CN101523556B - Machining apparatus and semiconductor strip machining system using the same - Google Patents

Machining apparatus and semiconductor strip machining system using the same Download PDF

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Publication number
CN101523556B
CN101523556B CN2007800378225A CN200780037822A CN101523556B CN 101523556 B CN101523556 B CN 101523556B CN 2007800378225 A CN2007800378225 A CN 2007800378225A CN 200780037822 A CN200780037822 A CN 200780037822A CN 101523556 B CN101523556 B CN 101523556B
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mentioned
semiconductor
semiconductor band
track
band
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CN101523556A (en
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罗益均
郑显权
尹雄焕
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Hanmi Semiconductor Co Ltd
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Hanmi Semiconductor Co Ltd
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Priority claimed from KR1020060128282A external-priority patent/KR100814890B1/en
Application filed by Hanmi Semiconductor Co Ltd filed Critical Hanmi Semiconductor Co Ltd
Priority claimed from PCT/KR2007/004871 external-priority patent/WO2008044840A2/en
Publication of CN101523556A publication Critical patent/CN101523556A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Sawing (AREA)
  • Dicing (AREA)

Abstract

The invention discloses a machining apparatus and a semiconductor strip machining system. The machining apparatus includes a chuck table unit including a pair of chuck tables simultaneously movable inan X-axis direction while being individually movable in an Y-axis direction; and a cutting unit for machining articles respectively seated on the chuck tables.

Description

Processing unit (plant) and the semiconductor band system of processing of using this processing unit (plant)
Technical field
The present invention relates to a kind of semiconductor bar processing unit (plant), particularly relate to a kind of in the semiconductor cutting technique cutting semiconductor band (semiconductor strip) make it to become respectively independently the processing unit (plant) of a plurality of semiconductor packages and the semiconductor band system of processing of using this processing unit (plant).
Background technology
Usually, semiconducter process mainly comprises manufacturing FAB technology and packaging technology.In FAB technology, designing integrated circuit on a silicon wafer is to form semiconductor chip.In packaging technology, leadframe attachment is arrived semiconductor chip.Then; In packaging technology, carry out the welding procedure and the molding process of wire bonding technique or formation soldered ball in order; To form the semiconductor band; Wherein, wire bonding technique or welding procedure are for semiconductor chip is electrically connected with lead frame, and molding process uses the for example resin material of epoxy resin and so on.
The semiconductor band is fed to cutter sweep with the state that is placed on the chuck platform through given pick-up, is rotated blade cuts afterwards and becomes respectively independently semiconductor packages.In order to carry out above-mentioned technology, be equipped with semiconductor processing.
But above-mentioned prior art exists following point.
In the semiconductor band system of processing of routine, its cutter sweep only comprises blade, therefore can only be along straight cuts semiconductor band, and can't be along curvilinear cut semiconductor band.Thus, conventional semiconductor band system of processing can't adapt to the different working requirement.
And, under placement location and the out-of-alignment situation of desired locations of semiconductor band on the chuck platform during with said cut semiconductor band, owing to do not have and can possibly produce substandard products from the out-of-alignment device of dynamic(al) correction.
Disclosure of the Invention
Technical problem
The present invention is proposed in view of the above problems.One object of the present invention is the semiconductor band system of processing that a kind of processing unit (plant) is provided and uses this processing unit (plant), and above-mentioned processing unit (plant) has the cutter sweep that can realize cutting technique along curve.
Another object of the present invention is to the semiconductor band system of processing that a kind of processing unit (plant) is provided and uses this processing unit (plant); But above-mentioned processing unit (plant) sensing is positioned at the position of the semiconductor band on the chuck platform, and according to the position that is sensed the position of cutter sweep is proofreaied and correct.
Technical scheme
According to an aspect, the present invention provides a kind of processing unit (plant), comprising: chuck platform unit has a pair of chuck platform that can move and can move along Y direction separately along X-direction simultaneously; And cutter unit, be used for a plurality of workpiece that are placed in respectively on the chuck platform are processed.
According on the other hand, the present invention provides a kind of processing unit (plant), comprising: chuck platform unit has four chuck platforms that can move and can move along Y direction separately along X-direction simultaneously; And two cutter units, be used for the workpiece on the first and the 3rd chuck platform that is placed in above-mentioned four chuck platforms is processed or the workpiece that is placed on the second and the 4th chuck platform is processed.
Can further comprise according to processing unit (plant) of the present invention: sensing cell; Be used to obtain information about the position of each workpiece; And sending said information to related cutter unit, said sensing cell comprises: the video getter is used to obtain the information about the position of each workpiece; And video getter track, be used to make said video getter to move along said video getter track.
Above-mentioned chuck platform unit can comprise: the said chuck platform that is used for the support semiconductor band; First feeding member is used for presenting said chuck platform along X-direction; And second feeding member, be used for presenting said chuck platform along Y direction.
Rotatable 360 degree of each chuck platform.
Above-mentioned chuck platform unit can comprise: the chuck platform is used to support above-mentioned semiconductor band; Vertical driver is used to make above-mentioned chuck platform vertical moving; And horizontal driver, be used to make above-mentioned chuck platform to move horizontally.
According to another aspect, the present invention provides a kind of semiconductor band system of processing, comprising: loading part is used to receive a plurality of semiconductor bands; Cutting part comprises above-mentioned processing unit (plant); Unloading portion is used to receive said semiconductor band and is processed a plurality of semiconductor packages that the back is generated fully; And feed part, be used to pick up said semiconductor band or said semiconductor packages, and present the semiconductor band that picked up or semiconductor package and be filled to said loading part, said cutting part or said unloading portion.
According to more on the one hand, the present invention provides a kind of semiconductor band system of processing, comprising: first loading part is used to receive a plurality of semiconductor bands; First cutting part comprises above-mentioned processing unit (plant); The first unloading portion is used for being received in the semiconductor band after said first cutting part is processed fully; Feed part is used to pick up said semiconductor band, and presents the semiconductor bar that is picked up and bring to said first loading part, said first cutting part or the said first unloading portion; Second loading part is used to receive the semiconductor band that is unloaded from the said first unloading portion; Second cutting part comprises the rotating disk and second cutter unit, on said rotating disk, places said semiconductor band, and said second cutter unit is used for said semiconductor band is processed into a plurality of semiconductor packages; Inspection portion is used for checking whether the semiconductor packages after said second cutting part is processed fully exists defective; The second unloading portion is used to receive the semiconductor packages after the said inspection of process portion checks fully; And transmission portion, be used between said first unloading portion and said second loading part, presenting the semiconductor band.
The cutter unit of above-mentioned first cutting part can comprise laser cutting device, and above-mentioned second cutter unit can comprise blade.
Above-mentioned first cutting part can further comprise sensing cell, is used to obtain the information about the position that is placed in the semiconductor band on each chuck platform; Said first cutting part can be used for receiving the information from said sensing cell, and the Working position of the cutter unit of first cutting part that is used for the semiconductor band is proofreaied and correct.
Above-mentioned second cutting part can comprise: rotating disk, on said rotating disk, place said semiconductor band, and said rotating disk is removable along Y direction in the rotatable while; And blade, can move along X-direction around said rotating disk.
According to more on the one hand, the present invention provides a kind of semiconductor band system of processing, comprising: loading part is used to receive a plurality of semiconductor bands; Above-mentioned processing unit (plant); Washing/drying portion is used for cleaning-drying and the semiconductor band is processed fully a plurality of semiconductor packages that produce afterwards; Inspection portion is used to check out all clear and washes dried semiconductor packages and whether have defective; Unloading portion is used to receive the semiconductor packages behind the total inspection; And feed part, be used to pick up said semiconductor band or semiconductor packages, and present the semiconductor band that picked up or semiconductor package and be filled to said loading part, said processing unit (plant), said washing/drying portion, said inspection portion or said unloading portion.
Above-mentioned loading part can comprise: carrying case is used to stack said semiconductor band; Conveyer is used to transmit said carrying case; First turns to track, is used to rotate the semiconductor band of presenting through said conveyer; And propeller, be used for presenting said semiconductor bar that said carrying case stacks and bring to said first and turn to track.
Said unloading portion can comprise: second turns to track, is used to receive and rotate the said semiconductor band that cuts fully and present in said feed part; Unload cassette is used to stack the semiconductor band after cutting fully; Conveyer is used to transmit said unload cassette; And clamper, be used to transmit overlay said second turn on the track fully the cutting after said semiconductor bar bring to said unload cassette.
Brief Description Of Drawings
Accompanying drawing comprises in the present invention in order to provide further understanding of the present invention.The accompanying drawing illustration execution mode of the present invention, and with specification in order to explain principle of the present invention.
Fig. 1 is the structural representation of expression according to first execution mode of semiconductor band system of processing of the present invention;
Fig. 2 to Fig. 8 is the structural representation of operation in order of expression structure shown in Figure 1;
To be expression want the processed semiconductor band plan view at the first being processed state according to the present invention to Fig. 9;
Figure 10 is the plan view of first execution mode of expression semiconductor band cutting structure shown in Figure 9;
Figure 11 is the plan view that expression semiconductor band shown in Figure 9 is cut second execution mode of the cutting structure under the state;
Figure 12 is the plan view that expression semiconductor band shown in Figure 9 is cut the 3rd execution mode of the cutting structure under the state;
Figure 13 is the structural representation of expression according to second execution mode of semiconductor band system of processing of the present invention;
Figure 14 is the structural representation of expression according to the 3rd execution mode of semiconductor band system of processing of the present invention;
Figure 15 is the structural representation of expression according to the 4th execution mode of semiconductor band system of processing of the present invention;
Figure 16 is the structural representation of expression according to the 5th execution mode of semiconductor band system of processing of the present invention; And
Figure 17 is the front view according to the structure of semiconductor band system of processing of the present invention.
Realize the optimal mode of invention
Specify preferred implementation with reference to the accompanying drawings according to processing unit (plant) of the present invention and semiconductor band system of processing.
With reference to Fig. 1, Fig. 1 representes first execution mode of semiconductor band system of processing.Semiconductor band system of processing according to the present invention shown in Fig. 1 comprises: loading part 100, and the workpiece that reception will be processed, and load above-mentioned workpiece to loading stage; Cutting part 300 is processed the above-mentioned workpiece that has loaded; Unloading portion 400 be used to receive the above-mentioned workpiece after processing fully, and the above-mentioned workpiece after will processing fully is offloaded to the outside of the loading stage of above-mentioned system of processing; And feed part 200, the above-mentioned workpiece that has loaded is fed to above-mentioned loading part 100, cutting part 300 and unloading portion 400.
Above-mentioned loading part 100 has a plurality of carrying cases 102.Can stack a plurality of semiconductor band SS that need process in each carrying case 102 with the form of cassette tape box.Certainly, in above-mentioned each carrying case 102, also can only put a semiconductor band SS.
Loading part 100 also comprises first conveyer 104, is used for presenting one by one above-mentioned carrying case 102.Above-mentioned first conveyer 104 can be used various drive systems.Preferably, first conveyer 104 is used the belt-type drive system.
End at above-mentioned first conveyer 104 is provided with loading attachment 105.Above-mentioned loading attachment 105 has propeller 106.Above-mentioned propeller 106 is used for being loaded in above-mentioned carrying case 102 and being shifted to each one bring in and one by one move semiconductor band SS of a plurality of semiconductor band SS of propeller 106 by first conveyer 104 through propelling; Make semiconductor band SS one by one be placed in first and turn on the track 112, will turn to track 112 to elaborate to first after a while.
Above-mentioned loading attachment 105 also comprises first clamper 110.Above-mentioned first clamper 110 is arranged on a side of above-mentioned carrying case 102, makes above-mentioned first clamper 110 in the face of above-mentioned propeller 106.Thereby when above-mentioned propeller 106 when first turns to track 112 to advance the side of a semiconductor band SS, above-mentioned first clamper 110 picks up and draws the opposite side of above-mentioned semiconductor band SS, and semiconductor band SS is presented easily.
Above-mentioned loading attachment 105 also has first and turns to track 112.Above-mentioned first turns to track 112 to be arranged on the mobile route of above-mentioned propeller 106 and above-mentioned first clamper 110.Above-mentioned first turns to track 112 to comprise is arranged to the pair of tracks of revolving three-sixth turn.First turns to track 112 to allow a semiconductor band SS to place on it, is used to rotate the semiconductor band SS that is placed, so that can change the moving direction of the semiconductor band SS that is placed.
And feed part 200 is set, make between itself and the above-mentioned loading part 100 to be orthogonal.Feed part 200 is used for above-mentioned semiconductor band SS is fed to unloading portion (400) from above-mentioned loading part 100.Above-mentioned feed part 200 has the track of presenting 202.Above-mentioned presenting first pick-up 204 and second pick-up 206 are set on the track 202, win pick-up 204 and second pick-up 206 can be moved along the above-mentioned track 202 of presenting.
