WO2006022597A3 - Supply mechanism for the chuck of an integrated circuit dicing device - Google Patents

Supply mechanism for the chuck of an integrated circuit dicing device Download PDF

Info

Publication number
WO2006022597A3
WO2006022597A3 PCT/SG2005/000288 SG2005000288W WO2006022597A3 WO 2006022597 A3 WO2006022597 A3 WO 2006022597A3 SG 2005000288 W SG2005000288 W SG 2005000288W WO 2006022597 A3 WO2006022597 A3 WO 2006022597A3
Authority
WO
WIPO (PCT)
Prior art keywords
integrated circuit
chuck
chuck table
supply mechanism
dicing device
Prior art date
Application number
PCT/SG2005/000288
Other languages
French (fr)
Other versions
WO2006022597A2 (en
Inventor
Hae Choon Yang
Original Assignee
Rokko Systems Pte Ltd
Hae Choon Yang
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from SG200405166A external-priority patent/SG120197A1/en
Priority claimed from SG200501802A external-priority patent/SG125997A1/en
Priority claimed from SG200505056A external-priority patent/SG129327A1/en
Application filed by Rokko Systems Pte Ltd, Hae Choon Yang filed Critical Rokko Systems Pte Ltd
Priority to US11/660,940 priority Critical patent/US7829383B2/en
Priority to MX2007002281A priority patent/MX2007002281A/en
Priority to JP2007529785A priority patent/JP5140428B2/en
Priority to EP05771606.0A priority patent/EP1789998B1/en
Priority to KR1020077004327A priority patent/KR101299322B1/en
Publication of WO2006022597A2 publication Critical patent/WO2006022597A2/en
Publication of WO2006022597A3 publication Critical patent/WO2006022597A3/en
Priority to US12/895,342 priority patent/US7939374B2/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • B28D5/0094—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work the supporting or holding device being of the vacuum type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67754—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a batch of workpieces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Dicing (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

A system for dicing substrates to singulate integrated circuit units includes a dicing machine (Z) which operates with a chuck table (4). A lifting assembly (Ax, Ay) deposits substrates to be singulated onto the chuck table (4) at substantially the same time as it removes previously singulated units from the chuck table (4). Also disclosed is a support device fixing the diced chips by vacuum to an insert of a soft material.
PCT/SG2005/000288 2004-08-23 2005-08-23 Supply mechanism for the chuck of an integrated circuit dicing device WO2006022597A2 (en)

Priority Applications (6)

Application Number Priority Date Filing Date Title
US11/660,940 US7829383B2 (en) 2004-08-23 2005-08-23 Supply mechanism for the chuck of an integrated circuit dicing device
MX2007002281A MX2007002281A (en) 2004-08-23 2005-08-23 Supply mechanism for the chuck of an integrated circuit dicing device.
JP2007529785A JP5140428B2 (en) 2004-08-23 2005-08-23 Supply mechanism for chuck of integrated circuit dicing machine
EP05771606.0A EP1789998B1 (en) 2004-08-23 2005-08-23 Supply mechanism for the chuck of an integrated circuit dicing device
KR1020077004327A KR101299322B1 (en) 2004-08-23 2005-08-23 Supply mechanism for the chuck of an integrated circuit dicing device
US12/895,342 US7939374B2 (en) 2004-08-23 2010-09-30 Supply mechanism for the chuck of an integrated circuit dicing device

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
SG200405166A SG120197A1 (en) 2004-08-23 2004-08-23 Supply mechanism for the chuck of an integrated circuit dicing device
SG200405166-0 2004-08-23
SG200501802A SG125997A1 (en) 2005-03-22 2005-03-22 Improved chuck table for an integrated circuit dicing device
SG200501802-3 2005-03-22
SG200505056-2 2005-07-15
SG200505056A SG129327A1 (en) 2005-07-15 2005-07-15 Improved method and apparatus for an integrated circuit dicing device

Related Child Applications (2)

Application Number Title Priority Date Filing Date
US11/660,940 A-371-Of-International US7829383B2 (en) 2004-08-23 2005-08-23 Supply mechanism for the chuck of an integrated circuit dicing device
US12/895,342 Division US7939374B2 (en) 2004-08-23 2010-09-30 Supply mechanism for the chuck of an integrated circuit dicing device

Publications (2)

Publication Number Publication Date
WO2006022597A2 WO2006022597A2 (en) 2006-03-02
WO2006022597A3 true WO2006022597A3 (en) 2006-08-31

Family

ID=35967934

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/SG2005/000288 WO2006022597A2 (en) 2004-08-23 2005-08-23 Supply mechanism for the chuck of an integrated circuit dicing device

Country Status (8)

Country Link
US (2) US7829383B2 (en)
EP (1) EP1789998B1 (en)
JP (1) JP5140428B2 (en)
KR (1) KR101299322B1 (en)
CN (1) CN101969038B (en)
MY (1) MY146842A (en)
TW (1) TWI387053B (en)
WO (1) WO2006022597A2 (en)

