KR20070013866A - Plasma processing system of cluster type and processing method thereby - Google Patents

Abstract

A method and a system for processing cluster type plasma are provided to increase a plasma processing speed by organically coupling plural process chambers with one another. A system for processing a cluster type plasma includes a conveying module(10), plural process chambers(30a,30b,30c), and a transfer module(20). The conveying module loads a substrate to be processed on an empty tray and unloads the substrate from the tray after a plasma treatment process. The process chambers receive the trays, on which the substrate is loaded, and perform a plasma treatment process in a vacuum atmosphere. The transfer module transfers the tray, on which the substrate is loaded, from the conveying module to the process chamber. The transfer module includes a transfer robot, which moves the tray, on which the substrate is loaded, from the process chamber to the conveying module.

Description

Plasma processing system of cluster type and processing method hence}

1 is a plan view of a conventional plasma processing system.

2 is a cross-sectional view of the process chamber shown in FIG.

3 is a perspective view of one embodiment of a plasma processing system according to the present invention.

4 is a plan view of the system shown in FIG.

5 is a side view of the loader shown in FIG. 4.

6 is a perspective view of the transfer robot shown in FIG. 4.

7 is a perspective view of another embodiment of a plasma processing system according to the present invention.

** Description of the symbols for the main parts of the drawings **

10: Return Module 11: Loader

11a: body 11b: pad holder

11c: vacuum pad 12: unloader

13: shaft 20: transfer module

21: housing 22: transfer robot

22a: lower jig 22b: upper jig

22c: arm 22d: tray holding part

23: guide rails 30a, 30b, 30c: process chamber

31, 32: vacuum pump 40: buffer module

51: tray 52: substrate

The present invention relates to a cluster type plasma processing system and method, and more particularly, to a cluster type plasma processing system and method that can improve the plasma processing speed by organically combining at least one or more process chambers. .

In general, in the process of manufacturing a semiconductor process, a flat panel display device, or a solar cell, a plasma processing system that uses a plasma to perform a predetermined process on a wafer or a liquid crystal substrate (hereinafter, referred to as a "substrate") is used.

A conventional system for performing plasma treatment on a substrate will be described with reference to FIG. 1. The conventional plasma processing system includes a transfer module 200 having two rows of loaders / unloaders 201a and 201b, two loading chambers 300, a transfer chamber 100, and an unloading chamber (two). 400).

Referring to the configuration of the conventional system in detail, the transport module 200 is provided with a loader / unloader (201a, 201b) for loading (receiving) and unloading (discharge) the substrate in the tray 202 In addition, the loading chamber 300 and the unloading chamber 400 repeat a vacuum state in an atmospheric state, and a vacuum pump that pumps to create a vacuum atmosphere is connected to the loading chamber 300 and the unloading chamber 400. In contrast, the process chamber 100 must maintain a vacuum at all times, for which the vacuum pump 101 is connected. Moreover, it is an apparatus which generates a plasma in a vacuum atmosphere, and performs a predetermined plasma process on a board | substrate. The process chamber 100 will be described in detail with reference to FIG. 2. An upper electrode 112 is provided in an upper region of the chamber 110, and is installed in a lower region facing the upper electrode 112. The base 114 is provided to be spaced apart from the bottom of one chamber 110 by a predetermined distance, the insulating member 116 loaded on the upper region of the base 114, and the upper region of the insulating member 116 It consists of a lower electrode 118 including a cooling plate to be loaded.

In order to protect the upper electrode 112 and the lower electrode 118 from the plasma during the process, the remaining portion except the electrode surface, that is, the upper region edge portion and each side surface is attached to the insulating plate 122 and then a ceramic plate on the outside thereof. (124) was attached.

In addition, a high frequency power supply rod (not shown) to which a high frequency power RF is applied from the outside of the chamber 110 is installed on the bottom surface of the lower electrode 118 described above. The high frequency power supply rod penetrates through a center support 126 supporting a central portion of the base 114 to be in contact with the bottom surface of the lower electrode 118.

