CN101459056A - Supply mechanism for the chuck of an integrated circuit dicing device - Google Patents
Supply mechanism for the chuck of an integrated circuit dicing device Download PDFInfo
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- CN101459056A CN101459056A CNA2008101896980A CN200810189698A CN101459056A CN 101459056 A CN101459056 A CN 101459056A CN A2008101896980 A CNA2008101896980 A CN A2008101896980A CN 200810189698 A CN200810189698 A CN 200810189698A CN 101459056 A CN101459056 A CN 101459056A
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Abstract
The invention relates to a supply mechanism used for a chuck of integrated circuit cutter device. A system cutting a substrate to form sorting and separating units comprises: a box which arranges the substrate into a guide system, wherein the guide system is communicated with a chuck table device, the chuck table device is appropriate for cutting the substrate into the separating units retained in a preset space allocation, the chuck table device comprises a plurality of chuck tables, the substrate is arranged the plurality of chuck tables, and at least one chuck table is positioned on a single rail and can move on the rail; a cutter device used for separating the units from the substrate; and a retaining device used for retaining the units in the relative position in the preset space allocation corresponding with the positions of the units in the substrate before being separated, wherein the cutter device comprises a cutting blade provided with at least a shaft related to each rail, and at least one cutting-tool is on the shaft; a tipping gear which turns the substrate and at the same time retains the preset space allocation; a net block assembly separating and controlling the single unit; and a sorting and separating device which can effectively separates the separating units.
Description
Technical field
The present invention relates to a kind of cutting and separation system.This system and cutting machine interact or comprise that cutting machine, this cutting machine cutting (" scribing ") form the substrate of many integrated circuits thereon to form single integrated circuit.The invention still further relates to the device that uses in this cutting and the separation system.
Background technology
Usually on Semiconductor substrate, form a plurality of integrated circuits simultaneously, cut substrate then and form single integrated circuit.The device that becomes known for that substrate sent into such cutting machine and be used for the integrated circuit that sorting cuts.
A kind of integrated circuit of increased popularity is the integrated circuit that has a plurality of electrical pickofves in the array on an one interarea (typically be soldered ball, i.e. BGA Package and do not have solder joint in the pin package, promptly quad flat non-pin (QFN) encapsulates).Typically, the substrate to have ball grid array on the substrate surface surface of state cutting up with soldered ball.The known branch selection operation of limited number of times of carrying out on the separation integrated circuit unit is to detect unusual (fault) unit.Adopt camera to carry out this point, separative element passes through below camera.The improvement level of this kind technology is limited at present.Particularly, it trends towards operating on the basis of being criticized by the unit that same substrate produced, if the fault of detecting then integral body abandon this endorsement unit (for example because find that substrate is not too accurate with aiming at of cutting machine line of cut).
In this process, use the device of its upper surface edge contact integrated circuit, the edge in the surface area outside that ball grid array covered controls described unit.Circuit contact there has reduced the danger that welded ball array is produced destruction.Yet this control operation is difficult to realization, and along with the difficulty more that becomes is shunk in reduction of integrated circuit size and ball grid array edge.
Summary of the invention
The present invention aims to provide a kind of novel and useful system to cutting machine supply substrate.
The present invention also provides a kind of novelty and useful diced system, and it comprises the mechanism that is used for to cutting machine supply integrated circuit.
First aspect the invention provides a kind of substrate transfer of cooperating with cutting machine and chuck system, and this system comprises the chuck table with two chuck parts; The driving mechanism that is used for mobile chuck part between the primary importance and the second place; Roughly carry out the lifting subassembly of following operation simultaneously: (i) when the first chuck segment branch is in primary importance, first substrate is placed on described first chuck part and (ii) when the second chuck segment branch is in the second place, partly mentions the separative element of the previous substrate that is cut from second chuck; Described chuck table and driving mechanism can be operated to finish following operation: (i) cooperate with cutting machine with cutting place the primary importance place described chuck part substrate and (ii) this chuck is partly moved to the second place.
Second aspect the invention provides a kind of system of integrated circuit with the formation separative element that be used to cut, and this system comprises cutting machine; Chuck table with two chuck parts; The driving mechanism that is used for mobile chuck part between the primary importance and the second place; Roughly carry out the lifting subassembly of following operation simultaneously: (i) when the first chuck segment branch is in primary importance, first substrate is placed on described first chuck part and (ii) when the second chuck segment branch is in the second place, partly mentions the separative element of the previous substrate that is cut from second chuck; Described chuck table, driving mechanism and cutting machine can be operated the substrate that places the described chuck part at primary importance place with cutting, and this chuck is partly moved to the second place.
The third aspect the invention provides the method that a kind of separation is formed on the integrated circuit unit of substrate interior, and this method comprises: first substrate is placed on the chuck table that is in primary importance; The operation cutting machine to be cutting first substrate, thereby and the operation driving mechanism with mobile chuck table first substrate that is cut is moved to the second place; And roughly carry out (i) simultaneously and mention first substrate that is cut from the chuck table that is in the second place; (ii) second substrate is placed on the chuck table that is in primary importance.
Adopt term " roughly simultaneously " to mean than lifting subassembly and carry out the much smaller time scale of needed time of operation of mentioning and put down substrate.The a kind of of term " roughly simultaneously " may be substrate of release in the 2 second time (perhaps more preferably 1 second) of the unit that separates mentioning.Optionally, in the situation that by suction substrate and separative element is remained on the extraction unit, term " roughly simultaneously " hint is applied to time that the suction force on the separative element increases and is applied to the time-interleaving that the suction force on the separative element reduces.
Typically, chuck table can comprise two parts: receive the first of substrate to be separated and can remove the second portion of separative element from it.Chuck table is preferred rotatable first is caused the position of second portion.
Preferably, lifting subassembly comprises the framework lifting piece with the surface that receives substrate and has the netted lifting piece on the surface that receives separative element.Framework lifting piece and netted lifting piece move at least one direction on chuck table plane together, but preferably towards the chuck table surface with leave independent moving on the direction on chuck table surface.Lifting subassembly can be operated with delivery in the framework lift portion and drop on the chuck table in the substrate, and roughly side by side substrate is placed in the first of chuck table and from the second portion of chuck table and removes separative element.
Lifting subassembly can comprise be arranged on chuck table on the induction element induction element of cooperating, with along with lifting subassembly near chuck table and positioning framework lifting piece and netted lifting piece.In one form, at least one in these induction elements is the projection form, and in these induction elements at least one be form of grooves, to receive this projection.
Lifting subassembly comprises at least one vacuum source and one or more opening in framework lifting piece and netted lifting piece, these openings can be communicated with vacuum source, impel substrate and/or separative element to shift to the negative pressure of framework lifting piece and netted lifting piece respective surfaces with generation.
