CN104600015B - A kind of chip transmitting device - Google Patents
A kind of chip transmitting device Download PDFInfo
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- CN104600015B CN104600015B CN201510073744.0A CN201510073744A CN104600015B CN 104600015 B CN104600015 B CN 104600015B CN 201510073744 A CN201510073744 A CN 201510073744A CN 104600015 B CN104600015 B CN 104600015B
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- 230000007246 mechanism Effects 0.000 claims abstract description 93
- 230000005540 biological transmission Effects 0.000 claims abstract description 39
- 230000002950 deficient Effects 0.000 claims abstract description 11
- 238000001514 detection method Methods 0.000 claims description 61
- 238000010438 heat treatment Methods 0.000 claims description 25
- 230000033001 locomotion Effects 0.000 claims description 19
- 238000001179 sorption measurement Methods 0.000 claims description 17
- 238000000034 method Methods 0.000 claims description 12
- 230000008569 process Effects 0.000 claims description 11
- 230000007547 defect Effects 0.000 claims description 6
- 230000005855 radiation Effects 0.000 claims description 4
- 230000001360 synchronised effect Effects 0.000 claims description 2
- 238000004806 packaging method and process Methods 0.000 description 11
- 238000010586 diagram Methods 0.000 description 10
- 230000008878 coupling Effects 0.000 description 5
- 238000010168 coupling process Methods 0.000 description 5
- 238000005859 coupling reaction Methods 0.000 description 5
- 238000007599 discharging Methods 0.000 description 5
- 235000012431 wafers Nutrition 0.000 description 4
- 238000004100 electronic packaging Methods 0.000 description 3
- 239000002699 waste material Substances 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000009776 industrial production Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68313—Auxiliary support including a cavity for storing a finished device, e.g. IC package, or a partly finished device, e.g. die, during manufacturing or mounting
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Specific Conveyance Elements (AREA)
Abstract
The invention provides a kind of chip transmitting device, wherein, the chip transmitting device includes chip circle transmission mechanism, and the chip circle transmission mechanism includes：Rotating disk and the motor for driving the rotating disk to rotate, the rotating disk are provided with multiple stations for chip placement；By the rotation of the rotating disk, the chip being disposed therein on a station is moved to the second place at first position；First chip pick-and-place mechanism, the chip is placed on the station in the rotating disk at the first position after chip for picking up；Second chip pick-and-place mechanism, for the chip being located in the rotating disk on the station of the second place to be taken out；The whether defective chip detecting system in surface for detecting the chip in the chip circle transmission mechanism.The present invention can realize the remote precise delivery of chip, improve the efficiency of transmission of chip.
Description
Technical Field
The invention relates to the field of semiconductor packaging, in particular to a chip transmission device.
Background
With the rapid development of global electronic information technology, the chip packaging market is getting bigger and bigger, the market competition is getting stronger, and the improvement of the packaging efficiency becomes an important means for many packaging enterprises to seize the market. More chips can be manufactured on a large wafer at a time, and the large wafer is more and more in the packaging market in order to improve the chip packaging efficiency. Semiconductor packages have now entered the 12 inch era and 18 inch packaged devices will certainly emerge in the future. The rapid development of large wafers presents challenges to existing electronic packaging technologies, one of the most significant challenges being the precise transmission of chips over large distances. When two workbenches are far away from each other at present, a long-distance transportation screw rod or linear motor mode is adopted. The remote chip operation process is widely applied to the electronic packaging industrial production and is used for realizing the lossless accurate transmission and bonding of IC chips, such as packaging equipment of a chip bonding machine, a chip arranging machine, a flip chip and the like. The long-distance chip transmission operation is a key process in electronic packaging, and the efficiency of the transmission operation directly influences the efficiency of packaging equipment.
Disclosure of Invention
The invention provides a chip transmission device, which aims to realize long-distance accurate transmission of chips and improve the transmission efficiency of the chips.
