KR100938192B1 - Method of superposing and sealing a substrate - Google Patents

Abstract

In conjunction with the release of support of the upper substrate A by the electrostatic adsorption means 5b, the gas G is ejected from the back side of the upper substrate, and the gas is discharged from the electrostatic adsorption surface 5b1 of the upper support plate 1. And by forcibly injecting between the substrate and the back surface of the upper substrate, by breaking the adhesion state between these electrostatic adsorption surfaces and the substrate surface and peeling them off, the electrostatic adsorption force between them is forcibly attenuated and extinguished. The dropping force to the lower substrate B, i.e. the acceleration of the drop, is forcibly applied, whereby the upper substrate is momentarily compressed onto the lower substrate and the upper substrate is changed in posture while being supported by the electrostatic adsorption means 5b. The upper and lower substrates are sealed and overlapped by moving onto the lower substrate without being pressed. Therefore, the upper substrate can be forcedly dropped while being aligned regardless of the release unevenness of the electrostatic attraction force.

Description

Substrate Overlay Sealing Method {METHOD OF SUPERPOSING AND SEALING A SUBSTRATE}

In the manufacturing process of flat panel display apparatuses, such as a liquid crystal display (LCD) and a plasma display (PDP), for example, this invention arrange | positions (aligns) two board | substrates used therein in a XY (theta) direction, It is related with the board | substrate overlapping sealing method of the board | substrate bonding machine which overlaps and seals board | substrates, and pressurizes between both board | substrates to a predetermined | prescribed gap by the pressure difference which arises in the inside and outside of both the upper and lower substrates after that.

Specifically, the upper substrate is detachably supported by the electrostatic adsorption means on the upper support plate, the lower substrate facing the upper substrate is detachably supported on the lower support plate, and the upper and lower substrates are aligned to each other. It is related with the board | substrate superposition sealing method which releases support of the upper board | substrate by electrostatic adsorption means, and superimposes and seals an upper board | substrate on a lower board | substrate when the space | interval becomes desired vacuum degree.

Conventionally, as this type of substrate superimposition sealing method, the pressure plate is composed of an insulating member having an electrode plate embedded therein, and is equipped with an electrostatic adsorption means (electrostatic adsorption function) capable of supporting the upper substrate (upper substrate). The upper substrate is supported on the upper support plate by the adsorption means, and after positioning both substrates in the XY direction, the pressure is reduced in the vacuum chamber, and the electrostatic adsorption function is released when the vacuum chamber reaches the desired vacuum degree. The upper and lower substrates are dropped on the lower substrate, the upper and lower substrates are overlapped, and the pressure plate is lowered, so that the upper and lower substrates are pressed and the gap between them is bonded to a predetermined gap (see Patent Document 1, for example). .

[Patent Document 1]

Japanese Laid-Open Patent Publication No. 2001-166272 (No. 6 page, Fig. 8).

In the conventional substrate superposition sealing method, however, the upper substrate is freely dropped in vacuum by releasing the electrostatic adsorption means, but the substrate adsorption force by the electrostatic adsorption means continues without immediately disappearing even when the power supply is interrupted. Because of this, release unevenness occurs due to the subsequent lowering of the substrate adsorption force, and the interface between the electrostatic adsorption surface and the upper substrate starts to peel off partially, and finally the entire surface of the upper substrate is peeled off and free falls.

As a result, the upper substrate freely falls while rotating around the last peeled point, so that an error occurs in the alignment between the two substrates, and the sealing is incomplete due to the pressure of the free falling and There was a problem that it was easy to mix.

In addition, since the upper substrate is partially lowered by gravity from the point where it first began to peel off against the electrostatic adsorption surface, the inclination occurs, and since the inclination is likely to change according to the situation, it is impossible to correct during free fall. Moreover, even after falling on the lower board | substrate, it was difficult to correct, and there existed a problem that a predetermined parallelism could not be achieved.

By the way, in recent years, although the side which the tendency of a board | substrate has become large is beginning to manufacture more than 1000 mm, parallelism similar to a small board | substrate is calculated | required even if a board | substrate becomes large. In particular, when one side of the substrate exceeds 1000 mm, the distance in the Z direction becomes extremely small compared to the size of the XY direction, so it is ideal to move these upper and lower substrates in a completely parallel state, but in reality it is very difficult.

Under such circumstances, when the large upper substrate larger than 1000 mm on one side is slightly inclined, the gap in the Z direction is extremely small compared to the size in the XY direction, and thus the liquid crystal sealing applied in advance to either of the opposing surfaces of the upper and lower substrates. There is a risk of damaging such as damaging the sealing material (annular adhesive) or the film surface of both substrates, and there is a problem in that normal bonding cannot be expected.

The invention according to claim 1 of the present invention aims to forcibly drop the upper substrate while being aligned regardless of the release unevenness of the electrostatic attraction force.

