KR101516575B1 - Substrate processing apparatus, substrate processing method and storage medium storing substrate processing program - Google Patents

Substrate processing apparatus, substrate processing method and storage medium storing substrate processing program Download PDF

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KR101516575B1
KR101516575B1 KR1020110057597A KR20110057597A KR101516575B1 KR 101516575 B1 KR101516575 B1 KR 101516575B1 KR 1020110057597 A KR1020110057597 A KR 1020110057597A KR 20110057597 A KR20110057597 A KR 20110057597A KR 101516575 B1 KR101516575 B1 KR 101516575B1
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South Korea
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substrate
processing chamber
substrate processing
substrates
transfer
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KR1020110057597A
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Korean (ko)
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KR20110137249A (en
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아키라 무라타
잇세이 우에다
오사무 구로다
코우지 기모토
마사히로 요시다
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도쿄엘렉트론가부시키가이샤
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67178—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers vertical arrangement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67754—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a batch of workpieces

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
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  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

Thereby improving the throughput of the substrate processing in the substrate processing apparatus. In the present invention, there are provided substrate transfer bases 11 and 12 capable of placing a plurality of substrates 2, a substrate processing chamber 15 for processing the substrates 2 one by one, Transfer the substrates 2 from the transfer bases 11 and 12 to the respective substrate processing chambers 15 and 16 and transfer the substrates 2 from the substrate processing chambers 15, (N is an integer of 3 or more) are provided in the substrate transport mechanisms 36 and 38, and the substrate transport mechanisms 36 and 38 for transporting the substrates 2 to the substrate transport mechanisms 36 and 38, (43, 44, 45) for use in a substrate processing apparatus and a substrate processing apparatus for use in the same substrate processing apparatus (1) (2 to N-1 pieces) of the substrates 2 are simultaneously held by 2 to N-1 substrate support areas 43, 44 and 45, and the substrates 2 ) To carry out I made it.

Description

TECHNICAL FIELD [0001] The present invention relates to a substrate processing apparatus, a substrate processing method, and a recording medium on which a substrate processing program is recorded. BACKGROUND OF THE INVENTION 1. Field of the Invention [0001]

The present invention relates to a substrate processing apparatus, a substrate processing method, and a recording medium on which a substrate processing program is recorded. More particularly, the present invention relates to a substrate processing apparatus, a substrate processing method, To a substrate processing apparatus, a substrate processing method, and a recording medium on which a substrate processing program is recorded.

2. Description of the Related Art Conventionally, in the case of manufacturing a semiconductor component or a flat display, a substrate processing apparatus of a leaf-like shape is used for cleaning or etching a substrate such as a semiconductor wafer or a liquid crystal substrate.

This monolithic substrate processing apparatus has a substrate transfer chamber extending in the front and rear directions at a central portion of a rectangular box-shaped casing, and is formed by arranging a plurality of substrate processing chambers in front and rear in left and right chambers of the substrate transfer chamber .

In the substrate processing apparatus, substrates are carried in each substrate processing chamber one by one using a substrate transport mechanism provided inside the substrate transport chamber, the substrates are processed one by one in each substrate processing chamber, And is carried out from each substrate processing chamber by using a transport mechanism (see, for example, Patent Document 1).

Japanese Patent Laid-Open Publication No. 2008-34490

In the above conventional substrate processing apparatus, since the substrates are transported one by one using the substrate transport mechanism, the time required for transporting the substrates in the substrate processing apparatus is long.

Therefore, in the substrate processing apparatus, it is necessary to shorten the time required for transporting the substrate to further improve the throughput of the substrate processing.

As a means for shortening the time required for transporting the substrate in the substrate processing apparatus, it is conceivable to increase the moving speed of the substrate transport mechanism. However, since the substrate must be transported in a stationary state, There was a limit to the increase of the moving speed of the mechanism.

Therefore, according to the present invention, there is provided a substrate processing apparatus comprising: a substrate transfer table capable of placing a plurality of substrates; a substrate processing chamber for processing the substrates one by one; (N is an integer of 3 or more) provided in the substrate transport mechanism, and a substrate support for holding the substrates one by one, the substrate processing apparatus comprising: A plurality of (two to N-1) pieces of the substrates are held at the same time from 2 to N-1 substrate backplane of the N substrate backplanes, and the substrates are brought into the substrate processing chamber one by one .

