CN1692388A

CN1692388A - Method for sealing substrates while stacking

Info

Publication number: CN1692388A
Application number: CNA200380100016XA
Authority: CN
Inventors: 竹节宪之; 古闲泰行; 大岛秀树; 稻叶亮一
Original assignee: Shin Etsu Engineering Co Ltd
Current assignee: Shin Etsu Engineering Co Ltd
Priority date: 2003-10-23
Filing date: 2003-10-23
Publication date: 2005-11-02
Anticipated expiration: 2023-10-23
Also published as: JP3721378B2; WO2005041156A1; KR20060093357A; JPWO2005041156A1; TW200517700A; KR100938192B1; CN100426338C; TWI266264B; AU2003275604A1

Abstract

While interlocking with the operation of an electrostatic attraction means (5b) for releasing an upper substrate (A), gas (G) is jetted from the back side of the upper substrate and injected forcibly between the electrostatic attraction face (5b1) of an upper holding plate (1) and the back surface of the upper substrate. Since adhesion state of the electrostatic attraction face and the substrate surface is broken and they are stripped from each other, electrostatic attraction between them is attenuated forcibly and eliminated. Since a falling force or a falling acceleration acts forcibly on a lower substrate (B) due to the pressure of injected gas, the upper substrate adheres onto the lower substrate instantaneously. The upper substrate is moved, while being held by the electrostatic attraction means (5b), onto the lower substrate without varying the attitude, and bonded and stacked thereon while being sealed. The upper substrate can thereby be dropped forcibly while being aligned regardless of variation in the electrostatic attraction being released.

Description

Substrate overlaps encapsulating method

Technical field

The substrate that the present invention relates to a kind of base plate bonding machine overlaps encapsulating method, be for example in the manufacture process of the flat-panel monitor of LCD (LCD) or plasma display (PDP) etc., with its employed two plate bases relatively behind the involutory position of XY θ direction (location), make and overlap sealing between these substrates, thereafter, by at the draught head of the inside and outside generation of two substrates up and down, pressurize, between two substrates, reach the interval of regulation.

In detail, relate to a kind of substrate and overlap encapsulating method, be by Electrostatic Absorption mechanism, detachable ground remains on the upside substrate on the holding plate of top, and the downside substrate that detachable ground will be relative with this upside substrate remains on the holding plate of below, and the position of carrying out between these upper and lower base plates is involutory, when being required vacuum tightness around it, releasing overlaps on the downside substrate upside substrate according to the maintenance to the upside substrate that Electrostatic Absorption mechanism carries out, and seals.

Technical background

In the past, overlap encapsulating method as this kind substrate, be to constitute by increased pressure board is built-in with battery lead plate in inside insulativity parts, has the Electrostatic Absorption mechanism (Electrostatic Absorption function) that can keep upside substrate (upper substrate), by this Electrostatic Absorption mechanism, the upside substrate is remained on the holding plate of top, with these two substrates behind the involutory position of XY direction, to reducing pressure in the vacuum chamber, when in this vacuum chamber, reaching required vacuum tightness, remove the Electrostatic Absorption function, the upside substrate is dropped on the downside substrate, making up and down, two substrates overlaps, by this increased pressure board is descended,, make both intervals that is spaced apart regulation to two substrates pressurization up and down, glue together (for example, with reference to patent documentation 1).

[patent documentation 1]

The spy open the 2001-166272 communique (the 6th page, Fig. 8)

But, overlap in the encapsulating method at substrate in the past as described above, it is releasing by Electrostatic Absorption mechanism, in a vacuum, make the free-falling of upside substrate, but because of the substrate absorption affinity that produces according to Electrostatic Absorption mechanism, even interdict its power supply, the substrate absorption affinity can not disappear immediately yet, but continues the generation effect, so because in the reduction of thereafter substrate absorption affinity, and producing the instability of removing, the interface of Electrostatic Absorption face and upside substrate begins the part peels off, so, make comprehensively peeling off of upside substrate at last, free-falling.

In view of the above, because the upside substrate is the center with the position of peeling off at last, the one side rotation is moved, the one side free-falling, so have following problems, that is, producing error on the involutory position between the two substrates, in the pressure of free-falling, sealing is incomplete simultaneously, and air is sneaked into easily.

Have again, also have following problems, that is because the upside substrate from the position that begins with respect to the Electrostatic Absorption face to peel off in advance because gravity and local sagging, produce, and, change according to this tilt condition easily, in free-falling, can not revise, after dropping on the downside substrate, also be difficult to revise simultaneously, can't reach the depth of parallelism of regulation.

But in recent years, in the tendency that substrate maximizes, begin to make the substrate that a limit surpasses 1000mm, even but substrate maximizes the also requirement and the small-sized same depth of parallelism of substrate.Particularly, then compare with the size of this XY direction if a limit of substrate surpasses 1000mm, because the interval of Z direction is extremely little, so, move though should make these upper and lower base plates be that completely parallel state is approaching ideally, in fact very difficulty.