In addition to the object of the invention of Claim 1, the invention of Claim 2 aims at completely preventing the position shift of the upper board | substrate by the release nonuniformity of an electrostatic attraction force.

In addition to the object of the invention of Claim 1 or 2, the invention of Claim 3 aims at overlapping an upper board | substrate in parallel with a lower board | substrate irrespective of the parallelism of the electrostatic adsorption surface of an upper and lower support plate, and upper and lower board | substrates.

In order to achieve the above object, the invention described in claim 1 in accordance with the release of the support of the upper substrate by the electrostatic adsorption means, and blows off the gas from the back side of the upper substrate, the gas of the upper support plate By forcibly injecting between the electrostatic adsorption surface and the back surface of the upper substrate, the adhesion state between the electrostatic adsorption surface and the substrate surface is destroyed and the two are separated, thereby forcing the electrostatic adsorption force between the two to be attenuated and extinguished. The drop force to the lower substrate, i.e., the acceleration of the drop, is forcibly applied by the pressure of the upper substrate, whereby the upper substrate is instantly pressed onto the lower substrate, and the lower substrate is not changed in posture while being supported by the electrostatic adsorption means. The substrate is moved and pressed onto the substrate to seal and overlap the upper and lower substrates.

Therefore, the upper substrate can be forcedly dropped while being aligned regardless of the release unevenness of the electrostatic attraction force.

As a result, as compared with the conventional method of freely dropping the upper substrate by releasing the electrostatic adsorption, the alignment error between the two substrates can be prevented, and the sealing space can be securely formed, and the mixing of air can be prevented. have.

In addition, since no inclination occurs at all with peeling of the upper substrate from the electrostatic adsorption surface, a predetermined parallelism can be achieved, and a liquid crystal resulting from the inclination of the upper substrate even when one side is larger than 1000 mm. It is possible to completely prevent obstacles such as damaging the sealing material (annular adhesive) for sealing and the membrane surface of both substrates.

In addition to the invention according to claim 1, the invention described in claim 2 is provided from the back side of the upper substrate in a state in which the electrostatic adsorption force remains approximately at the same time as or immediately after the support of the upper substrate is released by the electrostatic adsorption means. By starting the ejection of the gas, the upper substrate is forcibly peeled from the electrostatic adsorption face of the upper support plate at the gas pressure before the release unevenness of the electrostatic adsorption force occurs.

Therefore, the position shift of the upper board | substrate by the uneven release of the electrostatic attraction force can be prevented completely.

In addition to the configuration of the invention according to claim 1 or 2, the invention described in claim 3 is forcedly dropped by adjusting the ejection amount, the ejection speed, and the ejection position of the gas with respect to the upper substrate in accordance with the test result of forcibly falling. The attitude of the upper substrate can be controlled.

Therefore, even if the electrostatic adsorption surfaces and the upper and lower substrates of the upper and lower support plates are not completely parallel, the upper substrate can be overlapped in parallel with the lower substrate.

BRIEF DESCRIPTION OF THE DRAWINGS The longitudinal front view of the board | substrate bonding apparatus used directly for implementation of the board | substrate overlapping sealing method which shows one Example of this invention, (a) is an overall view which shows the state after the fine adjustment of board | substrates, (b ) Partially enlarges the state before forcibly peeling the upper substrate from the electrostatic adsorption surface, and (c) partially enlarges the state after peeling.

2 is an explanatory diagram showing a substrate set time.

3 is an explanatory diagram showing schematic adjustment of substrates.

4 is an explanatory diagram showing a state after joining.

Best Mode for Carrying Out the Invention

The board | substrate bonding apparatus used directly in order to implement the board | substrate superposition sealing method of this invention is relatively movable in a Z direction behind the upper support plate 1 and the lower support plate 2, as shown to FIG. The upper and lower pairs of mounting bodies 3 and 4 provided and the upper and lower support plates 1 and 2 are partitioned so as to be enclosed between the mounting bodies 3 and 4 by the approach movement of these mounting bodies 3 and 4. The support means 5 for detachably supporting the upper space A and the lower board | substrate B provided in the closed space S1 and the upper support plate 1 and the lower support plate 2, respectively is provided.

This embodiment is the upper surface plate 1 in which the upper support plate 1 is mounted to be movable only in the Z (up and down) direction with respect to the plate-shaped upper mounting body 3 that is movable in the XYθ (horizontal) direction. The support plate 2 is the lower surface plate 2 fixed integrally on the plate-shaped lower mounting body 4, and the two glass substrates hold | maintained on the opposing surface of these upper surface plate 1 and the lower surface plate 2 ( By superimposing A and B in the vacuum space S1 and adjusting and moving relatively in the XYθ direction, the case where coarse and fine adjustments are performed sequentially by positioning the two substrates A and B is performed. To indicate.