In the above substrate processing apparatus, at least one or more of the N substrate bores may be provided as a carry-only substrate holding means for carrying only the substrate into the substrate processing chamber by carrying it thereon, Wherein said substrate processing chamber is provided with at least one or more other substrate supporting portions for carrying said substrate from said substrate processing chamber to said substrate processing chamber, To be carried out for carrying out the same.

In addition, in the above substrate processing apparatus, it is preferable that a substrate holding body for holding the substrate is provided on each of the substrate holding regions, and when the substrate holding body is brought into the substrate holding body provided on the carrying- And a substrate holding portion for holding the substrate at the time of carrying out the substrate holding portion is arranged in the moving direction of the substrate supporting portion when the carrying-in and-out substrate holding portion is carried out, and the moving distance of the carrying- So as to be different from the above-mentioned board for exclusive use of the carry-out.

In the above substrate processing apparatus, the N substrate backing strips are arranged vertically and arranged, and at least one or more substrate backing strips on the upper side are transferred only by carrying out the substrate from the substrate processing chamber, I decided to do it.

Further, in the above substrate processing apparatus, the N substrate supports are arranged in an up-and-down direction, and the substrate is transferred from the one of the two substrate supports to the substrate processing chamber , And the substrate is taken out from the substrate processing chamber at the other substrate backplane.

In the above substrate processing apparatus, a transfer device for transferring the N or more substrates simultaneously is provided between the substrate carrier and the carrier accommodating the plurality of substrates.

Further, in the present invention, there are provided N substrate strips for holding the substrates one by one between the substrate transfer table capable of placing a plurality of substrates and the substrate processing chamber for processing the substrates one by one (N is 3 The substrate processing apparatus according to the present invention is a substrate processing method for carrying the substrate by using a substrate transfer mechanism provided with two to N-1 substrates A plurality of (two to N-1) pieces of the substrates are held at the same time in the backplane, and the substrates are brought into the processing chamber one by one.

In the above-mentioned substrate processing method, at least one of the N substrate bores is dedicated only by bringing the substrate into the substrate processing chamber, and at least one or more other substrate bumps are transferred to the substrate processing chamber And at least one or more of the other substrate bumps are used to carry the substrate into the substrate processing chamber and to take out the substrate from the substrate processing chamber.

In addition, in the above substrate processing method, at least one or more substrate backplanes on the upper side among the N substrate backplanes arrayed in the upper and lower rows are dedicated only by carrying out the substrate from the substrate processing chamber.

In addition, in the above-mentioned substrate processing method, the substrate is carried into the substrate processing chamber in one of the two substrate sub-planes arranged vertically among the N substrate sub- The substrate is taken out from the substrate.

Further, in the above-mentioned substrate processing method, the N or more substrates are simultaneously transferred using a transfer device between a carrier containing a plurality of the substrates and the substrate transfer belt.

Further, in the present invention, between the substrate transfer table capable of placing a plurality of substrates and the substrate processing chamber for processing the substrates one by one, there are provided N substrate pairs for holding the substrates one by one, A substrate processing program for carrying the substrate by using a substrate transfer mechanism installed therein and processing the substrates one by one in the substrate processing chamber, the recording medium comprising: A plurality of (two to N-1) pieces of the substrates are held at the same time in the (N-1) substrate backplane, and the substrates are brought into the substrate processing chamber one by one.

In addition, in the recording medium on which the substrate processing program is recorded, at least one of the N substrate bores is dedicated only by carrying the substrate into the substrate processing chamber, and at least one or more other substrate- And at least one or more of the other substrate supports are used to carry the substrate into the substrate processing chamber and to take the substrate out of the substrate processing chamber.

In addition, in the recording medium on which the substrate processing program is recorded, at least one or more substrate backplanes on the upper side among the N substrate backplanes arrayed in the upper and lower rows may be transferred only by carrying out the substrate from the substrate processing chamber .

In addition, in the recording medium on which the substrate processing program is recorded, the substrate is carried into the substrate processing chamber from one of the two substrate sub-planes arranged vertically among the N substrate sub- And the substrate is taken out from the substrate processing chamber.

Further, in the recording medium on which the substrate processing program is recorded, between the carrier accommodating a plurality of the substrates and the substrate carrier, the N or more substrates are simultaneously transported by using the transport device.

