KR100858890B1 - Transfer module and apparatus for treating substrate with the transfer module, and method for treating substrate - Google Patents

Transfer module and apparatus for treating substrate with the transfer module, and method for treating substrate Download PDF

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Publication number
KR100858890B1
KR100858890B1 KR1020070030484A KR20070030484A KR100858890B1 KR 100858890 B1 KR100858890 B1 KR 100858890B1 KR 1020070030484 A KR1020070030484 A KR 1020070030484A KR 20070030484 A KR20070030484 A KR 20070030484A KR 100858890 B1 KR100858890 B1 KR 100858890B1
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chamber
substrate
robot
processing unit
transfer
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KR1020070030484A
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Korean (ko)
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김형준
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세메스 주식회사
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67196—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the transfer chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67276—Production flow monitoring, e.g. for increasing throughput
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/139—Associated with semiconductor wafer handling including wafer charging or discharging means for vacuum chamber

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Automation & Control Theory (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The present invention relates to a module for transferring a substrate, an apparatus for processing the substrate with the module, and a substrate processing method for the apparatus. A substrate processing apparatus according to the present invention includes a load lock chamber having chambers stacked on top and bottom, first and second process chambers arranged to be stepped with respect to each other, and first and second process chambers between the chambers and the first and second process chambers, And a transfer chamber for transferring the transfer chamber. The transfer chamber has a first robot and a second robot installed so as to face each other up and down. Wherein the first robot transfers substrates between chambers located at the top of the chambers of the load lock chamber and the first process chambers and the second robot is located below the chambers of the load lock chamber And transfers the substrate between the chambers and the second process chambers. The present invention improves substrate throughput by robots independently transferring substrates between chambers and process chambers of different heights.

Description

TECHNICAL FIELD [0001] The present invention relates to a substrate processing apparatus having a transfer module and a transfer module, and a substrate processing method.

1 is a plan view of a substrate processing apparatus according to the present invention.

FIG. 2 is a perspective view showing main components of a substrate processing apparatus according to the present invention. FIG.

3 is a side view of the substrate processing apparatus shown in Fig.

4 is a perspective view of the first transfer unit shown in Fig.

5 is a perspective view of the second transfer unit shown in Fig.

6 is a plan view of a substrate processing apparatus according to another embodiment of the present invention.

7 is a side view of the substrate processing apparatus shown in Fig.

8 is a perspective view showing the second robot shown in Fig.

Description of the Related Art [0002]

1: substrate processing apparatus

10: load port

20: EFM

30: Load lock chamber

40: first processing unit

50: second processing unit

100: first transfer chamber

110: 1st robot

120: Second robot

200: second transfer chamber

300: Third transfer chamber

The present invention relates to a module for transferring a substrate, an apparatus for processing the substrate with the module, and a substrate processing method for the apparatus.

A general substrate processing apparatus is a device for performing processes such as deposition, etching, ashing, and cleaning on a substrate such as a wafer for manufacturing a semiconductor integrated circuit chip and a glass substrate for manufacturing a flat panel display . Among these substrate processing apparatuses, the multi-chamber type wafer processing apparatus has a load lock chamber, a plurality of process chambers, and a load lock chamber and a transfer chamber disposed between the process chambers and transferring the substrates.

The process chambers are disposed along the periphery of the transfer chamber. The transfer chamber brings the substrate into and out of each process chamber. A robot arm is installed inside the transfer chamber. The robot arm provided in the transfer chamber transfers the substrate from the load lock chamber in the process and brings the substrate into one of the process chambers to seat the substrate in a chuck installed inside the process chamber. When the substrate is placed on the chuck, the process chamber performs a predetermined process on the substrate surface. When the process is completed, the robot arm again takes the substrate out of the process chamber.

The robot arm of the transfer chamber sequentially transfers a single wafer between the load lock chamber and the process chambers. In order to improve the throughput of the substrate, the robot arm must rapidly transfer the substrates. However, as the number of process chambers increases, the substrate can not be processed in the load lock chamber due to the limitation of the substrate throughput of the robot arm, and the number of the standby substrates increases.

To solve this, a plurality of robot arms in the transfer chamber may be arranged side by side to increase the substrate throughput of the apparatus. However, in this case, the area occupied by the robot arm is increased, thereby increasing the footprint and manufacturing cost of the apparatus.

