CN106206392B - Die positioning and arranging equipment and die positioning and arranging method - Google Patents
Die positioning and arranging equipment and die positioning and arranging method Download PDFInfo
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- CN106206392B CN106206392B CN201510227183.5A CN201510227183A CN106206392B CN 106206392 B CN106206392 B CN 106206392B CN 201510227183 A CN201510227183 A CN 201510227183A CN 106206392 B CN106206392 B CN 106206392B
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Abstract
The invention provides a crystal grain positioning and arranging device for improving positioning and arranging efficiency and a crystal grain positioning and arranging method using the device, which are used for positioning a plurality of crystal grains in an area to be arranged of a substrate, supporting the plurality of crystal grains through a supporting member, and transposing the supporting member by a transposing mechanism, so that the effect of positioning the plurality of crystal grains on the substrate in a short time can be achieved, the crystal grain arranging speed is greatly improved, the productivity is improved, and the production cost is indirectly reduced.
Description
Technical Field
The present invention relates to a die-positioning and arrangement apparatus and a die-positioning and arrangement method, and more particularly, to a die-positioning and arrangement apparatus and a die-positioning and arrangement method that increase the positioning and arrangement efficiency.
Background
In the semiconductor wafer level packaging process, a wafer is cut into a plurality of dies, good products are picked out from the dies, and the dies are rearranged on a circular substrate for subsequent processing. Since the dice are re-distributed (redistribution), routed, and mounted with balls … … after being reconfigured (reconfiguration), the dice must be placed and positioned on the substrate with high precision. In general, the error is required to be controlled within 2 microns. The prior art method selects a position on the substrate, uses a robot arm to pick up a die, and then places the die at the position selected by the controller. Conceivably, the mechanical arm can only place one crystal grain at a time, and the efficiency is very limited. After each die is disposed on the substrate, a processing time is required for the robot to apply a force to the die to bond the die to the substrate. This is a serious drag to slow down the rate of die placement by the robot, resulting in overall rate limitation, which is an important link for the semiconductor industry with high throughput demand.
Disclosure of Invention
Therefore, in order to solve the above problems, an object of the present invention is to provide a die-positioning-and-disposing apparatus and a die-positioning-and-disposing method using the same, which can greatly increase the rate at which dies are positioned and disposed on a substrate.
The present invention is directed to a die-positioning-and-disposing apparatus for positioning a plurality of dies in a region to be disposed of a substrate, the die-positioning-and-disposing apparatus including: a supporting member having a supporting surface on which the plurality of dies are arranged; an arrangement mechanism for arranging the plurality of dies on the supporting surface of the supporting member; and a transposing mechanism configured to transpose the supporting member to a fixed position orientation from a loading orientation corresponding to the supporting surface, wherein in the loading orientation, the supporting surface of the supporting member faces the arranging mechanism, and the arranging mechanism arranges the plurality of dies, and in the fixed position, the supporting member and the substrate are relatively flipped, so that the supporting surface of the supporting member faces the to-be-arranged region of the substrate, and the plurality of dies are positioned in the to-be-arranged region of the substrate by relative displacement between the supporting member and the substrate.
In an embodiment of the invention, a die-positioning-arrangement apparatus for increasing the efficiency of positioning arrangement is provided, and the arrangement mechanism is correspondingly provided in plural.
In an embodiment of the invention, a die-positioning-and-arranging apparatus for increasing the efficiency of positioning and arranging is provided, further comprising a circulating means configured to circulate the plurality of holding means between a position corresponding to the transposing mechanism and a position corresponding to the arranging mechanism.
In an embodiment of the present invention, a die-positioning-and-arranging apparatus for increasing the efficiency of positioning and arranging is provided, wherein the substrate is a wafer, glass, PCB, or ceramic substrate.
In an embodiment of the present invention, a die-positioning-and-placing apparatus for increasing the positioning and placing efficiency is provided, in which the supporting member has a size substantially equal to a unit exposure range of an exposure mechanism that performs exposure processing on a die placed on a substrate in a subsequent process.
