JP2004022979A - Attracting stage and substrate-bonding apparatus using the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To surely hold even an insulated object. <P>SOLUTION: An electrode 24, which is formed flat almost in the same size as the glass substrates 1, 2, is buried in a holding portion body 23 of the attracting stages 21, 22. A grounding electrode 25, which is formed flat almost in an equal size to that of the electrode 24, is fixed and located to the surfaces of holding portion body 23 in the side opposite to the attracting surface 23A sandwiching the electrode 24. The electrode 24 is connected to the positive side of a DC power source 26, while the grounding electrode 25 is connected to the negative side of the DC power supply 26. When a voltage is applied between the electrode 24 and grounding electrode 25 in the DC power supply 26, an electric field is produced between the electrodes 24, 25 and the periphery thereof. The glass substrates 1, 2 are attracted with a force generated by the negative charges appearing at the surface facing the electrode 24 with dielectric polarization and the positive charges appearing at the attracting surface 23A. <P>COPYRIGHT: (C)2004,JPO

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to an adsorption stage for adsorbing an object to be adsorbed by electrostatic force and a substrate bonding apparatus using the same.
[0002]
[Prior art]
2. Description of the Related Art A so-called electrostatic chuck is known as an adsorption stage for adsorbing an object to be adsorbed using electrostatic force. In such an electrostatic chuck, two types, a monopolar type and a bipolar type, are used depending on the form of electrodes arranged inside the electrostatic chuck.
[0003]
The single-pole type electrostatic chuck has a plate-like electrode arranged inside the electrostatic chuck in parallel with a suction surface of an object to be suctioned in the electrostatic chuck, and an insulating member between the suction surface and the suction surface. Become. Then, by applying a potential difference between the electrode and the object to be adsorbed, different charges are generated on the opposing surface of the electrode and the object to be adsorbed. Adsorb.
[0004]
As shown in FIG. 7, the bipolar electrostatic chuck includes a pair of electrodes 7, 8 formed in a comb shape in a plan view in a holding portion main body 6 made of an insulating member having an adsorption surface of an object to be adsorbed. Are arranged on the same plane with the electrodes 7 and 8 insulated from each other. Then, the object to be adsorbed is placed on the adsorbing surface by utilizing the action of electric charge that appears on the surface of the insulating member 6 facing the electrodes 7 and 8 due to dielectric polarization induced by an electric field generated by applying a potential difference between the electrodes 7 and 8. Adsorb.
[0005]
[Problems to be solved by the invention]
However, when trying to adsorb an insulating object to be adsorbed such as a glass substrate, the above-described electrostatic chucks have the following problems.
[0006]
In the case of the former single-pole type electrostatic chuck, it is necessary to generate a potential difference between an electrode disposed inside the electrostatic chuck and an object to be attracted. When the object to be attracted is an insulator, the potential difference is generated. Can not be caused. Therefore, the glass substrate cannot be adsorbed.
[0007]
On the other hand, the latter bipolar electrostatic chuck 5 utilizes dielectric polarization induced in the insulating member 6 by an electric field generated when a potential difference is generated between the electrodes 7 and 8 arranged in the electrostatic chuck 5. Then, the object to be adsorbed is adsorbed on the adsorbing surface, so that even an insulator such as a glass substrate can be adsorbed. However, in the gap portion t provided for electrically insulating the electrodes 7 and 8 from each other, the adsorption action by the dielectric polarization cannot be effectively obtained, and the arrangement area of the electrodes 7 and 8 is smaller than that of the unipolar type. In this case, the adsorption efficiency was low, and as a result, a sufficient amount of adsorption force could not be obtained, and the object to be adsorbed might fall or be displaced during adsorption.
[0008]
And, when such an electrostatic chuck is applied to a substrate bonding apparatus that bonds a pair of glass substrates in a state in which a liquid crystal is sealed therebetween, the glass substrates cannot be sufficiently held, and the glass substrates cannot be held sufficiently. There has been a possibility that problems such as displacement may occur, or the glass substrate may fall and cannot be bonded.
