CN117373994A - Robot for transporting wafers and semiconductor processing apparatus - Google Patents
Robot for transporting wafers and semiconductor processing apparatus Download PDFInfo
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- CN117373994A CN117373994A CN202311535589.0A CN202311535589A CN117373994A CN 117373994 A CN117373994 A CN 117373994A CN 202311535589 A CN202311535589 A CN 202311535589A CN 117373994 A CN117373994 A CN 117373994A
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- 235000012431 wafers Nutrition 0.000 title claims abstract description 62
- 239000004065 semiconductor Substances 0.000 title claims description 15
- 238000012545 processing Methods 0.000 title claims description 14
- 238000000034 method Methods 0.000 description 6
- 230000008569 process Effects 0.000 description 6
- 238000012986 modification Methods 0.000 description 4
- 230000004048 modification Effects 0.000 description 4
- 230000008901 benefit Effects 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- 238000011109 contamination Methods 0.000 description 2
- 238000012864 cross contamination Methods 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
Abstract
The present disclosure discloses a robot for transferring wafers, comprising: a first finger, a first stop block and a second stop block are arranged at the first end of the first finger; at least two second fingers disposed on both sides of the first finger, the at least two second fingers respectively including a third stopper and a fourth stopper disposed on a second end opposite to the first end; and the driving device can drive the first finger and the second finger to move oppositely, each of the first stop block, the second stop block, the third stop block and the fourth stop block is provided with a first step surface and a second step surface respectively, the first step surface of the first stop block, the first step surface of the second stop block, the first step surface of the third stop block and the first step surface of the fourth stop block are positioned on one plane, and the second step surface of the first stop block, the second step surface of the second stop block, the second step surface of the third stop block and the second step surface of the fourth stop block are positioned on one plane.
Description
Technical Field
The present disclosure relates to the field of semiconductor manufacturing, and more particularly, to a robot for transporting wafers and a semiconductor processing apparatus.
Background
In the prior art, in order to grasp the dirty and clean pieces in the wafer, it is often necessary to design different robots. For example, a robot is used to grasp the dirty piece and then perform cleaning. And the other robot is used to re-grasp and place the clean wafer to the desired location.
While two independent manipulators can prevent pollution of dirty sheets to clean sheets, the structure of the manipulator is complex and is not beneficial to efficient treatment.
Disclosure of Invention
The present disclosure is directed to solving at least one of the above-mentioned problems and disadvantages of the prior art, namely, at least being capable of improving the transfer efficiency of a semiconductor processing apparatus and reducing the number of robots. In view of this technical problem, the present disclosure proposes a new type of robot for transporting wafers based on how the robot is reused.
Specifically, the present disclosure proposes a robot for transferring wafers, the robot comprising:
the first end of the first finger is provided with a first stop block and a second stop block;
at least two second fingers disposed on both sides of the first finger, the at least two second fingers respectively including a third stopper and a fourth stopper disposed on a second end opposite to the first end; and
a driving device capable of driving the first finger and the second finger to move toward each other,
wherein each of the first, second, third, and fourth stops has a first step surface and a second step surface, respectively, and wherein the first step surface of the first stop, the first step surface of the second stop, the first step surface of the third stop, and the first step surface of the fourth stop are on a plane, and the second step surface of the first stop, the second step surface of the second stop, the second step surface of the third stop, and the second step surface of the fourth stop are on a plane.
In this way, the manipulator according to the present disclosure can realize the grabbing of the dirty piece and the clean piece by means of the cooperation of different stoppers, using different parts provided on the first finger and the second finger, which adopt different parts on the manipulator, so that the dirty piece and the clean piece can be contacted by using different parts under the condition of multiplexing the same manipulator, thereby being capable of avoiding the pollution of the dirty piece to the clean piece, and in addition, the manipulator according to the present disclosure has reduced the number of the manipulator due to the realization of multiplexing. In addition, the number of the mechanical arms is reduced, so that the space of a process cavity can be saved, the cost of mechanical equipment can be reduced, or the use of high-precision mechanical arms can be reduced.
