WO2008041294A1

WO2008041294A1 - Chuck device for substrate bonding machine and method of neutralizing charges on substrate

Info

Publication number: WO2008041294A1
Application number: PCT/JP2006/319541
Authority: WO
Inventors: Yoshikazu Ohtani
Original assignee: Shin-Etsu Engineering Co., Ltd.
Priority date: 2006-09-29
Filing date: 2006-09-29
Publication date: 2008-04-10

Abstract

An electrostatic chuck is replaceably installed on the substrate-side surface of a holding plate without any modification on the surface. Electrostatic chucks (2) formed in a thin plate-like shape or a membrane-like shape are respectively detachably attracted to the substrate-side surfaces (la, la') of the holding plates (1, 1'). Because the substrate-side surfaces (la, la') of the holding plates (1, 1') are formed integrally with the thin sheet-like or membrane-like electrostatic chucks (2), the substrates (A, B) are detachably held by electrostatic attracting force of the thin sheet-like or membrane-like electrostatic chucks (2), and the thin sheet-like electrostatic chucks (2) can be easily detached from the substrate-side surfaces (la, la') of the holding plates (1, 1').

Description

Substrate bonding machine chuck device and substrate neutralizing method

Technical field

[0001] The present invention relates to a process for manufacturing a flat panel display such as a liquid crystal display (LCD) or a plasma display (PDP), for example, when a substrate such as CF glass or TFT glass is detachably held and bonded. TECHNICAL FIELD The present invention relates to a chuck device for a substrate bonding machine used for the above, and a substrate static elimination method using the chuck device.

Specifically, the present invention relates to a chuck device for a substrate bonding machine that electrostatically attracts a substrate to a substrate side of a holding plate and detachably holds the substrate, and a substrate discharging method using the same.

Background art

Conventionally, as a chuck device for this type of substrate bonding machine, a dielectric and an electrode unit are laminated on the entire opposing surfaces of a pair of upper and lower holding plates (surface plate) made of a rigid body such as metal or ceramics. Each of the electrostatic chucks is provided, and suction suction means for assisting suction holding in the atmosphere are additionally provided, and both the substrates are sucked and held by the electrostatic chuck and suction suction means. In some cases, mutual alignment is performed to bond the force substrates together (see, for example, Patent Document 1).

In addition, electrostatic chucks (electrostatic chucks) are respectively attached to the entire opposing surfaces of a pair of upper and lower holding plates (back holding plates), and suction suction means (suction conduits) are formed, respectively. When peeling the substrate from the electric chuck holder, the application of voltage is stopped and the conductive material connected to the end face of the electrostatic chuck or the conductive material in contact with the substrate provided on the adsorption surface of the electrostatic chuck section Is connected to the frame ground to release the charges accumulated on the dielectric layer of the electrostatic chuck and the substrate during electrostatic adsorption to the frame ground, thereby facilitating peeling of the substrate or switching instead of the frame ground. Connected to the power supply, the current flows to cancel the charge accumulated on the dielectric layer and the substrate, or the conductive pin that contacts the back surface of the substrate and the contact pin force that contacts the surface of the substrate Charge accumulated on both sides of the substrate By canceling the separation of the substrate to facilitate some are to prevent separation charge (for example, see Patent Document 2). [0003] Patent Document 1: Japanese Patent Application Laid-Open No. 2003-324144 (Page 3-5, Fig. 1-2)

Patent Document 2: Japanese Patent Laid-Open No. 2002-229044 (Pages 10-12, FIGS. 7, 9)

Disclosure of the invention

Problems to be solved by the invention

[0004] In a production line of a liquid crystal display using such a chuck for a substrate bonding machine, glass cullet (shards) may be transported on the glass substrate, especially during setup. If the cullet is squeezed between the electrostatic chuck and the electrostatic chuck, the surface of the electrostatic chuck may be partially broken and broken.

If even a part of the surface of the electrostatic chuck breaks, the function of the entire electrostatic chuck stops and the electrode part where high voltage is applied is exposed, so it is used in a state close to a vacuum, especially in a vacuum laminating machine. In such a case, there is a possibility that a fault causing an overcurrent may occur, such as an arc discharge between the ground portion of the metal pedestal and a plasma discharge in the Paschen area during vacuuming.