[0009]
SUMMARY OF THE INVENTION It is an object of the present invention to provide a suction stage capable of holding the object well even when the object is an insulator, and a substrate bonding apparatus using the same.
[0010]
[Means for Solving the Problems]
One aspect of the present invention includes an adsorption surface that adsorbs and holds an object to be adsorbed, and an electrode that is disposed on the adsorption surface via an insulating layer and to which a voltage is applied. In the adsorption stage for adsorbing on the adsorption surface, the electrode is formed in a flat plate shape, and an earth electrode disposed on the opposite side of the adsorption surface to the flat electrode with an insulating layer interposed therebetween. It is characterized by having.
[0011]
Another aspect of the present invention includes an adsorption surface that adsorbs and holds an object to be adsorbed, and an electrode that is disposed on the adsorption surface via an insulating layer and to which a voltage is applied. In the adsorption stage for adsorbing the adsorbate on the adsorption surface, the electrode is formed in a flat plate shape, and has a ground electrode disposed around the flat plate electrode via an insulating layer. I do.
[0012]
Still another embodiment of the present invention includes a first suction stage that holds a first substrate, and a second suction stage that is arranged to face the first suction stage and holds a second substrate. A substrate to be bonded via an adhesive in a state where the first substrate held by the first suction stage and the second substrate held by the second suction stage are relatively positioned. In the bonding apparatus, at least one of the first suction stage and the second suction stage is provided with a suction surface for holding a substrate by suction and an insulating layer disposed between the suction surface and an insulating layer. It is characterized by comprising a flat electrode to be applied and an earth electrode disposed on the opposite side of the flat electrode from the suction surface via an insulating layer.
[0013]
Still another embodiment of the present invention includes a first suction stage that holds a first substrate, and a second suction stage that is arranged to face the first suction stage and holds a second substrate. A substrate to be bonded via an adhesive in a state where the first substrate held by the first suction stage and the second substrate held by the second suction stage are relatively positioned. In the bonding apparatus, at least one of the first suction stage and the second suction stage is provided with a suction surface for holding a substrate by suction and an insulating layer disposed between the suction surface and an insulating layer. A flat electrode to be applied and a ground electrode disposed around the flat electrode with an insulating layer interposed therebetween.
[0014]
[Action]
According to the present invention, the object to be adsorbed or the substrate is brought into contact with the electrode in the insulating layer by dielectric polarization induced by an electric field generated around the electrode as a result of a voltage being applied between the flat electrode and the ground electrode. Is attracted to the attracting surface by utilizing the action of the charge appearing on the facing surface of the substrate.
[0015]
BEST MODE FOR CARRYING OUT THE INVENTION
One embodiment of the present invention will be described with reference to FIGS.
[0016]
FIG. 1 is a partial cross-sectional front view showing an example of the configuration of a substrate bonding apparatus to which a suction stage according to the present invention is applied, FIG. 2 is a cross-sectional front view showing a main part of the suction stage in FIG. 1, and FIG. FIG. 4 is a schematic view showing electric fields and electric charges generated in the suction stage of FIG.
[0017]
In FIG. 1, a substrate bonding apparatus 10 applies a sealant to at least one of two glass substrates 1 and 2 in a closed loop and supplies liquid crystal to the inside of the sealant. To produce a liquid crystal display panel in a vacuum, a vacuum chamber 11, an upper suction head 12, a lower suction head 13, a pressure adjustment device 14 for adjusting the pressure in the vacuum chamber 11, an image recognition device 15, and a control device. 16.
[0018]
The vacuum chamber 11 surrounds the upper suction head 12 and the lower suction head 13, and has a side surface on which an opening / closing door for loading and unloading the glass substrates 1 and 2 as objects to be sucked into and out of the vacuum chamber 11. 11A is provided.
