CN2379914Y - Apparatus for assembling chip and having chip turning-over function - Google Patents
Apparatus for assembling chip and having chip turning-over function Download PDFInfo
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- CN2379914Y CN2379914Y CN 99214137 CN99214137U CN2379914Y CN 2379914 Y CN2379914 Y CN 2379914Y CN 99214137 CN99214137 CN 99214137 CN 99214137 U CN99214137 U CN 99214137U CN 2379914 Y CN2379914 Y CN 2379914Y
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Abstract
The utility model relates to a chip connecting device with a chip turning over function. The utility model is characterized in that a chip turning over unit is additionally arranged between an existing chip placing seat and a chip fine adjustment unit, a user can select to take out a chip from the chip placing seat and put the chip on the chip fine adjustment unit directly without the action of turning over the chip or select to take out the chip from the chip placing seat, put the chip on the chip turning over unit to carry out the action of turning over the chip firstly, and then place the chip on the chip fine adjustment unit through the control of a control unit, thus the turning over of a chip can be selected, and the utility model can be applied to the IC packaging where the chip is needed to be turned over and the IC packaging where the chip is not needed to be turned over.
Description
The utility model relates to a kind of chip join device with turning-over of chip function, refers to especially a kind of whether chip is separated, and selects will to relocate behind the chip turn-over in a suprabasil chip join device from disk.
General integrated circuit (Integrated Circuit, abbreviate IC as) encapsulation (Packaging) process, if the IC element with lead frame (Lead Frame) is an example, but summary is divided into chip adhesive (Die Bonding), wire-bonded (WireBonding), die casting (Molding), cutting (Cutting ﹠amp substantially; Trimming) and the clubfoot five big steps such as (Lead Forming) that are shaped.If with BGA ball grid array substrate (BallGrid Array Substrate, be called for short BGA) the IC potted element, the step that does not then have clubfoot to be shaped, but between molded and cutting step, increase the step that a soldered ball is connected (Solder BallAttaching).Wherein, because chips welding (promptly, chip is engaged with lead frame or substrate) setting accuracy, with directly having influence on the carrying out of subsequent manufacturing processes and finally encapsulating the reliability (Reliability) of finished product, be the problem that the IC encapsulation field is endeavoured to improve therefore always.
For example, Fig. 1 represents a kind of chip join device commonly used.Mainly be that a disk 1 (Wafer) that is divided into many chips 2 (Chip) unit is placed in a rotatable disk platform 3, be placed on the rotating platform 5 choosing a chip 2 on the disk platform 3 by a chip withdrawing device 4, after the angle location via position probing correcting device 6 adjustment chips 2, by a coupling device 7 chip 2 has been got and affixed on the lead frame 8 again.One of advantage of this chip join device, be that this disk platform 3 can be rotated motion, so that the chip 2 that will be scheduled to be removed moves to than near near the chip withdrawing device 4, so can shorten the shift motion of chip 2 withdrawing devices, and shorten chip adhesive process, raising packaging efficiency.And, more because dwindling of the required mobile working space of chip withdrawing device 4 makes that the volume design of chip join device is dwindled, to reduce taking of board space.In addition, because the disk 1 on the disk platform 3 is in the change that has after the rotation on the angle, therefore, can detect the angular deflection amount of the chip 2 on the rotating platform 5 at the position probing correcting device 6 on the rotating platform 5, and then rotated and be adjusted to accurate angle location, so just can improve the setting accuracy when chip 2 is engaged to lead frame 8, and can take into account the efficient that does not have influence on chip adhesive again.
But, chip join device as shown in Figure 1, the working face (Active Side promptly, has the face of integrated circuit configuration) that can only be applicable to traditional chip 2 up, and the non-working surface of chip 2 is attached at the conventional package structure on the lead frame 8 down.For some need be with chip 2 turn-overs, need make the working face of chip 2 be attached to the potted element of lead frame 8 (or substrate), chip join device commonly used shown in Figure 1 just can't reach this function fully.At present, for some lead-in wire (Lead On Chip on the substrate for example, abbreviation LOC), turning-over of chip (FlipChip) BGA ball grid array (BGA) or film auto-stitching (the Tape AutomatedBonding of part, be called for short TAB) potted element of form such as BGA ball grid array BGA, need to be mostly working face carry out the chip adhesive process towards the direction of lead frame (or substrate) with chip.Technology now except LOC be packaged with use with chip down, lead frame is in last mode, chip is conformed to up outside the chip adhesive mode of lead frame, the whirligig that other mode all involves with complexity comes turning-over of chip, chip turning device commonly used is except, complexity special because of designing make that cost increases, more, cause encapsulating the qualification rate or the reduction of chip adhesive efficient indirectly because the action of this upset will cause the increase of chip position error amount or increase operate time.
Except above-mentioned shortcoming, Chang Yong chip join device all has an identical shortcoming now, that is, prior art all must be designed a unique chip coupling device (chip adhesive) that is suitable at a certain IC encapsulating products.For example, tradition is used for carrying out turning-over of chip not and the non-working surface of chip is fitted in the chip join device of lead frame top down, need just can't be used to the IC encapsulating products of turning-over of chip.Vice versa, and those have chip turning device and the complicated chip join device of structure, and those do not need on the IC encapsulating products of turning-over of chip definitely can't to be diverted to production yet.Factory is in order to satisfy the requirement of client to the different IC encapsulating products, will because of the traditional die coupling device can not migrating property and be forced to buy more many chip adhesive apparatus, these at the different IC encapsulating products the chip adhesive apparatus bought respectively not only the most of the time is in idle state and causes taking of factory building space, and the raising, fund that more will cause equipment cost are idle, and the financial losses of equipment depreciation, are a great obstacle really for the raising of national manufacturer competitiveness in the world.
Therefore, main purpose of the present utility model provides a kind of chip join device with turning chip functions, not only the device of its chip upset is simple, cheap for manufacturing cost, even and chip still can carry out accurate localization adjustment action again after upset, guarantee the correctness of chip adhesive process, especially, the more important thing is, chip join device of the present utility model can be in carrying out the chip adhesive process, selection is overturn chip or do not overturn, therefore make chip join device of the present utility model applicable to the need upset or do not need on the IC encapsulating products of turning-over of chip, and can significantly reduce the cost of purchasing the chip join device, and the competitiveness of raising industry.
For reaching above-mentioned purpose, the chip join device of the turning chip functions of tool of the present utility model includes:
One puts core print seat, can carry a plurality of chips on it;
One chip fine-adjusting unit can carry a chip on it, and this chip fine-adjusting unit can position trimming movement to this chip that it carried, so that the angle of this chip accurately is adjusted to a predetermined angular;
One chip turn-over unit can carry out the 180 turn-over action backs of spending to the chip that it carried, chip is positioned on the chip fine-adjusting unit;
One chip is chosen the unit, can choose a chip and select and be placed on one of them of chip fine-adjusting unit and chip turn-over unit from putting core print seat;
One chip adhesive unit can take out and be engaged to a ground with the chip on the chip fine-adjusting unit.On (it can be lead frame or BGA ball grid array BGA substrate); And
One control unit is connected in aforementioned each unit with control and coordinate the action of each unit, and this control unit can send a control signal and indicates this chip to choose the unit chip is placed on chip fine-adjusting unit or the chip turn-over unit.Therefore, choose the unit by control unit indication chip chip be placed on the chip fine-adjusting unit, can make chip under the state that is not reversed, just by the chip adhesive unit with chip join to ground.And when control unit indication chip is chosen the unit chip is placed in chip turn-over unit, chip turn-over unit will be just placing behind the chip turn-over on the chip fine-adjusting unit, so the chip that the chip adhesive unit has been got will be by the chip of turn-over, and chip is pasted to ground with the ventricumbent direction of working.Thus, just having reached chip join device of the present utility model can select when carrying out the chip adhesive process the chip upset or the purpose of not overturning.And,, therefore more can guarantee the accuracy of chip adhesive because chip can come accurate position and the angle of adjusting chip via the chip fine-adjusting unit again behind turn-over.
Chip join device with turning-over of chip function of the present utility model, also include one and put a core print seat location adjustment unit and a disk detection and localization unit, this disk detection and localization unit is arranged at puts a suitable height on the core print seat, can detect the angle orientation of a plurality of chips of putting on the core print seat to be carried, and rotate this and put core print seat so that angle adjustment that will these a plurality of chips to predetermined angular, is chosen the unit for chip and chosen action by putting core print seat location adjustment unit.