In the present invention, a substrate is transported to a substrate processing chamber by using a substrate transport mechanism provided with N substrate strips (N is an integer of 3 or more) for holding the substrates one by one, and the substrates are processed one by one in the substrate processing chamber A plurality of (two to N-1) substrates are held at the same time in two to N-1 substrate backplane of the N substrate backplanes, and the substrates are brought in one by one into the substrate processing chamber Therefore, the time required for transporting the substrate can be shortened, and the throughput of the substrate processing can be improved.

1 is a plan view showing a substrate processing apparatus;
2 is a side sectional view of the substrate processing apparatus.
3 is a plan view showing a substrate transport mechanism;
4 is a side view of the substrate processing apparatus.
5 is an explanatory view showing the operation of the substrate transport mechanism;

Hereinafter, a specific configuration of the substrate processing apparatus according to the present invention will be described with reference to the drawings.

As shown in Figs. 1 and 2, the substrate processing apparatus 1 includes a plurality of (for example, 25) substrates 2 (here, semiconductor wafers) A substrate carrying unit 4 for carrying in and out is formed and a rectangular box-shaped substrate carrying unit 5 for carrying a substrate 2 housed in the carrier 3 is formed at the rear of the substrate carrying-in / And a rectangular box-like substrate processing unit 6 for performing various processes such as cleaning and drying of the substrate 2 is formed on the rear portion of the substrate transfer unit 5. [

The substrate carry-in carriage 4 is configured such that a plurality of (four in this case) carriers 3 are placed close to the front wall 7 of the substrate transfer unit 5 so as to be placed laterally spaced apart from each other .

The substrate transfer unit 5 is provided with a transfer chamber 9 containing the transfer device 8 on the front side and a substrate transfer chamber 10 on the rear side of the transfer chamber 9, Two substrate transfer bases 11 and 12 are vertically housed in a plurality of (two in this example) substrates 2 spaced upward and downward.

The substrate transfer unit 5 is connected to the transfer chamber 9 and the substrate transfer chamber 10 via a transfer port 13.

The substrate transfer unit 5 transfers the substrate 1 between any one of the carriers 3 placed on the substrate loading / unloading base 4 and any one of the upper and lower substrate transfer units 11 and 12 by using the transfer device 8. [ (In this case, five sheets) are arranged and transported.

The substrate transfer unit 5 transfers the upper 10 pieces of the upper and lower substrate transfer tables 11 and 12 from the substrate loading and unloading station 4 to the substrate processing unit 6 in the substrate processing unit 6 and 10 in the lower side are used when the substrates are transferred from the substrate processing unit 6 to the substrate loading and unloading station 4, 2 is prevented from being supported at the same portion of the substrate transfer bases 11 and 12 and transfer of particles or the like from the substrate 2 before the processing to the substrate 2 after the processing is prevented .

The substrate processing unit 6 is provided with a first substrate transfer chamber 14 extending in the longitudinal direction on the upper side of the central portion and first to fourth substrate processing chambers 15 to 18 on the left side of the first substrate transfer chamber 14 And the fifth to eighth substrate processing chambers 20 to 23 are arranged in the front and rear direction on the right side of the first substrate transfer chamber 14, respectively.

The substrate processing unit 6 is provided with a second substrate transport chamber 25 extending in the front and rear direction in the same manner as the first substrate transport chamber 14 at the lower center portion, The ninth to twelfth substrate processing chambers 26 to 29 are arranged in the front and rear direction and the thirteenth to sixteenth substrate processing chambers 31 to 34 are arranged in the front and rear direction on the right side of the second substrate transfer chamber 25.

The first substrate transfer chamber 14 accommodates a first substrate transfer mechanism 36 configured to be movable in the forward and backward directions and is provided in the substrate transfer chamber 11 on the upper side of the substrate transfer chamber 10, And is communicated through the loading / unloading port (37). The second substrate transfer chamber 25 accommodates a second substrate transfer mechanism 38 configured to be movable in the forward and backward directions and is provided with a substrate transfer chamber 2 substrate carry-in / out port 39. In this case,

As shown in Figs. 3 and 4, the first and second substrate transport mechanisms 36 and 38 have the same structure, and the structure of the first substrate transport mechanism 36 will be described. The movable member 36 is movable along a rail 40 laid on a floor of the substrate transfer chamber 14 by a driving mechanism not shown and includes a driving mechanism for moving the movable member upward and downward A casing 42 is provided on an upper portion of a moving table 41 and three stages of substrate beams 43, 44 and 45 for receiving and transferring the substrate 2 held in the casing 42 And arranged vertically.