[0019]
The upper suction head 12 is disposed outside the vacuum chamber 11 as an upper suction stage 21 as a first suction stage for holding the upper glass substrate 1 as a first substrate, and is connected to the upper suction stage 21 via a connecting portion 12A. The upper suction stage 21 can be moved up and down by the elevating device 12B. Here, the space between the connecting portion 12A and the vacuum chamber 11 can be slid while maintaining airtightness by a sealing means such as an O-ring.
[0020]
The lower suction head 13 includes a lower suction stage 22 as a second suction stage that holds the lower glass substrate 2 as a second substrate, and a moving table 13A that is disposed on the bottom surface of the vacuum chamber 11 and supports the lower suction stage 22. Have. The moving table 13A is movable in a horizontal (X-Y direction) direction and a rotation (θ) direction.
[0021]
The pressure adjusting device 14 adjusts the pressure in the vacuum chamber 11, and includes a pressure reducing device that reduces the pressure in the vacuum chamber 11 and a pressure increasing device that increases the pressure in the reduced vacuum chamber 11.
[0022]
The image recognition device 15 includes four imaging devices 15A and an image processing device 15B that performs image processing on images captured by each imaging device. The four imaging devices 15 </ b> A capture images of position detection marks attached to the corners of the upper glass substrate 1 and the lower glass substrate 2, and are mounted on the upper suction stage 21 below the vacuum chamber 11. The glass substrate 1 and the lower glass substrate 2 held by the lower suction stage 22 are arranged at positions corresponding to the respective corners with the imaging direction facing upward.
[0023]
Further, a transparent viewing window 11B made of quartz glass or the like is provided at a position corresponding to each imaging device 15A in the vacuum chamber 11, and a through hole 22A is provided at a position corresponding to each imaging device 15A on the lower suction stage 22. The imaging device 15A is provided to image the glass substrates 1 and 2 through the viewing window 11B and the through hole 22A. Since each of the glass substrates 1 and 2 is transparent, the position detection mark provided on the upper glass substrate 1 can be imaged through the lower glass substrate 2.
[0024]
The image processing device 15B performs a relative displacement between the position detection mark on the upper glass substrate 1 and the position detection mark on the lower glass substrate 2 based on the image data captured by the imaging device 15A. Is detected, and a relative displacement between the upper glass substrate 1 and the lower glass substrate 2 is calculated based on the detected value.
[0025]
The control device 16 controls the operation of the substrate bonding device 10, and is connected to the lifting device 12B, the moving table 13A, the pressure control device 14, and the image processing device 15B.
[0026]
Next, the configuration of the upper suction stage 21 and the lower suction stage 22 will be described in detail with reference to FIGS. In addition, since the upper suction stage 21 and the lower suction stage 22 have the same structure, the individual descriptions of the suction stages 21 and 22 are omitted in FIG.
[0027]
Each of the suction stages 21 and 22 includes a holding unit main body 23, an electrode 24, and a ground electrode 25.
[0028]
The holding portion main body 23 is formed of an insulating material, and has a suction surface 23A for holding the glass substrates 1 and 2.
[0029]
As shown in FIG. 3, the electrode 24 is formed in a flat plate shape having substantially the same size and the same shape as the glass substrates 1 and 2 in plan view, and is formed in the holding portion main body 23 in parallel with the suction surface 23A. Be placed. Thus, an insulating layer made of an insulating material forming the holding body 23 is interposed between the electrode 24 and the suction surface 23A of the holding body 23.
[0030]
The ground electrode 25 is formed in a plate shape having substantially the same size and the same shape as the electrode 24, and is fixed to a surface of the holding portion main body 23 opposite to the suction surface 23 </ b> A with the electrode 24 interposed therebetween. Therefore, an insulating layer made of an insulating material forming the holding portion main body 23 is interposed between the ground electrode 25 and the electrode 24.