Lifting subassembly can be configured to be used to comprise the substrate of a plurality of panels, and each panel is made up of a plurality of integrated circuits to be separated.Integrated circuit is preferably the type with electrical pickoff array, for example ball grid array or pad array.Preferably, when the electrical pickoff array towards chuck table time cutting substrate.
Lifting subassembly is preferably along comprising that the ring with upper/lower positions moves: its promote first substrate primary importance, its place first substrate and mention from Unit second of previous cutting separative element chuck table, with and place the placement location of separative element.
Preferably, lifting subassembly moves through a stage or a plurality of stage between chuck table and placement location, separative element processed (for example cleaning) in the described stage.These stages comprise that separative element is subjected to the stage of scratch brushing effect and uses liquid to clean the wash phase of separative element.Preferably, netted lifting piece is inserted cleaning positions, use liquid to clean the separative element that is positioned on the netted lifting piece in this position at wash phase.Preferably be not exposed in the liquid at this stage framework lifting piece.
Preferably, can lifting subassembly be set to along comprising that the ring of lower position moves: its collect first substrate primary importance, its place first substrate and mention from Unit second of previous cutting separative element the position that is right after chuck table, with and place the placement location of separative element.
In the preferred embodiment, this system can comprise the processing unit of one or more processing separative elements.Among the preferred embodiment, one of them described processing unit can be the scratch brushing unit.
Among the preferred embodiment, wherein a kind of described processing unit is the liquid cleaning unit, and this unit cleans separative element when the part of the lifting subassembly that supports separative element is positioned at cleaning positions.
In the preferred embodiment, integrated circuit unit can be included in the electrical pickoff array of avoiding chuck table during the cutting operation.
Fourth aspect the invention provides a kind of substrate of cooperating with cutting machine and transports and chuck system, and this system comprises:
Chuck table with two chuck parts; The driving mechanism that is used for mobile chuck part between the primary importance and the second place; Roughly carry out the lifting subassembly of following operation simultaneously: (i) when the first chuck segment branch is in primary importance, first substrate is placed on described first chuck part and (ii) when the second chuck segment branch is in the second place, partly mentions the separative element of the previous substrate that is cut from second chuck; Chuck table and driving mechanism can be operated to finish following operation: (i) cooperating with cutting machine places first substrate on first chuck part at primary importance place and (ii) first chuck is partly moved to the second place with cutting.
The 5th aspect the invention provides a kind of supporting arrangement that supports one group of integrated circuit unit, and this device comprises scaffold, and described framework has groove array; Be adapted to be mounted within the soft material inserts of scaffold inside, described inserts has to be arranged to when described inserts is installed in described framework inside and frame groove corresponding opening array; Vacuum plant with each described groove and open communication; The corresponding inserts opening in each unit in wherein said group also remains on correct position by vacuum.
In the preferred embodiment, substrate can comprise one or more discrete panels, thereby each panel comprises that a plurality of preparations are by this system's cutting and the described unit that separates.Like this, to be suitable for having the substrate of a plurality of panels or to be used for itself be the substrate of single panel for system according to the present invention.This system can comprise batch processing or approximate continuous processing, can have a plurality of panels by the batch processing substrate, and each panel contains a plurality of unit, also therefore reduces the time of staying of substrate in system by the single panel of this system handles of continuous processing.
This system is applicable to multiple package dimension, from the QFN package design 1 * 1 of minimum to maximum available encapsulation 15 * 15.This point should not limit the scope of the invention, because following available encapsulation may be fit to system of the present invention equally, but still remains the market development.
In the preferred embodiment, this system also can comprise the separator of chuck table upstream.Described separator is suitable for receiving the substrate with many panels, and the predetermined panel quantity that is used to cut based on chuck table to be entered, and the panel of predetermined quantity is separated with initial substrate.
Among the preferred embodiment, separator can have optical recognition system, whereby this system identification when the panel of predetermined quantity through the cutting part of separator, thereby control this system receiving information from recognition system and to guide cutter sweep cutting initial substrate, thereby generate new substrate with predetermined quantity panel.Described predetermined quantity can be any number more than 1 and can be the function of chuck table size or other physical parameter.Selectable, this quantity can be subjected to the influence of the economy of desired per hour unit number.
Be single panel or be in the preferred embodiment of smallest number panel at least at substrate, have the unique advantage of operation lesser amt panel.For example, to given vacuum arrangement, the panel number is few more, and useful especially available negative pressure is just big more during dissection.Therefore under any circumstance, the panel of lesser amt is more stable and improve the quality of dissection, if situation particularly relevant with package size or that require skew to cut.
For being applicable to for example system of single panel of lesser amt panel, reduced the cost of changing existing setting, so crossover tool can become economically feasible to keep this system.
Simulate processed continuously situation for continuous processing or system by single treatment lesser amt panel, if miscut can cut the waste as far as possible.For example, if because miscut appears in disposable incident, the loss that relates to a panel so will be littler when relating to a plurality of panel substrate.
The 6th aspect the invention provides a kind of substrate that cuts to produce the method for sorting separative element, may further comprise the steps: described substrate is installed to guide track system; Through guide track system described substrate is transported to the chuck table device to cut described substrate; Cut described substrate and remain on separative element in the predetermined space configuration with generation; The described substrate that overturns is kept predetermined spatial configuration simultaneously; Transport separative element to net piece (net block) assembly with separately and the control individual unit; And sorting and classification individual unit are with its effective separation.
Therefore, the invention provides complete system with at its front end receiving integrate circuit bar, and transport prepare to use, reprocessing and discarded sorting separative element.This system can be included in single unit system inside, perhaps optionally is included in the modular construction, and connects each step by conveyer.
In the preferred embodiment, cutting step also comprise with substrate pack into be arranged in a plurality of chuck table on the track, along described track move chuck table and through each cutter sweep, use cutter sweep from the substrate separation unit and before corresponding the separation each separative element keep the relative position of separative element in the predetermined space configuration in the position of substrate.
Because the business success of this system per hour is subjected to the significant impact of unit number (UPH) ratio, the relative prior art of embodiment that helps to improve UPH has obvious advantage.Therefore, for the system of this embodiment, cutting bed can comprise a plurality of chuck table and therefore can accept a plurality of bands.
Among the preferred embodiment, this system can have a plurality of tracks, and each track supports a chuck table at least.
In the more preferred embodiment, each track can support a plurality of chuck table.
Among another embodiment, single chuck table can be packed into, move, separate and keep step to minimize the time of delay between these steps according to interleaved order experience.
This embodiment provides interleaved processes and further improves UPH.
In the preferred embodiment, the separative element that is transported to the net block assembly is placed at least one net piece.Optionally, many net pieces are arranged.