Further, in order to increase the substrate throughput of the apparatus, a plurality of transfer chambers may be further added in the direction away from the load lock chamber, and further process chambers may be installed around the additional transfer chamber to increase the throughput of the substrate. However, in this case, the robot arm installed in the transfer chamber must transfer the substrate to both the process chambers provided in the transfer chamber and the transfer chamber to be added, so that the load on the robot arm in the transfer chamber is increased.

It is an object of the present invention to provide a transfer module for improving the throughput of a substrate, a substrate processing apparatus having the transfer module, and a substrate processing method.

According to an aspect of the present invention, there is provided a transfer module including a first robot having a first blade on which a substrate is placed and a first drive shaft for driving the first blade, a second blade on which the substrate is placed, Wherein the first drive shaft is disposed on the upper portion of the first blade and the second drive shaft is disposed on the lower portion of the second blade.

According to an embodiment of the present invention, the first blade is located higher than the second blade.

According to the embodiment of the present invention, the first robot and the second robot are disposed so as to face each other up and down.

According to an embodiment of the present invention, the transfer module further includes a housing for providing a space for installing the first blade and the second blade therein, wherein the first drive shaft is coupled to the upper wall of the housing And the second drive shaft is coupled to the lower wall of the housing.

According to another aspect of the present invention, there is provided a substrate processing apparatus including a first chamber, a second chamber that is stacked with the first chamber such that the first chamber is located at an upper portion, And a transfer module for transferring the substrate, wherein the transfer module comprises: a first robot having a first blade on which a substrate is placed and a first drive shaft positioned above the first blade to drive the first blade; And a second robot having a second blade placed thereon and a second drive shaft positioned below the second blade for driving the second blade, wherein the first blade is disposed on the second blade, The first robot and the second robot are arranged so as to face each other up and down.

According to an aspect of the present invention, there is provided a substrate processing apparatus including a load lock chamber, a first processing unit, and a second processing unit, wherein the load lock chamber is disposed on one side of the first processing unit, A second processing unit is disposed on the other side of the first processing unit, and the first processing unit is disposed between the first processing chamber, the load lock chamber and the first processing chamber, and between the load lock chamber and the second processing chamber A first transfer chamber having a first transfer module for transferring a substrate between the units, the second processing unit including a second process chamber, a transfer chamber for transferring the substrate from the first transfer module to the second process chamber, And a second transfer chamber having a second transfer module, wherein the first transfer module includes a first robot for transferring the substrate between the load lock chamber and the first process chamber, a second robot for transferring the substrate between the load lock chamber and the second transfer chamber, And a second robot for transferring the substrate between the processing units.

According to an embodiment of the present invention, the first robot is disposed on the second robot.

According to an embodiment of the present invention, the load lock chamber includes a first chamber and a second chamber provided below the first chamber, and the first robot is disposed between the first chamber and the first chamber And the second robot transfers the substrate between the second chamber and the second processing unit.

According to an embodiment of the present invention, the substrate processing apparatus further comprises a third processing unit extending from the second processing unit in a direction away from the first processing unit, wherein the second robot has more than the first robot Number of blades.

According to an embodiment of the present invention, the first process chamber and the second process chamber are formed to be stepped with respect to each other.

According to another aspect of the present invention, there is provided a substrate processing method, comprising: a first chamber and a second chamber stacked one above the other and a first robot and a second robot facing each other, The transfer of the substrate to the first chamber and the second chamber is carried out by a robot positioned at the top of the first robot and the second robot by the transfer of the substrate between the first chamber and the chamber located at the top of the second chamber And the transfer of the substrate between the first chamber and the chamber positioned below the second chamber is performed by a robot positioned below the first robot and the second robot.

According to an aspect of the present invention, there is provided a substrate processing method including: a first processing unit that performs a substrate processing process; a second processing unit that extends from the first processing unit in a direction away from the load lock chamber; Wherein the substrate transfer between the load lock chamber and the process chambers provided in the first processing unit is performed by one robot provided in the first processing unit, The substrate transfer between the second processing units is performed by another robot installed in the first processing unit.

According to the embodiment of the present invention, the load lock chamber has a first chamber and a second chamber which are stacked on top of each other, wherein the first processing unit and the second processing unit are provided so as to step with each other, And the other robot are provided so as to be vertically opposed to each other, wherein the first chamber is located above the second chamber, and the substrate transfer to the first chamber is carried out between the one robot and the other robot Is carried out by a robot positioned at a relatively high position, and the substrate transfer to the second chamber is performed by a robot positioned at a relatively low position.

According to an embodiment of the present invention, the substrate processing method further comprises a third processing unit extending from the second processing unit in a direction away from the load lock chamber to process the substrate, 3 transferring the substrate into the process chamber provided in the third processing unit is made by a transfer robot provided in the third processing unit and transferring the substrate at the same height as the second robot, The mutual substrate transfer is performed by a robot having a number of blades larger than the number of blades provided in the first robot.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the present invention is not limited to the embodiments described herein but may be embodied in other forms. Rather, the embodiments disclosed herein are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. Although the present embodiment has been described by taking an apparatus for processing wafers for fabricating semiconductor integrated circuit chips as an example, the present invention is applicable to all apparatuses for processing substrates.

(Example 1)

1 is a plan view of a substrate processing apparatus according to the present invention, FIG. 2 is a perspective view showing the main components of a substrate processing apparatus according to the present invention, FIG. 3 is a cross-sectional view taken along line A- Fig. 4 is a perspective view of the first transfer unit shown in Fig. 2, and Fig. 5 is a perspective view of the second transfer unit shown in Fig.

1 to 3, an apparatus for treating substrate 1 according to the present invention includes a load port 10, an equipment front end module (EFEM) 20 includes a load-lock chamber 30, a first treating unit 40, and a second treating unit 50 .

The load port 10 is disposed in front of the eM 20. The load port (10) has a plurality of support portions (12). Each of the supports 12 is arranged in a line along one side of the EMS 20 and seats and supports the accommodation member C in the process. The housing member C is a container for housing a plurality of substrates W. As the receiving member C, a FOUP may be used.

The EFM 20 transfers the substrate W between the housing member C and the load lock chamber 30. [ The EMBEDIUM 20 includes at least one substrate transfer device 22. The substrate transfer device 22 transfers the substrate W between the loading member C and the load lock chamber 30 which are seated on the load port 10. [

The load lock chamber 30 is disposed between the EFM 20 and the transfer chamber 40. The load lock chamber 30 includes a carry-in chamber 32 and a carry-out chamber 34. The carry-in chamber 32 is a chamber through which the substrate W is transferred from the emf 20 to the transfer chamber 40 and the carry-out chamber 34 is moved from the transfer chamber 40 to the emf 20, Is a chamber to be transported. The loading chamber 32 has a first chamber 32a and a second chamber 32b. The first chamber 32a and the second chamber 32b are arranged so that their heights are different from each other. In one embodiment, the first chamber 32a is disposed on the upper portion of the second chamber 32b, and the first chamber 32a and the second chamber 32b are stacked on each other. The carry-out chamber 34 has substantially the same structure as the carry-in chamber 32. That is, the carry-out chamber 34 has a first chamber 34a and a second chamber 34b which are vertically stacked.

The first processing unit 40 includes first process chambers 42 and a first transfer chamber 100. The first process chambers 42 perform the process of processing the substrate W during processing. The first process chambers 42 are disposed on the opposite sides of the transfer chamber 100, respectively. The first process chambers 42 have the same configuration and structure as each other, and the heights of the first process chambers 42 are the same. The first process chambers 42 are provided with a substrate entry / exit port 42a through which the substrate W enters and exits. The substrate entry / exit openings 42a provided in each of the first process chambers 42 have the same height. The height of the substrate entry port 42a of the first process chambers 42 is equal to the height of the substrate entry ports 32a 'and 34a' provided in the upper chambers 32a and 34a of the load lock chamber 30 . Alternatively, the first process chambers 42 may perform processes different from each other.

The first transfer chamber 100 includes a first transfer module for transferring the substrate W between the load lock chamber 30 and the process chamber 40. 4 and 5, the first transfer module has a housing 102, a first robot 110, and a second robot 120. The housing 102 provides a space in which the first robot 110 and the second robot 120 are installed. A load lock chamber 30 is disposed on the front surface of the transfer chamber 100 and a first process chamber 42 is disposed on both sides of the transfer chamber 100. A second transfer chamber 200 to be described later is disposed on the rear surface of the transfer chamber 100.