[0031]
The electrode 24 is connected to the positive electrode of the DC power supply 26, and the ground electrode 25 is connected to the negative electrode of the DC power supply 26. A voltage can be applied between the electrode 24 and the ground electrode 25 by the DC power supply 26. . The DC power supply 26 is ON / OFF controlled by the control device 16.
[0032]
The thickness of the insulating layer interposed between the suction surface 23A and the electrode 24 and the thickness of the insulating layer interposed between the electrode 24 and the ground electrode 25 are at least between the suction surface 23A and the electrode 24. , The electrode 24 and the ground electrode 25 need to have a thickness that can maintain an electrical insulation state, and the thickness is set to an appropriate thickness according to the material of the insulating material.
[0033]
Next, the operation will be described.
[0034]
First, although not shown, at least one of the upper glass substrate 1 and the lower glass substrate 2, for example, the lower glass substrate 2, is previously coated with a sealing agent in a closed loop shape, and is surrounded by the sealing agent. In the following description, it is assumed that a required amount of liquid crystal is supplied in the region.
[0035]
The opening and closing door 11A of the vacuum chamber 11 is opened, and the upper glass substrate 1 is supplied to the upper suction stage 21 and the lower glass substrate 2 is supplied to the lower suction stage 22 by a transfer device (not shown). At this time, the inside of the vacuum chamber 11 is set to the atmospheric pressure by the pressure control device 14.
[0036]
Here, the glass substrates 1 and 2 supplied by the transport device (not shown) are sucked on the suction surfaces 23A of the upper suction stage 21 and the lower suction stage 22 by the following operation.
[0037]
That is, when the glass substrates 1 and 2 are conveyed to the close position opposing the suction surface 23A of the holding portion main body 23 by the conveyance device shown in the drawings, the DC power supply 26 is controlled to be ON by the control device 16 and the electrode 24 and the ground are connected. A voltage is applied between the electrodes 25.
[0038]
When a voltage is applied between the electrode 24 and the earth electrode 25, the electrode 24 connected to the positive electrode of the DC power supply 26 is charged to a positive charge, and the earth electrode 25 connected to the negative electrode is charged to a negative charge. An electric field is generated between and around the electrode 24 and the ground electrode 25 as shown by a broken line in FIG. Then, dielectric polarization is induced in the holding portion main body 23 and the glass substrates 1 and 2 by this electric field.
[0039]
That is, as shown in FIG. 4, different charges (negative charges) appear on the side of the holding portion main body 23 that is in contact with the surface of the electrode 24, and the same kind of charges as the electrode 24 on the adsorption surface 23A. (Positive charge) appears. On the surface side of the glass substrates 1 and 2 facing the electrode 24, a charge (negative charge) opposite to that of the electrode 24 appears. As a result, the glass substrates 1 and 2 are attracted by a force (electrostatic force) between the positive charge appearing on the suction surface 23A side of the holding body 23 and the negative charge appearing on the electrode 24 side of the glass substrates 1 and 2. It is adsorbed on the adsorption surface 23A.
[0040]
When the suction of the upper glass substrate 1 on the upper suction stage 21 and the suction of the lower glass substrate 2 on the lower suction stage 22 are completed, the controller 16 closes the opening / closing door 11A. Further, the control device 16 controls the pressure control device 14 to reduce the pressure in the vacuum chamber 11 (vacuum state), and controls the elevating device 12B to move the upper glass substrate 1 and the lower glass substrate 1 from the position shown in FIG. The upper suction stage 21 is lowered until the position 2 is opposed to the position 2 with a slight gap.
[0041]
After bringing the upper glass substrate 1 and the lower glass substrate 2 close to each other, the control device 16 controls the imaging device 15A to image the position detection marks provided on the upper glass substrate 1 and the lower glass substrate 2. . The image data captured by the imaging device 15A is sent to the image processing device 15B, and the relative position of the position detection marks on the upper glass substrate 1 and the lower glass substrate 2 is determined by the image processing device 15B using a known pattern matching method or the like. Is calculated, and a relative displacement between the upper glass substrate 1 and the lower glass substrate 2 is calculated from the calculated displacement between the position detection marks.