In one exemplary embodiment according to the present disclosure, the first and second stops, and the third and fourth stops are axisymmetric about a longitudinal axis of the first finger. In this way, a robot in accordance with the present disclosure can be enabled to grasp a wafer more firmly.
In one exemplary embodiment according to the present disclosure, the driving means comprises a first driving means arranged for moving the first finger relative to the second finger for switching between a first relative position and a second relative position.
In one exemplary embodiment according to the present disclosure, at the first relative position, the first step surface of the first stopper, the first step surface of the second stopper, the first step surface of the third stopper, and the first step surface of the fourth stopper are located on the same circumference, a diameter of the circumference corresponding to a diameter of a wafer to be clamped. Preferably, in one exemplary embodiment according to the present disclosure, in the second relative position, the second step surface of the first stopper, the second step surface of the second stopper, the second step surface of the third stopper, and the second step surface of the fourth stopper are located on the same circumference, a diameter of the circumference corresponding to a diameter of a wafer to be clamped. Adjustment of the relative positions of the first finger and the second finger is achieved in this way.
In one exemplary embodiment according to the present disclosure, the driving apparatus further includes:
and a second drive means arranged to move the first finger relative to the second finger. In this way, fine adjustment of the position of the first finger relative to the second finger can be achieved, so that the first finger and the second finger can be brought together to grip the wafer to be grasped.
In one exemplary embodiment according to the present disclosure, at the first relative position, a circumference in which the first step surface of the first stopper, the first step surface of the second stopper, the first step surface of the third stopper, and the first step surface of the fourth stopper are located is at a first height, and wherein at the second relative position, a circumference in which the second step surface of the first stopper, the second step surface of the second stopper, the second step surface of the third stopper, and the second step surface of the fourth stopper are located is at a second height.
Alternatively or additionally, in one exemplary embodiment according to the present disclosure, the first height and the second height are different, the robot comprises a first clamping block and a second clamping block, wherein the first clamping block is for clamping the wafer at the first height, and wherein the second clamping block is for clamping the wafer at the second height.
Preferably, in one exemplary embodiment according to the present disclosure, the first and second clamping blocks are integrally formed.
Furthermore, a second aspect according to the present disclosure proposes a semiconductor processing apparatus comprising a robot as proposed according to the first aspect of the present disclosure.
In one exemplary embodiment according to the present disclosure, the semiconductor processing apparatus includes at least two robots, the at least two robots being in different layers.
In summary, according to the manipulator of the present disclosure, the grabbing of the dirty piece and the clean piece can be achieved by means of the cooperation of different stoppers by using different components arranged on the first finger and the second finger, and the different parts on the manipulator are adopted, so that the dirty piece and the clean piece can be contacted by adopting different components under the condition of multiplexing the same manipulator, thereby avoiding the pollution of the dirty piece to the clean piece. In addition, the number of the mechanical arms is reduced, so that the space of a process cavity can be saved, the cost of mechanical equipment can be reduced, or the use of high-precision mechanical arms can be reduced.
Drawings
Features, advantages, and other aspects of embodiments of the disclosure will become more apparent upon reference to the following detailed description, taken in conjunction with the accompanying drawings, wherein several embodiments of the disclosure are shown by way of illustration, and not limitation, in which:
FIG. 1A shows a schematic view of a robot for transporting wafers in a first position according to the present disclosure;
FIG. 1B shows a schematic view of a robot for transporting wafers in a second position according to the present disclosure;
FIG. 2A illustrates a schematic diagram of another embodiment of a robot for transporting wafers in accordance with the present disclosure;
FIG. 2B shows a schematic view of a clamping block of a robot for transporting wafers in accordance with the present disclosure; and
fig. 3 illustrates a side view of another embodiment of a robot for a semiconductor processing apparatus in accordance with the present disclosure.