The present invention provides a die positioning and arranging method for increasing positioning and arranging efficiency by another technical means for solving the problems of the prior art, wherein a plurality of dies are positioned in a region to be arranged of a substrate by using a die positioning and arranging apparatus, the die positioning and arranging apparatus includes a supporting member, an arranging mechanism and a transposing mechanism, the die positioning and arranging method includes: a presetting step, arranging the plurality of crystal grains on the bearing surface of the bearing component by the arranging mechanism; and a transposition step of transposing the supporting member to a fixed position by the transposition mechanism from a loading position corresponding to the supporting surface, wherein in the loading position, the supporting surface of the supporting member faces the arrangement mechanism for arranging the crystal grains by the arrangement mechanism, and in the fixed position, the supporting member and the substrate are relatively turned over so that the supporting surface faces the to-be-arranged area of the substrate, and the plurality of crystal grains are positioned in the to-be-arranged area of the substrate by relative displacement between the supporting member and the substrate.
In an embodiment of the invention, a die-positioning-and-arranging method for increasing the positioning-and-arranging efficiency is provided, wherein in the transposing step, the transposing is performed by the transposing mechanism to flip the supporting member at an angle.
In an embodiment of the present invention, a die-positioning-and-layout method for increasing the positioning-and-layout efficiency is provided, which further includes, after the transposing step, a separation step: relatively separating the supporting member and the substrate, and keeping the plurality of dies in the region to be arranged.
In an embodiment of the present invention, a die-positioning-and-arranging method for increasing efficiency of positioning and arranging is provided, wherein the supporting members are provided in plural, in the pre-arranging step, the arranging mechanism arranges the plural dies on the plural supporting members respectively, and in the transposing step, the transposing mechanism transposes the plural supporting members.
In an embodiment of the present invention, a die-positioning-and-arranging method for increasing the efficiency of positioning and arranging is provided, wherein the die-positioning-and-arranging apparatus further includes a circulating member, and after the transposing step, a circulating step of transporting the transferred holding member to a position corresponding to the arranging mechanism by the circulating member for holding the die again is further included.
By adopting the technical means of the invention, the traditional method that only a single crystal grain can be arranged at one time is replaced, a plurality of crystal grains can be positioned on the substrate in a short time, the number of times of back and forth movement of equipment is reduced, and the total processing time is shortened, so that the speed of crystal grain arrangement is greatly improved, the productivity is improved, and the production cost is indirectly reduced.
The present invention will be further described with reference to the following examples and accompanying drawings.
Drawings
Fig. 1 is a perspective view of a die-positioning-and-arranging apparatus according to an embodiment of the invention.
Fig. 2 is a schematic side view of a portion of a die-positioning placement apparatus according to an embodiment of the invention.
Fig. 3 is a flowchart of a die positioning and placement method according to an embodiment of the invention.
Fig. 4 is a perspective view of a die-positioning-and-disposing apparatus according to another embodiment of the invention.
Fig. 5 is a flowchart of a die positioning and placement method according to another embodiment of the invention.
Reference numerals
100 die positioning and arranging equipment
1 supporting member
11 bearing surface
2 arrangement mechanism
3 transposition mechanism
4 controller
5 circulation component
D crystal grain
P1 feeding position
P2 fixed position orientation
R region to be arranged
S substrate
S101 step
S102 step
S201 step
S202 step
S203 step
S204 step
Z crystal grain storage area
Detailed Description
The following describes an embodiment of the present invention with reference to fig. 1 to 4. The description is not intended to limit the embodiments of the present invention, but is one example of the present invention.
Referring to fig. 1 and fig. 2, a die-positioning-and-arranging apparatus 100 according to an embodiment of the invention is used for positioning a plurality of dies D on a to-be-arranged region R of a substrate S. The die-positioning-arrangement 100 apparatus includes a holding member 1, an arrangement mechanism 2, a transposing mechanism 3, and a controller 4 electrically connecting the arrangement mechanism 2 and the transposing mechanism 3. The supporting member 1 is an intermediate carrier for supporting a plurality of dies D and has a supporting surface 11 for disposing thereon the plurality of dies D. The supporting member 1 may be, for example, a tray with adhesive property, or a member formed by combining a plurality of vacuum suction nozzles, so that the die D can be fixed thereon.