Because under such environment, the large-scale upside substrate that surpasses 1000mm as if a limit only has small inclination, then compare with the size of XY direction, the interval of Z direction is also extremely little, so exist the sealing liquid crystal smeared in advance on any one party of the relative face make upper and lower base plate with encapsulant (ring-type bonding agent) or make the possibility of the fault generation that the face of two substrates sustains damage etc., existence can not be expected the problem of complete normal gummed.

The purpose of the described invention of the 1st technical scheme among the present invention is, the upside substrate is fallen under the involutory state in position, and unstable irrelevant with the releasing of Electrostatic Absorption power.

The described invention of the 2nd technical scheme is on the basis of the described goal of the invention of the 1st technical scheme, and the position displacement of adding with the upside substrate that prevents from fully to cause according to the instability that Electrostatic Absorption power is removed is a purpose.

The described invention of the 3rd technical scheme, be on the basis of the 1st or the 2nd described goal of the invention of technical scheme, add so that upside substrate and downside substrate and the Electrostatic Absorption face of holding plate up and down and up and down the depth of parallelism of two substrates have nothing to do, overlapping abreast is purpose.

Summary of the invention

To achieve the above object, the invention that the 1st technical scheme is put down in writing among the present invention is, remove interlock with the maintenance of carrying out according to Electrostatic Absorption mechanism to the upside substrate, make the rear side ejection of gas from this upside substrate, between the Electrostatic Absorption face by this gas being forced inject the top holding plate and the back side of upside substrate, destroy the intimate-association state of these Electrostatic Absorption faces and real estate, by both are peeled off, mandatory decay is eliminated Electrostatic Absorption power between the two, simultaneously, pressure by institute's injecting gas, forcibly make the falling force of downward side group plate, i.e. the acceleration generation effect of Xia Luoing, in view of the above, this upside substrate is crimped onto on the downside substrate, the state of upside substrate to be kept by Electrostatic Absorption mechanism, posture move steadily and are crimped onto on the downside substrate, seal overlapping upper and lower base plate.

Therefore, the upside substrate is fallen under the involutory state in position, and unstable irrelevant with the releasing of Electrostatic Absorption power.

Its result is, with the releasing by Electrostatic Absorption, the technology in the past of upside substrate free-falling compared, and can prevent the involutory error in position between the two substrates, can form seal cavity effectively simultaneously, can prevent sneaking into of air.

Have again, because be accompanied by upside substrate peeling off from the Electrostatic Absorption face, can not produce inclination fully, so can reach the depth of parallelism of regulation, and, even limit surpasses the large substrate of 1000mm, the inclination that also can fully prevent above side group plate is that the sealing liquid crystal of cause is with encapsulant (ring-type bonding agent) or fault that the face of two substrates is sustained damage etc.

The described invention of the 2nd technical scheme, be on the basis of the described invention of the 1st technical scheme, add the roughly while that is disengaged in maintenance to the upside substrate by Electrostatic Absorption mechanism, or following closely also remaining has under the state of Electrostatic Absorption power, begin rear side ejection gas from the upside substrate, before the releasing instability generation of Electrostatic Absorption power,, the upside substrate is peeled off from the Electrostatic Absorption face of top holding plate by gaseous tension.

Therefore, can prevent position displacement fully because of the unstable upside substrate that causes of the releasing of Electrostatic Absorption power.

The described invention of the 3rd technical scheme is on the basis of the formation of the 1st or the 2nd described invention of technical scheme, add by test result according to mandatory whereabouts, adjust spray volume, spouting velocity and the ejection position of gas, can control the posture of the upside substrate of forcing to fall with respect to the upside substrate.

Therefore, though up and down the Electrostatic Absorption face of holding plate or up and down two substrates be not parallel fully, also can make upside substrate and downside substrate overlapping abreast.

Description of drawings

Fig. 1 is that the vertical profile of the direct base plate bonding device that uses in the enforcement of the substrate coincidence encapsulating method of expression one embodiment of the present of invention is looked front elevation, (a) be the overall diagram of the state behind expression little involutory between the substrate, (b) be the local state that amplifies expression is forcibly peeled off the upside substrate from the Electrostatic Absorption face before, (c) be the local state that amplifies after expression is peeled off.

Key diagram when Fig. 2 is the setting of expression substrate.

Fig. 3 is thick to fashionable key diagram between the expression substrate.

Fig. 4 is the key diagram of the state behind the expression gummed.

Embodiment

The base plate bonding device that directly uses in order to implement substrate of the present invention to overlap encapsulating method, as Fig. 1-shown in Figure 4, have a pair of

fixing body

3,4, enclosure space S1 and maintaining body 5 up and down, this a pair of

fixing body

3,4 is provided in the behind of top holding plate 1 and below holding plate 2, can relatively move freely to the Z direction; This enclosure space S1 moves by the approaching of these

fixing bodies

3,4, cuts apart formation for

holding plate

1,2 about surrounding between fixing

body

3,4; This maintaining body 5 is used for dismantled and assembled upside substrate A and the downside substrate B that freely keeps respectively being equipped on top holding plate 1 and the below holding plate 2.

