CN112349636A - High-precision large-board-level micro-assembly equipment - Google Patents
High-precision large-board-level micro-assembly equipment Download PDFInfo
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- CN112349636A CN112349636A CN201910732692.1A CN201910732692A CN112349636A CN 112349636 A CN112349636 A CN 112349636A CN 201910732692 A CN201910732692 A CN 201910732692A CN 112349636 A CN112349636 A CN 112349636A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68792—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention provides a high-precision large-board-level micro-assembly device, which comprises: the wafer loading device comprises a wafer platform, a first conveying mechanism, a rotating mechanism, a second conveying mechanism and a wafer loading platform; the first conveying mechanism is positioned above the wafer table and used for conveying the chips on the wafer table to the rotating mechanism; the rotating mechanism is positioned between the wafer platform and the wafer loading platform and comprises: the rotary table rotates by taking an axis vertical to the table top as a rotating shaft, receives the chip from the first conveying mechanism and conveys the chip to the second conveying mechanism through rotary motion; the second conveying mechanism is located above the chip loading table and conveys the chips on the rotary table to the rotating mechanism. The rotary table is adopted to load the sheets in a rotating mode, and compared with a mode of loading by adopting a plurality of rotary arms, the rotary table has the advantages of short loading stroke and high efficiency, and is beneficial to improving the sheet loading efficiency and realizing the miniaturization of equipment volume.
Description
Technical Field
The invention relates to the technical field of wafer packaging, in particular to high-precision large-board-level micro-assembly equipment.
Background
Panel-level fan-out type die-bonding machines are key devices in semiconductor packaging lines and have very wide application in die-bonding. Panel-level fan-out die-bonding machines require that a wafer be taken from a large wafer 12 "in diameter and then accurately attached to a 650X650 panel at high speed. The existing panel-level fan-out type chip loader is mainly a rotary arm type chip loader, namely, the turnover from a chip to a substrate is realized through the rotation of a mechanical arm. However, the swing-arm type chip bonding machine usually needs a plurality of swing arms to work, which requires a panel-level fan-out type chip bonding machine to provide a long movement stroke, thus increasing the size of the equipment, and the swing-arm type chip bonding machine also has the problem of low chip bonding efficiency. Therefore, it is necessary to provide a further solution to the above problems.
Disclosure of Invention
The present invention is directed to a solution to the deficiencies of the prior art.
In order to solve the technical problems, the technical scheme of the invention is as follows:
a high precision large board level micropackaging apparatus comprising: the wafer loading device comprises a wafer platform, a first conveying mechanism, a rotating mechanism, a second conveying mechanism and a wafer loading platform;
the first conveying mechanism is positioned above the wafer table and used for conveying the chips on the wafer table to the rotating mechanism;
the rotating mechanism is positioned between the wafer platform and the wafer loading platform and comprises: the rotary table rotates by taking an axis vertical to the table top as a rotating shaft, receives the chip from the first conveying mechanism and conveys the chip to the second conveying mechanism through rotary motion;
the second conveying mechanism is located above the chip loading table and conveys the chips on the rotary table to the rotating mechanism.
As an improvement of the high-precision large-board-level micro-assembly apparatus of the present invention, the first transfer mechanism includes: first transfer arm, set up in first suction nozzle of first transfer arm tip and drive the first drive structure of the action of first transfer arm, first drive structure includes: the first transmission arm is driven to move along the X-axis direction, and the first cylinder is used for driving the first screw rod and the first transmission arm thereon to move along the Z-axis direction.
As an improvement of the high-precision large-plate-level micro-assembly equipment, the turntable is of a disc structure, and a rotating shaft of the disc structure is an axis passing through the center of the disc.
As an improvement of the high-precision large-plate-level micro-assembly equipment, the turntable is a rectangular plate, and a rotating shaft of the rectangular plate is an axial line passing through the center of the rectangular plate.
As an improvement of the high-precision large-plate-level micro-assembly equipment, the rotary table is driven to rotate by a rotary motor, and a motor shaft of the rotary motor is in transmission connection with the rotary table through a flange.
As an improvement of the high-precision large-board-level micro-assembly apparatus of the present invention, the second transfer mechanism includes: the second transfer arm, set up in the second suction nozzle of second transfer arm tip and drive the second drive structure of the action of second transfer arm, second drive structure includes: the second screw rod drives the second transmission arm to move along the X-axis direction, and the second cylinder drives the second screw rod and the second transmission arm thereon to move along the Z-axis direction.
