WO2008041294A1 - Dispositif à mandrin pour machine de liaison de substrat et procédé de neutralisation de charges sur un substrat - Google Patents

Dispositif à mandrin pour machine de liaison de substrat et procédé de neutralisation de charges sur un substrat Download PDF

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Publication number
WO2008041294A1
WO2008041294A1 PCT/JP2006/319541 JP2006319541W WO2008041294A1 WO 2008041294 A1 WO2008041294 A1 WO 2008041294A1 JP 2006319541 W JP2006319541 W JP 2006319541W WO 2008041294 A1 WO2008041294 A1 WO 2008041294A1
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
electrostatic chuck
electrostatic
chuck
bonding machine
Prior art date
Application number
PCT/JP2006/319541
Other languages
English (en)
Japanese (ja)
Inventor
Yoshikazu Ohtani
Original Assignee
Shin-Etsu Engineering Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin-Etsu Engineering Co., Ltd. filed Critical Shin-Etsu Engineering Co., Ltd.
Priority to PCT/JP2006/319541 priority Critical patent/WO2008041294A1/fr
Publication of WO2008041294A1 publication Critical patent/WO2008041294A1/fr

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/061—Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
    • B65G2249/02—Controlled or contamination-free environments or clean space conditions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
    • B65G2249/04—Arrangements of vacuum systems or suction cups
    • B65G2249/045—Details of suction cups suction cups

