TW200729372A - Apparatus and method for mounting electronic component - Google Patents

Apparatus and method for mounting electronic component

Info

Publication number
TW200729372A
TW200729372A TW095147893A TW95147893A TW200729372A TW 200729372 A TW200729372 A TW 200729372A TW 095147893 A TW095147893 A TW 095147893A TW 95147893 A TW95147893 A TW 95147893A TW 200729372 A TW200729372 A TW 200729372A
Authority
TW
Taiwan
Prior art keywords
semiconductor chip
electronic component
mounting electronic
unit
inverting
Prior art date
Application number
TW095147893A
Other languages
Chinese (zh)
Other versions
TWI328265B (en
Inventor
Masanori Hashimoto
Yuichi Sato
Yukihiro Ikeya
Original Assignee
Shibaura Mechatronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JP2005369515 priority Critical
Application filed by Shibaura Mechatronics Corp filed Critical Shibaura Mechatronics Corp
Publication of TW200729372A publication Critical patent/TW200729372A/en
Application granted granted Critical
Publication of TWI328265B publication Critical patent/TWI328265B/zh

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67144Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01033Arsenic [As]
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01047Silver [Ag]
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01061Promethium [Pm]
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01074Tungsten [W]
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01078Platinum [Pt]
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01082Lead [Pb]
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01093Neptunium [Np]

Abstract

An apparatus for mounting an electronic component is provided with the followings: one wafer stage for supplying a semiconductor chip; a first inverting unit and a second inverting unit, which pick up the semiconductor chip on the wafer stage and then invert the semiconductor chip; a first mounting unit, which receives the semiconductor chip inverted by the first inverting unit and mounts the semiconductor chip on a board; and a second mounting unit, which receives the semiconductor chip inverted by a second inverting pickup tool and mounts the semiconductor chip on the board.
TW95147893A 2005-12-22 2006-12-20 TWI328265B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005369515 2005-12-22

Publications (2)

Publication Number Publication Date
TW200729372A true TW200729372A (en) 2007-08-01
TWI328265B TWI328265B (en) 2010-08-01

Family

ID=38188495

Family Applications (1)

Application Number Title Priority Date Filing Date
TW95147893A TWI328265B (en) 2005-12-22 2006-12-20

Country Status (5)

Country Link
JP (1) JP4713596B2 (en)
KR (1) KR101014293B1 (en)
CN (1) CN101341587B (en)
TW (1) TWI328265B (en)
WO (1) WO2007072714A1 (en)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5030843B2 (en) * 2008-04-14 2012-09-19 芝浦メカトロニクス株式会社 Electronic component mounting apparatus and mounting method
JP5104685B2 (en) * 2008-09-19 2012-12-19 パナソニック株式会社 Parts pickup device
CN104604356B (en) * 2012-09-06 2017-05-17 富士机械制造株式会社 Control system and control method for component mounting machine
KR101460626B1 (en) * 2013-06-28 2014-11-13 한미반도체 주식회사 Supplying Apparatus of Semiconductor Materials
WO2015072593A1 (en) * 2013-11-14 2015-05-21 (주)정원기술 Chip supply apparatus of laser chip bonding machine
KR102080214B1 (en) 2016-02-01 2020-02-24 시바우라 메카트로닉스 가부시끼가이샤 Mounting apparatus and mounting method of an electronic component, and the manufacturing method of a package part
JP6717630B2 (en) * 2016-03-29 2020-07-01 芝浦メカトロニクス株式会社 Electronic component mounting equipment
KR102180449B1 (en) * 2016-05-13 2020-11-19 에이에스엠엘 네델란즈 비.브이. Multiple miniature pickup elements for component stacking and/or pick-and-place processes
CN107887295B (en) * 2016-09-30 2019-07-23 上海微电子装备(集团)股份有限公司 A kind of chip bonding device and bonding method
KR101939347B1 (en) * 2017-02-28 2019-01-16 (주) 예스티 Apparatus for fabricating semi-conductor
KR101939343B1 (en) * 2017-02-28 2019-01-16 (주) 예스티 Apparatus for fabricating semi-conductor
KR101944355B1 (en) * 2017-02-28 2019-01-31 (주) 예스티 Apparatus for fabricating semi-conductor
JP6781677B2 (en) * 2017-08-01 2020-11-04 芝浦メカトロニクス株式会社 Electronic component mounting equipment and mounting method, and package component manufacturing method

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02207595A (en) * 1989-02-07 1990-08-17 Matsushita Electric Ind Co Ltd Electronic component mounting device
JP2808824B2 (en) * 1990-05-17 1998-10-08 松下電器産業株式会社 Electronic component mounting equipment
EP0883979B1 (en) * 1996-02-29 1999-10-13 Alphasem AG Method and device for receiving, orientating and assembling of components
JP3747054B2 (en) * 2001-12-04 2006-02-22 Towa株式会社 Bonding apparatus and bonding method
SG104292A1 (en) * 2002-01-07 2004-06-21 Advance Systems Automation Ltd Flip chip bonder and method therefor

Also Published As

Publication number Publication date
JPWO2007072714A1 (en) 2009-05-28
CN101341587A (en) 2009-01-07
TWI328265B (en) 2010-08-01
WO2007072714A1 (en) 2007-06-28
JP4713596B2 (en) 2011-06-29
KR20080068876A (en) 2008-07-24
KR101014293B1 (en) 2011-02-16
CN101341587B (en) 2010-10-27

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees