KR20090012702A - Substrate transfering apparatus and facility for treating with the same, and method for trasfering substrate with the apparatus - Google Patents

Abstract

A substrate transferring apparatus and a facility for treating with the same, and a method for transferring a substrate with the apparatus are provided to increase the throughput of substrate and prevent the contamination of substrate. A substrate transport apparatus(100) comprises a blade(110). The plurality of blades are successively integrated on the substrate transport apparatus. The substrate is settled in the blade. The blade has a substrate support member. The substrate support member is arranged in a plurality of locations on the blade. The substrate support member has the first support block(114), the second support block(116) and a driver. The first support block is arranged in the shear of blade. The second support block is arranged in the backend of blade. The first and second support blocks contact with the substrate.

Description

SUBSTRATE TRANSFERING APPARATUS AND FACILITY FOR TREATING WITH THE SAME, AND METHOD FOR TRASFERING SUBSTRATE WITH THE APPARATUS

The present invention relates to an apparatus for transferring a semiconductor substrate, a facility for processing the substrate with the same, and a substrate transfer method of the substrate transfer apparatus.

In a general semiconductor manufacturing process, in order to proceed with each unit process, a plurality of facilities for each process characteristic is provided. And these facilities are equipped with the apparatus for conveying a wafer to each facility.

Of these wafer transfer devices, the robot arm usually consists of a blade, a plurality of arms, and a driver. The blade is a plate for seating the wafer. Arms are provided for operating the blade. The actuators operate organically to transfer the wafers placed on the blades to their respective facilities.

However, in a typical wafer transfer apparatus, when the substrate is transferred, the blade is contaminated by the foreign matter remaining on the substrate, and the substrates processed afterwards are contaminated by the foreign matter remaining on the blade. In particular, the robot arm provided in the facility for processing the substrate using the processing liquid is contaminated by the processing liquids remaining on the wafer when the substrate having been processed is taken out of the processing chamber. Therefore, the wafer to be processed afterwards is contaminated by the processing liquid remaining in the blade, so that the substrate processing process efficiency is lowered.

In addition, the general wafer transfer apparatus has a low wafer throughput. That is, the general wafer transfer device transfers one wafer at a time, so the amount of wafer processing per unit time is small.

In addition, in the general wafer transfer apparatus, a phenomenon in which processing efficiency is lowered due to unstable mounting of the wafer during the process occurs. In other words, if the seating state of the wafer seated on the blade is unstable, the wafer may be detached from the blade during the wafer transfer and the wafer may be damaged, or the wafer may not be correctly placed at the required position in the process. .

It is an object of the present invention to provide a substrate transfer apparatus for preventing a blade from being contaminated by debris remaining on the substrate during substrate transfer, thereby reducing the efficiency of the substrate processing process, and a substrate processing apparatus and method including the same.

An object of the present invention is to provide a substrate transfer apparatus for improving substrate throughput, and a substrate processing equipment and method having the same.

An object of the present invention is to provide a substrate transfer apparatus for stably transferring wafers to improve process efficiency, and a substrate processing apparatus and method having the same.

According to an aspect of the present invention, there is provided a substrate transfer apparatus including a blade for mounting a substrate, wherein the blade includes substrate support means for supporting the substrate at a plurality of positions on the blade. The substrate supporting means may adjust a first support block disposed at the front end of the blade, a second support block disposed at the rear of the blade, and a relative distance between the first support block and the second support block. And a driver for driving at least one of the first support block and the second support block.

According to an embodiment of the present invention, the first support block has a stepped inner surface whose height decreases toward the rear end of the blade, and the second support block has a lower height toward the front end of the blade. Lost slopes.

According to another embodiment of the present invention, the first support block has a stepped inner surface that is lower in height toward the rear end of the blade, the second support block is lower in height toward the front end of the blade Losing has a stepped inner surface.

According to another embodiment of the present invention, the first support block has an inclined surface that is lower in height toward the rear end of the blade, the second support block has an inclined surface that is lower in height toward the front end of the blade Have

A substrate processing apparatus according to the present invention for achieving the above object is a plurality of process chambers for performing a processing process on a substrate, a load port for loading an accommodating member for accommodating a plurality of substrates, and the process chambers and the And a substrate transfer device for transferring a substrate between the receiving members placed in the load port, wherein the substrate transfer device includes at least one blade on which the substrate is placed during the process, and the blade is disposed at the front end of the blade and the process is performed. A first support block having a first support portion on which the substrate is placed when the substrate is brought into the chamber and a second support portion on which the substrate is placed when the substrate is removed from the process chamber, and disposed at the rear of the blade; A first seating portion on which the substrate is placed and a second seating portion on which the substrate is placed upon removal of the substrate from the process chamber; Which includes a second support block.

According to an embodiment of the present invention, the blade further comprises a driver for driving at least one of the first support block or the second support block to adjust the relative distance between the first support block and the second support block. Include.

According to an embodiment of the present invention, the first support block has a stepped inner surface that is lower in height toward the rear end of the blade, wherein the first support portion and the second support portion are different from each other on the inner surface. Is provided in height.

According to another embodiment of the present invention, the first support block has an inclined surface that is lower in height toward the rear end of the blade, the first support and the second support is provided at different heights of the inclined surface.

According to an embodiment of the present invention, the second support block has an inclined surface that is lower in height toward the front end of the blade, and the first seating portion and the second seating portion are provided at different heights of the inclined surface. .

According to another embodiment of the present invention, the second support block has a stepped inner surface that is lower in height toward the front end of the blade, wherein the first seating portion and the second seating portion are mutually It is provided at different heights.

The substrate processing method according to the present invention for achieving the above object is a case where the substrate is removed from the process chamber and the first portion of the blade in contact with the substrate when the substrate is brought into the process chamber where the substrate processing process is performed The second portions of the blades in contact with the substrate are made different from each other.

According to an embodiment of the present invention, the substrate transfer method is performed by adjusting the relative height of the first portion and the second portion, the relative height adjustment of the first portion and the second portion is the first support block And a relative distance between the second support block and the second support block.

According to an embodiment of the present invention, the substrate transfer method is provided by providing a support block having a stepped inner surface on the blade, so that the substrate is placed on a horizontal plane of a different height of the inner surface in some cases.

According to an embodiment of the present invention, the substrate transfer method is provided by providing a support block having an inclined surface on the blade, so that the substrate is placed at different heights of the inclined surface in some cases.

According to an embodiment of the present invention, the blade is arranged so that at least two blades are stacked up and down, and the substrate transfer method comprises the steps of: transporting a substrate from an accommodating member accommodating a plurality of substrates; Mounting a substrate on each of the blades, placing the substrate on one of the blades, transferring the substrate to one of the process chambers, and placing the substrate on the other one of the blades among the process chambers. Transferring the substrate to another.

According to an embodiment of the present invention, the substrate transfer method comprises seating a substrate located in any one of the process chambers to any one of the blades, the substrate located in the other one of the process chambers the blade The method further includes the step of seating on the other one of the two, and bringing the substrate into the receiving member.

The substrate transfer apparatus and substrate processing apparatus having the same according to the present invention, and the substrate transfer method of the apparatus is divided by the different parts of the blade to distinguish the case of carrying the substrate into the process chamber and the case of carrying out the substrate from the process chamber By being supported, the substrate subsequently prevented from being contaminated by foreign matter remaining in the substrate on which the process is completed in the process chamber.

The substrate transfer apparatus and substrate processing apparatus having the same according to the present invention, and the substrate transfer method of the apparatus improve the substrate throughput by simultaneously transferring a plurality of substrates.

The substrate transfer apparatus and substrate processing apparatus having the same according to the present invention, and the substrate transfer method of the apparatus stably seats the substrate during substrate transfer, thereby improving substrate processing process efficiency.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the invention is not limited to the embodiments described herein and may be embodied in other forms. Rather, the embodiments introduced herein are provided so that the disclosure will be thorough and complete, and will fully convey the spirit of the invention to those skilled in the art.

In addition, in the present embodiment, a substrate processing facility for cleaning a wafer for manufacturing a semiconductor integrated circuit chip has been described as an example, but the present invention may be applied to all facilities for processing a substrate.

In addition, in the present embodiment, the case where the process chamber performs the process of cleaning the substrate with the cleaning solution has been described as an example, but the present invention may be applied to all the facilities for processing the substrate.

(Example)

1 is a view showing a substrate processing facility according to the present invention, Figure 2 is a view showing the configuration of the process chamber shown in FIG. 3 is a perspective view showing the blade and the arm portion of the substrate transfer apparatus shown in Figure 1, Figure 4 is a side view of the blade shown in FIG. 5A and 5B are diagrams for describing an operation process of the second support block according to the present invention.

Referring to FIG. 1, a substrate processing facility 1 according to the present invention includes a process room 10, a load port 20, and a first transfer room 30. And a second trasfer room 40. The process chamber 10 has a plurality of process chambers 12. The process chambers 12 are arranged in a row on both sides of the second transfer chamber 40. The load port 20 is disposed in front of the first transfer chamber 30, and the process chamber 10 and the second transfer chamber 40 are disposed behind the first transfer chamber 30.

The process chamber 10 performs a process of processing a semiconductor substrate (hereinafter, referred to as a wafer) W. FIG. The process chamber 10 includes a plurality of process chambers 12. Each of the process chambers 12 performs the same semiconductor process. Alternatively, each of the process chambers 12 may optionally perform different processes. Two process chambers 12 are arranged side by side on both sides of the second transfer chamber 40.

The load port 20 loads / unloads the housing member 22 accommodating the plurality of wafers W. As the housing member 22, a cassette, a FOUP, and the like are used. Three load ports 20 are arranged side by side in front of the YFM 30.

The first transfer chamber 30 transfers the wafer W between the accommodating member 22 and the second transfer chamber 40 seated in the load port 20 during the process. The first transfer chamber 30 has at least one robot arm (not shown). The first transfer chamber 30 may be an equipment front end module (EFEM) installed in front of or behind the process equipment to transfer wafers between the process equipment and the outside of the process equipment.

The second transfer chamber 40 transfers the wafers W between the process chamber 10 and the first transfer chamber 30. The second transfer chamber 40 has at least one substrate transfer apparatus 100. The substrate transfer apparatus 100 transfers the wafers W transferred from the first transfer chamber 30 to each process chamber 12 during the cleaning process. In addition, the substrate transfer apparatus 100 transfers the wafers W on which the cleaning process has been completed from the respective process chambers 12 to the first transfer chamber 30. Details of the configurations of the substrate transfer apparatus 100 will be described later.

Subsequently, the process chamber 12 according to the present invention will be described in detail. In this embodiment, each process chamber 12 will be described by taking an example of performing a cleaning process for cleaning foreign matter remaining on the wafer surface.

Referring to FIG. 2, the process chamber 12 has a housing 12a, a chuck 12b, and a nozzle 12c. The housing 12a provides a space for performing a process of cleaning the wafer W therein. The housing 12a has a cylindrical shape with an open top. The open upper portion 12a 'of the housing 12a serves as a passage through which the wafer W enters and exits during the process. The chuck 12b supports and rotates the wafer W inside the housing 12a during the process. The nozzle 12c sprays the cleaning liquid onto the wafer W placed on the chuck 12b during the process.

Subsequently, the substrate transfer apparatus 100 according to the present invention will be described in detail. 3 and 4, the substrate transfer apparatus 100 includes a blade 110, an arm member 120, a driving part 130, and a guide rail. 140.

The blade 110 mounts and supports the wafer (W). The blades 110 are arranged such that two are stacked up and down. Each blade 110 has the same configuration and structure as each other. The blade 110 has a substrate support means for supporting the wafer W during the process. The substrate support means includes a support member 112, a first support block 114, and a second support block 116.

The support part 112 provides a surface on which the wafer W is seated during substrate transfer. The support 112 has two fingers 112a. Two fingers 112a are arranged side by side spaced apart at regular intervals. The wafer W is placed and supported on each finger 112a during substrate transfer.

The first support block 114 seats one side of the wafer (W). The first support block 114 is provided in front of each finger 112a. The first support block 114 protrudes upward from the upper surface of the finger 112a. The first support block 114 has an inner side surface which contacts and supports one side of the wafer W during the process. The inner side surface has a step shape in which the height decreases toward the rear end direction of the finger 112a.

As an example, the inner surface of the seating block 114 is stepped so that the height becomes lower toward the rear end direction (hereinafter, the first direction) X1 of the finger portion 112 as shown in FIG. 4. Has The inner side surface is provided with a first support 114a and a second support 114b. The first support part 114a and the second support part 114b are portions provided so that a portion of the lower surface of the wafer W is placed during substrate transfer. The height of the first support 114a is located at a height lower than the height of the second support 114a. When the first support part 114a transfers the wafers W from the EMP 30 to each process chamber 12, the first support part 114a contacts a portion of the lower surface of the front end of the wafer W to support the wafers W. When the second support part 114b transfers the wafer W from each process chamber 12 to the EMP 30, the second support part 114b comes in contact with a portion of the lower surface of the front end of the wafer W to support the wafer W. Accordingly, the substrate transfer device 100 selectively allows the wafer W to be seated on the first support part 114a or the second support part 114b according to the process, so that the wafers are provided on different portions of the first support block 114. Make sure that (W) is supported.

The second support block 116 contacts the lower surface of the rear end of the wafer W to support the wafer W during substrate transfer. The second support block 116 is disposed to face the first support block 114 at the rear side of each finger 112a. The second support block 116 protrudes upward from the upper surface of the finger portion 112. The second support block 116 has an inclined surface whose height decreases toward the front end direction (hereinafter, the second direction) X2 of the finger part 112. The inclined surface of the second support block 116 is provided with a first seating portion 116a and a second seating portion 116b. The first seating portion 116a and the second seating portion 116b are portions provided so that a portion of the lower surface of the other side of the wafer W is placed. The height of the first seating portion 116a is located at a height lower than the height of the second seating portion 116b. The first seating portion 116a is in contact with a portion of the lower surface of the rear end of the wafer W when the substrate transfer device 100 transfers the wafer W from the EMP 30 to each process chamber 12. The wafer W is supported. The second seating portion 116b is in contact with a portion of the lower surface of the rear end of the wafer W when the substrate transfer device 100 transfers the wafer W from each process chamber 12 to the EMP 30. The wafer W is supported.

Here, the second support block 116 is provided to be linearly movable back and forth. For example, referring to FIGS. 5A and 5B, the second support block 116 is positioned between the first position L1 and the second position L2. In the first position L1, when the substrate transfer apparatus 100 transfers the wafers W from the EPMS 30 to the respective process chambers 12, the wafers W may be disposed in the first support block 114. The second support block 116 is positioned to be supported in contact with the first seating part 116a of the first support part 114a and the second support block 116. In addition, the second position L2 is the wafer W when the substrate transfer device 100 transfers the wafer W from each of the process chambers 12 from the process chamber 12 to the first support block 114. Position of the second support block 116 to be supported in contact with the second support part 114b and the second seating part 116b of the second support block 116. The blade 110 is provided with a driving part (not shown) such as an air cylinder to move the second support block 116. The driver may move at least one of the first support block 114 and the second support block 116 in the first direction X1 such that a relative distance between the first support block 114 and the second support block 116 is adjusted. ) And the linear reciprocating movement in the second direction X2. Accordingly, the second support block 116 is selectively positioned at the first position L1 and the second position L2 according to the process, so that the wafers W are provided at different portions of the inclined surface of the second support block 116. To be supported.

Arm portion 120 is provided for operation of blade 110. Arm portion 120 is composed of arms (arms) operated in the configuration of the articulated joints. The driving unit 130 operates each of the arms organically to allow the wafer W placed on the blade 110 to move between the EFM 30 and the process chamber 10 during the process. The guide rail 140 guides the driving unit 130 such that the driving unit 130 linearly reciprocates in the second transfer chamber 40.

In the present exemplary embodiment, the substrate transfer apparatus 100 includes a mounting block 114 having a stepped phenomenon and a second support block 116 having an inclined surface to support the wafer W. Device 100 may support wafer W in a variety of ways. That is, as shown in FIG. 6, the substrate transfer apparatus 100 ′ according to another embodiment of the present invention has a stepped second support block 116 ′ which is stepped so that its height becomes lower toward the second direction X2. ) In this case, the first seating portion 116a 'and the second seating portion 116b' of the second support block 116 'may include a first seating portion (2) of the second support block 116 according to an embodiment of the present invention. 116 and the second mounting portion 116 to perform the same function.

In addition, the substrate transport apparatus 100 ″ according to another exemplary embodiment of the present invention may have a first support block 114 ′ having an inclined surface having a lower height toward the first direction X1 as shown in FIG. 7. ) In this case, the first support part 114a ′ and the second support part 114 b ′ of the first support block 114 ′ may include the first support part 114 a and the second support part 114 of the seating block 114 according to an exemplary embodiment of the present invention. It performs the same function as the support part 114b.

In addition, in the substrate transfer apparatus 100 according to the above-described embodiment, when the wafer W is brought into the process chamber 10, the wafer W may be formed in each of the first and second support blocks 114 and 116. When the wafer W is supported by the first support part 114a and the first seating part 116a, and the wafer W is carried out from the process chamber 10, the wafer W is the second support part 114b and the second seating part. Although described as an example of being supported by 116b, in the case of selectively loading the wafer W into the process chamber 10, the wafer W is formed of each of the first and second support blocks 114 and 116. When the wafer W is supported by the second support part 114b and the second seating part 116b, and the wafer W is carried out from the process chamber 10, the wafer W is the first support part 114a and the first seating part ( Can be modified to be supported by 116a).

Hereinafter, the process of the substrate processing apparatus 1 according to the present invention will be described in detail. 8A to 8D are views for explaining a process of a substrate processing facility according to the present invention. 9A and 9B are views illustrating a state of a blade during substrate transfer according to the present invention.

When the process starts, the accommodating member 22 is loaded into the load port 20, and the EMP 30 carries the wafer W from the accommodating member 22. Subsequently, the substrate transfer device 100 of the second transfer chamber 40 seats the wafer W from the EP 30 to the spin chucks 12b of the respective process chambers 12 of the process chamber 10. . When the wafer W is seated on the spin chuck 12b, the spin chuck 12b rotates the wafer W, and the nozzle 12c sprays the cleaning liquid onto the rotated wafer W. The sprayed cleaning liquid removes foreign substances remaining on the wafer W surface. When the wafer W cleaning process of each process chamber 12 is completed, the substrate transfer device 100 unloads the wafer W from the spin chuck 12b of each process chamber 12, and thereafter, Exported to (30). Then, the EMP 30 carries the wafer W into the housing member 22. When all of the wafers W completed in the process are brought into the accommodating member 22, the accommodating member 22 is transferred to a facility where a subsequent process is performed.

Subsequently, the wafer W transfer process of the substrate transfer apparatus 100 will be described in detail. Referring to FIG. 8A, first, the substrate transfer apparatus 100 seats the wafer W on both blades 110. In this case, as shown in FIG. 9A, the second support block 116 is positioned at the first position L1. Therefore, the wafer W is supported in contact with the first support part 114a of the first support block 114 and the first seating part 116a of the second support block 116. The substrate transfer apparatus 100 seats the wafer W placed on any one of the blades 110 on the spin chuck 12b of the first process chamber 12A (①). Subsequently, the substrate transfer apparatus 100 mounts the wafer W placed on the other one of the blades 110 to the spin chuck 12b of the second process chamber 12B (2).