The upper surface plate 1 and the lower surface plate 2 are formed in a flat plate shape having a thickness not to be deflected (warped) by, for example, a rigid body such as metal or ceramics. And support the circumferential edge portion 3a of the upper mounting body 3 so as to be adjustable and moveable in the Z direction, and the lower surface plate 2 is mounted and fixed on the center portion of the lower mounting body 4 so as not to be distorted. In addition, the center portion of the lower mounting body 4 is connected on the case-shaped mount 14 so as to prevent further distortion.

In the case of the example of illustration, for example, with respect to the horizontal hole 3b which plurally perforated by the peripheral edge part 3a of the upper mounting body 3, the support beam 1a plurally extended to the side surface of the upper surface plate 1 was each, respectively. It can be inserted into a loose fitting shape so as to be adjusted and move only in the Z direction, and both are sealed with an elastic sealing material 1b such as a bellows.

Moreover, as needed, a plurality of elastic members 1c, such as a spring, etc. which can elastically deform only Z direction from the upper mounting body 3 to the upper surface of the upper surface plate 1 can also be extended.

In addition, although the upper mounting body 3 consists of the support body formed in flat form in the example of illustration, and the circumferential edge part 3a of the detachable frame shape connected in airtight state with respect to the circumferential edge, these are formed integrally. You may.

In the case of this embodiment, the said support means 5 is a suction source (for example, a vacuum pump etc.) from the some ventilation hole 5a1 drilled in the opposing surface of the upper surface plate 1 and the lower surface plate 2, respectively. Suction adsorption means 5a, 5a for suctioning the substrates A, B, electrostatic adsorption means 5b, 5b for adsorption support in vacuum, and a substrate transfer robot (not shown). And suction adsorption support means 5c and 5c for receiving the upper and lower substrates A and B from the upper and lower substrates 1 and 2 to the substrate supporting surfaces.                 

The suction source of the suction adsorption means 5a and 5a and the power supply of the electrostatic adsorption means 5b and 5b are controlled by a controller (not shown) and sucked to an initial state in which both substrates A and B are set. And after the electrostatic adsorption is started and the fine adjustment of both the substrates A and B is completed, the suction adsorption and the electrostatic adsorption only on the upper substrate A are released, and after the closed space S1 described later returns to the atmosphere, The suction adsorption and the electrostatic adsorption of the substrate B are released to return to the initial state.

In the example of illustration, the said electrostatic adsorption means 5b and 5b are electrostatic chucks which approach mutually, and are arrange | positioned in parallel, and are made to the metal bases 5d and 5d interposed between the opposing surfaces of the upper and lower base plates 1 and 2. The electrostatic chucks are detachably connected to each other, and the ventilation holes 5a1 and 5a1 of the suction adsorption means 5a and 5a are appropriately applied to the entire surfaces of the electrostatic adsorption surfaces 5b1 and 5b1 which are surfaces of these electrostatic chucks. A plurality of holes are formed per interval.

The said feed | suction adsorption support means 5c and 5c are plurally arrange | positioned so that it can move to Z direction across the bases 5d and 5d of the electrostatic chuck, the upper and lower base plates 1 and 2, and the upper and lower mounting bodies 3 and 4. It is a lift pin and the like, which is a substrate supporting surface of the upper and lower platen 1 and 2 by being sucked again at a position that does not interfere with the non-bonding surfaces of the upper and lower substrates A and B that the substrate transfer robot (not shown) adsorbs and supports. It is to be transferred to the electrostatic chuck.

Moreover, these pedestals 5d and 5d are provided between the opposing surfaces of the upper and lower surface plates 1 and 2 and the pedestals 5d and 5d as necessary, for example, via height adjustment jig 1d and 2d such as a disc spring. The parallelism of the opposing surfaces may be finely adjusted, and the pedestals 5d and 5d and the upper and lower plates 1 and 2 may be bonded to each other without the height adjusting jig 1d and 2d.

In addition, the support means of both board | substrates A and B is not limited to what was mentioned above, For example, if it is low vacuum, the vacuum adsorption means using a vacuum difference can also be used instead of the electrostatic adsorption means 5b and 5b.

Between the peripheral edge part 3a of the upper mounting body 3, and the peripheral edge part 4a of the lower mounting body 4, it supports so that it can move to a XY (theta) direction relatively, maintaining the sealed state between both. The movable sealing means 6 is provided in an annular shape so as to surround both the substrates A and B, and the closed space (3) between the upper and lower mounting bodies 3 and 4 is moved by the approach movement of these mounting bodies 3 and 4. S1) is partitioned so that the upper and lower surface plates 1 and 2 may be enclosed.

In the case of the example of illustration, since the upper and lower board | substrates A and B are rectangular, although the moving sealing means 6 was formed in planar frame shape, it is not limited to this, For example, both board | substrates A and B like a wafer are mentioned. In the case where the circle is circular, it is formed in a similar shape to each other along its outer circumference.