Among the preferred embodiment, each net piece is positioned on the independent track.Optionally, each track can support and transport a plurality of net pieces.
Among another embodiment, sorting and classification step comprise determines whether each separative element falls into effective range, invalid scope or definite separative element and whether need reprocessing.
The 7th aspect the invention provides the system that is used to cut substrate and produces the sorting separative element, comprises that this guide track system is communicated with the chuck table device with pack into the box (cassette) of guide track system of described substrate; Described chuck table device is suitable for substrate is cut into the separative element that remains in the predetermined space configuration; The described substrate that overturns keeps the turning device of predetermined space configuration simultaneously; Separate and control the net block assembly of individual unit; And the sorting and the sorter that effectively separate separative element.
In the preferred embodiment, be equipped with above the chuck table device can comprise substrate a plurality of chuck table, from the cutter sweep of substrate separation unit be used for each separative element before corresponding the separation and keep the holding device of the relative position of separative element in predetermined space disposes in the position of substrate.
In another preferred embodiment, each chuck table can be on the independent track and move this chuck table and so mobile substrate to be independent of other chuck table.
Among the preferred embodiment, the chuck table device is suitable for allowing substrate is contained on the chuck table as the function that is independent of the substrate on another chuck table of cutting.
In the preferred embodiment, at least two chuck table are arranged on the independent track, move chuck table and so mobile substrate to be independent of other chuck table.
Among the preferred embodiment, the chuck table device is suitable for allowing substrate is contained on two chuck table at least as the function that is independent of the substrate on the other chuck table of cutting.
Among the preferred embodiment, cutter sweep can comprise that laser cutting, water spray any or its combination of cutting or blade cuts.
In another preferred embodiment, blade cuts can comprise and adopts at least one to be positioned at vane group on the single axle.
Among another embodiment, cutter sweep can comprise a plurality of axles, and each has mutliblade vane group to improve the speed of cutting substrate.
In another preferred embodiment, at least one axle can be relevant with independent track.Optionally, each track has relative a plurality of axle, and each axle has at least one blade, and perhaps it may have a plurality of blades in the vane group configuration.
Description of drawings
Only preferred feature of the present invention is described now with reference to accompanying drawing for task of explanation, wherein:
Fig. 1 (a) is the vertical view according to cutting of first embodiment of the invention integrated circuit and separation system;
Fig. 1 (b) is the end view of the part of Fig. 1 embodiment of looking along direction Y among Fig. 1;
Fig. 2 is made up of to 2 (c) Fig. 2 (a), and the charging appliance assembly of Fig. 1 embodiment is shown;
Fig. 3 is made up of to 3 (c) Fig. 3 (a), and the inlet guide assembly of Fig. 1 embodiment is shown;
Fig. 4 is made up of Fig. 4 (a) and 4 (b), and the cross section of Fig. 1 embodiment that comprises two chuck table is shown;
Fig. 5 is first view of Fig. 1 embodiment cleaner unit;
Fig. 6 is second view of Fig. 1 embodiment cleaner unit;
Fig. 7 is made up of to 7 (c) Fig. 7 (a), and the heat block assembly of Fig. 1 embodiment is shown;
Fig. 8 is made up of to 8 (c) Fig. 8 (a), and the turning device unit of Fig. 1 embodiment is shown;
Fig. 9 is made up of to 9 (c) Fig. 9 (a), and the stand-by unit assembly of Fig. 1 embodiment is shown;
Figure 10 is made up of to 10 (i) Figure 10 (a), and the net block assembly of Fig. 1 embodiment is shown;
Figure 11 is made up of to 11 (c) Figure 11 (a), and the lifting subassembly of Fig. 1 embodiment is shown;
Figure 12 is made up of to 12 (c) Figure 12 (a), and the tray lift assembly of Fig. 1 embodiment is shown;
Figure 13 is that Figure 12 tray lift assembly, normal pallet are piled up the vertical view that assembly, unusual pallet accumulation assembly and empty pallet are piled up assembly;
Figure 14 is made up of Figure 14 (a) and 14 (b), and the normal pallet that Figure 13 is shown is piled up assembly and unusual pallet accumulation assembly; With
Figure 15 illustrates the empty pallet of Figure 13 and piles up assembly;
Figure 16 (a) is the plane graph of separative element panel;
Figure 16 (b) is the cross sectional elevation of supporting arrangement in accordance with another embodiment of the present invention;
Figure 16 (c) is the detailed view of Figure 16 (b) supporting arrangement;
Figure 17 is the schematic diagram of separator according to a further embodiment of the invention;
Figure 18 is the vertical view of integrated circuit cutting in accordance with another embodiment of the present invention and separation system;
Figure 19 is the flow chart according to the processing of Figure 18 embodiment;
The flow chart that Figure 20 handles in accordance with another embodiment of the present invention;
Figure 21 is the detailed view of chuck in accordance with another embodiment of the present invention;
Embodiment
Fig. 1 (a) illustrates as the integrated circuit cutting of one embodiment of the invention and the general structure of separation system.Among Fig. 1 (a) from this system of top observation.It forms cutting part and sorting part by two parts.Two horizontal directions are labeled as X and Y.
Cutting and separation system are used to cut the substrate that comprises a plurality of integrated circuits with sorting.This system is particularly suitable for such integrated circuit, its each all have a contact array (yet can as described belowly be the integrated circuit that is used for other type) that is positioned on the initial side of substrate up with this system reform.Use charging appliance assembly 1 with substrate from the box insertion system.Substrate is transported to inlet guide assembly 2 from charging appliance assembly 1.Use first camera 3 check substrates in this stage, mainly for check substrate belong to be adapted at cutting with separation system in the type used.
As following detailed, substrate-transfer is to two chuck table 4, from the cutting machine of it being packed into totally representing with Z here.Can constitute this cutting machine Z according to known design, therefore be not described in detail here.
The substrate that is cut arrives heat block assembly 7 by the scratch brushing unit 5 and the cleaning device unit 6 of scratch brushing separative element.Therefrom, each unit is transferred to turning device unit 8, here, the following detailed description in detail, thus overturn each ball grid array of each unit down.Receive separative element by the stand-by unit that comprises second camera (idle unit) assembly 9 then.Subsequently, separative element forwards net block assembly 10 to.
Fig. 1 (b) illustrates the part 2 to 10 of being looked by the direction that is labeled as Y among Fig. 1 (a).Be expressed as framework lifting subassembly and be depicted as two diverse location places that are in its continuous employing in using this systematic procedure with part A y and Ax.