In order to prevent this, it is necessary to replace the electrostatic chuck itself whose surface has been destroyed. However, in the conventional chuck device for a substrate bonding machine, the electrostatic chuck is fixedly arranged on the entire surface of the holding plate, so that the replacement work at the installation site is difficult and only requires time. Since the operation of the entire line cannot be resumed until this replacement work is completed, there was a problem that the operation rate decreased.

In the case of Patent Document 2, when the substrate is peeled off from the electrostatic chuck, it is easy to remove the residual charge of the substrate to make it easy to peel off. At that moment, the surface of the substrate is peeled and charged according to the difference in the charge train between the surface material of the electrostatic chuck and the material of the substrate is accumulated on the surface of the substrate. When the separation distance is long, there is a problem in that a discharge occurs to destroy a device such as a TFT element formed on the substrate.

[0005] Of the present invention, the invention described in claim 1 is intended to attach the electrostatic chuck in a replaceable manner without any modification to the substrate side surface of the holding plate.

In addition to the object of the invention described in claim 1, the invention described in claim 2 neutralizes the peeling charge generated on the substrate due to peeling from the electrostatic chuck from a position away from the electrostatic chuck. It is for the purpose.

In addition to the object of the invention described in claim 1 or 2, the invention described in claim 3 is characterized in that after the substrate is peeled from the electrostatic chuck, the peeling charge generated on the substrate due to the peeling is removed from the electrostatic chip. The purpose is to remove static from a position away from the backpack.

Means for solving the problem

In order to achieve the above-described object, the invention according to claim 1 of the present invention is configured such that an electrostatic chuck formed in a thin plate shape or a film shape is detachably attached to the substrate side surface of the holding plate. The substrate is detachably held on the substrate side surface of the holding plate by the electrostatic attraction force of the thin plate-like or film-like electrostatic chuck.

The invention according to claim 2 is provided with separation means for separating the substrate from the electrostatic chuck and forming a static elimination gap between the electrostatic chuck and the substrate in the configuration of the invention according to claim 1. At the same time, the separation means creates a gap for static elimination between the surface of the electrostatic chuck and the substrate, and changes the voltage of the electrode portion of the electrostatic chuck, thereby neutralizing the charge remaining on the substrate. It is characterized by the addition of a configuration that induces a summing electric field.

The invention described in claim 3 is the atmosphere after the substrate is peeled off from the electrostatic chuck of the substrate bonding machine chuck device of the substrate bonding machine according to claim 1, or in a predetermined low vacuum. The voltage of the electrode part of the electrostatic chuck is varied to induce an electric field, and the charge remaining on the substrate is neutralized.

The invention's effect

[0007] The invention according to claim 1 of the present invention is such that the electrostatic chuck formed in a thin plate shape or a film shape is detachably bonded to the substrate side surface of the holding plate to thereby attach the substrate side surface of the holding plate. Are integrated with the thin plate or film electrostatic chuck, and the substrate is detachably held by the electrostatic chucking force of the thin plate or film electrostatic chuck, and the substrate side surface force of the holding plate is A thin plate-like or film-like electrostatic chuck can be easily removed.

Therefore, it is possible to replace the electrostatic chuck with no change to the substrate side surface of the holding plate.

As a result, the surface of the electrostatic chuck partially breaks down due to the penetration of foreign matter compared to the conventional case where the electrostatic chuck is fixedly arranged on the entire surface of the holding plate. However, since the holding plate and the thin or film-like electrostatic chuck are separate parts, the electrostatic chuck can be easily exchanged for the holding plate even at the installation site. When is used in a production line such as a liquid crystal display, the operation of the entire line can be resumed in a short time, so the operation rate does not decrease and a stable production volume can be expected.

Furthermore, the holding plate of the substrate laminating machine that holds the substrate by suction and suction means excluding the electrostatic chuck can be used as it is to provide an electrostatic chuck function. The adsorption performance can be improved.

[0008] In addition to the effect of the invention of claim 1, the invention of claim 2 forms a gap for static elimination between the surface of the electrostatic chuck and the substrate by the separating means, and the electrode of the electrostatic chuck By inducing an electric field by varying the voltage of the part, a part of the atmospheric gas such as air is instantaneously ionized and ionized in this electric field part, and these neutralize the charge remaining on the substrate B.