In order to achieve the above object, the present invention provides a chip transfer apparatus, wherein the chip transfer apparatus comprises:
chip circulation transmission device, chip circulation transmission device includes: the chip placing machine comprises a rotating disk and a driving motor for driving the rotating disk to rotate, wherein a plurality of stations for placing chips are arranged on the rotating disk; the chip arranged on one station is moved from a first position to a second position through the rotation of the rotating disc;
the first chip picking and placing mechanism is used for picking up a chip and then placing the chip on a working position on the rotating disc, wherein the working position is at the first position;
the second chip picking and placing mechanism is used for picking out the chips on the stations at the second position on the rotating disc;
and the chip detection system is used for detecting whether the surface of the chip on the chip circulating and conveying mechanism is defective or not.
Optionally, the chip conveying device further includes a worktable mechanism, the worktable mechanism includes a feeding worktable and a discharging worktable, wherein the first chip picking and placing mechanism picks up the chips from the feeding worktable and then places the chips on the rotating disc, and the second chip picking and placing mechanism places the chips picked up from the rotating disc on the discharging worktable.
Optionally, the chip transmission device further includes: and the heating module is used for heating the chip in the rotating process of the rotating disc after the chip is placed on one station of the rotating disc, and the heating module is positioned on the periphery of the circumference of the rotating disc.
Optionally, the heating module is heated by radiation or directly.
Optionally, the chip circulation transmission mechanism further includes: a motor fixing seat for fixing the driving motor; a motor connecting shaft for connecting the driving motor and the rotating disk; the rotating disk fixing seat is used for fixing the rotating disk; and the bearing is positioned between the rotating disk fixing seat and the rotating disk and used for supporting the rotating disk to rotate, the bearing inner ring fixing ring is used for fixing the bearing inner ring, and the bearing outer ring fixing ring is used for fixing the bearing outer ring.
Optionally, the chip circulating and conveying mechanism further comprises a vacuum adsorption structure, the vacuum adsorption structure comprises a plurality of vacuum pipe joints, the vacuum pipe joints are located on the outer circumferential surface of the rotating disc, the vacuum pipe joints correspond to the stations on the rotating disc one by one, and the stations are fixed by adopting a vacuum adsorption mode through the vacuum pipe joints.
Optionally, the vacuum adsorption structure further includes: a rotary joint for connecting with a vacuum generating device, wherein the rotary joint is positioned below the rotating disc and is synchronous with the rotating speed of the rotating disc; the vacuum branch joints are connected with the rotary joint through vacuum pipes and are arranged between the rotary disc and the rotary joint, and the vacuum branch joints are also connected with the vacuum pipe joints in a one-to-one corresponding mode through the vacuum pipes.
Optionally, the first chip pick-and-place mechanism and the second chip pick-and-place mechanism each include: the swing arm is used for picking up the chip, and a vacuum adsorption device is arranged at one end of the swing arm, which is used for picking up the chip; a rotating motor for driving the swing arm to do reciprocating rotation motion and a linear motor for driving the swing arm to do up-and-down reciprocating motion; the rotating motor controls the swinging arm to do rotating reciprocating motion through the coupler; the swing arm, the coupler and the rotating motor are assembled on the first base; the linear motor controls the swing arm to do up-and-down reciprocating motion by controlling the first base to slide relative to the second base.
Optionally, the first chip pick-and-place mechanism and the second chip pick-and-place mechanism each include: an X-direction guide rail; an X-direction motion fixing seat moving on the X-direction guide rail; and the Z-direction pickup head is positioned on the X-direction moving fixed seat, a vacuum adsorption device is arranged at one end of the Z-direction pickup head for picking up the chip, and the Z-direction pickup head can move on the X-direction moving seat along the Z direction.