Certainly, when above-mentioned first turned to track 112 to be in stationary state, above-mentioned first pick-up 204 and second pick-up 206 were rotatable to change the moving direction of above-mentioned semiconductor band SS.
Preferably, first pick-up 204 is arranged on to present and closes on above-mentioned loading part 100 places on the track 202.In this case, first pick-up 204 can pick up semiconductor band SS that a semiconductor band SS and easily presenting picked up easily to chuck platform 304, will elaborate to chuck platform 304 after a while.
Preferably, above-mentioned second pick-up 206 is arranged on above-mentioned presenting and closes on above-mentioned unloading portion 400 places on the track 202.In this case, above-mentioned second pick-up 206 can pick up a semiconductor band SS easily, and can easily present the semiconductor band SS that picked up to unloading portion 400.
And the cutting part 300 that is used to process one or more semiconductor band SS is arranged at above-mentioned below of presenting track 202 cores.
Above-mentioned cutting part 300 comprises chuck platform unit 302, is installed into to move horizontally along X axle and Y direction.One or more semiconductor band SS to be processed are placed on the upper surface of chuck platform unit 302.Cutting part 300 also comprises cutter unit 320, is used for certain the some processing semiconductor strips S S on a semiconductor band SS, perhaps certain bar straight line or the Curve Machining semiconductor band SS on the semiconductor band SS.Cutter unit 320 recoverable X axles, Y axle and θ position thereof.Cutting part 300 also comprises sensing cell 330, is used to obtain about the information of the position of semiconductor band SS to be processed and sends positional information to the above-mentioned cutter unit 320 that is detected, so that the Working position of above-mentioned cutter unit 320 is able to proofread and correct.Cutting part constitutes the semiconductor packages processing unit (plant) according to said structure.
Certainly, above-mentioned semiconductor packages processing unit (plant) can be used as the processing unit (plant) of the workpiece of processing except the semiconductor band.For example, above-mentioned processing unit (plant) is used in and forms certain mark on the workpiece.
As shown in Figure 1, chuck platform unit 302 comprises: a plurality of chuck platforms 304, each chuck platform are suitable at semiconductor band of semiconductor band SS supported underneath; With the chuck platform feeder 310 that is used to present above-mentioned chuck platform 304.
Each chuck platform 304 is used for during carrying out process operation through cutter unit 320, below semiconductor band SS, fixes and support a semiconductor band SS.To explain the process operation of cutter unit 320 after a while.The those skilled in the art should recognize that above-mentioned chuck platform 304 can have arbitrary structures.
Above-mentioned chuck platform feeder 310 comprises: first feeding member 312 is used for presenting above-mentioned chuck platform 304 along X-direction; And second feeding member 314, be used for presenting above-mentioned chuck platform 304 along Y direction.
Dispose above-mentioned second feeding member 314 and above-mentioned to present track 202 orthogonal thereto.As stated, above-mentioned second feeding member 314 is used for presenting above-mentioned chuck platform 304 along Y direction.Wherein, as long as removable chuck platform 304, above-mentioned second feeding member 314 can have arbitrary structures.Second feeding member 314 can comprise several feeding members that are arranged in parallel.In this embodiment, second feeding member 314 comprises four feeding members, that is, and and 2-1 feeding member 314a, 2-2 feeding member 314b, 2-3 feeding member 314c and 2-4 feeding member 314d.In this case, second feeding member 314 can be configured to inside and have screw and axle, can move simultaneously so that constitute all feeding members of above-mentioned second feeding member 314.
It is orthogonal thereto with above-mentioned second feeding member 314 to dispose above-mentioned first feeding member 312.First feeding member 312 is used for presenting second feeding member 314 along X-direction.The feeding member that constitutes second feeding member 314 can move through first feeding member 312 simultaneously.
Cutter unit 320 a side of above-mentioned second feeding member 314 be arranged at second feeding member 314 above.Above-mentioned cutter unit 320 is used to process the semiconductor band SS that is placed on each chuck platform 304.
For above-mentioned cutter unit 320, can use various cutter sweeps.In execution mode shown in Figure 1, cutter unit 320 can comprise laser cutting device.And cutter unit 320 can comprise the blade in the execution mode shown in figure 15.
Above-mentioned laser cutting device is provided with head (not shown in the accompanying drawing) on the top, above-mentioned head is configured to, the controller that in through laser cutting device, comprises to X axle, Y axle with and the condition controlled of θ position under move.Above-mentioned laser cutting device is used for along curve and straight line above-mentioned semiconductor band SS shown in Figure 9 being processed, and is extremely shown in Figure 12 like Figure 10.Certainly, can process, make it to be cut into independently a plurality of semiconductor packages SP respectively semiconductor bar band SS.
Can use several laser cutting devices.At this, cutter unit 320 comprises two cutter units in the execution mode shown in Fig. 1, that is, and and the first cutter unit 320a and the second cutter unit 320b.
And the above-mentioned first cutter unit 320a and the second cutter unit 320b are arranged on the top of above-mentioned second feeding member 314.As shown in Figure 1, the first cutter unit 320a and the second cutter unit 320b can lay respectively at the top of 2-2 feeding member 314b and 2-4 feeding member 314d.Certainly, the above-mentioned first cutter unit 320a and the second cutter unit 320b also can be arranged at the top of 2-1 feeding member 314a and 2-3 feeding member 314c respectively.
Sensing cell 330 a side of above-mentioned second feeding member 314 be arranged on second feeding member 314 above.
Above-mentioned sensing cell 330 has video getter 332, is used for the position that sensing is installed on the semiconductor band SS on each the chuck platform 304 that is connected with second feeding member 314.Sensing is carried out in the position of 332 pairs of semiconductor bar bands of above-mentioned video getter SS; And transmission is about the controller (not shown in the accompanying drawing) of information to the above-mentioned laser cutting device of the position of the semiconductor band SS of institute's sensing, so that can regulate the beam transmit direction of the head of laser cutting device.
And, in above-mentioned cutting part 300 cutter unit 320 regions below be provided with waste material box 350.Above-mentioned waste material box 350 is as the discharge-channel of impurity, so that the impurity that during process operation, is produced is excluded through self-weight of impurity.
And, above second feeding member 314, being provided with video getter track 334, above-mentioned video getter track 334 is orthogonal to above-mentioned second feeding member 314 and is parallel to above-mentioned first feeding member 312.And above-mentioned video getter 332 can move along above-mentioned video getter track 334.
In addition, be provided with unloading portion 400 in that relative side of the side with being provided with above-mentioned loading part 100 of above-mentioned feed part 200.Above-mentioned unloading portion 400 has a plurality of unload cassettes 402.In each unload cassette 402, can stack a plurality of fully processing after semiconductor band SS.Can certainly in each unload cassette 402, only put a semiconductor band SS.
And unloading portion 400 also comprises second conveyer 404, is used for presenting one by one unload cassette 402.Above-mentioned second conveyer 404 can be used various drive systems, and preferably, second conveyer 404 is used the belt-type drive system.
End at second conveyer 404 is provided with discharge mechanism 410.Above-mentioned discharge mechanism 410 has second and turns to track 412, and above-mentioned second turns to track 412 to be arranged on the below of the mobile route of above-mentioned second pick-up 206.Above-mentioned second turns to track 412 to comprise the pair of tracks that is arranged to revolve three-sixth turn; And above-mentioned second turns to track 412 to allow a semiconductor band SS to place on it; Be used to rotate the semiconductor band SS that is placed, to change the moving direction of the semiconductor band SS that is placed.
And discharge mechanism 410 also comprises second clamper 414.Above-mentioned second clamper 414 picks up and is positioned over above-mentioned second and turns to the side of the semiconductor band SS on the track 412, and presents the semiconductor band SS that picked up that side to the unload cassette 402 of discharge mechanism 410.
And; Above-mentioned discharge mechanism 410 should be configured to: when semiconductor band SS is divided into respectively independently a plurality of semiconductor packages SP along with being cut fully, above-mentioned discharge mechanism 410 pick up above-mentioned respectively independently the semiconductor packages SP that picked up of semiconductor packages SP and presenting to unloading portion 400.
Below, specify operation according to semiconductor band system of processing first execution mode of the present invention with said structure.
At first, as shown in Figure 2, when a semiconductor band SS is placed in 102 last times of carrying case of loading part 100,104 operations of first conveyer are to be sent to propeller 106 with above-mentioned carrying case 102.
When above-mentioned carrying case 102 is aimed at the moving direction of above-mentioned propeller 106, above-mentioned propeller 106 operations.According to the operation of propeller 106, a semiconductor band SS is moved to first turn to track 112.
When above-mentioned semiconductor band SS shifts to above-mentioned first when turning to track 112, that side relative that first clamper 110 picks up above-mentioned semiconductor band SS with propeller 106, and turn to track 112 to drag (traction) semiconductor band SS towards above-mentioned first.That is, through the coordinative role of above-mentioned propeller 106 with above-mentioned first clamper 110, above-mentioned semiconductor band SS is placed in above-mentioned first and turns on the track 112.
When being placed in above-mentioned first, above-mentioned semiconductor band SS turns to 112 last times of track; As shown in Figure 3; Above-mentioned first turns to track 112 to rotate so that semiconductor band SS aims at the layout of chuck platform 304, and semiconductor band SS easily is positioned on one of them of chuck platform 304.
When above-mentioned first turned to track 112 to rotate, first pick-up 204 moved along presenting track 202, and picked up and be placed in the above-mentioned first above-mentioned semiconductor band SS that turn on the track 112.Afterwards, first pick-up 204 is placed in the semiconductor band SS that is picked up on the chuck platform 304 on one of them that is arranged in 2-2 feeding member 314b and 2-4 feeding member 314d.Subsequently, first pick-up 204 will be placed in second half conductor band SS that above-mentioned same way as is presented on the wherein chuck platform 304 on another that is arranged in 2-2 feeding member 314b and 2-4 feeding member 314d.Certainly, first pick-up 204 also can be placed in the semiconductor band SS that is picked up on the chuck platform 304 that is arranged on above-mentioned 2-1 feeding member 314a and the 2-3 feeding member 314c.When above-mentioned semiconductor band SS is placed in the 304 last times of chuck platform that are connected with above-mentioned 2-2 feeding member 314b and 2-4 feeding member 314d respectively, above-mentioned chuck platform 304 is along with the associated feed member of second feeding member 314 moves along Y direction.
When above-mentioned chuck platform 304 along with above-mentioned second feeding member 314 when Y direction moves, they will pass through sensing cell 330.At this moment, the video getter 332 of above-mentioned sensing cell 330 obtains the information about the position that is placed in the semiconductor band SS on each chuck platform 304 that is moved, and sends the controller of information to the cutter unit 320 that is obtained.
Along with the position of remembering is calibrated in video getter 332 detections of sensing cell 330 really on given position on the above-mentioned semiconductor band SS, obtain positional information.
Receive after this information, above-mentioned controller is based on the position of the head of the above-mentioned cutter unit 320 of this information correction.In this case; As shown in Figure 4; Because constituting the first cutter unit 320a and the second cutter unit 320b of above-mentioned cutter unit 320 is arranged on position 2-2 feeding member 314b and the 2-4 feeding member 314d; Therefore, sensing is carried out in 330 pairs of positions that are placed on the semiconductor band SS on the chuck platform 304 that is connected with 2-2 feeding member 314b and 2-4 feeding member 314d of above-mentioned sensing cell.
Simultaneously; As shown in Figure 5; During the semiconductor band SS on the chuck platform 304 that is positioned at 2-2 feeding member 314b and 2-4 feeding member 314d is carried out processed, semiconductor band SS will be placed on the chuck platform 304 of above-mentioned 2-1 feeding member 314a and 2-3 feeding member 314c.
Afterwards, as shown in Figure 6, the chuck platform 304 of above-mentioned 2-1 feeding member 314a and 2-3 feeding member 314c moves to the zone that the below limited of the video getter track 334 of sensing cell 330.Above-mentioned thus video getter 332 detects the position of above-mentioned semiconductor band SS on the chuck platform 304 of 2-1 feeding member 314a and 2-3 feeding member 314c, so that can carry out the position correction of cutter unit 320.
And; The processed of semiconductor band SS on the chuck platform 304 of 2-2 feeding member 314b and 2-4 feeding member 314d finishes, and a plurality of feeding members that constitute second feeding member 314 move along X-direction through first feeding member 312 simultaneously.As a result, make the chuck platform 304 of above-mentioned 2-1 feeding member 314a and 2-3 feeding member 314c lay respectively at first cutter unit 320a of the above-mentioned cutter unit 320 of formation and the below of the second cutter unit 320b.
Can accomplish cutting thus to the semiconductor band SS on all chuck platforms 304.After the cutting of accomplishing above-mentioned semiconductor band SS, above-mentioned chuck platform 304 turns back to its initial position through above-mentioned chuck platform feeder 310.