Meanwhile, a cooling path through which coolant flows may be formed in the lower electrode 118 to cool the heat generated from the lower electrode 118. The cooling water is provided to a cooling path provided in the lower electrode 118 through a cooling path installed through side support members 128 and 130 supporting four corners of the base 114.

A baffle 138 is provided between the inner wall of the chamber 110 and the ceramic plate 124. The baffle 138 serves as a passage for exhausting the unreacted gas remaining in the chamber 110 and the polymer generated during the process to the lower portion of the chamber 110 during or after the process is performed. After the polymer is first blocked, the polymer can be discharged through the exhaust holes formed at the corners of the lower surface of the process chamber.

Referring to the operation of the conventional plasma processing system configured as described above, the loader / unloader in the transfer chamber to load the substrate (hereinafter referred to as "to-be-processed substrate") to perform the plasma processing to the empty tray. When the loading of the substrate into the tray is completed, the tray is fed to the loading chamber along the guide rail, where it is brought into the process chamber by means of transportation. When the plasma processing is completed in the process chamber, the plasma-treated substrate (hereinafter referred to as “processing substrate”) accommodated in the tray is transferred to the unloading chamber, and then transferred along the guide rail to the transfer chamber. After the tray is transferred to the transfer chamber, the substrate is unloaded by the loader / unloader, and the loader / unloader is again unloaded to load the substrate to be processed into an empty tray and repeats the above-described process. Is to proceed with plasma processing.

However, the conventional plasma processing system as described above has a problem in that the loading of the substrate to be processed and the unloading of the substrate to be processed are not quick, and therefore, the process chamber is limited to two. In particular, each of the process chambers has a problem that the loading chamber and the unloading chamber should be provided separately.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-described problems, and an object of the present invention is to provide a cluster type plasma processing system and method which can improve plasma processing speed by organically combining at least one or more process chambers. In providing.

Another object of the present invention is to provide a cluster type plasma processing system and method capable of minimizing a space to maintain a high vacuum atmosphere by performing under atmospheric pressure or a low vacuum atmosphere in a space other than the process chamber in which the plasma processing is performed.

In order to solve the above technical problem, the cluster type plasma processing system according to the present invention includes: a transport module for loading a substrate to be processed into an empty tray and unloading the processing substrate from a tray in which the processing substrate after plasma processing is received; A plurality of process chambers which receive a tray containing the substrate to be processed and perform plasma processing in a vacuum atmosphere; And a transfer module including a transfer robot configured to transfer the tray loaded with the substrate to be processed from the transfer module to the process chamber or to transfer the tray containing the substrate from the process chamber to the transfer module. The transfer module and the transfer module are preferably in an atmospheric pressure atmosphere.

In addition, in the cluster type plasma processing system of the present invention, the transfer module and the plurality of process chambers are disposed along the sidewall of the transfer module, and in particular, the plurality of the process chambers are the same with respect to the transfer robot. It is preferably located on the circumference.

On the other hand, a buffer module is provided that provides a space for temporarily storing the tray in which the substrate to be processed or the tray in which the processing substrate is accommodated, and in this case, the transfer module and the buffer module are the same with respect to the transfer robot. More preferably, it is located on the circumference.

In addition, the conveying module is provided with a loader for loading the substrate to be processed into the tray, and an unloader for unloading the substrate from the tray. The conveying module is provided with a guide rail. Accordingly, the transfer robot is configured to move horizontally.

The plasma processing method using the cluster type plasma processing system according to the present invention includes a loading step of receiving a substrate to be processed into an empty tray in a transport module; A substrate loading step of transferring the tray and sequentially loading the tray into at least one process chamber; A plasma processing step of plasma processing the substrate to be processed in the process chamber; A buffering step of temporarily storing a second tray loaded with a second substrate to be processed in the transfer module in a buffer space while the plasma processing is performed; A substrate transport step of transporting the tray from the process chamber where the plasma processing is completed and transferring it to the transport module; And a second substrate loading step of bringing in a second tray into the process chamber from which the tray is carried out. The loading step of receiving a substrate to be processed into an empty tray in a transfer module may be performed. A substrate loading step of transferring the tray and sequentially loading the tray into at least one process chamber; A plasma processing step of plasma processing the substrate to be processed in the process chamber; A buffering step of carrying out the tray and temporarily storing the tray in a buffer space; A second substrate supplying step of transferring the second tray containing the second substrate to be processed from the conveying module and carrying it into the process chamber from which the processing substrate is carried out; And an unloading step of transferring the tray temporarily stored in the buffer space to the transfer module to discharge the processing substrate.

