KR100894740B1 - Apparatus for attaching substrates - Google Patents

Abstract

An apparatus for attaching substrates is provided to absorb the substrates by using a plurality of electrostatic chucks(ESCs), thereby reducing the deformation of substrates and the power required for absorbing the substrate. An upper chamber(200) is ascended and descended by a driving unit. An upper plate(210) is arranged at a lower part of the upper chamber and is formed in a plate shape. Electrostatic chucks(220) are inserted into a lower surface of the upper plate and attaches the first substrate(P1) by the electrostatic force. A camera(230) controls the relative positions of the second substrate(P2) and the first substrate. A substrate separating part(240) absorbs or presses the first substrate to attach or separate the first substrate. A lower chamber(300) forms the adhesion space by coming in contact with the upper chamber.

Description

Substrate Bonding Device {APPARATUS FOR ATTACHING SUBSTRATES}

The present invention relates to a substrate bonding apparatus, and more particularly, to a substrate bonding apparatus for attaching a substrate using electrostatic force.

As information society has developed, the demand for display devices has increased in various forms. Recently, various flat panel display devices such as liquid crystal display (LCD), plasma display pannel (PDP), and electro luminescent display (ELD) have been studied, and some of them are already widely used in real life.

Among them, LCDs are being used for mobile image display devices because of their excellent image quality compared to CRT (Cathode Ray Tube) and the advantages of light weight, thinness, and low power consumption. A representative example of the liquid crystal display panel used in the LCD is a TFT-LCD panel. In the TFT-LCD panel, an array substrate in which a plurality of thin film transistors (TFTs) are formed in a matrix form and a color filter substrate in which a color filter or a light shielding film are formed are bonded to each other at intervals of a few μm, and before bonding, The liquid crystal is injected and encapsulated in the middle or after bonding to manufacture the panel.

Therefore, in manufacturing a liquid crystal display panel used in LCD, it is essential to manufacture the array substrate and the color filter substrate, and then attach the two substrates and inject the liquid crystal material into the space therebetween. The bonding process is one of the important processes for determining the quality of the LCD.

Substrate bonding is achieved by pressing the array substrate and the color filter substrate together using pressure. To this end, the substrate bonding apparatus includes two electrostatic chucks (ESCs) arranged up and down facing each other, and adheres the substrates to the electrostatic chucks. And while maintaining the parallelism of the two electrostatic chucks close to each other and proceed with the bonding of the two substrates.

Meanwhile, the electrostatic chuck used in the substrate bonding apparatus is most commonly used to support a substrate in a semiconductor manufacturing process and a display panel manufacturing process. As a prior art for this electrostatic chuck and substrate adhesion using an electrostatic chuck, refer to International Publication No. "WO2004 / 084298", "Substrate holding mechanism using an electrostatic chuck and a manufacturing method thereof" filed by Tokyo Electron Co., Ltd. can do.

The electrostatic chuck is mainly made of alumina sintered body or ceramic made of alumina spray, interposed therein with an electrode plate connected to a direct current power source to adsorb the substrate with a constant power generated by a high voltage applied from the direct current power source.

In the structure of the substrate bonding apparatus, the conventional electrostatic chuck arrangement method has used a single electrostatic chuck to correspond to the entire area of the substrate to be adsorbed. However, using an electrostatic chuck corresponding to the entire substrate area as the size of the substrate increases in size is problematic in terms of cost and efficiency.

SUMMARY OF THE INVENTION An object of the present invention is to provide a substrate bonding apparatus capable of distributing a plurality of electrostatic chucks to efficiently absorb a large area of substrate and reducing the amount of power used.

Another object of the present invention is to provide a substrate bonding apparatus using an air expansion unit capable of efficiently detaching the substrate from the electrostatic chuck.