Detailed Description
The technical scheme of the invention is further specifically described below through examples and with reference to the accompanying drawings. In the specification, the same or similar reference numerals denote the same or similar components. The following description of embodiments of the present invention with reference to the accompanying drawings is intended to illustrate the general inventive concept and should not be taken as limiting the invention.
The terms "comprising," including, "and similar terms used herein should be interpreted as open-ended terms, i.e., including, but not limited to," meaning that other elements may also be included. The term "based on" is based at least in part on. The term "one embodiment" means "at least one embodiment"; the term "another embodiment" means "at least one additional embodiment," and so forth.
As described above, the present disclosure is directed to solving at least one of the above-mentioned problems and disadvantages of the related art, which is at least capable of improving the transfer efficiency of a semiconductor processing apparatus and reducing the number of robots. In view of this technical problem, the present disclosure proposes a new type of robot for transporting wafers based on how the robot is reused.
In summary, the present disclosure proposes a robot for transporting wafers, the robot comprising: the first end of the first finger is provided with a first stop block and a second stop block; at least two second fingers disposed on both sides of the first finger, the at least two second fingers respectively including a third stopper and a fourth stopper disposed on a second end opposite to the first end; and a driving device capable of driving the first finger and the second finger to move toward each other, wherein each of the first stopper, the second stopper, the third stopper, and the fourth stopper has a first step surface and a second step surface, respectively, and wherein the first step surface of the first stopper, the first step surface of the second stopper, the first step surface of the third stopper, and the first step surface of the fourth stopper are on one plane, and the second step surface of the first stopper, the second step surface of the second stopper, the second step surface of the third stopper, and the second step surface of the fourth stopper are on one plane. In this way, the manipulator according to the present disclosure can realize the grabbing of the dirty piece and the clean piece by means of the cooperation of different stoppers, using different parts provided on the first finger and the second finger, which adopt different parts on the manipulator, so that the dirty piece and the clean piece can be contacted by using different parts under the condition of multiplexing the same manipulator, thereby being capable of avoiding the pollution of the dirty piece to the clean piece, and in addition, the manipulator according to the present disclosure has reduced the number of the manipulator due to the realization of multiplexing. In addition, the number of the mechanical arms is reduced, so that the space of a process cavity can be saved, the cost of mechanical equipment can be reduced, or the use of high-precision mechanical arms can be reduced.
The robot for transferring wafers of the present disclosure is described below with reference to fig. 1A to 3. Wherein fig. 1A shows a schematic view of a robot for transferring wafers according to the present disclosure in a first position, fig. 1B shows a schematic view of a robot for transferring wafers according to the present disclosure in a second position, fig. 2A shows a schematic view of another embodiment of a robot for transferring wafers according to the present disclosure, fig. 2B shows a schematic view of a clamping block of a robot for transferring wafers according to the present disclosure, and fig. 3 shows a side view of another embodiment of a robot for semiconductor processing equipment according to the present disclosure.
As can be seen from fig. 1A, the robot for transferring wafers according to the present disclosure includes: a first finger 1, a first stop 3.1 and a second stop 3.2 being provided on a first end (e.g. left side) of the first finger 1; at least two second fingers 2, the at least two second fingers 2 being arranged on both sides of the first finger 1, the at least two second fingers 2 comprising a third stop 4.1 and a fourth stop 4.2, respectively, arranged on a second end (e.g. right side) opposite to the first end (e.g. left side); and a driving device (not shown in the figure) capable of driving the first finger 1 and the second finger 2 to move toward each other, wherein each of the first stopper 3.1, the second stopper 3.2, the third stopper 4.1 and the fourth stopper 4.2 has a first step surface (for example, a lower step surface) and a second step surface (for example, a higher step surface), respectively, and wherein the first step surface (for example, a lower step surface) of the first stopper, the first step surface (for example, a lower step surface) of the second stopper, the first step surface (for example, a lower step surface) of the third stopper and the first step surface (for example, a lower step surface) of the fourth stopper are on one plane, and the second step surface (for example, a higher step surface) of the first stopper, the second step surface (for example, a higher step surface) of the second stopper, the second step surface (for example, a higher step surface) of the third stopper and the fourth step surface (for example, a higher step surface) of the fourth stopper are on the same plane. In this way, the manipulator according to the present disclosure is able to achieve the gripping of the dirty sheets and the clean sheets by means of the cooperation of the different stops 3.1, 3.2, 4.1 and 4.2, with the different parts provided on the first finger 1 and the second finger 2, which employ the different parts on the manipulator, so that the dirty sheets and the clean sheets can be contacted with the different parts in the case of multiplexing the same manipulator, whereby contamination of the clean sheets by the dirty sheets can be avoided, and furthermore the manipulator according to the present disclosure is reduced in number due to multiplexing. In addition, the number of the mechanical arms is reduced, so that the space of a process cavity can be saved, the cost of mechanical equipment can be reduced, or the use of high-precision mechanical arms can be reduced.