The arrangement mechanism 2 is used to arrange a plurality of dies D on the supporting surface 11 of the supporting member 1. In one embodiment, the arranging mechanism 2 is a robot arm, and the controller 4 controls the arranging mechanism 2 to arrange the plurality of dies D located in the die storage area Z one by one onto the supporting surface 11 in a suction manner, but the invention is not limited thereto.
The transfer mechanism 3 is provided to transfer the supporting member 1 from the loading position P1 corresponding to the supporting surface 11 to the positioning position P2. The loading direction P1 means that the supporting surface 11 of the supporting member 1 faces the arrangement mechanism 2 and the arrangement mechanism 2 arranges the plurality of dies D. In contrast, the positioning orientation P2 is to position the plurality of dies D in the region R of the substrate S to be arranged by relatively inverting the supporting member 1 and the substrate S such that the supporting surface 11 of the supporting member 1 faces the region R of the substrate S to be arranged and by relative displacement between the supporting member 1 and the substrate S. In fig. 2, the transfer mechanism 3 turns the holding member 1 at an angle to transfer the holding member to the fixed position P2. However, in practice, the substrate S may be turned over, or the supporting member 1 and the substrate S may be turned over at an angle so that the supporting surface 11 of the supporting member 1 faces the region R where the substrate S is to be placed. After the holding member is transferred to the positioning orientation P2, the controller 4 controls the transferring mechanism 3 to separate the holding member 1 and the substrate S, and holds the plurality of dies D in the region to be arranged R. The relative separation may be performed by moving the supporting member 1 away from the substrate S by the transfer mechanism 3 or by moving the substrate S away from the supporting member 1, or may be performed by relative displacement by moving both of them.
The controller 4 is also configured to determine the position of each die D on the supporting surface 11 and determine the region R to be arranged on the substrate S, in addition to controlling the operations of the arranging mechanism 2 and the flipping mechanism 3.
Referring to fig. 3, the die positioning and arranging method provided by the present invention includes a presetting step and a transposing step.
In one embodiment, the supporting member 1 is a square carrier, and the substrate S may be a wafer, glass, PCB, ceramic substrate or other materials, but the invention is not limited thereto. The holding member 1 has a size substantially equal to a unit exposure range of an exposure mechanism that performs exposure processing on the crystal grains D arranged on the substrate S in a subsequent process. That is, the size of the supporting member 1 is determined according to the exposure mechanism used in the subsequent process, and the pitch of the arrangement positions provided for the plurality of dies D on the supporting surface 11 may be further defined by the exposure mechanism. With the design of the supporting member 1 completely corresponding to the exposure mechanism, the relative positions of the plurality of dies D arranged on the substrate S and the relative positions of the dies and the substrate S can be completely matched with the unit exposure range of the exposure mechanism, thereby minimizing the error.
Referring to fig. 4 and 5, another embodiment of the present invention is provided. The difference from the previous embodiment is that the crystal grain positioning and arranging apparatus 100a of the present embodiment further includes a circulating member 5. In the present embodiment, the supporting member 1 is provided in plural, and the arranging mechanism 2 is correspondingly provided in plural, but the number of the supporting member 1 and the arranging mechanism 2 is not necessarily equal. The circulating means 5 is provided to circulate the plurality of holding members 1 to be close to the plurality of arranging means 2 between a position corresponding to the transposing means 3 and a position corresponding to the arranging means 2, the plurality of arranging means 2 arranges the plurality of dies D on the plurality of holding members 1, and the transposing means 3 transposes the plurality of dies D to the plurality of regions to be arranged R.
That is, in the present embodiment, in order to further improve the productivity, a plurality of holding members 1 and a plurality of arranging mechanisms 2 are used. The plurality of arrangement mechanisms 2 operate simultaneously to arrange the plurality of dies D on the plurality of holding members 1. In other words, compared to the previous embodiment, more supporting members 1 can be arranged on a plurality of dies D per unit time in the present embodiment. Thus, the arrangement speed of the single arrangement mechanism 2 can be prevented from being slower than the transposition speed of the transposition mechanism 3, and the transposition mechanism can continuously transpose the supporting member 1.