Definitions

  • the present invention relates to a process for manufacturing a flat panel display such as a liquid crystal display (LCD) or a plasma display (PDP), for example, when a substrate such as CF glass or TFT glass is detachably held and bonded.
  • a flat panel display such as a liquid crystal display (LCD) or a plasma display (PDP)
  • LCD liquid crystal display
  • PDP plasma display
  • the present invention relates to a chuck device for a substrate bonding machine used for the above, and a substrate static elimination method using the chuck device.
  • the present invention relates to a chuck device for a substrate bonding machine that electrostatically attracts a substrate to a substrate side of a holding plate and detachably holds the substrate, and a substrate discharging method using the same.
  • a dielectric and an electrode unit are laminated on the entire opposing surfaces of a pair of upper and lower holding plates (surface plate) made of a rigid body such as metal or ceramics.
  • Each of the electrostatic chucks is provided, and suction suction means for assisting suction holding in the atmosphere are additionally provided, and both the substrates are sucked and held by the electrostatic chuck and suction suction means.
  • mutual alignment is performed to bond the force substrates together (see, for example, Patent Document 1).
  • electrostatic chucks electrostatic chucks
  • suction suction means suction conduits
  • Patent Document 1 Japanese Patent Application Laid-Open No. 2003-324144 (Page 3-5, Fig. 1-2)
  • Patent Document 2 Japanese Patent Laid-Open No. 2002-229044 (Pages 10-12, FIGS. 7, 9)
  • glass cullet (shards) may be transported on the glass substrate, especially during setup. If the cullet is squeezed between the electrostatic chuck and the electrostatic chuck, the surface of the electrostatic chuck may be partially broken and broken.
  • the electrostatic chuck In order to prevent this, it is necessary to replace the electrostatic chuck itself whose surface has been destroyed.
  • the electrostatic chuck is fixedly arranged on the entire surface of the holding plate, so that the replacement work at the installation site is difficult and only requires time. Since the operation of the entire line cannot be resumed until this replacement work is completed, there was a problem that the operation rate decreased.
  • Patent Document 2 when the substrate is peeled off from the electrostatic chuck, it is easy to remove the residual charge of the substrate to make it easy to peel off. At that moment, the surface of the substrate is peeled and charged according to the difference in the charge train between the surface material of the electrostatic chuck and the material of the substrate is accumulated on the surface of the substrate. When the separation distance is long, there is a problem in that a discharge occurs to destroy a device such as a TFT element formed on the substrate.
  • the invention described in claim 1 is intended to attach the electrostatic chuck in a replaceable manner without any modification to the substrate side surface of the holding plate.
  • the invention described in claim 2 neutralizes the peeling charge generated on the substrate due to peeling from the electrostatic chuck from a position away from the electrostatic chuck. It is for the purpose.
  • the invention described in claim 3 is characterized in that after the substrate is peeled from the electrostatic chuck, the peeling charge generated on the substrate due to the peeling is removed from the electrostatic chip.
  • the purpose is to remove static from a position away from the backpack.
  • the invention according to claim 1 of the present invention is configured such that an electrostatic chuck formed in a thin plate shape or a film shape is detachably attached to the substrate side surface of the holding plate.
  • the substrate is detachably held on the substrate side surface of the holding plate by the electrostatic attraction force of the thin plate-like or film-like electrostatic chuck.
  • the invention according to claim 2 is provided with separation means for separating the substrate from the electrostatic chuck and forming a static elimination gap between the electrostatic chuck and the substrate in the configuration of the invention according to claim 1.
  • the separation means creates a gap for static elimination between the surface of the electrostatic chuck and the substrate, and changes the voltage of the electrode portion of the electrostatic chuck, thereby neutralizing the charge remaining on the substrate. It is characterized by the addition of a configuration that induces a summing electric field.
  • the invention described in claim 3 is the atmosphere after the substrate is peeled off from the electrostatic chuck of the substrate bonding machine chuck device of the substrate bonding machine according to claim 1, or in a predetermined low vacuum.
  • the voltage of the electrode part of the electrostatic chuck is varied to induce an electric field, and the charge remaining on the substrate is neutralized.
  • the invention according to claim 1 of the present invention is such that the electrostatic chuck formed in a thin plate shape or a film shape is detachably bonded to the substrate side surface of the holding plate to thereby attach the substrate side surface of the holding plate.
  • the substrate is detachably held by the electrostatic chucking force of the thin plate or film electrostatic chuck, and the substrate side surface force of the holding plate is A thin plate-like or film-like electrostatic chuck can be easily removed.
  • the surface of the electrostatic chuck partially breaks down due to the penetration of foreign matter compared to the conventional case where the electrostatic chuck is fixedly arranged on the entire surface of the holding plate.
  • the holding plate and the thin or film-like electrostatic chuck are separate parts, the electrostatic chuck can be easily exchanged for the holding plate even at the installation site.
  • the operation of the entire line can be resumed in a short time, so the operation rate does not decrease and a stable production volume can be expected.
  • the holding plate of the substrate laminating machine that holds the substrate by suction and suction means excluding the electrostatic chuck can be used as it is to provide an electrostatic chuck function.
  • the adsorption performance can be improved.
  • the invention of claim 2 forms a gap for static elimination between the surface of the electrostatic chuck and the substrate by the separating means, and the electrode of the electrostatic chuck By inducing an electric field by varying the voltage of the part, a part of the atmospheric gas such as air is instantaneously ionized and ionized in this electric field part, and these neutralize the charge remaining on the substrate B.
  • the holding plate of a substrate bonding machine that holds and holds substrates by suction suction means other than electrostatic chucks can be provided with a static elimination function to prevent destruction of devices on the substrate due to peeling charging. It becomes possible.