After loading the wafers W into the first and second process chambers 12A and 12B, the substrate transfer apparatus 100 again transfers the wafers from the EPM 30 to the third and fourth process chambers 12C and 12D. Transfer W). That is, first, the substrate transfer apparatus 100 seats the wafer W on each blade 110. In this case, as shown in FIG. 9A, the wafer W is supported by being in contact with the first support part 114a of the first support block 114 and the first seating part 116a of the second support block 116. . The substrate transfer apparatus 100 seats the wafer W placed on any one of the blades 110 in the spin chuck 12b of the third process chamber 12C (③). Subsequently, the substrate transfer device 100 mounts the wafer W placed on the other blade 110 to the spin chuck 12b of the fourth process chamber 12C (4).

When the cleaning process of the wafer W is completed, the substrate transfer apparatus 100 transports the wafer W from the respective process chambers 12A, 12B, 12C, and 12D and transfers the wafer W to the primer M 30. . That is, first, the substrate transfer apparatus 100 seats the wafer W placed on the spin chuck 12a of the first process chamber 12A on one of the blades 110 (5). Subsequently, the substrate transfer apparatus 100 mounts the wafer W placed on the spin chuck 12a of the second process chamber 12B on the other blade 110 (6). At this time, the second support block 116 is moved from the first position L1 to the second position L2. Thus, as shown in FIG. 9B, the wafer W placed on each of the blades 110 has a second seating portion 114b of the first support block 114 and a second seating of the second support block 116. It contacts and is supported by the part 116b. The substrate transfer device 100 carries the wafers W placed on the respective blades 110 to the EMP 30.

After unloading the wafer W from the first and second process chambers 12A and 12B, the substrate transfer device 100 continues to free the wafer W from the third and fourth process chambers 12C and 12D. Load. That is, the substrate transfer apparatus 100 mounts the wafer W placed on the spin chuck 12b of the third process chamber 12C on one of the blades 110 (7). Subsequently, the substrate transfer apparatus 100 mounts the wafer W placed on the spin chuck 12a of the fourth process chamber 12D on the other blade 110 (8). At this time, as shown in FIG. 9B, the wafer W placed on each of the blades 110 has a second support part 114b of the first support block 114 and a second seating of the second support block 116. It contacts and is supported by the part 116b. The substrate transfer device 100 carries the wafers W placed on the respective blades 110 to the EMP 30.

As described above, the present invention relates to a case where the wafer W is transferred from the EEP 30 to the process chamber 10 and a case where the wafer W is transferred from the process chamber 10 to the EEP 30. By separating and supporting the wafers W by different portions of the blades 110, it is possible to prevent the processing liquid remaining on the wafers W on which the cleaning process is completed from affecting the wafers W to be processed later. In particular, when the process chamber 12 performs a wet treatment process, the substrate transfer device 100 transfers the wafer W in which the treatment liquid (the cleaning liquid in this embodiment) used in the process remains. Blade 110 is contaminated by the treatment liquid remaining in the). Therefore, according to the present invention, when the wafer W is transferred to the process chamber 12 and when the wafer W is taken out from the process chamber 12, the wafers may be formed by different portions of the blades 110, respectively. By supporting W), the blade 110 is prevented from being contaminated by the processing liquid remaining on the wafer W.

In addition, the substrate processing apparatus 100 according to the present invention improves the substrate throughput of the substrate processing apparatus 100 by simultaneously transferring two wafers W at a time.

In addition, the present invention includes support blocks 114 and 116 for stably seating and supporting the wafer W during substrate transfer, thereby preventing the wafer W from being separated from the blade 110 and being damaged during the process.

The foregoing detailed description illustrates the present invention. In addition, the foregoing description shows and describes preferred embodiments of the present invention, and the present invention can be used in various other combinations, modifications, and environments. That is, changes or modifications may be made within the scope of the concept of the invention disclosed in this specification, the scope equivalent to the disclosed contents, and / or the skill or knowledge in the art. The above-described embodiments illustrate the best state for implementing the technical idea of the present invention, the use of other inventions such as the present invention in other state known in the art, and the specific fields of application and uses of the invention. Various changes required are also possible. Accordingly, the detailed description of the invention is not intended to limit the invention to the disclosed embodiments. Also, the appended claims should be construed to include other embodiments.