Each of the substrate supporting members 43, 44 and 45 is provided with a pair of fork-like fork-shaped substrate table stands 49, 50 and 51 which can be advanced and retreated forwardly of the drive units 46, 47 and 48, Four substrate supports 52, 53 and 54 for supporting the substrate 2 on the upper surface of the table 49, 50 and 51 are respectively provided at intervals in the circumferential direction along the outer circumferential edge of the substrate 2 have. The driving devices 46, 47 and 48 move the substrate table 49, 50 and 51 in the moving direction (the advancing and retracting direction) close to the direction in which they are spaced apart from the driving devices 46, 47 and 48.

The top and bottom substrate supports 43 and 45 are formed by forming the substrate supports 52 and 54 in a single step shape and forming the outer periphery of the substrate 2 at the substrate holding portions 55 and 56 at the respective stages So that the edge portion is supported and the substrate 2 is held horizontally.

The top substrate support 43 at the uppermost stage is provided with a substrate support 2 for exclusive use only for carrying out the substrate 2 from the substrate processing chambers 15 to 18, 20 to 23, 26 to 29, and 31 to 34 43 and the lowermost substrate support strip 45 is made of a dedicated transfer substrate for transferring only the substrate 2 to each of the substrate processing chambers 15 to 18, 20 to 23, 26 to 29, 31 to 34, And serves as a supplementary earth 45. This prevents the substrate 2 before and after the treatment from being held by the same substrate support 43 or 45 and prevents the transfer of particles and the like from the substrate 2 before the treatment to the substrate 2 after the treatment can do.

On the other hand, the substrate backplane 44 in the middle stage carries the substrates 2 into the respective substrate processing chambers 15 to 18, 20 to 23, 26 to 29, 31 to 34, Out substrate board 44 for carrying out the substrate 2 from the substrates 20 to 23, 26 to 29, and 31 to 34, respectively. The substrate support 44 for carrying in and out of the substrate support substrate 44 is formed in a two-step shape so that when the substrate support 53 is carried into each of the substrate processing chambers 15 to 18, 20 to 23, 26 to 29 and 31 to 34, The substrate 2 is held at the time of removal from the substrate holding portions 57a and 57b and the respective substrate processing chambers 15 to 18, 20 to 23, 26 to 29, and 31 to 34 at the time of carrying out holding the substrate 2, And the substrate holding portions 58a and 58b are formed in a moving direction (advancing / retreating direction) of the substrate support 44 for both the input and output. The substrate holding portion 57a at the time of loading is formed at the lower end of the substrate supporting body 53 in front of the moving direction of the loading / unloading substrate supporting portion 44, and the substrate holding portion 57b at the time of loading / And is formed at the upper end of the substrate support 53 at the rear of the moving direction of the earth 44.

The substrate holding portion 58a at the time of unloading is formed at the upper end of the substrate supporting body 53 in front of the moving direction of the loading / unloading substrate holding portion 44 and the substrate holding portion 58b at the unloading / And is formed at the lower end of the substrate support 53 in the rear of the substrate support strip 44 in the moving direction. Therefore, the pitches of the respective substrate holding portions in the moving direction of the carrying-in / out substrate supporting portion 44 and the pitches of the substrate holding portions in the moving direction of the carrying-in and carrying-out substrate supporting portions 43 and 45 are formed differently.

The positions of the respective substrate holding portions in the moving direction of the carrying-in / out substrate supporting portion 44 are different from the positions of the substrate holding portions in the moving direction of the carrying-in and carrying-out supporting substrate 43, 45.

In addition, the substrate carrying area 44 for both the carrying-in and carrying-out is widened to move back and forth more forward and backward than the carrying-in and carrying-out substrate supporting parts 43 and 45, The moving distance and the movement distance of the carry-in / take-out-only substrate buffer strips 43 and 45 are made different from each other, so that the substrate placed at the same position can be received.

The substrate support region 44 for interrupting the substrate support (the substrate for supporting both the substrate in and out of the substrate) 44 supports the substrate holding portions 57a and 57b at the first stage of the two substrate supports 53, The outer peripheral edge of the substrate 2 is supported by the substrate holding portion 57b during the second-stage carry-in of the two substrate supports 53 on the rear side in the moving direction of the substrate support strip 44 (a state shown by a dotted line in FIG. Or the two substrate supports 53 on the rear side in the moving direction of the substrate support 44 and the substrate holding portion 58a in the second stage out of the two substrate supports 53 on the front side in the moving direction of the substrate support 44, The outer peripheral edge of the substrate 2 is supported by the substrate holding portion 58b (the state shown by the solid line in Fig. 4) during the first-stage removal of the substrate 2, and the substrate 2 is held in an oblique shape. Thereby, the substrate 2 before being processed by the substrate processing chambers 15 to 18, 20 to 23, 26 to 29, and 31 to 34 is transferred to the substrate holding portion 57 And the second substrate support 53 on the rear side are supported by the substrate holding portion 57b during the second carry-in and the substrate 2 after the processing is held by the substrate holding portion 53 at the second- It is possible to prevent the substrate 2 before and after the processing from being supported at the same portion of the substrate support 53 by supporting the substrate 58 by the substrate holding portion 58b at the first stage of the rear portion 58a and the rear two substrate supports 53 It is possible to prevent the transfer of particles and the like between the substrates 2 before and after the treatment.

In the substrate processing unit 6, the substrate transfer chamber 10 of each substrate transfer unit 5 and each of the substrate processing chambers 15 to 18, 20 to 23, 26-29 and 31-34 or between the substrate processing chambers 15-18, 20-23, 26-29 and 31-34, and the substrate processing chambers 15- 18, 20 to 23, 26 to 29, and 31 to 34, the substrates 2 are processed one by one.

The substrate processing apparatus 1 is constructed as described above and the substrate processing chambers 15 to 18, 20 to 23, and 26 of the substrate transfer unit 8 or the substrate processing unit 6 of the substrate transfer unit 5 29 and 31 to 34 or the substrate transport mechanisms 36 and 38 are connected to the control section 59 and stored in the recording medium 60 incorporated in the control section 59. [

The substrate transport mechanisms 36 and 38 are controlled as described below by a substrate processing program, and are adapted to transport a plurality of substrates 2 at the same time. In the following description, the operation of the first substrate transport mechanism 36 will be described, but the second substrate transport mechanism 38 operates in the same manner.

First, in the substrate processing program, five substrates 2 are transported from a single carrier 3 placed on the substrate carry-in carriage 4 to the substrate transfer carrier 11 by using the transport device 8. In this substrate processing program, the upper 10 pieces of the upper and lower substrate transfer bases 11 and 12 which can mount 20 substrates 2 are transferred from the substrate loading / unloading station 4 to the substrate processing unit 6 The substrate transporting carriage 4 is successively divided into five pieces on the upper side and five pieces on the lower side among the 10 pieces used for carrying in each of the substrate transfer bases 11 and 12 by using the transfer device 8, So that the substrate 2 is transported from the one carrier 3 placed on the substrate transfer table 11.

5A, the substrate transfer mechanism 36 is moved to the position immediately before the substrate transfer chamber 10 and placed on the uppermost and second stages of the substrate transfer table 11 And receives the two substrates 2 at the lower and lower stages of the substrate support 44 and 45, respectively.

At this time, unlike the substrate backplane 45 (carrying-only substrate backbone) 45, which is the substrate substrate backbone (the substrate for loading and unloading the substrate back and forth) 44 of the interruption, The substrate 2 is held in the inclined shape of the front and back in the substrate holding portion 57b at the time of the second-stage loading of the substrate holding portion 57a and the two rear substrate supporting bodies 53 at the first- A state shown by a dotted line in Fig. 4).

Subsequently, in the substrate processing program, as shown in FIG. 5B, the substrate transport mechanism 36 is moved to any one of the substrate processing chambers (for example, the first substrate processing chamber 15 The substrate is moved to the immediately preceding room position of the substrate processing chamber 15 and the height thereof is adjusted and one substrate 2 processed in the substrate processing chamber 15 is taken out of the substrate processing chamber 15 do.