Mention separative element by lifting subassembly 11A from net block assembly 10.Use these separative elements of sphere vision verification camera assembly 11B verification then from following inspection separative element.Computer system uses the data that obtain in this step to determine the quality of this unit, and therefore controls lifting subassembly 11A and put it in one of them of two pallet 12d, 12e.Empty pallet is remained on position 12c.In case fill, then respectively pallet 12d, 12e shift-in normal cell pallet piled up assembly 13 and anomaly unit pallet accumulation assembly 14.Tray lift assembly 12 moves empty pallet to substitute any pallet 12d, the 12e that has removed from position 12c.New empty pallet is piled up assembly 15 from empty pallet move to position 12c.
Go through the various piece of this embodiment now.
Charging appliance assembly 1 represents with vertical view that in Fig. 2 (a) end view of looking with direction Y from Fig. 1 (a) is represented in Fig. 2 (b), and the end view of looking with direction X from Fig. 1 (a) in Fig. 2 (c) is represented.Charging appliance assembly 1 comprises a plurality of boxlike case 1a of the regional 1d of the epimere 1c that is arranged in loading assembly 1.Each all contains the substrate of a plurality of accumulations these boxlike casees, and each substrate comprises a plurality of panel 1b, and (typically each panel is identical, and considers that the application that separates integrated circuit designs; 2,3,4 or 5 panels are arranged) in the single substrate.Send into loading assembly 1 to boxlike case of major general at every turn.In case each case 1a loads, use the wide rubber belt 1e that drives by roller 1f and motor 1g that it is transported (along the direction towards Fig. 2 (c) right side) towards clamp 1h, 1i.Clamp 1h, 1i by under press from both sides 1i and go up folder 1h and form.With clamp 1h, 1i through fixture block 1L be installed in/lower linear guide rail 1j on.
In case 1a is sent to clamp 1h, 1i with the boxlike case, cylinder 1k upwards promotes case with regard to folder 1i under starting.This stably is positioned at down folder 1i with boxlike case 1a and goes up between the folder 1h.
Reduce clamp 1h, 1i along last/lower linear guide rail 1j then, overlapping up to a substrate and substrate groove 1m.By push rod 1n substrate is advanced substrate groove 1m.Mobile then clamp 1h, 1i are so that another substrate among the boxlike case 1a and substrate groove 1m are overlapping.Like this, all substrates among the boxlike case 1a are sequentially transferred to groove 1m.
Load in case finish substrate, empty van 1a is moved down, and clamp 1h, 1i discharge it from last/lower linear guide rail 1j.Empty van is placed on the hypomere 1o of charging appliance assembly 1 regional 1d.
After first camera 3 carried out visual inspection, swing roller 2a arrived brake 2b substrate is moved on to rail brackets 2f up to it.Rail brackets has the upper surface that is roughly rectangle, and this moment upper surface major axis be in the horizontal direction of Figure 13 (a).
In this process, adopt the interval of servomotor 2d and band 2e aligned inlet guide rail 2c.In case substrate (in Fig. 3 (a) be expressed as comprise four panel 1b with it) is positioned at rail brackets 2f top, then use the rail brackets 2f that is connected with last/following air cylinder 2g upwards to mention substrate 1b from the horizontal plane of the guide rail that enters the mouth.Servomotor 2h and band 2i rotary rail support 2f then, thereby rotation substrate 1b.This is rotated on the horizontal plane through 90 ° or 270 °, so that the correct two chuck table discussed below of aiming at of substrate.This rotation means that substrate begins to have the major axis on the directions X, but rotation makes its major axis extend in the Y direction, is arranged to receive substrate at this direction cutting machine Z.
In case, then mention substrate from frame rack 2f by the framework lifting subassembly by frame rack 2f rotation substrate.The framework lifting subassembly has two respectively with the part of Ay and Ax mark (among Fig. 1 (b)), and servomotor Af makes these two parts can independently move and can move together in the horizontal direction (observed left and right directions in as Fig. 1 (b)) in vertical direction.Part A y comprises the framework lifting piece Ab that is used to mention the substrate that is bearing on the frame rack 2f, and part A x comprises the netted lifting piece Aa that discusses hereinafter.Framework lifting piece Ab links the vacuum source that produces the power that keeps substrate contact frame lifting subassembly Ab through conduit Ai.Typically, framework lifting piece Ab is included in its lip-deep a plurality of openings that are communicated with conduit Ai.Switching mechanism decision starts vacuum source (promptly opening being applied negative pressure) or inactive vacuum source (for example its no longer with open communication).
After frame rack 2f mentioned first substrate, frame rack 2f reset into its previous azel at framework lifting piece Ab, thereby it can receive new substrate.Then new substrate is mentioned and rotary manipulation.
The framework lifting subassembly is with the framework " loaded " position of substrate-transfer to two chuck table 4.Two chuck table 4 are represented with vertical view in Fig. 4 (a), the direction indication of looking with the direction Y along Fig. 1 (a) in Fig. 4 (b).Two chuck table 4 are set to and can rotate around vertical axis, and it comprises by rotating two same section 4a, 4b of mutual exchange.Among the part 4a on the left of the framework lifting piece Ab of framework lifting subassembly once puts into substrate as shown in Figure 4.Adopt the opening that can be communicated with vacuum source in the chuck table to keep this substrate there by negative pressure.Each has projection Am, An in its end components A a, Ab, and these projections enter respective openings 4m, the 4n on the chuck table 4, thereby guarantee correct positioning.Two chuck table 4 are set to cooperate with the cutting machine of the cutting box of Known designs.During cutting, each substrate 1b is cut into separative element 7a.Cutting back chuck table is around the position (be the position at part 4b previous place) of its central vertical shaft Rotate 180 ° separative element 7a is taken to right side shown in Figure 4.Part 4b moves on to the position at the previous place of part 4a simultaneously.
With framework lifting piece Ab with new substrate be placed among the part 4a operation simultaneously, netted lifting piece Aa is reduced to contact the separative element 7a of the substrate 1b that is before cut.Netted lifting piece Aa comprises the opening that is arranged in its lower surface that is communicated with vacuum source through conduit Ah, thereby netted lifting piece Aa keeps separative element 7a.Close from the negative pressure on the separative element of chuck table split shed.The framework lifting subassembly leaves two chuck table 4 then, thus the substrate 1b that two chuck table 4 can be cooperated with cutting machine and just placed with cutting.Like this, effectively utilized the time that two chuck table are cooperated with the framework lifting subassembly, be used to place new substrate simultaneously and remove the substrate that has cut.Like this, make the output optimum of cutting machine, and reduce the time of being wasted as far as possible in the loading and unloading chuck table.
Netted lifting piece Aa rises to separative element 7a the scratch brushing unit 5 that cleans separative element by fricting movement.Netted lifting piece Aa moves on to cleaning device unit 6 with separative element 7a then, and unit 6 represents with the view that direction Y looks in Fig. 5, represents with the view of looking with the X rightabout in Fig. 6.Reduce netted lifting piece Aa and enter cleaning area 6a up to each unit.Projection 4n enters in each opening at cleaning unit 6 tops.