[0042]
The control device 16 controls the movement of the moving table 13A based on the relative displacement between the upper glass substrate 1 and the lower glass substrate 2 calculated by the image processing device 15B so that the relative displacement is zero. The lower glass substrate 2 is moved so that
[0043]
Thereafter, the control device 16 controls the elevating device 12B to move the upper suction stage 21 downward to bring the upper glass substrate 1 into contact with the lower glass substrate 2 via a sealant, and to set a predetermined pressing force. Press for a preset time with pressure.
[0044]
After a lapse of the set time, the control device 16 controls the DC power supply 26 for applying a voltage between the electrodes 24 and 25 of the upper suction stage 21 to OFF, and controls the pressure control device 14 to enlarge the inside of the vacuum chamber 11. Increase to atmospheric pressure.
[0045]
Thereafter, the control device 16 controls the elevating device 12B to raise the upper suction stage 21 to the position shown in FIG. At this time, the bonded glass substrates 1 and 2 are left on the lower suction stage 22 by the suction force of the lower suction stage 22.
[0046]
Next, the opening / closing door 11A of the vacuum chamber 11 is opened, and the bonded glass substrates 1 and 2 are picked up from above the lower suction stage 22 by a transfer device (not shown) and carried out of the vacuum chamber 11. At a timing before the glass substrates 1 and 2 are picked up by a transfer device (not shown), the control device 16 controls the DC power supply 26 for applying a voltage between the electrodes 24 and 25 of the lower suction stage 22 to be OFF.
[0047]
By repeating the above operation, the glass substrates 1 and 2 are sequentially bonded.
[0048]
According to the above embodiment, a flat plate-like electrode 24 having substantially the same size as the glass substrates 1 and 2 is provided on the holding portion main body 23 of the suction stages 21 and 22, and is opposed to the suction surface 23 </ b> A with the electrode 24 interposed therebetween. A ground electrode 25 in the form of a flat plate having substantially the same size as the electrode 24 was disposed on the surface of the holding portion main body 23 on the side, and a voltage was applied between the electrode 24 and the ground electrode 25. By doing so, the glass substrates 1 and 2 are attached to the adsorption stages 21 and 22 by the action of dielectric polarization induced by an electric field generated when a voltage is applied between the electrode 24 and the ground electrode 25. Adsorbed. Moreover, as shown in FIG. 4, this effect can be expected in the entire region on the suction surface 23A located opposite to the electrode 24 where the electric field is generated. Since the suction force can be effectively applied to a large area of the substrate, even an insulating object to be suctioned such as the glass substrates 1 and 2 can be satisfactorily held. In order to sufficiently exert the holding force of the glass substrates 1 and 2, it is desirable that the size of the electrode 24 be equal to or larger than the size of the surface to be sucked of the glass substrates 1 and 2 to be sucked.
[0049]
Further, since the electrode 24 and the ground electrode 25 are formed in substantially the same size and the same shape as the glass substrates 1 and 2, which are the objects to be adsorbed, and both are arranged in the layer direction, the attraction force to the glass substrates 1 and 2 is reduced. It is possible to prevent the outer diameters of the suction stages 21 and 22 from becoming unnecessarily large with respect to the external shape of the glass substrates 1 and 2 to be sucked while acting well. Accordingly, the suction stages 21 and 22 disposed in the vacuum chamber 11 can be reduced in size, and as a result, the volume of the vacuum chamber 11 can be reduced. Therefore, the size of the substrate bonding apparatus 10 can be reduced, and the time required for decompression and pressure increase in the vacuum chamber 11 can be reduced, so that productivity can be improved.