Accordingly, it is possible to neutralize the separation charge generated on the substrate due to the separation from the electrostatic chuck and away from the electrostatic chuck.

As a result, when the substrate is peeled from the electrostatic chuck, discharge is generated over the separation distance between the surface of the electrostatic chuck and the substrate due to the peeling charge, compared to the conventional one in which the residual charge on the substrate is removed to facilitate peeling. Without being formed on the substrate! For example, devices such as TFT elements can be prevented from being destroyed.

Furthermore, even the holding plate of a substrate bonding machine that holds and holds substrates by suction suction means other than electrostatic chucks can be provided with a static elimination function to prevent destruction of devices on the substrate due to peeling charging. It becomes possible.

[0009] In addition to the effect of the invention of claim 1, the invention of claim 3 fluctuates the voltage of the electrode portion of the electrostatic chuck in the atmosphere where the substrate is separated from the electrostatic chuck or in a predetermined low vacuum. Then, by inducing an electric field, a part of atmospheric gas such as air is instantaneously ionized and ionized in this electric field portion, and these neutralize charges remaining on the substrate.

Therefore, after the substrate is peeled from the electrostatic chuck, the peeling charge generated on the substrate along with the peeling can be neutralized by the position force away from the electrostatic chuck.

As a result, when the substrate is peeled from the electrostatic chuck, the residual charge on the substrate is removed to remove it. Compared to the conventional static elimination method that makes it easier to discharge, discharge does not occur across the peeling distance between the surface of the electrostatic chuck and the substrate due to peeling charging, and devices such as TFT elements formed on the substrate are destroyed. Can be prevented.

BEST MODE FOR CARRYING OUT THE INVENTION

[0010] A substrate bonding machine in which a chuck device for a substrate bonding machine of the present invention holds a glass substrate used for a liquid crystal display (LCD), a plasma display (PDP) or a flexible display panel in a detachable manner. The case where it is deployed is shown.

[0011] This substrate bonding machine is a fixed plate formed in a flat plate shape that does not deform (stagnate) with a rigid body such as metal or ceramics as shown in Figs. 1 (a) to 1 (c). A pair of upper and lower holding plates 1, 1 ′, which is a board force, is arranged, and the two substrates A and B are detachably held on the parallel opposing surfaces of these upper and lower holding plates 1, 1 ′. After the vacuum chamber S formed in the surrounding area reaches a predetermined degree of vacuum, the upper and lower holding plates 1, \ 'are relatively adjusted and moved in the ΧΥ Θ direction (horizontal direction in the drawing) to obtain substrates A and B. After aligning each other, at least one of the substrates A and B is peeled off and overlapped by the smooth surface force of the upper and lower holding plates 1, \ ', and then the vacuum break in the vacuum chamber S is performed. The pressure difference between the substrates A and B is pressurized to a predetermined gap by the pressure difference generated between the substrates A and B.

More specifically, the upper and lower holding plates 1, \ 'as shown by the solid line in FIG. 1 (a) can be moved relatively in the Z direction (vertical direction in the drawing) by lifting means (not shown). In an atmosphere of atmospheric pressure, the substrates A and B transferred by a transfer robot (not shown) are set on the respective smooth surfaces with the upper and lower holding plates 1 being separated in the vertical direction. Each is retained.

[0013] Thereafter, the upper and lower holding plates 1 and 1 'are moved closer to each other by the operation of the elevating means as shown by the two-dot chain line in Fig. 1 (a), and the vacuum chamber S is defined between them.

Subsequently, when the air is exhausted from the vacuum chamber S by the operation of the suction means (not shown) and a predetermined degree of vacuum is reached, the horizontal holding means (not shown) is operated to operate the upper and lower holding plates 1. , 1 'can be adjusted and moved in the XY 0 direction with respect to the other. Rough alignment and fine alignment are sequentially performed as alignment between the held substrates A and B.

[0014] After these alignments are completed, either one of the substrates A and B held on the upper and lower holding plates 1, 1 'as shown in Fig. 1 (b) is moved toward the other, An annular adhesive (sealant) C on the lower substrate B is sandwiched between the two by applying pressure instantaneously with the C sandwiched between them.