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SG136833A1 (en) * 2006-05-02 2007-11-29 Rokko Systems Pte Ltd An improved net table
US8011058B2 (en) * 2006-10-31 2011-09-06 Asm Assembly Automation Ltd Singulation handler system for electronic packages
SG142198A1 (en) * 2006-11-03 2008-05-28 Rokko Systems Pte Ltd A unit lifter assembly
SG143079A1 (en) * 2006-11-14 2008-06-27 Rokko Systems Pte Ltd Net block assembly
US8167523B2 (en) * 2007-07-12 2012-05-01 Asm Assembly Automation Ltd Singulation handler comprising vision system
JP2009200089A (en) * 2008-02-19 2009-09-03 Towa Corp Cutting method and device for substrate
SG156539A1 (en) * 2008-04-14 2009-11-26 Rokko Ventures Pte Ltd A system and process for dicing integrated circuits
NL2001790C2 (en) * 2008-07-11 2010-01-12 Fico Bv Device and method for cutting electronic components.
SG172499A1 (en) 2009-12-23 2011-07-28 Rokko Systems Pte Ltd Assembly and method for ic unit engagement
JP5657935B2 (en) * 2010-07-08 2015-01-21 株式会社ディスコ Cutting equipment
KR101594965B1 (en) * 2010-09-10 2016-02-18 한미반도체 주식회사 Apparatus for Singulation Processing of Semiconductor Package
KR20120108229A (en) * 2011-03-23 2012-10-05 삼성디스플레이 주식회사 Work table for laser processing
KR101411157B1 (en) * 2012-07-31 2014-06-23 세메스 주식회사 Apparatus for processing a substrate
KR101373393B1 (en) * 2012-07-31 2014-03-13 세메스 주식회사 Rotatable rail for transferring a substrate
ITTV20130048A1 (en) * 2013-04-10 2014-10-11 Dario Toncelli MATERIAL CUTTING MACHINE IN SLAB
WO2016024917A1 (en) * 2014-08-13 2016-02-18 Rokko Systems Pte Ltd Apparatus and method for processing sputtered ic units
CN106206392B (en) * 2015-05-07 2021-04-30 梭特科技股份有限公司 Die positioning and arranging equipment and die positioning and arranging method
TWI577624B (en) 2016-09-30 2017-04-11 均豪精密工業股份有限公司 Warpage plate transporting logistics system
CN107195580B (en) * 2017-05-23 2023-05-05 商洛学院 Dual-purpose MOCVD substrate holder tray structure capable of synchronously growing on different substrate blocks
US11107716B1 (en) * 2020-02-06 2021-08-31 Pyxis Cf Pte. Ltd. Automation line for processing a molded panel
KR102274543B1 (en) * 2020-03-20 2021-07-07 ㈜토니텍 saw & placement system
CN112739003B (en) * 2020-11-09 2022-04-26 昆山丘钛光电科技有限公司 Method and device for dividing FPC (Flexible printed Circuit) connecting board
TWI820522B (en) * 2020-12-15 2023-11-01 新加坡商洛克系统私人有限公司 Method and system for ic unit singulation and sorting
KR20230135661A (en) * 2021-03-18 2023-09-25 토와 가부시기가이샤 Processing equipment and manufacturing methods of processed products

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US5953590A (en) * 1996-11-26 1999-09-14 Micron Technology, Inc. Method and apparatus to hold integrated circuit chips onto a chuck and to simultaneously remove multiple integrated circuit chips from a cutting chuck
WO2001085367A1 (en) * 2000-05-08 2001-11-15 Avalon Technology Pte Ltd Singulation and sorting system for electronic devices
WO2003095169A1 (en) * 2002-05-03 2003-11-20 Primeca Pte Ltd Bi-directional singulation saw system and method

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WO2001085367A1 (en) * 2000-05-08 2001-11-15 Avalon Technology Pte Ltd Singulation and sorting system for electronic devices
WO2003095169A1 (en) * 2002-05-03 2003-11-20 Primeca Pte Ltd Bi-directional singulation saw system and method

Also Published As

Publication number Publication date
US20080213975A1 (en) 2008-09-04
EP1789998A4 (en) 2011-09-14
US7829383B2 (en) 2010-11-09
WO2006022597A2 (en) 2006-03-02
JP5140428B2 (en) 2013-02-06
EP1789998A2 (en) 2007-05-30
TWI387053B (en) 2013-02-21
CN101969038B (en) 2012-02-15
KR20070048737A (en) 2007-05-09
CN101969038A (en) 2011-02-09
US20110021003A1 (en) 2011-01-27
KR101299322B1 (en) 2013-08-26
US7939374B2 (en) 2011-05-10
MY146842A (en) 2012-09-28
JP2008511164A (en) 2008-04-10
EP1789998B1 (en) 2014-04-09

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