[0050]
Further, in the substrate bonding apparatus to which such suction stages 21 and 22 are applied, since the glass substrates 1 and 2 can be held better than a bipolar electrostatic chuck, the glass substrates 1 and 2 can be held. When bonding, it is possible to prevent a deviation in the surface direction between the glass substrates 1 and 2 and the suction stages 21 and 22, thereby improving the bonding accuracy of the glass substrates 1 and 2. The yield can be improved.
[0051]
Further, the suction stages 21 and 22 are arranged in the vacuum chamber 11, and the glass substrates 1 and 2 are bonded in a state where the pressure in the vacuum chamber 11 is reduced (vacuum state). Air can be prevented from being mixed into the sealed liquid crystal, and a high quality liquid crystal display panel can be manufactured.
[0052]
Next, a second embodiment of the suction stage according to the present invention will be described with reference to FIGS. FIG. 5 is a cross-sectional front view showing the suction stage according to the second embodiment, and FIG. 6 is a view taken along the line BB of FIG. 5 and 6, the same components as those in FIGS. 2 and 3 are denoted by the same reference numerals, and description thereof will be omitted.
[0053]
5 and 6, the difference from the suction stage of the first embodiment shown in FIGS. 2 and 3 is that the ground electrode 25 is formed in a frame shape having a rectangular opening at the center, and Is arranged so as to be substantially flush with the electrode 24. Here, the point that the size of the electrode 24 is formed in a plate shape having substantially the same size and the same shape as the glass substrates 1 and 2 is the same as that of the suction stage according to the first embodiment shown in FIGS. Is the same as
[0054]
With the suction stages 21 and 22 having such a configuration, as in the suction stage of the first embodiment, the suction force can be generated on the entire surface of the suction surface 23 </ b> A opposed to the electrode 24. The effect that even an insulating object to be adsorbed, such as 2, can be favorably held.
[0055]
In the case of the second embodiment, the width W of the ground electrode 25 must be equal to the length L of the side of the electrode 24 in order to effectively apply the attraction force to all the areas of the attraction surface 23A corresponding to the electrode 24. Is preferably at least half.
[0056]
In the second embodiment, the ground electrode 25 is formed in the shape of a flat plate frame. However, the ground electrode 25 may have another shape. For example, a rectangular flat ground electrode may be formed along each side of the electrode 24. And the respective ground electrodes may be connected to the negative electrode side of the DC power supply 26.
[0057]
In each of the above-described embodiments, an example has been described in which the glass substrates 1 and 2 are suctioned to the suction stages 21 and 22 using the electrostatic force between the glass substrates 1 and 2 and the electrodes 24. A suction hole for vacuum suction may be formed in 23A, and the glass substrates 1 and 2 may be sucked together with the vacuum suction force. By doing so, under the atmosphere in the vacuum chamber where the vacuum suction force can be applied, the electrostatic force and the vacuum suction force can be applied to the glass substrates 1 and 2, and the glass substrate 1 can be more reliably applied. , 2 can be held.
[0058]
Alternatively, the suction hole may be connected to a supply source of compressed air, and the compressed air may be blown out from the suction hole when the suction by the electrostatic force is released. In this way, even if the application of the voltage to the electrodes 24 and 25 is stopped, the glass substrates 1 and 2 are attracted even if the charges remain on the attracting surface 23A of the holding unit main body 23. The glass substrates 1 and 2 can be smoothly transferred from the suction stages 21 and 22 to a transfer device (not shown).
[0059]
Further, instead of compressed air, ionized compressed gas may be ejected from the adsorption hole. In this case, by using an ionized gas having a charge different from that of the charge remaining on the suction surface 23A of the holding portion main body 23, in addition to the effect of blowing out the compressed air as described above, the suction surface 23A The effect of removing the remaining charge can be obtained.
[0060]
In addition, although the description has been made of the example in which the glass substrate which is an insulator (dielectric) is used as an object to be adsorbed, the present invention is not limited to this. For example, a substrate made of a dielectric such as plastic, or The present invention is also applicable to a substrate made of a conductor or a semiconductor such as a wafer.