Simultaneously, by the frame rack 6b in pneumatic cylinder 6c and the guide post 6d rising cleaning device unit 6, up to the lower surface of its contact separation unit 7a.So that separative element 7a is remained on the frame rack 6b, described opening is overlapping with separative element 7a respectively with the open communication of vacuum source in the upper surface of conduit and frame rack 6b.Close the pneumatic function of netted lifting piece Aa.
After the surface of cleaning the separative element 7a with ball, water and/or air port 6f stop using.Frame rack 6b moves up once more, contacts netted lifting piece Aa once more up to separative element 7a.Adopt conduit Ah to open vacuum source once more, and disconnect the vacuum source of frame rack 6b.At this moment once more separative element 7a is remained on the lower surface of netted lifting piece Aa.Open water and air spout 6f once more, and clean another surface side of ball grid array (promptly away from) of separative element 7a.
After the cleaning, netted lifting piece Aa mentions separative element 7a and it is moved to the upper surface of the heat block 7c of heat block assembly 7.Heat block assembly 7 is represented with vertical view in Fig. 7 (a), represents with the sectional view of looking from direction A in Fig. 7 (b), and represents with the sectional view of seeing from direction B in Fig. 7 (c).At this moment, enter opening 7d by projection An and aim at netted lifting piece Aa and heat block 7c, thereby separative element 7a suitably is positioned at precalculated position on the heat block 7c.
In case separative element 7a contacts with heat block 7c, then stops the negative pressure of conduit Ah, and through with upper surface 7c in the conduit 7b of open communication apply negative pressure so that separative element 7a is remained on the heat block 7c, described opening and separative element 7a are overlapping.
At this moment, the framework lifting subassembly does not transport substrate or separative element, and the framework lifting subassembly turns back to its position above inlet guide assembly 2.The used time of cutting machine cutting substrate 1b is preferably carried out the used time of following set as many with the framework lifting subassembly at least: (i) move on to heat block assembly 7 from two chuck table 4, (ii) turn back to the inlet guide assembly, (iii) mention new substrate 1b (that is, except itself and platform 4 interact all parts that lifting subassembly operates).Suppose so, so time of can the excuse lifting subassembly not consumed with the interaction of other unit of the service speed of cutting machine and reducing.
Any water droplet on the thermal evaporation separative element 7a that the cartridge heater 7a of heat block assembly 7 is produced.This system also comprises the standby lifting subassembly (representing with the Az among Fig. 1 (b)) that is moved back and forth (left side-right side among Fig. 1 (b)) by servomotor Ag.This standby lifting subassembly comprises nozzle Ad.Move standby lifting subassembly Az so that nozzle Ad points to separative element 7a, and nozzle Ad blows the unit of the air at separative element 7a place with dry this unit, particularly top.
Standby lifting subassembly Az comprises the standby lifting device Ac that can raise and reduce, and this standby lifting device Ac is included in the opening that is communicated with vacuum source through conduit AL on its lower surface.Standby lifting device Ac is reduced to separative element 7a top, and starts vacuum source so that separative element remains on the lower surface of standby lifting device Ac.Then standby lifting device Ac improved, moves horizontally (right side to Fig. 1 (b)), be reduced on the horizontal surface of flipping block 8a of roll-over unit 8 then.Roll-over unit 8 is represented with vertical view in Fig. 8 (a), represents with the view of looking to direction X in Fig. 8 (b).Part roll-over unit is represented with the view of looking to direction Y in Fig. 8 (c).Flipping block 8a is the entity with two relative flat surfaces, and each surface comprises the opening that is communicated with vacuum source through conduit 8b.In case separative element 7a is placed on the upper surface of flipping block 8a, the vacuum source of the standby lifting device Ac that then stops using, and start roll-over unit 8 vacuum source so that separative element 7a be connected on the upper surface of flipping block 8a.
When this connect to continue, flipping block 8a around by its center (entering Fig. 1 (b) and 8 (c) page or leaf) thus trunnion axis 8e rotate make before flipping block 8a up the surface now down.Carry out the rotation of flipping block 8a by the servomotor 8c that links flipping block by rubber belt 8d.Before noting heretofore up ball grid array now down.
The next part of system is a spare block assembly 9 shown in Figure 9.Fig. 9 (a) is a vertical view, and Fig. 9 (b) is the view that the edge direction opposite with direction X looked, and Fig. 9 (c) is the view of looking along direction Y.Spare block assembly 9 comprises the spare block 9a that is positioned at below the flipping block 8a.Thereby rotation flipping block 8a separative element 7a down after, rising spare block 9a contacts its upper horizontal surface up to separative element 7a.By on comprising/the spare block hoisting mechanism of following cylinder 9d and last/following guide post 9e carries out this operation.Apply then with spare block 9a upper surface in the vacuum source of open communication so that separative element 7a is remained on the spare block.Stop using the then vacuum source of roll-over unit 8.And then reduction spare block 9a.
Also can move horizontally (left side-right among Fig. 1 (b)) spare block 9a along horizontal guide rail 9c by anterior-posterior cylinder 9b.Carry out this operates up to spare block 9a no longer below flipping block 8a always.Spare block 9a passes through below the second camera Ae.Computer system adopts the data of being collected by camera Ae to analyze the flag state of separative element 7a and situation (note its see the surface of separative element 7a over against ball grid array), and discerns any unit with abnormal marking state or situation.These data are prepared against by computer system stores and are used (as described below) later on.
Raising then, almost the upper level with turning device 8a is identical up to its upper surface for spare block 9a, thereby (as described below) can mention separative element 7a easily once more by standby lifting subassembly Az.Above separative element, reduce standby lifting device Ac, and start vacuum source AL once more to keep separative element 7a.Stop using the then vacuum source of spare block 9a.Use standby lifting device Ac that separative element 7a is moved on on the upper surface of net block assembly 10 net piece 10a then.
Figure 10 (a) illustrates the net block assembly 10 that edge and direction X rightabout are looked, Figure 10 (b) illustrates the net block assembly of looking along direction Y, Figure 10 (c) is the vertical view of the net piece 10a of net block assembly 10, and Figure 10 (d) if illustrate removes the outward appearance of net block assembly 10 behind the net piece 10a.
Figure 10 (e) is the amplification plan view of Figure 10 (c) part.Figure 10 (f) is Figure 10 (e) guide wire of alternative shape.Figure 10 (g) and 10 (h) are illustrated in the vertical plane of each mutual crosscut two cross sections by net piece 10a.Corresponding Figure 10 of Figure 10 (i) (g), and the operation of description net piece 10a.
Shown in Figure 10 (a) and 10 (b), the net piece 10a of net block assembly 10 is bearing on the rectangular slab 10j that is installed on vertical axis 10m top.Can move back and forth a 10m (left side-right among Figure 10 b) by servomotor 10b.Can be by servomotor 10L through rubber belt 10k rotating shaft 10m.
Shown in Figure 10 (e), the end face of net piece 10a has a plurality of fritters (pocket) 10d corresponding with separative element quantity.Fritter 10d is arranged among the group 10c, and group 10c is corresponding to quantity and the layout of the separative element 7a that is obtained by single substrate 1b.All separative element 7a from a substrate 1b are placed the corresponding fritter 10d of one of these groups 10c.
Each fritter 10d can be with the conduit 10i that is communicated with accordingly with vacuum source overlapping or aligning, thereby a resolution element 7a can be remained among the fritter 10d.Be connected with conduit 10n via the passage among the axle 10j between conduit 10i and the vacuum source.After a unit 7a was placed fritter 10d, to the suction of the bottom of fritter 10a, shaping meaned that unit 7a suitably aims at net piece 10a to the negative pressure among the fritter 10d to anvil 10e, 10f with unit 7a.That is, existence can reduce " autoregistration " of mentioning risk of failure of back.Note, though not upset among the embodiment (if i.e. omission roll-over unit 8) if and/or separative element do not have ball grid array, this autoregistration characteristic is also useful.
In case suitably be in the fritter, then move separative element 7a along the direction Y of the lifting subassembly 11A of (being the top of Fig. 1 (a)) towards the system rear portion by the servomotor 10b that drives net piece 10a.In the meantime, adopt motor 10L to come rotating shaft 10m.
Lifting subassembly represents with vertical view that in Figure 11 (a) view of looking with court and X rightabout is represented, and represented with the view of looking towards direction Y at Figure 11 (c) in Figure 11 (b).Lifting subassembly 11A comprises a plurality of (for example at least 3) unit lifting subassembly 11a, 11c moves horizontally (left side-right side among Fig. 1 (a)) each unit lifting subassembly by corresponding linear series connection actuator.Each unit lifting subassembly 11a comprises many group (for example at least 4 groups) independent separate unit lifting device 11b.Drive each independent unit lifting device 11b up and down by corresponding linear electric machine 11d separately.In case servomotor 10b moves on to the system rear portion with net piece 10a, then the rotation of net piece 10a makes each lifting subassembly 11a and the separative element 7a of delegation overlapping (on direction Y).Each independent unit lifting device 11b promotes a corresponding separative element 7a, and on the direction of representing with arrow 11f the unit that is raised is being moved to above the ball vision verification camera 11e.
Any amount of camera 11e can be arranged, and the same with net piece 10a, can on the Y direction, move each camera 11e.In Figure 11 (a), have only a camera 11e, it is expressed as three possible positions that separate on the Y direction, and can between these positions, shown in arrow 11g, move.
Like this, can tie up positions from each unit 7a of following shooting any 3 with respect to one of them camera 11e.Note ball grid array down.The 2 dimension image input computer systems that will be caught by camera 11e are with state, situation, feature and the pattern of verification ball.For example, if any ball breaks away from integrated circuit, then can directly determine this point.Alternatively, this can comprise the fine parameters of determining unit, for example skew of its relative optimum position, its coplanarity and its bending.
Based on this definite (and result that previous quality is determined on the basis of camera Ae output), can determine that individually normally mobile still is mobile unusually to each unit.According to this result, computer system control individual unit lifting device 11b with corresponding units is placed normal cell pallet 12d and goes up or anomaly unit pallet 12e on.
When filling up normal cell pallet 12d or anomaly unit pallet 12e, it is removed from system, and empty pallet is injected the position of the pallet that is removed from position 12c.Carry out this operation by tray lift assembly 12.Figure 12 (a) is the vertical view of tray lift assembly 12, and Figure 12 (b) is the view of the pallet component 12 of looking towards direction X, and Figure 12 (c) is the view of the pallet component 12 of looking towards direction Y.
When filling normal cell pallet 12d or anomaly unit pallet 12e, these pallets are positioned on each position of property conveyer 12b along the line.This linear transmission machine 12b also extends above the residing position of dummy cell pallet 12c.Conveyer 12b transports tray lift unit 12a, and tray lift unit 12a can promote pallet conversely.
The structure that is used for removing the mechanism of full normal pallet is represented with vertical view at Figure 13, represents with the view of looking towards direction X at Figure 14 (a).
Similarly, when filling unusual pallet 12e, will settle the unusual tray plate 12j of unusual pallet to be sent to unusual pallet stacked units 14 along track 14c towards the direction opposite with Y by conveyer 14d.Pile up assembly 14 places at unusual pallet, the pallet slave plate 12j that adopts the drive system that is arranged in part 14b will be filled with anomaly unit removes, and pallet is deposited among the part 14a.Usually, at least 30 pallets can be deposited in this position.The structural table of mechanism that removal is full of the pallet of anomaly unit is shown among Figure 14 (b), and identical with Figure 14 (a), just Reference numeral 12d, 12i, 13,13a, 13b, 13c, 13d replace with unit 12e, 12j, 14,14a, 14b, 14c, 14d respectively.
As described in a section of front, in case removed normal pallet 12d or unusual pallet 12e, tray lift unit 12a delivers to its position with empty pallet 12c.
Fill the position that empty pallet 12c had before occupied by the empty pallet provisioning component with new empty pallet.The empty pallet provisioning component is made up of empty pallet stacked units 15, in empty pallet stacked units 15 (preferably this unit can store at least 30 empty pallets), empty pallet is deposited in regional 15a under the control of driver element that is arranged in part 15b and linear transmission machine 15d, linear transmission machine 15d is sent to position 12c with empty pallet from empty pallet stacked units 15 along track 15c.The structure of this mechanism is represented with vertical view in Figure 13, represents with the view of looking along direction X in Figure 15.
Attention can change the quantity of these pallets in other configuration.For example, in some variants of embodiment, can further divide anomaly unit 7a according to its Exception Type.Can anomaly unit be placed one of them of a plurality of anomaly unit pallets then according to the Exception Type of being discerned.
Usually, substrate comprises unit panel, and an integrated circuit is represented in each unit, perhaps may be the encapsulation of these circuit, for example 2 * 2 (1 * 1), 4 * 4 encapsulation or the like.According to the operation requirement, substrate can comprise one or more such panels.For example, if the economy demand of handling requires batch processing, then substrate can comprise a plurality of panels.Alternatively, if economy shows the processing of " continuously " more, i.e. smaller units quantity and/or the substrate time of staying in system, substrate can comprise seldom or even panel so.