In the transfer process, the supporting member 1 is also transferred from the feeding position P1 to the positioning position P2, as in the previous embodiment. After the supporting member 1 is transferred to the positioning orientation P2, the controller 4 controls the transferring mechanism 3 to relatively separate the plurality of supporting members 1 and the substrate S, and to retain the plurality of dies D in the region R to be arranged. Thereafter, the transferred holding member 1 is transported to a position corresponding to the placement mechanism 2 by the circulation member 5 to hold the crystal grain again.
By the die-positioning-arrangement apparatus 100a and the die-positioning-arrangement method of the present invention, the turnover mechanism 3 can transpose a plurality of dies D to the region R to be arranged of the substrate S at a time, thereby saving lengthy arrangement time and greatly increasing the speed. In detail, the transfer mechanism 3 can save much time for moving back and forth between the die storage area Z and the substrate S every time the support member 1 is transferred. In a practical example, if the supporting member 1 supports N dies D, the time for the transferring mechanism 3 to transfer the supporting member 1 once is saved by N-1 units compared to the prior art. In addition, the prior art requires one process time for arranging one die, but in the present invention, the plurality of dies D arranged on the supporting member 1 simultaneously contact the substrate S, so the plurality of dies D also require only one process time in total. When the transposing mechanism 3 transposes N dies onto the substrate S at a time, the process time of N-1 unit is saved. In summary, the die-positioning and arrangement apparatus and the die-positioning and arrangement method of the present invention can greatly improve the productivity and further reduce the production cost.
While the foregoing description and description are of the preferred embodiment of the present invention, other modifications of the invention shall be apparent to those skilled in the art from the following claims and their equivalents, as long as such modifications are within the scope of the appended claims.
Claims (9)
1. A die-positioning-and-arranging apparatus for positioning a plurality of dies in a region to be arranged of a substrate,
the die positioning and arranging apparatus includes:
a supporting member having a supporting surface as a common supporting surface on which the plurality of crystal grains are commonly arranged;
an arrangement mechanism disposed facing the common bearing surface with the common bearing surface in a loading orientation, the arrangement mechanism for arranging the plurality of dies on the common bearing surface of the bearing member; and
a transferring mechanism configured to turn over and hold the common supporting surface on which the plurality of dies are arranged by the supporting member in such a manner that the plurality of dies are adsorbed or bonded to and held on the common supporting surface, then face the common supporting surface on which the plurality of dies are held by the adsorption or bonding to the region to be arranged of the substrate, and position the common supporting surface in a positioning orientation of the region to be arranged of the substrate by relative displacement between the common supporting surface and the substrate via the supporting member, whereby after the plurality of dies are arranged on the common supporting surface in a loading orientation, the plurality of dies are transferred from the loading orientation corresponding to the supporting surface to a positioning orientation without leaving the common supporting surface, the size of the supporting member is substantially equal to the unit exposure range of an exposure mechanism, the exposure mechanism carries out exposure processing on the crystal grains arranged on the substrate in a subsequent process, the supporting member completely corresponds to the exposure mechanism, the exposure mechanism defines the distance between each crystal grain in the plurality of crystal grains arranged at the arrangement position of the supporting member, so that the relative positions of the plurality of crystal grains arranged on the substrate and the relative positions of the crystal grains and the substrate can completely fit the unit exposure range of the exposure mechanism, and errors are reduced to the minimum.
2. The die positioning placement apparatus according to claim 1, wherein the holding member is provided in plural, and the placement mechanism is provided in plural correspondingly.
3. The die positioning placement apparatus of claim 2, further comprising a circulation means configured to circulate the plurality of holding means between a position corresponding to the transposing mechanism and a position corresponding to the placement mechanism.
4. The die-positioning placement apparatus of claim 1, wherein the substrate is a wafer, glass, PCB, or ceramic substrate.