The present invention provides a substrate bonding apparatus. The substrate bonding apparatus includes an upper chamber, a lower chamber contacting the upper chamber to form a bonding space, an upper surface plate disposed on a lower surface of the upper chamber and formed in a plate shape, and a plurality of substrates are dispersed and disposed on the lower surface of the upper surface plate. And an air expansion portion disposed between the electrostatic chuck attached by electric power and a pair of neighboring electrostatic chucks of the plurality of electrostatic chucks to separate the substrate from the electrostatic chuck.

The present invention uses a plurality of electrostatic chuck to adsorb the substrate, thereby reducing the amount of deformation of the substrate due to the adsorption of the substrate than when using a single electrostatic chuck. By distributing a plurality of electrostatic chucks, the amount of power used to absorb the substrate can be reduced, which is economical and efficient. In addition, since the rod-shaped expansion member is disposed between the plurality of electrostatic chucks, not only does the residual electrostatic force of the electrostatic chucks be discarded when the substrate is separated, but also the substrates can be efficiently removed from the electrostatic chucks.

1 is a schematic cross-sectional view showing a substrate bonding apparatus according to an embodiment of the present invention.

Referring to FIG. 1, the substrate bonding apparatus 100 includes an upper chamber 200, a lower chamber 300, and a driving unit 400.

The upper chamber 200 is elevated by the driving unit 400. The lower surface of the upper chamber 200 is in close contact with the lower chamber 300 to form a bonding space. The upper plate 210 is disposed on the lower surface of the upper chamber 200 and is formed in a plate shape. The upper chuck 220 is attached to the lower surface of the upper plate 210, and the first substrate P1 is attached to the lower surface of the upper chuck 220. The upper chuck 220 may be an electrostatic chuck (ESC) attaching the first substrate P1 by electrostatic power. The electrostatic chuck 220 is embedded in the lower surface of the upper plate 210, and a plurality of electrostatic chucks 220 are distributed and attached to the first substrate P1 by electrostatic power.

On the upper surface of the upper chamber 200, a camera unit 230 for adjusting the relative position of the first substrate P1 and the second substrate P2, and the first substrate P1 to the upper chuck 220 are attached. Or a substrate separation device 240 for adsorbing or pressing the first substrate P1 to separate or separate the substrate.

The camera unit 230 may include a first substrate P1 attached to the upper chuck 220 of the upper plate 210 through a through hole 231 formed in the upper chamber 200 and the upper plate 210, and a material to be described later. The alignment state of the two substrates P2 is read. The camera unit 230 is mounted to overlap and observe an alignment mark (not shown) provided on the first substrate P1 and the second substrate P2, and at least the first substrate P1 and the second substrate. It is arranged to overlap and observe at least two diagonal edges of (P2). In this case, the lighting device 330 is installed below the lower chamber 300 to provide the camera unit 230 with illumination so that the camera unit 230 can photograph the alignment mark.

The substrate separating apparatus 240 may include a plurality of separation pins 241 disposed through the upper chamber 200 and the upper plate 210, and the outside of the upper chamber 200 to lift the separation pins 241. Separation pin actuator 242 is included. Separation pin 241 is installed in a hollow tube shape, a vacuum pressure is formed inside the separation pin 241 to adsorb the first substrate (P1).

In addition, although not shown, a vacuum pump is connected to form a vacuum pressure in the bonding space formed by the upper chamber 200 and the lower chamber 300. The vacuum pump may be a dry pump, a turbomolecular pump (TMP), a mechanical booster pump (MBP), or the like.

The lower chamber 300 is disposed below the upper chamber 200, and the upper chamber 200 is lowered to the lower chamber 300 by the driving unit 400 so that the upper chamber 200 and the lower chamber 300 are bonded together. Form a space. The lower plate 310 is disposed on the upper surface of the lower chamber 300, and the lower chuck 320 is disposed on the upper surface of the lower plate 310. The lower chuck 320 attaches the second substrate P2. The lower chuck 320 may be an electrostatic chuck (ESC) that attaches the second substrate P2 by electrostatic power.