As shown in fig. 1A, the first step surfaces (e.g., lower step surfaces) of the stoppers 3.1 and 3.2 and the first step surfaces (e.g., lower step surfaces) of the stoppers 4.1 and 4.2 together support one wafer.
As can be seen from fig. 1B, the robot for transferring wafers according to the present disclosure includes: a first finger 1, a first stop 3.1 and a second stop 3.2 being provided on a first end (e.g. left side) of the first finger 1; at least two second fingers 2, the at least two second fingers 2 being arranged on both sides of the first finger 1, the at least two second fingers 2 comprising a third stop 4.1 and a fourth stop 4.2, respectively, arranged on a second end (e.g. right side) opposite to the first end (e.g. left side); and a driving device (not shown in the figure) capable of driving the first finger 1 and the second finger 2 to move toward each other, wherein each of the first stopper 3.1, the second stopper 3.2, the third stopper 4.1 and the fourth stopper 4.2 has a first step surface (for example, a lower step surface) and a second step surface (for example, a higher step surface), respectively, and wherein the first step surface (for example, a lower step surface) of the first stopper, the first step surface (for example, a lower step surface) of the second stopper, the first step surface (for example, a lower step surface) of the third stopper and the first step surface (for example, a lower step surface) of the fourth stopper are on one plane, and the second step surface (for example, a higher step surface) of the first stopper, the second step surface (for example, a higher step surface) of the second stopper, the second step surface (for example, a higher step surface) of the third stopper and the fourth step surface (for example, a higher step surface) of the fourth stopper are on the same plane. In this way, the manipulator according to the present disclosure is able to achieve the gripping of the dirty sheets and the clean sheets by means of the cooperation of the different stops 3.1, 3.2, 4.1 and 4.2, with the different parts provided on the first finger 1 and the second finger 2, which employ the different parts on the manipulator, so that the dirty sheets and the clean sheets can be contacted with the different parts in the case of multiplexing the same manipulator, whereby contamination of the clean sheets by the dirty sheets can be avoided, and furthermore the manipulator according to the present disclosure is reduced in number due to multiplexing. In addition, the number of the mechanical arms is reduced, so that the space of a process cavity can be saved, the cost of mechanical equipment can be reduced, or the use of high-precision mechanical arms can be reduced.
As shown in fig. 1A, the first step surfaces (e.g., the higher step surfaces) of the stoppers 3.1 and 3.2 and the first step surfaces (e.g., the higher step surfaces) of the stoppers 4.1 and 4.2 together support one wafer.
Here, the first finger 1 is driven by a pneumatic cylinder or an electric cylinder, and is relatively displaceable with respect to the second finger 2. Different stoppers are mounted on the first finger 1 and the second finger 2.
