper stage 3a is not shown.

As shown in the enlarged front views of FIGS. 5 and 6, the plate member 131 connects the upper and lower separated plates 131a and 131b via the piezoelectric member 131c at the central portion, and the left and right portions of the connecting portion are connected. At both ends, lower plate 1
A pin 131d provided so as to project from the upper end surface of 31b is provided, and the pin 131d is configured to be slidable in the vertical direction by being guided by a guide hole 131e provided in the upper plate 131a.

An operating rod 131f is provided on the upper center of the upper plate 131a so as to penetrate the front and back, and the operating rod 131f is acted on by the force from the driving unit 132 to move in the vertical (Z-axis) direction. By moving, the whole plate member 131 slides up and down.

That is, the drive unit 132 is shown in FIGS.
As shown in FIG. 3, a fitting plate 132b having a slit-shaped hole 132a in which an operating rod 131f is fitted, a ball screw mechanism 132c, a servo motor 132d for driving the ball screw mechanism 132c, and an upper plate 3a are fixed. And a guide plate 132e that guides the operating rod 131f that protrudes to the opposite side of the plate member 131 in the up and down (Z) direction.

Slit-shaped hole 132a of fitting plate 132b
Are provided so that the length direction is inclined, the ball screw mechanism 132 is controlled by the rotation control of the servo motor 132d.
The position of the operating rod 131f, which is incorporated in c and moves by being guided by the guide plate 132e when the fitting plate 132b moves in the direction of the arrow X, changes its position along the inclined hole 132a. Move up and down (Z).

That is, with the configuration of the plate member 131, the upper plate 131a presses the lower plate 131b through the piezoelectric member 131c such as a load cell, which is a pressure sensor, by the driving of the servomotor 132d, and the upper plate 131a is sucked and held by the upper stage 3a. The upper substrate 1a thus formed can be pressed along the application line of the sealant 11.

At this time, the piezoelectric member 131c detects the force with which the upper plate 131a presses the upper substrate 1a via the lower plate 131b and supplies it to the controller 14 shown in FIG.

Therefore, the controller 14 controls the piezoelectric member 131c.
As shown in FIG. 7, the linearly applied sealant 11 receives a preset pressing force based on the pressing force detected by the servo motor 132d so as to bond the upper and lower substrates 1a and 1b. The rotation can be controlled.

A liquid crystal cell employing the substrate bonding apparatus having the above structure is manufactured by the procedure (process) shown in FIG.

First, as in the conventional case, the upper substrate 1a is loaded into the chamber 2 and held by suction on the upper stage 3a (step 71) .fwdarw.Next, the lower substrate 1 on which the spacers 9 have been sprinkled beforehand.
The sealant 11 is applied so as to surround the display surface of b, and the liquid crystal 10 is dropped on the display surface. Then, the lower substrate 1b is adsorbed and held by the lower stage 3b and carried into the chamber 2 (step 72).
The upper chamber 2a is lowered to exhaust the inside of the chamber 2 (step 73) → Next, after the upper substrate 1a and the lower substrate 1b are aligned with each other, the upper stage 3a is lowered and the sealant 11 is added.
Both substrates 1a and 1b are overlapped with each other through (step 7).
4) → Next, the controller 14 presses the pressing mechanism 13 along the application line of the sealing agent 11 so that an appropriate pressing force can be obtained based on the detection signal from the pressure sensor (piezoelectric member 131c) of the pressing mechanism 13. The servo motor 132d of 13 is controlled for a preset time (step 75). At this time, the upper substrate 1a may be released from the upper stage 3a. → Next, the chamber 2 is returned to atmospheric pressure, and the upper substrate 1
a is released from the upper stage 3a and the upper chamber 2a is raised (step 76) → Finally, both substrates 1a and 1b (liquid crystal cells) that are bonded and suction-held on the lower stage 3b are carried out.

As described above, according to the first embodiment, along the line coated with the sealant 11 which is an adhesive,
A pressing mechanism 13 that presses the upper substrate surface in a direction that narrows the gap between the upper and lower substrates 1a and 1b is provided, and a pressure sensor detected by a pressure sensor incorporated in the pressing mechanism 13 controls the pressing force.
Therefore, the controller 14 can control the pressing mechanism 13 by the feedback control so that the sealing agent 11 is pressed with a preset pressing force.

Therefore, according to this embodiment, the substrate holding surfaces of the upper and lower stages 3a and 3b holding the upper and lower substrates 1a and 1b are deformed, and only the control of the pressing force by the motor 6 can be applied to the coating portion. Even when the force is not sufficiently applied to the sealing agent 11 of the above, the upper substrate 1a is pressed by the pressing mechanism 1
Since the sealant 11 can be crushed by receiving the pressing force of 3, the upper and lower substrates 1a and 1b can be properly and firmly adhered to each other and good bonding can be performed.