When all chuck platforms 304 were positioned at its initial position, second pick-up 206 was shifted to the zone that above-mentioned chuck platform 304 tops are limited.Then, above-mentioned second pick-up 206 picks up semiconductor band SS one by one, and makes the semiconductor band SS that is picked up be placed in second to turn on the track 412.
At this moment, as shown in Figure 8, above-mentioned second turns to track 412 to be in rotation status, makes it be parallel to chuck platform 304, so that the semiconductor band SS that easily second pick-up 206 is picked up receives.
Turn to 412 last times of track when a semiconductor band SS is placed in above-mentioned second, second clamper 414 picks up above-mentioned semiconductor band SS, and presents the semiconductor band SS that picked up that side to the unload cassette 402 of unloading portion 400.When above-mentioned semiconductor band SS is placed in 402 last times of unload cassette, 404 operations of above-mentioned second conveyer transmit semiconductor band SS to carry out the processing in next stage.Processed finishes like this.
Certainly, when the form of in above-mentioned cutting part 300, accomplishing the semiconductor band SS of processing was the semiconductor packages form, then can be configured to above-mentioned uninstalling system with independent semiconductor packages SP be the unloading that unit carries out semiconductor band SS.
Below, specify second execution mode of above-mentioned semiconductor band system of processing.Shown in figure 13, above-mentioned semiconductor band system of processing comprises: loading part 1000 is used to receive a plurality of semiconductor band SS; And first cutting part 3000.Above-mentioned first cutting part 3000 comprises chuck platform unit 3002, and above-mentioned chuck platform unit 3002 has a plurality of chuck platforms 3004 of placing semiconductor band SS above that one by one.Above-mentioned chuck platform 3004 can move along X axle and Y direction.Above-mentioned first cutting part 3000 also comprises first cutter sweep, is used for the bending and the straight part that are placed in the semiconductor band SS on each chuck platform 3004 are processed.Semiconductor band system of processing also comprises: the first unloading portion 4000 is used for being received in the semiconductor band SS that above-mentioned first cutting part 3000 is accomplished processing; And first feed part 2000, be used for picking up above-mentioned semiconductor band SS one by one and present the semiconductor band SS that picked up one by one to above-mentioned first cutting part 3000 or the above-mentioned first unloading portion 4000.Semiconductor band system of processing also comprises: second loading part 3204 is used to receive the above-mentioned semiconductor band SS that the above-mentioned first unloading portion 4000 unloads; Second cutting part 3200; It comprises the rotating disk 3226 and second cutter sweep; On this rotating disk, will settle semiconductor band SS one by one; Rotating disk 3336 can move along X-direction, and second cutter sweep is installed into and can moves along X-direction, so that semiconductor band SS is processed into a plurality of independently semiconductor packages SP one by one; Inspection portion 5020 is used for checking whether the above-mentioned semiconductor packages that processes at above-mentioned second cutting part 3200 exists defective; The second unloading portion 5000 is used for being received in the above-mentioned semiconductor packages SP that above-mentioned inspection portion 5020 accomplishes inspection; And transmission portion 3202, be used between above-mentioned first unloading portion 4000 and above-mentioned second loading part 3204, presenting above-mentioned semiconductor band SS.
Above-mentioned first loading part 1000 has a plurality of first carrying cases 1002.In above-mentioned each first carrying case 1002, can stack a plurality of semiconductor band SS that will cut.Certainly, also can in above-mentioned each first carrying case 1002, only place a semiconductor band SS.
And above-mentioned first loading part 1000 also comprises first conveyer 1004, is used for presenting one by one above-mentioned first carrying case 1002.Above-mentioned first conveyer 1004 can use various drive systems.Preferably, first conveyer 104 is used the belt-type drive system.
End at above-mentioned first conveyer 1004 is provided with first loading attachment 1005.Above-mentioned first loading attachment 1005 has first propeller 1006.Above-mentioned first propeller 1006 is used for through advancing above-mentioned each a side that is stacked in above-mentioned first carrying case 1002 and shifts to a plurality of semiconductor band SS of first propeller 1006 through first conveyer 1004; Move semiconductor band SS one by one, make semiconductor band SS be placed in first one by one and turn on the track 1008.
And above-mentioned first loading attachment 1005 also comprises first clamper 1010.Above-mentioned first clamper 1010 is set in the face of above-mentioned first propeller 1006; Therefore; When above-mentioned first propeller 1006 when first turns to track 1008 to advance the side of a semiconductor band SS; Above-mentioned first clamper 1010 picks up and draws the opposite side of above-mentioned semiconductor band SS, so that above-mentioned semiconductor band SS is fed easily.
And above-mentioned first loading attachment 1005 comprises that also first turns to track 1008.First turns to track 1008 to be arranged on the mobile route of above-mentioned first propeller 1006.Above-mentioned first turns to track 1008 to comprise the pair of tracks that is arranged to revolve three-sixth turn; Above-mentioned first turns to and can place a semiconductor band SS on the track 1008; And first turns to track 1008 to be used to make the semiconductor band SS of above-mentioned placement to rotate, so that the semiconductor band SS that is placed is moved to other directions.
In addition, above-mentioned first feed part 2000 and the 1000 quadrature settings of above-mentioned first loading part.Above-mentioned first feed part 2000 is used for above-mentioned semiconductor band SS is fed to above-mentioned first cutting part 3000 or the first unloading portion 4000 one by one from first feed part 1000.
Above-mentioned first feed part 2000 comprises that also first presents track 2002.Above-mentioned first present track 2002 a side be provided with first pick-up 2004, above-mentioned first pick-up 2004 can be presented track 2002 along above-mentioned first and move.
Particularly, first pick-up 2004 can be arranged at above-mentioned first and present track 2002 tops and above-mentioned first loading part, 1000 adjacents.Above-mentioned first pick-up 2004 picks up above-mentioned semiconductor band SS one by one, and presents the semiconductor band SS that picked up to chuck platform 3004, and specific descriptions will be done to above-mentioned chuck platform 3004 in the back.
And, present above-mentioned first and also to be provided with second pick-up 2006 on the track 2002.Above-mentioned second pick-up 2006 picks up the above-mentioned semiconductor band SS of initial cut one by one, and presents semiconductor band SS to the first unloading portion 4000 of being picked up.
And, above-mentioned first present track 2002 middle body below be provided with first cutting part 3000.Above-mentioned first cutting part 3000 has cutter sweep, and above-mentioned cutting part 3000 has identical structure with the cutting part 300 described in above-mentioned first execution mode.Correspondingly, replace the element of reference number 300, the first cutting parts 3000 of Fig. 1 to refer to, and hereinafter repeat no more by reference number 3000.
But above-mentioned first cutting part 3000 is used for along straight line and curve above-mentioned semiconductor band SS being processed.That is, above-mentioned first cutting part 3000 is used curved blades and along straight line and curve unmanageable part of each semiconductor band SS cut, and is not fully semiconductor bar band SS to be cut, and is shown in figure 10.
In addition, above-mentioned first present track 2002 be provided with the first unloading portion 4000 with first loading part, 1000 relative sides.The above-mentioned first unloading portion 4000 has a plurality of first unload cassettes 4002.In each above-mentioned first unload cassette 4002, can stack the semiconductor band SS of a plurality of initial cut.Certainly, in each above-mentioned first unload cassette 4002, also can only put a semiconductor band SS.
And the above-mentioned first unloading portion 4000 also comprises second conveyer 4004 that is used for presenting one by one first unload cassette 4002.Above-mentioned second conveyer 4004 can be used various drive systems.Preferably, second conveyer 4004 is used the belt-type drive system.
And, be provided with first discharge mechanism 4010 at an end of the above-mentioned first unloading portion 400.Above-mentioned first discharge mechanism 4010 has second and turns to track 4012, is arranged at the below of above-mentioned second pick-up, 2006 mobile routes.Above-mentioned second turns to track 4012 to have the pair of tracks that is arranged to revolve three-sixth turn; And second turns to track 4012 to allow a semiconductor band SS to place on it; Be used to rotate the semiconductor band SS that is placed, change the moving direction of the semiconductor band SS that is placed thus.
Above-mentioned first discharge mechanism 4010 also comprises second clamper 4014.Above-mentioned second clamper 4014 picks up and is positioned at the above-mentioned second semiconductor band SS that turn on the track 4012, and the semiconductor band SS that is picked up is placed on one of them of above-mentioned unload cassette 4002.
And, between above-mentioned first unloading portion 4000 and above-mentioned second loading part 3204, be provided with transmission portion 3202.Above-mentioned transmission portion 3202 is used for presenting semiconductor band SS to the second cutting part 3200 through initial cut from above-mentioned first cutting part 3000.
End in above-mentioned transmission portion 3202 is provided with second loading part 3204.Above-mentioned second loading part 3204 has a plurality of second carrying cases 3206.In each above-mentioned second carrying case 3206, can stack a plurality of semiconductor band SS that will cut.Certainly, in each above-mentioned second carrying case 3206, also can only put a semiconductor band SS.
And above-mentioned second loading part 3204 also comprises the 3rd conveyer 3208 that is used for presenting one by one second carrying case 3206.Above-mentioned the 3rd conveyer 3208 can be used various drive systems.Preferably, the 3rd conveyer 3208 is used the belt-type drive system.
Above-mentioned second loading part 3204 has second loading attachment 3209.Above-mentioned second loading attachment 3209 has second propeller 3210.Above-mentioned second propeller 3210 is used for being loaded in above-mentioned second carrying case 3206 and shifting to each the side of the above-mentioned semiconductor band SS of second propeller 3210 through the 3rd conveyer 3208 through propelling; Move semiconductor band SS one by one, the semiconductor band is placed in one by one introduces on the track 3218.
Above-mentioned introducing track 3218 has pair of tracks, is used for temporarily on the mobile route of the 3rd pick-up 3216, depositing a semiconductor band SS, so that above-mentioned the 3rd pick-up 3216 picks up above-mentioned semiconductor band SS easily.
And above-mentioned second loading attachment 3209 also comprises the 3rd clamper 3220.Above-mentioned the 3rd clamper 3220 is set in the face of above-mentioned second propeller 3210.Therefore, when above-mentioned second propeller 3210 when above-mentioned introducing track 3218 advances the side of a semiconductor band SS, above-mentioned the 3rd clamper 3220 picks up and draws the opposite side of above-mentioned semiconductor band SS.
In addition, second feed part 3212 and second loading part 3204 laterally arrange.Above-mentioned second feed part 3212 has second and presents track 3214.Present above-mentioned second and to be provided with the 3rd pick-up 3216 on the track 3214, above-mentioned the 3rd pick-up 3216 can be presented track 3214 along above-mentioned second and move.Above-mentioned the 3rd pick-up 3216 picks up above-mentioned semiconductor band SS one by one, and presents the semiconductor band SS that picked up to rotating disk 3226.The back will specifically describe above-mentioned rotating disk 3226.
Second cutting part 3200 is arranged at the core of above-mentioned second feed part 3212.Above-mentioned second cutting part 3200 is arranged in the below of above-mentioned second feed part 3212.Except turntable 3226, above-mentioned second cutting part 3200 also comprises blade unit 3224.
Above-mentioned blade unit 3224 is provided with blade in the one of which side, is used to cut each semiconductor band SS.Above-mentioned blade unit 3224 can comprise a pair of blade unit.
Above-mentioned blade unit 3224 is processed into a plurality of semiconductor packages SP through above-mentioned semiconductor band SS is cut into a plurality of parts according to required size with each semiconductor band SS.
And a side of above-mentioned second cutting part 3200 is provided with rotating disk 3226.Above-mentioned rotating disk 3226 can be done 360 degree rotations through motor, on above-mentioned rotating disk 3226, chuck platform 3230 can be set.
Above-mentioned chuck platform 3230 is to be used for during 3224 couples one semiconductor band SS of above-mentioned blade unit carries out cutting operation, below semiconductor band SS, fixing and supporting said semiconductor band SS.The those skilled in the art should recognize that above-mentioned chuck platform 3230 can have arbitrary structures.
And, ash can (not shown in the accompanying drawing) can be set, so that remove the impurity that when each semiconductor band SS being processed into a plurality of semiconductor packages SP, produces in the bottom of above-mentioned second cutting part 3200.Replace ash can, air nozzle (not shown in the accompanying drawing) can be set, in a side of second cutting part 3200 so that trash flow is to a direction.
In addition, being provided with the 4th pick-up 3232, the four pick-ups 3232 in a side of above-mentioned second feed part 3212 can present track 3214 along above-mentioned second and move.Above-mentioned the 4th pick-up 3232 is used to present the semiconductor bar that on rotating disk 3226, cuts fully and brings to the second unloading portion 5000.