Subsequently, in the substrate processing program, one substrate 2 held in the substrate supporting portion 44 of the substrate transport mechanism 36 is carried into the substrate processing chamber 15, as shown in Fig. 5C.

At this time, the abrupt substrate abutment region (transfer substrate support region) 44 moves back and forth by a long distance, unlike the substrate abutment region 45 (transfer substrate only), which will be described later The substrate holding portion 57a and the rear two substrate supporting bodies 53 are held in a sloped shape in the front and rear directions in the substrate holding portion 57b at the time of the second-stage loading of the two front substrate supporting bodies 53, (In a state shown by a dotted line in Fig. 4) is carried into the substrate processing chamber 15. As shown in Fig.

5D, the substrate transfer mechanism 36 is moved to another substrate processing chamber (for example, the second substrate processing chamber 16) while holding the two substrates 2, And one height of the substrate 2 after the processing in the substrate processing chamber 16 is taken out of the substrate processing chamber 16 to the abutting substrate backing 44. [

At this time, unlike the uppermost substrate support (transfer only substrate support) 43 (Fig. 5B) described above, the substrate support (interposed / , The substrate 2 is transported from the substrate holding portion 58b at the time of carrying out the first stage of the substrate holding portion 58a and the two rear substrate holding bodies 53 at the time of carrying out the second stage of the two front substrate supporting bodies 53 (In a state shown by a solid line in Fig. 4).

Subsequently, in the substrate processing program, one substrate 2 held by the substrate support 45 at the lowermost end of the substrate transport mechanism 36 is carried into the substrate processing chamber 16, as shown in Fig. 5E.

5F, the substrate transfer mechanism 36 is moved to the position immediately before the substrate transfer chamber 10, and the substrate transfer is carried out simultaneously at the uppermost stage and the interrupted substrate stages 43, 44 at the same time The two substrates 2 to be held are transferred to the third stage and the lower stage of the substrate transfer platform 11, respectively.

At this time, the abrupt substrate abutment region (transfer substrate support region) 44 is moved forward and backward by a short distance different from the uppermost substrate abutment region (transfer only substrate abutment region) 43, The substrate 2 is held by the substrate holding portion 58b at the first stage of the substrate holding portion 58a and the two rear substrate holding bodies 53 at the time of carrying out the second stage of the substrate holding portion 53, (The state shown by the solid line in Fig. 4).

Thereafter, in the substrate processing program, the five substrates 2 are transferred to any one of the carriers 3 placed on the substrate transfer platform 4 from the substrate transfer platform 11 using the transfer device 8 . In this substrate processing program, the lower 10 pieces of the upper and lower substrate transfer bases 11 and 12 which can mount 20 substrates 2 are transferred from the substrate processing unit 6 to the substrate loading / unloading station 4 And the upper side and the lower side of the 10 pieces used for carrying out the respective substrate transfer bases 11 and 12 are divided into 5 pieces and the lower side are sequentially transferred from the substrate transfer table 11 to the substrate And the substrate 2 is carried to any one of the carriers 3 placed on the platform 4.

In the above description, a case has been described in which the two substrates 2 are simultaneously conveyed while being held by the substrate conveying mechanism 36 having the three substrate supporting portions 43, 44 and 45. However, Two or more (N-1 or less) substrates 2 can be simultaneously held and transported by using a substrate transport mechanism having three or more substrates.

As described above, in the substrate processing method using the substrate processing program in the substrate processing apparatus 1, three substrate buffers 43, 44, and 45 for holding the substrates 2 one by one are provided In the case where the substrate 2 is transported to the substrate processing chambers 15 and 16 by using the substrate transport mechanism 36 and the substrates 2 are processed one by one in the substrate processing chambers 15 and 16, Two substrates 2 are simultaneously held by the respective substrates 1 to 43, 44 and 45 and the substrates 2 are transported one by one to the substrate processing chambers 15 and 16, Can be shortened and the throughput of the substrate processing can be improved.