Optionally, the chip detection system includes: a downward-looking camera for detecting a position of the chip on the rotating disk, an angular offset, and whether an upper surface of the chip is defective, the downward-looking camera being located above a station on the rotating disk at a first position; the chip comprises a left detection camera, a right detection camera, a front detection camera and a rear detection camera, wherein the left detection camera, the right detection camera, the front detection camera and the rear detection camera are used for detecting whether defects exist on the side surface of the chip, an image collector of the left detection camera and an image collector of the right detection camera are oppositely arranged and face a third position, an image collector of the front detection camera and an image collector of the rear detection camera are oppositely arranged and face the third position, and the third position is a position on the rotating disc.
Optionally, the rotating disc is a circular disc rotating disc or a polygonal rotating disc.
The invention has the beneficial effects that:
the chip conveying device provided by the invention is characterized in that a chip circulating conveying mechanism, a first chip picking and placing mechanism, a second chip picking and placing mechanism and a chip detecting system are matched together, in the process of conveying chips by the chip conveying device, the first chip picking and placing mechanism picks up the chips and places the picked chips on a station, which is positioned at a first position, on a rotating disc, a driving motor drives the rotating disc to rotate, and when the chips rotate to a second position along with the rotating disc, the second chip picking and placing mechanism takes the chips out of the rotating disc; in the process that the chip rotates along with the rotating disc, the chip detection system detects the surface of the chip and checks whether the surface of the chip has defects. The first chip picking and placing mechanism, the chip circulating transmission mechanism and the second chip picking and placing mechanism in the chip transmission device enable a plurality of chips to rotate along with the rotating disc, so that the transmission efficiency of the chips is improved; the chip detection system enables the chip transmission device to have a chip detection function and is suitable for packaging of high-end chips.
Drawings
FIG. 1 is a schematic structural diagram illustrating a front view of a chip transfer device according to an embodiment of the present invention;
FIG. 2 is a schematic structural diagram illustrating a top view of a chip transfer device according to an embodiment of the present invention;
FIG. 3 is a schematic structural diagram of a chip circulation transfer mechanism according to an embodiment of the present invention;
fig. 4 is a schematic structural diagram of a first chip pick-and-place mechanism and a second chip pick-and-place mechanism according to an embodiment of the present invention;
fig. 5 is a second schematic structural diagram of the first chip pick-and-place mechanism and the second chip pick-and-place mechanism according to the embodiment of the invention; and
fig. 6 is a schematic structural diagram of a rotary disk in the chip transfer mechanism according to the embodiment of the present invention.
Wherein in the figure: 1. rotating the disc; 2. a drive motor; 3. a frame; 4. a first chip pick-and-place mechanism; 5. a second chip pick-and-place mechanism; 6. looking down the camera; 7. a left detection camera; 8. a right detection camera; 9. a front detection camera; 10. a post-detection camera; 11. a feeding workbench; 12. a blanking workbench; 13. a heating module; 14. a motor fixing seat; 15. a motor connecting shaft; 16. a rotating disc fixing seat; 17. a bearing; 18. a bearing inner ring fixing ring; 19. a bearing outer ring fixing ring; 20. a vacuum pipe joint; 21. a rotary joint; 22. a vacuum shunt joint; 23. a rotary joint fixing seat; 24. a base; 25. swinging arms; 26. a rotating electric machine; 27. a linear motor; 28. a coupling; 29. a first base; 30. a second base; 31. an X-direction guide rail; 32. an X-direction motion fixing seat; 33. a Z-direction pickup head; 34. an X-direction linear guide rail sliding block; 35. an X-direction linear motor rotor; 36. an X-direction linear motor stator; 37. a Z-direction linear guide rail sliding block; 38. a Z-direction linear motor rotor; 39. a Z-direction linear guide rail; 40. and a Z-direction linear motor stator.
Detailed Description
Exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. While exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be embodied in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.
As shown in fig. 1 and 2, in one embodiment of the present invention, the chip transporting apparatus includes a chip circulation transporting mechanism, a first chip pick-and-place mechanism 4, a second chip pick-and-place mechanism 5, and a chip detecting system. The chip circulating transmission mechanism mainly realizes the remote transmission of chips, is the main part of the whole chip transmission device, mainly comprises a rotating disk 1 and a driving motor 2 for driving the rotating disk 1 to rotate, and particularly can be fixed on a stable rack 3.