In the case of this embodiment, this moving sealing means 6 is attached to the moving block 6a formed in the cross-sectional rectangle or circle according to the planar shape of the upper and lower board | substrates A and B, and the upper surface of this moving block 6a. The lower part mounted on the lower surface of the movable block 6a and the annular sealing material 6b which can be elastically deformed in Z direction, such as an O-ring, for example, which is joined to the peripheral edge part 3a of one upper mounting body 3, and is separated. It consists of an annular vacuum seal 6c, such as an O-ring, which is always in contact with the peripheral edge part 4a of the mounting body 4, and is movable in an XY (theta) direction.                 

A vacuum lubricating oil is used for this vacuum seal 6c as needed, for example, and in the example of illustration, a vacuum seal is spread over the peripheral edge part 4a of the lower mounting body 4 in the inner lower surface of the moving block 6a. Although only 6 layer was interposed, it is not limited to this, Although it is not shown in figure, the vacuum seal 6c can also be added and double-interposed also in the outer lower surface of the moving block 6a, and similarly to this, the annular sealing material 6b It can also interpose double inside and outside the figure.

In addition, either of the opposing surfaces of the substrates A and B, in the case of the present embodiment, has a frame shape in which the annular adhesive C is closed as a sealing material for liquid crystal sealing in advance along the peripheral edge of the surface of the lower substrate B. The liquid crystal (not shown) is filled in advance, and a plurality of gap adjusting spacers (not shown) are scattered as necessary.

And the above-mentioned schematic adjustment is performed in the state which maintained the space | interval of upper and lower board | substrates A and B so that the upper board | substrate A may not contact the annular adhesive C at all, and the upper board | substrate A will be lowered after that. The fine adjustment mentioned above is performed in the state which contact | connected at least one part of circumferential direction of the annular adhesive C at this time.

In order to perform these coarse and fine adjustment, the board | substrate spacing adjustment means 7 which moves one or both of the upper and lower base plates 1 and 2 in parallel to a Z direction with respect to the upper and lower mounting bodies 3 and 4, Coupling means 8 which couples the moving seal means 6 and the upper and lower mounting bodies 3 and 4 in the XYθ direction and integrates them, and horizontal moving means which adjusts and moves the moving seal means 6 in the XYθ direction ( 9), the position adjusting means 10 having a large rigidity in the vertical (Z) direction which is movable in the same direction with the adjustment movement of the upper surface plate 1 and the lower surface plate 2 in the relative XYθ direction, Lifting means 11 for elevating the upper and lower mounting bodies 3 and 4 in the Z direction so as to open and close the closed space S1, and intake means for extracting and inserting the gas in the closed space S1 to a predetermined vacuum degree ( 12) is equipped.

In the present embodiment, the substrate gap adjusting means 7 is plural in the circumferential direction on the upper surface of the moving block 6a toward the support beam 1a of the upper surface plate 1 that can be adjusted and moved in the Z direction. For example, it is the drive body which expands and contracts in Z direction, such as a linear actuator, and moves further the space | interval of both board | substrates A and B which approached and moved by the elevating means 11 mentioned later, and adjusts coarse and finely. Adjustments are made in sequence.

The drive body of this board | substrate space | interval adjustment means 7 is a control factor (not shown), and a change factor, such as thickness balance of board | substrates A and B, before the time of setting both board | substrates A and B. FIG. In consideration of this, each of the driving bodies is stretched separately so that the upper and lower surface plates 1 and 2 are set in parallel, and in the state where the closed space S1 is formed thereafter, the upper substrate A is formed on the lower substrate B. By providing a clearance of about 1 mm to 2 mm that does not come into contact with the annular adhesive C or the liquid crystal at all, and then shortly driving them in turn in conjunction with the coarse and fine adjustment of both substrates A and B, The gap between the two substrates A and B is approached step by step to an interval that can sufficiently secure the positioning accuracy of the two substrates A and B. After the closed space S1 has returned to atmospheric pressure, it is stretched and initialized. Return to the state.

To describe the specific example, it is preferable to approach the upper substrate A to about 0.5 mm in which the upper substrate A does not come into contact with the annular adhesive C as the minimum value before the coarse adjustment, and the minimum value before the fine adjustment is performed. As the upper substrate A, even if the upper substrate A partially contacts at least a part of the circumferential direction of the annular adhesive C, it is preferable to bring the upper substrate A closer to about 0.1 mm to 0.2 mm that does not contact the lower substrate B.

In addition, although not shown, the drive body of the board | substrate spacing adjustment means 7 can also be provided toward the support beam 1a of the upper surface plate 1 from the peripheral edge part 3a of the upper mounting body 3.

