CN107093574A - A kind of chip bonding device with chip turning function - Google Patents

A kind of chip bonding device with chip turning function Download PDF

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Publication number
CN107093574A
CN107093574A CN201710214933.4A CN201710214933A CN107093574A CN 107093574 A CN107093574 A CN 107093574A CN 201710214933 A CN201710214933 A CN 201710214933A CN 107093574 A CN107093574 A CN 107093574A
Authority
CN
China
Prior art keywords
handgrip
chip
electric drive
drive hydraulic
hydraulic thruster
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201710214933.4A
Other languages
Chinese (zh)
Inventor
卓廷厚
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Alex Hua Tian Constant Core Semiconductor (xiamen) Co Ltd
Original Assignee
Alex Hua Tian Constant Core Semiconductor (xiamen) Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alex Hua Tian Constant Core Semiconductor (xiamen) Co Ltd filed Critical Alex Hua Tian Constant Core Semiconductor (xiamen) Co Ltd
Priority to CN201710214933.4A priority Critical patent/CN107093574A/en
Publication of CN107093574A publication Critical patent/CN107093574A/en
Pending legal-status Critical Current

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Earth Drilling (AREA)

Abstract

The invention discloses a kind of chip bonding device with chip turning function, including work top and processor, the work top left side is vertically connected with support column, the plan vertical of the support column is connected with carrying cross bar, the first electric drive hydraulic thruster is installed with above the carrying cross bar left end, the right-hand member of first electric drive hydraulic thruster is fixedly connected with stepper motor, the stepper motor is connected with rotating disk by rotating bar, the second electric drive hydraulic thruster is fixedly connected with the rotating disk, micro air pump is fixedly installed on second electric drive hydraulic thruster, the second electric drive hydraulic thruster bottom is installed with handgrip chamber, the handgrip intracavitary is provided with handgrip, and connected between handgrip and handgrip chamber by spring, miniature air bag is provided between the handgrip, the miniature air bag is connected with micro air pump.The present invention can carry out the movement and upset of plane to chip, and horizontal move up is carried out using the first electric drive hydraulic thruster.