The first chip picking and placing mechanism 4 and the second chip picking and placing mechanism 5 can move the chip in the X direction and the Y direction in the horizontal plane, move the chip in the Z direction in the vertical plane and rotate the chip on the vertical plane, wherein the first chip picking and placing mechanism 4 is used for placing the chip on a station on the rotating disc 1 at a first position after picking up the chip, and the second chip picking and placing mechanism 5 is used for taking the chip on a station on the rotating disc 1 at a second position, in particular, in order to improve the transmission efficiency of the chip circulating transmission mechanism, the first position and the second position can be two positions at two ends of the diameter of the rotating disc 1, namely, the rotating disc 1 rotates 180 degrees from the first position to the second position; in order to enable the first chip pick-and-place mechanism 4 and the second chip pick-and-place mechanism 5 to pick and place chips firmly and accurately, both the first chip pick-and-place mechanism 4 and the second chip pick-and-place mechanism 5 have a vacuum adsorption function.
The chip detection system is used for detecting whether the surface of a chip on the chip circulating transmission mechanism has a defect, and specifically, the chip detection system may include five cameras, namely an overlooking camera 6, a left detection camera 7, a right detection camera 8, a front detection camera 9 and a rear detection camera 10, wherein the overlooking camera 6 may be located above a station located at a first position on the rotary disk 1, when the first chip pick-and-place mechanism 4 places the chip on the station located at the first position on the rotary disk 1, the overlooking camera 6 may not only detect the position and angle deviation condition of the chip on the rotary disk 1, but also detect whether the upper surface of the chip has a defect, and if the upper surface of the chip is detected to have a defect, the chip is treated as a waste chip; the image capturing device of the left detection camera 7 and the image capturing device of the right detection camera 8 are oppositely arranged and face the third position, the image capturing device of the front detection camera 9 and the image capturing device of the rear detection camera 10 are oppositely arranged and face the third position, the third position is a position on the rotary disk 1, namely, the two ends of the diameter which is vertical to the circumference of the position on the rotary disk 1 are respectively fixed with the left detection camera 7, the right detection camera 8, the front detection camera 9 and the rear detection camera 10, when the station where the chip is placed rotates to the first position, the left detection camera 7, the right detection camera 8, the front detection camera 9 and the rear detection camera 10 respectively detect whether the left surface, the right surface, the front surface and the rear surface of the chip are defective or not.
Specifically, the chip transfer device may further include a table mechanism and a heating module 13. The worktable mechanism comprises a loading worktable 11 and a blanking worktable 12, the loading worktable 11 can be used for placing LED or IC chips, and the first chip picking and placing mechanism 4 can pick up the chips from the loading worktable 11 and then place the chips on the rotating disk 1; the blanking worktable 12 can be used for placing a wafer, a substrate or a lead frame, and the second chip picking and placing mechanism 5 can place the chips picked from the rotating disc 1 onto the blanking worktable 12; preferably, for the convenience of picking up the chip from the feeding table 11 by the first chip picking and placing mechanism 4 and for the convenience of placing the picked chip on the discharging table 12 by the second chip picking and placing mechanism 5, the feeding table 11 and the discharging table 12 are both fixed on the frame 3, and the working surface of the feeding table 11, the working surface of the discharging table 12 and the working surface of the rotating disc 1 are on the same horizontal plane. The heating module 13 can heat the chips placed on the rotating disk 1 in the chip transmission process, and the heating temperature can reach 300 ℃; in order to improve the utilization rate of the heating module 13, the heating module 13 may be fixed on the frame 3 at the periphery of the circumference of the rotating disk 1, and the heating mode of the heating module 13 may be a radiation heating mode or a direct heating mode, wherein the radiation heating mode is that the chip is heated by radiating heat to the chip on the rotating disk 1; the direct heating method is to heat the chips on the rotating disk 1 by a heating source.