Fig. 2A shows a schematic view of another embodiment of a robot for transporting wafers according to the present disclosure, and fig. 2B shows a schematic view of a clamping block of the robot for transporting wafers according to the present disclosure. As can be seen from fig. 2A and 2B, the right end of the first finger 1 has a clamping block 5, and the clamping block 5 is also driven by a different cylinder or electric cylinder than the aforementioned first step surface (e.g. lower step surface) and second step surface (e.g. higher step surface). By moving the first finger 1 to two different positions (for example the positions shown in fig. 1A and 1B), contact of the wafer by different parts of the stop can be achieved separately, to achieve prevention of cross contamination, and this has the advantage that: the wafer can be self-centering after clamping, and can be transmitted at high speed, etc. Furthermore, preferably, in one exemplary embodiment according to the present disclosure, the at least one clamping block 5 is directed towards the circumferential center with respect to the moving direction of the first finger. In this way, the wafer stress during clamping is more uniform, thereby improving the quality stability of the wafer.
As shown in fig. 2A and 2B, under the state 1 of the robot arm according to the present disclosure, when the first finger 1 moves to the illustrated position, the parts of the first finger 1 and the second finger 2 contacting the wafer are: the lower step surface of the stop 3.1, the lower step surface of the stop 3.2, the lower step surface of the stop 4.1, the lower step surface of the stop 4.2, and the lower step surface of the clamp block 5. The clamping block 5 is driven by an air cylinder or an electric cylinder to perform horizontal movement in the drawing, the wafer is clamped when moving to the left, and the wafer is unclamped when moving to the right. Under state 2 of the robot arm according to the present disclosure, when the first finger 1 moves to the illustrated position, the parts of the finger contacting the wafer are: the upper step surface of the stop 3.1, the upper step surface of the stop 3.2, the upper step surface of the stop 4.1, the upper step surface of the stop 4.2, and the upper step surface of the clamping block 5. The clamping block 5 is driven by an air cylinder or an electric cylinder to do horizontal movement in the drawing, the wafer is clamped when moving to the left, and the wafer is unclamped when moving to the right.
Here, in one exemplary embodiment according to the present disclosure, the first and second stoppers, and the third and fourth stoppers are axisymmetric about a longitudinal axis of the first finger. In this way, a robot in accordance with the present disclosure can be enabled to grasp a wafer more firmly. Preferably, in one exemplary embodiment according to the present disclosure, the driving means comprises a first driving means arranged for moving the first finger relative to the second finger for switching between a first relative position and a second relative position. Furthermore, in one exemplary embodiment according to the present disclosure, at the first relative position, the first step surface of the first stopper, the first step surface of the second stopper, the first step surface of the third stopper, and the first step surface of the fourth stopper are located on the same circumference, a diameter of which corresponds to a diameter of a wafer to be clamped. Preferably, in one exemplary embodiment according to the present disclosure, in the second relative position, the second step surface of the first stopper, the second step surface of the second stopper, the second step surface of the third stopper, and the second step surface of the fourth stopper are located on the same circumference, a diameter of the circumference corresponding to a diameter of a wafer to be clamped. Adjustment of the relative positions of the first finger and the second finger is achieved in this way. Furthermore, in an exemplary embodiment according to the present disclosure, the driving apparatus further includes: and a second drive means arranged to move the first finger relative to the second finger. In this way, fine adjustment of the position of the first finger relative to the second finger can be achieved, so that the first finger and the second finger can be brought together to grip the wafer to be grasped.