Hereinafter, with reference to the accompanying drawings will be described in detail the configuration and operation of the embodiment according to the present invention.

Referring to FIG. 3, an embodiment according to the present invention includes a transfer module 10, a transfer module 20, and three process chambers 30a, 30b, and 30c, and specifically, a rectangular parallelepiped shape located at the center portion. The transfer module 20 and one transfer module 10 and three process chambers 30a, 30b, and 30c are disposed adjacent to each other on four sides of the transfer module 20 to form a cluster type. Able to know.

Referring to Figure 4 in detail the configuration of this embodiment, the transport module 10 also has a substantially rectangular parallelepiped housing is provided, the tray seating portion is formed in the housing, the loader on the upper left and right sides 11) and the unloader 12 are formed separately, respectively. The loader 11 and the unloader 12 are movable in the X and Z-axis directions through the shaft 13, and are configured to be movable in the Y-axis direction through separate transportation means, although not shown.

5, the loader 11 is composed of two bodies 11a, and seven pad holders 11b and vacuum pads 11c are coupled to each body 11a, and the body 11a. ), The pad holder 11b and the vacuum pad 11c are provided with a vacuum line. Therefore, the loader is configured to be able to adsorb 7 x 2 substrates 52 simultaneously. In this embodiment, the unloader 12 also has the same configuration as that of the loader 11.

The transfer module 20 is provided with a substantially rectangular parallelepiped housing 21, and is formed adjacent to one side wall of the transfer module 10, and a substrate to be processed or a processing substrate is provided inside the transfer module 20. A transfer robot 22 for holding and transporting the loaded (51) tray 51 and a guide rail 23 for providing a line through which the transfer robot 22 can move in a horizontal direction are provided. Referring to FIG. 6, the transfer robot 22 is installed on the lower jig 22a coupled to move along the guide rail 23 and the upper jig 22a and moves up and down (Z axis). And an upper jig 22b rotatable 360 °, two arms 22c coupled to the upper jig 22b, and a grip part 22d on which the tray 51 is lifted.

The three process chambers 30a, 30b, and 30c are formed adjacent to the three side walls of the transfer module 20, respectively, and the configuration can be the same as that of the conventional process chamber. That is, a vacuum pump 31, 32 for pumping to perform a plasma treatment in a vacuum state, and comprises an upper electrode (not shown) and a lower electrode (not shown).

However, conventionally, the tray containing the substrate to be processed is supplied through the loading chamber in a vacuum atmosphere before being supplied to the process chamber, but in this embodiment, the tray is directly supplied from the transfer module 20 in the standby state to the process chamber 30. Therefore, the pumping capacity should be superior to the conventional process chamber. Therefore, it can be seen that the two vacuum pumps 31 and 32 are connected in parallel.

In particular, a buffer module 40 is further added between the transfer chamber 10 and any one of the process chambers 30a or 30c adjacent thereto. The buffer module 40 temporarily stores a tray 51 in which a substrate to be processed is loaded in the transfer module 10 or a tray 51 in which a processing substrate subjected to plasma treatment in the process chambers 30a, 30b, and 30c is stored. It consists of a rectangular parallelepiped housing provided with a buffer space for temporary storage.

As shown in the present embodiment, the three process chambers 30a, 30b, 30c are located on the same circumference around the transfer robot 22, and the transfer module (tray seat) and buffer module ( 40 is also located on the same circumference around the transfer robot 22.

7 shows another embodiment of a cluster type plasma processing system according to the present invention. Referring to this, in the system shown in FIG. 3, one process chamber is further provided on both side walls in the longitudinal direction of the transfer module. Of course, the configuration and operation of the transfer module, transfer module, buffer module and process chamber are the same. In this way, process efficiency can be increased. Therefore, the process efficiency can be maximized by appropriately adjusting the number of process chambers according to the process speed of the transfer module and the transfer module.