Fig. 3 is a schematic structural diagram of the chip circulation transmission mechanism in an embodiment of the present invention, and in an embodiment of the present invention, the chip circulation transmission mechanism further includes a motor fixing seat 14, a motor connecting shaft 15, a rotating disk fixing seat 16, a bearing 17, a bearing inner ring fixing ring 18, and a bearing outer ring fixing ring 19. The motor fixing seat 14 is connected with the driving motor 2 and plays a role in fixing the driving motor 2, and preferably, the motor fixing seat 14 is positioned below the driving motor 2; the motor connecting shaft 15 is respectively connected with the driving motor 2 and the rotating disk 1 to play a role in connection; the rotating disk fixing seat 16 is connected with the rotating disk 1 and plays a role of fixing the rotating disk 1, and preferably, the rotating disk fixing seat 16 is positioned below the rotating disk 1; the bearing 17 is positioned between the rotating disk fixing seat 16 and the rotating disk 1, plays a role in supporting the rotating disk 1 to rotate, and reduces the frictional resistance when the rotating disk 1 rotates; the bearing inner ring fixing ring 18 and the bearing outer ring fixing ring 19 are respectively positioned on the inner ring and the outer ring of the bearing 17, and respectively play a role in fixing the bearing inner ring and the bearing outer ring.
With continued reference to fig. 3, the chip circulation transfer mechanism further includes a vacuum suction mechanism including a plurality of vacuum joints 20, a rotary joint 21, and a plurality of vacuum branch joints 22. The vacuum tube joints 20 are positioned on the outer circumferential surface of the rotating disc 1, the vacuum tube joints 20 correspond to stations on the rotating disc 1 one by one, and the stations fix the chips in a vacuum adsorption mode through the vacuum tube joints 20; the rotary joint 21 is positioned below the rotary disc 1, the vacuum branch joints 22 are positioned between the rotary disc 1 and the rotary joint 21, one end of the rotary joint 21 is connected with the vacuum generating device, the other end of the rotary joint is connected with the plurality of vacuum branch joints 22 through vacuum tubes, and the plurality of vacuum branch joints 22 are correspondingly connected with the plurality of vacuum tube joints 20 one by one through the vacuum tubes; specifically, in order to make the vacuum tubes connecting the rotary joint 21 and the vacuum tube joints 20 rotate together with the rotating disk 1, one end of the rotary joint 21 connected with the vacuum generating device is fixed, one end of the rotary joint 21 connected with the vacuum tube joints 20 can rotate, and in order to make the vacuum tubes connecting the rotary joint 21 and the vacuum shunt joints 22 rotate together with the rotating disk 1, the rotary joint 21 and the rotating disk 1 rotate at the same speed, preferably, the rotary joint 21 can be fixed on a rotary joint fixing seat 23, a base 24 can be arranged below the rotary joint fixing seat 23 to play a role in supporting the whole chip circulation transmission mechanism, and similarly, the base 24 can be fixed on the rack 3.
During the rotation of the rotating disk 1 with the chips, the vacuum generating device works to extract air in the vacuum tube connected with the rotating joint 21 and the vacuum branch joint 22, the vacuum branch joint 22 and the vacuum tube joint 20 through the rotating joint 21, so that suction is generated at the station corresponding to the vacuum tube joint 20, and the chips at the station on the rotating disk 1 are adsorbed and fixed. In the process, each vacuum channel communicated with the station can be controlled independently, and all the vacuum channels can be controlled simultaneously.