And, washing/drying portion 3234 is set on the mobile route of above-mentioned the 4th pick-up 3232.Above-mentioned cleaning-drying portion 3234 is used for after accomplishing process operation cleaning from the semiconductor packages of above-mentioned second cutting part 3200 and dry.
The above-mentioned second unloading portion 5000 has dry section (drying block) 5002, is used for the dry up hill and dale semiconductor packages SP that presents via above-mentioned the 4th pick-up 3232.Before inspection portion 5020 carried out checked operation, above-mentioned dry section 5002 was removed fully after washing/drying portion 3234 carries out cleaning operation and is remained in the moisture on the semiconductor packages SP, will describe in detail after a while.
The above-mentioned second unloading portion 5000 has the 3rd and presents track 5004.The 5th pick-up 5006 is arranged on the above-mentioned the 3rd and presents on the track 5004, and can present track 5004 along the above-mentioned the 3rd and move.Above-mentioned the 5th pick-up 5006 is used for the above-mentioned semiconductor packages SP at above-mentioned dry section 5002 bone dries is fed to rest area 5008, the above-mentioned rest area 5008 temporary transient inspection above-mentioned semiconductor packages SP before that preserve.
Below the mobile route of above-mentioned the 5th pick-up 5006, rest area 5008 is arranged in a side of the mobile route of the 5th pick-up 5006.Above-mentioned rest area 5008 is disposed at and the above-mentioned the 3rd presents the rest area that track 5004 quadratures extend and present on the track 5010, and can present track 5010 along above-mentioned rest area and move to inspection portion 5020.
The above-mentioned the 3rd present track 5004 a side be provided with the 6th pick-up 5012.Above-mentioned the 6th pick-up 5012 is used for the semiconductor packages SP that portion 5020 on inspection checks fully is fed to acceptance division 5022, and the back will specifically describe above-mentioned acceptance division 5022.
The second unloading portion 5000 also comprises semiconductor packages feed part 5014, and it is parallel and be orthogonal to rest area and present track 5010 that semiconductor packages feed part 5014 and the above-mentioned the 3rd is presented track 5004.Above-mentioned semiconductor packages feed part 5014 comprises that semiconductor packages presents track 5016 and semiconductor packages pick-up 5018, and above-mentioned semiconductor packages pick-up 5018 can be presented track 5016 along semiconductor packages and move.
Above-mentioned semiconductor packages pick-up 5018 picks up to be loaded into along above-mentioned rest area presents the above-mentioned semiconductor packages on the above-mentioned rest area 5008 that track 5010 moves, and the semiconductor packages of being picked up is shifted to the zone that inspection portion 5020 tops limit.
According to user's demand, several semiconductor packages feed part 5014 can be provided.In this execution mode, two semiconductor packages feed part 5014 are provided.Below the mobile route of above-mentioned semiconductor packages pick-up 5018, inspection portion 5020 is arranged on a side of the mobile route of semiconductor packages pick-up 5018.Above-mentioned inspection portion 5020 is used to check whether the above-mentioned semiconductor packages of being picked up and being presented by 5018 of above-mentioned semiconductor packages pick-ups exists defective.
In addition, in the above-mentioned second unloading portion 5000, also be provided with acceptance division 5022.Above-mentioned acceptance division 5022 comprises: receive plate rail 5024, be used to receive the semiconductor packages of presenting from inspection portion 5020; And, receiving plate rail and present track 5026, above-mentioned reception plate rail 5024 can move along above-mentioned track.
Above-mentioned reception plate rail is presented track 5026 and is presented track 5004 and semiconductor packages with respect to the above-mentioned the 3rd and present track 5016 quadratures and extend.Several acceptance divisions 5022 can be provided, preferably, two or more acceptance divisions 5022 be provided.
One of them of two or more acceptance divisions 5022 can be used as the semiconductor packages SP of substandard products is confirmed as in reception by above-mentioned inspection portion 5020 space.In addition, all the other acceptance divisions 5022 are as receiving the space of being confirmed as the semiconductor packages SP of certified products by above-mentioned inspection portion 5020.
Below, specify operation according to second execution mode of above-mentioned semiconductor band system of processing of the present invention.
In second execution mode, the operational mode of first loading part 1000, first feed part 2000 and the first unloading portion 4000 of semiconductor band system of processing is identical with its operational mode in above-mentioned first execution mode.And the operational mode of first cutting part 3000 is similar with the operational mode of cutting part 300 in above-mentioned first execution mode.
But first cutting part 3000 is different from the cutting mode of cutting part 300 in second execution mode with mode cutting semiconductor band shown in figure 10.Above-mentioned semiconductor band SS is fed to the first unloading portion 4000 after 3000 cuttings of first cutting part, be fed to second loading part 3204 through transmission portion 3202 from the first unloading portion 4000 then.
Particularly, the above-mentioned semiconductor band of presenting along above-mentioned transmission portion 3202 arrives at the 3rd conveyer 3208, overlays then in one of them of second carrying case 3206.When above-mentioned semiconductor band SS was placed in second carrying case 3206,3208 operations of above-mentioned the 3rd conveyer were to move second carrying case 3206 to second propeller 3210.
When second carrying case 3206 arrives at second propeller 3210; Above-mentioned second propeller 3210 is pushed the semiconductor band SS of above-mentioned second carrying case 3206 to the 3rd pick-up 3216; Next; The 3rd clamper 3220 picks up the side of above-mentioned semiconductor band SS, and presents the semiconductor band SS that picked up to introducing track 3218.
When above-mentioned semiconductor band SS arrived at above-mentioned introducing track 3218, above-mentioned the 3rd pick-up 3216 picked up and is positioned over the above-mentioned semiconductor band SS that introduces on the track 3218, and presents track 3214 along second of second feed part 3212 and move to rotating disk 3226.The 3rd pick-up 3216 is positioned over above-mentioned semiconductor band SS on the chuck platform 3230 of above-mentioned rotating disk 3226 then.
Next, each blade unit 3224 operation.Each above-mentioned blade unit 3224 can presented on the parallel direction of track 3214 and moving with above-mentioned second.According to the operation of each blade unit 3224, the blade of above-mentioned blade unit 3224 with above-mentioned second present move on the parallel direction of track 3214 in, SS cuts to the semiconductor bar band.
Because above-mentioned rotating disk 3226 can rotate, thus can the entire portion of the semiconductor band SS on the chuck platform 3230 that be positioned at above-mentioned rotating disk 3226 be cut into a plurality of semiconductor packages SP, shown in Figure 11 and 12.On above-mentioned rotating disk 3226, picked up by the 4th pick-up 3232, and present semiconductor packages SP to the second unloading portion 5000 of being picked up by the 4th pick-up 3232 by the above-mentioned semiconductor packages SP of cutting fully.
When being presented by above-mentioned the 4th pick-up 3232, above-mentioned semiconductor packages SP is through washing/drying portion 3234.When semiconductor packages SP process washing/drying portion 3234, the impurity that during processed, is attached to semiconductor packages SP is removed from semiconductor packages SP fully.
The above-mentioned semiconductor packages SP that has accomplished cleaning and dried is stacked in the dry section 5002 of the second unloading portion 5000.Then, above-mentioned semiconductor packages SP fully is dried in above-mentioned dry section 5002.
5006 couples of above-mentioned semiconductor packages SP through bone dry of the 5th pick-up pick up, and then the 5th pick-up 5006 is presented the semiconductor packages SP that picked up to rest area 5008.Then, being positioned over above-mentioned semiconductor packages SP on the above-mentioned rest area 5008 presents track 5010 along above-mentioned rest area and presents.
5018 pairs of semiconductor packages pick-ups are presented the above-mentioned semiconductor packages SP that track 5010 presents along above-mentioned rest area and are picked up, and semiconductor packages pick-up 5018 is presented semiconductor packages SP to inspection portion 5020.Then, the above-mentioned semiconductor packages SP that is fed to above-mentioned inspection portion 5020 presents track 5016 along above-mentioned semiconductor packages and presents, and simultaneously, presents track 5026 and presents and receive plate rail 5024 along receiving plate rail.
The semiconductor packages of confirming as certified products through above-mentioned inspection portion 5020 is stacked in the reception plate rail 5024 that is used for receiving certified products, and the semiconductor packages of confirming as substandard products through above-mentioned inspection portion 5020 is stacked in the reception plate rail 5024 that is used for receiving substandard products.
Through above-mentioned operation, according to the EO of the semiconductor band system of processing of second execution mode.
Below, the 3rd execution mode of detailed description semiconductor band system of processing.
Shown in figure 14, semiconductor band system of processing comprises: loading part 500 is used to receive a plurality of semiconductor bands; And cutting part 700.Above-mentioned cutting part 700 comprises chuck platform unit 702 and cutter sweep.Above-mentioned chuck platform unit 702 has a plurality of chuck platforms 704, is used for placing one by one semiconductor band SS above that.Above-mentioned chuck platform 704 can move along X axle and Y direction.Above-mentioned cutter sweep is installed movably, is processed into a plurality of independently semiconductor packages SP with the semiconductor band SS that will be positioned on each chuck platform 704.Semiconductor band system of processing also comprises: washing/drying portion 800 is used for the above-mentioned semiconductor packages SP through cutting is fully carried out cleaning-drying; Inspection portion 900 is used to check out all clear and washes dry semiconductor packages SP and whether have defective; Unloading portion 950 is used to finish receiving the above-mentioned semiconductor packages SP after the inspection; And feed part 600, be used to pick up above-mentioned semiconductor band SS and it is fed to above-mentioned loading part 500 or above-mentioned cutting part 700, and pick up semiconductor packages SP and it is fed to above-mentioned washing/drying portion 800, above-mentioned inspection portion 900 or unloading portion 950.
Above-mentioned loading part 500 has a plurality of carrying cases 502.In each carrying case 502, can stack a plurality of semiconductor band SS that will cut.Certainly, also can in above-mentioned each carrying case 502, only place a semiconductor band SS.
And above-mentioned loading part 500 also comprises conveyer 504, is used for presenting one by one above-mentioned carrying case 502.Above-mentioned conveyer 504 can use various drive systems.Preferably, conveyer 504 uses the belt-type drive system.
Above-mentioned loading part 500 comprises loading attachment 505.Above-mentioned loading attachment 505 has propeller 506.Above-mentioned propeller 506 moves semiconductor packages SS one by one through promoting to be stacked in each the side of a plurality of semiconductor band SS of shifting to propeller 506 in the above-mentioned carrying case 502 and through conveyer 504, it is positioned over one by one introduces on the track 510.
And above-mentioned loading attachment 505 also comprises clamper 508.Above-mentioned clamper 508 is set in the face of above-mentioned propeller 506; Therefore; When above-mentioned propeller 506 when introducing track 510 and advance the side of above-mentioned semiconductor band SS, above-mentioned clamper 508 picks up and drags the opposite side of (or traction) above-mentioned semiconductor band SS.
And, also be provided with introducing track 510 at loading part 500.Particularly, above-mentioned introducing track 510 is set on the mobile route of above-mentioned propeller 506 and clamper 508, be set at simultaneously first pick-up 604 that feed part 600 comprised mobile route a side and be positioned at the below of this mobile route.First pick-up 604 of above-mentioned feed part 600 will detail hereinafter.Above-mentioned introducing track 510 comprises pair of tracks, is used for to cutting part 700, temporarily depositing a semiconductor band SS at the above-mentioned semiconductor band SS of transmission.
And feed part 600 is disposed at a side of above-mentioned loading part 500.Above-mentioned feed part 600 has the track of presenting 602.The above-mentioned track 602 of presenting is provided with and can presents first pick-up 604 that track 602 moves along above-mentioned.Above-mentioned first pick-up 604 picks up the above-mentioned semiconductor band that is positioned on the above-mentioned introducing track 510; The semiconductor band that is picked up is positioned over presents on the track 602; So that the semiconductor band can be fed to chuck platform unit 708, hereinafter will detail chuck platform unit 708.
Also be provided with second pick-up 606 on the track 602 above-mentioned presenting.Above-mentioned second pick-up 606 is used for presenting semiconductor packages SP to washing/drying portion 800 from cutting part 700.Hereinafter will detail cutting part 700 and washing/drying portion 800.
Also be provided with the 3rd pick-up 608 on the track 602 presenting.Above-mentioned the 3rd pick-up 608 is used for presenting semiconductor packages SP to inspection portion 900 from washing/drying portion 800.Below the middle body of above-mentioned feed part 600, be provided with the cutting part 700 that above-mentioned semiconductor band SS is processed.
Contained chuck platform unit 702 is arranged as and can moves horizontally along X axle and Y direction in the above-mentioned cutting part 700.Want processed one or more semiconductor band SS to be placed on the upper surface of chuck platform unit 702.The cutter unit 720 that is also contained in the cutting part 700 can be processed a semiconductor band SS by certain point on semiconductor band SS, perhaps can be along straight line on the semiconductor band SS or a semiconductor band of Curve Machining SS.Cutter unit 720 is gone back recoverable at the X axle, the Y axle with and the θ position.Cutting part 700 also comprises sensing cell 730, is used to obtain the information about the position of the semiconductor band SS that will process, and detected positional information is sent to cutter unit 720, makes the Working position of above-mentioned cutter unit 720 can obtain proofreading and correct.According to said structure, cutting part 720 forms the semiconductor packages processing unit (plant).