Figure 16 (a) is the plane graph of panel 16 with integrated circuit unit 18 of separation.Unit 18 remains on the appropriate location on the supporting arrangement 17, and supporting arrangement 17 is used for during cutting panel 16 panel 16 being fixed on the appropriate location, and subsequently individual unit 18 is remained on the appropriate location to prepare to be sent to next website.
Figure 16 (b) is the lateral elevational view of panel 16, shows the vacuum plant that unit 18 is maintained the appropriate location.
Vacuum system comprises vacuum groove or collecting pipe 20, and it maintains under the suitable negative pressure.Collecting pipe 20 is communicated with by retainer 19 through groove 21.Typically the supporting arrangement of being made by soft material 17 also has the opening 23 of corresponding bearing support groove 21, and soft material for example is any suitable elastic materials, includes but not limited to silicon rubber or polyurethane.Opening 23 corresponding each independent unit 18 in the supporting arrangement 17.Therefore, vacuum collecting pipe 20 directly is communicated with unit 18 by the groove of bearing support and the opening of supporting arrangement.
This point is expression in more detail in as Figure 16 (c) of supporting arrangement detail drawing.Here it can be expressed as the opening 23 that unit 18 covers in the supporting arrangement 17.The vacuum pressure 22 that applies by opening remains on the appropriate location up to preparing in next website release with the unit.
Figure 17 illustrates the upstream process of one embodiment of the invention, and wherein, substrate 24 is used for system may be undesirable, therefore optionally reduces the size of substrate 24 before being sent to chuck table.Therefore, initial substrate 24 is moved to 25 separators.This separator of indication is about the predetermined quantity of panel that will single treatment under operator's control.In this example, predetermined quantity is a panel 26, and this panel 26 separates from the remainder of initial substrate 24.Rotate then as the single substrate of single panel 26 and with it and move on to suitable orientation to be sent to chuck table.Subsequently, cut single panel 26 to produce separative element array 16, in order to being sent to the next stage of processing.
Figure 18 and 19 illustrates integrated circuit cutting and the total structure of separation system and the basic handling that this system is carried out in the preferred embodiment of the present invention.Among Figure 18 from this system of top observation.It is made of two parts, cutting part and sorting part.Two horizontal directions are labeled as X and Y.
Cutting and separation system are used to cut the substrate that comprises a plurality of integrated circuits with sorting.This system is particularly suitable for such integrated circuit, its each have the contact point array that is positioned on the initial side of substrate up (yet as described below, can be the integrated circuit that is used for other type) with the system reform.Adopt loading assembly 201 with substrate from the box insertion system.Substrate is transported to inlet guide assembly 202 from loading assembly 201.Use first camera 203 check substrates in this stage, mainly check substrate belong to be adapted at cutting with separation system in the type used.
As described in more detail below, substrate forwards two chuck table 204 to, from here substrate being sent into the cutting machine of representing with Z, and expression in more detail in Figure 20.This cutting machine Z can form according to known design, therefore no longer describes in detail.
The substrate that is cut forwards heat block assembly 207 to through scratch brushing unit 205, the cleaning unit 206 of scratch brushing separative element.From forwarding roll-over unit 208 here to, at roll-over unit 208 places, as following detailed description, thereby each separative element is reversed each ball grid array down with separative element.Receive separative element by the stand-by unit assembly 209 that comprises second camera then.Subsequently, separative element forwards net block assembly 210 to.
Among another embodiment, Figure 19 illustrates and uses the boxlike case that a band 220 is sent to cutting machine.Guide rail through each website of system transmits by system, and box is sent to guide rail with band.Before transmitting band, it experiences 230 first verifications (or demonstration) and is sent to guide rail subsequently.
Subsequently band (single or a plurality of) is placed on the available chuck table 240a and 240b of the cutting machine Z that is arranged in Figure 17.For quickening should be mobile, staggered chuck table 240a of order and 240b, thus a band is sent to next available chuck table, and through cutting machine.This point has simulation to handle continuously but not the advantage of batch processing, and by batch processing, and band is overstocked bottleneck in the processing of each band to be cut such as can to cause.Therefore, although prior art may need 30 seconds when waiting next band to be installed delay, and staggered chuck table 240a and the 240b of order reduced to this time about 12 seconds in this embodiment.Among another embodiment, have a plurality of chuck table, thereby any delay may be caused rather than as the result of cutting process by the delivery time of new band.Among this embodiment, processing delay may near but definitely do not reach and have postponed in zero second pure and handle continuously.Therefore the present invention is intended to compare with prior art and per hour improves unit (UPH) processing speed.
Scratch brushing and clean the separative element that 245 cutting process produce then, and heat separative element that 250 cutting process produce to remove moisture.
Upset 255 separative elements that remain in the spatial configuration that is limited by a plurality of bands are preferably to make ball grid array 260 down.
Figure 20 illustrates a previous embodiment at cutting machine Z shown in Figure 180.Here cutting machine comprises two track 305a and 305b, a pair of chuck table 300a of each rail support and 300b.
Track 305a and 305b move with linear direction, to pass through cutting station 310a and 310b.These cutting stations 310a and 310b also are designed to linear operation, but meet at right angles with orbital direction.Therefore, two motion combination of cutting station 310a and 310b and track 305a and 305b produce an effect, may reside in the bidimensional cutting of the band on chuck table 300a and the 300b whereby.
Difference embodiment illustrated in fig. 3 is to adopt a pair of chuck table 300a and the 300b on the track.Therefore, improve the staggered in proper order UPH that handles of previous described employing whereby, come further to improve greatly UPH by making the cutting machine capabilities double.
It is any even be further characterized in that the same UPH of promotion improves, adopts vane group 310a and 310b at cutting station.Have extra blade band cutting speed is doubled, thereby directly promote the increase of UPH.
Figure 21 illustrates the more detailed processing according to the 3rd embodiment, more critically limits the activity in each website whereby.
Claims (16)
1. one kind is cut substrate to form the system of sorting separative element, comprising:
With pack into the box of guide track system of described substrate, this guide track system is communicated with the chuck table device;
Described chuck table device is suitable for substrate is cut into the separative element that remains in the predetermined space configuration, described chuck table device comprises a plurality of chuck table, wherein said substrate is installed on described a plurality of chuck table, and at least one chuck table is positioned on the independent track and can moves thereon;
Cutter sweep is used for from the described unit of substrate separation; With
Holding device is used for each preceding separative element of corresponding separation and keeps the relative position of each separative element in described predetermined space configuration in the position of substrate;
Described cutter sweep comprises the cutting blade with at least one relevant with each track, and at least one cutlery is positioned on the described axle,
The described substrate that overturns keeps the turning device of predetermined space configuration simultaneously;
Separate and control the net block assembly of individual unit; And
The sorting and the sorter that effectively separate separative element.