Referring to fig. 4, which is a schematic diagram illustrating a first implementation structure of the first chip pick-and-place mechanism 4 and the second chip pick-and-place mechanism 5 in the present invention, in this embodiment, the first chip pick-and-place mechanism 4 and the second chip pick-and-place mechanism 5 may be a swing arm type. In the present embodiment, each of the first chip pick-and-place mechanism 4 and the second chip pick-and-place mechanism 5 includes a swing arm 25, a rotary motor 26, a linear motor 27, a coupling 28, a first base 29, and a second base 30. Wherein, the rotating electrical machine 26 is connected with the swing arm 25 through the coupling 28, and the swing arm 25, the coupling 28 and the rotating electrical machine 26 are assembled on the first base 29, and the rotating electrical machine 26 can control the swing arm 25 to make reciprocating rotation movement through the coupling 28; the first base 29 is slidably disposed on the second base 30, and the linear motor 27 controls the first base 29 to slide relative to the second base 30, so as to control the swing arm 25 to reciprocate up and down. Preferably, in order to prevent the swing arm 25 carrying the chip from dropping off during the rotation process, a vacuum adsorption device is disposed at one end of the swing arm 25 for picking up the chip, and the vacuum adsorption device can make the swing arm 25 firmly adsorb the chip.
As shown in fig. 5, which is a schematic diagram of a second implementation structure of the first chip pick-and-place mechanism 4 and the second chip pick-and-place mechanism 5 in the present invention, in this embodiment, the first chip pick-and-place mechanism 4 and the second chip pick-and-place mechanism 5 may be of a linear driving type. The first chip pick-and-place mechanism 4 and the second chip pick-and-place mechanism 5 each include an X-direction guide rail 31, an X-direction movement fixing base 32, and a Z-direction pick-and-place head 33. Wherein, the X-direction moving fixing seat 32 can do reciprocating linear motion on the X-direction guide rail 31; preferably, an X-direction linear guide slider 34 and an X-direction linear motor mover 35 may be fixed below the X-direction moving fixing base 32, the X-direction linear motor mover 35 is matched with an X-direction linear motor stator 36, and specifically, the X-direction linear guide slider 34 drives the X-direction moving fixing base 32 to make a linear reciprocating motion under the matching of the X-direction linear motor mover 35 and the X-direction linear motor stator 36. The Z-direction pick-up head 33 is positioned on the X-direction moving fixing seat 32; preferably, a Z-direction linear guide rail slider 37 and a Z-direction linear motor mover 38 are connected to the Z-direction pickup head 33, a Z-direction linear guide rail 39 is arranged on the X-direction movement fixing base 32, the Z-direction linear motor mover 38 is matched with a Z-direction linear motor stator 40, and specifically, the Z-direction linear guide rail slider 37 drives the Z-direction pickup head 33 to perform Z-direction linear reciprocating movement on the X-direction movement fixing base 32 under the matching of the Z-direction linear motor mover 38 and the Z-direction linear motor stator 40; preferably, in order to prevent the chip from falling off during the movement of the Z-direction pick-up head 33 carrying the chip, a vacuum adsorption device is disposed at one end of the Z-direction pick-up head 33 for picking up the chip, and the vacuum adsorption device can enable the Z-direction pick-up head 33 to firmly adsorb the chip.
Fig. 6 is a schematic structural diagram of a rotary disk 1 in a chip conveying mechanism according to an embodiment of the present invention, and in this embodiment, the rotary disk 1 may be a disk-type conveying mechanism or other polygonal circulating conveying mechanism.
Next, the operation of the entire chip transfer apparatus will be described.