5. A crystal grain positioning and arranging method is used for positioning a plurality of crystal grains in an area to be arranged of a substrate by utilizing crystal grain positioning and arranging equipment, and is characterized in that the crystal grain positioning and arranging equipment comprises a supporting member, an arranging mechanism and a transposition mechanism, and the crystal grain positioning and arranging method comprises the following steps:
a presetting step of arranging the plurality of crystal grains on a bearing surface of the bearing member by the arranging mechanism, the bearing surface serving as a common bearing surface on which the plurality of crystal grains are arranged together, the arranging mechanism being disposed on the common bearing surface so as to face the common bearing surface in a loading orientation; and
a transferring step of, by the holding means, inverting and holding the common holding surface on which the plurality of dies are arranged by the holding means in such a manner that the plurality of dies are adsorbed or adhered and held on the common holding surface, then facing the common holding surface on which the plurality of dies are inverted and held to the area to be arranged of the substrate, and positioning the common holding surface in a positioning orientation of the area to be arranged of the substrate by relative displacement between the common holding surface and the substrate via the holding means, whereby after the plurality of dies are arranged on the common holding surface in a loading orientation, the plurality of dies are transferred by the transferring means in a positioning orientation from a loading orientation corresponding to the holding surface without leaving the common holding surface, the size of the supporting member is substantially equal to the unit exposure range of an exposure mechanism, the exposure mechanism carries out exposure processing on the crystal grains arranged on the substrate in a subsequent process, the supporting member completely corresponds to the exposure mechanism, the exposure mechanism defines the distance between each crystal grain in the plurality of crystal grains arranged at the arrangement position of the supporting member, so that the relative positions of the plurality of crystal grains arranged on the substrate and the relative positions of the crystal grains and the substrate can completely fit the unit exposure range of the exposure mechanism, and errors are reduced to the minimum.
6. The die positioning and placement method of claim 5, wherein in the transposing step, the transposing is performed by the transposing mechanism by flipping the holding member at an angle.
7. The die positioning and arrangement method of claim 5, further comprising, after the transposing step, a separation step of:
relatively separating the supporting member and the substrate, and keeping the plurality of crystal grains in the area to be arranged.
8. The die-positioning-and-arranging method according to claim 5, wherein the holding members are provided in plural, in the pre-arranging step, the plural dies are arranged on the plural holding members by the plural arranging mechanisms, respectively, and in the transposing step, the plural holding members are transposed by the transposing mechanism.
9. The die positioning and arrangement method of claim 5, wherein the die positioning and arrangement apparatus further comprises a circulation component, and further comprises, after the transposing step:
and a circulating step of transporting the rotated supporting member to a position corresponding to the arranging mechanism by the circulating member for supporting the crystal grains again.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510227183.5A CN106206392B (en) | 2015-05-07 | 2015-05-07 | Die positioning and arranging equipment and die positioning and arranging method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510227183.5A CN106206392B (en) | 2015-05-07 | 2015-05-07 | Die positioning and arranging equipment and die positioning and arranging method |
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| Publication Number | Publication Date |
|---|---|
| CN106206392A CN106206392A (en) | 2016-12-07 |
| CN106206392B true CN106206392B (en) | 2021-04-30 |
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| CN201510227183.5A Active CN106206392B (en) | 2015-05-07 | 2015-05-07 | Die positioning and arranging equipment and die positioning and arranging method |
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| CN108962803A (en) * | 2017-05-17 | 2018-12-07 | 梭特科技股份有限公司 | Crystal grain transfer device |
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| CN2379914Y (en) * | 1999-06-14 | 2000-05-24 | 华东半导体工业股份有限公司 | Apparatus for assembling chip and having chip turning-over function |
| JP5140428B2 (en) * | 2004-08-23 | 2013-02-06 | ロッコ・システムズ・プライベイト・リミテッド | Supply mechanism for chuck of integrated circuit dicing machine |
| JP4595740B2 (en) * | 2005-08-16 | 2010-12-08 | パナソニック株式会社 | Chip inversion device, chip inversion method, and chip mounting device |
| KR101169406B1 (en) * | 2010-04-12 | 2012-08-03 | (주)제이티 | Test Handler for semiconductor device, and inpection method for semiconductor device |
| TWI485786B (en) * | 2012-04-16 | 2015-05-21 | Gallant Micro Machining Co Ltd | Grain Stripping Method and Device |
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