[0015] After that, as shown in Fig. 1 (c), the upper and lower holding plates 1, \ 'are moved away from each other by the operation of the elevating means, and the intake means is operated in reverse at substantially the same time. Alternatively, air or nitrogen is supplied into the vacuum chamber S by another mechanism, and the atmosphere in the vacuum chamber S is returned to atmospheric pressure. Then, the liquid crystal is squeezed to a predetermined gap to complete the bonding process.

[0016] Then, either one or both of the above-described substrate-side surfaces la and la 'of the upper and lower holding plates 1, 1' that are parallel to each other is used as a chuck device for a substrate bonding machine according to the present invention. The electrostatic chuck 2 formed in the shape of a thin film or thin film is detachably adhered, and one or both of the upper and lower substrates A and B are electrostatically attracted by the electrostatic adsorption force of the thin plate or film-like electrostatic chuck 2 Then, the alignment operation of the substrates A and B described above is performed, and the bonding operation of the substrates A and B described above is performed by stopping and peeling off the electrostatic chucking function of one of the electrostatic chucks 2. Is done.

[0017] The electrostatic chuck 2 is a dielectric 2a formed in a smooth thin plate or thin film with an insulating organic material such as polyimide, polyetheretherketone (PEEK), or polyethylene naphthalate (PEN). In addition, an electrode portion 2b that also becomes a conductive paste or a conductive foil cover patterned by screen printing or the like is integrally laminated therein.

[0018] The electrode portion 2b is formed to be insulated from the surroundings, and is connected to a power source (not shown) for applying a voltage thereto.

As a specific example, it is preferable to use a bipolar electrostatic chuck in which two or more electrode portions 2b are embedded in, for example, a comb shape.

[0019] As an adhering means between the electrostatic chuck 2 and one or both of the substrate-side surfaces la and la 'of the upper and lower holding plates 1, 1' described above, although not shown, an adhesive material is a magnet or a mechanical material. Wonta Attach it so that it cannot be misaligned using a coupling mechanism.

Furthermore, the outer peripheral edge of the electrostatic chuck 2 or a mounting portion formed continuously therewith can be formed larger than the substrate side surface la, la 'and can be bent and attached to the side surface. is there.

[0020] At least the lower holding plate! / And the lower electrostatic chuck ^, a plurality of through-holes 3 as shown in FIGS. 2 (a) and 2 (b) are formed in a straight line in the Z (vertical) direction. As the separating means 4 for separating the upper and lower substrates A and B, which have been bonded together, from the surface of the electrostatic chuck 2, the lift pins whose tip portions are formed of an insulating material are moved in the Z (vertical) direction. The lower substrate B is pushed up by lowering the surface force of the lower electrostatic chuck 2 by controlling the operation so that the gas or other fluid such as nitrogen gas or air is jetted upward. A slight clearance S1 of about 2 to 3 mm, for example, is formed between the back surface B1 of B.

[0021] The lower electrostatic chuck is formed in the atmosphere or in a predetermined low vacuum in which a gap S1 is formed between the surface of the lower electrostatic chuck 2 and the rear surface B1 of the lower substrate B by the separating means 4. A high voltage is applied between two or more electrode parts 2b embedded in 2 from a high voltage power source (not shown), and is applied during electrostatic chucking of the lower substrate B. By changing the voltage of these two or more electrode portions 2b by repeatedly reversing the polarity of the substrate, an electric field that neutralizes the charge remaining on the lower substrate B is induced! / ヽThe

Hereinafter, an embodiment of the present invention will be described with reference to the drawings.

Example 1

[0022] This Example 1 is a thin plate on the substrate-side surfaces la and la 'of the upper and lower holding plates 1, 1' as shown in Figs. 1 (&) to (ji) and Fig. 2 (&) (b). Alternatively, the thin-film electrostatic chuck 2 is detachably bonded to each other, and both the upper and lower substrates A and B are electrostatically attracted by the electrostatic adsorption force of the thin plate-like or film-like electrostatic chuck 2, as described above. The alignment operation and the bonding operation are performed in a vacuum, and the upper and lower substrates A and B, which have been bonded, are pushed up by the surface force of the lower electrostatic chuck 2 and between the lower surface B1 of the lower substrate B. Fig. 9 shows a case where the static electricity is removed by forming a slight static elimination gap S1 of about 2 to 3 mm, for example.

[0023] On the smooth surfaces of the upper and lower holding plates 1, which face each other in parallel, a pedestal (base) having a rigid body force is provided. It is preferable that the electrostatic chuck 2 is attached by an adhesive means, with lb, 1W protruding and having a smooth base surface at the tip surface as the substrate side surface la, la ′.

[0024] At least a base lb 'of the lower holding plate 1' is opened with a plurality of through holes 3 in which the separating means 4 is provided.

Further, as necessary, a plurality of suction holes 5a are provided at appropriate intervals on the bases lb, 11 of the upper and lower holding plates 1, as suction suction means 5 for sucking and holding in the atmosphere. Is connected to a suction source (not shown) such as a vacuum pump.

[0025] When the plurality of suction holes 5a are formed in the substrate-side surfaces la and la 'at appropriate intervals as described above, the electrostatic chuck 2 is also opposed to each suction hole 5a and the through-holes 2c. Open the doors to communicate with each other.

In the illustrated example, a thin plate or thin film electrostatic chuck 2 is supported on a base lb of the upper holding plate 1 by a guide means (not shown) so as to be reciprocally movable in the vertical direction. The upper electrostatic chuck 2 is drawn toward the smooth substrate side surface la of the pedestal lb to attach it detachably, and the isolation means for separating the electrostatic chuck 2 from the substrate side surface la. Means 7 are provided.

[0027] The adhering means 6 includes, for example, a magnet 6a such as a permanent magnet or an electromagnet, and a magnetic field between the surface la on the substrate side of the upper holding plate 1 and the surface of the upper electrostatic chuck 2 facing the upper surface la. A magnet attracted by the magnet and a magnetic body 6b such as a metal formed into a film by sputtering or the like are fixedly arranged.

[0028] The separating means 7 is directed toward the surface of the upper electrostatic chuck 2 from the suction hole 5a of the suction suction means 5 provided on the substrate side surface la of the upper holding plate 1, for example, nitrogen gas or air. A force that injects gas or other fluid and presses the electrostatic chuck 2, or the electrostatic chuck 2 is pressed by a driving body that reciprocates up and down, such as an air cylinder, By converting one of the magnetic poles of the magnets 6a and 6b provided and repelling them by making the magnetic poles of the opposing magnets 6a and 6b the same, the upper electrostatic chuck 2 is parallel from the smooth substrate side surface la. To leave.

Next, the operation of such a chuck device for a substrate bonding machine will be described. First, in the atmospheric pressure state shown by the solid line in FIG. 1 (a), the electrostatic chuck in the form of a thin plate or thin film toward the substrate side surface la of the upper holding plate 1 by the operation of the suction adsorption means 5 or the adhesion means 6 2 and pulling the upper and lower substrates A and B transferred by the transfer robot in this state along the smooth substrate side surface la, and the upper electrostatic chuck attached to the upper holding surface la. 2 and the lower electrostatic chuck 2 mounted on the substrate-side surface 1 of the lower holding plate, respectively, are electrostatically attracted and held.

[0030] When the upper and lower substrates A and B are transferred by the transfer robot and transferred to the upper and lower electrostatic chucks 2 and set, there is a possibility that glass cullet (fragment) or the like enters.

In this case, the surface of the electrostatic chuck 2 such as the dielectric 2a is formed by sandwiching the cullet between the electrostatic chucks 2 and 2 along with the electrostatic adsorption between the upper and lower substrates A and B. May break down and break down.

[0031] Even in such a case, since the electrostatic chuck 2 having a thin plate shape or a thin film shape is detachably provided on the substrate side surfaces la, W of the upper and lower holding plates 1, 1 ', these electrostatic chucks 2 Can be easily replaced.

Thereafter, the upper and lower holding plates 1, 1 ′ are moved closer to each other by the operation of the elevating means as shown by a two-dot chain line in FIG. 1 (a) to form a vacuum chamber S, and the inside of the vacuum chamber S is predetermined. After reaching the vacuum degree, the upper and lower holding plates 1, \ 'are adjusted and moved relative to each other in the ΘΘ direction, and the upper and lower substrates A and B are aligned.

[0033] After the alignment operation is completed, the electrostatic chuck 2 above the substrate-side surface la of the upper holding plate 1 is moved upward by the operation of the separating means 7 as shown in FIG. The substrate A is pulled away while being electrostatically attracted, and the upper substrate A is moved toward the lower substrate B.