Here, the two pressing mechanisms 13A, 13
The pressing of the upper substrate 1a by B may be performed at the same time or at different timings, but if importance is attached to work efficiency, it is preferable to perform the pressing at the same time. Note that the control for operating the pressing mechanisms 13A and 13B at different timings is configured such that the controller 14 has a timer function incorporated therein and outputs the drive command to the servo motor 123d of the pressing mechanisms 13A and 13B at different timings. By doing so, it can be easily realized.

Further, a plate member 131 is provided along the line coated with the sealant 11, and the plate member 131 is provided.
Since the one side portion of the sealant 11 applied in a frame shape on the lower substrate 1b is pressed together at a time, the force in the direction along the surface is exerted between the upper substrate 1a and the lower substrate 1b. Can be prevented as much as possible, which makes it possible to perform the bonding with high accuracy and improve the quality of the liquid crystal display panel.

In the first embodiment, the pressing mechanism 1 is applied to the sealing agent 11 applied in a frame shape so as to draw a quadrangle.
3 is configured to be provided one by one along each side, but a plurality of pressing mechanisms 13 can be provided on one side depending on the length of the side.

FIG. 9 is a front view of essential parts showing a second embodiment of the substrate bonding apparatus according to the present invention in which a plurality of (2) pressing mechanisms are arranged on one side.

That is, as shown in FIG. 9, by providing the two pressing mechanisms 13A and 13B, the upper substrate 1a can be finely pressed in the lengthwise direction, and the upper substrate 1a can be bonded more accurately in the lengthwise direction. Can be matched.

Although the pressure sensor has been described as an example provided between the upper plate 1a and the lower plate 131b of the plate member 131, the present invention is not limited to this and may be provided on the stage side.

In addition, although an example in which the upper stage 3a is lowered and the upper substrate 1a is superposed on the lower substrate 1b and then the pressing mechanism 13 is used for pressing has been described, the present invention is not limited to this, and the pressing mechanism 13 is not limited thereto. The entire upper substrate 1a may be pressed by the upper stage 3a at the same time as or after the pressing by
Further, the pressing using the pressing mechanism 13 may be performed after the entire upper substrate 1a is pressed by the upper stage 3a.

The pressing mechanism 13 has been described as an example in which it is fixed in the direction along the surfaces of the substrates 1a and 1b. However, the position of the sealant 11 that changes with the size change of the substrates 1a and 1b. According to the above, the position may be adjusted so as to move in the direction along the surfaces of the substrates 1a and 1b. Specifically, for example, the pressing mechanism 13 is provided with a position adjusting mechanism for moving the stages 3a, 3b in the direction toward and away from the center, and a slit formed on the stage 3a side for inserting the plate member 131 is provided. The plate member 131 is formed wide enough to allow the movement thereof. In addition, a pair of pressing mechanisms 13 located opposite each other.
With regard to the above, as in the second embodiment, a pressing mechanism group composed of a plurality of pressing mechanisms 13 is provided, and a position adjusting mechanism is provided so as to be independently movable. As for the frame 13, as in the first embodiment, one side of the frame-shaped sealant 11 is pressed together. Further, the length that can be pressed by the pressing mechanism 13 corresponding to each side of the frame-shaped sealant 11 is set in accordance with the length of the side of the frame-shaped sealant 11 applied to the maximum-sized substrates 1a and 1b. To do. When the size of the substrates 1a and 1b is changed from the maximum size to the smaller size, the substrates 1a and 1b are also moved closer to the pressing plates of the other pressing mechanisms 13 that move closer to each other. The movement of the pressing mechanism 13 located corresponding to the pressing mechanism 13 of the other set among the pressing mechanisms 13 of one set is selectively restricted so that the pressing mechanisms 13 of the set do not interfere with each other. With this configuration, it is possible to handle the bonding of the substrates 1a and 1b of a plurality of sizes. Here, as the position adjusting mechanism of the pressing mechanism 13, a ball screw mechanism using a motor as a drive source, a linear motor, or the like can be used.

In the above description, when one pressing mechanism is provided on each side of the sealing material applied in the frame shape, the pressing timing of the upper substrate 1a by each pressing mechanism is made different so that the application position of the sealing material is changed. Can respond to changes. That is, first, while the pressing mechanisms of one set facing each other are retracted to a position that does not hinder the movement (movement in the direction of approaching and separating) of the pressing mechanisms of the other set, the pressing mechanisms of the other sets are sealed. The upper substrate 1a is pressed by moving it so as to face the application position of the agent. Next, the other set of pressing mechanisms is retracted to a position that does not hinder the movement of the one set of pressing mechanisms, and under this condition, the one set of pressing mechanisms is moved so as to oppose the sealing agent application position. , The upper substrate 1a is pressed.

In each of the above-described embodiments, the pressing mechanism 13, 13A, 13B is installed on the upper stage 3a side which holds the upper substrate 1a by suction and presses the upper substrate 1a. Since it is only necessary that the sealing agent, which is an agent, receives an appropriate pressing force to bond the upper and lower substrates together, the pressing mechanisms 13, 13A, 13B are incorporated on the lower stage 3b side that adsorbs and holds the lower substrate 1b, It may be configured to press 1b.