What this embodiment represented is following situation, top holding plate 1 is with respect to the tabular top fixing body 3 that can move to XY θ (level) direction, the last price fixing 1 that can be mounted to Z (up and down) direction only with moving freely, below holding plate 2 is that one is fixed on the following price fixing 2 on the tabular below fixing body 4, by the 2 sheet glass system substrate A that make on these price fixing 1 and keep on the relative face of price fixing 2 down, B is overlapping in the enclosure space S1 of vacuum, relatively move, and order is carried out as two substrates A to the adjustment of XY θ direction, involutory thick involutory and little involutory in position between the B.

Last price fixing 1 and following price fixing 2 are the rigid bodies by for example metal or pottery etc., constitute the thick tabular that can not distort (deflection) distortion, under the situation of present embodiment, be circumference 3a with respect to top fixing body 3, can freely adjust support movably to the Z direction and go up price fixing 1, following price fixing 2 mountings are fixed on below fixing body 4 middle body above, making it not can distorted deformation, middle body that simultaneously will this below fixing body 4 is connected on the basket stand 14, and further making it can distorted deformation.

Under the situation of illustrated example, for example, open a plurality of cross-drilled hole 3b that wear on the circumference 3a with respect to fixing body 3 up, to a plurality of brace summer 1a that on the side of last price fixing 1, set up continuously, insert logical etc. respectively with the loose fit shape, only can freely adjust movably and support to the Z direction, simultaneously these between the two, with the elaxtic seal 1b sealing of for example corrugated tube etc.

Have again, also can be as required, from top fixing body 3 to whole go up price fixing 1 above, set up a plurality of continuously only at the elastomeric element 1c of for example spring of Z direction elastically deformable etc.

In addition, top fixing body 3 is by forming flat maintenance main body and with respect to its periphery under the situation of illustrated example, and the circumference 3a of the separable frame shape that airtight shape connects constitutes, also can be integrally formed these.

Above-mentioned maintaining body 5 is under the situation of present embodiment, be equipped with and attract

adsorbing mechanism

5a, 5a, the 5b of Electrostatic Absorption mechanism, 5b and accept to use to adsorb maintaining

body

5c, 5c, this attracts adsorbing mechanism 5a, the 5a attraction source (not having diagram) by for example vacuum pump etc., attract absorption substrate A, B from the relative face of last price fixing 1 and following price fixing 2, opening a plurality of air hole 5a1 that wear respectively; The absorption that the 5b of this Electrostatic Absorption mechanism, 5b are used in a vacuum keeps; This is accepted with adsorbing maintaining

body

5c, and 5c accepts from substrate and transports upper and lower base plate A, the B that uses robot (not having diagram), is used for it is transplanted on this substrate maintenance face of price fixing 1,2 up and down.

The attraction source of above-mentioned attraction adsorbing

mechanism

5a, 5a and the power supply of the 5b of Electrostatic Absorption mechanism, 5b, move control by controller (do not have diagram), in the A-stage of setting two substrates A, B, begin to attract absorption and Electrostatic Absorption, after finishing two substrates A, B little involutory, only remove attraction absorption and Electrostatic Absorption, after enclosure space S1 described later turns back to atmosphere to upside substrate A, releasing is got back to A-stage to attraction absorption and the Electrostatic Absorption of downside substrate B.

In illustrated example, the above-mentioned Electrostatic Absorption 5b of mechanism, 5b are the electrostatic chucks of approaching mutually, arranged side by side shape configuration, with respect to metal pedestal 5d, the 5d between the relative face of price fixing 1,2 up and down, be connected and fixed electrostatic chuck detachable, spread all over as Electrostatic Absorption face 5b1, the 5b1 on the surface of these electrostatic chucks comprehensively, respectively with each appropriate interval, a plurality of air hole 5a1,5a1 that offer above-mentioned attraction adsorbing

mechanism

5a, 5a.

Above-mentioned pedestal 5d, the 5d that spreads all over electrostatic chuck with

absorption maintaining body

5c, 5c that accept, price fixing 1,2 and fixing

body

3,4 up and down up and down, connect to the Z direction with can move freely, by picker of a plurality of configurations etc., the position of not disturbing, again adsorb substrate and transport non-cemented surface, it is transplanted on as the electrostatic chuck of the substrate maintenance face of price fixing 1,2 up and down with upper and lower base plate A, the B of the adsorbed maintenance of robot (do not have diagram).

Have again, also can be as required, between the relative face and

pedestal

5d, 5d of price fixing 1,2 up and down, by for example height control apparatus 1d, the 2d of disk spring etc. are installed, the depth of parallelism to the relative face of these

pedestals

5d, 5d is finely tuned,

height control apparatus

1d, 2d can also be installed, connect

pedestal

5d, 5d and price fixing 1,2 up and down.

In addition, the maintaining body of two substrates A, B is not limited only to above-mentioned material, if low vacuum for example then also can replace the Electrostatic Absorption 5b of mechanism, 5b use with the vacuum suction mechanism that utilizes the vacuum difference.

