CN106206392A - Crystal grain location advancing equipment and crystal grain location method for arranging - Google Patents
Crystal grain location advancing equipment and crystal grain location method for arranging Download PDFInfo
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- CN106206392A CN106206392A CN201510227183.5A CN201510227183A CN106206392A CN 106206392 A CN106206392 A CN 106206392A CN 201510227183 A CN201510227183 A CN 201510227183A CN 106206392 A CN106206392 A CN 106206392A
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- crystal grain
- holding members
- substrate
- location
- deployment mechanism
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Abstract
The present invention provides a kind of location that increases arrange the crystal grain location advancing equipment of efficiency and use the crystal grain location method for arranging of this equipment, layout area is treated for what a plurality of crystal grain were positioned substrate, through a plurality of crystal grain of holding members support, transposing facility transposition holding members, and in can reaching the short time, a plurality of crystal grain are positioned the effect of substrate, thus significantly improve the speed of die arrangement, improve production capacity, indirectly reduce production cost.
Description
Technical field
The present invention relates to a kind of crystal grain location advancing equipment and crystal grain location method for arranging, particularly relate to a kind of increase location cloth
Put crystal grain location advancing equipment and the crystal grain location method for arranging of efficiency.
Background technology
In the processing procedure of semiconductor wafer level packaging, it is necessary to wafer is cut into plural number crystal grain, more therefrom chooses non-defective unit, again join
Put on the substrate of circle to carry out follow-up processing.Owing to crystal grain is the most heavily to divide after reconfiguring (reconfiguration)
Cloth (redistribution), coiling, plant ball ... etc. the course of processing, therefore crystal grain must be put the most smart of location on substrate
Accurate.Control within 2 microns it is said that in general, error is requirement.The way of prior art is a position on selected substrate,
Utilize mechanical arm to draw a crystal grain, then crystal grain is placed into the position that controller is selected.It will be appreciated that mechanical arm is once
Can only place a crystal grain, efficiency is extremely limited.And after each crystal grain is arranged to substrate, in addition it is also necessary to one section of processing time,
Allowing mechanical arm force in crystal grain makes it engage with substrate.This has the most seriously dragged slowly mechanical arm to arrange the speed of crystal grain, causes
Overall rate is limited, for the semiconductor industry that production capacity demand is high, is the important step being badly in need of improving.
Summary of the invention
Therefore, for solving the problems referred to above, the purpose of the present invention is i.e. providing a kind of crystal grain location advancing equipment and is using its crystalline substance
Grain location method for arranging, can be greatly improved crystal grain and be positioned the speed being arranged into substrate.
The present invention solves for a kind of location that increases of offer, the technological means that problem of the prior art is used arranges that the crystal grain of efficiency is fixed
Position advancing equipment, treats layout area for what a plurality of crystal grain were positioned substrate, and this crystal grain location advancing equipment comprises: support
Component, has a support face, for these a plurality of die arrangement on it；Deployment mechanism, in order to hold these a plurality of die arrangement in this
This support face of torr component；And transposing facility, configured and this holding members is turned from corresponding to the feeding orientation in this support face
Being placed in fixation orientation, wherein in this feeding orientation, this support face of this holding members is intended for this deployment mechanism, and for this layout
These a plurality of crystal grain of arrangement of mechanism, and in this fixation orientation, this holding members overturns through relative with this substrate, and makes this support
Layout area is treated towards this of this substrate in this support face of component, and via the relative displacement between this holding members and this substrate
So that a plurality of crystal grain are positioned this of this substrate and treat layout area.
A kind of location that increases is provided to arrange the crystal grain location advancing equipment of efficiency, this deployment mechanism pair in one embodiment of this invention
Should be provided as a plurality of.
There is provided a kind of location that increases to arrange the crystal grain location advancing equipment of efficiency in one embodiment of this invention, also comprise circulation structure
Part, this circulating member configured and corresponding to this transposing facility position and corresponding to this deployment mechanism position between circulating
These a plurality of holding members defeated.
There is provided in one embodiment of this invention a kind of increase location arrange efficiency crystal grain location advancing equipment, this substrate be wafer,
Glass, PCB, ceramic substrate.