Description

A kind of chip bonding device with chip turning function
Technical field
The present invention relates to chip application technical field, specially a kind of chip bonding device with chip turning function.
Background technology
Chip is the soul of electronic system, and the application field that chip technology has been carried out and will carried out is very extensive, Our life can not leave chip, such as our mobile phone, computer, automobile, chip is mounted on, without chip The life of people will not be so convenient, and chip has obverse and reverse, is required to overturn it in manufacture and installation process Operation, these work can not be carried out with hand, and spot or sweat on hand can be polluted to chip, and the present invention proposes a kind of Chip bonding device with chip turning function.
The content of the invention
It is an object of the invention to provide a kind of chip bonding device with chip turning function, to solve above-mentioned background The problem of being proposed in technology.
To achieve the above object, the present invention provides following technical scheme:A kind of chip engagement with chip turning function Device, including work top and processor, the work top left side are vertically connected with support column, and the top of the support column is hung down Direct-connected be connected to above carrying cross bar, the carrying cross bar left end is installed with the first electric drive hydraulic thruster, and described first is electronic The right-hand member of hydraulic push rod is fixedly connected with stepper motor, and the stepper motor is connected with rotating disk, the rotating disk by rotating bar It is fixedly connected with the second electric drive hydraulic thruster, second electric drive hydraulic thruster and is fixedly installed micro air pump, described second Electric drive hydraulic thruster bottom is installed with handgrip chamber, and the handgrip intracavitary, which is provided between handgrip, and handgrip and handgrip chamber, leads to Cross between spring connection, the handgrip and be provided with miniature air bag, the miniature air bag is connected with micro air pump, the processing Device is electrically connected with actuator, and first electric drive hydraulic thruster, stepper motor, the second electric drive hydraulic thruster and micro air pump are equal It is electrically connected with actuator.
It is preferred that, the handgrip is provided with four, and uniform arrangement.
It is preferred that, be provided with below the stepper motor on pulley, the carrying cross bar and offer chute, the pulley with Slide is connected.
It is preferred that, the rotating disk is arranged on the outside of carrying cross bar.
It is preferred that, the miniature air bag is fitted with handgrip.
Compared with prior art, the beneficial effects of the invention are as follows:The present invention can carry out the movement and upset of plane to chip, Moved up using the progress of the first electric drive hydraulic thruster is horizontal, can more accurately be clamped to chip, stepper motor drives rotating disk to rotate, The upset of chip is realized, the another side of chip can be handled, use handgrip grab chips, the internal structure to chip will not be made Into damage, the operation after chip upset is also convenient for.
Brief description of the drawings
Fig. 1 is main structure body schematic diagram of the present invention;
Fig. 2 carries the schematic diagram of cross bar for the present invention;
Fig. 3 is the cut-away view of handgrip chamber of the present invention;
Fig. 4 carries the sectional view of cross bar for the present invention;
Fig. 5 is fundamental diagram of the present invention.
In figure:1 work top, 2 support columns, 3 carrying cross bars, 4 first electric drive hydraulic thrusters, 5 stepper motors, 6 pulleys, 7 Chute, 8 rotating disks, 9 second electric drive hydraulic thrusters, 10 handgrip chambers, 11 micro air pumps, 12 handgrips, 13 miniature air bags, 14 springs, 15 Processor, 16 actuators.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete Site preparation is described, it is clear that described embodiment is only a part of embodiment of the invention, rather than whole embodiments.It is based on Embodiment in invention, the every other reality that those of ordinary skill in the art are obtained under the premise of creative work is not made Example is applied, the scope of protection of the invention is belonged to.
Fig. 1-5 are referred to, the present invention provides a kind of technical scheme:A kind of chip engagement dress with chip turning function Put, including work top 1 and processor 15, the left side of work top 1 is vertically connected with support column 2, the top of the support column 2 Portion, which is vertically connected with above carrying cross bar 3, carrying cross bar 3 left end, is installed with the first electric drive hydraulic thruster 4, and described the The right-hand member of one electric drive hydraulic thruster 4 is fixedly connected with stepper motor 5, and the lower section of stepper motor 5 is provided with pulley 6, described to hold Carry and offer chute 7 on cross bar 3, the pulley 6 is slidably connected with chute 7, reduce stepper motor 5 to the first electric drive hydraulic thruster 4 pressure brought, the stepper motor 5 is connected with rotating disk 8 by rotating bar, and the rotating disk 8 is arranged on the outer of carrying cross bar 3 Side, prevents when rotating disk 8 from rotating having the second electric drive hydraulic thruster 9 is fixedly connected with friction, the rotating disk 8 with cross bar 3, described the Micro air pump 11 is fixedly installed on two electric drive hydraulic thrusters 9, the bottom of the second electric drive hydraulic thruster 9 is installed with handgrip Handgrip 12 is provided with chamber 10, the handgrip chamber 10, the handgrip 12 is provided with four, and uniform arrangement, the He of handgrip 12 By the elastic connection of spring 14 between handgrip chamber 10, miniature air bag 13, the miniature air bag 13 are provided between the handgrip 12 Fit, the miniature air bag 13 is connected with micro air pump 11, realized by the cooperation of spring 14 and miniature air bag 13 with handgrip 12 The clamping action of device, spring 14 plays a part of fixed and buffered, and the processor 15 is electrically connected with actuator 16, described First electric drive hydraulic thruster 4, stepper motor 5, the second electric drive hydraulic thruster 9 and micro air pump 11 electrically connect with actuator 16 Connect.
Operation principle:Micro air pump 11 is deflated to miniature air bag 13, shrinks miniature air bag 13, the grab chips of handgrip 12, Stepper motor 5 drives rotating disk 8 to rotate 180 °, realizes the upset of chip, the processing after being overturn to chip, 5 turns of stepper motor Original position is moved go back to, by the flexible of the first electric drive hydraulic thruster 4, chip specific station is loaded into, micro air pump 11 gives miniature gas Capsule 13 is inflated, and expands miniature air bag 13, and handgrip 12 unclamps, and chip can be installed to specific position.
Although an embodiment of the present invention has been shown and described, for the ordinary skill in the art, can be with A variety of changes, modification can be carried out to these embodiments, replace without departing from the principles and spirit of the present invention by understanding And modification, the scope of the present invention is defined by the appended.

