SG120197A1 - Supply mechanism for the chuck of an integrated circuit dicing device - Google Patents

Supply mechanism for the chuck of an integrated circuit dicing device

Info

Publication number
SG120197A1
SG120197A1 SG200405166A SG200405166A SG120197A1 SG 120197 A1 SG120197 A1 SG 120197A1 SG 200405166 A SG200405166 A SG 200405166A SG 200405166 A SG200405166 A SG 200405166A SG 120197 A1 SG120197 A1 SG 120197A1
Authority
SG
Singapore
Prior art keywords
chuck
integrated circuit
supply mechanism
dicing device
circuit dicing
Prior art date
Application number
SG200405166A
Inventor
Choon Yang Hae
Original Assignee
Rokko Systems Pte Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rokko Systems Pte Ltd filed Critical Rokko Systems Pte Ltd
Priority to SG200405166A priority Critical patent/SG120197A1/en
Priority to CN2008101896980A priority patent/CN101459056B/en
Priority to MX2007002281A priority patent/MX2007002281A/en
Priority to TW094128727A priority patent/TWI387053B/en
Priority to PCT/SG2005/000288 priority patent/WO2006022597A2/en
Priority to MYPI20053939A priority patent/MY146842A/en
Priority to CN2010101501235A priority patent/CN101969038B/en
Priority to US11/660,940 priority patent/US7829383B2/en
Priority to SG200801530-7A priority patent/SG140606A1/en
Priority to KR1020077004327A priority patent/KR101299322B1/en
Priority to CNB200580034750XA priority patent/CN100521101C/en
Priority to JP2007529785A priority patent/JP5140428B2/en
Priority to EP05771606.0A priority patent/EP1789998B1/en
Publication of SG120197A1 publication Critical patent/SG120197A1/en
Priority to US12/895,342 priority patent/US7939374B2/en

Links

SG200405166A 2004-08-23 2004-08-23 Supply mechanism for the chuck of an integrated circuit dicing device SG120197A1 (en)

Priority Applications (14)

Application Number Priority Date Filing Date Title
SG200405166A SG120197A1 (en) 2004-08-23 2004-08-23 Supply mechanism for the chuck of an integrated circuit dicing device
US11/660,940 US7829383B2 (en) 2004-08-23 2005-08-23 Supply mechanism for the chuck of an integrated circuit dicing device
SG200801530-7A SG140606A1 (en) 2004-08-23 2005-08-23 Supply mechanism for the chuck of an integrated circuit dicing device
TW094128727A TWI387053B (en) 2004-08-23 2005-08-23 Supply mechanism for the chuck of an integrated circuit dicing device
PCT/SG2005/000288 WO2006022597A2 (en) 2004-08-23 2005-08-23 Supply mechanism for the chuck of an integrated circuit dicing device
MYPI20053939A MY146842A (en) 2004-08-23 2005-08-23 Supply mechanism for the chuck of an integrated circuit dicing device
CN2010101501235A CN101969038B (en) 2004-08-23 2005-08-23 Supporting arrangement for a group of integrated circuit units
CN2008101896980A CN101459056B (en) 2004-08-23 2005-08-23 System and method for cutting substrate to produce separation unit
MX2007002281A MX2007002281A (en) 2004-08-23 2005-08-23 Supply mechanism for the chuck of an integrated circuit dicing device.
KR1020077004327A KR101299322B1 (en) 2004-08-23 2005-08-23 Supply mechanism for the chuck of an integrated circuit dicing device
CNB200580034750XA CN100521101C (en) 2004-08-23 2005-08-23 System and method for cutting an integrated circuit device
JP2007529785A JP5140428B2 (en) 2004-08-23 2005-08-23 Supply mechanism for chuck of integrated circuit dicing machine
EP05771606.0A EP1789998B1 (en) 2004-08-23 2005-08-23 Supply mechanism for the chuck of an integrated circuit dicing device
US12/895,342 US7939374B2 (en) 2004-08-23 2010-09-30 Supply mechanism for the chuck of an integrated circuit dicing device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SG200405166A SG120197A1 (en) 2004-08-23 2004-08-23 Supply mechanism for the chuck of an integrated circuit dicing device

Publications (1)

Publication Number Publication Date
SG120197A1 true SG120197A1 (en) 2006-03-28

Family

ID=36586224

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200405166A SG120197A1 (en) 2004-08-23 2004-08-23 Supply mechanism for the chuck of an integrated circuit dicing device

Country Status (2)

Country Link
CN (2) CN100521101C (en)
SG (1) SG120197A1 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG156539A1 (en) * 2008-04-14 2009-11-26 Rokko Ventures Pte Ltd A system and process for dicing integrated circuits
SG172499A1 (en) * 2009-12-23 2011-07-28 Rokko Systems Pte Ltd Assembly and method for ic unit engagement
EP2777069A4 (en) * 2011-11-08 2015-01-14 Intevac Inc Substrate processing system and method
US10907247B2 (en) * 2014-08-13 2021-02-02 Rokko Systems Pte Ltd Apparatus and method for processing sputtered IC units
CN108351379A (en) * 2016-01-15 2018-07-31 罗斯柯公司 For by overturning the method and apparatus that the device under test is loaded on tester and is unloaded from tester
CN110931413B (en) * 2018-09-20 2022-03-04 北京华卓精科科技股份有限公司 Electrostatic chuck separating device
KR102484237B1 (en) * 2020-11-06 2023-01-04 ㈜토니텍 Mounter cutting device for semiconductor package

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4688540A (en) * 1984-12-27 1987-08-25 Disco Abrasive Systems, Ltd. Semiconductor wafer dicing machine
US5803797A (en) * 1996-11-26 1998-09-08 Micron Technology, Inc. Method and apparatus to hold intergrated circuit chips onto a chuck and to simultaneously remove multiple intergrated circuit chips from a cutting chuck
US6196532B1 (en) * 1999-08-27 2001-03-06 Applied Materials, Inc. 3 point vacuum chuck with non-resilient support members

Also Published As

Publication number Publication date
CN101459056B (en) 2010-09-15
CN101459056A (en) 2009-06-17
CN101069270A (en) 2007-11-07
CN100521101C (en) 2009-07-29

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