TWI266264B - Packaging method for overlapped substrates - Google Patents

Packaging method for overlapped substrates

Info

Publication number
TWI266264B
TWI266264B TW093120525A TW93120525A TWI266264B TW I266264 B TWI266264 B TW I266264B TW 093120525 A TW093120525 A TW 093120525A TW 93120525 A TW93120525 A TW 93120525A TW I266264 B TWI266264 B TW I266264B
Authority
TW
Taiwan
Prior art keywords
electrostatic suction
substrate
upper substrate
enforcing
posture
Prior art date
Application number
TW093120525A
Other languages
Chinese (zh)
Other versions
TW200517700A (en
Inventor
Noriyuki Takefushi
Yasuyuki Koga
Hideki Oshima
Ryoichi Inaba
Original Assignee
Shinetsu Eng Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinetsu Eng Co Ltd filed Critical Shinetsu Eng Co Ltd
Publication of TW200517700A publication Critical patent/TW200517700A/en
Application granted granted Critical
Publication of TWI266264B publication Critical patent/TWI266264B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
    • H01J9/24—Manufacture or joining of vessels, leading-in conductors or bases
    • H01J9/26—Sealing together parts of vessels
    • H01J9/261—Sealing together parts of vessels the vessel being for a flat panel display
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1339—Gaskets; Spacers; Sealing of cells

Landscapes

  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Optics & Photonics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Mathematical Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Liquid Crystal (AREA)
  • Wrapping Of Specific Fragile Articles (AREA)
  • Gas-Filled Discharge Tubes (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Manufacture Of Electron Tubes, Discharge Lamp Vessels, Lead-In Wires, And The Like (AREA)

Abstract

The present invention relates to a packaging method for overlapped substrates, which is to release the linkage of holding the upper substrate (A) by the electrostatic suction mechanism (5b), and to inject gas (G) from the back of the upper substrate; by injecting the gas between the electrostatic suction surface (5b1) of the upper holding plate (1) and the back of the upper substrate, destroy the tight bonding between the electrostatic suction surface and the substrate surface to separate them; then, with enforcing deterioration to eliminate the electrostatic suction force between them; and, with the pressure of gas injection, generate the falling acceleration by enforcing the falling force on the lower substrate (B); thus, instantly the upper substrate will be contacted with the lower substrate, and the upper substrate is held at the posture by the electrostatic suction mechanism (5b), and moved and pressed onto the lower substrate without changing posture to overlap with the upper and lower substrates seamlessly. Therefore, the process can be irrelevant to the release of electrostatic suction force, and enforcing the upper substrate to fall under the posture with the aligned position.
TW093120525A 2003-10-23 2004-07-08 Packaging method for overlapped substrates TWI266264B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2003/013536 WO2005041156A1 (en) 2003-10-23 2003-10-23 Method for sealing substrates while stacking

Publications (2)

Publication Number Publication Date
TW200517700A TW200517700A (en) 2005-06-01
TWI266264B true TWI266264B (en) 2006-11-11

Family

ID=34509566

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093120525A TWI266264B (en) 2003-10-23 2004-07-08 Packaging method for overlapped substrates

Country Status (6)

Country Link
JP (1) JP3721378B2 (en)
KR (1) KR100938192B1 (en)
CN (1) CN100426338C (en)
AU (1) AU2003275604A1 (en)
TW (1) TWI266264B (en)
WO (1) WO2005041156A1 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008041293A1 (en) * 2006-09-29 2008-04-10 Shin-Etsu Engineering Co., Ltd. Work transferring method, electrostatic chuck device, and board joining method
WO2008041294A1 (en) * 2006-09-29 2008-04-10 Shin-Etsu Engineering Co., Ltd. Chuck device for substrate bonding machine and method of neutralizing charges on substrate
JP2008134439A (en) * 2006-11-28 2008-06-12 Matsushita Electric Ind Co Ltd Flat panel supplying method and flat panel assembling apparatus
JP5308725B2 (en) * 2008-06-17 2013-10-09 スタンレー電気株式会社 Substrate bonding method
KR101182172B1 (en) * 2010-10-18 2012-09-12 에이피시스템 주식회사 Apparatus for fabricating flexible liquid crystal display
CN108602342B (en) * 2016-10-17 2020-06-12 信越工程株式会社 Vacuum laminating device for laminating device
CN108890680A (en) * 2018-08-23 2018-11-27 苏州软体机器人科技有限公司 A kind of actuator carrying out grasping movement using Electrostatic Absorption effect

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06235896A (en) * 1993-02-08 1994-08-23 Ropuko:Kk Contactless pressure sticking method
JP2002090703A (en) * 2000-09-13 2002-03-27 Sharp Corp Apparatus and method for assembling substrate for liquid crystal
JP4690572B2 (en) * 2000-11-30 2011-06-01 キヤノンアネルバ株式会社 Substrate overlay device
JP3742000B2 (en) * 2000-11-30 2006-02-01 富士通株式会社 Press machine
JP3458145B2 (en) * 2001-04-17 2003-10-20 株式会社 日立インダストリイズ Substrate bonding method and apparatus
CN100456088C (en) * 2002-02-05 2009-01-28 乐金显示有限公司 LCD adhesion machine and method for producing LCD with the same adhering machine
TW583428B (en) * 2002-02-22 2004-04-11 Shibaura Mechatronics Corp Substrate laminating apparatus and method
JP3693972B2 (en) * 2002-03-19 2005-09-14 富士通株式会社 Bonded substrate manufacturing apparatus and substrate bonding method

Also Published As

Publication number Publication date
CN1692388A (en) 2005-11-02
TW200517700A (en) 2005-06-01
AU2003275604A1 (en) 2005-05-11
WO2005041156A1 (en) 2005-05-06
JPWO2005041156A1 (en) 2007-03-29
JP3721378B2 (en) 2005-11-30
KR100938192B1 (en) 2010-01-21
CN100426338C (en) 2008-10-15
KR20060093357A (en) 2006-08-25

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