  • the invention of claim 3 fluctuates the voltage of the electrode portion of the electrostatic chuck in the atmosphere where the substrate is separated from the electrostatic chuck or in a predetermined low vacuum. Then, by inducing an electric field, a part of atmospheric gas such as air is instantaneously ionized and ionized in this electric field portion, and these neutralize charges remaining on the substrate.
  • the peeling charge generated on the substrate along with the peeling can be neutralized by the position force away from the electrostatic chuck.
  • the holding plate of a substrate bonding machine that holds and holds substrates by suction suction means other than electrostatic chucks can be provided with a static elimination function to prevent destruction of devices on the substrate due to peeling charging. It becomes possible.
  • LCD liquid crystal display
  • PDP plasma display
  • This substrate bonding machine is a fixed plate formed in a flat plate shape that does not deform (stagnate) with a rigid body such as metal or ceramics as shown in Figs. 1 (a) to 1 (c).
  • a pair of upper and lower holding plates 1, 1 ′ which is a board force, is arranged, and the two substrates A and B are detachably held on the parallel opposing surfaces of these upper and lower holding plates 1, 1 ′.
  • the upper and lower holding plates 1, ⁇ ' are relatively adjusted and moved in the ⁇ ⁇ direction (horizontal direction in the drawing) to obtain substrates A and B.
  • the substrates A and B After aligning each other, at least one of the substrates A and B is peeled off and overlapped by the smooth surface force of the upper and lower holding plates 1, ⁇ ', and then the vacuum break in the vacuum chamber S is performed.
  • the pressure difference between the substrates A and B is pressurized to a predetermined gap by the pressure difference generated between the substrates A and B.
  • the upper and lower holding plates 1, ⁇ 'as shown by the solid line in FIG. 1 (a) can be moved relatively in the Z direction (vertical direction in the drawing) by lifting means (not shown).
  • the substrates A and B transferred by a transfer robot are set on the respective smooth surfaces with the upper and lower holding plates 1 being separated in the vertical direction. Each is retained.
  • the horizontal holding means (not shown) is operated to operate the upper and lower holding plates 1. , 1 'can be adjusted and moved in the XY 0 direction with respect to the other. Rough alignment and fine alignment are sequentially performed as alignment between the held substrates A and B.
  • either one or both of the above-described substrate-side surfaces la and la 'of the upper and lower holding plates 1, 1' that are parallel to each other is used as a chuck device for a substrate bonding machine according to the present invention.
  • the electrostatic chuck 2 formed in the shape of a thin film or thin film is detachably adhered, and one or both of the upper and lower substrates A and B are electrostatically attracted by the electrostatic adsorption force of the thin plate or film-like electrostatic chuck 2
  • the alignment operation of the substrates A and B described above is performed, and the bonding operation of the substrates A and B described above is performed by stopping and peeling off the electrostatic chucking function of one of the electrostatic chucks 2. Is done.
  • the electrostatic chuck 2 is a dielectric 2a formed in a smooth thin plate or thin film with an insulating organic material such as polyimide, polyetheretherketone (PEEK), or polyethylene naphthalate (PEN).
  • an electrode portion 2b that also becomes a conductive paste or a conductive foil cover patterned by screen printing or the like is integrally laminated therein.
  • the electrode portion 2b is formed to be insulated from the surroundings, and is connected to a power source (not shown) for applying a voltage thereto.
  • bipolar electrostatic chuck in which two or more electrode portions 2b are embedded in, for example, a comb shape.
  • an adhesive material is a magnet or a mechanical material. Wonta Attach it so that it cannot be misaligned using a coupling mechanism.
  • the outer peripheral edge of the electrostatic chuck 2 or a mounting portion formed continuously therewith can be formed larger than the substrate side surface la, la 'and can be bent and attached to the side surface. is there.
  • FIGS. 2 (a) and 2 (b) At least the lower holding plate! / And the lower electrostatic chuck ⁇ , a plurality of through-holes 3 as shown in FIGS. 2 (a) and 2 (b) are formed in a straight line in the Z (vertical) direction.
  • the lower substrate B is pushed up by lowering the surface force of the lower electrostatic chuck 2 by controlling the operation so that the gas or other fluid such as nitrogen gas or air is jetted upward.
  • a slight clearance S1 of about 2 to 3 mm, for example, is formed between the back surface B1 of B.
  • the lower electrostatic chuck is formed in the atmosphere or in a predetermined low vacuum in which a gap S1 is formed between the surface of the lower electrostatic chuck 2 and the rear surface B1 of the lower substrate B by the separating means 4.
  • a high voltage is applied between two or more electrode parts 2b embedded in 2 from a high voltage power source (not shown), and is applied during electrostatic chucking of the lower substrate B.
  • This Example 1 is a thin plate on the substrate-side surfaces la and la 'of the upper and lower holding plates 1, 1' as shown in Figs. 1 (&) to (ji) and Fig. 2 (&) (b).
  • the thin-film electrostatic chuck 2 is detachably bonded to each other, and both the upper and lower substrates A and B are electrostatically attracted by the electrostatic adsorption force of the thin plate-like or film-like electrostatic chuck 2, as described above.
  • the alignment operation and the bonding operation are performed in a vacuum, and the upper and lower substrates A and B, which have been bonded, are pushed up by the surface force of the lower electrostatic chuck 2 and between the lower surface B1 of the lower substrate B.
  • Fig. 9 shows a case where the static electricity is removed by forming a slight static elimination gap S1 of about 2 to 3 mm, for example.
  • a pedestal (base) having a rigid body force is provided on the smooth surfaces of the upper and lower holding plates 1, which face each other in parallel. It is preferable that the electrostatic chuck 2 is attached by an adhesive means, with lb, 1W protruding and having a smooth base surface at the tip surface as the substrate side surface la, la ′.
  • At least a base lb 'of the lower holding plate 1' is opened with a plurality of through holes 3 in which the separating means 4 is provided.
  • suction holes 5a are provided at appropriate intervals on the bases lb, 11 of the upper and lower holding plates 1, as suction suction means 5 for sucking and holding in the atmosphere. Is connected to a suction source (not shown) such as a vacuum pump.
  • the electrostatic chuck 2 is also opposed to each suction hole 5a and the through-holes 2c. Open the doors to communicate with each other.
  • a thin plate or thin film electrostatic chuck 2 is supported on a base lb of the upper holding plate 1 by a guide means (not shown) so as to be reciprocally movable in the vertical direction.