In the present embodiment, the coupling means 8 is provided only in the Z direction formed on opposite surfaces of the moving block 6a of the movable sealing means 6 and the peripheral edge portion 3a of the upper mounting body 3, respectively. It consists of the recessed part 8a and the convex part 8b which fit together, In the example of illustration, this recessed part 8a is formed in the upper surface of the moving block 6a of the moving sealing means 6, and the convex part ( Although 8b) is formed convexly on the lower surface of the peripheral edge part 3a of the upper mounting body 3, these can also be arrange | positioned upside down.

In the present embodiment, the horizontal moving means 9 includes a cam 9b extending to at least three motors 9a provided outside the closed space S1, and the cam 9b is moved to a moving block ( It is made of an elastic body 9c such as a spring, for example, which is in constant contact with 6a), and the marks displayed on both substrates A and B are based on data output from a detector (not shown) composed of a microscope and a camera. By operating the motor 9a, the moving block 6a and the upper mounting body 3 coupled thereto are pressed and driven in the XYθ direction, and the coarse and fine adjustment of the upper substrate A supported by the upper surface plate 1 is performed. Is carried out.

In addition, the horizontal movement means 9 is not limited to the cam 9b extended to the motor 9a, For example, it may be another drive source, such as an actuator.

In the present embodiment, the position adjusting means 10 is constituted by a plurality of substantially parallel members extending in the Z direction, and one end thereof is joined to each other, and the other end thereof is a moving block of the sealing means 6. It joins to 6a and the lower mounting bodies 4, respectively, and supports some part of multiple members so that bending deformation is possible only in the XY (theta) direction.

More specifically, the center member 10a having a large rigidity in the Z direction joined so that the plurality of members are lowered from the lower surface of the moving block 6a toward the peripheral edge portion 4a of the lower mounting body 4 and And a peripheral member 10b that is bent and deformed in the XYθ direction joined to be lowered to the lower surface of the peripheral edge portion 4a of the lower mounting body 4 so as to surround the periphery thereof, and the center member 10a and the peripheral member ( It consists of the connection member 10c which joins and supports the lower end part of 10b). The unit which integrates these is arrange | positioned in the circumferential direction along the circumferential edge part 4a of the lower mounting body 4 in plurality at predetermined intervals, and the atmospheric pressure which acts on the upper mounting body 3, this upper mounting body 3, and upper part Since the force such as the weight of the surface plate 1 is dispersed in each of the center members 10a provided vertically from the lower surface of the moving block 6a over each connection member 10c, Z of each center member 10a has. Due to the large rigidity in the direction, the space between the lower surface of the moving block 6a and the peripheral edge portion 4a of the lower mounting body 4 is maintained at predetermined intervals.

In particular, in the case of the illustrated example, the center member 10a is formed in a circumferential shape having a large diameter that is high in the Z direction and does not deform in the XYθ direction, and is drilled in the circumferential edge portion 4a of the lower mounting body 4. A plurality of peripheral members 10b deformable in the XYθ direction made of a link mechanism are arranged in the XYθ direction so as to be movable in the XYθ direction with respect to the passage hole 4b, for example, four are arranged. In addition, as the bending member 10d used for the lower end and the upper end of these link mechanisms, for example, a ball joint or the like is used, and the connecting member 10c is formed in a flat disk shape.

In addition, the structure of the multiple member which comprises the said position adjusting means 10 is not limited to what was shown in figure, The periphery member 10b which can deform | transform in an XY (theta) direction is formed elastically deformable instead of the above-mentioned link mechanism, or multiple Elastic bars made of two elastically deformable columns, wires, or the like are disposed or, on the contrary, the rigidity of the peripheral member 10b is increased in the Z direction so as not to be deformable in the XYθ direction, and the center member 10a is in the XYθ direction. The same effect can be obtained also with other structures, such as deformation.

In the present embodiment, the elevating means 11 is, for example, jack or vertical drive fixedly arranged toward the four corner portions of the peripheral edge portion 3a of the upper mounting body 3 at the periphery of the mount 14. And the front end portion 11a so as to be in contact with the circumferential edge portion 3a of the upper mounting body 3 in the XYθ direction so as to be movable, and the intermediate portion 11b is the movable sealing means 6. The moving block 6a is inserted through and moved in the XYθ direction.

In the initial state in which the drive source of the elevating means 11 is operated by a controller (not shown) and sets the substrates A and B, the upper mounting body 3 is raised to a predetermined height position and is waiting. After the completion of the set of the substrates A and B, the upper mounting body 3 is lowered to partition the closed space S1 between the lower mounting body 4 so as to surround both substrates A and B. After completion of the fine adjustment of both the substrates A and B or after the closed space S1 described later returns to the atmospheric pressure, it is raised to return to the initial state.