In the process of transmitting the chip by the chip transmission mechanism, the driving motor 2 drives the rotating disc 1 to rotate, the first chip picking and placing mechanism 4 picks up the chip from the feeding workbench 11 and then places the chip on a station at the first position on the rotating disc 1, at this time, the overlooking camera 6 in the chip detection system detects whether the position, the angle and the upper surface of the chip are defective, if the upper surface of the chip is defective, the chip is treated as a waste chip, and if the upper surface of the chip is not defective, the chip rotates along with the rotating disc 1. In the process that the chip rotates along with the rotating disc 1, on one hand, the vacuum generating device works, and air in the vacuum tube connected with the rotating joint 21, the vacuum branch joint 22 and the vacuum tube joint 20 is extracted through the rotating joint 21, so that suction is generated at a station corresponding to the vacuum tube joint 20, the chip at the station on the rotating disc 1 is fixed, and in the process, each path of vacuum channel communicated with the station can be controlled independently, and all the vacuum channels can be controlled simultaneously; on the other hand, when the station with the chips adsorbed on the rotating disc 1 rotates to a third position, the left detection camera 7, the right detection camera 8, the front detection camera 9 and the rear detection camera 10 in the chip detection system respectively detect the left surface, the right surface, the front surface and the rear surface of the chip, similarly, if one of the surfaces is defective, the chip is treated as a waste chip, if all the surfaces are not defective, the chip continues to rotate along with the rotating disc 1 until the station rotates to the second position, and the second chip picking and placing mechanism 5 picks up the chip from the station and places the chip on the blanking worktable 12; wherein the heating module 13 heats the chip before the second chip pick-and-place mechanism 5 picks the chip from the station.
According to the invention, the chip circulating transmission mechanism, the first chip pick-and-place mechanism and the second chip pick-and-place mechanism are combined, so that the chip transmission efficiency is greatly improved, and the long-distance transmission precision of the chip is ensured; meanwhile, in the chip transmission process, the heating module heats the chip, so that the packaging time of the heating type chip is shortened, and the production efficiency is improved; in addition, the chip detection system consisting of five cameras enables the chip transmission device to have a chip multi-surface detection function and is suitable for packaging of high-end chips.
While the preferred embodiments of the present invention have been described, it will be understood by those skilled in the art that various changes and modifications may be made without departing from the spirit and scope of the invention as defined in the following claims.
Claims (9)
1. A chip transfer apparatus, comprising: chip circulation transmission device, chip circulation transmission device includes: the chip placing machine comprises a rotating disk and a driving motor for driving the rotating disk to rotate, wherein a plurality of stations for placing chips are arranged on the rotating disk; the chip arranged on one station is moved from a first position to a second position through the rotation of the rotating disc;
the first chip picking and placing mechanism is used for picking up a chip and then placing the chip on a working position on the rotating disc, wherein the working position is at the first position;
the second chip picking and placing mechanism is used for picking out the chips on the stations at the second position on the rotating disc;
a chip detection system for detecting whether the surface of the chip on the chip circulating and conveying mechanism is defective;
the vacuum adsorption structure comprises a plurality of vacuum pipe joints, the vacuum pipe joints are positioned on the outer circumferential surface of the rotating disc and correspond to stations on the rotating disc one by one, and the stations fix the chips in a vacuum adsorption mode through the vacuum pipe joints;
wherein,
the first chip pick-and-place mechanism and the second chip pick-and-place mechanism each include:
the swing arm is used for picking up the chip, and a vacuum adsorption device is arranged at one end of the swing arm, which is used for picking up the chip;
a rotating motor for driving the swing arm to do reciprocating rotation motion and a linear motor for driving the swing arm to do up-and-down reciprocating motion;
the rotating motor controls the swinging arm to do rotating reciprocating motion through the coupler;
the swing arm, the coupler and the rotating motor are assembled on the first base;
the linear motor controls the swing arm to do up-and-down reciprocating motion by controlling the first base to slide relative to the second base.
2. The chip transfer apparatus according to claim 1, further comprising a table mechanism including a loading table and a unloading table, wherein the first chip pick-and-place mechanism picks up chips from the loading table and places the chips on the rotating disc, and the second chip pick-and-place mechanism places the chips picked up from the rotating disc on the unloading table.
3. The chip transfer device according to claim 1, further comprising: and the heating module is used for heating the chip in the rotating process of the rotating disc after the chip is placed on one station of the rotating disc, and the heating module is positioned on the periphery of the circumference of the rotating disc.
4. The chip conveying apparatus according to claim 3, wherein the heating module is heated by radiation or direct heating.