  • the upper electrostatic chuck 2 is drawn toward the smooth substrate side surface la of the pedestal lb to attach it detachably, and the isolation means for separating the electrostatic chuck 2 from the substrate side surface la.
  • Means 7 are provided.
  • the adhering means 6 includes, for example, a magnet 6a such as a permanent magnet or an electromagnet, and a magnetic field between the surface la on the substrate side of the upper holding plate 1 and the surface of the upper electrostatic chuck 2 facing the upper surface la.
  • a magnet attracted by the magnet and a magnetic body 6b such as a metal formed into a film by sputtering or the like are fixedly arranged.
  • the separating means 7 is directed toward the surface of the upper electrostatic chuck 2 from the suction hole 5a of the suction suction means 5 provided on the substrate side surface la of the upper holding plate 1, for example, nitrogen gas or air.
  • a force that injects gas or other fluid and presses the electrostatic chuck 2, or the electrostatic chuck 2 is pressed by a driving body that reciprocates up and down, such as an air cylinder,
  • a driving body that reciprocates up and down, such as an air cylinder
  • the electrostatic chuck in the form of a thin plate or thin film toward the substrate side surface la of the upper holding plate 1 by the operation of the suction adsorption means 5 or the adhesion means 6 2 and pulling the upper and lower substrates A and B transferred by the transfer robot in this state along the smooth substrate side surface la, and the upper electrostatic chuck attached to the upper holding surface la. 2 and the lower electrostatic chuck 2 mounted on the substrate-side surface 1 of the lower holding plate, respectively, are electrostatically attracted and held.
  • the surface of the electrostatic chuck 2 such as the dielectric 2a is formed by sandwiching the cullet between the electrostatic chucks 2 and 2 along with the electrostatic adsorption between the upper and lower substrates A and B. May break down and break down.
  • the upper and lower holding plates 1, 1 ′ are moved closer to each other by the operation of the elevating means as shown by a two-dot chain line in FIG. 1 (a) to form a vacuum chamber S, and the inside of the vacuum chamber S is predetermined.
  • the upper and lower holding plates 1, ⁇ ' are adjusted and moved relative to each other in the ⁇ direction, and the upper and lower substrates A and B are aligned.
  • the electrostatic chuck 2 above the substrate-side surface la of the upper holding plate 1 is moved upward by the operation of the separating means 7 as shown in FIG.
  • the substrate A is pulled away while being electrostatically attracted, and the upper substrate A is moved toward the lower substrate B.
  • the upper and lower substrates A and B are instantaneously pressed with the annular adhesive C interposed therebetween, and the two are sealed and overlapped.
  • the inside of the vacuum chamber S is returned to the atmospheric pressure, and the pressure is evenly applied by the pressure difference generated inside and outside of both the substrates A and B.
  • the pressure difference generated inside and outside the both substrates A and B reaches the predetermined gap.
  • the bonding process is completed by crushing.
  • the residual suction force of the upper electrostatic chuck 2 is extremely reduced by passing through the Paschen discharge region where the degree of vacuum in the vacuum chamber S is about several tens of Pa to several thousand Pa. .
  • the upper substrate A held by the adhesive force of the annular adhesive C and the upper electrostatic chuck 2 may come in contact with each other, and may be difficult to peel off.
  • the upper electrostatic chuck 2 from which the surface force of the upper substrate A is peeled adheres to the upper base surface la, and thereafter, the upper and lower holding plates 1, 1 'are separated from each other by the operation of the lifting means. Move in the direction to return to the initial state.
  • the surface material of the electrostatic chuck 2 is applied to the rear surface B1 of the lower substrate B.
  • the charge corresponding to the difference in the charge train between the material of the lower substrate B and the lower substrate B is caused by the peeling charge S that accumulates on the back surface B1 of the lower substrate B.
  • This static electricity varies depending on the size and processing conditions of the lower substrate B.
  • the voltage may be 20 KV or more as a ground voltage, and when this accumulated charge is discharged, the substrates A and B Devices such as TFT elements formed above may be destroyed, and the device characteristics may change partially even without destruction.
  • the upper and lower substrates A and B that have completed the bonding process are opened on the substrate-side surface 1 of the lower holding plate and the lower electrostatic chuck 2 as shown in FIGS. 2 (a) and 2 (b).
  • the upper and lower substrates that have been bonded together by raising the lift pin from the plurality of perforated holes 3 as the separating means 4 or by jetting a gas or other fluid such as nitrogen gas or air upward, for example.
  • the surface force of the lower electrostatic chuck 2 is also pushed up by A and B, and a slight clearance S1 of about 2 to 3 mm, for example, is formed between the lower substrate B and the back surface B1.
  • an electric field (specifically an alternating electric field) is induced in the vicinity thereof.
  • the gap between the surface of the lower bipolar electrostatic chuck 2 and the lower surface B1 of the lower substrate B with the lift pin of the separating means 4 is about 2 mm
  • the applied voltage is ⁇ 2500 V
  • the withstand voltage of the lower board B decreased to about 1/3, and it decreased to about 1/3 each time it was performed again.
  • the charging voltage can be drastically reduced in a short time. It was.
  • the substrate bonding machine for bonding two substrates A and B in a vacuum has been described.
  • the present invention is not limited to this, and the substrate for bonding substrates A and B in the atmosphere. Even in this case, the same effect as that of the above-described vacuum bonding machine can be obtained.
  • a thin plate-like or thin-film-like electrostatic is applied to the substrate side surface la of the upper holding plate 1.
  • the chuck 2 is supported so that it can reciprocate in the vertical direction, and the upper substrate A is moved toward the lower substrate B by separating the upper electrostatic chuck 2 while the upper substrate A is electrostatically attracted.
  • both substrates A and B are bonded together with agent C, the present invention is not limited to this. Both substrates A and B may be overlapped by other bonding methods that do not move the upper electrostatic chuck 2 up and down. .
  • FIG. 1 is a longitudinal front view showing an embodiment of a chuck device for a substrate bonding machine of the present invention, and (a) to (c) show a method for bonding substrates together in the order of steps.
  • FIG. 2 A longitudinal front view showing the state of static elimination, and (a) and (b) are shown in order of operation steps.