In one exemplary embodiment according to the present disclosure, at the first relative position, a circumference in which the first step surface of the first stopper, the first step surface of the second stopper, the first step surface of the third stopper, and the first step surface of the fourth stopper are located is at a first height, and wherein at the second relative position, a circumference in which the second step surface of the first stopper, the second step surface of the second stopper, the second step surface of the third stopper, and the second step surface of the fourth stopper are located is at a second height. Alternatively or additionally, in one exemplary embodiment according to the present disclosure, the first height and the second height are different, the robot comprises a first clamping block and a second clamping block, wherein the first clamping block is for clamping the wafer at the first height, and wherein the second clamping block is for clamping the wafer at the second height. Preferably, in one exemplary embodiment according to the present disclosure, the first and second clamping blocks are integrally formed. The solution provided by the present disclosure may contact the wafers by different components to transport the wafers, preventing cross-contamination between the wafers. In addition, the solution provided by the present disclosure adopts clamping design based on contact distinction, and has the advantages of firm clamping, no falling of wafer, self-centering of clamped wafer, high-speed transmission, etc
In addition, as shown in fig. 3, the scheme can be expanded to design of multiple layers of fingers 301, 302, 303, 304 and 305, and the same moving parts with different layers can be driven by the same or different cylinders and electric cylinders. In addition, the front stop block and the rear cushion block of the scheme can be arranged at different heights, namely, the lower step surface of the stop block 3.1, the lower step surface of the stop block 3.2, the lower step surface of the stop block 4.1 and the lower step surface of the stop block 4.2 are in contact with the wafer, wherein the height of the wafer is 1, and the higher step surface of the stop block 3.1, the higher step surface of the stop block 3.2, the higher step surface of the stop block 4.1 and the higher step surface of the stop block 4.2 are in contact with the wafer, and the height of the wafer is 2. At this time, the clamping block 5 can be deformed into different height regions of the same clamping block, and the different regions of the same clamping block are respectively contacted with the wafers in two states.
Furthermore, a second aspect according to the present disclosure proposes a semiconductor processing apparatus comprising a robot as proposed according to the first aspect of the present disclosure. Preferably, in one exemplary embodiment according to the present disclosure, the semiconductor processing apparatus includes at least two robots, the at least two robots being in different layers.
In summary, according to the manipulator of the present disclosure, the grabbing of the dirty piece and the clean piece can be achieved by means of the cooperation of different stoppers by using different components arranged on the first finger and the second finger, and the different parts on the manipulator are adopted, so that the dirty piece and the clean piece can be contacted by adopting different components under the condition of multiplexing the same manipulator, thereby avoiding the pollution of the dirty piece to the clean piece. In addition, the number of the mechanical arms is reduced, so that the space of a process cavity can be saved, the cost of mechanical equipment can be reduced, or the use of high-precision mechanical arms can be reduced.
The above is merely an optional embodiment of the present disclosure, and is not intended to limit the embodiments of the present disclosure, and various modifications and variations may be possible to the embodiments of the present disclosure for those skilled in the art. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the embodiments of the present disclosure are intended to be included within the scope of the embodiments of the present disclosure.
Although embodiments of the present disclosure have been described with reference to a number of specific embodiments, it should be understood that embodiments of the present disclosure are not limited to the specific embodiments disclosed. The embodiments of the disclosure are intended to cover various modifications and equivalent arrangements included within the spirit and scope of the appended claims. The scope of the following claims is to be accorded the broadest interpretation so as to encompass all such modifications and equivalent structures and functions.
Claims (11)
1. A robot for transporting wafers, the robot comprising:
the first end of the first finger is provided with a first stop block and a second stop block;
at least two second fingers disposed on both sides of the first finger, the at least two second fingers respectively including a third stopper and a fourth stopper disposed on a second end opposite to the first end;
the robot comprises a first clamping block and a second clamping block, wherein the first clamping block is used for clamping a wafer at a first height, and wherein the second clamping block is used for clamping the wafer at a second height, and wherein the clamping block faces towards a circumference center relative to the moving direction of the first finger; and
a driving device capable of driving the first finger and the second finger to move toward each other,
wherein each of the first, second, third, and fourth stops has a first step surface and a second step surface, respectively, and wherein the first step surface of the first stop, the first step surface of the second stop, the first step surface of the third stop, and the first step surface of the fourth stop are on a plane, and the second step surface of the first stop, the second step surface of the second stop, the second step surface of the third stop, and the second step surface of the fourth stop are on a plane.
2. The manipulator of claim 1, wherein the first and second stops, and the third and fourth stops are axisymmetric about a longitudinal axis of the first finger.