This chip fine-adjusting unit includes a chip bearing platform and a plummer CD-ROM drive motor, and one suitably highly locates to be provided with a chip detection and localization unit on the chip bearing platform, used chip detection and localization unit comes the position of the chip that carried on the detection chip plummer, and, finely tune the accurate location of the chip on the chip bearing platform by the rotation of plummer drive motor chip bearing platform.
Wherein, this chip turn-over unit includes: a pivoted arm; One inhales the core pawl, is located at an end of pivoted arm; An and pivoted arm CD-ROM drive motor, can drive pivoted arm serves as that axle carries out pivoting action between a primary importance and a second place with its other end, just can choose the unit for chip when this pivoted arm is positioned at primary importance is placed in chip on the suction core pawl, and when pivoted arm is driven by the pivoted arm CD-ROM drive motor and turns round about 180 when spending to the second place, the chip of inhaling on the core pawl just in time is placed on the chip fine-adjusting unit with the state of putting upside down up and down.By this kind structure, the device of chip turn-over of the present utility model unit is simple relatively, the design of Control Software is easy and manufacturing cost is also cheaper.
This pivoted arm is about 180 degree by the anglec of rotation that primary importance is switched to the second place.
The suction core pawl of this pivoted arm is provided with the sucker of bleeding so that the chip on it adsorbs to be positioned to inhale on the core pawl, can make chip break away from suction core pawl by sucker being suspended bleed.
This chip join device more includes a chip adhesive detection and localization unit, and it is arranged at a suitable highly place on this ground, can be used for detecting ground and whether is positioned at predetermined chip adhesive position.
This chip adhesive unit includes: one gets chip apparatus, a ground conveying device, an and sizer, this ground conveying device is used for that a plurality of grounds are delivered to one one by one successively is scheduled to continue to deliver to predetermined chip adhesive position after gluing position, the gluing, and this is got chip apparatus and then is used for this ground that is positioned at predetermined chip adhesive position has been got and be engaged to the chip on the chip fine-adjusting unit.
This ground is a lead frame.
This ground is a BGA BGA ball grid array substrate.
In sum, chip join device of the present utility model, not only the device of chip upset is simple, cheap for manufacturing cost, even and the accurate adjustment that chip still can position after upset is again moved, guarantee the good rate of chip adhesive process, especially the more important thing is, chip join device of the present utility model can be in carrying out the chip adhesive process, selection is overturn chip or do not overturn, therefore make chip join device of the present utility model applicable to the need upset or do not need on the IC encapsulating products of turning-over of chip, thereby can significantly reduce the cost of purchasing the chip join device, and the raising industrial competitiveness, all shortcomings that overcome prior art fully and had.
Be described with reference to the accompanying drawings the utility model by the following examples:
Fig. 1 is a chip join schematic representation of apparatus in the past;
Fig. 2 is a preferred embodiment schematic diagram of chip join device of the present utility model;
Fig. 3 is the action schematic diagram of the chip turn-over unit in the chip join device of the present utility model.
The principal character of the chip join device with turning chip functions that the utility model proposed is to put between core print seat and the chip fine-adjusting unit known, sets up a chip turn-over unit.And, control by a control unit, can select a chip directly is put in after core print seat takes out on the chip fine-adjusting unit and skips the action of chip upset or select this chip is carried out on the chip turn-over unit being positioned on the chip fine-adjusting unit after the turn-over action by putting to be put in earlier after core print seat takes out again by putting, so just can reach whether the purpose that the angle location error that chip upset back is produced is finely tuned correction being selected and taken into account simultaneously again in the chip upset.
Fig. 2 and Fig. 3 are the preferred embodiment with chip join device 20 of turning-over of chip function of the present utility model, mainly include: one puts core print seat 21, puts core print seat location adjustment unit 22, a disk detection and localization unit 23, a chip and chooses unit 24, a chip turn-over unit 25, a chip fine-adjusting unit 26, a chip detection and localization unit 27, a chip adhesive unit 28, a chip adhesive detection and localization unit 29, an and control unit 30.This control unit 30 is connected in aforesaid each unit to control and to coordinate the action of each unit.