Abstract

La présente invention concerne un mandrin électrostatique qui peut être placé sur la surface côté substrat d'un plaque de support de façon interchangeable et ce, sans impliquer aucune modification à la surface. Des mandrins électrostatiques (2) en forme de plaque mince ou de membrane sont respectivement attirés de façon détachable sur les surfaces côté substrat (1a, 1a') des plaques de support (1, 1'). Les surfaces côté substrat (1a, 1a') des plaques de support (1, 1') faisant partie intégrante des mandrins électrostatiques (2) de type plaque mince ou membrane, les substrats (A, B) sont maintenus de façon amovible par une force d'attraction électrostatique des mandrins électrostatiques (2) de type plaque mince ou membrane et il est possible de détacher facilement les mandrins électrostatiques (2) de type plaque mince des surfaces côté substrat (1a, 1a') des plaques de support (1, 1').
PCT/JP2006/319541 2006-09-29 2006-09-29 Dispositif à mandrin pour machine de liaison de substrat et procédé de neutralisation de charges sur un substrat WO2008041294A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/JP2006/319541 WO2008041294A1 (fr) 2006-09-29 2006-09-29 Dispositif à mandrin pour machine de liaison de substrat et procédé de neutralisation de charges sur un substrat

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2006/319541 WO2008041294A1 (fr) 2006-09-29 2006-09-29 Dispositif à mandrin pour machine de liaison de substrat et procédé de neutralisation de charges sur un substrat

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WO2008041294A1 true WO2008041294A1 (fr) 2008-04-10

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PCT/JP2006/319541 WO2008041294A1 (fr) 2006-09-29 2006-09-29 Dispositif à mandrin pour machine de liaison de substrat et procédé de neutralisation de charges sur un substrat

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150274420A1 (en) * 2012-10-22 2015-10-01 Grenzebach Maschinenbau Gmbh Apparatus and method for quickly transferring plates

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000025948A (ja) * 1998-07-10 2000-01-25 Yaskawa Electric Corp 静電浮上搬送装置
WO2005041156A1 (fr) * 2003-10-23 2005-05-06 Shin-Etsu Engineering Co., Ltd. Procede de scellement de substrats pendant l'empilement

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000025948A (ja) * 1998-07-10 2000-01-25 Yaskawa Electric Corp 静電浮上搬送装置
WO2005041156A1 (fr) * 2003-10-23 2005-05-06 Shin-Etsu Engineering Co., Ltd. Procede de scellement de substrats pendant l'empilement

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150274420A1 (en) * 2012-10-22 2015-10-01 Grenzebach Maschinenbau Gmbh Apparatus and method for quickly transferring plates

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