[0061]
Further, although the description has been made of the example in which the electrode 24 is connected to the positive electrode and the ground electrode 25 is connected to the negative electrode, the positive electrode and the negative electrode may be exchanged.
[0062]
【The invention's effect】
ADVANTAGE OF THE INVENTION According to this invention, even if an object to be adsorbed is an insulator, it can hold | maintain well.
[Brief description of the drawings]
FIG. 1 is a partial cross-sectional front view showing an example of a configuration of a substrate bonding apparatus to which a suction stage according to the present invention is applied.
FIG. 2 is a sectional front view showing a main part of the suction stage of FIG. 1;
FIG. 3 is a view as viewed in the direction of arrows AA in FIG. 2;
FIG. 4 is a schematic diagram showing electric fields and electric charges generated in the suction stage of FIG. 2;
FIG. 5 is a sectional front view showing a suction stage according to a second embodiment.
6 is a view taken in the direction of arrows BB in FIG. 5;
FIG. 7 is a plan sectional view showing a configuration of a conventional bipolar electrostatic chuck.
[Explanation of symbols]
1. Upper glass substrate (object to be adsorbed)
2 Lower glass substrate (adsorbed object)
DESCRIPTION OF SYMBOLS 10 Substrate bonding apparatus 11 Vacuum chamber 12 Upper suction head 13 Lower suction head 14 Pressure regulator 15 Image recognition device 16 Controller 21 Upper suction stage (first suction stage)
22 Lower suction stage (second suction stage)
23 Main body of holding section 23A Suction surface 24 Electrode 25 Earth electrode 26 DC power supply

Claims (6)

It has an adsorption surface for adsorbing and holding the object to be adsorbed, and an electrode disposed on the adsorption surface via an insulating layer to which a voltage is applied, and adsorbs the object to the adsorption surface by electrostatic force. In the adsorption stage,
The electrode is formed in a plate shape,
An adsorption stage comprising an earth electrode disposed on the opposite side of the adsorption surface to the plate-like electrode via an insulating layer. It has an adsorption surface for adsorbing and holding the object to be adsorbed, and an electrode disposed on the adsorption surface via an insulating layer to which a voltage is applied, and adsorbs the object to the adsorption surface by electrostatic force. In the adsorption stage,
The electrode is formed in a plate shape,
An attraction stage comprising an earth electrode disposed around the flat electrode via an insulating layer. 3. The suction stage according to claim 1, wherein the electrode has substantially the same size and the same shape as a contact surface of the object to be suctioned with the suction surface. 4. A first suction stage that holds the first substrate; and a second suction stage that is disposed opposite to the first suction stage and holds the second substrate, and is held by the first suction stage. A substrate bonding apparatus that bonds the first substrate and the second substrate held on the second suction stage via an adhesive in a state of being relatively positioned,
At least one of the first suction stage and the second suction stage,
A suction surface for holding the substrate by suction, a plate-shaped electrode disposed on the suction surface via an insulating layer to which a voltage is applied, and an insulating layer on the opposite side of the plate-shaped electrode from the suction surface. And a ground electrode disposed through the substrate. A first suction stage that holds the first substrate; and a second suction stage that is disposed opposite to the first suction stage and holds the second substrate, and is held by the first suction stage. A substrate bonding apparatus that bonds the first substrate and the second substrate held on the second suction stage via an adhesive in a state of being relatively positioned,
At least one of the first suction stage and the second suction stage,
An adsorption surface for adsorbing and holding the substrate, a plate-shaped electrode disposed on the adsorption surface via an insulating layer to which a voltage is applied, and an earth electrode disposed around the plate-shaped electrode via the insulating layer And a substrate bonding apparatus comprising: The substrate bonding apparatus according to claim 4, wherein the first suction stage and the second suction stage are disposed in a vacuum chamber.

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