This is put can carry a disk 31 (Wafer) on the core print seat 21, this disk 31 is cut into the separable chip 32 of a plurality of independences (Chip, or be called Die) in advance.Be connected with this and put core print seat location adjustment unit 22 and disk detection and localization unit 23 putting core print seat 21.Disk detection and localization unit 23 is arranged at puts a suitable height on the core print seat 21, can detect the angle orientation of putting a plurality of chips 32 of being placed on the core print seat 21, and by put 22 rotations of core print seat location adjustment unit this put core print seat 21 in case with the angle adjustment of a plurality of chips 32 to predetermined angular, choose unit 24 for this chip and choose action.Thisly rotate one of this benefit of putting core print seat 21 by putting core print seat location adjustment unit 22, be that the chip of putting on the core print seat 21 32 can be rotated near locating than the service position of choosing unit 24 near chip, so just can shorten chip chooses the round trip that chip 32 required displacements are chosen in unit 24, except that therefore speed-up chip binding speed, required working space in the time of also can reducing chip because of the shortening of shift motion and choose unit 24 action, make that the volume design of chip join device is dwindled, in addition, more can reduce the degree of difficulty of gallery device design.
This chip is chosen unit 24, can choose a chip 32 on the core print seat 21 and selects to be seated on one of them of chip fine-adjusting unit 26 and chip turn-over unit 25 by putting.It is one by several servo motor institute driven mechanical hand arms that this chip is chosen unit 24, can carry out the translational motion of the axial longer distance of X-Y as shown in Figure 2 and the small size handling action on the Z-direction, because it is very general device on the existing chip coupling device that the arm-type chip of this manipulator is chosen unit 24, be not major technique feature of the present utility model, so will do not stated at this.
Can be placed with a chip (not shown) on this chip fine-adjusting unit 26, and this chip fine-adjusting unit 26 can position trimming movement to this chip that it carried, so that the angle of this chip accurately is adjusted to a predetermined angular.In this preferred embodiment, this chip fine-adjusting unit 26 includes a chip bearing platform 261 and a plummer drive motors 262, and a suitable highly place more is provided with this chip detection and localization unit 27 on chip bearing platform 261.This chip detection and localization unit 27 can be a vision checking device, it can catch the peripheral shape position or the gauge point position (not shown) of the chip that is carried on the chip bearing platform 261, and carry out with this vision checking device in store recording contrast to obtain a poor location value, just rotate by plummer drive motors 262 chip for driving plummers 261 then, fall within the allowable range of being scheduled to up to aforesaid angle location difference, that is to say, the position location of the chip that is captured by chip detection and localization unit 27 (vision checking device) and the location difference between its stored record material less than to a certain degree the time (, when the position is identical) till, so just can reach the purpose of finely tuning the accurate angle location of the chip on the chip bearing platform 261 with chip detection and localization unit 27 and chip fine-adjusting unit 26.
This chip adhesive unit 28 can take out the chip that is positioned on the chip fine-adjusting unit 26 and be engaged on the ground 33.In a preferred embodiment, it is IC encapsulation (Packaging) process of ground 33 that chip join device 20 of the present utility model applies to lead frame (Lead Frame).Yet, anyly have the knack of the semiconductor packaging personnel, can show and chip join device 20 of the present utility model is applied to BGA ball grid array (BGA) IC encapsulation process with easily knowing, then be with the BGA substrate this moment, or film auto-stitching formula substrate (TAB Tape) is as the aforementioned ground 33 that is used for joint chip.
In this preferred embodiment, this chip adhesive unit 28 can include: one gets chip apparatus 281, a ground conveying device 282, an and sizer 283.This ground conveying device 282 is delivered to a predetermined gluing position singly successively with a plurality of grounds 33, this ground 33 by 283 pairs of predetermined gluings of sizer position carries out gluing, promptly, (for example be covered with non-conductive binding material, be commonly called as and be the epoxy resin Epoxy of elargol liquid or hot melt two-sided tape Dual-SidedAdhesive Tape etc.) after, continue ground 33 is delivered to a predetermined chip adhesive position by ground conveying device 282 again.This gets chip apparatus 281 as shown in Figure 2, is generally a mechanical arm that can carry out the translational motion and the small size handling action on the Z-direction of the axial longer distance of X-Y.This is got chip apparatus 281 and the chip on the chip fine-adjusting unit 26 has been got and has been engaged on this ground 33 that is positioned at predetermined chip adhesive position, to finish the chip adhesive process of IC encapsulation.It should be noted that, this is got chip apparatus 281 and is getting and moving to chip the process of this predetermined chip adhesive position from chip fine-adjusting unit 26, also will be simultaneously to this chip the X-Y direction of principal axis the position error that may have adjust, to guarantee the accuracy of chip adhesive process.Afterwards, this ground 33 will according to actual needs and further toast (for lead-in wire posture IC) or reflow (for TAB BGA IC encapsulation) or other relevant subsequent process together with chip, because this part has not been a technical characterictic of the present utility model, so will no longer be stated at this.