As an improvement of the high-precision large-plate-level micro-assembly equipment, the first conveying mechanism, the rotating mechanism, the second conveying mechanism and the wafer loading table form a feeding station, and the feeding station is distributed on two sides of the wafer table in a left-right mirror symmetry mode.
As an improvement of the high-precision large-board-level micro-assembly apparatus of the present invention, the high-precision large-board-level micro-assembly apparatus further includes: first vision, second vision, third vision and fourth vision, first vision is located the upper portion of wafer platform, and is located first transport mechanism's oblique top, second vision and third vision are located the top of revolving stage, just the second vision corresponds and sets up in the top of last material level, and the third vision corresponds and sets up in the top of material level down, the fourth vision is located the upper portion of film loading platform.
Compared with the prior art, the invention has the beneficial effects that: the high-precision large-plate-level micro-assembly equipment adopts the rotary table to load the sheets in a rotating mode, has the advantages of short loading stroke and high efficiency compared with a mode of loading by adopting a plurality of rotary arms, and is beneficial to improving the sheet loading efficiency and realizing the miniaturization of the equipment volume.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments described in the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is a front view of an embodiment of the high-precision large board-level micro-assembly apparatus of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
As shown in fig. 1, the high-precision large-board-level micro-assembly apparatus according to an embodiment of the present invention includes: the wafer stage comprises a wafer stage 1, a first conveying mechanism 2, a rotating mechanism 3, a second conveying mechanism 4 and a loading stage 5.
The wafer platform 1 is used for placing large-size wafers, the placed wafers are cut into a plurality of wafer wafers in advance, and the wafer wafers are conveyed to the rotating mechanism 3 through the first conveying mechanism 2.
The first conveying mechanism 2 is located above the wafer table 1, and in order to convey the wafer, the first conveying mechanism 2 needs to be capable of moving horizontally and vertically in a vertical plane. Specifically, the first conveyance mechanism 2 includes: the suction device comprises a first conveying arm 21, a first suction nozzle 22 arranged at the end part of the first conveying arm 21 and a first driving structure 23 for driving the first conveying arm 21 to move.
Wherein the first driving structure 23 comprises: a first screw rod 231 driving the first transmission arm 21 to move along the X-axis direction, and a first cylinder 232 driving the first screw rod 231 and the first transmission arm thereon to move along the Z-axis direction. Therefore, under the driving of the first cylinder 232, the first transfer arm 21 descends to the table top of the wafer table 1, sucks the chip through the first suction nozzle 22 on the first transfer arm, continues to ascend to a certain height under the driving of the first cylinder 232, then horizontally moves to the position above the rotating mechanism 3 under the driving of the first screw rod 231, and descends to the height of the rotating mechanism 3 under the driving of the first cylinder 232 again, and the first suction nozzle 22 releases pressure to place the sucked chip on the rotating mechanism 3. In addition, the first cylinder 232 can be replaced by a screw rod or a cam or a direct drive motor.
The rotating mechanism 3 is used for transferring the chips from the first transfer mechanism 2 to a second transfer mechanism 4, and is positioned between the wafer table 1 and a loading table 5, and the rotating mechanism 3 comprises: a turntable 31 rotating with an axis perpendicular to the table top as a rotation axis.
The turntable 31 may be a disc structure, and preferably, the rotation axis of the disc structure is an axis passing through the center of the disc. Alternatively, the turntable 31 may be a rectangular plate, and preferably, the rotation axis of the rectangular plate is an axis passing through the center of the rectangular plate.
In this embodiment, the rotating platform 31 is driven by a rotating motor 32 to rotate, and at this time, a motor shaft of the rotating motor 32 is in transmission connection with the rotating platform 31 through a flange. Thus, after receiving the chip from the first conveying mechanism 2, the turntable 31 conveys the chip to the second conveying mechanism 4 by a rotating motion under the driving of the rotating motor 32.
The second transfer mechanism 4 is used for transferring the chips on the turntable 31 to the rotating mechanism 3, is located above the loading table 5, and needs to be capable of moving horizontally and vertically in a vertical plane in order to transfer the wafers. Specifically, the second conveyance mechanism 4 includes: a second transfer arm 41, a second suction nozzle 42 provided at an end of the second transfer arm 41, and a second driving mechanism 43 for driving the second transfer arm 41.
