CN107093574A - A kind of chip bonding device with chip turning function - Google Patents
A kind of chip bonding device with chip turning function Download PDFInfo
- Publication number
- CN107093574A CN107093574A CN201710214933.4A CN201710214933A CN107093574A CN 107093574 A CN107093574 A CN 107093574A CN 201710214933 A CN201710214933 A CN 201710214933A CN 107093574 A CN107093574 A CN 107093574A
- Authority
- CN
- China
- Prior art keywords
- handgrip
- chip
- electric drive
- drive hydraulic
- hydraulic thruster
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Earth Drilling (AREA)
Abstract
The invention discloses a kind of chip bonding device with chip turning function, including work top and processor, the work top left side is vertically connected with support column, the plan vertical of the support column is connected with carrying cross bar, the first electric drive hydraulic thruster is installed with above the carrying cross bar left end, the right-hand member of first electric drive hydraulic thruster is fixedly connected with stepper motor, the stepper motor is connected with rotating disk by rotating bar, the second electric drive hydraulic thruster is fixedly connected with the rotating disk, micro air pump is fixedly installed on second electric drive hydraulic thruster, the second electric drive hydraulic thruster bottom is installed with handgrip chamber, the handgrip intracavitary is provided with handgrip, and connected between handgrip and handgrip chamber by spring, miniature air bag is provided between the handgrip, the miniature air bag is connected with micro air pump.The present invention can carry out the movement and upset of plane to chip, and horizontal move up is carried out using the first electric drive hydraulic thruster.
Description
Technical field
The present invention relates to chip application technical field, specially a kind of chip bonding device with chip turning function.
Background technology
Chip is the soul of electronic system, and the application field that chip technology has been carried out and will carried out is very extensive,
Our life can not leave chip, such as our mobile phone, computer, automobile, chip is mounted on, without chip
The life of people will not be so convenient, and chip has obverse and reverse, is required to overturn it in manufacture and installation process
Operation, these work can not be carried out with hand, and spot or sweat on hand can be polluted to chip, and the present invention proposes a kind of
Chip bonding device with chip turning function.
The content of the invention
It is an object of the invention to provide a kind of chip bonding device with chip turning function, to solve above-mentioned background
The problem of being proposed in technology.
To achieve the above object, the present invention provides following technical scheme：A kind of chip engagement with chip turning function
Device, including work top and processor, the work top left side are vertically connected with support column, and the top of the support column is hung down
Direct-connected be connected to above carrying cross bar, the carrying cross bar left end is installed with the first electric drive hydraulic thruster, and described first is electronic
The right-hand member of hydraulic push rod is fixedly connected with stepper motor, and the stepper motor is connected with rotating disk, the rotating disk by rotating bar
It is fixedly connected with the second electric drive hydraulic thruster, second electric drive hydraulic thruster and is fixedly installed micro air pump, described second
Electric drive hydraulic thruster bottom is installed with handgrip chamber, and the handgrip intracavitary, which is provided between handgrip, and handgrip and handgrip chamber, leads to
Cross between spring connection, the handgrip and be provided with miniature air bag, the miniature air bag is connected with micro air pump, the processing
Device is electrically connected with actuator, and first electric drive hydraulic thruster, stepper motor, the second electric drive hydraulic thruster and micro air pump are equal
It is electrically connected with actuator.
It is preferred that, the handgrip is provided with four, and uniform arrangement.
It is preferred that, be provided with below the stepper motor on pulley, the carrying cross bar and offer chute, the pulley with
Slide is connected.
It is preferred that, the rotating disk is arranged on the outside of carrying cross bar.
It is preferred that, the miniature air bag is fitted with handgrip.
Compared with prior art, the beneficial effects of the invention are as follows：The present invention can carry out the movement and upset of plane to chip,
Moved up using the progress of the first electric drive hydraulic thruster is horizontal, can more accurately be clamped to chip, stepper motor drives rotating disk to rotate,
The upset of chip is realized, the another side of chip can be handled, use handgrip grab chips, the internal structure to chip will not be made
Into damage, the operation after chip upset is also convenient for.
Brief description of the drawings
Fig. 1 is main structure body schematic diagram of the present invention；
Fig. 2 carries the schematic diagram of cross bar for the present invention；
Fig. 3 is the cut-away view of handgrip chamber of the present invention；
Fig. 4 carries the sectional view of cross bar for the present invention；
Fig. 5 is fundamental diagram of the present invention.