In preferred embodiment, this chip join device 20 also can include a chip adhesive detection and localization unit 29, it can be one and is similar to aforesaid vision checking device, and be arranged at top, aforementioned predetermined chip adhesive position one and suitably highly locate, can be used for detecting whether ground 33 is positioned at predetermined chip adhesive position or whether this chip adhesive unit 28 is engaged to chip 32 on the tram of ground 33.
Main being characterised in that of the present utility model, this chip join device 20 of the present utility model also includes a chip turn-over unit 25, it is arranged at chip and chooses between unit 24 and the chip fine-adjusting unit 26, can carry out the turn-over action of 180 degree to a chip 32, and, control unit 30 of the present utility model can send a control signal, " selection " indication is placed directly into chip fine-adjusting unit 26 on (not turning-over of chip) by putting after core print seat 21 takes out with chip 32, or chip 32 is put into earlier on the chip turn-over unit 25 undertaken being put on the chip fine-adjusting unit 26 after the turn-over action by it again.And, because therefore chip 32 can more can guarantee the accuracy of chip adhesive again via chip fine-adjusting unit 26 accurate position and the angles of adjusting chip behind turn-over.
Fig. 2 and Fig. 3 represent a preferred embodiment of chip turn-over of the present utility model unit 25, and this chip turn-over unit 25 includes: a pivoted arm 251, inhale core pawl 252 be located at an end of pivoted arm 251, and a pivoted arm CD-ROM drive motor 253 can to drive pivoted arm 251 serve as spool to carry out pivoting action between the primary importance and the second place with its other end 254.Because this pivoted arm 251 is about 180 degree by the anglec of rotation that primary importance is switched to the second place, therefore can reach the purpose of the start face of chip just in time being turned over turnback.Pivoted arm 251 structures by this 180 degree rotations are come turning-over of chip, the design of can make the device of chip turn-over of the present utility model unit 25 simple relatively (only needing to drive pivoted arms 251 by a motor 253 pivot), Control Software is (swing offset that one dimension is only arranged does not have the translational motion of collocation X, Y or Z axle) and low manufacturing cost easily.
The suction core pawl 252 of this pivoted arm 251 is provided with the sucker that can bleed so that the chip on it (not shown) absorption is positioned to inhale on the core pawl 252, can make chip break away from suction core pawl 252 by sucker being suspended bleed, so just can reach the purpose that takes, puts a chip with suction core pawl 252.
When this pivoted arm 251 is positioned at primary importance, can chooses unit 24 for chip just and chip 32 is placed in inhales on the core pawl 252, and draw fixed chip and make it be unlikely to break away from pivoted arm 251 by inhaling core pawl 252.Then, when driving these pivoted arm 251 gyrations to the second place by pivoted arm CD-ROM drive motor 253, the chip of inhaling on the core pawl 252 just in time is placed on the chip fine-adjusting unit 26 with the state of putting upside down up and down, inhales core pawl 252 then and just chip is released on the chip fine-adjusting unit 26.And carry out the accurate angle location adjustment action of this chip by chip fine-adjusting unit 26.