The first robot 110 transfers the substrate W between the first chambers 32a and 34a of the load lock chamber 30 and the first process chambers 42. [ The first robot 110 is installed on the upper wall of the housing 102. The first robot 110 has a first blade 112, a first arm 114, and a first driver 116. The first blade (112) supports the substrate (W). The first arm portion 114 is made up of a plurality of arms. Each of the arms is operatively associated with each other to transfer the substrate W to the first blade 112. The first driver 116 drives the first arm 114 to transfer the substrate W by the first blade 112. The first driver 116 has a first drive shaft 116a coupled with the first arm 114. [ The first drive shaft 116a is disposed on the upper portion of the first blade 112. For example, the first drive shaft 116a is installed on the upper wall of the housing 102. [

The second robot 120 transfers the substrate W between the second chambers 32b and 34b of the load lock chamber 30 and the second processing unit 50. [ The second robot 120 is installed on the lower wall of the housing 102. The second robot 120 has a second blade 122, a second arm 124, and a second driver 126. The second blade 122 supports the substrate W. [ The second blade 122 is arranged to face the first blade 122 at a lower portion of the first blade 122. [ Thus, the second blade 122 transports the substrate W at a lower height than the first blade 122. The second arm portion 124 is made up of a plurality of arms. Each of the arms is operatively associated with each other to transfer the substrate W to the second blade 122. The second driver 126 drives the second arm 124 to move the substrate W by the second blade 122. The second driver 126 has a second drive shaft 126a coupled with the second arm 124. [ The second drive shaft 126a is disposed below the second blade 122. For example, the second drive shaft 126a is installed on the lower wall of the housing 102. [

The second processing unit (50) is disposed on the other side of the first processing unit (40). The second processing unit 50 has second processing chambers 52, a buffer member 54, and a second transfer chamber 200. Each of the second process chambers 52 has the same configuration and structure as the first process chamber 42 described above. The second process chamber 52 is disposed on each side of the second transfer chamber 200.

The buffer unit 54 waits for the substrate W in the second processing unit 50. The buffer unit 54 has a first buffer member 54a and a second buffer member 54b. The first buffer unit 54a waits for the substrate W transferred from the first processing unit 40 before the process is performed in the second process chamber 52 and the second buffer unit 54a waits for the second process And waits for the substrate W which has been processed in the chamber 52. The first buffer unit 54a and the second buffer unit 54b are disposed between the first transfer chamber 100 and a second transfer chamber 200 to be described later.

The second transfer chamber 200 has a second transfer module. The second transfer module has a housing 202 and a transfer robot 210. The housing 202 provides a space for installing the transfer robot 210 therein. The transfer robot 210 loads and unloads the substrate W to / from the second process chambers 52. In one embodiment, the transfer robot 210 has the same configuration and structure as the second robot 120 of the first transfer chamber 100. That is, the transfer robot 210 has the third blade 212, the third arm 214, and the third driver 216. The third blade 212 is provided at the same height as the second blade 122 and the third driver 216 drives the third arm 214 to operate the third blade 212.

According to the present embodiment, the heights of the structures of the first processing unit 40 and the second processing unit 50 are set to be different from each other. That is, the second processing unit 50 and the first processing unit 40 are installed so as to be stepped with respect to each other. In one embodiment, the second processing unit 50 has a height lower than the height of the first processing unit 40. That is, the height of the second process chambers 52 is lower than the height of the first process chambers 42 of the first process unit 40. Therefore, the height of the substrate entry / exit port 52a provided in the second process chambers 52 is lower than the height of the substrate entry / exit port 42a provided in the first process chambers 42. Due to the above-described structure, the transfer robot 210 of the second transfer chamber 200 transfers the substrate W at a position lower than the first robot 110 of the first transfer module. At this time, the height of the third blade 212 of the transfer robot 210 and the height of the first blade 112 of the first robot 110 may be the same.

In the present embodiment, the process chambers 42 and 52 provided in the first processing unit 40 and the second processing unit 50 all perform the same process. However, Some or all of the first process chambers 42 and the second process chambers 52 may perform processes different from each other.