A kind of location that increases is provided to arrange the crystal grain location advancing equipment of efficiency in one embodiment of this invention, this holding members
Size is substantially equal to the unit exposure scope of exposure mechanism, this exposure mechanism in successive process to the crystal grain being arranged in this substrate
It is exposed processing.
The present invention solves that another technological means that problem of the prior art is used provides a kind of location that increases to arrange the crystal grain of efficiency
Location method for arranging, utilizes crystal grain location advancing equipment that a plurality of crystal grain are positioned the layout area for the treatment of of substrate, and this crystal grain is fixed
Position advancing equipment includes holding members, deployment mechanism and transposing facility, and this crystal grain location method for arranging comprises: initialization step,
By this deployment mechanism by these a plurality of die arrangement in the support face of this holding members；And transposing step, will by this transposing facility
This holding members from corresponding to the feeding orientation transposition in this support face in fixation orientation, wherein in this feeding orientation, this holding members
This support face be intended for this deployment mechanism, and arrange those crystal grain for this deployment mechanism, and in this fixation orientation, this support
Component and this substrate overturn through relative, and layout area is treated towards this of this substrate in this support face made, and via this holding members
And relative displacement between this substrate is so that this plurality of crystal grain are positioned this of this substrate and treat layout area.
A kind of location that increases is provided to arrange the crystal grain location method for arranging of efficiency, wherein in this transposition in one embodiment of this invention
In step, this transposition is for be overturn this holding members by this transposing facility with an angle.
A kind of location that increases is provided to arrange the crystal grain location method for arranging of efficiency, in this transposing step in one embodiment of this invention
After, also include separating step: this holding members of relative separation and this substrate, these a plurality of crystal grain of indwelling treat layout area in this.
A kind of location that increases is provided to arrange crystal grain location method for arranging, wherein this support structure of efficiency in one embodiment of this invention
Part is provided as a plurality of, in this initialization step, this deployment mechanism is respectively arranged these a plurality of crystal grain in a plurality of support structures
Part, in this transposing step, by these a plurality of holding members of this transposing facility transposition.
Thering is provided a kind of location that increases to arrange the crystal grain location method for arranging of efficiency in one embodiment of this invention, wherein this crystal grain is fixed
Position advancing equipment also comprises circulating member, after this transposing step, also includes circulation step, will be after transposition by this circulating member
The transport of this holding members to the position corresponding to this deployment mechanism for support crystal grain once again.
Via the technology used in the present invention means, replace and be once only capable of the traditional method arranging single crystal grain, can be in short-term
In a plurality of crystal grain are positioned substrate, the number of times that minimizing equipment moves back and forth, and shorten overall processing time, thus significantly
Promote the speed of die arrangement, improve production capacity, indirectly reduce production cost.
Specific embodiment of the present invention, will be by below example and attached be further described in graphic.
Accompanying drawing explanation
Fig. 1 is the crystal grain location advancing equipment schematic perspective view according to one embodiment of the invention.
Fig. 2 is the crystal grain location advancing equipment part schematic side view according to embodiments of the invention.
Fig. 3 is the crystal grain location method for arranging flow chart according to embodiments of the invention.
Fig. 4 is the crystal grain location advancing equipment schematic perspective view according to another embodiment of the present invention.
Fig. 5 is the crystal grain location method for arranging flow chart according to another embodiment of the present invention.
Reference
100 crystal grain location advancing equipments
1 holding members
11 support faces
2 deployment mechanism
3 transposing facility
4 controllers
5 circulating members
D crystal grain
P1 feeding orientation
P2 fixation orientation
R treats layout area
S substrate
S101 step
S102 step
S201 step
S202 step
S203 step
S204 step
Z crystal grain storage area
Detailed description of the invention
Below according to Fig. 1 to Fig. 4, and embodiments of the present invention are described.This explanation is not to limit embodiments of the present invention,
And it is the one of embodiments of the invention.
Refering to shown in Fig. 1 and Fig. 2, it is used for plural number according to a crystal grain location advancing equipment 100 of one embodiment of the invention
What individual crystal grain D was positioned substrate S treats layout area R.Crystal grain location arranges that 100 equipment comprise holding members 1, deployment mechanism
2, transposing facility 3 and electrical connection the deployment mechanism 2 and controller 4 of transposing facility 3.It is multiple that holding members 1 is responsible for carrying
The middle carrier of number crystal grain D, and there is support face 11, arrange on it for a plurality of crystal grain D.Holding members 1 such as may be used
To be the pallet with stickiness, or the component combined for plural number vacuum slot, can be fixed thereon for crystal grain D.