Shown in figure 14ly go out, each in a plurality of chuck platforms that in above-mentioned chuck platform unit 702, comprise is used for a semiconductor band of the supported underneath SS at semiconductor band SS.Chuck platform unit 702 also comprises chuck platform feeder 710, is used to present above-mentioned chuck platform 704.
Each chuck platform 704 is used for during carrying out process operation through 720 pairs of semiconductor bar bands of cutter unit SS, below semiconductor band SS, fixing and supporting a semiconductor band SS.Hereinafter will detail the process operation of cutter unit 720.The those skilled in the art should recognize that above-mentioned chuck platform 704 can have arbitrary structures.
Above-mentioned chuck platform feeder 710 comprises: first feeding member 712 can make above-mentioned chuck platform 704 move along X-direction; And second feeding member 714, above-mentioned chuck platform 704 is moved along Y direction.
Dispose above-mentioned second feeding member 714 and above-mentioned to present track 602 orthogonal thereto, above-mentioned second feeding member 714 is used for above-mentioned chuck platform 304 is presented along Y direction.It is orthogonal thereto with above-mentioned second feeding member 714 to dispose above-mentioned first feeding member 712, and above-mentioned first feeding member 712 is used for presenting above-mentioned second feeding member 714 along X-direction.
And above-mentioned second feeding member 714 can comprise parallel several feeding members of arranging.In this execution mode, above-mentioned second feeding member 714 comprises four feeding members, that is, and and 2-1 feeding member 714a, 2-2 feeding member 714b, 2-3 feeding member 714c and 2-4 feeding member 714d.
And cutter unit 720 is arranged on a side of above-mentioned second feeding member 714 and the top of second feeding member 714.Above-mentioned cutter unit 720 is used to process the above-mentioned semiconductor band SS that is placed on each chuck platform 704.
Above-mentioned cutter unit 720 can be used various cutter sweeps.Cutter unit 720 can comprise the laser cutting device in this execution mode as shown in Figure 1.And cutter unit 720 can comprise the blade in the execution mode shown in figure 15.
Above-mentioned laser cutting device is provided with head (not shown in the accompanying drawing) on the top, above-mentioned head is to be configured to move under the condition that controller contained in through laser cutting device controls X axle, Y axle and head θ position.Above-mentioned laser cutting device is used for along curve and straight line semiconductor band SS shown in Figure 9 being processed, and is extremely shown in Figure 12 like Figure 10.Certainly, can process, to make it to be cut into independently a plurality of semiconductor packages SP respectively to above-mentioned semiconductor band SS.
And, can use several laser cutting devices.At this, cutter unit 720 can comprise two cutter units, that is, the first cutter unit 720a and the second cutter unit 720b are shown in the execution mode as shown in Figure 1.
And the above-mentioned first cutter unit 720a and the second cutter unit 720b are arranged on the top of above-mentioned second feeding member 714.Shown in figure 14, the above-mentioned first cutter unit 720a and the second cutter unit 720b can lay respectively on 2-1 feeding member 714a and the 2-3 feeding member 714c, or on 2-2 feeding member 714b and the 2-4 feeding member 714d.
In addition, above a side of above-mentioned second feeding member 714 is arranged on sensing cell 730 second feeding member 714.Above-mentioned sensing cell 730 has video getter 732, and above-mentioned video getter places the position of the semiconductor band SS on each the chuck platform 704 that is connected with second feeding member 714 to carry out sensing to peace z.The position of above-mentioned video getter 732 sensing semiconductor band SS; And the position of the semiconductor band SS of institute's sensing is sent to the controller (not shown in the accompanying drawing) of above-mentioned laser cutting device, so that the beam transmit direction of the head of laser cutting device can be conditioned.
And, above second feeding member 714, being provided with video getter track 734, above-mentioned video getter track 734 is orthogonal to above-mentioned second feeding member 714 and is parallel to above-mentioned first feeding member 712.And above-mentioned video getter 732 can move along above-mentioned video getter track 734.
Above-mentioned cutter unit 720 can be used various cutter sweeps.In this execution mode, 720 of cutter units are made up of a laser cutting device.
Above-mentioned laser cutting device comprises the head that is installed on its top.Above-mentioned header arrangement becomes, can along with controller contained in the laser cutting device to X axle, Y axle with and the θ position control and carry out position correction.Above-mentioned laser cutting device is used for along curve and straight line semiconductor band SS shown in Figure 9 being processed, and is extremely shown in Figure 12 like Figure 10.
And, at the following of above-mentioned cutter unit 720 waste material box 750 can be set.Above-mentioned waste material box 750 is used to make the impurity that when cutting part 700 cuts into above-mentioned semiconductor band SS a plurality of semiconductor packages SP, produces to be removed through its deadweight.
In addition, washing/drying portion 800 side relative that be arranged at above-mentioned feed part 600 with above-mentioned loading part 500.Above-mentioned washing/drying portion 800 comprises the first washing/drying portion 801 and the second washing/drying portion 811.
The above-mentioned first washing/drying portion 801 inside are limited with washing/drying space 802.In above-mentioned washing/drying space 802 to fully the cutting after semiconductor packages SP cleaning-drying.
Above-mentioned washing/drying portion 800 also comprises rinsing table 804.Above-mentioned rinsing table 804 is installed into can be presented track 805 along rinsing table and move, and above-mentioned rinsing table is presented track 805 and on the longitudinal direction of washing/drying portion 800, extended.Above-mentioned rinsing table 804 is used under the condition that above-mentioned semiconductor packages SP is positioned on the above-mentioned rinsing table 804, moving along with wash phase.On the mobile route of above-mentioned rinsing table 804, be provided with air nozzle 806.Above-mentioned air nozzle 806 is used for going up injection air to the above-mentioned semiconductor packages SP that is positioned on the above-mentioned rinsing table 804, thereby removes the impurity of the upper surface that is attached to semiconductor packages SP.Certainly, above-mentioned air nozzle 806 also can blow the hot-air of high temperature, thus the semiconductor packages SP after the dry cleaning fully.
And, in the mobile route of above-mentioned rinsing table 804, also be provided with sprinkler head 808.Above-mentioned sprinkler head 808 is used for to the above-mentioned semiconductor packages SP injection water that is positioned on the above-mentioned rinsing table 804, thereby removes the impurity of the upper surface that is attached to semiconductor packages SP.
In addition, in the mobile route of rinsing table 804, be provided with the first brush portion 810.The above-mentioned first brush portion 810 is used to remove and is attached to the impurity that is positioned at the above-mentioned semiconductor packages SP upper surface on the above-mentioned rinsing table 804.
Side in the above-mentioned first washing/drying portion 801 is provided with the second washing/drying portion 811, that is, and and in a side of the 3rd pick-up 608 mobile routes of above-mentioned feed part 600 and the second washing/drying portion 811 is set below this mobile route.The above-mentioned second washing/drying portion 811 is used to remove the impurity that is attached to above-mentioned semiconductor packages SP lower surface.
The above-mentioned second washing/drying portion 811 comprises the second brush portion 812.The above-mentioned second brush portion 812 is used to remove the impurity that is adhered on the above-mentioned semiconductor packages SP lower surface of being presented by the 3rd pick-up.
And the above-mentioned second washing/drying portion 811 also comprises air nozzle 813 and (operating) water nozzle 814, thereby removes the impurity that is attached to above-mentioned semiconductor packages SP lower surface.
Side in above-mentioned washing/drying portion 800 also can be provided with dry section (not shown in the accompanying drawing), that is, above-mentioned dry section is positioned at the end of mobile route of the 3rd pick-up 608 of above-mentioned feed part 600.Above-mentioned dry section is used for thoroughly removing and residues in above-mentioned semiconductor packages SP and go up and be not cleaned/impurity that drying section 800 is removed.
And, be provided with inspection portion 900 at an end of the mobile route of the 3rd pick-up 608 of above-mentioned feed part 600.Above-mentioned inspection portion 900 comprises first detector 914 and second detector 906, and above-mentioned first detector 914 is used to check the upper surface of the above-mentioned semiconductor packages SP after the cutting fully, and above-mentioned second detector 906 is used to check the lower surface of above-mentioned semiconductor packages SP.
Inspection portion 900 comprises that also inspection desk presents track 908, and the sensing platform is presented track 908 and extended with respect to above-mentioned track 602 quadratures of presenting, and is arranged on above-mentioned below of presenting track 602.Above-mentioned inspection portion 900 also comprises inspection desk 910, and inspection desk 910 is arranged to can be presented track 908 along above-mentioned inspection desk and move.Above-mentioned inspection desk 910 allows semiconductor packages SP to place on it, and presents track 908 along above-mentioned inspection desk and move the semiconductor packages SP that is placed.
Above-mentioned inspection desk present track 908 above be provided with the first inspection portion and present track 912, the above-mentioned first inspection portion presents track 912 and presents track 906 quadratures with respect to inspection desk and extend.The first inspection portion 914 is set to present track 912 along the above-mentioned first inspection portion and moves.The above-mentioned first inspection portion 914 is used to check whether the upper surface that is positioned at each the semiconductor packages SP on the above-mentioned inspection desk 910 exists defective.Hereinafter will be described in detail the second inspection portion 906.
Side in above-mentioned inspection portion 900 is provided with unloading portion 950.Above-mentioned unloading portion 950 has discharge mechanism and presents track 952; Above-mentioned discharge mechanism is presented track 952 and is presented track 912 with respect to the above-mentioned first inspection portion and extend in parallel; Above-mentioned unloading portion 950 also has encapsulation pick-up 954 and unloading pick-up 956, and the two can be presented track 952 along above-mentioned discharge mechanism and move.
954 couples of semiconductor packages SP that accomplish inspection at above-mentioned inspection desk 910 of above-mentioned encapsulation pick-up pick up, and it is positioned on the secondary station 958, and hereinafter will be described in detail secondary station 958.956 couples of semiconductor packages SP that checked fully by the second inspection portion 906 of above-mentioned unloading pick-up pick up, and it is positioned on the acceptance division 960 contained in the above-mentioned unloading portion 950.
On the mobile route of above-mentioned encapsulation pick-up 954 and above-mentioned unloading pick-up 956, be provided with secondary station 958.Above-mentioned secondary station 958 is used for temporarily depositing the semiconductor packages SP after the first inspection portion 914 checks fully.
Side at above-mentioned secondary station 958 is provided with the second inspection portion 906.The above-mentioned second inspection portion 906 is used to check whether the lower surface of each semiconductor packages of being checked by the first inspection portion 914 exists defective.
And, parallel with secondary station 958, below the mobile route of above-mentioned unloading pick-up 956, be provided with acceptance division 960.Be limited with certain space in the above-mentioned acceptance division 960, be used to provide reception through above-mentioned inspection portion 900 place of the semiconductor packages SP of inspection fully.
And, a plurality of above-mentioned acceptance divisions 960 can be set.Preferably, at least two acceptance divisions 960 are set.That is, preferably, unloading portion 950 has and is used to receive the acceptance division 960 that the portion of being examined 900 confirms as the semiconductor packages SP of substandard products, and is used to receive the acceptance division 960 that the portion of being examined 900 confirms as the semiconductor packages SP of certified products.
Simultaneously, unloading pick-up track 962 is set also, presents the above-mentioned unloading pick-up 956 that track 952 moves in order to present along above-mentioned discharge mechanism.Particularly; Above-mentioned unloading pick-up track 962 is configured to be orthogonal to above-mentioned discharge mechanism and presents track 952; Like this, above-mentioned unloading pick-up track 962 just can be presented track 952 along discharge mechanism and move, and above-mentioned unloading pick-up 956 can move along above-mentioned unloading pick-up track 962.
That is, above-mentioned unloading pick-up 956 both can be presented track 952 along above-mentioned discharge mechanism and move in X-direction, can move in Y direction along above-mentioned unloading pick-up track 962 again.
Below, specify operation according to the semiconductor band system of processing of third embodiment of the invention.
When a semiconductor band SS is placed in 502 last times of carrying case of loading part 500,504 runnings of first conveyer are so that carrying case 502 moves to propeller 506.When above-mentioned carrying case 502 is aimed at the moving direction of above-mentioned propeller 506, above-mentioned propeller 506 operations.According to the operation of propeller 506, a semiconductor band SS is sent on the first pick-up track 605 of first pick-up 604.