The intake means 12 is an air passage for communicating with a vacuum pump (not shown) provided outside the closed space S1, and the vacuum pump is operated and controlled by a controller (not shown), and the upper and lower surface plates 1 , The intake air is started thereafter after the closed space S1 is formed by the approach movement of 2), and in the case of this embodiment, the air is supplied to the closed space S1 after the substrate pressing means 13 described later. To return to atmospheric pressure.

In the case of the example of illustration, the inlet 12a to the said ventilation path is formed in the clearance gap formed by the opposing surface of the upper and lower base plates 1 and 2, and the pedestals 5d and 5d, respectively, and is closed from these inlet 12a and 12a. The adverse effect of the air in the space S1 flowing only in one direction, for example, preventing the supported substrates A and B from tilting or the liquid crystal previously charged on the lower substrate B from scattering. .

The substrate crimping means 13 forcibly presses the upper substrate A, which is electrostatically adsorbed onto the electrostatic chuck which is the substrate support surface of the upper surface plate 1 in the state after the fine adjustment described above, toward the lower substrate B. As shown in Fig. 1 (b) (c), the electrostatic adsorption force of the upper substrate A by the electrostatic adsorption means 5b is substantially coincident with the release of the electrostatic adsorption force. In the illustrated example, the gas G such as nitrogen gas or air is moved from the electrostatic chuck toward the back side of the upper substrate A by using the vent holes 5a1 and 5a1 of the suction adsorption means 5a and 5a. The gas G is sprayed and forcedly injected between the electrostatic adsorption surface 5b1 of the upper support plate 1 and the back surface of the upper substrate A, so that these electrostatic adsorption surfaces 5b1 and the substrate surface are in close contact with each other. By desorption of the protons, the electrostatic adsorption force between them Attenuation and extinction, and the force of the falling force to the lower substrate B, i.e., the acceleration of the drop, is forcibly applied by the pressure of the injected gas G, whereby the upper substrate A is at least about 0.1 mm to It falls about 0.2 mm and presses over the whole periphery of the annular adhesive C on the lower board | substrate B instantaneously.

In addition, about the injection of the said gas G, it is necessary to set at least the following operating conditions beforehand based on a prior test result.

(1) Delay time from the electrostatic adsorption of the upper substrate A by the electrostatic adsorption means 5b to the injection operation of the gas G.

(2) Injection pressure of gas G.

(3) Injection time of gas G.

On the other hand, the substrates A and B are supported by a robot for transporting a substrate (not shown), are transferred to the upper surface plate 1 and the lower surface plate 1, and passed to the respective supporting means 5, but in particular, In the case of the upper board | substrate A, since the film surface A2 faces downward, it is common to support and convey only the peripheral edge part so that it may not be damaged. However, especially in the case of the large sized board | substrates A and B in which one side exceeds 1000 mm, the center part of the film surface A2 of the upper board | substrate A sags with support of only the above-mentioned peripheral edge part, There is a fear that the central portion of the membrane surface A2 may be damaged by hitting foreign substances.

Therefore, in the present embodiment, as shown by the dashed-dotted line in Fig. 2, the substrate transfer robot adsorbs a plurality of points on the non-bonded surface (rear surface A1) on the opposite side to the membrane surface A2 of the upper substrate A to prevent the membrane surface A2. In addition, the center portion of the upper substrate A is transported so as not to sag, and the suction adsorption support means 5c for feeding the support means 5 is extended downward toward the non-bonded surface A1 of the upper substrate A, thereby providing a substrate. It picks up again at a position which does not interfere with the suction position of the transfer robot, and transfers it to the substrate support surface of the upper surface plate 1.

Next, the board | substrate overlap sealing method by such a board | substrate bonding apparatus is demonstrated according to process order.

First, the upper and lower substrates A and B are suction-transferred by the substrate transfer robot and transferred to the support means 5 of the upper surface plate 1 and the support means 5 of the lower surface plate 1, respectively. In the case of the example, a non-bonding surface A1 of the upper substrate A is absorbed and transferred by the substrate transport robot, and as shown by the double-dotted line in FIG. By adsorption by the support means 5c again, the adsorption | suction of only this non-joining surface A1 makes it possible to send out to the board | substrate support surface of the upper surface plate 1 by the adsorption | suction of the board | substrate conveyance robot, and to enlarge the board | substrate A and B In connection with this, the center part of the upper board | substrate A does not sag.

As a result, even if the board | substrate A and B become large, it can carry in without damaging the film surface A2.

Thus, as shown in FIG. 2, the upper board | substrate A and the lower board | substrate B by which the adhesive agent C were previously apply | coated and the liquid crystal was filled to the opposing surface of the upper surface plate 1 and the lower surface plate 2 are shown. When each of the substrates is pre-aligned and set, the suction adsorption means 5a and 5a and the electrostatic adsorption means 5b and 5b respectively support the substrates A and B so as not to be movable.