Hereinafter, the process of the substrate processing apparatus 1 having the above-described configurations will be described in detail.

When the substrate processing process is started, the accommodating member C is seated on the load port 10, and the substrate transfer device 22 of the emitter 20 transfers the substrate W from the receiving member C to the transfer chamber 30 of the load lock chamber 30, (32). At this time, the substrate transfer device 22 transfers the substrate W from the accommodating member C to the first chamber 32a and the second chamber 32b of the transfer chamber 32. The first transfer chamber 100 transfers the substrate W between the first and second chambers 32a and 32b and the first and second transfer chambers 42 and.

That is, the first robot 110 of the first transfer chamber 100 transfers the substrate W from the first chamber 32a to the first processing chamber 42. The first robot 110 transfers another substrate W transferred to the first chamber 32a from the first chamber 32a to the other one of the first processing chambers 42, . The first process chambers 42 perform a substrate processing process on the transferred substrate W. When the substrate processing process is completed, the first robot 110 carries the substrate W from the first process chamber 42 to the first chamber 34a of the carry-out chamber 34 .

The second robot 120 moves the substrate W from the second chamber 32b of the load lock chamber 30 to the second processing unit 50 in the process of transferring the substrate W by the first robot 110, . That is, the second robot 120 places the substrate W in the first buffer portion 54a of the buffer portion 54 from the second chamber 32b. The transfer robot 210 of the second transfer module transfers the substrate W from the first buffer unit 54a to one of the second process chambers 52 and then transfers the substrate W to the first buffer unit 54a, (W) to another process chamber of the second process chambers (52). When the substrate processing process is completed, the first robot 110 carries the substrate W from the second process chamber 52 to the second chamber 34b of the carry-out chamber 34.

The substrate W transferred to the carry-out chamber 34 is transferred to the receiving member C which is seated on the rod port 10 by the substrate transfer device 22 of the EMB. When all of the substrates W that have been processed in the storing member C are collected, the storing member C is transferred to a facility in which a subsequent process is performed.

As described above, the substrate processing apparatus 1 according to the present invention is provided with the transfer module having the first robot 110 and the second robot 120 arranged to face each other in the up-and-down direction, 110 and the second robot 120 independently transfer the substrate W to increase the substrate throughput between the load lock chamber 30 and the processing unit 40 to increase the substrate throughput of the apparatus 1, Thereby improving the efficiency of the treatment process.

Further, the substrate processing apparatus 1 according to the present invention can process the substrate W by disposing the first robot 110 and the second robot 120 vertically, thereby reducing the footprint of the apparatus.

The substrate processing apparatus 1 according to the present invention further includes a first robot 110 and a second robot 120 in which the first transfer chamber 100 is vertically disposed, The second robot 120 performs the transfer of the substrate W to the first processing chamber 50 and the second robot 120 performs the transfer of the substrate W to the second processing unit 50, The load on the robot arm of the robot arm of the first transfer chamber can be reduced compared with the manner in which the robot arm in the transfer chamber performs the substrate transfer to the process chambers and the substrate transfer to the second processing unit.

(Example 2)

In the above-described embodiment of the present invention, the substrate W is processed by the two processing units 40 and 50 having different heights. However, Three or more processing units may be provided.

7 and 8, a substrate processing apparatus 1 'according to another embodiment of the present invention includes a substrate processing apparatus 1' according to an embodiment of the present invention, A third processing unit 60 is added in the configuration. The structure and structure of the third processing unit 60 are substantially the same as those of the second processing unit 50. [ That is, the third processing unit 60 has the third processing chambers 62, the buffer portion 64, and the third transfer chamber 300. At this time, the height of the third process chambers 62 is the same as the height of the second process chambers 52, and the height of the third transfer chambers 300 is equal to the height of the second transfer chambers 200. Therefore, the transfer robot 310 provided in the third transfer chamber 300 transfers the substrate W at the same height as the transfer robot 210 provided in the second transfer chamber 200. The buffer unit 64 has the same structure and structure as the buffer unit 54 of the second processing unit 50. The buffer unit 64 temporarily waits for the substrate W when the substrate W is transferred between the second processing unit 50 and the third processing unit 60. [