When above-mentioned semiconductor band SS when the first pick-up track 605 moves, first clamper 508 picks up that side of the semiconductor band SS relative with propeller 506, drags (or traction) above-mentioned semiconductor band SS towards the first pick-up track 605.That is, above-mentioned semiconductor band SS is placed on the above-mentioned first pick-up track 605 through the synergy of above-mentioned propeller 506 with above-mentioned first clamper 508.
When above-mentioned semiconductor band SS is placed on 506 last times of the above-mentioned first pick-up track, above-mentioned first pick-up 604 moves to cutting part 700 along the track 602 of presenting of feed part 600.When above-mentioned first pick-up 604 arrived at cutting part 700, the chuck platform 704 of above-mentioned cutting part 700 was located in the below of above-mentioned first pick-up 604.
Then, above-mentioned first pick-up 604 is placed on the semiconductor band SS that is picked up on the chuck platform 704 of above-mentioned chuck platform unit 702.In an identical manner, second half conductor band SS is placed on another chuck platform 704 of chuck platform unit 702.In case in the above described manner above-mentioned semiconductor band SS is placed 702 last times of above-mentioned chuck platform unit, related chuck platform 704 is along with above-mentioned second feeding member 714 moves along Y direction.
When above-mentioned chuck platform 704 along with above-mentioned second feeding member 714 when Y direction moves, chuck platform 704 will pass through sensing cell 730.At this moment, the video getter 732 of above-mentioned sensing cell 730 obtains the information about the position that is placed in the semiconductor band on each chuck platform 704 that is moved, and the information of being obtained is sent to the controller of cutter unit 720.
After receiving above-mentioned information, controller will be proofreaied and correct the position of the head of above-mentioned cutter unit 72.At this moment; Shown in figure 14; Because constituting the first and second cutter unit 720a and the 720b of above-mentioned cutter unit 720 lays respectively on 2-2 feeding member 714b and the 2-4 feeding member 714d; Therefore, sensing is carried out in 730 pairs of positions that are positioned at the semiconductor band SS on the chuck platform 704 that is connected with above-mentioned 2-2 feeding member 714b and 2-4 feeding member 714d of above-mentioned sensing cell.
And when the cutting technique of the semiconductor band SS on the chuck platform 304 of 2-2 feeding member 714b and 2-4 feeding member 714d finishes, above-mentioned chuck platform 704 will move along X-direction along with above-mentioned first feeding member 712.The chuck platform 704 of above-mentioned subsequently 2-1 feeding member 714a and 2-3 feeding member 714c is positioned at the below of above-mentioned cutter unit 720.
Mode can be accomplished the cutting to the semiconductor band SS on all chuck platforms 704 thus.After the cutting of accomplishing above-mentioned semiconductor band SS, above-mentioned chuck platform 704 turns back to its initial position through above-mentioned chuck platform feeder 710.
When all chuck platforms 704 were positioned at initial position, second pick-up 606 moved to the zone that above-mentioned chuck platform 704 tops limit, so that semiconductor band SS is fed to the first washing/drying portion 801.Above-mentioned then second pick-up 606 picks up the above-mentioned semiconductor packages of cutting fully, and it is installed on the rinsing table 804.
When above-mentioned semiconductor packages is placed on 804 last times of above-mentioned rinsing table, above-mentioned rinsing table 804 moves to washing/drying space 802.At first, above-mentioned rinsing table 804 is removed the impurity that is attached to semiconductor packages through air nozzle 806 through air, and afterwards, above-mentioned rinsing table 804 encapsulates through water cleaning semiconductor through sprinkler head 808.
At this moment, the first brush portion 810 is at the upper surface along above-mentioned rinsing table 804, that is, when moving along the upper surface of above-mentioned semiconductor packages, remove and be attached to the impurity that above-mentioned semiconductor package is loaded onto.
Above-mentioned rinsing table 804 passes through above-mentioned sprinkler head 808 once more through after the above-mentioned first brush portion 810, thereby through the water cleaning semiconductor encapsulation, passes through air nozzle portion 806 afterwards once more, through air purge and drying of semiconductor encapsulation.
After accomplishing the clean of in the first washing/drying portion 801, carrying out, above-mentioned rinsing table 804 turns back to its initial position.At this moment, the 3rd pick-up 608 moves to the zone that above-mentioned rinsing table 804 tops are limited.Above-mentioned then the 3rd pick-up 608 picks up above-mentioned semiconductor packages and moves to the second washing/drying portion 811.Above-mentioned the 3rd pick-up 608 moves along the above-mentioned track 602 of presenting, and in this moving process, the 3rd pick-up 608 order is through the second brush portion 812, air nozzle 813 and (operating) water nozzle 814.
Simultaneously, the dry section that is set at the above-mentioned second washing/drying portion 811 of the moisture on the above-mentioned semiconductor packages SP is removed fully.
Next, the above-mentioned semiconductor package of above-mentioned the 3rd pick-up 608 placements is loaded on the inspection desk 910.
When above-mentioned semiconductor packages is positioned over 910 last times of above-mentioned inspection desk, above-mentioned inspection desk 910 is presented track 908 along inspection desk and is moved to the zone that the first inspection portion, 914 belows are limited.At this moment, the above-mentioned first inspection portion 914 confirms whether the upper surface that is positioned over each semiconductor packages on the above-mentioned inspection desk 910 exists defective when presenting track 912 along the first inspection portion and moving.
After the above-mentioned first inspection portion 914 of process, above-mentioned rinsing table 804 turns back to its initial position.Next, encapsulation pick-up 954 picks up the semiconductor packages on the above-mentioned rinsing table 804, and it is fed to secondary station 958 when presenting track 952 along discharge mechanism and moving.
When above-mentioned semiconductor packages was placed on the above-mentioned secondary station 958, unloading pick-up 956 picked up the semiconductor packages that is positioned on the above-mentioned secondary station 958 when presenting track 952 along discharge mechanism and moving.Afterwards, above-mentioned unloading pick-up 956 moves to the above-mentioned second inspection portion 906 along unloading pick-up track 962.
The above-mentioned second inspection portion 906 confirms whether the lower surface of each semiconductor packages that unloading pick-up 956 is picked up exists defective.Then, above-mentioned unloading pick-up 956 is fed to acceptance division 960 with above-mentioned semiconductor packages when track 952 moves presenting along above-mentioned discharge mechanism.
At this moment, the semiconductor packages of confirming as certified products via above-mentioned inspection portion 900 is stacked in the acceptance division 960 that is used for certified products, and the semiconductor packages of confirming as substandard products via above-mentioned inspection portion 900 is stacked in the acceptance division 960 that is used for substandard products.
Below, specify structure according to the 4th execution mode of semiconductor band system of processing of the present invention.
Figure 15 representes the 4th execution mode of semiconductor band system of processing.Semiconductor band system of processing shown in Figure 15 comprises: loading part 6100 is used to receive the workpiece that will process, and above-mentioned workpiece is loaded into loading stage; Cutting part 6300 is used for the workpiece that is loaded is processed; And washing/drying portion 6400 is used for cleaning and dry processed workpiece fully.
Above-mentioned loading part 6100 has a plurality of carrying cases 6102.In each carrying case 6102,, can stack a plurality of semiconductor band SS that need process with the form of cassette tape box.Certainly, also can only put a semiconductor band SS in each carrying case 6102.
Loading part 6100 also comprises conveyer 6104, is used for presenting one by one above-mentioned carrying case 6102.Above-mentioned conveyer 6104 can be used various drive systems, advantageous applications belt-type drive system.
End at above-mentioned conveyer 6104 is provided with loading attachment 6105.Above-mentioned loading attachment 6105 has propeller 6106.Above-mentioned propeller 6106 is used for being stacked in above-mentioned carrying case 6102 and shifting to each the side of above-mentioned a plurality of semiconductor band SS of propeller 6106 through conveyer 6104 through propelling; Move semiconductor band SS one by one, introduce on the track 6112 thereby it is placed in one by one.To describe in detail above-mentioned introducing track 6112 below.
And above-mentioned loading attachment 6105 also comprises clamper 6110.Above-mentioned clamper 6110 is arranged at a side of above-mentioned carrying case 6102, makes it towards propeller 6106.Therefore when above-mentioned propeller 6110 when above-mentioned first introduces the side of the above-mentioned semiconductor band SS of track 6112 propellings; Above-mentioned clamper 6110 picks up and drags the opposite side of (or traction) above-mentioned semiconductor band SS, so that above-mentioned semiconductor band SS easily presents.
And above-mentioned loading attachment 6105 also comprises introduces track 6112.Above-mentioned introducing track 6112 is arranged on the mobile route of propeller 6106 and clamper 6110.Above-mentioned introducing track 6112 is made up of pair of tracks, and a semiconductor band SS is settled on it.
And feed part 6200 is set to be orthogonal to above-mentioned loading part 6100.Above-mentioned feed part 6200 is used for presenting the extremely above-mentioned washing/drying of above-mentioned semiconductor band SS portion 6400 from above-mentioned loading part 6100.Above-mentioned feed part 6200 comprises presents track 6202.Be provided with first pick-up 6204 and second pick-up 6206 on the track 6202 above-mentioned presenting, and they can be moved along presenting track 6202.
Preferably, above-mentioned first pick-up 6204 is disposed at and presents on the track 6202 and above-mentioned loading part 6100 adjacents.This is because above-mentioned first pick-up 6204 can pick up a semiconductor band SS like a cork, and is fed to the chuck platform 6304 that hereinafter will detail like a cork.
Preferably, above-mentioned second pick-up 6206 is disposed at above-mentioned 6400 adjacents with above-mentioned unloading portion of presenting on the track 6202.This is because above-mentioned second pick-up 6206 can pick up a semiconductor band SS like a cork, and is fed to washing/drying portion 6400 like a cork.
Above-mentioned present track 6202 middle bodies below be provided with the cutting part 6300 that one or more semiconductor band SS are processed.
Above-mentioned cutting part 6300 comprises chuck platform unit 6302, cutter unit 6320 and sensing cell 6330.Above-mentioned chuck platform unit 6302 is installed as in the rotatable while and can moves horizontally along Y direction, and its upper surface can be placed one or more semiconductor band SS that will process.Above-mentioned cutter unit 6320 can be processed a semiconductor band SS along the straight line on the semiconductor band SS, and can move along X-direction.Above-mentioned sensing cell 6330 is used to obtain about the information of the position of semiconductor band SS to be processed and sends positional information to chuck platform unit 6302 and the above-mentioned cutter unit 6320 that is detected, so that the position of above-mentioned cutter unit 6320 is able to proofread and correct.According to said structure, above-mentioned cutting part has constituted the semiconductor packages processing unit (plant).
Above-mentioned semiconductor packages processing unit (plant) can be used as the processing unit (plant) that is used to process the workpiece except the semiconductor band certainly.For example, can utilize above-mentioned processing unit (plant) on workpiece, to form certain mark.
Shown in figure 15; Above-mentioned chuck platform unit 6302 comprises a plurality of chuck platforms 6304 and chuck platform feeder 6310; A semiconductor band of the supported underneath SS that each chuck platform 6304 is applicable at above-mentioned semiconductor band SS, above-mentioned chuck platform feeder 6310 is used for chuck platform 6304 is presented.
During processing through cutter unit 6320, each chuck platform 6304 is used for below above-mentioned semiconductor band SS, fixing and supporting a semiconductor band SS.The process operation of cutter unit 6320 will detail after a while.The those skilled in the art should recognize that above-mentioned chuck platform 6304 can have arbitrary structures.
And chuck platform feeder 6310 comprises: first feeding member 6312 is used for presenting above-mentioned chuck platform 6304 along X-direction; Second feeding member 6314 is used for presenting above-mentioned chuck platform 6304 along Y direction; And a plurality of rotating members 6315, be used to rotate above-mentioned chuck platform 6304.
Above-mentioned second feeding member 6314 is configured to be orthogonal to the above-mentioned track 6202 of presenting, and above-mentioned second feeding member 6314 is used for presenting above-mentioned chuck platform 6304 along Y direction.And above-mentioned first feeding member 6312 is configured to be orthogonal to above-mentioned second feeding member 6314, and above-mentioned first feeding member 6312 is used on X-direction, presenting second feeding member 6314.
Above-mentioned second feeding member 6314 can comprise several feeding members that are arranged in parallel.In this execution mode, above-mentioned second feeding member 6314 comprises four feeding members, that is, 2-1 feeding member 6314a, 2-2 feeding member 6314b, 2-3 feeding member 6314c and 2-4 feeding member 6314d constitute.
Above-mentioned rotating member 6315 is provided with respectively on the chuck platform 6304 separately, so that related chuck platform 6304 can rotate.Because above-mentioned cutter unit 6320 is fixed, each rotating member 6320 rotates related chuck platform 6304 with respect to cutter unit 6320 during the cutting operation of cutter unit 6320, so that the semiconductor band is processed into different shape.