Up between the circumference 4a of the circumference 3a of fixing body 3 and below fixing body 4, ring-type is provided with hydrodynamic reciprocating sealing mechanism 6, this hydrodynamic reciprocating sealing mechanism 6 surrounds two substrates A, B, keep these sealing states between the two, relatively support to XY θ direction with can move freely, by these

fixing bodies

3,4 near moving, up and down between the

fixing body

3,4, cut apart and form the enclosure space S1 that price fixing 1,2 is up and down surrounded.

Under the situation of illustrated example, because two substrates A, B are rectangles up and down,, but be not limited only to this so hydrodynamic reciprocating sealing mechanism 6 forms plane frame shape, for example,, be under the situation of circle at two substrates A, B as wafer, form similar shape along its periphery.

This hydrodynamic reciprocating sealing mechanism 6 is by the xsect rectangle that forms according to the flat shape of two substrates A, B up and down or the mobile block 6a of circle under the situation of present embodiment; To be installed in this move block 6a above the Z direction of the circumference 3a of the top fixing body 3 for example O shape ring that contacts, leave etc., annular seal parts 6b that can elastic deformation; Be permanently connected to the circumference 4a of the following below fixing body 4 that is installed in mobile block 6a, the vacuum seal 6c of the ring-type of for example O shape ring that can move to XY θ direction etc. constitutes.

Can use for example vacuum grease to this vacuum seal 6c as required, in illustrated example, from the lower inside of mobile block 6a, to the circumference 4a of whole below fixing body 4, one heavy vacuum seal 6c only is installed, but be not limited only to this, also can below the outside of no illustrated mobile block 6a, append vacuum seal 6c, carrying out two re-mounts, equally, for annular seal parts 6b, also can carry out two and re-mount inside and outside.

In addition, the any one party of the relative face of aforesaid substrate A, B, under the situation of present embodiment, surface periphery portion along downside substrate B, to spread upon in advance on the frame shape of sealing as the ring-type bonding agent C of sealing liquid crystal in advance, liquid crystal (not having diagram) is filled into its inside with encapsulant, simultaneously as required, scatter a plurality of gaps adjustment pad (not having diagram).

Like this, at the interval of keeping upper and lower base plate A, B, make upside substrate A not contact under the state of ring-type bonding agent C fully, carry out above-mentioned slightly involutoryly, thereafter, fall upside substrate A, with a part of part state of contact of the circumferencial direction at least of ring-type bonding agent C under, carry out above-mentioned little involutory.

Thick involutory and little involutory in order to carry out these, need have with respect to fixing

body

3,4 up and down, make any one party or two sides of price fixing 1,2 up and down, to the parallel mobile substrate of Z direction interval adjusting mechanism 7; Make hydrodynamic reciprocating sealing mechanism 6 and up and down any one party of

fixing body

3,4 to XY θ direction engaging, make it incorporate snap fastener 8; The horizontal mobile mechanism 9 that hydrodynamic reciprocating sealing mechanism 6 is moved to the adjustment of XY θ direction; Be accompanied by upwards price fixing 1 and down the adjustment of the relative XY θ direction of price fixing 2 move, can be to equidirectional position adjusting mechanism 10 mobile, that have big rigidity to vertical (Z) direction; In order to open and close enclosure space S1, and make

fixing body

3,4 up and down relatively to the elevating mechanism 11 of Z direction lifting; Make in the gas discrepancy enclosure space S1, reach the suction mechanism 12 of specified vacuum degree.

Aforesaid substrate interval adjusting mechanism 7 is under the situation of present embodiment, be towards can freely adjust the brace summer 1a of the last price fixing 1 that moves to the Z direction, on mobile block 6a along the circumferential direction with the driving body to the telescopic moving of Z direction a plurality of configurations uniformly-spaced, for example linear actuator etc., by elevating mechanism 11 described later, make near the interval of the two substrates A, the B that move is approaching more and move, order is carried out thick involutory and little involutory.

This substrate driving body of adjusting mechanism 7 at interval moves control by controller (not having diagram), setting two substrates A, time point before the B, consider substrate A, the changing factor of the thickness balance of B etc., by making each driving body elongation separately, to price fixing 1 up and down, 2 be set at parallel, under the state that is formed with enclosure space S1 thereafter, upside substrate A does not contact fully with ring-type bonding agent C or liquid crystal on the downside substrate B, but separates the gap about about 1mm-2mm, thereafter, by with two substrates A, thick involutory and little involutory interlock of B, order is under reach, makes two substrates A up and down, the interval stage of B is approaching, can fully guarantee two substrates A until reaching by measuring, the interval of the involutory precision in position of B, after enclosure space S1 returns atmospheric pressure, make its elongation, turn back to A-stage.

If its concrete example is set forth, then carry out thick involutory before, as its minimum value, preferably upside substrate A does not contact with ring-type bonding agent C, is to be close to about about 0.5mm, carry out little involutory before, as its minimum value, preferably make upside substrate A further approaching, even partly contact with a part of of circumferencial direction at least of ring-type bonding agent C, do not contact yet, be about about 0.1mm-0.2mm with downside substrate B.