The edge of the lower chamber 300 is provided with a sealing member 340 for contacting the lower surface of the upper chamber 200 to maintain the airtightness of the bonding space.

On the lower surface of the lower chamber 300, the substrate lift for attaching the second substrate P2 to the lower chuck 320 or separating the second substrate P2 attached to the lower chuck 320 from the lower chuck 320. Device 350 is disposed.

The substrate elevating device 350 includes a plurality of elevating pins 351 disposed through the lower chamber 300 and the lower plate 310, and are provided outside the lower chamber 300 to elevate the plurality of elevating pins 351. Lifting pin actuator 352 to include.

When the second substrate P2 is carried between the upper chamber 200 and the lower chamber 300, the lifting pin 351 is raised to support the second substrate P2, and then the lifting pin 351 is It lowers and serves to position the second substrate (P2) on the lower chuck (320). In addition, when the bonding process is completed and the substrate (P1 + P2) to be carried out to the outside, the lifting pin 351 serves to raise the bonded substrate (P1 + P2) with respect to the lower chamber 300. .

The driving unit 400 raises and lowers the upper chamber 200 toward the lower chamber 300 so that the upper chamber 200 and the lower chamber 300 form a bonding space.

2 is a plan view illustrating an electrostatic chuck and an upper plate according to an embodiment of the present invention, and FIG. 3 is a cross-sectional view of an internal structure of the electrostatic chuck and the upper plate according to an embodiment of the present invention. Figure 4 is a side cross-sectional view showing a top plate according to an embodiment of the present invention.

2 to 4, a plurality of electrostatic chucks 220 are disposed on the upper plate 210 in the form of a matrix. This is because disposing the electrostatic chuck 220 in the form of such a plurality of matrices increases convenience of maintenance and repair. In addition, since the plurality of electrostatic chucks 220 are used to adsorb the first substrate P1, the amount of deformation of the substrate due to the adsorption of the substrate is reduced compared to the case of using a single electrostatic chuck. In addition, since the plurality of electrostatic chucks 220 are distributed and disposed, the amount of power used for absorbing the substrate can be reduced, which is economical and efficient.

In the upper plate 210, the electrostatic chuck 220 attaching the first substrate P1 to the electrostatic chuck and the first substrate P1 attached to the electrostatic chuck 220 are separated from the electrostatic chuck 220. An air expander 250 is provided to supply air to realize bonding with the two substrates P2.

The electrostatic chuck 220 is a component that fixes the first substrate P1 only by the force of the electrostatic force. The principle of the electrostatic chuck 220 is to adsorb the substrate using Coulombbic force and Johnson-Rahbeck force generated in the insulating layer located between the electrode and the first substrate P1 as known. It is. The electrostatic chuck 220 may be classified into a polyimide type electrostatic chuck 220 and a ceramic type electrostatic chuck 220. Since the manufacturing method of the electrostatic chuck 220 is a known technique, detailed description thereof will be omitted.

The air expansion unit 250 includes a base block 251, an air supply unit (not shown), and an expansion member 252.

The base block 251 has a through hole formed therein. Air is supplied to the expansion member 252 through the through hole. In addition, the through hole existing in the base block 251 serves to prevent deformation such as shrinking more than the original state when the expansion member 252 shrinks to the original state by pumping air of the through hole. Also do. The air supply part serves to supply air to one side of the through hole. The expansion member 252 is present on the other side of the through hole, and expands to the attachment surface side of the substrate attached to the electrostatic chuck 220.

The expansion member 252 may be in any form as long as it is a soft material. In one embodiment, the expansion member 252 may be a diaphragm. As shown in FIG. 2, the expansion member 252 is disposed between the electrostatic chucks 220 and is provided in a rod shape along the lower surface of the upper plate 210. Since the rod-shaped expansion member 251 is uniformly distributed along the lower surface of the upper plate 210, the first substrate P1 may be more effectively separated from the electrostatic chuck 220 than the peeling mechanism scattered by the yarns.