After that, as shown in FIG. 3, the upper mounting body 3 is lowered by the operation of the elevating means 11 to approach the lower mounting body 4, and the circumferential edge portion 3a of the upper mounting body 3 Coupling means 8 respectively formed on opposing surfaces of the moving block 6a of the moving sealing means 6 are fitted only in the Z direction, and both of them are integrated in the XYθ direction and the annular seal on the moving block 6a is provided. Close to the ash 6b, the closed space S1 is partitioned between the upper and lower mounting bodies 3 and 4 so as to surround the upper and lower plates 1 and 2 and the substrates A and B. .

At the same time, both of the substrates A and B are approached to a predetermined interval by the approach movement of the upper surface plate 1 and the lower surface plate 2, but the substrate spacing adjusting means 7 is about 1 mm to 2 mm. The upper substrate A does not come into contact with the annular adhesive C applied to the lower substrate B and replaced with a gap of a degree, and the space between the substrates A and B and the closed space S1 are In communication.

Thereafter, the air is taken out of the closed space S1 by the operation of the intake means 12 to become a predetermined vacuum degree, and the air is also taken out from between the substrates A and B to become a vacuum.

As a result, atmospheric pressure acts on the upper and lower mounting bodies 3 and 4 surrounding the upper surface plate 1 and the lower surface plate 2, and these upper and lower mounting bodies 3 are formed by a pressure difference from the vacuum space S1. , 4) may deform, but no atmospheric pressure acts on the upper surface 1 in the closed space S1.                 

As a result, the distortion deformation of the upper surface plate 1 by atmospheric pressure can be prevented without further reinforcement.

In the case of the present embodiment, the thickness of the lower mounting body 4 is thickened to such an extent that it does not deform even when atmospheric pressure acts, so that the lower surface plate 2 is not skewed and deformed at atmospheric pressure.

In the case of the example of illustration, even if the upper mounting body 3 is distorted and deformed toward the inside of the closed space S1 by atmospheric pressure, by the elastic linkage member 1c which is elastically deformable only in the Z direction over the upper surface of the upper surface plate 1. There is an advantage that the warp deformation of the upper mounting body 3 does not affect the upper surface plate 1 at all, and does not shift laterally in the XYθ direction.

And in this vacuum state, as shown in FIG. 3, the upper surface plate 1 lowers toward the lower surface plate 2 by operation | movement of the board | substrate space | interval adjustment means 7, and the upper and lower substrates A and B of After approaching the gap to at least about 0.5 mm, the moving block 6a of the moving seal means 6 is pushed and driven in the XYθ direction by the operation of the horizontal adjusting means 9, thereby engaging with this moving block 6a. The upper mounting body 3 integrated with the means 8 moves in the XYθ direction with respect to the lower mounting body 4, whereby the upper surface plate 1 is moved in the XYθ direction relative to the lower surface plate 2. Then, coarse adjustment of both substrates A and B is performed.

As a result, both the substrates A and B in the vacuum can be smoothly XYθ moved from the outside of the closed space S1 without using the XYθ stage, so that they can be roughly adjusted with high precision.

At the same time, when the moving block 6a is pressurized and driven in the XYθ direction, the peripheral member 10b of the position adjusting means 10 is bent and deformed, so that the center member 10a and the moving block 6a move in parallel, Due to the large rigidity in the vertical direction of the center member 10a, the moving block 6a is made to withstand the atmospheric pressure acting on the upper mounting body 3, the weight of the upper mounting body 3 and the upper surface plate 1, and the like. Since the space | interval between the lower surface of () and the peripheral edge part 4a of the lower mounting body 4 is maintained by predetermined space | interval, the sliding resistance which the vacuum seal 6c of the moving sealing means 6 receives is reduced.

As a result, positioning of both board | substrates A and B can be performed smoothly.

Subsequently, as shown in Fig. 1 (a) and (b), by the operation of the substrate gap adjusting means 7, the upper surface plate 1 descends toward the lower surface plate 2, so that the upper and lower substrates A, After further approaching the space of B) to at least about 0.1 mm to about 0.2 mm, the upper surface plate 1 and the lower surface plate 2 are adjusted and moved relatively in the XYθ direction, so that the fines of both substrates A and B Adjustment is made.

After the fine adjustment is completed, the electrostatic adsorption of the upper substrate A by the electrostatic adsorption means 5b is released entirely, and the substrate crimping means 13 is used to remove the plurality of vent holes 5a1 and 5a1. For example, a gas G such as nitrogen gas is ejected evenly to the entire non-bonding surface (rear surface) A1 of the upper substrate A, and this gas G is discharged to the electrostatic adsorption surface of the upper support plate 1 ( 5b1) is forcibly injected between the back surface of the upper substrate A, and the electrostatic adsorption force between the two is forcibly attenuated by destroying the adhesion state between these electrostatic adsorption surfaces 5b1 and the substrate surface and peeling them off. In addition, the drop force to the lower substrate B, i.e., the acceleration of the drop, is forcibly applied by the pressure of the injected gas G. As a result, as shown in FIG. Momentarily press-sealed over the entire circumference of the annular adhesive C on the lower substrate B A space (S2) are surely formed.