In addition, though do not have diagram, also can with substrate at interval the driving body of adjusting mechanism 7 set towards the brace summer 1a of last price fixing 1 from the circumference 3a of top fixing body 3.

Above-mentioned snap fastener 8 is under the situation of present embodiment, constitute by recess 8a and protuberance 8b, this recess 8a and protuberance 8b respectively only the mobile block 6a that is formed at hydrodynamic reciprocating sealing mechanism 6 with above the Z direction of relative face of circumference 3a of fixing body 3 chimeric, in illustrated example, this recess 8a depression is arranged on above the mobile block 6a of hydrodynamic reciprocating sealing mechanism 6, protuberance 8b protrude the circumference 3a be arranged on top fixing body 3 below, the configuration of also these can being turned upside down.

Above-mentioned horizontal mobile mechanism 9 is under the situation of present embodiment, constitute by cam 9b and elastic body 9c, this cam 9b and the motor 9a that is equipped with at least more than 3 in the outside of enclosure space S1 are provided with continuously, elastic body 9c makes for example spring that this cam 9b and mobile block 6a often contact etc., according to the detecting device that constitutes by microscope and camera (do not have diagram) output at two substrates A, the data of the mark of the last demonstration of B, by making motor 9a action, to the top fixing body 3 that XY θ direction pushes mobile block 6a and engages with it, remain in the thick involutory and little involutory of upside substrate A on the price fixing 1.

In addition, horizontal mobile mechanism 9 is not limited only to the cam 9b that is provided with continuously with motor 9a, also can be other drive source of actuator etc. for example.

Above-mentioned position adjusting mechanism 10 is under the situation of present embodiment, be that a plurality of parts by the almost parallel that extends to the Z direction constitute, these a end is bonded with each other, simultaneously the other end is engaged with the mobile block 6a and the below fixing body 4 of hydrodynamic reciprocating sealing mechanism 6 respectively, only to XY θ direction, can free bending deformation ground support the part of a plurality of parts.

If illustrate in greater detail, then these a plurality of parts are by central module 10a, parts 10b, link 10c constitute on every side, this central module 10a towards the circumference 4a of below fixing body 4, has bigger rigidity to the Z direction that is the catenary joint below mobile block 6a; Should around parts 10b to engaging to surrounding around it, overhang the following XY θ direction bending deformation of the circumference 4a of below fixing body 4; This link 10c engage to support these central modules 10a and the bottom of parts 10b on every side.Unit with these after integrated, circumference 4a along below fixing body 4, by pressing each predetermined distance, to a plurality of configurations of circumferencial direction, owing to make the power of atmospheric pressure or this top fixing body 3 that acts on the fixing body 3 of top and the weight that goes up price fixing 1 etc., below mobile block 6a, spread all over each link 10c ... be distributed to and hang each the central module 10a that establishes ... on, so by each central module 10a ... the bigger rigidity to the Z direction that is had makes between the circumference 4a of the following of mobile block 6a and below fixing body 4 and remains on predetermined distance.

Particularly under the situation of illustrated example, central module 10a is formed to Z direction rigidity height, cylindric to big footpath that XY θ direction can not be out of shape, simultaneously with respect to below open the through hole 4b that wears on the circumference 4a of fixing body 4, it is run through movably to XY θ direction, around this central module 10a, dispose many, for example 4 by linkage assembly constitute can be around XY θ direction distortion parts 10b, simultaneously as the flexing parts 10d that on the bottom of these linkage assemblys and upper end, uses, use for example ball-joint etc., have, it is tabular that link 10c forms flat circle.

In addition, constitute the structure of a plurality of parts of above-mentioned position adjusting mechanism 10, be not limited only to illustrated object, can be to the parts 10b on every side of XY θ direction distortion, even other structure, also can obtain same effect, promptly replace above-mentioned linkage assembly, can elastic deformation or form, or the elasticity pole stock that is made of the post of many elastically deformables or cable etc. of configuration, or in contrast, making on every side, the rigidity of parts 10b improves to the Z direction, formation can not be to XY θ direction distortion, makes central module 10a to the distortion of XY θ direction etc. simultaneously.

Above-mentioned elevating mechanism 11 is under the situation of present embodiment, be from the periphery of above-mentioned stand 14 four angle parts of the circumference 3a of fixing body 3 upward, the for example lifting jack of fixed configurations or drive up and down with cylinder etc., make the circumference 3a of its leading section 11a with respect to top fixing body 3, can contact movably to XY θ direction, the mobile block 6a of simultaneously above-mentioned hydrodynamic reciprocating sealing mechanism 6 can insert logical pars intermedia 11b movably to XY θ direction.

The drive source of this elevating mechanism 11 is to move control by controller (do not have diagram), in the A-stage that substrate A, B are set, make top fixing body 3 rise to the standby of specified altitude position, after the setting of substrate A, B is finished, top fixing body 3 is descended, and below between the fixing body 4, cut apart and form enclosure space S1, make it to surround two substrates A, B, after little involutory the finishing of two substrates A, B, or after enclosure space S1 described later gets back to atmospheric pressure, make it to rise, return A-stage.