As a result, the upper and lower substrates A and B are instantaneously pressed with the annular adhesive C interposed therebetween, and the two are sealed and overlapped.

[0034] In this superposition process, gas and fluid can be completely prevented from entering between the upper and lower substrates A and B, and the upper substrate A having extremely low rigidity is formed into a thin plate or Since the thin-film electrostatic chuck 2 serves as a cushioning material, even if slight pressure non-uniformity is applied to the annular adhesive C, the annular adhesive C formed between the upper and lower substrates A and B There is an advantage that it is difficult to affect a spacer (not shown). [0035] Immediately after the movement of the upper substrate A is completed, the power supply of the upper electrostatic chuck 2 is turned off, and the electrostatic adsorption function is stopped.

After that, the inside of the vacuum chamber S is returned to the atmospheric pressure, and the pressure is evenly applied by the pressure difference generated inside and outside of both the substrates A and B. The pressure difference generated inside and outside the both substrates A and B reaches the predetermined gap. The bonding process is completed by crushing.

Subsequently, from the upper substrate A bonded to the lower substrate B via the annular adhesive C as shown in FIG. 1 (c), the suction adsorbing means 5 and the adhering means 6 are operated to move upward. The electrostatic chuck 2 is pulled toward the substrate-side surface la of the upper holding plate 1 to start peeling of both.

[0037] At this time, the residual suction force of the upper electrostatic chuck 2 is extremely reduced by passing through the Paschen discharge region where the degree of vacuum in the vacuum chamber S is about several tens of Pa to several thousand Pa. . However, the upper substrate A held by the adhesive force of the annular adhesive C and the upper electrostatic chuck 2 may come in contact with each other, and may be difficult to peel off.

[0038] Therefore, as described above, it is not the case that the entire surface of the upper electrostatic chuck 2 is separated from the surface of the upper substrate A at the same time. If it is deformed and a gap for peeling is partially formed between the outer peripheral edge of the upper substrate A, the peeling force is applied to the electrostatic chucking portion 2a of the electrostatic chuck 2 and the surface of the upper substrate A. The gap widens at once, and the residual adsorption force is forcibly attenuated and disappears. Therefore, the entire force of the electrostatic adsorption surface of the upper electrostatic chuck 2 is smoothly peeled off from the surface of the substrate A.

[0039] Further, the upper electrostatic chuck 2 from which the surface force of the upper substrate A is peeled adheres to the upper base surface la, and thereafter, the upper and lower holding plates 1, 1 'are separated from each other by the operation of the lifting means. Move in the direction to return to the initial state.

[0040] The upper and lower substrates A and B that have completed this bonding process are detached from the lower electrostatic chuck 2 and carried out, but along with this separation, the upper and lower substrates A and B are charged with static electricity (charge). Will remain.

More specifically, at the moment when the lower electrostatic chuck 2 is peeled off from the state where the lower substrate B made of glass is attached, the surface material of the electrostatic chuck 2 is applied to the rear surface B1 of the lower substrate B. The charge corresponding to the difference in the charge train between the material of the lower substrate B and the lower substrate B is caused by the peeling charge S that accumulates on the back surface B1 of the lower substrate B. At this time, if the peeling distance between the surface of the lower electrostatic chuck 2 and the back surface Bl of the lower substrate B is short, the metal base lb that supports the lower electrostatic chuck 2 because the charging voltage is low lb It is difficult for electric discharge to occur between the conductive materials such as, but if this separation distance increases, the voltage becomes very high, and electric discharge occurs between the conductive materials such as the metal base lb.

[0042] This static electricity (charge) varies depending on the size and processing conditions of the lower substrate B. The voltage may be 20 KV or more as a ground voltage, and when this accumulated charge is discharged, the substrates A and B Devices such as TFT elements formed above may be destroyed, and the device characteristics may change partially even without destruction.

Therefore, static elimination is performed as follows.

Specifically, the upper and lower substrates A and B that have completed the bonding process are opened on the substrate-side surface 1 of the lower holding plate and the lower electrostatic chuck 2 as shown in FIGS. 2 (a) and 2 (b). The upper and lower substrates that have been bonded together by raising the lift pin from the plurality of perforated holes 3 as the separating means 4 or by jetting a gas or other fluid such as nitrogen gas or air upward, for example. The surface force of the lower electrostatic chuck 2 is also pushed up by A and B, and a slight clearance S1 of about 2 to 3 mm, for example, is formed between the lower substrate B and the back surface B1.