The number of the substrate posts 43, 44, 45 is not limited to three, but may be N (N is an integer of 3 or more), and 2 to N-1 substrates 2 may be simultaneously conveyed It is possible to shorten the time required for conveyance of the substrate 2 further by conveying the N-1 pieces of the substrates 2 at the same time, and it is possible to improve the throughput of the substrate processing. Further, when all the N substrates are simultaneously transported, the substrate 2 processed by the substrate processing chambers 15 to 18, 20 to 23, 26 to 29, and 31 to 34 can not be taken out, 2 can not be carried out at the same time and must be transported by the carrying-in and carrying-out of the substrate 2, and the time required for transporting the substrate 2 becomes longer.

Particularly, in the substrate conveying mechanism 36 of the above-described substrate processing apparatus 1, one of the plurality of (here, three) substrate supporting portions 43, 44, The substrate 2 is transferred only by carrying the substrate 2 to the substrate processing chamber 15 and the other substrate holding portion 43 is transferred only from the substrate processing chamber 16 to the substrate processing chamber 16, 44 are used to carry the substrate 2 into the substrate processing chamber 15 and to transport the substrate 2 from the substrate processing chamber 16, It is possible to simplify the structure of the substrate transport mechanism 36 and to improve the assembling workability or the maintenance property of the substrate transport mechanism 36, Can be reduced.

A plurality of (three in this case) substrate supports 43, 44 and 45 are arranged vertically in the substrate transport mechanism 36 of the substrate processing apparatus 1, The substrate 2 before being processed in the substrate processing chamber 15 is placed on the uppermost substrate support 43 so that the substrate 2 can be removed from the substrate processing chamber 15, It is possible to prevent particles and the like adhering to the substrate 2 before processing from dropping and damaging the substrate 2 held by the lower substrate supports 44 and 45. [

The substrate transfer mechanism 36 of the substrate processing apparatus 1 includes a plurality of (three in this case) substrate bores 43, 44 (44, 45) arranged vertically and arranged vertically The substrate 2 is carried into the substrate processing chamber 15 (16) by one of the two substrate supporting portions 44 (45) provided in parallel with the substrate supporting portion 44 (45) Since the substrate 2 is to be taken out from the substrate processing chamber 15 (16) with the substrate transfer mechanism (44), the distance for moving the substrate transfer mechanism (36) is shortened, and the transfer time can be further shortened. While the substrate 2 is carried out from the substrate processing chamber 15 (16) by the other substrate holding region 43 (44), the one substrate holding region 44 (45) 16), the opening area of the substrate processing chamber 15 (16) is made smaller when both substrates are simultaneously present in the substrate processing chamber 15 (16) And the size of the substrate processing chamber 15 (16) can be reduced.

In the substrate processing apparatus 1, a carrier 3 mounted on the substrate carry-in carriage 4 and a substrate transfer carrier 11, The number of N (in this case, three) or more (here, five) substrates 2 are collectively transported, so that the time required for transporting the substrate 2 can be further shortened, The throughput of the substrate processing can be improved.

1: substrate processing apparatus
2: substrate
3: Carrier
4: Transfer board
5: substrate transfer unit
6: substrate processing unit
7: Front wall
8:
9: Carrier
10: substrate transfer chamber
11, 12: substrate transfer base
13:
14, 25: substrate transport chamber
15 to 18, 20 to 23, 26 to 29, 31 to 34: substrate processing chamber
36, 38: substrate transport mechanism
37, 39: substrate loading / unloading outlet
40: rail
41:
42: casing
43, 44, 45: substrate substrate
46, 47, 48: Driving device
49, 50, 51: substrate mounting table
52, 53, 54: substrate support
55 to 58: substrate holding portion
59:
60: Recording medium

Claims (16)