Above-mentioned suction mechanism 12 is ventilation path that the vacuum pump (not having diagram) that sets with outside at enclosure space S11 is connected, this vacuum pump is to move control by controller (do not have diagram), the approaching of price fixing 1,2 moves passing through up and down, after forming enclosure space S1, air-breathing from here on, under the situation of present embodiment, after substrate described later is pressed 13 actions of random structure, supply air to enclosure space S1, turn back to atmospheric pressure.

Under the situation of illustrated example, be that air entry 12a with above-mentioned ventilation path is opened in respectively in the relative face and the formed gap of

pedestal

5d, 5d of price fixing 1,2 up and down, prevent the harmful effect that the air in the enclosure space S1 only flows and produced to a direction from these air entries 12a, 12a, for example or the two substrates A, the B that are kept tilt, or being pre-filled in liquid crystal on the downside substrate B disperses etc.

It is under above-mentioned little state after involutory that aforesaid substrate is pressed random structure 13, forcibly the downward side group plate of upside substrate A B is pressed attached mechanism, this upside substrate A is kept on the electrostatic chuck of face at the substrate as price fixing on above-mentioned 1 by Electrostatic Absorption, as Fig. 1 (b), (c) shown in, in the roughly while that the Electrostatic Absorption to upside substrate A of carrying out according to the 5b of Electrostatic Absorption mechanism is disengaged, or following closely also remaining has under the state of Electrostatic Absorption power, in illustrated example, use and attract adsorbing mechanism 5a, the air hole 5a1 of 5a, 5a1, from the make progress rear side of side group plate A of electrostatic chuck, spray for example gas G of nitrogen or air etc., between the Electrostatic Absorption face 5b1 by this gas G force being injected top holding plate 1 and the back side of upside substrate A, destroy the tight contact condition of these Electrostatic Absorption face 5b1 and real estate, by both are peeled off, Electrostatic Absorption power is between the two eliminated in mandatory decay, pass through the pressure of the gas G that injected simultaneously, forcibly act on the falling force of downward side group plate B, the acceleration that promptly falls, in view of the above, fall about making this upside substrate A with the about 0.1mm-0.2mm of minimum, press the full week that is attached to the whole ring-type bonding agent C on the downside substrate B instantaneously.

In addition, for the injection of above-mentioned gas G,, need preestablish following operation condition at least according to test result in advance.

(1) removes from the Electrostatic Absorption to upside substrate A of being carried out, arrive the time delay of the injection action of gas G according to the 5b of Electrostatic Absorption mechanism.

(2) expulsion pressure of gas G.

(3) injecting time of gas G.

On the other hand, aforesaid substrate A, B are transported with mechanical arm (not having diagram) by substrate and keep, be shifted into price fixing 1 and following price fixing 2, hand to maintaining body 5 separately, particularly under the situation of upside substrate A, in order to make its face A2 and unlikely damage downwards, only keeping circumference to transport is general way.But, particularly surpass under the situation of large substrate A, B of 1000mm on a limit, above-mentionedly exist the middle body of the face A2 that makes upside substrate A sagging only to the maintenance of circumference, in handover, the middle body of face A2 is run into foreign matter and damaged possibility.

Therefore, under the situation of present embodiment, shown in two pecked lines of Fig. 2, transport by substrate and to use mechanical arm, a plurality of positions of non-cemented surface (the inside) A1 of the opposition side of the face A2 of absorption and upside substrate A, transfer for the middle body that does not make face A2 is sagging, while is towards the non-cemented surface A1 of this upside substrate A, make accepting of above-mentioned maintaining body 5 with absorption maintaining body 5c ... elongation downwards, transporting the position that the absorption position with mechanical arm does not disturb with substrate, again absorption is accepted, and its substrate that is transplanted on price fixing 1 is kept face.

Then, according to process sequence, illustrate according to such substrate that base plate bonding device carried out to overlap encapsulating method.

At first, transport by substrate and to use mechanical arm, two substrates A is up and down transferred in absorption, B, hand to the maintaining body 5 of price fixing 1 and the maintaining body 5 of following price fixing 2 respectively, under the situation of present embodiment, transport by substrate and to use mechanical arm, the non-cemented surface A1 of upside substrate A is transferred in absorption, simultaneously shown in two pecked lines of Fig. 2, by using absorption maintaining body 5c by accepting ... in the position of not disturbing with this absorption position, again absorption by the only absorption of this non-cemented surface A1, can be transported with mechanical arm from substrate and hand on the substrate maintenance face of price fixing 1, be accompanied by substrate A, the maximization of B, the middle body of upside substrate A can be not sagging.

Even consequently substrate A, B maximize, also can not can damage face A2, move into.

Like this, on the relative face of last price fixing 1 and following price fixing 2, as shown in Figure 2, if the pre-aligned upside substrate A of difference, be coated with bonding agent C in advance, be filled with the downside substrate B of liquid crystal, be set, then, immovably attract to keep two substrates A, B respectively by attracting

adsorbing mechanism

5a, 5a and the 5b of Electrostatic Absorption mechanism, 5b.