Deployment mechanism 2 in order to be arranged in the support face 11 of holding members 1 by a plurality of crystal grain D.In one embodiment, arrange
Mechanism 2 is mechanical arm, and controller 4 controls deployment mechanism 2 and will be located in a plurality of crystalline substances of crystal grain storage area Z in the way of absorption
Grain D is arranged on support face 11 one by one, but the invention is not restricted to this.
Transposing facility 3 configured and by holding members 1 from the feeding orientation P1 transposition corresponding to support face 11 in fixation orientation P2.
So-called feeding orientation P1, refers to that the support face 11 of holding members 1 is intended for deployment mechanism 2 and arranges a plurality of crystalline substance for deployment mechanism 2
Grain D.Relatively, so-called fixation orientation P2 refers to holding members 1 with substrate S through relative upset, and makes holding members 1
Support face 11 towards layout area R for the treatment of of substrate S, and via the relative displacement between holding members 1 and substrate S so that
What a plurality of crystal grain D were positioned substrate S treats layout area R.In fig. 2, transposing facility 3 is with an angle upset support structure
Part 1 with transposition in fixation orientation P2.But in enforcement, it is also possible to upset substrate S or upset holding members 1 and substrate S each
Angle, reaching " the support face 11 of holding members 1 towards substrate S treat layout area R ".Holding members be transposed in
Behind fixation orientation P2, controller 4 controls transposing facility 3 relative separation holding members 1 and substrate S, a plurality of crystal grain of indwelling
D is in treating layout area R.Relative separation can be to move holding members 1 through transposing facility 3 to leave substrate S or mobile base
Plate S leaves holding members 1, naturally it is also possible to produce relative displacement through each moving both.
Controller 4 is except in order to control deployment mechanism 2 and the action of switching mechanism 3, also determining that each crystal grain D is in support face
Position on 11, and determine that be positioned at substrate S treats layout area R.
Referring to Fig. 3, crystal grain provided by the present invention location method for arranging, including initialization step and transposing step.
In one embodiment, holding members 1 is the carrier of square, and substrate S can be wafer, glass, PCB, ceramic base
Plate or other materials, and the invention is not restricted to this.The size of holding members 1 is substantially equal to the unit exposure scope of exposure mechanism,
The crystal grain D being arranged in substrate S is exposed processing in successive process by exposure mechanism.It is to say, the chi of holding members 1
Very little is that the exposure mechanism used according to following process determines, and is supplied to the cloth set of a plurality of crystal grain D on support face 11
The spacing put can also be defined by exposure mechanism further.Under the design of the most corresponding exposure mechanism of holding members 1, can make
Be arranged in substrate S a plurality of crystal grain D each other relative to the relation of position and crystal grain with the relative position of substrate S
Can be fitted like a glove the unit exposure scope of exposure mechanism, error is preferably minimized.
Referring to Fig. 4 and Fig. 5, the present invention proposes another embodiment.With the difference of previous embodiment it is, the present embodiment
Crystal grain location advancing equipment 100a also comprises circulating member 5.And in the present embodiment, holding members 1 is provided as a plurality of,
Deployment mechanism 2 is provided as a plurality of the most accordingly, but the quantity of holding members 1 and deployment mechanism 2 is the most necessary equal.Circulation
Component 5 is configured and is transporting a plurality of corresponding to circulation between position and the position corresponding to deployment mechanism 2 of transposing facility 3
Holding members 1 is to close to a plurality of deployment mechanism 2, and a plurality of crystal grain D are arranged in a plurality of support by a plurality of deployment mechanism 2
Component 1, transposing facility 3 transposed complex crystal grain D treats layout area R to a plurality of.
It is to say, in the present embodiment, for improving production capacity further, use a plurality of holding members 1 and the placement machine of plural number
Structure 2.A plurality of crystal grain D are arranged into a plurality of holding members 1 by the operation simultaneously of a plurality of deployment mechanism 2.In other words,
Comparing previous embodiment, the present embodiment can have more holding members 1 to be arranged a plurality of crystal grain D within the unit interval.As
This can be avoided the layout speed of single deployment mechanism 2 not catch up with the transposition speed of transposing facility 3 and drag slow efficiency, and can allow and turn
Put mechanism's transposition holding members 1 incessantly.