5. The chip conveying apparatus according to claim 1, wherein the chip circulation conveying mechanism further comprises:
a motor fixing seat for fixing the driving motor;
a motor connecting shaft for connecting the driving motor and the rotating disk;
the rotating disk fixing seat is used for fixing the rotating disk; and
the bearing is positioned between the rotating disk fixing seat and the rotating disk and used for supporting the rotating disk to rotate, the bearing inner ring fixing ring is used for fixing the bearing inner ring, and the bearing outer ring fixing ring is used for fixing the bearing outer ring.
6. The chip transfer device according to claim 1, wherein the vacuum adsorption structure further comprises:
a rotary joint for connecting with a vacuum generating device, wherein the rotary joint is positioned below the rotating disc and is synchronous with the rotating speed of the rotating disc;
the vacuum branch joints are connected with the rotary joint through vacuum pipes and are arranged between the rotary disc and the rotary joint, and the vacuum branch joints are also connected with the vacuum pipe joints in a one-to-one corresponding mode through the vacuum pipes.
7. The chip transfer apparatus according to claim 1, wherein the first chip pick-and-place mechanism and the second chip pick-and-place mechanism each comprise:
an X-direction guide rail;
an X-direction motion fixing seat moving on the X-direction guide rail;
and the Z-direction pickup head is positioned on the X-direction moving fixed seat, a vacuum adsorption device is arranged at one end of the Z-direction pickup head for picking up the chip, and the Z-direction pickup head can move on the X-direction moving seat along the Z direction.
8. The chip transfer device according to claim 1, wherein the chip detection system comprises:
a downward-looking camera for detecting a position of the chip on the rotating disk, an angular offset, and whether an upper surface of the chip is defective, the downward-looking camera being located above a station on the rotating disk at a first position;
the chip comprises a left detection camera, a right detection camera, a front detection camera and a rear detection camera, wherein the left detection camera, the right detection camera, the front detection camera and the rear detection camera are used for detecting whether defects exist on the side surface of the chip, an image collector of the left detection camera and an image collector of the right detection camera are oppositely arranged and face a third position, an image collector of the front detection camera and an image collector of the rear detection camera are oppositely arranged and face the third position, and the third position is a position on the rotating disc.
9. The chip transfer device of claim 1, wherein the rotary disk is a disk-shaped rotary disk or a polygonal-shaped rotary disk.
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN105261581B (en) * | 2015-11-20 | 2018-11-02 | 王敕 | Chip encapsulating device suitable for 12 cun of wafers |
| CN106005991B (en) * | 2016-06-23 | 2018-02-13 | 东莞市顶贴电子有限公司 | IC charging tray conveyers |
| CN106373914B (en) * | 2016-11-10 | 2020-03-24 | 北京中电科电子装备有限公司 | Chip bonding device |
| CN106711079B (en) * | 2017-02-24 | 2020-06-26 | 爱立发自动化设备（上海）有限公司 | Taking and placing device |
| CN108766909B (en) * | 2018-05-24 | 2021-05-18 | 上海集成电路研发中心有限公司 | Device and method for improving dew phenomenon in low-temperature ion implantation |
| CN109516179B (en) * | 2018-11-09 | 2021-09-24 | 青岛时间河智能科技有限公司 | Automatic film feeding device and automatic rubber plug edge removing machine |
| CN109545732A (en) * | 2018-12-13 | 2019-03-29 | 天津力矩自动化科技有限公司 | A kind of negative pressure structure for chip arranging machine |
| CN111383972A (en) * | 2018-12-29 | 2020-07-07 | 上海微电子装备（集团）股份有限公司 | Bonding device and bonding method |
| CN112349636A (en) * | 2019-08-09 | 2021-02-09 | 苏州艾科瑞思智能装备股份有限公司 | High-precision large-board-level micro-assembly equipment |
| CN110625832A (en) * | 2019-09-16 | 2019-12-31 | 武汉新芯集成电路制造有限公司 | Wafer cutting device and wafer cutting method |
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