By the above as can be known, when operator (User) desires to carry out the IC encapsulation process of a turning-over of chip, the operator is as long as assign an instruction to control unit 30, control unit 30 just can be according to its inner program of setting up, going control chip to choose unit 24 is placed in chip 32 on the suction core pawl 252, so, this chip just can carry out the location adjustment of follow-up chip fine-adjusting unit 26 and the chip adhesive action of chip adhesive unit 28 afterwards again along with the gyration of pivoted arm 251 by chip turn-over unit 25 turn-overs.When if operator (User) wants to carry out the IC encapsulation process of turning-over of chip not, the operator is as long as assign another instruction to control unit 30, control unit 30 just can be according to its inner program of setting up, going control chip to choose unit 24 directly is placed in chip 32 on the chip fine-adjusting unit 26, and the location adjustment of chip fine-adjusting unit 26 and the chip adhesive action of chip adhesive unit 28 are only directly carried out in the action of omitting the chip turn-over.Thus, the chip join device 20 of the utility model just can reach the purpose that selection is overturn chip or do not overturn when carrying out the chip adhesive process easily.And,, therefore more can guarantee the accuracy that microarray biochip is bonding because chip 32 can accurately be adjusted chip in the axial position error of X-Y via the angle of chip fine-adjusting unit 26 accurate adjustment chips 32 and by getting chip apparatus 281 again behind turn-over.
What one of value was carried is, though the chip join device 20 with turning-over of chip function of the present utility model has increased by a chip turn-over unit 25, yet but can not have influence on chip adhesive efficient, this be because chip of the present utility model choose unit 24, chip turn-over unit 25, and the action of chip adhesive unit 28 can carry out simultaneously in fact.That is to say, after chip is chosen unit 24 and chip is positioned over chip turn-over unit 25, though chip turn-over unit 25 then can be with the chip turn-over on chip fine-adjusting unit 26, yet chip was chosen unit 24 and can be got back to again simultaneously and put core print seat 21 and choose next chip and need not wait for that the action of chip turn-over unit 25 finishes this moment, certainly, when chip adhesive unit 28 when carrying out the chip adhesive process of last chip, the turn-over action of next chip is also being handled simultaneously in chip turn-over unit 25.Therefore can cause the reduction of chip adhesive efficient hardly.
Certainly, the above only is preferred embodiment of the present utility model, should not think the qualification to scope of the present utility model.So all parts of doing according to content of the present utility model are revised, and when not running counter to spirit of the present utility model, all should belong to protection range of the present utility model.
Claims (10)
1. chip join device with turning-over of chip function, comprise: one can carry putting core print seat, and can choosing the chip of a chip and choose unit, a chip fine-adjusting unit and the chip adhesive unit that the chip on the chip fine-adjusting unit can be got and is engaged on the ground that can finely tune chip location from putting core print seat of a plurality of chips, it is characterized in that:
This chip join device also includes a chip turn-over unit, and this chip turn-over unit is arranged at chip and chooses between unit and the chip fine-adjusting unit.
2. require 1 described chip join device with turning-over of chip function as the right profit, it is characterized in that, also include one and put a core print seat location adjustment unit and a disk detection and localization unit, this disk detection and localization unit is arranged at puts a suitable height on the core print seat.
3. the chip join device with turning-over of chip function as claimed in claim 1, it is characterized in that, this chip fine-adjusting unit includes a chip bearing platform and a plummer CD-ROM drive motor, and a suitable highly place is provided with a chip detection and localization unit on the chip bearing platform.
4. the chip join device with turning-over of chip function as claimed in claim 1 is characterized in that, this chip turn-over unit includes: a pivoted arm; One inhales the core pawl, is located at an end of pivoted arm; An and pivoted arm CD-ROM drive motor.
5. the chip join device with turning-over of chip function as claimed in claim 4 is characterized in that, this pivoted arm is about 180 degree by the anglec of rotation that primary importance is switched to the second place.
6. the chip join device with turning-over of chip function as claimed in claim 4 is characterized in that, the suction core pawl of this pivoted arm is provided with the sucker of bleeding.
7. the chip join device with turning-over of chip function as claimed in claim 1 is characterized in that, this chip join device also includes a chip adhesive detection and localization unit, and this chip adhesive detection and localization unit is arranged at a suitable highly place on this ground.
8. the chip join device with turning-over of chip function as claimed in claim 1 is characterized in that, this chip adhesive unit includes: one gets chip apparatus, a ground conveying device, an and sizer.
9. the chip join device with turning-over of chip function as claimed in claim 1 is characterized in that this ground is a lead frame.