During transposition, identical with previous embodiment, also it is that holding members 1 is transposed to fixation orientation from feeding orientation P1
P2.And after holding members 1 is transposed to fixation orientation P2, control transposing facility 3 relative separation plural number through controller 4
Individual holding members 1 and substrate S, indwelling a plurality of crystal grain D is in treating layout area R.Afterwards, will be through turning by circulating member 5
Holding members 1 transport postponed supplies support crystal grain once again to the position corresponding to deployment mechanism 2.
Positioning advancing equipment 100a and crystal grain location method for arranging by the crystal grain of the present invention, switching mechanism 3 can be once by multiple
What several crystal grain D were transposed to substrate S treats layout area R, saves the tediously long layout time, significantly speeds speed.In detail,
Transposing facility 3 holding members 1 of every transposition just can be saved and a lot " move back between crystal grain storage area Z and substrate S
Dynamic " time.For actual example, if holding members 1 support N number of crystal grain D, compared to prior art, transposition machine
Holding members 1 of structure 3 transposition just saves the time moved back and forth of N-1 unit.In addition, prior art arranges one
Crystal grain needs the first procedure time, but in the present invention, a plurality of crystal grain D being arranged in holding members 1 are to contact simultaneously
Substrate S, therefore a plurality of crystal grain D the most also has only to processing time once.N number of crystal grain when No. 3 transposition of transposing facility
In substrate S, just save the processing time of N-1 unit.In sum, crystal grain location advancing equipment and the crystal grain of the present invention are fixed
Position arranging method can be greatly improved production capacity, and then forces down production cost.
Above narration and explanation are only the explanation of presently preferred embodiments of the present invention, and for technique, those skilled in the art can
To make other amendment according to claim bounded by and above-mentioned explanation, as long as these amendments must be for this
Invention spirit and in the interest field of the present invention.
Claims (10)
1. a crystal grain location advancing equipment, treats layout area for what a plurality of crystal grain were positioned substrate, it is characterised in that
Described crystal grain location advancing equipment comprises:
Holding members, has a support face, for described a plurality of die arrangement on it；
Deployment mechanism, in order to by described a plurality of die arrangement in the described support face of described holding members；And
Transposing facility, configured and by described holding members from corresponding to the feeding orientation transposition in described support face in fixation orientation,
Wherein in described feeding orientation, the described support face of described holding members is intended for described deployment mechanism, and arranges described a plurality of crystal grain for described deployment mechanism, and
In described fixation orientation, described holding members overturns through relative with described substrate, and make the described support face of described holding members towards treating layout area described in described substrate, and via the relative displacement between described holding members and described substrate so that a plurality of crystal grain is positioned described in described substrate to treat layout area.
2. crystal grain location as claimed in claim 1 advancing equipment, it is characterised in that described holding members is provided as a plurality of, and described deployment mechanism correspondence is provided as a plurality of.
3. crystal grain location as claimed in claim 2 advancing equipment, it is characterized in that, also comprising circulating member, described circulating member is configured and circulates between the position corresponding to described transposing facility and the position corresponding to described deployment mechanism and transports described a plurality of holding members.
4. crystal grain location as claimed in claim 1 advancing equipment, it is characterised in that described substrate is wafer, glass, PCB or ceramic substrate.
5. crystal grain location as claimed in claim 1 advancing equipment, it is characterised in that the size of described holding members is substantially equal to the unit exposure scope of exposure mechanism, and the crystal grain being arranged in described substrate is exposed processing in successive process by described exposure mechanism.