[0044] The surroundings of the upper and lower substrates A and B, which have been bonded together in such a situation, are in the atmosphere or a low vacuum close thereto, and are embedded in the lower electrostatic chuck ^ in this atmosphere. A high voltage is applied to the two or more electrode portions 2b.

That is, by applying a positive charge and a negative charge side by side as a pair and changing the voltage of the electrode portion 2b, an electric field (specifically an alternating electric field) is induced in the vicinity thereof.

[0045] By this induced alternating electric field, a part of the atmospheric gas such as air is instantaneously ionized and ionized in that portion, that is, neutral molecules are separated into positive and negative charges. It acts to neutralize the charge remaining on the back surface B1 of the substrate B.

[0046] According to the experiment, the gap between the surface of the lower bipolar electrostatic chuck 2 and the lower surface B1 of the lower substrate B with the lift pin of the separating means 4 is about 2 mm, the applied voltage is ± 2500 V, and When the polarity was changed, the withstand voltage of the lower board B decreased to about 1/3, and it decreased to about 1/3 each time it was performed again.

By repeating this multiple times, the charging voltage can be drastically reduced in a short time. It was.

In the previous embodiment, the substrate bonding machine for bonding two substrates A and B in a vacuum has been described. However, the present invention is not limited to this, and the substrate for bonding substrates A and B in the atmosphere. Even in this case, the same effect as that of the above-described vacuum bonding machine can be obtained. Further, in the illustrated example, a thin plate-like or thin-film-like electrostatic is applied to the substrate side surface la of the upper holding plate 1. The chuck 2 is supported so that it can reciprocate in the vertical direction, and the upper substrate A is moved toward the lower substrate B by separating the upper electrostatic chuck 2 while the upper substrate A is electrostatically attracted. Although both substrates A and B are bonded together with agent C, the present invention is not limited to this. Both substrates A and B may be overlapped by other bonding methods that do not move the upper electrostatic chuck 2 up and down. .

Brief Description of Drawings

FIG. 1 is a longitudinal front view showing an embodiment of a chuck device for a substrate bonding machine of the present invention, and (a) to (c) show a method for bonding substrates together in the order of steps.

[Fig. 2] A longitudinal front view showing the state of static elimination, and (a) and (b) are shown in order of operation steps.

Explanation of symbols

A board (upper board) B board (lower board)

B1 Back C C Adhesive

S Vacuum chamber S1 Static elimination gap

1 Upper holding plate la Board side surface

lb pedestal 1 'lower holding plate

la 'PCB side surface lb' Pedestal

2 Electrostatic chuck 2a Dielectric

2b Electrode part 2c Through hole

3 Through holes 4 Separation means

5 Suction suction means 5a Suction hole

6 Adhering means 6a Stone

6b Magnetic material (magnet) 7 Isolation means

Claims

The scope of the claims

[1] In a chuck device for a substrate bonding machine that holds a substrate detachably by electrostatically adsorbing the substrate to the substrate side of the holding plate,

An electrostatic chuck formed in a thin plate shape or a film shape is bonded to the surface of the holding plate on the substrate side, and the substrate side of the holding plate is attached by the electrostatic adsorption force of the thin plate shape or the film shape electrostatic chuck. A chuck device for a substrate bonding machine, wherein the substrate is detachably held on the surface.

[2] Separation means for separating the substrate from the electrostatic chuck and forming a static elimination gap between the electrostatic chuck and the substrate is provided, and the surface of the electrostatic chuck and the substrate are separated by the separation means. The electric field that neutralizes the charge remaining on the substrate is induced by changing the voltage of the electrode portion of the electrostatic chuck while forming a gap for static elimination between the electrodes. Chuck device for substrate bonding machine.

[3] In the atmosphere after peeling the substrate from the electrostatic chuck of the chuck device for the substrate bonding machine according to claim 1, the voltage of the electrode portion of the electrostatic chuck is changed in the air or in a predetermined low vacuum. A method for neutralizing a substrate, characterized by inducing a field and neutralizing a charge remaining on the substrate.