Wherein the second driving structure 43 comprises: a second screw rod 431 driving the second transfer arm 41 to move along the X-axis direction, and a second cylinder 432 driving the second screw rod 431 and a second transmission arm thereon to move along the Z-axis direction. Therefore, under the driving of the second air cylinder 432, the second transfer arm 41 descends to the height of the rotating mechanism 3, sucks the chip through the second suction nozzle 42 on the second transfer arm, continues to ascend to a certain height under the driving of the second air cylinder 432, then horizontally moves to the position above the chip loading table 5 under the driving of the second screw rod 431, and descends to the table top of the chip loading table 5 under the driving of the second air cylinder 432 again, and the second suction nozzle 42 releases the pressure to place the sucked chip on the chip loading table 5. In addition, the second cylinder 432 can be replaced by a screw rod or a cam or a direct drive motor.
The chip mounting table 5 is used as a table top for chip mounting, can be arranged on a base and can slide along the slide rail 51 on the base so as to meet the actual chip mounting requirement.
In order to improve the chip mounting efficiency, the high-precision large-board-level micro-assembly equipment of the embodiment can also be designed as a double-station chip mounting machine. At the moment, the first conveying mechanism 2, the rotating mechanism 3, the second conveying mechanism 4 and the loading table 5 form a feeding station, and the feeding station is distributed on two sides of the wafer table 1 in a left-right mirror symmetry manner. Therefore, the two feeding stations share the middle wafer table 1, and chips are respectively sucked from the wafer table 1 to carry out chip loading.
In addition, in order to guarantee the accuracy in the chip turnover process, the high-precision large-board-level micro-assembly equipment is also provided with a plurality of CCD visual detectors, and the directions of key positions in the chip turnover process can be observed by the plurality of CCD visual detectors so as to guarantee the precision of subsequent chip mounting.
Specifically, the high-precision large-board-level micro-assembly equipment comprises: a first vision 61, a second vision 62, a third vision 63 and a fourth vision 64. Wherein the first vision 61 is used to observe and feed back the orientation of the chip when it is turned around by the first transfer mechanism 2. The first vision 61 is located at the upper part of the wafer table and obliquely above the first conveying mechanism. The second vision 62 and the third vision 63 are used for observing and feeding back the orientation of the chips when the chips are loaded and unloaded by the turntable 31, respectively. Second vision 62 and third vision 63 are located the top of revolving stage, just second vision 62 corresponds and sets up in the top of material loading level, and third vision 63 corresponds and sets up in the top of material unloading level, fourth vision 64 is used for observing and feeding back the position when chip is last to be loaded, fourth vision 64 is located the upper portion of loading platform.
In conclusion, the high-precision large-plate-level micro-assembly equipment disclosed by the invention adopts the rotary table to load the sheets in a rotating mode, and compared with a mode of loading by adopting a plurality of spiral arms, the high-precision large-plate-level micro-assembly equipment has the advantages of short loading stroke and high efficiency, and is beneficial to improving the sheet loading efficiency and realizing the miniaturization of the equipment volume.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.
Claims (8)
1. The utility model provides a little equipment of big board-level of high accuracy which characterized in that, the little equipment of big board-level of high accuracy includes: the wafer loading device comprises a wafer platform, a first conveying mechanism, a rotating mechanism, a second conveying mechanism and a wafer loading platform;
the first conveying mechanism is positioned above the wafer table and used for conveying the chips on the wafer table to the rotating mechanism;
the rotating mechanism is positioned between the wafer platform and the wafer loading platform and comprises: the rotary table rotates by taking an axis vertical to the table top as a rotating shaft, receives the chip from the first conveying mechanism and conveys the chip to the second conveying mechanism through rotary motion;
the second conveying mechanism is located above the chip loading table and conveys the chips on the rotary table to the rotating mechanism.
2. The high precision large board level micro assembly device according to claim 1, wherein the first transfer mechanism comprises: first transfer arm, set up in first suction nozzle of first transfer arm tip and drive the first drive structure of the action of first transfer arm, first drive structure includes: the first transmission arm is driven to move along the X-axis direction, and the first cylinder is used for driving the first screw rod and the first transmission arm thereon to move along the Z-axis direction.