In figure：1 work top, 2 support columns, 3 carrying cross bars, 4 first electric drive hydraulic thrusters, 5 stepper motors, 6 pulleys, 7
Chute, 8 rotating disks, 9 second electric drive hydraulic thrusters, 10 handgrip chambers, 11 micro air pumps, 12 handgrips, 13 miniature air bags, 14 springs, 15
Processor, 16 actuators.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete
Site preparation is described, it is clear that described embodiment is only a part of embodiment of the invention, rather than whole embodiments.It is based on
Embodiment in invention, the every other reality that those of ordinary skill in the art are obtained under the premise of creative work is not made
Example is applied, the scope of protection of the invention is belonged to.
Fig. 1-5 are referred to, the present invention provides a kind of technical scheme：A kind of chip engagement dress with chip turning function
Put, including work top 1 and processor 15, the left side of work top 1 is vertically connected with support column 2, the top of the support column 2
Portion, which is vertically connected with above carrying cross bar 3, carrying cross bar 3 left end, is installed with the first electric drive hydraulic thruster 4, and described the
The right-hand member of one electric drive hydraulic thruster 4 is fixedly connected with stepper motor 5, and the lower section of stepper motor 5 is provided with pulley 6, described to hold
Carry and offer chute 7 on cross bar 3, the pulley 6 is slidably connected with chute 7, reduce stepper motor 5 to the first electric drive hydraulic thruster
4 pressure brought, the stepper motor 5 is connected with rotating disk 8 by rotating bar, and the rotating disk 8 is arranged on the outer of carrying cross bar 3
Side, prevents when rotating disk 8 from rotating having the second electric drive hydraulic thruster 9 is fixedly connected with friction, the rotating disk 8 with cross bar 3, described the
Micro air pump 11 is fixedly installed on two electric drive hydraulic thrusters 9, the bottom of the second electric drive hydraulic thruster 9 is installed with handgrip
Handgrip 12 is provided with chamber 10, the handgrip chamber 10, the handgrip 12 is provided with four, and uniform arrangement, the He of handgrip 12
By the elastic connection of spring 14 between handgrip chamber 10, miniature air bag 13, the miniature air bag 13 are provided between the handgrip 12
Fit, the miniature air bag 13 is connected with micro air pump 11, realized by the cooperation of spring 14 and miniature air bag 13 with handgrip 12
The clamping action of device, spring 14 plays a part of fixed and buffered, and the processor 15 is electrically connected with actuator 16, described
First electric drive hydraulic thruster 4, stepper motor 5, the second electric drive hydraulic thruster 9 and micro air pump 11 electrically connect with actuator 16
Connect.
Operation principle：Micro air pump 11 is deflated to miniature air bag 13, shrinks miniature air bag 13, the grab chips of handgrip 12,
Stepper motor 5 drives rotating disk 8 to rotate 180 °, realizes the upset of chip, the processing after being overturn to chip, 5 turns of stepper motor
Original position is moved go back to, by the flexible of the first electric drive hydraulic thruster 4, chip specific station is loaded into, micro air pump 11 gives miniature gas
Capsule 13 is inflated, and expands miniature air bag 13, and handgrip 12 unclamps, and chip can be installed to specific position.
Although an embodiment of the present invention has been shown and described, for the ordinary skill in the art, can be with
A variety of changes, modification can be carried out to these embodiments, replace without departing from the principles and spirit of the present invention by understanding
And modification, the scope of the present invention is defined by the appended.
Claims (5)
1. a kind of chip bonding device with chip turning function, including work top（1）And processor（15）, its feature exists
In：The work top（1）The left side is vertically connected with support column（2）, the support column（2）Plan vertical to be connected with carrying horizontal
Bar（3）, the carrying cross bar（3）The first electric drive hydraulic thruster is installed with above left end（4）, first electric hydaulic pushes away
Bar（4）Right-hand member be fixedly connected with stepper motor（5）, the stepper motor（5）Rotating disk is connected with by rotating bar（8）, it is described
Rotating disk（8）On be fixedly connected with the second electric drive hydraulic thruster（9）, second electric drive hydraulic thruster（9）On be fixedly installed it is micro-
Type air pump（11）, second electric drive hydraulic thruster（9）Bottom is installed with handgrip chamber（10）, the handgrip chamber（10）Inside set
It is equipped with handgrip（12）, and handgrip（12）With handgrip chamber（10）Between pass through spring（14）Elastic connection, the handgrip（12）Between
It is provided with miniature air bag（13）, the miniature air bag（13）With micro air pump（11）Connection, the processor（15）It is electrically connected with
There is actuator（16）, first electric drive hydraulic thruster（4）, stepper motor（5）, the second electric drive hydraulic thruster（9）With miniature gas
Pump（11）And actuator（16）It is electrically connected with.