1 shows a substrate processing facility according to the present invention.

FIG. 2 is a view showing the configuration of the process chamber shown in FIG.

FIG. 3 is a perspective view illustrating a blade and an arm of the substrate transport apparatus illustrated in FIG. 1.

4 is a side view of the blade shown in FIG.

5A and 5B are diagrams for describing an operation process of the second support block according to the present invention.

6 is a view showing a blade according to another embodiment of the present invention.

7 is a view showing a blade according to another embodiment of the present invention.

8A to 8D are views for explaining a process of a substrate processing facility according to the present invention.

9a and 9b are views showing the appearance of the blade when transferring the substrate according to the present invention.

Claims (12)

An apparatus for transporting a substrate having a blade for seating the substrate, The blade, Substrate support means for supporting a substrate at a plurality of locations on the blade, The substrate support means, A first support block disposed at the front end of the blade; A second support block disposed behind the blade, and And a driver for driving at least one of the first support block and the second support block to adjust a relative distance between the first support block and the second support block. The method of claim 1, The first support block, It has a stepped inner surface that is lower in height toward the rear end of the blade, The second support block, Substrate transport apparatus characterized in that it has an inclined surface which is lower in height toward the front end of the blade. The method of claim 1, The first support block, It has a stepped inner surface that is lower in height toward the rear end of the blade, The second support block, Substrate transport apparatus, characterized in that it has a stepped inner surface that is lower in height toward the front end of the blade. The method of claim 1, The first support block, It has an inclined surface that is lower in height toward the rear end of the blade, The second support block, Substrate transport apparatus characterized in that it has an inclined surface which is lower in height toward the front end of the blade. In a facility for processing a substrate, A plurality of process chambers for performing a treatment process on a substrate; A load port for loading an accommodating member accommodating a plurality of substrates; It includes a substrate transfer device for transferring a substrate between the process chambers and the receiving member placed in the load port, The substrate transfer device, At least one blade on which the substrate is placed during processing, The blade, A first support block disposed at a front end of the blade and having a first support portion on which the substrate is placed when the substrate is brought into the process chamber and a second support portion on which the substrate is placed when the substrate is taken out from the process chamber; A second support block disposed behind the blade and having a first seating portion on which the substrate is placed when the substrate is brought into the process chamber and a second seating portion on which the substrate is placed when the substrate is taken out from the process chamber; Substrate processing equipment. The method of claim 5, wherein The blade, And a driver for driving at least one of the first support block and the second support block to adjust a relative distance between the first support block and the second support block. The method according to claim 5 or 6, The first support block, It has a stepped inner surface that is lower in height toward the rear end of the blade, The first support portion and the second support portion, Substrate processing equipment, characterized in that provided at different heights of the inner surface. The method according to claim 5 or 6, The first support block, It has an inclined surface that is lower in height toward the rear end of the blade, The first support portion and the second support portion, Substrate processing equipment, characterized in that provided at different heights of the inclined surface. The method according to claim 5 or 6, The second support block, It has a slope in which the height is lowered toward the shear direction of the blade, The first seating portion and the second seating portion, Substrate processing equipment, characterized in that provided at different heights of the inclined surface. The method according to claim 5 or 6, The second support block, It has a stepped inner surface that is lower in height toward the shear direction of the blade, The first seating portion and the second seating portion, Substrate processing equipment, characterized in that provided at different heights of the inner surface. The substrate is transferred using the substrate transfer apparatus of any one of claims 1 to 4, The first portion of the blade in contact with the substrate when the substrate is brought into the process chamber where the substrate treatment process is performed and the second portion of the blade in contact with the substrate when the substrate is removed from the process chamber are different from each other. The substrate transfer method characterized by the above-mentioned. The method of claim 11, The substrate transfer method, By adjusting the relative height of the first portion and the second portion, Relative height adjustment of the first portion and the second portion, And a relative distance between the first support block and the second support block.

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