3. A high precision large plate-scale micropackaging apparatus according to claim 1, wherein said turret is a disk structure, the axis of rotation of said disk structure being the axis passing through the center of the disk.
4. A high precision large plate-scale micropackaging apparatus according to claim 1, wherein said turret is a rectangular plate, and the rotation axis of said rectangular plate is an axis passing through the center of the rectangular plate.
5. The high precision large plate-scale micro-assembly equipment according to claim 1, wherein the turntable is rotated by a rotating motor, and a motor shaft of the rotating motor is in transmission connection with the turntable through a flange.
6. The high-precision large-board-scale micropackaging apparatus of claim 1, wherein said second transport mechanism comprises: the second transfer arm, set up in the second suction nozzle of second transfer arm tip and drive the second drive structure of the action of second transfer arm, second drive structure includes: the second screw rod drives the second transmission arm to move along the X-axis direction, and the second cylinder drives the second screw rod and the second transmission arm thereon to move along the Z-axis direction.
7. The high-precision large-plate-level micro-assembly equipment according to claim 1, wherein the first conveying mechanism, the rotating mechanism, the second conveying mechanism and the wafer loading table form a feeding station, and the feeding station is distributed on two sides of the wafer table in a left-right mirror symmetry manner.
8. The high-precision large-board-level micro-assembly device according to claim 1, further comprising: first vision, second vision, third vision and fourth vision, first vision is located the upper portion of wafer platform, and is located first transport mechanism's oblique top, second vision and third vision are located the top of revolving stage, just the second vision corresponds and sets up in the top of last material level, and the third vision corresponds and sets up in the top of material level down, the fourth vision is located the upper portion of film loading platform.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910732692.1A CN112349636A (en) | 2019-08-09 | 2019-08-09 | High-precision large-board-level micro-assembly equipment |
| PCT/CN2019/101957 WO2021026957A1 (en) | 2019-08-09 | 2019-08-22 | High-precision large panel-level micro-assembly device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910732692.1A CN112349636A (en) | 2019-08-09 | 2019-08-09 | High-precision large-board-level micro-assembly equipment |
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| CN112349636A true CN112349636A (en) | 2021-02-09 |
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| CN201910732692.1A Pending CN112349636A (en) | 2019-08-09 | 2019-08-09 | High-precision large-board-level micro-assembly equipment |
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| Country | Link |
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| CN (1) | CN112349636A (en) |
| WO (1) | WO2021026957A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114566445A (en) * | 2022-01-22 | 2022-05-31 | 苏州艾科瑞思智能装备股份有限公司 | High-precision micro-assembly equipment for wafer three-dimensional integration |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103400784A (en) * | 2013-08-08 | 2013-11-20 | 王敕 | Multipurpose encapsulating equipment |
| WO2016150080A1 (en) * | 2015-03-20 | 2016-09-29 | 北京中电科电子装备有限公司 | Flip chip bonding device |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104600015B (en) * | 2015-02-11 | 2018-01-02 | 北京中电科电子装备有限公司 | A kind of chip transmitting device |
| CN205920952U (en) * | 2016-07-28 | 2017-02-01 | 合肥矽迈微电子科技有限公司 | Chip paster equipment |
| CN108155124A (en) * | 2017-12-25 | 2018-06-12 | 北京中电科电子装备有限公司 | A kind of chip attachment device and method |
-
2019
- 2019-08-09 CN CN201910732692.1A patent/CN112349636A/en active Pending
- 2019-08-22 WO PCT/CN2019/101957 patent/WO2021026957A1/en active Application Filing
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103400784A (en) * | 2013-08-08 | 2013-11-20 | 王敕 | Multipurpose encapsulating equipment |
| WO2016150080A1 (en) * | 2015-03-20 | 2016-09-29 | 北京中电科电子装备有限公司 | Flip chip bonding device |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114566445A (en) * | 2022-01-22 | 2022-05-31 | 苏州艾科瑞思智能装备股份有限公司 | High-precision micro-assembly equipment for wafer three-dimensional integration |
| CN114566445B (en) * | 2022-01-22 | 2023-09-08 | 苏州艾科瑞思智能装备股份有限公司 | Wafer three-dimensional integration-oriented high-precision micro-assembly equipment |
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| Publication number | Publication date |
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| WO2021026957A1 (en) | 2021-02-18 |
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