Since the bonding space is in a vacuum state, the expansion member 252 expands toward the bonding space where the pressure is low by supplying air from the air supply unit. At the same time, the first substrate P1 is separated from the electrostatic chuck 220 by interrupting the electrostatic force of the electrostatic chuck 220. Since the rod-shaped expansion member 252 is disposed between the plurality of electrostatic chucks 220, the electrostatic chuck 220 not only destroys the residual electrostatic force of the electrostatic chuck 220 when the first substrate P1 is separated. The first substrate P1 can be effectively separated from the first substrate P1. In this case, when the expansion of the expansion member 252 and the blocking of the electrostatic chuck of the electrostatic chuck 220 are performed at the same time, the first substrate P1 can be efficiently separated from the electrostatic chuck 220.

In addition, by installing a heat wire outside the base block 251, that is, the air passage inside the upper plate 210, the air may expand more quickly. Thus, since air is delivered to the expansion member 252 along the through hole in the base block 251, the expansion member 252 may expand to detach the first substrate P1 from the electrostatic chuck 220.

5 is a cross-sectional view of an internal structure of an electrostatic chuck and an upper plate according to another embodiment of the present invention.

Referring to FIG. 5, the air expansion part 250 includes a cylindrical groove 253, an air supply part (not shown), a piston 254, and a locking jaw 255.

Cylindrical groove 253 is formed in the upper surface plate (210). The air supply unit supplies air to one side of the cylindrical groove 253. The piston 254 slides from one side of the cylindrical groove 253 to the other side. The locking jaw 255 supports the piston 254 inside the cylindrical groove 253 at the bottom dead center of the cylindrical groove 253.

Therefore, the piston is slid by the supply of air, and the first substrate P1 can be separated from the electrostatic chuck 220 due to the movement of the piston. At this time, by simultaneously blocking the electrostatic force of the electrostatic chuck 220, the first substrate (P1) is to be separated from the electrostatic chuck 220.

Hereinafter, the operating state of the substrate bonding apparatus 100 according to the present invention having the configuration as described above will be described.

First, the first substrate P1 and the second substrate P2 are supplied between the upper chamber 200 and the lower chamber 300 by a substrate supply device (not shown).

When the first substrate P1 is supplied first, as the first substrate P1 enters between the upper chamber 200 and the lower chamber 300, the separating pin 241 descends to adsorb the first substrate P1. do. Thereafter, the separating pin 241 raises the first substrate P1, and the first substrate P1 is attached to the electrostatic chuck 220.

As the second substrate P2 is supplied, the elevating pin 351 disposed in the lower chamber 300 ascends to the upper portion of the lower chamber 300 by the elevating pin actuator 352, and the elevating pin 351 is elevated. The second substrate P2 positioned between the upper chamber 200 and the lower chamber 300 is supported by). As the lifting pin 351 is lowered by the lifting pin actuator 352, the second substrate P2 supported by the lifting pin 351 is lowered together, and the lower chuck 320 positioned below the second substrate P2. It is attached by the adhesion force of).

When the attachment of the first substrate P1 and the second substrate P2 is completed, the upper chamber 200 is elevated by the driving unit 400 to the lower chamber 300, and the lower surface of the upper chamber 200 is lower chamber. While being in close contact with the upper surface of the 300, a bonding space for bonding of the first substrate (P1) and the second substrate (P2) is formed. At this time, the upper chamber 200 and the lower chamber 300 is kept airtight by the sealing member 340 disposed on the upper edge of the lower chamber 300.

When the bonding space is formed, alignment between the first substrate P1 and the second substrate P2 is performed by the alignment means (not shown).

When the alignment is completed, a vacuum pressure is formed in the bonding space and the first substrate P1 and the second substrate P2 are in close proximity (see FIG. 6). Then, the expansion member 252 is expanded as shown in FIG. 7, whereby the first substrate P1 is separated from the electrostatic chuck 220, and the first substrate P1 is free to the second substrate P2. It is dropped and temporarily bonded to the 2nd board | substrate P2 (refer FIG. 7).