2. a kind of chip bonding device with chip turning function according to claim 1, it is characterised in that：It is described to grab
Hand（12）It is provided with four, and uniform arrangement.
3. a kind of chip bonding device with chip turning function according to claim 1, it is characterised in that：The step
Stepper motor（5）Lower section is provided with pulley（6）, the carrying cross bar（3）On offer chute（7）, the pulley（6）With chute
（7）It is slidably connected.
4. a kind of chip bonding device with chip turning function according to claim 1, it is characterised in that：Described turn
Disk（8）It is arranged on carrying cross bar（3）Outside.
5. a kind of chip bonding device with chip turning function according to claim 1, it is characterised in that：It is described micro-
Type air bag（13）With handgrip（12）Laminating.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710214933.4A CN107093574A (en) | 2017-04-02 | 2017-04-02 | A kind of chip bonding device with chip turning function |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710214933.4A CN107093574A (en) | 2017-04-02 | 2017-04-02 | A kind of chip bonding device with chip turning function |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107093574A true CN107093574A (en) | 2017-08-25 |
Family
ID=59646357
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710214933.4A Pending CN107093574A (en) | 2017-04-02 | 2017-04-02 | A kind of chip bonding device with chip turning function |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107093574A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107968064A (en) * | 2017-11-27 | 2018-04-27 | 乐山新天源太阳能科技有限公司 | Silicon wafer wool making transfer device |
| CN112378307A (en) * | 2020-10-27 | 2021-02-19 | 无锡凯伦纳弹簧有限公司 | Automatic grabbing and aligning device |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2379914Y (en) * | 1999-06-14 | 2000-05-24 | 华东半导体工业股份有限公司 | Apparatus for assembling chip and having chip turning-over function |
| CN201406201Y (en) * | 2009-05-07 | 2010-02-17 | 深圳市比克电池有限公司 | Self-turning baiting device |
| CN104891180A (en) * | 2015-06-02 | 2015-09-09 | 吴江市七都镇庙港雅迪针织制衣厂 | Cloth roll lifting frame |
| CN106115260A (en) * | 2016-08-17 | 2016-11-16 | 华天科技（昆山）电子有限公司 | Device high speed fetching device |
| CN205854327U (en) * | 2016-08-02 | 2017-01-04 | 安徽德锐仕机床制造有限公司 | A kind of automobile engine cylinder-body fixture of easy processing |
| CN205969004U (en) * | 2016-08-11 | 2017-02-22 | 无锡百禾工业机器人有限公司 | Suspension type power -assisted machine hand |
-
2017
- 2017-04-02 CN CN201710214933.4A patent/CN107093574A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2379914Y (en) * | 1999-06-14 | 2000-05-24 | 华东半导体工业股份有限公司 | Apparatus for assembling chip and having chip turning-over function |
| CN201406201Y (en) * | 2009-05-07 | 2010-02-17 | 深圳市比克电池有限公司 | Self-turning baiting device |
| CN104891180A (en) * | 2015-06-02 | 2015-09-09 | 吴江市七都镇庙港雅迪针织制衣厂 | Cloth roll lifting frame |
| CN205854327U (en) * | 2016-08-02 | 2017-01-04 | 安徽德锐仕机床制造有限公司 | A kind of automobile engine cylinder-body fixture of easy processing |
| CN205969004U (en) * | 2016-08-11 | 2017-02-22 | 无锡百禾工业机器人有限公司 | Suspension type power -assisted machine hand |
| CN106115260A (en) * | 2016-08-17 | 2016-11-16 | 华天科技（昆山）电子有限公司 | Device high speed fetching device |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107968064A (en) * | 2017-11-27 | 2018-04-27 | 乐山新天源太阳能科技有限公司 | Silicon wafer wool making transfer device |
| CN112378307A (en) * | 2020-10-27 | 2021-02-19 | 无锡凯伦纳弹簧有限公司 | Automatic grabbing and aligning device |
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|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20170825 |
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| WD01 | Invention patent application deemed withdrawn after publication |