Claims (5)

1. a kind of chip bonding device with chip turning function, including work top(1)And processor(15), its feature exists In:The work top(1)The left side is vertically connected with support column(2), the support column(2)Plan vertical to be connected with carrying horizontal Bar(3), the carrying cross bar(3)The first electric drive hydraulic thruster is installed with above left end(4), first electric hydaulic pushes away Bar(4)Right-hand member be fixedly connected with stepper motor(5), the stepper motor(5)Rotating disk is connected with by rotating bar(8), it is described Rotating disk(8)On be fixedly connected with the second electric drive hydraulic thruster(9), second electric drive hydraulic thruster(9)On be fixedly installed it is micro- Type air pump(11), second electric drive hydraulic thruster(9)Bottom is installed with handgrip chamber(10), the handgrip chamber(10)Inside set It is equipped with handgrip(12), and handgrip(12)With handgrip chamber(10)Between pass through spring(14)Elastic connection, the handgrip(12)Between It is provided with miniature air bag(13), the miniature air bag(13)With micro air pump(11)Connection, the processor(15)It is electrically connected with There is actuator(16), first electric drive hydraulic thruster(4), stepper motor(5), the second electric drive hydraulic thruster(9)With miniature gas Pump(11)And actuator(16)It is electrically connected with.
2. a kind of chip bonding device with chip turning function according to claim 1, it is characterised in that:It is described to grab Hand(12)It is provided with four, and uniform arrangement.
3. a kind of chip bonding device with chip turning function according to claim 1, it is characterised in that:The step Stepper motor(5)Lower section is provided with pulley(6), the carrying cross bar(3)On offer chute(7), the pulley(6)With chute (7)It is slidably connected.
4. a kind of chip bonding device with chip turning function according to claim 1, it is characterised in that:Described turn Disk(8)It is arranged on carrying cross bar(3)Outside.
5. a kind of chip bonding device with chip turning function according to claim 1, it is characterised in that:It is described micro- Type air bag(13)With handgrip(12)Laminating.
CN201710214933.4A 2017-04-02 2017-04-02 A kind of chip bonding device with chip turning function Pending CN107093574A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201710214933.4A CN107093574A (en) 2017-04-02 2017-04-02 A kind of chip bonding device with chip turning function

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201710214933.4A CN107093574A (en) 2017-04-02 2017-04-02 A kind of chip bonding device with chip turning function

Publications (1)

Publication Number Publication Date
CN107093574A true CN107093574A (en) 2017-08-25

Family

ID=59646357

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201710214933.4A Pending CN107093574A (en) 2017-04-02 2017-04-02 A kind of chip bonding device with chip turning function

Country Status (1)

Country Link
CN (1) CN107093574A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107968064A (en) * 2017-11-27 2018-04-27 乐山新天源太阳能科技有限公司 Silicon wafer wool making transfer device
CN112378307A (en) * 2020-10-27 2021-02-19 无锡凯伦纳弹簧有限公司 Automatic grabbing and aligning device

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2379914Y (en) * 1999-06-14 2000-05-24 华东半导体工业股份有限公司 Apparatus for assembling chip and having chip turning-over function
CN201406201Y (en) * 2009-05-07 2010-02-17 深圳市比克电池有限公司 Self-turning baiting device
CN104891180A (en) * 2015-06-02 2015-09-09 吴江市七都镇庙港雅迪针织制衣厂 Cloth roll lifting frame
CN106115260A (en) * 2016-08-17 2016-11-16 华天科技(昆山)电子有限公司 Device high speed fetching device
CN205854327U (en) * 2016-08-02 2017-01-04 安徽德锐仕机床制造有限公司 A kind of automobile engine cylinder-body fixture of easy processing
CN205969004U (en) * 2016-08-11 2017-02-22 无锡百禾工业机器人有限公司 Suspension type power -assisted machine hand

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2379914Y (en) * 1999-06-14 2000-05-24 华东半导体工业股份有限公司 Apparatus for assembling chip and having chip turning-over function
CN201406201Y (en) * 2009-05-07 2010-02-17 深圳市比克电池有限公司 Self-turning baiting device
CN104891180A (en) * 2015-06-02 2015-09-09 吴江市七都镇庙港雅迪针织制衣厂 Cloth roll lifting frame
CN205854327U (en) * 2016-08-02 2017-01-04 安徽德锐仕机床制造有限公司 A kind of automobile engine cylinder-body fixture of easy processing
CN205969004U (en) * 2016-08-11 2017-02-22 无锡百禾工业机器人有限公司 Suspension type power -assisted machine hand
CN106115260A (en) * 2016-08-17 2016-11-16 华天科技(昆山)电子有限公司 Device high speed fetching device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107968064A (en) * 2017-11-27 2018-04-27 乐山新天源太阳能科技有限公司 Silicon wafer wool making transfer device
CN112378307A (en) * 2020-10-27 2021-02-19 无锡凯伦纳弹簧有限公司 Automatic grabbing and aligning device

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Application publication date: 20170825

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