And, in a side of above-mentioned second feeding member 6314 and above second feeding member 6314, cutter unit 6320 is set.Above-mentioned cutter unit 6320 is used for the semiconductor band SS that is loaded on each chuck platform 6304 is processed.
Above-mentioned cutter unit 6320 can be used various cutter sweeps, and in execution mode shown in Figure 15, cutter unit 6320 can comprise blade.
Like Figure 11 and shown in Figure 12, above-mentioned blade is used for along straight line semiconductor bar band SS being processed.Certainly, can process above-mentioned semiconductor band SS, it is cut into respectively with a plurality of semiconductor packages SP independently.
And, can use some above-mentioned blades.Use two blade to constitute the first cutter sweep 6320a and the second cutter sweep 6320b in the execution mode shown in figure 15 respectively.
And; The above-mentioned first cutter sweep 6320a and the second cutter sweep 6320b are arranged at the top of above-mentioned second feeding member 6314; Shown in figure 15, be arranged at that 2-1 feeding member 6314a and 2-3 feeding member 6314c go up or 2-2 feeding member 6314b and 2-4 feeding member 6314d on.
And, in above-mentioned second feeding member, 6,314 one sides and above second feeding member 6314, be provided with sensing cell 6330.
Above-mentioned sensing cell 6330 has video getter 6332, and above-mentioned video getter 6332 is used for sensing is carried out in the position that is placed in the semiconductor band SS on each the chuck platform 6304 that is connected with second feeding member 6314.Sensing is carried out in the position of 6332 couples of above-mentioned semiconductor band SS of above-mentioned video getter; And transmission is about the controller (not shown in the accompanying drawing) of information to the laser cutting device of the position of the semiconductor band SS of institute's sensing; Thereby Y axle and θ position to related chuck platform 6304 are regulated, and regulate with the X shaft position to related blade.
And video getter track 6334 is arranged at the top of above-mentioned second feeding member 6314, and above-mentioned video getter track 6334 is orthogonal to above-mentioned second feeding member 6314 and is parallel to above-mentioned first feeding member 6312.Above-mentioned video getter track 6334 can move above-mentioned video getter 6332 along above-mentioned video getter track 6334.
In addition, washing/drying portion 6400 is arranged on the mobile route of above-mentioned second pick-up 6206.Above-mentioned washing/drying portion 6400 is used to remove the impurity of the semiconductor packages SP that generates after comfortable each semiconductor band processing.
And dry section 6500 is arranged at a side of above-mentioned washing/drying portion 6400.Above-mentioned dry section 6500 is used to remove and after the cleaning operation of above-mentioned washing/drying portion 6400, remains in moisture that semiconductor package loads onto etc.
Below, specify operation according to the semiconductor band system of processing of the 4th execution mode of the present invention with said structure.
Shown in figure 15, when on a carrying case 6102 of loading part 6100, settling a semiconductor band SS, conveyer 6104 operations move to propeller 6106 with above-mentioned carrying case 6102.
Above-mentioned propeller 6106 moves when above-mentioned carrying case 6102 is aimed at the moving direction of above-mentioned propeller 6106.According to the operation of propeller 6106, a semiconductor band SS is moved to introducing track 6112.
When above-mentioned semiconductor band SS when introducing track 6112 and move, that side relative with propeller 6106 that clamper 6110 picks up above-mentioned semiconductor band SS drags (or traction) semiconductor band SS towards introducing track 6112.That is, through the synergy of above-mentioned propeller 6106 and clamper 6110, above-mentioned semiconductor band SS is placed on the above-mentioned introducing track 6112.
When above-mentioned semiconductor band SS is placed in 6112 last times of above-mentioned introducing track; First pick-up 6204 moves along presenting track 6202; And pick up the above-mentioned semiconductor band SS that is placed on the above-mentioned introducing track 6112, and it is placed on one of them the chuck platform 6304 that is arranged on 2-2 feeding member 6314b and the 2-4 feeding member 6314d.Subsequently, first pick-up 6204 will be placed in second half conductor band SS that above-mentioned same way as is presented on wherein another the chuck platform 6304 that is arranged on 2-2 feeding member 6314b and the 2-4 feeding member 6314d.Certain first pick-up 6204 also can be placed in the semiconductor band SS that is picked up on the chuck platform 6304 that is arranged on 2-1 feeding member 6314a and the 2-3 feeding member 6314c.
When above-mentioned semiconductor band SS is placed in the 6304 last times of chuck platform that are connected respectively to above-mentioned 2-2 feeding member 6314b and 2-4 feeding member 6314d, above-mentioned chuck platform 6304 will move along Y direction along the related feeding member of second feeding member 6314.
When Y direction moved, they were through sensing cell 6330 along second feeding member 6314 for above-mentioned chuck platform 6304.At this moment, the video getter 6332 of above-mentioned sensing cell 6330 obtains the information about the position that is placed in the semiconductor band SS on each of the above-mentioned chuck platform 6304 that is moved, and sends the controller of information to the cutter unit 6320 that is obtained.
Above-mentioned positional information is to detect through the position of confirming mark on the last given position of 6332 couples of above-mentioned semiconductor band SS of video getter of above-mentioned sensing cell 6330 to obtain.Position-based information can be confirmed the position of semiconductor band SS.
Receive after the above-mentioned information, above-mentioned controller is proofreaied and correct the position of the chuck platform 6304 of above-mentioned cutter unit 6320 and the position of blade based on this information.At this moment; Shown in figure 15; Because above-mentioned cutter unit 6320 is positioned on 2-2 feeding member 6314b and the 2-4 feeding member 6314d, thus 6330 pairs of above-mentioned sensing cells be placed in above-mentioned 2-2 feeding member 6314b and chuck platform 6304 that 2-4 feeding member 6314d is connected on the position of semiconductor band SS carry out sensing.
Simultaneously; When the semiconductor band SS on the chuck platform 6304 that is positioned at 2-2 feeding member 6314b and 2-4 feeding member 6314d is carried out processed, semiconductor band SS will be placed on the chuck platform 6304 of above-mentioned 2-1 feeding member 6314a and 2-3 feeding member 6314c.
And; When to being positioned at above-mentioned 2-2 feeding member 6314b and when the processed of the semiconductor band SS on the chuck platform 6304 of 2-4 feeding member 6314d finished, the feeding member that constitutes second feeding member 6314 moved along X-direction through first feeding member 6312 simultaneously.This makes the chuck platform 6304 of above-mentioned 2-1 feeding member 6314a and 2-3 feeding member 6314c be positioned at the below of above-mentioned cutter unit 6320.
And shown in figure 15, through the rotation of related rotating member 6315, the semiconductor band SS that is placed on each chuck platform 6304 can be cut into the desired shape of user.
Can the semiconductor band SS on all chuck platforms 6304 be processed into semiconductor packages in the above described manner.After the cutting of accomplishing above-mentioned semiconductor band SS, above-mentioned chuck platform 6304 turns back to its initial position through above-mentioned chuck platform feeder 6310.
When all chuck platforms 6304 were positioned at initial position, second pick-up 6206 moved to the zone that above-mentioned chuck platform 6304 tops are limited along the above-mentioned track 6202 of presenting.Above-mentioned then second pick-up 6206 picks up semiconductor packages SP, and it is fed to washing/drying portion 6400.
Above-mentioned semiconductor packages SP is cleaned drying in washing/drying portion 6400.In the dry section 6500 that is arranged at above-mentioned washing/drying portion 6,400 one sides, residue in moisture on the above-mentioned semiconductor packages SP etc. and thoroughly be eliminated.
Below, specify structure according to the semiconductor band system of processing of fifth embodiment of the invention.
Shown in figure 16, above-mentioned semiconductor band system of processing mainly comprises: loading part 7100 is used to load the semiconductor band; Cutting part 7300 is used for the semiconductor band that loads is cut into semiconductor packages; Unloading portion 7400 is used to unload above-mentioned semiconductor packages; And feed part 7200, be used for presenting the semiconductor band, and present semiconductor packages to unloading portion 7400 to above-mentioned loading part 7100 or cutting part 7300.
Above-mentioned loading part 7100 has a plurality of carrying cases 7102.In each carrying case 7102, can stack a plurality of semiconductor band SS that will process with the form of cassette tape box.Can certainly in each carrying case 7102, only put a semiconductor band SS.
And above-mentioned loading part 7100 also comprises first conveyer 7104 that is used for presenting one by one above-mentioned carrying case 7102.Above-mentioned first conveyer 7104 can be used various drive systems, advantageous applications belt-type drive system.
One end of above-mentioned first conveyer 7104 is provided with propeller 7106.Above-mentioned propeller 7106 is used for being loaded into above-mentioned carrying case 7102 and shifting to each the side of above-mentioned a plurality of semiconductor band SS of first propeller 7106 through first conveyer 7104 through propelling; Move semiconductor band SS one by one; It is placed on the first pick-up track 7206 one by one, and hereinafter will detail the first pick-up track 7206.
In addition, the side at above-mentioned loading part 7100 is provided with feed part 7200.Above-mentioned feed part 7200 comprises presents track 7202 and can present first pick-up 7204 that track 7202 moves along above-mentioned.Above-mentioned first pick-up 7204 picks up the above-mentioned semiconductor band SS that loads in the above-mentioned loading part 7100 one by one, and is fed to chuck platform 7316, and hereinafter will detail chuck platform 7316.
Above-mentioned first pick-up 7204 comprises the first pick-up track 7206.The above-mentioned first pick-up track 7206 is made up of pair of tracks, and when above-mentioned first pick-up 7204 moved, first pick-up 7204 allowed a semiconductor band to be positioned on it.
Above-mentioned first pick-up 7204 also comprises first clamper 7208.Above-mentioned first clamper 7208 is set at towards above-mentioned propeller 7106.Therefore, when above-mentioned propeller 7106 when the above-mentioned first pick-up track 7206 advances a side of a semiconductor band, above-mentioned first clamper 7208 picks up and drags the opposite side of (or traction) above-mentioned semiconductor band SS.
And above-mentioned first pick-up 7204 also comprises sensing cell 7210.Above-mentioned sensing cell 7210 is used to obtain about being placed in the information (will detail after a while) of chuck platform 7316 semiconductor-on-insulator strips S S positions, and sends positional information to the cutting part 7300 that is detected.
And, cutting part 7300 being set above-mentioned below presenting track 7202 middle bodies, above-mentioned cutting part 7300 comprises that the chuck platform presents track 7302, this track is orthogonal to the above-mentioned track 7202 of presenting.
Present on the track 7302 to install at above-mentioned chuck platform and present movably chuck platform unit 7304 of track 7302 along the chuck platform.Above-mentioned chuck platform unit 7304 has at least one chuck platform 7316, presents chuck platform 7316 through chuck platform unit 7304.Chuck platform unit 7304 also comprises driving main body 7306.Above-mentioned driving main body 7306 comprises horizontal drive portion 7308 and vertical drive portion 7310.The driver that above-mentioned horizontal drive portion 7308 comprises like motor and so on makes chuck platform 7316 present track 7302 along above-mentioned chuck platform and flatly moves.Certainly, above-mentioned horizontal drive portion 7308 also can be set to present track 7302 along above-mentioned chuck platform and move chuck platform 7316 at X axle and Y direction.
And above-mentioned vertical drive portion 7310 comprises vertical guide rail 7312.Above-mentioned vertical guide rail 7312 is used to make chuck platform 7316 vertical moving.7308 catch up with that to state horizontal drive portion 7308 similar, and above-mentioned vertical drive portion has driver, so that chuck platform 7316 vertical moving.
Side at above-mentioned vertical guide rail 7312 is provided with at least one support portion 7314, this support portion 7314 and above-mentioned vertical guide rail 7312 quadratures.And above-mentioned support portion 7314 can be placed chuck platform 7316 in the above.And the power of above-mentioned support portion 7314 receivability vertical drive portions 7310 can carry out vertical moving along vertical guide rail 7312 thus.
And, on above-mentioned support portion 7314, be provided with chuck platform 7316.Above-mentioned chuck platform 7316 is used for through cutter unit 7318 cutting semiconductor bands the time, the semiconductor band SS on it in semiconductor band supported underneath position.To explain cutter unit 7318 below.The those skilled in the art should recognize that above-mentioned chuck platform 7316 can have arbitrary structures.
Several above-mentioned chuck platforms 7316 can be supported in a support portion 7314.In embodiments of the present invention, on above-mentioned support portion 7314, be set up in parallel two above-mentioned chuck platforms 7316, follow the quantity of cutter unit 7318 to be complementary.To explain cutter unit 7318 below.
Shown in figure 17, a pair of above-mentioned chuck platform can be set present track 7302.In this case, a pair of chuck platform unit 7304 can be set, make it present track 7302 along above-mentioned two chuck platforms respectively and move.Vertically removable through as stated chuck platform unit 7304 being configured to, can prevent that they disturb each other during it moves.For ease of explanation, hereinafter only provides the explanation relevant with a cutter unit 7318.