Here, the substrate processing apparatus 1 'having the above-described configuration needs to increase the substrate processing speed of the second robot in the first transfer chamber 100 by further adding the third transfer chamber 300. [ That is, when the second robot 120a transfers the substrate W between the second chamber 32b, 34b of the load lock chamber 30 and the second transfer chamber 200, the substrate processing apparatus 1 ' The processing amount of the substrate W to be transferred to / from the third transfer chamber 300 of the third processing unit 60 is further added. Therefore, the processing amount of the second transfer chamber 300 of the substrate processing apparatus 1 according to the embodiment of the present invention The substrate processing speed is required to be twice as much as that of the robot 120. Accordingly, the substrate processing apparatus 1 'has a first robot 120a capable of performing a higher substrate throughput than the first robot 120. [ 8, the second robot 120 includes two blades 122a 'and 122a' 'stacked one above the other and an arm portion 124a for operation of the blade 122a and a driver 124a ). The second robot 120a simultaneously transports the two substrates W.

Although the third processing unit 60 has the same height and configuration as that of the second processing unit 50 in the present embodiment, the third processing unit 60 has the same height and configuration as that of the second processing unit 50, And may be arranged to be different from the height. Further, the third processing unit 60 may have different configurations from the second processing unit 50. [ For example, some or all of the third process chambers 62 provided in the third process unit 60 may perform a different process than the first and second process chambers 42, 52. In addition, the number of the third processing chambers 62 of the third processing unit 60 can be variously changed.

In the present embodiment, the second robot 120a of the first processing unit 40 has the blades 122a 'and 122a' 'of a structure in which the second robot 120a is stacked up and down. However, 120a, the first processing unit 40 can improve the throughput of the substrate W in various ways. For example, the second processing unit 30 may include two second robots 120a to improve the throughput of the substrate.

Hereinafter, a process of the substrate processing apparatus 1 'having the above-described configurations will be described. Here, a detailed description of the same processes as those of the substrate processing apparatus 1 described in the embodiment of the present invention will be omitted.

When the substrate processing process is started, the first robot 110 of the first transfer module transfers the substrate W between the first chambers 32a, 34a of the load lock chamber 30 and the process chambers 42 . The second robot 120a moves the substrate W between the second chambers 32b and 34b of the load lock chamber 30 and the second processing unit 50 in the process of transferring the substrate W by the first robot 110 W). That is, the second robot 120a seats the substrate W from the load lock chamber 30 to the buffer unit 54 of the second processing unit 50 simultaneously with the two substrates W. The transfer robot 210 of the second processing unit 50 transfers any one of the substrates W seated in the buffer unit 54 to the processing chambers (52). The transfer robot 210 transfers the other one of the substrates W seated in the buffer unit 54 to the other of the process chambers 52. Thereafter, the transfer robot 210 places the substrates W that have been seated in the buffer unit 54 in the buffer unit 64 of the third processing unit 60. The transfer robot 310 of the third transfer chamber 300 transfers the substrate W from the buffer unit 64 to the process chambers 62. [

The substrates W that have been processed in the second process chambers 52 are transferred to the buffer unit 54 by the transfer robot 210 and then transferred to the buffer unit 54 by the second robot 120, 2 chamber 34b. Substrates W that have been processed in the third process chambers 62 are transferred to the buffer unit 64 by the transfer robot 310 and then transferred to the buffer unit 54 by the transfer robot 210 Lt; / RTI > Then, the second robot 120 moves the substrates W to the second chamber 34b of the load lock chamber 30. At this time, the second robot 120 simultaneously transports the two wafers W.

The above-described substrate processing apparatus 1 'is provided with three processing units 40, 50 and 60 to perform a substrate processing process so that compared to the substrate processing apparatus 1 according to the embodiment of the present invention, The throughput can be further improved.

In addition, the above-described substrate processing apparatus 1 'may be configured such that the second robot arm 120a of the first processing unit 40 includes a plurality of blades to process the substrate W, The robot arm of the first transfer chamber 100, like the substrate processing apparatus 1, can improve the throughput of the substrate compared with a method in which the robot arm provided with one blade processes the substrate.