6. a crystal grain location method for arranging, utilize crystal grain location advancing equipment that a plurality of crystal grain are positioned the layout area for the treatment of of substrate, it is characterized in that, described crystal grain location advancing equipment includes that holding members, deployment mechanism and transposing facility, described crystal grain location method for arranging comprise:
Initialization step, by described deployment mechanism by described a plurality of die arrangement in the support face of described holding members；And
Transposing step, by described transposing facility by described holding members from corresponding to the feeding orientation transposition in described support face in fixation orientation, wherein in described feeding orientation, the described support face of described holding members is intended for described deployment mechanism, and arrange more described crystal grain for described deployment mechanism, and in described fixation orientation, described holding members overturns through relative with described substrate, and the described support face made is towards treating layout area described in described substrate, and via the relative displacement between described holding members and described substrate so that described a plurality of crystal grain is positioned described in described substrate to treat layout area.
7. crystal grain location as claimed in claim 6 method for arranging, it is characterised in that in described transposing step, described transposition is overturn described holding members by described transposing facility with an angle.
8. crystal grain location as claimed in claim 6 method for arranging, it is characterised in that after described transposing step, further includes separating step:
Holding members described in relative separation and described substrate, a plurality of crystal grain described in indwelling treat layout area in described.
9. crystal grain location as claimed in claim 6 method for arranging, it is characterized in that, described holding members is provided as a plurality of, in described initialization step, by described a plurality of deployment mechanism, described a plurality of crystal grain are respectively arranged in a plurality of holding members, in described transposing step, by a plurality of holding members described in described transposing facility transposition.
10. crystal grain location as claimed in claim 6 method for arranging, it is characterised in that described crystal grain location advancing equipment further includes circulating member, after described transposing step, also includes:
Circulation step, is transported the described holding members after transposition to the position corresponding to described deployment mechanism for support crystal grain once again by described circulating member.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510227183.5A CN106206392B (en) | 2015-05-07 | 2015-05-07 | Die positioning and arranging equipment and die positioning and arranging method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510227183.5A CN106206392B (en) | 2015-05-07 | 2015-05-07 | Die positioning and arranging equipment and die positioning and arranging method |
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| Publication Number | Publication Date |
|---|---|
| CN106206392A true CN106206392A (en) | 2016-12-07 |
| CN106206392B CN106206392B (en) | 2021-04-30 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510227183.5A Active CN106206392B (en) | 2015-05-07 | 2015-05-07 | Die positioning and arranging equipment and die positioning and arranging method |
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| CN (1) | CN106206392B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108962803A (en) * | 2017-05-17 | 2018-12-07 | 梭特科技股份有限公司 | Crystal grain transfer device |
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| CN2379914Y (en) * | 1999-06-14 | 2000-05-24 | 华东半导体工业股份有限公司 | Apparatus for assembling chip and having chip turning-over function |
| CN101189705A (en) * | 2005-08-16 | 2008-05-28 | 松下电器产业株式会社 | Chip reversing device and chip reversing method, and chip mounting apparatus and chip mounting method |
| US20080213975A1 (en) * | 2004-08-23 | 2008-09-04 | Hae Choon Yang | Supply Mechanism For the Chuck of an Integrated Circuit Dicing Device |
| CN102214549A (en) * | 2010-04-12 | 2011-10-12 | 宰体有限公司 | Semiconductor device testing device and testing method therefor |
| CN103377974A (en) * | 2012-04-16 | 2013-10-30 | 苏州均华精密机械有限公司 | Method and device for peeling, picking and placing crystal grains |
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2015
- 2015-05-07 CN CN201510227183.5A patent/CN106206392B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2379914Y (en) * | 1999-06-14 | 2000-05-24 | 华东半导体工业股份有限公司 | Apparatus for assembling chip and having chip turning-over function |
| US20080213975A1 (en) * | 2004-08-23 | 2008-09-04 | Hae Choon Yang | Supply Mechanism For the Chuck of an Integrated Circuit Dicing Device |
| CN101189705A (en) * | 2005-08-16 | 2008-05-28 | 松下电器产业株式会社 | Chip reversing device and chip reversing method, and chip mounting apparatus and chip mounting method |
| CN102214549A (en) * | 2010-04-12 | 2011-10-12 | 宰体有限公司 | Semiconductor device testing device and testing method therefor |
| CN103377974A (en) * | 2012-04-16 | 2013-10-30 | 苏州均华精密机械有限公司 | Method and device for peeling, picking and placing crystal grains |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108962803A (en) * | 2017-05-17 | 2018-12-07 | 梭特科技股份有限公司 | Crystal grain transfer device |
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| CN106206392B (en) | 2021-04-30 |
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