As a result, even when the power supply of the electrostatic adsorption means 5b is interrupted, even if the substrate adsorption force does not immediately disappear but continues to operate, the upper substrate A is moved in the XYθ direction without being affected by the release unevenness of the substrate adsorption force. You can drop it forcibly while positioning.

Thereby, there exists an advantage that the alignment error of both board | substrates A and B can be prevented, and sealing space S2 can be formed reliably, and mixing of air can be prevented.

In addition, when the ejection of the gas G is started from the back side of the upper substrate A at approximately the same time as or immediately after the support of the upper substrate A by the electrostatic adsorption means 5b is released, the electrostatic Before the release unevenness of the adsorption force occurs, the upper substrate A is forcibly peeled from the electrostatic adsorption surface 5b1 of the upper support plate 1 by the gas G pressure.

As a result, there is an advantage that the positional shift of the upper substrate A due to the uneven release of the electrostatic attraction force can be completely prevented.

In addition, in this case, when the ejection amount, the ejection speed, and the ejection position of the gas G with respect to the upper substrate A are configured to be adjustable, according to the test result of forcibly dropping, the upper substrate A By adjusting the ejection amount, the ejection speed, and the ejection position of the base G, the attitude of the upper substrate A forcibly falling can be controlled.

As a result, even if the electrostatic adsorption surfaces 5b1 and the upper and lower substrates A and B of the upper and lower support plates 1 and 2 are not completely parallel, the upper substrate A can be overlapped with the lower substrate B in parallel. There is this.

After the crimping of the substrates A and B is completed, air or nitrogen is introduced into the closed space S1 by the operation of the intake means 12 to return the atmosphere to atmospheric pressure.

Thereby, a predetermined gap is formed in the state in which the liquid crystal is enclosed evenly by being pressed evenly by the pressure difference which arises in and out of both board | substrates A and B. As shown in FIG.

After that, when the inside of the closed space S1 returns to atmospheric pressure, the upper mounting body 3 and the upper surface plate 1, the lower mounting body 4, and the lower surface plate 2 are operated by the operation of the elevating means 11. The board | substrate conveyance robot takes out the both board | substrates A and B which were separated, and the closed space S1 was opened and aligned, and the above-mentioned operation is repeated.

Moreover, in the said Example, the upper mounting body 3 is installed so that a movement to a Z direction is possible behind the upper surface plate which is the upper support plate 1, and the lower mounting body 4 is behind the lower surface plate which is the lower support plate 2. ) Is fixed integrally, but is not limited to this, and although not shown, the lower mounting plate 4, which is the lower support plate 2, and the lower mounting body 4 are separated and disposed so that the lower mounting body 4 is deformed by atmospheric pressure. It is also possible not to affect the lower surface plate 2.

In this case, the same thing as the elastic member 1c, such as a spring, which is elastically deformable only in the Z direction which spread | emitted as needed between the upper mounting body 3 and the upper surface of the upper surface plate 1, is lowered, It may be arranged between the surface plate and the lower mounting body 4 so that both are connected.

As mentioned above, the board | substrate superposition sealing method which concerns on this invention is used in the industry which manufactures flat panel display apparatuses, such as a liquid crystal display (LCD) and a plasma display (PDP).

Claims (3)

The upper substrate A is detachably supported by the electrostatic adsorption means 5b on the upper support plate 1, and the lower substrate B facing the upper substrate A is detachably mounted on the lower support plate 2. The upper substrate A is supported by the electrostatic adsorption means 5b when the upper and lower substrates A and B are aligned and the upper and lower substrates A and B are at a desired vacuum level. In the substrate superimposition sealing method of releasing and encapsulating the upper substrate A on the lower substrate B, In association with the release of the upper substrate A by the electrostatic adsorption means 5b, the gas G is blown between the electrostatic adsorption surface 5b1 of the upper support plate 1 and the back side of the upper substrate A. And the upper substrate (A) is forcibly peeled off from the electrostatic adsorption surface (5b1) by the pressure of the gas (G), and is pressed and sealed on the lower substrate (B) instantaneously. The gas from the back side of the upper substrate A according to claim 1, wherein the electrostatic adsorption force remains at the same time as or immediately after the support of the upper substrate A by the electrostatic adsorption means 5b is released. The jet of (G) was started, The board | substrate overlap sealing method characterized by the above-mentioned. The substrate superposition sealing method according to claim 1 or 2, wherein the ejection amount, ejection speed, and ejection position of the gas (G) with respect to the upper substrate (A) can be adjusted.

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