The foregoing detailed description is illustrative of the present invention. Furthermore, the foregoing is intended to show and describe preferred embodiments of the invention, and the invention may be used in various other combinations, modifications and environments. That is, it is possible to make changes or modifications within the scope of the concept of the invention disclosed in this specification, the disclosure and the equivalents of the disclosure and / or the scope of the art or knowledge of the present invention. It should be noted that the above-described embodiments illustrate the best mode for carrying out the technical idea of the present invention and that the present invention can be applied to other states known in the art for using other inventions such as the present invention, Various modifications are also possible. Accordingly, the foregoing description of the invention is not intended to limit the invention to the precise embodiments disclosed. It is also to be understood that the appended claims are intended to cover such other embodiments.

As described above, the transfer module according to the present invention, the substrate processing apparatus having the transfer module, and the substrate processing method have a multi-layered load lock chamber and process chambers having different heights, Robots, and each robot improves the throughput of the substrate by transferring the substrates independently.

Claims (14)

delete delete delete delete delete An apparatus for processing a substrate, A load lock chamber, a first processing unit, and a second processing unit, Wherein the load lock chamber is disposed on one side of the first processing unit, the second processing unit is disposed on the other side of the first processing unit, The first processing unit includes: A first process chamber, A first transfer chamber having a first transfer module for transferring a substrate between the load lock chamber and the first process chamber and between the load lock chamber and the second process unit, Wherein the second processing unit comprises: A second process chamber, And a second transfer chamber having a second transfer module for transferring the substrate from the first transfer module to the second process chamber, The first transfer module includes: A first robot for transferring the substrate between the load lock chamber and the first process chamber, And a second robot disposed below the first robot and transferring the substrate between the load lock chamber and the second processing unit, Wherein the first process chamber and the second process chamber comprise: Wherein the first and second substrates are formed to be stepped with respect to each other. delete The method according to claim 6, Wherein the load lock chamber comprises: A first chamber, And a second chamber disposed below the first chamber, The first robot includes: Transferring the substrate between the first chamber and the first process chamber, The second robot includes: And transfers the substrate between the second chamber and the second processing unit. An apparatus for processing a substrate, A load lock chamber, a first processing unit, a second processing unit, and a third processing unit, Wherein the load lock chamber is disposed on one side of the first processing unit, the second processing unit is disposed on the other side of the first processing unit, and the third processing unit is disposed on the other side of the first processing unit, 2 processing unit, The first processing unit includes: A first process chamber, A first transfer chamber having a first transfer module for transferring a substrate between the load lock chamber and the first process chamber and between the load lock chamber and the second process unit, Wherein the second processing unit comprises: And a second transfer chamber having a second process chamber and a second transfer module for transferring the substrate from the first transfer module to the second process chamber, The first transfer module includes: A first robot for transferring the substrate between the load lock chamber and the first process chamber, and a second robot for transferring the substrate between the load lock chamber and the second processing unit, The second robot includes: Wherein the first robot comprises a greater number of blades than the first robot. delete delete delete A substrate processing apparatus comprising: a first processing unit for performing a substrate processing process; and a second processing unit extending from the first processing unit in a direction away from the load lock chamber, The substrate transfer between the load lock chamber and the process chambers provided in the first processing unit is performed by one robot provided in the first processing unit, The substrate transfer between the load lock chamber and the second processing unit is performed by another robot installed in the first processing unit, Wherein the load lock chamber has a first chamber and a second chamber that are stacked on top of each other, Wherein the first processing unit and the second processing unit are installed so as to be stepped on each other, Wherein the one robot and the other robot are vertically opposed to each other, Wherein the first chamber comprises: A second chamber positioned above said second chamber, The substrate transfer into the first chamber may be performed by, And a robot positioned at a relatively high position among the one robot and the other robot, The transfer of the substrate to the second chamber is carried out, Wherein the robot is made by a robot positioned at a relatively low position. 14. The method of claim 13, The substrate processing method includes: Further comprising: a third processing unit extending from the second processing unit in a direction away from the load lock chamber, And transferring the substrate from the second processing unit to the process chamber provided in the third processing unit, And a transfer robot provided to the third processing unit and transferring the substrate at the same height as the second robot, Wherein the substrate transfer between the load lock chamber and the second processing unit is performed by: Wherein the first robot is made of a robot having a number of blades larger than the number of blades equipped with the first robot.
KR1020070030484A 2007-03-28 2007-03-28 Transfer module and apparatus for treating substrate with the transfer module, and method for treating substrate KR100858890B1 (en)

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