3. A manipulator according to claim 1, wherein the drive means comprises first drive means arranged to move the first finger relative to the second finger to switch between a first relative position and a second relative position.
4. A robot hand as claimed in claim 3, wherein, in the first relative position, the first step surface of the first stop, the first step surface of the second stop, the first step surface of the third stop and the first step surface of the fourth stop are located on the same circumference, the diameter of the circumference corresponding to the diameter of the wafer to be clamped.
5. A robot hand as claimed in claim 3, wherein in the second relative position, the second step surface of the first stop, the second step surface of the second stop, the second step surface of the third stop and the second step surface of the fourth stop are located on the same circumference, the diameter of the circumference corresponding to the diameter of the wafer to be clamped.
6. A manipulator according to claim 3, wherein the drive means further comprises:
and a second drive means arranged to move the first finger relative to the second finger.
7. The manipulator of claim 3, wherein at the first relative position, a circumference in which the first step surface of the first stop, the first step surface of the second stop, the first step surface of the third stop, and the first step surface of the fourth stop are located is at the first height, and wherein at the second relative position, a circumference in which the second step surface of the first stop, the second step surface of the second stop, the second step surface of the third stop, and the second step surface of the fourth stop are located is at the second height.
8. The manipulator of claim 7, wherein the first height and the second height are different.
9. The manipulator of claim 1, wherein the first clamp block and the second clamp block are integrally formed.
10. A semiconductor processing apparatus, characterized in that it comprises at least one robot according to any one of claims 1 to 9.
11. The semiconductor processing apparatus of claim 10, wherein the semiconductor processing apparatus comprises at least two robots, the at least two robots being in different layers.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311535589.0A CN117373994A (en) | 2023-11-17 | 2023-11-17 | Robot for transporting wafers and semiconductor processing apparatus |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311535589.0A CN117373994A (en) | 2023-11-17 | 2023-11-17 | Robot for transporting wafers and semiconductor processing apparatus |
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| Publication Number | Publication Date |
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| CN117373994A true CN117373994A (en) | 2024-01-09 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202311535589.0A Pending CN117373994A (en) | 2023-11-17 | 2023-11-17 | Robot for transporting wafers and semiconductor processing apparatus |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0687531A (en) * | 1992-09-09 | 1994-03-29 | Hitachi Ltd | Delivery jig and device |
| JP2006150538A (en) * | 2004-11-30 | 2006-06-15 | Rorze Corp | Holding type conveying device, robot using the same, disk-shaped article working equipment, and disk-shaped article conveying method |
| KR20090012702A (en) * | 2007-07-31 | 2009-02-04 | 세메스 주식회사 | Substrate transfering apparatus and facility for treating with the same, and method for trasfering substrate with the apparatus |
| CN107275268A (en) * | 2016-03-31 | 2017-10-20 | 平田机工株式会社 | Manipulator unit and method for shifting |
| CN113113340A (en) * | 2021-03-30 | 2021-07-13 | 北京北方华创微电子装备有限公司 | Manipulator of semiconductor equipment |
-
2023
- 2023-11-17 CN CN202311535589.0A patent/CN117373994A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0687531A (en) * | 1992-09-09 | 1994-03-29 | Hitachi Ltd | Delivery jig and device |
| JP2006150538A (en) * | 2004-11-30 | 2006-06-15 | Rorze Corp | Holding type conveying device, robot using the same, disk-shaped article working equipment, and disk-shaped article conveying method |
| KR20090012702A (en) * | 2007-07-31 | 2009-02-04 | 세메스 주식회사 | Substrate transfering apparatus and facility for treating with the same, and method for trasfering substrate with the apparatus |
| CN107275268A (en) * | 2016-03-31 | 2017-10-20 | 平田机工株式会社 | Manipulator unit and method for shifting |
| CN113113340A (en) * | 2021-03-30 | 2021-07-13 | 北京北方华创微电子装备有限公司 | Manipulator of semiconductor equipment |
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