Above above-mentioned chuck platform unit 7304, present along the chuck platform on the mobile route that track 7302 moves in chuck platform unit 7304, be provided with cutter unit 7318.Above-mentioned cutter unit 7318 is used for the semiconductor band that is positioned on the chuck platform 7316 is cut into a plurality of semiconductor packages.
Above-mentioned cutter unit 7318 can be used various cutter sweeps.Cutter unit 7318 can only comprise laser cutting device.Perhaps, cutter unit 7318 can comprise laser cutting device and blade.Hereinafter is to only only comprising that with cutter unit 7318 situation of laser cutting device describes.Above-mentioned laser cutting device comprises the head 7320 that is installed on its top, and above-mentioned head 7320 can be controlled X axle, Y axle and head θ position through the controller (not shown in the accompanying drawing) that comprises in the above-mentioned laser cutting device, makes it be able to position correction.Shown in figure 10, above-mentioned laser cutting device is used for along straight line or curve above-mentioned semiconductor bar band being processed.
And, can use a plurality of laser cutting devices, in this execution mode, because two chuck platforms 7316 laterally arrange two laser cutting devices of advantageous applications.
In addition, above-mentioned present track 7202 be provided with unloading portion 7400 with above-mentioned loading part 7100 those relative sides.Above-mentioned unloading portion 7400 comprises a plurality of unload cassettes 7402.In each unload cassette 7402, can stack a plurality of fully processing after semiconductor band SS.Certainly, in above-mentioned each unload cassette 7402, also can only put a semiconductor band SS.
And above-mentioned unloading portion 7400 also comprises second conveyer 7404, is used for presenting one by one above-mentioned unload cassette 7402.Above-mentioned second conveyer 7404 can be used various drive systems, advantageous applications belt-type drive system.
And, being provided with second pick-up 7212 on the track 7202 presenting of above-mentioned feed part 7200, above-mentioned second pick-up 7212 picks up and presents the above-mentioned semiconductor packages after the cutting fully.Above-mentioned second pick-up 7212 comprises the second pick-up track 7214.The above-mentioned second pick-up track 7214 is made up of pair of tracks, is used at second pick-up, 7212 moving process, at semiconductor band of semiconductor band supported underneath.
On the above-mentioned second pick-up track 7214, be provided with second clamper 7216.Above-mentioned second clamper 7216 is used for being positioned at the above-mentioned semiconductor band on the above-mentioned second pick-up track 7214 in placement on the unload cassette 7402.
Below, specify operation according to the semiconductor band system of processing of fifth embodiment of the invention.
When a semiconductor band is placed in 7102 last times of carrying case of loading part 7100,7104 runnings of first conveyer make above-mentioned carrying case 7102 move to first propeller 7106.When the moving direction of above-mentioned carrying case 7102 and above-mentioned first propeller 7106 on time, 7106 operations of above-mentioned first propeller make semiconductor bar Tape movement to the first a pick-up track 7206.
When above-mentioned semiconductor band SS when the above-mentioned first pick-up track 7206 moves; First clamper 7208 picks up that side relative with first propeller 7106 of above-mentioned semiconductor band, and drags (or traction) semiconductor band SS towards the above-mentioned first pick-up track 7206.That is, through the synergy of above-mentioned first propeller 7106 and above-mentioned first clamper 7208, above-mentioned semiconductor band SS is placed on the above-mentioned first pick-up track 7206.
When above-mentioned semiconductor band is placed in 7206 last times of the above-mentioned first pick-up track, above-mentioned first pick-up 7204 moves to cutting part 7300 along the track 7202 of presenting of feed part 7200.If above-mentioned first pick-up 7204 arrives at cutting part 7300, the chuck platform unit 7304 of then above-mentioned cutting part 7300 is placed in the below of above-mentioned first pick-up 7204.
Subsequently, above-mentioned first pick-up 7204 is placed in above-mentioned semiconductor band on the above-mentioned chuck platform unit 7304.If above-mentioned semiconductor band is placed on the above-mentioned chuck platform unit 7304, the sensing cell 7210 of then above-mentioned first pick-up 7204 is placed in the top of above-mentioned chuck platform unit 7304.
Above-mentioned sensing cell 7210 obtains the information about the position relation of 7316 of above-mentioned semiconductor band SS and above-mentioned chuck platforms, and the information of obtaining is sent to the controller of cutting part 7300.
After receiving above-mentioned information, above-mentioned cutting part 7300 is proofreaied and correct the position of the head 7320 of cutter unit 7318 according to above-mentioned information.Afterwards, above-mentioned chuck platform unit 7304 is presented track 7301 along the chuck platform and is moved to the zone that the below limited of above-mentioned cutter unit 7318.
If above-mentioned chuck platform unit 7304 is positioned at the below of above-mentioned cutter unit 7318, then above-mentioned cutter unit 7318 brings into operation, and cuts the semiconductor band on the above-mentioned chuck platform unit 7304.After above-mentioned semiconductor band cutting finished, above-mentioned chuck platform unit 7304 was presented track 7302 along above-mentioned chuck platform and is turned back to its initial position.
If above-mentioned chuck platform unit 7304 is positioned at its initial position, then second pick-up 7212 moves to the zone that the top limited of above-mentioned chuck platform 7316.Above-mentioned then second pick-up 7212 picks up the above-mentioned semiconductor band SS of cutting fully, and it is placed on the above-mentioned second pick-up track 7214.
If above-mentioned semiconductor band SS is placed on the above-mentioned second pick-up track 7214, then second clamper will promote above-mentioned semiconductor band SS to a unload cassette 7402.Then, when above-mentioned semiconductor band SS is placed in 7402 last times of above-mentioned unload cassette, then above-mentioned second conveyer 7404 will move, and transmit semiconductor SS, so that it gets into the processing of next stage.Thus, accomplish according to the process operation of semiconductor band system of processing of the present invention.
For it will be apparent to those skilled in the art that, under the situation that does not break away from spirit of the present invention or scope, can carry out various remodeling and variation to the present invention.Therefore, the present invention be intended to contain fall into the accompanying claims scope and etc. among a small circle to all remodeling of the present invention and variation.
Industrial applicibility
Semiconductor band system of processing according to the present invention as above-mentioned has following effect.
At first, because the cutter unit that above-mentioned semiconductor band system of processing is had comprises laser cutting device,, satisfy the various demands of different user so can the semiconductor band be cut into the semiconductor packages with different shape.
Secondly; Because above-mentioned semiconductor band system of processing also comprises the sensing cell that can sensing be placed in the semiconductor band position on the chuck platform; Therefore the position of the information correction cutter unit that can obtain according to this sensing cell can prevent the generation of substandard products, has improved productivity ratio.

Claims (12)

1. semiconductor band processing unit (plant) comprises:
Chuck platform unit has four chuck platforms that can move and can move along Y direction separately along X-direction simultaneously; And
Two cutter units are used for the workpiece on the first and the 3rd chuck platform that is placed in said four chuck platforms is processed or the workpiece that is placed on the second and the 4th chuck platform is processed.
2. semiconductor band processing unit (plant) according to claim 1 further comprises:
Sensing cell is used to obtain the information about the position of each workpiece, and sends said information to related cutter unit, and said sensing cell comprises: the video getter is used to obtain the information about the position of each workpiece; And video getter track, be used to make said video getter to move along said video getter track.
3. semiconductor band processing unit (plant) according to claim 1, wherein, said chuck platform unit comprises:
The said chuck platform that is used for the support semiconductor band;
First feeding member is used for presenting said chuck platform along X-direction; And
Second feeding member is used for presenting said chuck platform along Y direction.
4. semiconductor band processing unit (plant) according to claim 1, wherein, rotatable 360 degree of each chuck platform.
5. semiconductor band processing unit (plant) according to claim 1, wherein, said chuck platform unit comprises:
The said chuck platform that is used for the support semiconductor band;
Vertical driver is used to make said chuck platform vertical moving; And
Horizontal driver is used to make said chuck platform to move horizontally.
6. semiconductor band system of processing comprises:
Loading part is used to receive a plurality of semiconductor bands;
Cutting part comprises the processing unit (plant) described in claim 1;
Unloading portion is used to receive said semiconductor band and is processed a plurality of semiconductor packages that the back is generated fully; And
Feed part is used to pick up said semiconductor band or said semiconductor packages, and presents the semiconductor band that picked up or semiconductor package and be filled to said loading part, said cutting part or said unloading portion.
7. semiconductor band system of processing according to claim 6, wherein, said loading part comprises:
Carrying case is used to stack said semiconductor band;
Conveyer is used to transmit said carrying case;
First turns to track, is used to rotate the semiconductor band of presenting through said conveyer; And
Propeller is used for presenting said semiconductor bar that said carrying case stacks and brings to said first and turn to track;
Wherein, said unloading portion comprises:
Second turns to track, is used to receive and rotate the said semiconductor band that cuts fully and present in said feed part;
Unload cassette is used to stack the semiconductor band after cutting fully;
Conveyer is used to transmit said unload cassette; And
Clamper, be used to transmit overlay said second turn on the track fully the cutting after said semiconductor bar bring to said unload cassette.
8. semiconductor band system of processing comprises:
First loading part is used to receive a plurality of semiconductor bands;
First cutting part comprises processing unit (plant) as claimed in claim 1;
The first unloading portion is used for being received in the semiconductor band after said first cutting part is processed fully;
Feed part is used to pick up said semiconductor band, and presents the semiconductor bar that is picked up and bring to said first loading part, said first cutting part or the said first unloading portion;
Second loading part is used to receive the semiconductor band that is unloaded from the said first unloading portion;
Second cutting part comprises the rotating disk and second cutter unit, on said rotating disk, places said semiconductor band, and said second cutter unit is used for said semiconductor band is processed into a plurality of semiconductor packages;
Inspection portion is used for checking whether the semiconductor packages after said second cutting part is processed fully exists defective;
The second unloading portion is used to receive the semiconductor packages after the said inspection of process portion checks fully; And
Transmission portion is used between said first unloading portion and said second loading part, presenting the semiconductor band.
9. semiconductor band system of processing according to claim 8, wherein, the cutter unit of said first cutting part comprises laser cutting device, and said second cutter unit comprises blade.
10. semiconductor band system of processing according to claim 8, wherein, said first cutting part further comprises sensing cell, is used to obtain the information about the position that is placed in the semiconductor band on each chuck platform; Said first cutting part is used to receive the information from said sensing cell, and the Working position of the cutter unit of first cutting part that is used for the semiconductor band is proofreaied and correct.
11. semiconductor band system of processing according to claim 8, wherein, said second cutting part comprises:
Said rotating disk is placed said semiconductor band on said rotating disk, said rotating disk is removable along Y direction in the rotatable while; And
Blade can move along X-direction around said rotating disk.
12. a semiconductor band system of processing comprises:
Loading part is used to receive a plurality of semiconductor bands;
Processing unit (plant) as claimed in claim 1;
Washing/drying portion is used for cleaning-drying and the semiconductor band is processed fully a plurality of semiconductor packages that produce afterwards;
Inspection portion is used to check out all clear and washes dried semiconductor packages and whether have defective;
Unloading portion is used to receive the semiconductor packages behind the total inspection; And
Feed part is used to pick up said semiconductor band or semiconductor packages, and presents the semiconductor band that picked up or semiconductor package and be filled to said loading part, said processing unit (plant), said washing/drying portion, said inspection portion or said unloading portion.
CN2007800378225A 2006-10-09 2007-10-05 Machining apparatus and semiconductor strip machining system using the same Active CN101523556B (en)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
KR10-2006-0098091 2006-10-09
KR1020060098091 2006-10-09
KR1020060098091A KR20080032413A (en) 2006-10-09 2006-10-09 A manufacturing device for semiconductor
KR1020060128282A KR100814890B1 (en) 2006-12-15 2006-12-15 A manufacturing device and a system for manufacturing the semiconductor strip thereof
KR1020060128282 2006-12-15
KR10-2006-0128282 2006-12-15
PCT/KR2007/004871 WO2008044840A2 (en) 2006-10-09 2007-10-05 Machining apparatus and semiconductor strip machining system using the same

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Publication number Priority date Publication date Assignee Title
KR101675782B1 (en) * 2009-12-28 2016-11-14 세메스 주식회사 Apparatus for cutting semiconductor package
CN105397307B (en) * 2015-11-26 2017-12-01 马瑞利汽车零部件(芜湖)有限公司 Automobile lamp lens laser cutter device
CN113664917B (en) * 2021-10-25 2021-12-21 江苏卓远半导体有限公司 Packaging machine for semiconductor

Citations (1)

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Publication number Priority date Publication date Assignee Title
CN1781684A (en) * 2004-11-30 2006-06-07 株式会社迪斯科 Cutting machine

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1781684A (en) * 2004-11-30 2006-06-07 株式会社迪斯科 Cutting machine

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