Thereafter, as shown in Figure 3, action by elevating mechanism 11, top fixing body 3 is descended, approaching with below fixing body 4, the snap fastener 8 that forms respectively on the relative face of the mobile block 6a of the circumference 3a of fixing body 3 and hydrodynamic reciprocating sealing mechanism 6 is only chimeric in the Z direction up, make the two integrated to XY θ direction, simultaneously with mobile block 6a on annular seal material 6b closely contact, up and down between the fixing

body

3,4, divide and form enclosure space S1, price fixing 1 and following price fixing 2 and two substrates A, B in the encirclement.

Meanwhile, two substrates A, B move by the approaching of last price fixing 1 and following price fixing 2, approach to predetermined distance, by substrate interval adjusting mechanism 7, keep the gap about about 1mm-2mm and stand facing each other, upside substrate A does not touch the ring-type bonding agent C that spreads upon on the downside substrate B, and these two substrates A is communicated with enclosure space S1 between the B.

, by the action of suction mechanism 12, from enclosure space S1 extracting air, reach specified vacuum degree,, make it to become vacuum simultaneously also from extracting air between two substrates A, the B thereafter.

In view of the above, atmospheric pressure acts on and surrounds the fixing body up and down 3,4 of going up price fixing 1 and following price fixing 2, owing to, exist to make these possibility of fixing

body

3,4 distortion up and down, and atmospheric pressure does not act on the interior last price fixing 1 of enclosure space S1 fully with the pressure differential of the enclosure space S1 of vacuum.

Its result is, and is additional by appending, and can prevent the diagonal distortion of the last price fixing 1 that causes because of atmospheric pressure.

In addition, under the situation of present embodiment, even the thickness of the degree that also can not be out of shape for the atmospheric pressure effect of wall thickness dimension by making below fixing body 4 can make down the price fixing 2 under atmospheric pressure can diagonal distortion.

Under the situation of illustrated example, there is following advantage, promptly, even because of atmospheric pressure, top fixing body 3 diagonal distortion in enclosure space S1, also since above last price fixing 1 whole only can be to the elasticity communication component 1c of Z direction elastic deformation, and make the diagonal distortion of top fixing body 3 can not have influence on price fixing 1 fully, and, can be to XY θ direction lateral excursion yet.

So, under this vacuum state, as shown in Figure 3, by the substrate action of adjusting mechanism 7 at interval, last price fixing 1 downward price fixing 2 descends, make two substrates A up and down, after the interval of B is close to about minimum about 0.5mm, if action by horizontal adjusting mechanism 9, promote the mobile block 6a of hydrodynamic reciprocating sealing mechanism 6 to XY θ direction, then by this mobile block 6a and snap fastener 8 and incorporate top fixing body 3 moves to XY θ direction with respect to below fixing body 4, in view of the above, last price fixing 1 relatively moves to the adjustment of XY θ direction with following price fixing 2, carries out two substrates A, slightly involutory between the B.

Its result is, need not to use XY θ platform, and two substrates A, B in the vacuum are moved from the outside XY θ that carries out of enclosure space S1 smooth-goingly, carries out high-precision slightly involutory.

Meanwhile, if to XY θ direction, promote above-mentioned mobile block 6a, then because the parts 10b bending deformation on every side of position adjusting mechanism 10, central module 10a and mobile block 6a are parallel to be moved and make, the bigger rigidity that is had by this central module 10a to vertical direction, since resistant function on top fixing body 3 atmospheric pressure or this top fixing body 3 and on the weight etc. of price fixing 1, one side keeps the predetermined distance between the circumference 4a of the following of mobile block 6a and below fixing body 4, so reduced the suffered sliding resistance of vacuum seal 6c of hydrodynamic reciprocating sealing mechanism 6.

Its result is that the position between two substrates A, the B is involutory can carry out smooth-goingly.

Then, shown in Fig. 1 (a) and (b), by the substrate action of adjusting mechanism 7 at interval, last price fixing 1 downward price fixing 2 descends, after the interval of two substrates A, B further is close to about minimum about 0.1mm-0.2mm about making, price fixing 1 and following price fixing 2 are relatively moved to the adjustment of XY θ direction, carry out little involutory between two substrates A, the B.

After this little involutory finishing, remove the Electrostatic Absorption to upside substrate A of carrying out according to the 5b of Electrostatic Absorption mechanism comprehensively, press random structure 13 by substrate simultaneously, from a plurality of air hole 5a1,5a1 begins, equably will be for example the gas G of nitrogen etc. be ejected into non-cemented surface (back side) A1 all of upside substrate A, between the Electrostatic Absorption face 5b1 by this gas G force being injected top holding plate 1 and the back side of upside substrate A, destroy the tight contact condition of these Electrostatic Absorption face 5b1 and real estate, by both are peeled off, decay forcibly, eliminate Electrostatic Absorption power between the two, pass through the pressure of the gas G that injected simultaneously, the falling force of the downward side group plate of positive action B, the acceleration that promptly falls, in view of the above, shown in Fig. 1 (c), this upside substrate A presses the whole full week of the ring-type bonding agent C on the attached sealing downside substrate B instantaneously, positively forms seal cavity S2.