2. the system as claimed in claim 1, wherein each chuck table is on the independent track to be independent of other chuck table and moves each chuck table and therefore mobile substrate.
3. system as claimed in claim 2, wherein the chuck table device is suitable for allowing substrate is contained on the chuck table as the function that is independent of the substrate on another chuck table of cutting.
4. the system as claimed in claim 1 wherein is arranged on two chuck table on the independent track at least, moves chuck table and so mobile substrate to be independent of other chuck table.
5. system as claimed in claim 4, wherein the chuck table device is suitable for allowing substrate is contained on described two chuck table at least as the function that is independent of substrate on the other chuck table of cutting.
6. as any described system in the claim 1 to 5, wherein cutter sweep comprises that further laser cutting or water spray any or its combination of cutting.
7. the system as claimed in claim 1, wherein two or more axles are relevant with each independent track.
8. as claim 1 to 5 any or the described system of claim 7, wherein each axle adopts vane group.
9. as claim 1 to 5 any or the described system of claim 7, wherein the net block assembly comprises at least one the net piece that is arranged at least one track, is used for mobile separative element.
10. system as claimed in claim 9, wherein the net block assembly comprises a plurality of net pieces that are arranged on described at least one track.
11. system as claimed in claim 10 wherein has a plurality of tracks.
12. system as claimed in claim 11, the net piece that wherein is positioned on described a plurality of track interlocks with respect to the sequence of positions ground that is positioned at the net piece on other track.
13. one kind is cut substrate to form the method for sorting separative element, comprises following step:
Described substrate is installed to guide track system;
Through guide track system described substrate is transported to the chuck table device to cut described substrate;
Described substrate is installed on a plurality of chuck table, and at least one chuck table is positioned on the independent track;
Move chuck table along track, and through each cutter sweep;
Use cutter sweep from the substrate separation unit and
The relative position of each separative element in the predetermined space configuration kept in the position of each separative element in substrate before corresponding the separation;
The described substrate that overturns is kept predetermined spatial configuration simultaneously;
Transport separative element to the net block assembly to separate and the control individual unit; With
Sorting and classification individual unit are with its effective separation.
14. method as claimed in claim 13, wherein single chuck table according to interleaved order along each track experience load, by, separate and keep step to minimize the time of delay between these steps.
15. method as claimed in claim 13, wherein sorting and classification step comprise whether definite each separative element falls into effective range, invalid scope or definite separative element and whether need reprocessing.
16. the supporting arrangement of one group of integrated circuit unit of a supporting, this device comprises:
Scaffold, described framework has groove array;
Be adapted to be mounted within the soft material inserts of scaffold inside, described inserts has to be arranged to when described inserts is installed in described framework inside and frame groove corresponding opening array;
Vacuum plant with each described groove and open communication;
The corresponding inserts opening in each unit in wherein said group also remains on correct position by vacuum.
Applications Claiming Priority (9)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| SG2004051660 | 2004-08-23 | ||
| SG200405166-0 | 2004-08-23 | ||
| SG200405166A SG120197A1 (en) | 2004-08-23 | 2004-08-23 | Supply mechanism for the chuck of an integrated circuit dicing device |
| SG2005018023 | 2005-03-22 | ||
| SG200501802-3 | 2005-03-22 | ||
| SG200501802A SG125997A1 (en) | 2005-03-22 | 2005-03-22 | Improved chuck table for an integrated circuit dicing device |
| SG2005050562 | 2005-07-15 | ||
| SG200505056A SG129327A1 (en) | 2005-07-15 | 2005-07-15 | Improved method and apparatus for an integrated circuit dicing device |
| SG200505056-2 | 2005-07-15 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB200580034750XA Division CN100521101C (en) | 2004-08-23 | 2005-08-23 | System and method for cutting an integrated circuit device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101459056A true CN101459056A (en) | 2009-06-17 |
| CN101459056B CN101459056B (en) | 2010-09-15 |
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ID=36586224
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2008101896980A Active CN101459056B (en) | 2004-08-23 | 2005-08-23 | System and method for cutting substrate to produce separation unit |
| CNB200580034750XA Active CN100521101C (en) | 2004-08-23 | 2005-08-23 | System and method for cutting an integrated circuit device |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB200580034750XA Active CN100521101C (en) | 2004-08-23 | 2005-08-23 | System and method for cutting an integrated circuit device |
Country Status (2)
| Country | Link |
|---|---|
| CN (2) | CN101459056B (en) |
| SG (1) | SG120197A1 (en) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| SG156539A1 (en) * | 2008-04-14 | 2009-11-26 | Rokko Ventures Pte Ltd | A system and process for dicing integrated circuits |
| SG172499A1 (en) * | 2009-12-23 | 2011-07-28 | Rokko Systems Pte Ltd | Assembly and method for ic unit engagement |
| CN106847736B (en) * | 2011-11-08 | 2020-08-11 | 因特瓦克公司 | Substrate processing system and method |
| CN107002227B (en) * | 2014-08-13 | 2019-09-24 | 洛克系统私人有限公司 | For processing the device and method of the IC unit through sputtering |
| WO2017122048A1 (en) * | 2016-01-15 | 2017-07-20 | Rasco Gmbh | Method and device for loading and unloading devices under test into a tester by flipping |
| CN110931413B (en) * | 2018-09-20 | 2022-03-04 | 北京华卓精科科技股份有限公司 | Electrostatic chuck separating device |
| KR102484237B1 (en) * | 2020-11-06 | 2023-01-04 | ㈜토니텍 | Mounter cutting device for semiconductor package |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4688540A (en) * | 1984-12-27 | 1987-08-25 | Disco Abrasive Systems, Ltd. | Semiconductor wafer dicing machine |
| US5803797A (en) * | 1996-11-26 | 1998-09-08 | Micron Technology, Inc. | Method and apparatus to hold intergrated circuit chips onto a chuck and to simultaneously remove multiple intergrated circuit chips from a cutting chuck |
| US6196532B1 (en) * | 1999-08-27 | 2001-03-06 | Applied Materials, Inc. | 3 point vacuum chuck with non-resilient support members |
-
2004
- 2004-08-23 SG SG200405166A patent/SG120197A1/en unknown
-
2005
- 2005-08-23 CN CN2008101896980A patent/CN101459056B/en active Active
- 2005-08-23 CN CNB200580034750XA patent/CN100521101C/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| SG120197A1 (en) | 2006-03-28 |
| CN101459056B (en) | 2010-09-15 |
| CN101069270A (en) | 2007-11-07 |
| CN100521101C (en) | 2009-07-29 |
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