10. the chip join device with turning-over of chip function as claimed in claim 1 is characterized in that, this ground is a BGA ball grid array substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 99214137 CN2379914Y (en) | 1999-06-14 | 1999-06-14 | Apparatus for assembling chip and having chip turning-over function |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 99214137 CN2379914Y (en) | 1999-06-14 | 1999-06-14 | Apparatus for assembling chip and having chip turning-over function |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2379914Y true CN2379914Y (en) | 2000-05-24 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 99214137 Expired - Fee Related CN2379914Y (en) | 1999-06-14 | 1999-06-14 | Apparatus for assembling chip and having chip turning-over function |
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| Country | Link |
|---|---|
| CN (1) | CN2379914Y (en) |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN103137502A (en) * | 2013-03-07 | 2013-06-05 | 苏州均华精密机械有限公司 | Chip seaming device |
| CN103183228A (en) * | 2011-12-30 | 2013-07-03 | 旺矽科技股份有限公司 | Feeding mechanism for photoelectric component testing machine table |
| CN105174161A (en) * | 2015-09-25 | 2015-12-23 | 西安立芯光电科技有限公司 | Sample stand overturning device |
| CN106057717A (en) * | 2016-07-28 | 2016-10-26 | 合肥矽迈微电子科技有限公司 | Chip taking and placing device |
| CN106057709A (en) * | 2016-07-28 | 2016-10-26 | 合肥矽迈微电子科技有限公司 | Chip mounting equipment and application thereof |
| CN106206392A (en) * | 2015-05-07 | 2016-12-07 | 梭特科技股份有限公司 | Crystal grain location advancing equipment and crystal grain location method for arranging |
| CN107093574A (en) * | 2017-04-02 | 2017-08-25 | 华天恒芯半导体（厦门）有限公司 | A kind of chip bonding device with chip turning function |
| CN107452644A (en) * | 2016-05-31 | 2017-12-08 | 上海微电子装备（集团）股份有限公司 | Split type chip support plate carries bonding apparatus |
| CN107871684A (en) * | 2016-09-26 | 2018-04-03 | 捷进科技有限公司 | The manufacture method of flip-chip placement equipment and semiconductor devices |
| CN109037135A (en) * | 2018-06-07 | 2018-12-18 | 无锡思锐电子设备科技有限公司 | A kind of silicon wafer turnover mechanism |
| CN110582382A (en) * | 2017-04-23 | 2019-12-17 | 富兰卡爱米卡股份有限公司 | Apparatus and method for electrical inspection of electrical components |
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1999
- 1999-06-14 CN CN 99214137 patent/CN2379914Y/en not_active Expired - Fee Related
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103183228A (en) * | 2011-12-30 | 2013-07-03 | 旺矽科技股份有限公司 | Feeding mechanism for photoelectric component testing machine table |
| CN103183228B (en) * | 2011-12-30 | 2015-11-18 | 旺矽科技股份有限公司 | Feeding mechanism for photoelectric component testing machine table |
| CN103137502B (en) * | 2013-03-07 | 2015-12-09 | 苏州均华精密机械有限公司 | Chip bonding device |
| CN103137502A (en) * | 2013-03-07 | 2013-06-05 | 苏州均华精密机械有限公司 | Chip seaming device |
| CN106206392A (en) * | 2015-05-07 | 2016-12-07 | 梭特科技股份有限公司 | Crystal grain location advancing equipment and crystal grain location method for arranging |
| CN105174161A (en) * | 2015-09-25 | 2015-12-23 | 西安立芯光电科技有限公司 | Sample stand overturning device |
| CN107452644A (en) * | 2016-05-31 | 2017-12-08 | 上海微电子装备（集团）股份有限公司 | Split type chip support plate carries bonding apparatus |
| CN106057709A (en) * | 2016-07-28 | 2016-10-26 | 合肥矽迈微电子科技有限公司 | Chip mounting equipment and application thereof |
| CN106057717A (en) * | 2016-07-28 | 2016-10-26 | 合肥矽迈微电子科技有限公司 | Chip taking and placing device |
| CN107871684A (en) * | 2016-09-26 | 2018-04-03 | 捷进科技有限公司 | The manufacture method of flip-chip placement equipment and semiconductor devices |
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| CN110582382A (en) * | 2017-04-23 | 2019-12-17 | 富兰卡爱米卡股份有限公司 | Apparatus and method for electrical inspection of electrical components |
| US11845185B2 (en) | 2017-04-23 | 2023-12-19 | Franka Emika Gmbh | Device and method for the electrical testing of an electrical component |
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