Its result is, even the power supply of the shielding Electrostatic Absorption 5b of mechanism, the substrate absorption affinity is disappeared immediately but the continuation effect can not be subjected to this substrate absorption affinity yet and remove unsettled influence, upside substrate A is being fallen under the involutory state in XY θ direction position.

In view of the above, there is following advantage, that is, can prevents the involutory error in position between two substrates A, the B, can form seal cavity S2 effectively simultaneously, can prevent sneaking into of air.

Have again, the maintenance according to the 5b of Electrostatic Absorption mechanism to upside substrate A be disengaged roughly simultaneously or following closely, begin to spray under the situation of gas G from the rear side of upside substrate A, before the releasing instability generation of Electrostatic Absorption power, because the pressure of gas G is forcibly peeled off upside substrate A from the Electrostatic Absorption face 5b1 of top holding plate 1.

Its result is, has following advantage,, can prevent the offset because of the unstable upside substrate A that produces of releasing of Electrostatic Absorption power fully that is.

In addition, at this moment, under the situation of the formation that can adjust spray volume, spouting velocity and the ejection position of gas G with respect to upside substrate A, if test result according to mandatory whereabouts, adjustment then can be controlled the posture of the upside substrate A that forces to fall with respect to spray volume, spouting velocity and the ejection position of the gas G of upside substrate A.

Its result is, has following advantage, that is, even up and down the Electrostatic Absorption face 5b1 of holding

plate

1,2 or up and down two substrates A, B be not fully parallel, also can make upside substrate A and downside substrate B overlapping abreast.

Like this, the pressure of two substrates A, B is attached finish after, by the action of suction mechanism 12, air or nitrogen are injected in the enclosure space S1, make its environment turn back to atmospheric pressure.

In view of the above, break draught head equably, be sealed with under the state of liquid crystal, form predetermined gap in the inside and outside generation of two substrates A, B.

After this, if turn back to atmospheric pressure in the enclosure space S1, then pass through the action of elevating mechanism 11, top fixing body 3 and last price fixing 1 are separated with below fixing body 4 and following price fixing 2, open enclosure space S1, two substrates A, B behind the location are transported with mechanical arm taking-up, above-mentioned repeatedly action by substrate.

In addition, among the embodiment in the above, the behind of price fixing on holding plate above the conduct 1 is provided with top fixing body 3, the behind of the following price fixing of holding plate 2 below conduct to the Z direction with can move freely, fixing integratedly below fixing body 4, but be not limited only to this, though there is not diagram, by will be as the following price fixing and below fixing body 4 configured separate of below holding plate 2, even below fixing body 4 is owing to atmospheric pressure is out of shape, can not have influence on down price fixing 2 yet.

In this case, also the article identical with elastomeric element 1c can be configured in down between price fixing and the below fixing body 4, both are connected, this elastomeric element 1c is between fixing body 3 and last price fixing 1 up top, only can be to for example spring of the Z direction elastic deformation that is provided with as required and continuously etc.

The possibility of utilizing on the industry

As mentioned above, relevant method for sealing substrates while stacking of the present invention can utilize and make liquid crystal Show on the industry of flat-panel monitor of device (LCD) or plasma display (PDP) etc.

Claims

1. a substrate overlaps encapsulating method, be upside substrate (A) to be remained on the top holding plate (1) by Electrostatic Absorption mechanism (5b) detachable ground, detachable ground remains on the downside substrate (B) relative with this upside substrate (A) on the below holding plate (2), carry out these upper and lower base plates (A, B) position each other is involutory, when becoming desired vacuum tightness around it, the maintenance that releasing is carried out according to Electrostatic Absorption mechanism (5b) to upside substrate (A), upside substrate (A) is overlapped on downside substrate (B), seal, it is characterized in that

Remove interlock with the maintenance of carrying out according to above-mentioned Electrostatic Absorption mechanism (5b) to upside substrate (A), make the rear side ejection of gas (G) from this upside substrate (A), pressure by this gas (G) is forcibly peeled off upside substrate (A) from the Electrostatic Absorption face (5b1) of top holding plate (1), the crimping sealing is gone up on instantaneous ground side group plate (B) downwards, overlaps.

2. substrate as claimed in claim 1 overlaps encapsulating method, it is characterized in that, roughly simultaneously or following closely also remaining that is disengaged in the maintenance of carrying out according to above-mentioned Electrostatic Absorption mechanism (5b) to upside substrate (A) has under the state of Electrostatic Absorption power, begins to carry out from the ejection of the gas (G) of the rear side of upside substrate (A).

3. substrate as claimed in claim 1 or 2 overlaps encapsulating method, it is characterized in that, can adjust spray volume, spouting velocity and the ejection position of gas (G) with respect to above-mentioned upside substrate (A).