Referring to Figure 4 describes the operation and processing method of the plasma processing system of the substrate according to the present invention, the empty tray 51 composed of a 7 × 7 array on the tray seating portion of the transfer module 10, the loader ( 11) simultaneously adsorbs 7 x 2 substrates to be loaded into the empty tray 51. After the above operation is repeated and the loading of the substrate to be processed in the tray 51 is completed, the transfer robot 22 of the transfer module 20 extends the arm 22c to hold the tray 51 and grips the same. After moving along the guide rail 23 in a state, it carries in to each process chamber 30a, 30b, 30c. The process chambers 30a, 30b, and 30c open a door (not shown) in the process of loading the tray 51 so that the arm 22c enters the chambers 30a, 30b and 30c through the door. Unlike the transfer module is at atmospheric pressure, the process chamber also has to be exposed to the atmospheric state, so it must be pumped using the vacuum pumps 31 and 32, and this pumping again creates a vacuum atmosphere necessary for plasma treatment. In this state, plasma is generated using the upper electrode and the lower electrode to plasma-process the substrate 52. Meanwhile, while the plasma processing is performed in the process chambers 30a, 30b, and 30c, the transfer module 10 continues to load the substrate to be processed into the empty tray 51, and transfers the loaded tray to the transfer robot 11. ) Is gripped and placed on the buffer module 40. In other words, when the plasma process is completed, the tray is transferred from the process chamber to the transfer chamber by using the transfer robot. In the conveying chamber, the substrate is unloaded using the upper unloader and the loader, and the substrate to be processed is loaded into the unloaded space. Meanwhile, while the unloading of the processing substrate and the loading of the processing substrate are performed in the transfer chamber, the transfer robot transfers the tray temporarily stored in the buffer module to the process chamber (the process chamber in which the tray containing the processing substrate is carried out). Bring in By repeating such a process, the plasma treatment of the substrate to be processed can be performed continuously.

The plasma processing method using the cluster type plasma processing system according to the present invention can also be carried out by a method different from the above-described method. To explain this, the empty tray 51 having a 7 × 7 array is placed on the tray seating portion of the transfer module 10, and the loader 11 simultaneously sucks 7 × 2 substrates to be processed to empty the tray 51. Load in After the above operation is repeated and the loading of the substrate to be processed in the tray 51 is completed, the transfer robot 22 of the transfer module 20 extends the arm 22c to hold the tray 51 and grips the same. After moving along the guide rail 23 in a state, it carries in to each process chamber 30a, 30b, 30c. The process chambers 30a, 30b, and 30c open a door (not shown) in the process of loading the tray 51 so that the arm 22c enters the chambers 30a, 30b and 30c through the door. Unlike the transfer module is at atmospheric pressure, the process chamber also has to be exposed to the atmospheric state, so it must be pumped using the vacuum pumps 31 and 32, and this pumping again creates a vacuum atmosphere necessary for plasma treatment. In this state, plasma is generated using the upper electrode and the lower electrode to plasma-process the substrate 52. Meanwhile, while the plasma processing is performed in the process chambers 30a, 30b, and 30c, the transfer module 10 continues to load the substrate to be processed into the empty tray 51, and transfers the loaded tray to the transfer robot 11. ) Is gripped and placed on the buffer module 40. In other words, when the plasma process is completed, the process substrate is accommodated in the tray 51 accommodated in the process chambers 30a, 30b, and 30c. The arm 22c of the transfer robot 22 is gripped and taken out from the process chambers 30a, 30b, and 30c. The transfer robot 22 holding the tray 51 containing the processing substrate is transported in a horizontal direction, and the tray 51 is lowered to the buffer module 40, and then the upper jig ( 22b) and the arm 22c are rotated to grasp the tray 51 already loaded with the substrate to be processed and transferred to the process chambers 30a, 30b, and 30c where the tray 51 has been taken out immediately before the tray 51. Import Then, the transfer robot 22 is transported again in the horizontal direction to hold the tray 51 temporarily stored in the buffer module 40, and then transferred to the transfer module 10 to carry in. In the tray 51 carried in the transfer module 10, the unloader 12 vacuum-adsorbs and unloads a 7 × 2 processing substrate, and at the same time, the loader 11 loads a 7 × 2 substrate to be processed. Load in unloaded position. By repeating such a process, the plasma treatment of the substrate to be processed can be performed continuously.