A substrate transfer table capable of mounting a plurality of substrates,
A substrate processing chamber for processing the substrates one by one,
A substrate transport mechanism for transporting the substrate from the substrate transfer chamber to the substrate processing chamber and transporting the substrate from the substrate processing chamber to the substrate transfer chamber;
(N is an integer of 3 or more) provided in the substrate transport mechanism, and is provided with a substrate support
The substrate processing apparatus comprising:
(2 to N-1 pieces) of the substrates are simultaneously held in 2 to N-1 substrate backplanes of the N substrate backplanes, and the substrates are carried into the substrate processing chamber one by one,
Wherein at least one of the N substrate bores is made to be a dedicated transfer substrate pouch for transferring only the substrate into the substrate processing chamber and at least one or more other substrate pores are transferred from the substrate processing chamber to the substrate processing chamber, For carrying out the substrate from the substrate processing chamber to the substrate processing chamber and transferring the substrate from the substrate processing chamber to the substrate processing chamber, Wherein the substrate processing apparatus comprises: The method according to claim 1,
The substrate holding body for holding the substrate is provided on each of the substrate holding portions and the substrate holding body provided on the substrate holding portion for holding the substrate is provided with a holding portion for holding the substrate at the time of carrying, And the substrate holding unit is arranged in the moving direction of the substrate support when the substrate holding unit holds the substrate, and the movement distance of the substrate support unit is different from that of the transfer only substrate support unit or the carry- . 3. The method according to claim 1 or 2,
Characterized in that the N substrate supporting posts are arranged vertically in an up-and-down direction and at least one or more substrate supporting portions on the upper side are transferred only by carrying out the substrate from the substrate processing chamber. Device. 3. The method according to claim 1 or 2,
Wherein the N substrate support strips are arranged in an array up and down and the substrate is carried into the substrate processing chamber from one of the two substrate supports provided vertically, And the substrate is taken out from the substrate processing chamber in the beam region. 3. The method according to claim 1 or 2,
Wherein a transfer device for simultaneously transferring at least N substrates is provided between a carrier accommodating a plurality of the substrates and the substrate transfer table. (N is an integer of from 1 to 5) for holding (holding) the substrates one by one between a substrate transfer table capable of placing a plurality of substrates and a substrate processing chamber for processing the substrates one by one, A substrate processing apparatus for carrying the substrate by using a substrate transfer mechanism provided and processing the substrates one by one in the substrate processing chamber,
(2 to N-1 pieces) of the substrates are simultaneously held in 2 to N-1 substrate backplane of the N substrate backplanes, and the substrates are carried into the substrate processing chamber one by one,
At least one of the N substrate bores is dedicated only by bringing the substrate into the substrate processing chamber and only at least one or more other substrate bumps are taken out of the substrate processing chamber And at least one or more other substrate storage areas are used to carry the substrate into the substrate processing chamber and to transport the substrate from the substrate processing chamber. The method according to claim 6,
Wherein at least one or more substrate backplanes on the upper side among the N substrate backplanes arrayed vertically are dedicated only by carrying out the substrate from the substrate processing chamber. 8. The method according to claim 6 or 7,
The substrate is carried into the substrate processing chamber in one of two substrate supports provided vertically among the N substrate supports arranged in the vertical direction and the substrate is taken out from the substrate processing chamber at the other side The substrate processing method comprising: 8. The method according to claim 6 or 7,
Wherein at least N substrates are simultaneously transported between a carrier containing a plurality of the substrates and the substrate transfer belt by using a transfer device. There is provided a substrate support for holding (holding) the substrates one by one between a substrate transfer table capable of mounting a plurality of substrates and a substrate processing chamber for processing the substrates one by one, A substrate processing program for carrying the substrate by using a substrate transfer mechanism provided thereon and processing the substrates one by one in the substrate processing chamber,
(2 to N-1 pieces) of the substrates are simultaneously held in 2 to N-1 substrate backplanes of the N substrate backplanes, and the substrates are carried into the substrate processing chamber one by one,
At least one of the N substrate bores is dedicated only by bringing the substrate into the substrate processing chamber and only at least one or more other substrate bumps are taken out of the substrate processing chamber And at least one or more other substrate storage areas are used to carry the substrate into the substrate processing chamber and to transport the substrate from the substrate processing chamber. 11. The method of claim 10,
Wherein at least one or more substrate backplanes on the upper side among the N substrate backplanes arrayed vertically are dedicated only by carrying out the substrate from the substrate processing chamber. The method according to claim 10 or 11,
The substrate is transferred from one of the two substrate back-and-forth regions arranged vertically among the N substrate back-and-forth arranged in the upper and lower rows to the substrate processing chamber, and the substrate is taken out from the substrate processing chamber at the other And the substrate processing program is recorded on the recording medium. The method according to claim 10 or 11,
Wherein at least N substrates are simultaneously transported between a carrier containing a plurality of the substrates and the substrate transfer platform using a transfer device.

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KR1020110057597A 2010-06-16 2011-06-14 Substrate processing apparatus, substrate processing method and storage medium storing substrate processing program KR101516575B1 (en)

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