That is, the air supply unit supplies air into the base block 251, and the expansion member 252 expands through supply of air inside the base block 251. Since the bonding space is in a vacuum state, the expansion member 252 expands toward the bonding space where the pressure is low by supplying air from the air supply unit. At the same time, by interrupting the electrostatic force of the electrostatic chuck 220, the first substrate P1 is separated from the electrostatic chuck 220, and is temporarily bonded to the second substrate P2.

The first and second substrates P1 and P2 are firmly attached and bonded by supplying pressure by supplying N ₂ process gas to the outside of the temporary bonded first and second substrates P1 and P2. do. That is, the first substrate P1 and the second substrate P2 are bonded by the pressure difference between the first and second substrates P1 and P2 that are temporarily bonded by increasing the pressure in the bonding space.

When the bonding of the first substrate P1 and the second substrate P2 is completed, the pressure in the bonding space is restored to the atmospheric pressure state, and the bonded substrates P1 + P2 are taken out of the substrate bonding apparatus 100. . At this time, the reason for restoring to the atmospheric pressure state is that the pressure can be easily controlled, and since the substrate carrying out operation is performed at the atmospheric pressure state, no further process is necessary.

Although described in detail with respect to preferred embodiments of the present invention as described above, those of ordinary skill in the art, without departing from the spirit and scope of the invention as defined in the appended claims The present invention may be practiced in various ways. Accordingly, modifications to future embodiments of the present invention will not depart from the technology of the present invention.

For example, the present invention may be implemented by adding a component having another additional function or replacing the component with another component. However, all other modified embodiments include essential components of the present invention should be considered to be included in the technical scope of the present invention.

1 is a schematic cross-sectional view showing a substrate bonding apparatus according to an embodiment of the present invention.

2 is a plan view showing an electrostatic chuck and an upper surface plate according to an embodiment of the present invention.

Figure 3 is a cross-sectional view of the internal structure of the electrostatic chuck and the upper plate according to an embodiment of the present invention.

Figure 4 is a side cross-sectional view showing a top plate according to an embodiment of the present invention.

5 is a cross-sectional view of an internal structure of an electrostatic chuck and an upper plate according to another embodiment of the present invention.

6 and 7 are operation state diagrams of the electrostatic chuck and the substrate bonding apparatus having the same according to an embodiment of the present invention.

** Description of the symbols for the main parts of the drawings **

100: substrate bonding device

200: upper chamber

210: upper plate

220: upper chuck

250: air expansion unit

251: base block

252: expansion member

Claims (5)

Upper chamber; A lower chamber in contact with the upper chamber to form a bonding space; An upper plate disposed on a lower surface of the upper chamber and formed in a plate shape; An electrostatic chuck embedded in a lower surface of the upper plate and distributed in plurality, and attaching a substrate by electrostatic power; And Disposed between a pair of electrostatic chucks adjacent to each other of the plurality of electrostatic chucks, and including an air expansion portion for separating the substrate from the electrostatic chucks, The air inflation portion is a base block having a through hole formed therein, an air supply unit for supplying air to one side of the through hole, and the other side of the through hole, the expansion to expand to the side of the attachment surface of the substrate attached to the electrostatic chuck Substrate bonding apparatus comprising a member. delete The method of claim 1, The expansion member is a substrate bonding apparatus, characterized in that provided in the shape of a rod along the lower surface of the upper plate. The method of claim 1, The air expansion unit is a substrate bonding apparatus comprising a cylindrical groove formed inside the top plate, an air supply unit for supplying air to one side of the cylindrical groove and a piston slides from one side of the cylindrical groove to the other side. The method of claim 4, wherein And a locking jaw for supporting the piston at the bottom dead center of the cylindrical groove.

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