Unlike the above-described embodiment, the plasma processing system according to the present invention may form four or more process chambers. Of course, even in this case, a plurality of process chambers should be located on the same circumference around the transfer robot. In addition, as the number of process chambers increases, the loading and unloading efficiency of the substrate must be improved, so that a 7x2 row of loaders and unloaders can be changed to 7x3 or more.

According to the present invention there is an effect to improve the plasma processing speed by organically combining at least one or more process chambers.

In addition, according to the present invention, since a space other than the process chamber in which the plasma treatment is performed is performed under atmospheric pressure or a low vacuum atmosphere, a space for maintaining a high vacuum atmosphere can be minimized.

Moreover, since loading and unloading are performed at the same time, there is an effect that the process time can be shortened.

Claims (13)

A transport module for loading a substrate to be processed into an empty tray and unloading the processing substrate from a tray in which the processing substrate after plasma processing is received; A plurality of process chambers which receive a tray containing the substrate to be processed and perform plasma processing in a vacuum atmosphere; And And a transfer module provided with a transfer robot for transferring the tray loaded with the substrate to be processed from the transfer module to the process chamber or transferring the tray containing the substrate from the process chamber to the transfer module. Cluster type plasma processing system, characterized in that. The method of claim 1, The transfer module and the transfer module is a cluster type plasma processing system, characterized in that the atmospheric pressure atmosphere. The method according to claim 1 or 2, And the transfer module and the plurality of process chambers are disposed along the sidewalls of the transfer module. The method of claim 3, wherein And a plurality of said process chambers are located on the same circumference with respect to said transfer robot. The method of claim 1, And a buffer module configured to provide a space for temporarily storing the tray in which the substrate to be processed is stored or the tray in which the processing substrate is accommodated. The method of claim 5, The transfer module and the buffer module are cluster type plasma processing system, characterized in that located on the same circumference around the transfer robot. The method of claim 1, The conveyance module is provided with a loader for loading the substrate to be processed into the tray and an unloader for unloading the processing substrate from the tray. The method of claim 1, The transfer module is provided with a guide rail, the plasma processing system of the cluster type, characterized in that the transfer robot moves horizontally along the guide rail. A loading step of receiving the substrate to be processed into the empty tray in the conveying module; A substrate loading step of transferring the tray and sequentially loading the tray into at least one process chamber; A plasma processing step of plasma processing the substrate to be processed in the process chamber; A buffering step of temporarily storing a second tray loaded with a second substrate to be processed in the buffer module while the plasma processing is performed; A substrate transport step of transporting the tray from the process chamber where the plasma processing is completed and transferring it to the transport module; And And a second substrate importing step of bringing in a second tray into the process chamber from which the tray is carried out. The method of claim 9, The plasma processing step is performed in a high vacuum atmosphere, the other steps are plasma processing method, characterized in that performed in a low vacuum or atmospheric state. A loading step of receiving the substrate to be processed into the empty tray in the conveying module; A substrate loading step of transferring the tray and sequentially loading the tray into at least one process chamber; A plasma processing step of plasma processing the substrate to be processed in the process chamber; A buffering step of carrying out the tray and temporarily storing the tray in a buffer space; A second substrate supplying step of transferring the second tray containing the second substrate to be processed from the conveying module and carrying it into the process chamber from which the processing substrate is carried out; And And an unloading step of transferring the tray temporarily stored in the buffer space to the transfer module to discharge the processing substrate. The method of claim 11, The plasma processing step is performed in a high vacuum atmosphere, the other steps are plasma processing method, characterized in that performed in a low vacuum or atmospheric state. The method of claim 11, In the unloading step, And discharging the processing substrate and loading a third processing substrate.

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