In any case, according to the substrate bonding apparatus, the substrate bonding method, or the liquid crystal display panel manufacturing apparatus and manufacturing method according to the present invention, the applied adhesive is applied to the applied area by the use of the pressing mechanism. Since the two substrates can be bonded to each other by receiving an appropriate and sufficient pressing force in accordance with the above, the manufacturing yield can be improved, which is an effect obtained in practical use.

[0058]

As described above, according to the substrate bonding apparatus, the substrate bonding method, or the liquid crystal display panel manufacturing apparatus and manufacturing method of the present invention, it is possible to bond high quality substrates. Therefore, especially when applied to the manufacture of a liquid crystal display panel, a remarkable effect can be exhibited.

[Brief description of drawings]

FIG. 1 is a partially cutaway front view showing a first embodiment of a liquid crystal display panel manufacturing apparatus adopting a substrate bonding apparatus according to the present invention.

FIG. 2 is a sectional view of the device shown in FIG. 1, taken along the line AA.

3 is a configuration diagram showing a control system of the apparatus shown in FIG.

FIG. 4 is an enlarged view of a main part of the apparatus shown in FIG.

5 is a front view of the device shown in FIG. 2 taken in the direction of arrow Y. FIG.

FIG. 6 is a view of pressing the upper stage by the device shown in FIG.
It is a front view showing the state where the upper and lower substrates are bonded together.

FIG. 7 is an enlarged view of a main part of the apparatus shown in FIG.

FIG. 8 is a flowchart showing an operation procedure of the apparatus shown in FIG.

FIG. 9 is a partially cutaway front view of a main part showing a second embodiment of a liquid crystal display panel manufacturing apparatus adopting a substrate bonding apparatus according to the present invention.

FIG. 10 is a partially cutaway front view of a main part of a liquid crystal display panel manufacturing apparatus adopting a conventional substrate bonding apparatus.

11 is a cross-sectional view taken along the line AA of the device shown in FIG.

FIG. 12 is an enlarged front view of an essential part in a state where the upper and lower substrates are bonded together by pressing the upper stage in the apparatus shown in FIG.

[Explanation of symbols]

1a Upper substrate 1b Lower substrate 2 chamber 2a Upper chamber 2b Lower chamber 3a upper stage 3b lower stage 4 XY-θ movement mechanism 5 Guide mechanism 6 motor 71,72 imaging camera 8 elastic members 9 spacers 10 liquid crystal 11 Sealant (adhesive) 12 Conveyor rail 13, 13A, 13B pressing mechanism 131 Plate member 131a Upper plate 131b Lower plate 131c Piezoelectric member (pressure sensor) 131f operating rod 132 Drive unit 132d servo motor

Continued front page    F-term (reference) 2H088 FA03 FA04 FA09 FA30 HA01                       MA17                 2H089 NA22 NA32 NA33 NA48 NA60                       QA12 QA14 TA01                 5G435 AA17 BB12 CC09 HH20 KK05                       LL06 LL07 LL08

Claims (6)

[Claims] 1. An upper substrate is held on a lower surface of an upper stage arranged above, and the other lower substrate bonded to the held upper substrate is held on a lower stage located below to be opposed to each other. In a substrate bonding apparatus for bonding the two substrates via an adhesive applied so as to draw a line on one of the substrate surfaces, the substrate surface on the side opposite to the surface sandwiching the adhesive, A substrate bonding apparatus comprising a pressing mechanism that presses a substrate surface in a direction in which a space between both substrates is narrowed along a line on which an adhesive is applied. 2. The apparatus for manufacturing a liquid crystal display panel using a substrate bonding apparatus according to claim 1, wherein the adhesive is formed into a closed curve so as to surround the liquid crystal on the display surface of the substrate. 3. The pressing mechanism includes a pressure sensor that detects a pressing force applied to the substrate, and has a controller that controls the pressing force based on a signal detected by the pressure sensor. The substrate bonding apparatus according to claim 1, or the liquid crystal display panel manufacturing apparatus according to claim 2. 4. A step of holding an upper substrate on a lower surface of an upper stage arranged above, and a lower substrate bonded to the upper substrate held in this step is held on a lower stage located below. And a step of superposing the two substrates with an adhesive applied so as to draw a line on at least one of the upper substrate and the lower substrate, and the both substrates superposed in this step. On the other hand, it comprises a pressing step of pressing from a surface opposite to the substrate surface sandwiching the adhesive in a direction in which the gap between the substrates is narrowed along a line coated with the adhesive. And a method for laminating substrates. 5. The method of manufacturing a liquid crystal display panel using a substrate bonding method according to claim 4, wherein the adhesive has a closed curve formed so as to surround the liquid crystal on the substrate display surface. 6. The substrate bonding method according to claim 4, wherein the pressing step controls the pressing force based on a signal detected by a pressure sensor that detects the pressing force on the substrate. The method for manufacturing a liquid crystal display panel according to claim 5.